Power converter, power electronic conversion device and electrical equipment

Abstract

The invention discloses a power converter, a power electronic conversion device and electrical equipment. The power converter comprises a capacitor module which is provided with capacitor pins extending towards a plurality of side parts; a plurality of power conversion modules and a control panel, the plurality of power conversion modules are distributed on a plurality of side portions of the capacitor module, each power conversion module is provided with a signal pin extending upwards and a power pin extending towards the side portion, and the signal pins are electrically connected to the control panel; the power pins are electrically connected to the corresponding capacitor pins, and the power pins and the electrically connected capacitor pins are located on the same side of the capacitor module. Therefore, a large-area thick copper circuit board does not need to construct a main circuit to conduct large current, and the cost is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of power module technology, and more particularly to a power converter, power electronic conversion device, and electrical equipment. Background Technology

[0002] Currently, most string photovoltaic inverters integrate the film capacitor and inverter module onto the same circuit board for the power module section. Since the power circuitry needs to be configured on this board, a thick copper plate is required to achieve high current output; however, using a large area of ​​thick copper leads to higher costs. Summary of the Invention

[0003] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the first objective of this invention is to provide a power converter that eliminates the need for a large-area, thick copper circuit board to construct the main circuit for conducting large currents, effectively reducing costs.

[0004] To achieve the above objectives, a first aspect of the present invention provides a power converter, comprising: a capacitor module having capacitor pins extending to multiple sides; multiple power conversion modules and a control board, wherein the multiple power conversion modules are distributed on multiple sides of the capacitor module, each power conversion module having an upwardly extending signal pin and a side-extending power pin, the signal pin being electrically connected to the control board, and the power pin being electrically connected to a corresponding capacitor pin and located on the same side of the capacitor module as the electrically connected capacitor pin.

[0005] According to an embodiment of the present invention, the power converter of the power conversion module extends its power pins to the side and connects them to the capacitor module via copper busbars instead of a circuit board to form the main circuit. The signal pins of the power conversion module extend upwards and connect to the control board. This eliminates the need for a large area of ​​thick copper circuit board to construct the main circuit to conduct large currents, effectively reducing costs.

[0006] In some embodiments, the multiple power conversion modules include multiple inverter modules, the control board includes an inverter circuit board, the signal pins of each inverter module are electrically connected to the inverter circuit board, and the power pins of each inverter module are electrically connected to corresponding capacitor pins and are located on the same side of the capacitor module as the electrically connected capacitor pins.

[0007] In some embodiments, the plurality of power conversion modules include a plurality of inverter modules and at least one boost module, and the control board includes an inverter circuit board and a boost circuit board; wherein, the signal pin of each inverter module is electrically connected to the inverter circuit board, and the power pin of each inverter module is electrically connected to a corresponding capacitor pin, and is located on the same side of the capacitor module as the electrically connected capacitor pin; the signal pin of each boost module is electrically connected to the boost circuit board, and the power pin of each boost module is electrically connected to a corresponding capacitor pin, and is located on the same side of the capacitor module as the electrically connected capacitor pin.

[0008] In some embodiments, multiple inverter modules and inverter circuit boards are located on one side of the capacitor module, and at least one boost module and boost circuit board are located on the other side of the capacitor module.

[0009] In some embodiments, the capacitor module includes at least one capacitor and a capacitor circuit board, wherein the pins of each capacitor extend upward and are electrically connected to the capacitor circuit board, and the capacitor pins are disposed on the capacitor circuit board.

[0010] In some embodiments, each capacitor pin includes a first conductive portion disposed on the capacitor circuit board and extending downward, and a second conductive portion electrically connected to the first conductive portion and extending away from the side of the capacitor module, wherein the second conductive portion is electrically connected to the corresponding power pin.

[0011] In some embodiments, the capacitor module is an integrated capacitor, which includes at least one capacitor and whose pins are the docking power terminals of the integrated capacitor.

