Laser annealing breakpoint scanning method and device, electronic equipment and laser annealing equipment

Abstract

The invention relates to the technical field of semiconductor technologies, and provides a laser annealing breakpoint supplementary scanning method and device, electronic equipment and laser annealing device.The method comprises the steps that under the condition that alarm information or abnormal information of the laser annealing technology of a target object is received, a laser is controlled to be shut down, and current position information of a motion table system is recorded; and initial position information can be provided for subsequent complementary scanning. Under the condition that the laser is determined to be shut down, the motion platform system is controlled to stop moving, and heat accumulation caused by continuous irradiation of the laser on the target object is avoided. The current position information of the motion platform system is utilized, and the breakpoint repairing formula of the laser annealing process is automatically generated in combination with the original formula of the laser annealing process, so that the generation efficiency can be improved, and the generation error can be reduced. Under the condition that the breakpoint complementary scanning signal of the target object is received, breakpoint complementary scanning is performed on the target object from the breakpoint position information of the laser annealing process of the target object by using the breakpoint complementary scanning formula, so that the accuracy of a complementary scanning result can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor process technology, and in particular to a laser annealing breakpoint repair method, apparatus, electronic device, and laser annealing equipment. Background Technology

[0002] Semiconductor annealing is a common method to optimize the quality of semiconductor materials. The usual method is to anneal the material at high temperature for a certain period of time after the material has been grown in order to improve the crystal quality of the semiconductor material.

[0003] Annealing is usually achieved using laser annealing equipment. In most cases where the laser annealing scan is unexpectedly terminated due to an alarm or other reasons, the location of the breakpoint is determined by the scan coordinates in the process log, the laser current, and the temperature of the pyrometer. Then, a specific breakpoint rescan formula is edited and executed to achieve the purpose of annealing.

[0004] However, the scanning trajectory of laser annealing equipment is composed of multiple trajectories. If rescanning is required, it can only start from the next trajectory after the breakpoint, or the trajectory at the breakpoint must be rescanned, resulting in inaccurate scanning data. Moreover, the rescanning formula for breakpoints is calculated manually, the trajectory path is relatively complex, and manual work is inefficient and prone to errors. Summary of the Invention

[0005] This invention provides a laser annealing breakpoint repair method, apparatus, electronic device, and laser annealing equipment to address the deficiencies in the prior art.

[0006] This invention provides a laser annealing breakpoint repair method, comprising:

[0007] If an alarm or abnormal information is received regarding the laser annealing process of the target object, the laser is controlled to shut down, and the current position information of the motion table system is recorded.

[0008] The laser is turned off, the motion table system is controlled to stop moving, and a breakpoint repair formula for the laser annealing process is generated based on the original formula of the laser annealing process and the current position information.

[0009] Receive the breakpoint repair signal of the target object, and based on the breakpoint repair recipe, perform breakpoint repair on the target object starting from the current position information.

[0010] According to a laser annealing breakpoint repair method provided by the present invention, the step of performing breakpoint repair on the target object based on the breakpoint repair formula, starting from the current position information, includes:

[0011] Based on the breakpoint completion formula, the initial motion path of the motion table system is generated;

[0012] In the initial motion path, the position points before the current position information are removed to obtain the target motion path; the target motion path starts from the current position information.

[0013] Based on the target motion path, the motion table system is controlled to perform breakpoint rescanning on the target object.

[0014] According to a laser annealing breakpoint completion method provided by the present invention, the step of controlling the motion stage system to perform breakpoint completion on the target object based on the target motion path includes:

[0015] Based on the target motion path, control the motion stage system to make the stage of the target object move relative to the laser;

[0016] When the motion stage system detects that the platform has reached each position point on the target motion path, the motion stage system controls the laser to emit light.

[0017] According to the present invention, a laser annealing breakpoint repair method is provided, wherein the breakpoint repair formula is configured as a read-only formula.

[0018] According to the laser annealing breakpoint repair method provided by the present invention, the current position information includes the coordinates of the current position point of the motion table system and the number of the current position point.

