Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a first circuit board, a first adapter plate, a second adapter plate and a second circuit board, the second adapter plate is arranged between the top of the first adapter plate and the bottom of the second circuit board, and the first circuit board sequentially passes through the first adapter plate and the second adapter plate. The first circuit board and the second circuit board are stacked in the thickness direction of the circuit board assembly. According to the circuit board assembly, the second adapter plate is arranged between the top of the first adapter plate and the bottom of the second circuit board, assembling is easy, the structure is simple, the first adapter plate and the second adapter plate are partially overlapped in the thickness direction of the circuit board assembly, the space utilization rate of the circuit board assembly in the thickness direction and the horizontal plane direction is increased, and the circuit board assembly is more convenient to use. Therefore, the reasonability of the spatial layout of the circuit board assembly is improved, the overall size of the circuit board assembly is reduced, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and more particularly to a circuit board assembly and electronic device. Background Technology

[0002] With the development of the electronic equipment industry, the functions required by mobile phones and other devices are gradually increasing, and the electronic components required to realize these functions are also gradually increasing, which puts forward higher requirements on the area of ​​circuit board components.

[0003] Currently, in order to achieve more functions, circuit board assemblies occupy too much area, resulting in an unreasonable spatial layout of the circuit board assemblies, which in turn affects the size of the entire electronic device and consequently the user experience. Summary of the Invention

[0004] This application provides a circuit board assembly and electronic device with a reasonable spatial layout, improved space utilization, and reduced size.

[0005] This application provides a circuit board assembly, including: a first circuit board, a first adapter board, a second adapter board and a second circuit board stacked sequentially from bottom to top, wherein the first adapter board and the second adapter board are partially stacked in the thickness direction of the circuit board assembly, and the projection surfaces of the first adapter board and the second adapter board on the first circuit board are partially overlapped.

[0006] Optionally, the first adapter plate and the second adapter plate are offset from each other in the thickness direction of the circuit board assembly.

[0007] The first adapter plate and the first circuit board enclose a first cavity, and the first adapter plate, the first circuit board, the second adapter plate, and the second circuit board enclose a second cavity; a plurality of electronic devices are provided at the top of the first circuit board and the bottom of the second circuit board, and the plurality of electronic devices are respectively located in the first cavity and the second cavity.

[0008] Optionally, the first adapter plate includes at least one groove, the opening of which is disposed facing the first circuit board, and the groove and a portion of the top surface of the first circuit board enclose the first cavity; a portion of the electronic device disposed on the top of the first circuit board is housed in the first cavity.

[0009] Optionally, there is a gap between the top surface of the electronic device located on top of the first circuit board within the first cavity and the bottom of the groove.

[0010] Optionally, there is a gap between the side of the electronic device located on top of the first circuit board within the first cavity and the sidewall of the groove.

[0011] Optionally, the second adapter plate is disposed between the top of the first adapter plate and the bottom of the second circuit board; the second adapter plate includes an adapter through hole; the first adapter plate includes at least one through hole; the through hole communicates with the adapter through hole, so that a portion of the top surface of the first circuit board, the bottom surface of the second circuit board, the side wall of the through hole, and the side wall of the adapter through hole enclose and form the second cavity; a portion of the electronic devices disposed on the top of the first circuit board and a plurality of the electronic devices disposed on the bottom of the second circuit board are all housed in the second cavity.

[0012] Optionally, the number of the second adapter plates is at least one.

[0013] Optionally, at least one second adapter plate is disposed on top of the first adapter plate.

[0014] Optionally, each of the adapter through holes of the second adapter plate is connected to each of the through holes of the first adapter plate.

[0015] Optionally, the number of the second circuit boards is at least one, and at least one second circuit board is located on top of the second adapter plate. Optionally, there is a gap between the top surface of the electronic device located on top of the first circuit board in the second cavity and the bottom surface of the electronic device located at the bottom of the second circuit board.