[0012] In some embodiments, the power converter further includes a heat dissipation module, and the capacitor module and multiple power conversion modules are all disposed on the heat dissipation module.

[0013] In some embodiments, the power converter is a multiphase inverter, which includes multiple inverter branches, each of which includes at least two inverter modules connected in parallel.

[0014] To achieve the above objectives, a second aspect of the present invention provides a power electronic conversion device, including the aforementioned power converter.

[0015] According to embodiments of the present invention, the power electronic conversion device, based on the aforementioned power converter, can effectively reduce costs.

[0016] To achieve the above objectives, a third aspect of the present invention provides an electrical device including the aforementioned power converter or power electronic conversion device.

[0017] The electrical equipment according to embodiments of the present invention, based on the aforementioned power converter or power electronic conversion device, can effectively reduce costs.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] Figure 1a A side view of a power converter according to some embodiments of the present invention;

[0020] Figure 1b for Figure 1a Top view of the power converter shown;

[0021] Figure 2a A side view of a power converter according to other embodiments of the present invention;

[0022] Figure 2b for Figure 2a Top view of the power converter shown;

[0023] Figure 3a This is a side view of a power converter according to some embodiments of the present invention;

[0024] Figure 3b for Figure 2a The top view of the power converter shown. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0026] The power converter, power electronic conversion device, and electrical equipment proposed in the embodiments of the present invention are described below with reference to the accompanying drawings.

[0027] Figure 1a This is a side view of a power converter according to some embodiments of the present invention. Figure 1b for Figure 1a The top view of the power converter shown.

[0028] Reference Figures 1a-1bThe power converter includes a capacitor module 201, multiple power conversion modules 202, and a control board 203. The capacitor module 201 has capacitor pins 201A and 201B extending to multiple sides. The multiple power conversion modules 202 are distributed on multiple sides of the capacitor module 201. Each power conversion module 202 has an upwardly extending signal pin 202A and a side-extending power pin 202B. The signal pin 202A is electrically connected to the control board 203, and the power pin 202B is electrically connected to the corresponding capacitor pin and is located on the same side of the capacitor module 201 as the electrically connected capacitor pin.

[0029] Specifically, capacitor module 201 is used to filter and regulate the DC power output or required by multiple power conversion modules 202. Its specific structure is not limited; for example, capacitor module 201 can be a film capacitor module. Capacitor module 201 has capacitor pins 201A and 201B extending to multiple sides for electrical connection with the multiple power conversion modules 202. It should be noted that the multiple sides of capacitor module 201 are not limited here; for example, it could be... Figure 1a and Figure 1b The capacitor module 201 shown can be two opposite sides, or two adjacent sides, etc. Capacitor pins 201A and 201B do not represent positive or negative terminals; they are only used to indicate that the capacitor pins are located on different sides of the capacitor module 201. For example, in... Figure 1a and Figure 1b In the capacitor module 201, the capacitor pins located on the left side are referred to as capacitor pins 201B, and the capacitor pins located on the right side are referred to as capacitor pins 201A. Both capacitor pins 201A and capacitor pins 201B include a positive terminal and a negative terminal.

[0030] Multiple power conversion modules 202 are used to convert electrical energy, such as DC to AC, AC to DC, AC to DC and back to AC, or DC to DC; the specific conversion is not limited here. The multiple power conversion modules 202 are distributed on multiple sides of the capacitor module 201, and can be evenly or unevenly distributed; this is not limited here. For example, Figure 1b An example of an equal division is given.

[0031] Each power conversion module 202 has an upwardly extending signal pin 202A, which is electrically connected to the control board 203. For example, the signal pin 202A can be inserted into the soldering holes of the control board 203 for soldering connection to form the control circuit of the power conversion module 202 and control the power conversion module 202. Each power conversion module 202 also has a side-extending power pin 202B, which is electrically connected to the side-extending capacitor pins 201A and 201B of the capacitor module 201, for example, by laser soldering connection.