[0019] According to a laser annealing breakpoint repair method provided by the present invention, the step of generating a breakpoint repair formula for the laser annealing process based on the original formula of the laser annealing process and the current position information further includes:

[0020] If an alarm or abnormal information is received regarding the laser annealing process of the target object, record the current time.

[0021] The breakpoint refresh formula is named based on the name of the original formula and the current time.

[0022] The present invention also provides a laser annealing breakpoint repair device, comprising:

[0023] The first control module is used to control the laser to shut down and record the current position information of the motion table system if it receives alarm or abnormal information about the laser annealing process of the target object.

[0024] The second control module is used to determine that the laser is turned off, control the motion table system to stop moving, and generate the breakpoint repair formula of the laser annealing process based on the original formula of the laser annealing process and the current position information.

[0025] The breakpoint completion module is used to receive the breakpoint completion signal of the target object and, based on the breakpoint completion recipe, perform breakpoint completion on the target object starting from the current position information.

[0026] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the laser annealing breakpoint repair method as described above.

[0027] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the laser annealing breakpoint repair method as described above.

[0028] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the laser annealing breakpoint repair method as described above.

[0029] This invention provides a laser annealing breakpoint repair method, apparatus, electronic device, and laser annealing equipment. The method first, upon receiving alarm or abnormal information from the laser annealing process of the target object, controls the laser to shut down and records the current position information of the motion stage system, providing starting position information for subsequent repair scanning. Secondly, upon confirming the laser is off, the motion stage system is stopped to prevent heat accumulation from continuous laser irradiation of the target object. Using the current position information of the motion stage system, combined with the original laser annealing process formula, a breakpoint repair formula for the laser annealing process is automatically generated. This not only improves generation efficiency and reduces generation errors but also reduces the difficulty of generating the breakpoint repair formula, effectively solving the safety, tediousness, and efficiency problems associated with manually calculating the repair trajectory. Finally, upon receiving the breakpoint repair signal from the target object, the breakpoint repair formula is used to perform breakpoint repair scanning on the target object, starting from the breakpoint position information of the laser annealing process. This improves the accuracy of the repair results, avoids duplicate scanning or missing scan data, and reduces the wafer scrap rate caused by machine alarms or abnormalities. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on the drawings described below without creative effort.

[0031] Figure 1 This is one of the flowcharts of the laser annealing breakpoint repair method provided by the present invention;

[0032] Figure 2 This is the second flowchart of the laser annealing breakpoint repair method provided by the present invention;

[0033] Figure 3 This is a schematic diagram of the structure of the laser annealing breakpoint repair device provided by the present invention;

[0034] Figure 4 This is one of the structural schematic diagrams of the laser annealing equipment provided by the present invention;

[0035] Figure 5 This is the second schematic diagram of the structure of the laser annealing equipment provided by the present invention;

[0036] Figure 6 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0038] The terms "first" and "second" in the specification and claims of this invention may explicitly or implicitly include one or more of those features. In the description of the invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0039] Existing laser annealing equipment can only begin scanning from the next trajectory after the breakpoint during rescanning, leading to missing scan data or rescanning the breakpoint trajectory, resulting in partially repeated scan data. This is not only inaccurate but also wastes scanning resources. Furthermore, the breakpoint rescanning formula is calculated manually, resulting in complex trajectory paths, low manual efficiency, and susceptibility to errors. Therefore, this invention provides a laser annealing breakpoint rescanning method.

[0040] Figure 1 This is a schematic flowchart of a laser annealing breakpoint repair method provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the method includes:

[0041] S1, if an alarm or abnormal information is received regarding the laser annealing process of the target object, control the laser to shut down and record the current position information of the motion table system;

[0042] S2, determine that the laser is turned off, control the motion table system to stop moving, and generate the breakpoint repair formula of the laser annealing process based on the original formula of the laser annealing process and the current position information;

[0043] S3, receive the breakpoint repair signal of the target object, and perform breakpoint repair on the target object starting from the current position information based on the breakpoint repair formula.