[0016] Optionally, there is a gap between the side of the electronic device located on top of the first circuit board within the second cavity and the sidewall of the through hole.

[0017] There is a gap between the side of the electronic device located at the bottom of the second circuit board within the second cavity and the sidewall of the adapter hole.

[0018] Optionally, the circuit board assembly may also include multiple shielding covers.

[0019] Optionally, the top of the first adapter plate is provided with multiple electronic devices, and the shielding cover is provided on the top of the first adapter plate to cover the multiple electronic devices provided on the top of the first adapter plate.

[0020] Optionally, the second circuit board has multiple electronic devices on its top, and the shielding cover is located on the top of the second circuit board to cover the multiple electronic devices located on the top of the second circuit board.

[0021] Optionally, the first circuit board has multiple electronic components on its top, and the shield is located on the top of the first circuit board to cover some of the electronic components located on the top of the first circuit board.

[0022] Optionally, the bottom of the first circuit board is provided with a plurality of electronic devices, and the shielding cover is provided at the bottom of the first circuit board to cover the plurality of electronic devices provided at the bottom of the first circuit board.

[0023] Optionally, the first adapter plate includes a cavity circuit board.

[0024] Optionally, the first circuit board includes a main circuit board.

[0025] Optionally, the second circuit board includes an radio frequency circuit board.

[0026] This application also provides an electronic device, including: a circuit board assembly as described in any of the preceding statements.

[0027] The circuit board assembly and electronic device provided in this application are easy to assemble and have a simple structure by placing a second adapter plate between the top of the first adapter plate and the bottom of the second circuit board. The first adapter plate and the second adapter plate are partially stacked in the thickness direction of the circuit board assembly, which improves the space utilization of the circuit board assembly in the thickness direction and the horizontal plane direction, thereby improving the rationality of the spatial layout of the circuit board assembly, reducing the overall size of the circuit board assembly, and improving the user experience. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0029] Figure 1 The diagram shown is a schematic diagram of one embodiment of the circuit board assembly of this application.

[0030] Figure 2 As shown Figure 1 A cross-sectional view of an embodiment of a circuit board assembly.

[0031] Explanation of reference numerals in the attached figures:

[0032] Circuit board assembly 100; first circuit board 1; first adapter plate 2; groove 21; through hole 22; second adapter plate 3; adapter through hole 31; second circuit board 4; first cavity 5; second cavity 6; electronic components 7; shielding cover 8. Detailed Implementation

[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.

[0034] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise defined, the technical or scientific terms used in this application should be understood in their ordinary sense by one of ordinary skill in the art to which this application pertains. The words “a” or “one” and similar terms used in this specification and claims do not indicate a limitation of quantity, but rather indicate the presence of at least one. “A plurality” includes two, equivalent to at least two. The words “comprising” or “including” and similar terms mean that the element or object preceding “comprising” or “including” covers the element or object listed following “comprising” or “including” and its equivalents, and does not exclude other elements or objects. The words “connected” or “linked” and similar terms are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. The singular forms “a,” “the,” and “the” used in this specification and appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0035] The circuit board assembly of this application includes a first circuit board, a first adapter board, a second adapter board, and a second circuit board. The second adapter board is disposed between the top of the first adapter board and the bottom of the second circuit board. The first circuit board is stacked with the second circuit board in the thickness direction of the circuit board assembly via the first adapter board and the second adapter board. By disposing the second adapter board between the top of the first adapter board and the bottom of the second circuit board, the circuit board assembly is easy to assemble and has a simple structure. The partial stacking of the first and second adapter boards in the thickness direction of the circuit board assembly improves the space utilization rate of the circuit board assembly in both the thickness and horizontal directions, thereby improving the rationality of the spatial layout of the circuit board assembly, reducing the overall size of the circuit board assembly, and improving the user experience.

[0036] This application provides a circuit board assembly and an electronic device. The circuit board assembly and electronic device of this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can be combined with each other.