[0032] Multiple power conversion modules 202 are electrically connected to capacitor module 201 via copper busbars (i.e., via power pins to capacitor pins). This not only constitutes the main circuit of the power converter, but also bypasses the control board 203. In this way, the control board 203 only needs to complete the connection of signal pins, which greatly reduces the number of pins that need to be connected. This allows the number of connection pins of the control board 203 to be controlled, making production simpler. Moreover, it eliminates the need for large areas of thick copper to carry large currents, resulting in a significant reduction in cost.

[0033] It should be noted that each power conversion module 202 also includes a power pin 202C, which is used to connect to other circuits, and no specific restrictions are made here.

[0034] It should be noted that in this example, the control board 203 uses a single circuit board. In other examples, the control board 203 may use multiple circuit boards, which can be electrically connected via signal lines. This can further reduce the number of pins on each circuit board, thereby controlling the area and pin count of a single circuit board.

[0035] In some embodiments, the plurality of power conversion modules 202 include a plurality of inverter modules, the control board 203 includes an inverter circuit board, the signal pins of each inverter module are electrically connected to the inverter circuit board, and the power pins of each inverter module are electrically connected to corresponding capacitor pins, and are located on the same side of the capacitor module 201 as the electrically connected capacitor pins. That is, Figures 1a-1b The power conversion module 202 shown can be an inverter module, and the control board 203 can be an inverter circuit board. AC-DC conversion is achieved through multiple inverter modules and capacitor modules 201, that is, multiple inverter modules and capacitor modules 201 can constitute an inverter.

[0036] Specifically, typically one inverter module corresponds to one phase of the inverter, and a three-phase inverter corresponds to three inverter modules. When the peak power is high, such as around 300kW, a wafer is connected in parallel inside the inverter module to achieve high current output. However, this method has poor flexibility. Therefore, multiple inverter modules can be connected in parallel instead of connecting wafers in parallel inside the inverter module to achieve high current output. However, using multiple inverter modules in parallel increases the number of inverter modules, and the corresponding power pins and signal pins will increase exponentially. When multiple power pins and signal pins are soldered onto a large circuit board, the large number of pins requires multiple pins to be inserted into solder holes, which affects production efficiency. At the same time, since the power circuit needs to be configured on the circuit board, a thick copper circuit board is required to achieve high current output, but using thick copper over a large area leads to higher costs. Based on this, in the embodiments of the present invention, multiple inverter modules are electrically connected to the capacitor module 201 using the aforementioned copper busbar method. This not only constitutes the main circuit of the inverter, but also bypasses the control board 203. In this way, the control board 203 only needs to complete the connection of signal pins, which greatly reduces the number of pins that need to be connected. This allows the number of connection pins of the control board 203 to be controlled, making production simpler. Moreover, it eliminates the need for a large area of ​​thick copper to carry large currents, resulting in a significant reduction in cost.

[0037] In some embodiments, refer to Figure 2a and Figure 2b The multiple power conversion modules 202 include multiple inverter modules 204 and at least one boost module 205, and the control board 203 includes an inverter circuit board 206 and a boost circuit board 207. Specifically, the signal pin 204A of each inverter module 204 is electrically connected to the inverter circuit board 206, and the power pin 204B of each inverter module 204 is electrically connected to the corresponding capacitor pin 201A, and is located on the same side of the capacitor module 201. Similarly, the signal pin 205A of each boost module 205 is electrically connected to the boost circuit board 207, and the power pin 205B of each boost module 205 is electrically connected to the corresponding capacitor pin 201B, and is located on the same side of the capacitor module 201.

[0038] Specifically, the boost module 205 is used to boost the first DC power to the second DC power. The specific circuit structure and number of boost modules 205 are not limited; for example, the boost module 205 can be a single-phase BOOST boost module, and there can be one or more boost modules 205, depending on actual needs. The capacitor module 201 is used to filter and regulate the second DC power; its specific structure is not limited, for example, the capacitor module 201 can be a film capacitor module. Multiple inverter modules 204 can form a single-phase inverter circuit or a multi-phase inverter circuit to convert the filtered and regulated second DC power to the required AC power. Each phase of the inverter circuit can be composed of two or more inverter modules 204 connected in parallel to achieve high current output.