[0044] Specifically, the laser annealing breakpoint repair method provided in this embodiment of the invention is executed by a laser annealing breakpoint repair device, which can be configured in the machine control software system of the laser annealing equipment.

[0045] First, step S1 is executed. Upon receiving alarm or abnormal information regarding the laser annealing process of the target object, the laser is shut down, and the current position information of the motion table system is recorded. Here, the target object can be an object requiring laser annealing, such as a wafer. Alarm or abnormal information refers to any alarm or abnormal information indicating that the laser scanning process needs to be stopped. Receiving alarm or abnormal information indicates that the laser annealing process requires stopping the laser scanning.

[0046] Alarm information can include equipment failure, power supply problems, and safety protection mechanism triggering, while abnormal information can include abnormal laser power, abnormal temperature, abnormal optical system, abnormal motion system, and abnormal control software system.

[0047] The laser annealing breakpoint repair device can control the laser to shut down and stop emitting light by sending a control signal to the laser. When the laser shuts down, it sends a shutdown feedback signal to the laser annealing breakpoint repair device to notify that the shutdown was successful and that the laser is in a safe state of not emitting light.

[0048] Upon receiving alarm or abnormal information, it is also necessary to record the current position information of the motion table system. This current position information is the breakpoint position information of the laser annealing process of the target object, which is used to locate the current position point of the motion table system.

[0049] Then, step S2 is executed. Upon receiving the shutdown feedback signal from the laser, the laser annealing breakpoint repair device confirms that the laser is off. At this point, a control signal is sent to the motion stage system to stop its movement, and the target object's stage (Chuck) and the laser become relatively stationary. By shutting down the laser before stopping the motion stage system, heat accumulation caused by continuous laser irradiation of the same location on the target object can be avoided.

[0050] Subsequently, using the original formula of the laser annealing process for the target object and the current position information of the motion stage system, a breakpoint-filling formula for the laser annealing process is generated. The original formula is the formula for the laser annealing process of the target object under normal conditions. It refers to a complete set of process parameters and operating steps required for the laser annealing process, tailored to the material and application requirements of the target object, ensuring that the laser annealing process achieves the expected results. The original formula may include key parameters such as laser power, beam scanning speed, irradiation duration, annealing depth, annealing temperature, scanning path shape, starting position, ending position, and number of scans, as well as any material pretreatment and post-treatment steps that may be involved. Furthermore, the original formula may also include some special operating steps, such as preheating, heat preservation, and cooling, to further improve the annealing effect or meet specific process requirements.

[0051] By recording the current location information in the original formula, a breakpoint-compensated formula for the laser annealing process can be generated. In other words, compared to the original formula, the breakpoint-compensated formula includes the breakpoint location information of the target object in the laser annealing process.

[0052] Finally, in step S3, the laser annealing breakpoint repair device receives the breakpoint repair signal from the target object. This breakpoint repair signal can be triggered by the user. The user can trigger it by clicking the repair button on the laser annealing device after reviewing the alarm or abnormal information and deeming it negligible. Alternatively, the user can trigger it by clicking the repair button on the laser annealing device after reviewing the alarm or abnormal information, removing the target object for maintenance, and then placing the target object back into the laser annealing device. The repair button can be a physical button or a virtual button; no specific limitation is made here.

[0053] After receiving the breakpoint completion scan signal of the target object, the motion table system can be controlled to move and the laser can be controlled to emit light. According to the original formula scanning process, the breakpoint completion scan formula is used to start from the breakpoint position information of the laser annealing process of the target object and perform breakpoint completion scan on the target object. This can improve the accuracy of the completion scan results and avoid repeated scanning or missing scanning data.