[0037] Figure 1The diagram shown is a schematic diagram of one embodiment of the circuit board assembly 100 of this application. Figure 2 As shown Figure 1 A cross-sectional view of an embodiment of the circuit board assembly 100.

[0038] exist Figure 1 and Figure 2 In the illustrated embodiment, the electronic device includes a circuit board assembly 100, which can be a commonly used device such as a mobile phone or tablet. The circuit board assembly 100 includes a first circuit board 1, a first adapter board 2, a second adapter board 3, and a second circuit board 4, stacked sequentially from bottom to top. In this embodiment, the first circuit board 1 (Baseband, abbreviated as BB board) includes a main circuit board, which can be a printed circuit board (PCB). The first adapter board 2 includes a cavity circuit board, which can be a cavityPCB. The second adapter board 3 can be an interposer board (int board). The second circuit board 4 includes a radio frequency circuit board, which can be an RFPCB (Radio Frequency, abbreviated as RF board), a type of printed circuit board specifically designed and manufactured for radio frequency circuits. The first circuit board 1, the first adapter board 2, and the second circuit board 4 are used to arrange electronic components 7, and the second adapter board 3 is used to increase the space in the thickness direction (Z direction) and horizontal direction (X and Y directions) of the entire circuit board assembly 100. The circuit board assembly 100 includes a first circuit board 1, a first adapter plate 2, a second adapter plate 3, and a second circuit board 4. The second adapter plate 3 is disposed between the top of the first adapter plate 2 and the bottom of the second circuit board 4. The first circuit board 1 is stacked with the second circuit board 4 in the thickness direction of the circuit board assembly 100 via the first adapter plate 2 and the second adapter plate 3. By disposing the second adapter plate 3 between the top of the first adapter plate 2 and the bottom of the second circuit board 4, the circuit board assembly 100 is easy to assemble and has a simple structure. The partial stacking of the first adapter plate 2 and the second adapter plate 3 in the thickness direction of the circuit board assembly 100 improves the space utilization of the circuit board assembly 100 in both the thickness and horizontal directions, thereby improving the rationality of the spatial layout of the circuit board assembly 100, reducing the overall size of the circuit board assembly 100, making the structure compact, and making the overall structure of the electronic device thinner and lighter, thus improving the user experience. Optionally, the second adapter plate 3 does not include the part that directly connects the first circuit board 1 and the second circuit board 4, thereby reducing the size in the horizontal direction (X and Y directions) and reducing the number of soldering operations in the fabrication of the circuit board assembly. If not designed in this way, the dimensions of the circuit board assembly 100 in the thickness direction (Z direction) and horizontal direction (X direction and Y direction) will increase, thereby increasing the volume of the circuit board assembly 100 and the space required to install the circuit board assembly 100 in the electronic device, resulting in wasted space.

[0039] exist Figure 1 and Figure 2 In the illustrated embodiment, the first adapter plate 2 and the second adapter plate 3 are partially stacked in the thickness direction of the circuit board assembly 100, and their projection surfaces on the first circuit board 1 partially overlap. The circuit board assembly 100 is constructed by sequentially stacking the first circuit board 1, the first adapter plate 2, the second adapter plate 3, and the second circuit board 4 from bottom to top. The partial stacking of the first adapter plate 2 and the second adapter plate 3 in the thickness direction improves the space utilization of the circuit board assembly 100 in the thickness direction. Furthermore, the partial overlap of the projection surfaces of the first adapter plate 2 and the second adapter plate 3 on the first circuit board 1 improves the space utilization of the circuit board assembly 100 in the horizontal direction, thereby enhancing the rationality of the spatial layout of the circuit board assembly 100, reducing the overall size of the circuit board assembly 100, and improving the user experience. The first adapter plate 2 and the second adapter plate 3 are staggered in the thickness direction of the circuit board assembly 100. In this embodiment, after the first adapter plate 2 and the second adapter plate 3 are offset in the thickness direction of the circuit board assembly, a portion of the first adapter plate 2 overlaps with the second adapter plate 3 in the thickness direction of the circuit board assembly 100, while a portion of the first adapter plate 2 is exposed to the outside. This allows the first adapter plate 2 to have more space to arrange electronic devices 7, further rationalizing the spatial layout of the circuit board assembly 100 and improving the space utilization rate of the circuit board assembly 100.