[0039] The capacitor module 201 has capacitor pins 201A and 201B extending to the side for electrical connection with the inverter module 204 and the boost module 205.

[0040] Inverter module 204 has an upwardly extending signal pin 204A that is electrically connected to inverter circuit board 206. For example, signal pin 204A can be inserted into the solder hole of inverter circuit board 206 for soldering connection to form the control circuit of inverter module 204 and control inverter module 204. Boost module 205 has an upwardly extending signal pin 205A that is electrically connected to boost circuit board 207. For example, signal pin 205A can be inserted into the solder hole of boost circuit board 207 for soldering connection to form the control circuit of boost module 205 and control boost module 205.

[0041] Inverter module 204 has a power pin 204B extending to the side, which is electrically connected to capacitor pin 201A extending to the side of capacitor module 201, for example, by laser welding. Boost module 205 has a power pin 205B extending to the side, which is electrically connected to capacitor pin 201B extending to the side of capacitor module 201, for example, by laser welding. Inverter module 204 and boost module 205 are electrically connected to capacitor module 201 using copper busbars (i.e., via power pins to capacitor pins). This not only constitutes the main circuit of the power converter but also bypasses inverter circuit board 206 and boost circuit board 207. Thus, inverter circuit board 206 and boost circuit board 207 only need to connect signal pins, significantly reducing the number of pins required. This allows for control over the number of pins connected to inverter circuit board 206 and boost circuit board 207, simplifying production. Furthermore, it eliminates the need for large current flows, thus avoiding the need for extensive copper plating and significantly reducing costs.

[0042] It should be noted that each inverter module 204 also includes a power pin 204C, which is used for electrical connection to other electrical components, such as loads. Each boost module 205 also includes a power pin 205C, which is used for electrical connection to other electrical components, such as DC power supplies.

[0043] It should be noted that in this example, multiple inverter modules 204 and inverter circuit boards 206 are located on one side of capacitor module 201, and at least one boost module 205 and boost circuit board 207 are located on the other side of capacitor module 201. This allows for control over the area of ​​inverter circuit boards 206 and boost circuit boards 207. In other examples, multiple inverter modules 204 can be located on different sides of capacitor module 201, and at least one boost module 205 can be located on different sides of capacitor module 201. The specific location can be determined based on requirements. In this case, inverter circuit board 206 and boost circuit board 207 can be a single circuit board or multiple circuit boards. When multiple circuit boards are used, they can be electrically connected via signal lines.

[0044] In the above embodiments, by extending the power pins of the inverter module and boost module to the side and connecting them to the capacitor module via copper busbars instead of a circuit board, a main circuit is formed. Meanwhile, the signal pins of the inverter module and control module extend upwards and are connected to their respective circuit boards. This allows for control over the area of ​​a single circuit board and the number of connection pins, and eliminates the need for a large-area, thick copper circuit board to construct the main circuit for conducting large currents, thereby effectively reducing costs.

[0045] In some embodiments, refer to Figure 3a and Figure 3b The capacitor module 201 includes at least one capacitor 208 and a capacitor circuit board 209. The pins of each capacitor 208 extend upward and are electrically connected to the capacitor circuit board 209. The capacitor pins 201A and 201B are disposed on the capacitor circuit board 209.

[0046] Specifically, the number and type of capacitors 208 can be set according to actual needs and are not limited here. For example, standard capacitors, such as standard film capacitors, can be used, and there can be one or more of them. At least one capacitor 208 is provided on the capacitor circuit board 209. For example, the pins of each capacitor 208 extend upward and are inserted into the soldering holes of the capacitor circuit board 209 for soldering connection. The capacitor circuit board 209 is provided with capacitor pins 201A and 201B so as to be electrically connected to multiple power conversion modules 202 by means of copper busbars, such as to the boost module 205 and the inverter module 204.