[0054] The laser annealing breakpoint repair method provided in this embodiment of the invention firstly, upon receiving alarm or abnormal information from the laser annealing process of the target object, controls the laser to shut down and records the current position information of the motion stage system, which can provide starting position information for subsequent repair scanning. Secondly, upon confirming that the laser is shut down, controls the motion stage system to stop moving to avoid heat accumulation caused by continuous laser irradiation of the target object. Using the current position information of the motion stage system, combined with the original formula of the laser annealing process, a breakpoint repair formula for the laser annealing process is automatically generated. This not only improves generation efficiency and reduces generation errors but also reduces the difficulty of generating the breakpoint repair formula, effectively solving the safety, tediousness, and efficiency problems of manually calculating the repair trajectory. Finally, upon receiving the breakpoint repair signal from the target object, the breakpoint repair formula is used to start the breakpoint repair scanning of the target object from the breakpoint position information of the laser annealing process. This improves the accuracy of the repair results, avoids repeated scanning or missing scan data, and reduces the wafer scrap rate caused by machine alarms or abnormalities.

[0055] Based on the above embodiments, the laser annealing breakpoint completion method provided in this embodiment of the invention includes the current position information including the coordinates of the current position point of the motion table system and the number of the current position point.

[0056] Specifically, upon receiving alarm or abnormal information regarding the laser annealing process of the target object, the recorded current position information of the motion table system can include the coordinates of the current position point and the number of the current position point. Here, the coordinates of the current position point can be two-dimensional coordinates, and the number of the current position point can be the row number of the current position point in the original formula, or it can be the sequence number of the current position point in the motion path of the motion table system.

[0057] In this embodiment of the invention, the introduction of the current position point number can ensure accurate positioning of the current position point in the case of multiple repeated scans, thereby improving the accuracy of breakpoint completion scanning.

[0058] Based on the above embodiments, the laser annealing breakpoint repair method provided in this embodiment of the invention, wherein the breakpoint repair is performed on the target object starting from the current position information based on the breakpoint repair formula, includes:

[0059] Based on the breakpoint completion formula, the initial motion path of the motion table system is generated;

[0060] In the initial motion path, the position points before the current position information are removed to obtain the target motion path; the target motion path starts from the current position information.

[0061] Based on the target motion path, the motion table system is controlled to perform breakpoint rescanning on the target object.

[0062] Specifically, when performing breakpoint completion scanning on the target object, the initial motion path of the motion table system can be generated first using the breakpoint completion scanning recipe. The method for generating this initial motion path is the same as that for generating the motion path using the original recipe, and both can be implemented using conventional path generation methods, without specific limitations here.

[0063] Subsequently, in the initial motion path of the motion table system, the position points before the current position information of the motion table system when receiving alarm or abnormal information of the laser annealing process of the target object are removed, resulting in the target motion path (Buffer). Therefore, the target motion path begins from the current position information of the motion table system when receiving alarm or abnormal information of the laser annealing process of the target object, and does not include position points before that current position information.

[0064] Subsequently, the target motion path is sent to the motion table system, which moves along the target motion path. At each position point on the target motion path, the laser is triggered to emit light to scan the target object.

[0065] In this embodiment of the invention, by determining the target motion path of the motion stage system before the current position information is included, it is possible to control the motion stage system to start moving from the current position information and perform breakpoint completion scanning on the target object, thus ensuring the accuracy and efficiency of breakpoint completion scanning.

[0066] Based on the above embodiments, the laser annealing breakpoint completion method provided in this embodiment of the invention, wherein the step of controlling the motion stage system to perform breakpoint completion on the target object based on the target motion path includes:

[0067] Based on the target motion path, control the motion stage system to make the stage of the target object move relative to the laser;

[0068] When the motion stage system detects that the platform has reached a position point on the target motion path, the motion stage system controls the laser to emit light.

[0069] Specifically, when controlling the motion stage system, the motion stage system can be controlled to move along the target motion path. The motion stage system can drive the laser to move, or drive the platform carrying the target object to move, so that the platform carrying the target object moves relative to the laser.

[0070] When the motion stage system detects that the platform of the target object has reached various positions on the target motion path, the motion stage system can send control signals to the laser to control the laser to emit light, thereby realizing the scanning of the target object.