[0040] exist Figure 1 and Figure 2 In the illustrated embodiment, the first adapter plate 2 includes at least one groove 21 and at least one through hole 22. The at least one groove 21, together with the first circuit board 1, forms a first cavity 5. The first cavity 5 is used to accommodate multiple electronic devices 7 of the circuit board assembly 100. The at least one through hole 22, together with the first circuit board 1, the second adapter plate 3, and the second circuit board 4, forms a second cavity 6. The second cavity 6 is used to accommodate multiple electronic devices 7 of the circuit board assembly 100. Multiple electronic devices 7 are provided on the top of the first circuit board 1 and the bottom of the second circuit board 4. The electronic devices 7 are used to implement the functions required by the electronic device corresponding to the circuit board assembly 100. The multiple electronic devices 7 are respectively located in the first cavity 5 and the second cavity 6.

[0041] The circuit board assembly 100 consists of a first circuit board 1, a first adapter plate 2, a second adapter plate 3, and a second circuit board 4 stacked sequentially from bottom to top. The first adapter plate 2 forms a first cavity 5 by enclosing the first circuit board 1 through at least one groove 21, and forms a second cavity 6 by enclosing the first circuit board 1, the second adapter plate 3, and the second circuit board 4 through at least one through hole 22. By effectively utilizing the through hole 22 and the groove 21 of the first adapter plate 2, multiple electronic devices 7 can be housed in the first cavity 5 and the second cavity 6, thereby improving space utilization, reducing the stacking height of the multi-layer circuit boards, reducing the thickness of the circuit board assembly 100, and further reducing the thickness of the entire electronic device, thus improving the user experience. In this embodiment, a three-dimensional stacking process of five sandwiches is formed by using the first adapter board 2 and the sandwich stack (i.e., the sandwich stack formed by the second circuit board 4, the second adapter board 3, and the first circuit board 1). This allows electronic devices 7 to be placed on all five sides of the circuit board assembly 100. The size of the circuit board assembly 100 is reduced in the X direction, and the placement area is increased in the Z direction, which satisfies the layout of electronic devices 7 and meets the requirements of extreme stacking and electronic devices, such as the need for a large camera module decoration (referred to as deco) in mobile phones.

[0042] exist Figure 1 and Figure 2 In the embodiment shown, the opening of the groove 21 is positioned facing the first circuit board 1. Figure 1 The dashed line represents the groove 21 located on the side facing the first circuit board 1. The groove 21 and part of the top surface of the first circuit board 1 enclose a first cavity 5, in which a portion of the electronic components 7 located on the top of the first circuit board 1 are housed. This arrangement ensures the functionality of the electronic devices and utilizes the space of the circuit board assembly 100 in the Z direction, saving space in the X and Y directions. A gap exists between the top surface of the electronic components 7 located on the top of the first circuit board 1 within the first cavity 5 and the bottom of the groove 21. This design protects the electronic components 7 while preventing friction between the top surface of the electronic components 7 and the bottom of the groove 21, thus ensuring the functionality of the electronic components 7 is not interfered with. The gap between the top surface of the electronic components 7 located on the top of the first circuit board 1 and the bottom of the groove 21 can be set according to actual needs, as long as it meets the heat dissipation requirements of the electronic components 7. A gap also exists between the side surface of the electronic components 7 located on the top of the first circuit board 1 within the first cavity 5 and the sidewall of the groove 21. This design protects the electronic component 7 while preventing friction between the side of the electronic component 7 and the sidewall of the groove 21, thus ensuring that the function of the electronic component 7 is not interfered with. The gap between the side of the electronic component 7 located on the top of the first circuit board 1 and the sidewall of the groove 21 can be set according to actual needs, as long as it meets the heat dissipation requirements of the electronic component 7.