[0047] In some embodiments, refer to Figure 3aBoth capacitor pins 201A and 201B include a first conductive portion 210 disposed on the capacitor circuit board 209 and extending downward, and a second conductive portion 211 electrically connected to the first conductive portion 210 and extending away from the side of the capacitor module 201 (specifically the capacitor 208). The second conductive portion 211 is electrically connected to the corresponding power pin.

[0048] Specifically, taking capacitor pin 201A as an example, capacitor pin 201A includes a first conductive part 210 and a second conductive part 211. The first conductive part 210 and the second conductive part 211 can be integrally formed, and there is no specific limitation here. One end of the first conductive part 210 is located on the capacitor circuit board 209, and the first conductive part 210 extends downward to approach the power pin 204B. The second conductive part 211 extends away from the side of the capacitor module 201, that is, towards the inverter module 204 to approach the power pin 204B. The second conductive part 211 and the power pin 204B can be electrically connected by laser welding. In other words, the electrical connection between the capacitor module 201 and the inverter module 204 is achieved by setting an L-shaped adapter terminal on the capacitor circuit board 209.

[0049] It is understood that one end of the first conductive part 210 is also electrically connected to one or more of at least one capacitor 208. For example, the capacitor circuit board 209 is provided with a current path to realize the electrical connection between the first conductive part 210 and the corresponding capacitor 208, thereby realizing the electrical connection between the corresponding capacitor 208 and the inverter module 204.

[0050] It should be noted that the configuration method for capacitor pin 201B can be the same as or different from that for capacitor pin 201A. For example, using... Figure 2a The structure shown is not limited here.

[0051] In some embodiments, refer to Figure 2a and Figure 2b The capacitor module 201 is an integrated capacitor, which includes at least one capacitor (not shown). Capacitor pins 201A and 201B are the power terminals for the integrated capacitor. In other words, the capacitor module 201 can be a customized injection-molded capacitor module, such as a customized film capacitor module. This module integrates one or more capacitors internally and has external power terminals for electrical connection to multiple power conversion modules 202, such as the inverter module 204 and the boost module 205. Connection methods include, but are not limited to, laser welding.

[0052] In some embodiments, refer to Figures 2a-3bThe power converter also includes a heat dissipation module 212. The capacitor module 201 and multiple power conversion modules 202 are all mounted on the heat dissipation module 212. For example, the backs of the capacitor module 201, inverter module 204, and boost module 205 can all be mounted on the heat dissipation module 212 for heat dissipation. It should be noted that... Figures 2a-3b In the example shown, the heat dissipation module 212 is integrated into one unit. However, in some other embodiments, the heat dissipation module 212 may include multiple modules, with the capacitor module 201, inverter module 204, and boost module 205 corresponding to different heat dissipation modules to meet different heat dissipation requirements. The heat dissipation module 212 can be an air-cooled radiator, a water-cooled radiator, etc., and there is no limitation here.

[0053] In some embodiments, the power converter is a multiphase inverter, which includes multiple inverter branches, each of which includes at least two inverter modules connected in parallel. The number of inverter modules connected in parallel in each inverter branch can be the same or different. For example, the power converter is a three-phase inverter, which includes three inverter branches connected in parallel. Each inverter branch can be composed of two inverter modules 204 connected in parallel to conduct large current, thereby realizing a high-power power converter and effectively improving the application flexibility of the inverter modules 204.

[0054] In the above embodiments, the inverter modules (multiple inverter modules connected in parallel to form an inverter branch, rather than connecting wafers in parallel within a single inverter module) and boost modules of the parallel scheme are arranged on both sides of the capacitor module. The power pins of the inverter modules and boost modules are routed to the side and electrically connected to the capacitor module via copper busbars instead of a circuit board to form the main circuit. The signal pins of the inverter modules and control modules are routed upward and electrically connected to the corresponding circuit boards. This allows the area and number of pins of a single circuit board to be controlled, and eliminates the need for a large area of ​​thick copper circuit board to construct the main circuit to conduct large currents, effectively reducing costs. The more inverter modules are connected in parallel, the more significant the cost reduction.