[0071] Based on the above embodiments, the laser annealing breakpoint repair method provided in this embodiment of the invention, wherein generating the breakpoint repair formula for the laser annealing process based on the original formula of the laser annealing process and the current position information, further includes:

[0072] If an alarm or abnormal information is received regarding the laser annealing process of the target object, record the current time.

[0073] The breakpoint refresh formula is named based on the name of the original formula and the current time.

[0074] Specifically, when the laser annealing breakpoint re-scanning device receives alarm or abnormal information about the laser annealing process of the target object, it can also record the current time. This current time is the breakpoint time of the laser annealing process of the target object.

[0075] Furthermore, when generating the breakpoint repair formula for the laser annealing process, the breakpoint repair formula is named using the name of the original formula for the laser annealing process and the current recorded time. That is, the name of the breakpoint repair formula records the name of the original formula and the current time when the alarm or abnormal information of the laser annealing process of the target object is received.

[0076] In this embodiment of the invention, the breakpoint time is recorded in the name of the breakpoint patching recipe, which makes it easier for users to determine the time when the breakpoint occurred and facilitates the archiving of breakpoint information for the target object. Furthermore, recording the breakpoint time in the name of the breakpoint patching recipe, rather than in the recipe itself, reduces the amount of data required to modify the original recipe, avoids adding extra data that could change the format of the original recipe, and ensures that the breakpoint patching recipe can be accurately read and applied.

[0077] Based on the above embodiments, the laser annealing breakpoint repair method provided in this embodiment of the invention, wherein controlling the laser to shut down includes:

[0078] A laser shutdown signal is sent to the controller so that the controller can shut down the laser based on the laser shutdown signal.

[0079] Specifically, in this embodiment of the invention, the laser annealing breakpoint repair device does not directly control the laser, but indirectly controls the laser through a controller. Here, the controller can be a programmable logic controller (PLC).

[0080] The introduction of a controller enhances the flexibility of laser control, making it easier to respond to changing environments and demands. It reduces the risk of system oscillations and instability, thereby improving system stability. Furthermore, it is easy to maintain and expand. When adjustments or upgrades are needed, only the controller needs to be modified, without requiring large-scale changes to the entire system. In addition, because the controller has self-diagnostic and protection functions, it can take timely measures in case of faults, reducing the risk of failure and preventing serious impacts on the entire system. The controller can automatically adjust the control strategy based on the real-time status and demands of the system to achieve optimal performance.

[0081] At this time, when the motion table system controls the laser to emit light, the motion table system can send a laser emission signal to the controller, and the controller can control the laser to emit light according to the laser emission signal. This laser emission signal can be a Position Event Generate (PEG) signal.

[0082] Based on the above embodiments, the laser annealing breakpoint repair method provided in this embodiment of the invention configures the breakpoint repair recipe as a read-only recipe, thereby preventing users from modifying the parameters in the breakpoint repair recipe and avoiding errors where the modified parameters do not match the paths in the original recipe.

[0083] like Figure 2 As shown, based on the above embodiments, the laser annealing breakpoint repair method provided in this embodiment of the invention generally includes:

[0084] Receive alarm or abnormal information about the laser annealing process of the target object;

[0085] Send a laser shutdown signal to the controller to shut down the laser and record the current position information of the motion table system;

[0086] Once the laser is confirmed to be off, the motion table system is controlled to stop moving.

[0087] Based on the original formula of the laser annealing process and the current position information, a breakpoint repair formula for the laser annealing process is generated.

[0088] Calculate the target motion path of the motion table system based on the breakpoint cleanup formula;

[0089] Send the target motion path to the motion table system;

[0090] The motion table system performs breakpoint replacement scanning on the target object according to the target motion path.

[0091] like Figure 3 As shown, based on the above embodiments, this embodiment of the invention provides a laser annealing breakpoint repair device, comprising:

[0092] The first control module 31 is used to control the laser to shut down and record the current position information of the motion table system if it receives alarm or abnormal information about the laser annealing process of the target object.

[0093] The second control module 32 is used to determine that the laser is turned off, control the motion table system to stop moving, and generate the breakpoint repair formula of the laser annealing process based on the original formula of the laser annealing process and the current position information.