[0043] exist Figure 1 and Figure 2 In the illustrated embodiment, a second adapter plate 3 is disposed between the top of the first adapter plate 2 and the bottom of the second circuit board 4. The second adapter plate 3 is used to increase the height between the first adapter plate 2 and the second circuit board 4. The second adapter plate 3 includes an adapter through hole 31. The adapter through hole 31 is used to save space in the circuit board assembly 100. The through hole 22 communicates with the adapter through hole 31, so that a portion of the top surface of the first circuit board 1, the bottom surface of the second circuit board 4, the sidewall of the through hole 22, and the sidewall of the adapter through hole 31 enclose a second cavity. Specifically, the through hole 22 communicates with the adapter through hole 31 and forms a second cavity 6 with the inner side surface of the second adapter plate 3, a portion of the top surface of the first circuit board 1, and the bottom surface of the second circuit board 4, respectively. In this embodiment, the shapes of the through hole 22 and the adapter through hole 31 are adapted to each other, both being irregular hexagons, and both extending in the X and Y directions. This arrangement can increase the space of the second cavity 6. The number of second adapter plates 3 is at least one. In this embodiment, the number of second adapter plates 3 is one, but two, three, etc., can also be provided, and the number is not limited to this. At least one second adapter plate 3 is disposed on top of the first adapter plate 2. In some embodiments, multiple second adapter plates 3 are distributed in the X and / or Y directions on the top of the first adapter plate 2. This arrangement can increase the space of the circuit board assembly 100 in the X and Y directions, facilitating the placement of more electronic devices 7. The adapter through-hole 31 of each second adapter plate 3 is respectively connected to each through-hole 22 of the first adapter plate 2. This arrangement can increase the space of the circuit board assembly 100 in the Z direction, facilitating the placement of more electronic devices 7 in the Z direction. In some other embodiments, the adapter through-hole 31 of each second adapter plate 3 may not be connected to each through-hole 22 of the second adapter plate 3, and may be directly disposed on top of the second circuit board 4, and is not limited to this. The number of second circuit boards 4 is at least one. In this embodiment, the number of second circuit boards 4 is one, but two, three, etc., can also be provided, and the number is not limited to this. At least one second circuit board 4 is located on top of the second adapter plate 3. At least one second circuit board 4 is respectively disposed corresponding to each second adapter plate 3. This arrangement increases the number of second circuit boards 4, thereby increasing the number of positions where more electronic devices 7 can be installed. In some embodiments, each second circuit board 4 is respectively disposed corresponding to each through hole 22 of the first adapter plate 2. This arrangement increases the number of second circuit boards 4 facing the second adapter plate 3, facilitating the installation of more electronic devices 7.