[0055] In some embodiments, a power electronic conversion device is also provided, including the aforementioned power converter. It should be noted that this power electronic conversion device includes, but is not limited to, devices requiring power conversion such as photovoltaic inverters, wind power converters, and new energy vehicle motor drives.

[0056] According to embodiments of the present invention, the power electronic conversion device, based on the aforementioned power converter, can effectively reduce costs.

[0057] In some embodiments, an electrical device is also provided, including the aforementioned power converter or power electronic conversion device. It should be noted that this electrical device includes, but is not limited to, photovoltaic power generation systems, wind power generation systems, new energy vehicles, household appliances, and other equipment requiring power conversion.

[0058] The electrical equipment according to embodiments of the present invention, based on the aforementioned power converter or power electronic conversion device, can effectively reduce costs.

[0059] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0061] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0062] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A power converter, characterized by, The power converter comprises: a capacitor module provided with capacitor pins extending to multiple sides; a plurality of power conversion modules and a control board, the plurality of power conversion modules are distributed on the multiple sides of the capacitor module, each of the power conversion modules is provided with signal pins extending upward and power pins extending to the sides, the signal pins are electrically connected to the control board, and the power pins are electrically connected to corresponding capacitor pins and located on the same side of the capacitor module as the electrically connected capacitor pins.

2. The power converter of claim 1, wherein, The plurality of power conversion modules comprise a plurality of inverter modules, and the control board comprises an inverter circuit board, the signal pins of each of the inverter modules are electrically connected to the inverter circuit board, and the power pins of each of the inverter modules are electrically connected to corresponding capacitor pins and located on the same side of the capacitor module as the electrically connected capacitor pins.

3. The power converter of claim 1, wherein, The plurality of power conversion modules comprise a plurality of inverter modules and at least one boost module, and the control board comprises an inverter circuit board and a boost circuit board; wherein, the signal pins of each of the inverter modules are electrically connected to the inverter circuit board, the power pins of each of the inverter modules are electrically connected to corresponding capacitor pins and located on the same side of the capacitor module as the electrically connected capacitor pins; the signal pins of each of the boost modules are electrically connected to the boost circuit board, and the power pins of each of the boost modules are electrically connected to corresponding capacitor pins and located on the same side of the capacitor module as the electrically connected capacitor pins.

4. The power converter of claim 3, wherein, The plurality of inverter modules and the inverter circuit board are located on one side of the capacitor module, and the at least one boost module and the boost circuit board are located on the other side of the capacitor module.

5. The power converter of any of claims 1-4, wherein, The capacitor module comprises at least one capacitor and a capacitor circuit board, the pins of each of the capacitors extend upward and are electrically connected to the capacitor circuit board, and the capacitor pins are arranged on the capacitor circuit board.

6. The power converter of claim 5, wherein, The capacitor pins comprise first conductive parts arranged on the capacitor circuit board and extending downward, and second conductive parts electrically connected to the first conductive parts and extending away from the sides of the capacitor module, and the second conductive parts are electrically connected to corresponding power pins.

7. The power converter of any of claims 1-4, wherein, The capacitor module is an integrated capacitor, the integrated capacitor comprises at least one capacitor, and the capacitor pins are power terminals of the integrated capacitor.

8. The power converter of claim 1, wherein, Further comprising a heat dissipation module, and the capacitor module and the plurality of power conversion modules are arranged on the heat dissipation module.

9. The power converter of claim 2 or 3, wherein, The power converter is a multi-phase inverter, and the multi-phase inverter comprises a plurality of inverter branches, each of the inverter branches comprises at least two inverter modules connected in parallel.

10. A power electronic conversion device, characterized by, The power converter comprises any one of claims 1-9.

11. An electrical device, characterized by The power converter comprises any one of claims 1-9, or the power electronic conversion device of claim 10.

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