[0094] The breakpoint repair module 33 is used to receive the breakpoint repair signal of the target object and, based on the breakpoint repair recipe, perform breakpoint repair on the target object starting from the current position information.

[0095] Based on the above embodiments, the laser annealing breakpoint repair device provided in this embodiment of the invention, wherein the breakpoint repair module is specifically used for:

[0096] Based on the breakpoint completion formula, the initial motion path of the motion table system is generated;

[0097] In the initial motion path, the position points before the current position information are removed to obtain the target motion path; the target motion path starts from the current position information.

[0098] Based on the target motion path, the motion table system is controlled to perform breakpoint rescanning on the target object.

[0099] Based on the above embodiments, the laser annealing breakpoint repair device provided in this embodiment of the invention, wherein the breakpoint repair module is further specifically used for:

[0100] Based on the target motion path, control the motion stage system to make the stage of the target object move relative to the laser;

[0101] When the motion stage system detects that the platform has reached each position point on the target motion path, the motion stage system controls the laser to emit light.

[0102] Based on the above embodiments, the laser annealing breakpoint repair device provided in this embodiment of the invention has the breakpoint repair formula configured as a read-only formula.

[0103] Based on the above embodiments, the laser annealing breakpoint repair device provided in this embodiment of the invention includes the current position information including the coordinates of the current position point of the motion table system and the number of the current position point.

[0104] Based on the above embodiments, the laser annealing breakpoint repair device provided in this embodiment of the invention, wherein the second control module is further configured to:

[0105] If an alarm or abnormal information is received regarding the laser annealing process of the target object, record the current time.

[0106] The breakpoint refresh formula is named based on the name of the original formula and the current time.

[0107] Specifically, the functions of each module in the laser annealing breakpoint repair device provided in this embodiment of the invention correspond one-to-one with the operation flow of each step in the above method-like embodiments, and the achieved effects are also the same. For details, please refer to the above embodiments, and this will not be repeated in this embodiment of the invention.

[0108] like Figure 4 As shown, based on the above embodiments, this embodiment of the invention provides a laser annealing device, including: a stage 41, a motion stage system 42, a machine control software system 43, and a laser 44;

[0109] Platform 41 is used to support the target object;

[0110] The motion stage system 42 is used to control the relative movement of the stage 41 and the laser 44;

[0111] Laser 44 is used to generate laser light;

[0112] The machine control software system 42 is used to execute the laser annealing breakpoint repair method provided in the above embodiments.

[0113] In this laser annealing equipment, since the machine control software system 42 can execute the laser annealing breakpoint repair method provided in the above embodiments, it can control the laser to shut down and record the current position information of the motion stage system when receiving alarm or abnormal information of the laser annealing process of the target object, providing starting position information for subsequent repair scanning. Secondly, when it is determined that the laser is shut down, the motion stage system is controlled to stop moving to avoid heat accumulation caused by continuous laser irradiation of the target object. Using the current position information of the motion stage system, combined with the original formula of the laser annealing process, the breakpoint repair formula of the laser annealing process is automatically generated, which can not only improve the generation efficiency and reduce the generation error, but also reduce the difficulty of generating the breakpoint repair formula, effectively solving the problems of safety, tediousness, and efficiency in the process of manually calculating the repair trajectory. Finally, when the breakpoint repair signal of the target object is received, the breakpoint repair formula is used to start the breakpoint repair of the target object from the breakpoint position information of the laser annealing process of the target object, which can improve the accuracy of the repair results, avoid repeated scanning or missing scanning data, and reduce the scrap rate of wafers caused by machine alarms or abnormalities.

[0114] Based on the above embodiments, such as Figure 5 As shown, a controller 45 can be connected between the machine tool control software system 43 and the laser 44. The machine tool control software system 43 can control the laser 44 to turn off by sending a laser shutdown signal to the controller 45, and the motion table system 42 can control the laser 44 to emit light by sending a laser emission signal to the controller 45.