[0044] exist Figure 1 and Figure 2In the illustrated embodiment, some electronic devices 7 located at the top of the first circuit board 1 and multiple electronic devices 7 located at the bottom of the second circuit board 4 are housed within the second cavity 6. This arrangement allows the second cavity 6 to accommodate some of the electronic devices 7 from both the first and second circuit boards 1 and 4, utilizing the space in the Z-direction of the circuit board assembly 100 and saving space in the X and Y directions. A gap exists between the top surface of the electronic device 7 located at the top of the first circuit board 1 and the bottom surface of the electronic device 7 located at the bottom of the second circuit board 4 within the second cavity 6. This arrangement protects the electronic devices 7 while preventing friction between them, thus ensuring the functionality of the electronic devices 7 is not interfered with. The gap between the top surface of the electronic device 7 located at the top of the first circuit board 1 and the bottom surface of the electronic device 7 located at the bottom of the second circuit board 4 within the second cavity 6 can be set according to actual needs, as long as it meets the heat dissipation requirements of the electronic devices 7. A gap exists between the side of the electronic device 7 located at the top of the first circuit board 1 within the second cavity 6 and the sidewall of the through hole 22. This design protects the electronic device 7 while preventing friction between the side of the electronic device 7 and the sidewall of the through hole 22, thus ensuring that the function of the electronic device 7 is not interfered with. The gap between the side of the electronic device 7 located at the top of the first circuit board 1 within the second cavity 6 and the sidewall of the through hole 22 can be set according to actual needs, as long as it meets the heat dissipation requirements of the electronic device 7. A gap also exists between the side of the electronic device 7 located at the bottom of the second circuit board 4 within the second cavity 6 and the sidewall of the transition through hole 31. This gap protects the electronic device 7 while preventing friction between the side of the electronic device 7 and the sidewall of the transition through hole 31, thus ensuring that the function of the electronic device 7 is not interfered with.

[0045] exist Figure 2In the illustrated embodiment, the circuit board assembly 100 further includes multiple shielding covers 8. The shielding covers 8 are used to protect the electronic components 7, prevent signal interference, and effectively improve the circuit performance of the circuit board assembly 100. Multiple electronic components 7 are disposed on the top of the first adapter plate 2. The shielding covers 8 are disposed on the top of the first adapter plate 2, covering the multiple electronic components 7 disposed on the top of the first adapter plate 2. The shielding covers 8 shield the multiple electronic components 7 on the top of the first adapter plate 2. In this embodiment, the multiple electronic components 7 on the top of the first adapter plate 2 are located on the top surface of the outer surface of the groove 21 of the first adapter plate 2, that is, the portion of the top of the first adapter plate 2 not covered by the second adapter plate 3 and the second circuit board 4. Multiple electronic components 7 are disposed on the top of the first circuit board 1, and the shielding covers 8 are disposed on the top of the first circuit board 1, covering a portion of the electronic components 7 disposed on the top of the first circuit board 1. In this embodiment, the shielding cover 8 shields the electronic components 7 located within the second cavity 6 of the first adapter plate 2. The electronic components 7 within the first cavity 5 are covered by the groove 21 of the first adapter plate 2. The shielding cover 8 may or may not be provided; it is not limited to this. Multiple electronic components 7 are located at the bottom of the first circuit board 1. The shielding cover 8 is located at the bottom of the first circuit board 1, covering the multiple electronic components 7 located at the bottom of the first circuit board 1. The electronic components 7 at the bottom of the first circuit board 1 are exposed to the outside. In this embodiment, one shielding cover 8 may be provided; in other embodiments, multiple shielding covers 8 may be provided; it is not limited to this. Multiple electronic components 7 are located at the top of the second circuit board 4. The shielding cover 8 is located at the top of the second circuit board 4, covering the multiple electronic components 7 located at the top of the second circuit board 4. The electronic components 7 at the top of the second circuit board 4 are exposed to the outside. In this embodiment, two shielding covers 8 are provided; it is not limited to one, three, four, or other numbers. The electronic components 7 at the bottom of the second circuit board 4 and a portion of the electronic components 7 at the top of the first circuit board 1 are disposed within the second cavity 6. In this embodiment, the portion of the electronic components 7 at the top of the first circuit board 1 may be provided with a shielding cover 8, while the electronic components 7 at the bottom of the second circuit board 4 may not be provided with a shielding cover 8. In some embodiments, the portion of the electronic components 7 at the top of the first circuit board 1 may not be provided with a shielding cover 8, while the electronic components 7 at the bottom of the second circuit board 4 may be provided with a shielding cover 8. In other embodiments, both the portion of the electronic components 7 at the top of the first circuit board 1 and the electronic components 7 at the bottom of the second circuit board 4 may be provided with shielding covers 8, and this is not limited to these embodiments.

[0046] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A circuit board assembly, characterized by The circuit board assembly comprises: a first circuit board, a first adapter plate, a second adapter plate and a second circuit board, the second adapter plate is arranged between the top of the first adapter plate and the bottom of the second circuit board, and the first circuit board is arranged in the thickness direction of the circuit board assembly by the first adapter plate and the second adapter plate in sequence and stacked with the second circuit board.

2. The circuit board assembly of claim 1, wherein, The first adapter plate and the first circuit board form a first cavity, and the first adapter plate, the first circuit board, the second adapter plate and the second circuit board form a second cavity; the top of the first circuit board and the bottom of the second circuit board are each provided with a plurality of electronic devices, and the plurality of electronic devices are respectively located in the first cavity and the second cavity.

3. The circuit board assembly of claim 2, wherein, The first adapter plate comprises at least one groove, the opening of the groove is arranged towards the first circuit board, and the groove and part of the top surface of the first circuit board form the first cavity; part of the electronic devices arranged on the top of the first circuit board are received in the first cavity.

4. The circuit board assembly of claim 3, wherein, The top surface of the electronic device arranged on the top of the first circuit board in the first cavity and the groove bottom have a gap; and / or The side surface of the electronic device arranged on the top of the first circuit board in the first cavity and the side wall of the groove have a gap.

5. The circuit board assembly of claim 2, wherein, The second adapter plate comprises an adapter through hole; the first adapter plate comprises at least one through hole; the through hole and the adapter through hole are in communication, so that part of the top surface of the first circuit board, the bottom surface of the second circuit board, the side wall of the through hole and the side wall of the adapter through hole form the second cavity; part of the electronic devices arranged on the top of the first circuit board and the plurality of electronic devices arranged on the bottom of the second circuit board are all received in the second cavity.

6. The circuit board assembly of claim 5, wherein, The number of the second adapter plates is at least one; At least one of the second adapter plates is arranged on the top of the first adapter plate; and / or The adapter through hole of each of the second adapter plates is in communication with each of the through holes of the first adapter plate respectively; and / or The number of the second circuit boards is at least one, and at least one of the second circuit boards is arranged on the top of the second adapter plate.

7. The circuit board assembly of claim 6, wherein, The top surface of the electronic device arranged on the top of the first circuit board in the second cavity and the bottom surface of the electronic device arranged on the bottom of the second circuit board have a gap; and / or The side surface of the electronic device arranged on the top of the first circuit board in the second cavity and the side wall of the through hole have a gap; and / or The side surface of the electronic device arranged on the bottom of the second circuit board in the second cavity and the side wall of the adapter through hole have a gap.

8. The circuit board assembly of claim 1, wherein, The circuit board assembly further comprises a plurality of shielding covers; The first adapter plate is provided with a plurality of electronic devices on the top, and the shielding cover is arranged on the top of the first adapter plate to cover the plurality of electronic devices arranged on the top of the first adapter plate; And / or The second circuit board is provided with a plurality of electronic devices on the top, and the shielding cover is arranged on the top of the second circuit board to cover the plurality of electronic devices arranged on the top of the second circuit board.

9. The circuit board assembly of claim 1, wherein, The circuit board assembly further comprises a plurality of shielding covers; The first circuit board is provided with a plurality of electronic devices on the top thereof, and the shielding covers are arranged on the top of the first circuit board to cover part of the electronic devices on the top of the first circuit board; and / or The first circuit board is provided with a plurality of electronic devices on the bottom thereof, and the shielding covers are arranged on the bottom of the first circuit board to cover the electronic devices on the bottom of the first circuit board.

10. The circuit board assembly of claim 1, wherein, The first adapter board comprises a concave cavity circuit board; and / or The first circuit board comprises a main circuit board; and / or The second circuit board comprises a radio frequency circuit board.

11. An electronic device, comprising: The circuit board assembly comprises: The circuit board assembly according to any one of claims 1 to 10.

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