[0115] Figure 6 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 6 As shown, the electronic device may include a processor 610, a communications interface 620, a memory 630, and a communication bus 640. The processor 610, communications interface 620, and memory 630 communicate with each other via the communication bus 640. The processor 610 can call logical instructions in the memory 630 to execute the laser annealing breakpoint repair method provided in the above embodiments.

[0116] Furthermore, the logical instructions in the aforementioned memory 630 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0117] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer is able to execute the laser annealing breakpoint repair method provided in the above embodiments.

[0118] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the laser annealing breakpoint repair method provided in the above embodiments.

[0119] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0120] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method of laser anneal breakpoint fill-in-scan, the method comprising: The method comprises the following steps: If alarm information or abnormal information of a laser annealing process of a target object is received, the laser is controlled to be turned off, and current position information of a motion stage system is recorded; It is determined that the laser is turned off, the motion stage system is controlled to stop moving, and a breakpoint compensation scanning formula of the laser annealing process is generated based on an original formula of the laser annealing process and the current position information; The breakpoint compensation scanning formula is received, and the target object is subjected to breakpoint compensation scanning based on the breakpoint compensation scanning formula and starting from the current position information.

2. The laser anneal breakpoint fill-in-scan method of claim 1, wherein, The breakpoint compensation scanning based on the breakpoint compensation scanning formula and starting from the current position information comprises the following steps: An initial motion path of the motion stage system is generated based on the breakpoint compensation scanning formula; In the initial motion path, position points before the current position information are removed to obtain a target motion path; the target motion path starts from the current position information; The target object is subjected to breakpoint compensation scanning based on the target motion path and by controlling the motion stage system.

3. The laser anneal breakpoint fill-in sweep method of claim 2, wherein, The breakpoint compensation scanning based on the target motion path and by controlling the motion stage system comprises the following steps: The target object is subjected to breakpoint compensation scanning by controlling the motion stage system so that a stage of the target object moves relative to the laser; When the motion stage system detects that the stage reaches each position point on the target motion path, the laser is controlled to emit light by the motion stage system.

4. The laser anneal breakpoint fill-in-scan method of any of claims 1-3, wherein, The breakpoint compensation scanning formula is configured to be read only.

5. The laser anneal breakpoint fill-in-scan method of any of claims 1-3, wherein, The current position information comprises a current position point coordinate of the motion stage system and a number of the current position point.

6. The laser anneal breakpoint fill-in-scan method of any of claims 1-3, wherein, The breakpoint compensation scanning formula generated based on the original formula of the laser annealing process and the current position information further comprises the following steps: If alarm information or abnormal information of a laser annealing process of a target object is received, the current time is recorded; The breakpoint compensation scanning formula is named based on a name of the original formula and the current time.

7. A laser anneal breakpoint fill-in apparatus, comprising: The method comprises the following steps: A first control module is configured to control a laser to be turned off and record current position information of a motion stage system if alarm information or abnormal information of a laser annealing process of a target object is received; A second control module is configured to control the motion stage system to stop moving and generate a breakpoint compensation scanning formula of the laser annealing process based on an original formula of the laser annealing process and the current position information if it is determined that the laser is turned off; A breakpoint compensation scanning module is configured to receive the breakpoint compensation scanning formula of the target object and perform breakpoint compensation scanning on the target object based on the breakpoint compensation scanning formula and starting from the current position information.

8. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor executes the computer program to implement the laser annealing breakpoint compensation scanning method in any one of claims 1-6. 9.A non-transitory computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the laser annealing breakpoint compensation scanning method in any one of claims 1-6.

10. A laser anneal apparatus, comprising: The method comprises the following steps: A stage, a motion stage system, a machine table control software system, and a laser; The stage is configured to carry a target object; The motion stage system is configured to control the stage to move relative to the laser; The laser is configured to perform laser annealing on the target object. The laser is used for generating laser light; The machine control software system is used for performing the laser anneal breakpoint re-scan method as claimed in any one of claims 1-6.

Images