Micro heat source assembly, manufacturing method thereof, atomizing core and electronic device

Abstract

The invention provides a micro heat source assembly and a manufacturing method thereof, an atomizing core and an electronic device, and the micro heat source assembly comprises a first substrate which is provided with at least one first through hole; the second substrate and the first substrate are arranged in a laminated mode, and a second through hole is formed in the second substrate; the heat source piece is arranged between the first base plate and the second base plate, the heat source piece is used for heating liquid flowing in from the first through hole to enable the liquid to form atomized gas, the second through hole is used for enabling the atomized gas to pass through, and the problem of dry burning caused by poor contact between the heat source piece and the liquid in traditional electronic atomization equipment can be effectively solved; and the equipment service life and safety are obviously improved.

Description

Technical Field

[0001] This application relates to the field of atomization technology, and in particular to a micro heat source component and its manufacturing method, atomizing core and electronic device. Background Technology

[0002] Currently, the atomizing core structure in electronic atomizing devices typically adopts a design where the heating element is directly placed on a glass substrate. Its working principle is that the heating element generates heat when energized, atomizing the surrounding liquid into gas.

[0003] However, in related technologies, due to unreasonable design of the atomizing core structure and deformation of the heating element and / or substrate during use, poor contact between the liquid and the heating element occurs, and heat cannot be effectively transferred to the liquid, causing the heating element to easily burn out, affecting its safety and lifespan. Summary of the Invention

[0004] This application provides a micro heat source component, an atomizing core, an electronic device, and a method for manufacturing the micro heat source component, in order to at least solve the above-mentioned technical problems existing in the prior art.

[0005] According to a first aspect of this application, a micro heat source component is provided, the micro heat source component comprising: The first substrate has at least one first through hole; The second substrate is stacked with the first substrate, and the second substrate has a second through hole; A heat source is disposed between the first substrate and the second substrate. The heat source is used to heat the liquid flowing in from the first through hole to make the liquid form atomized gas. The second through hole is used to allow the atomized gas to pass through.

[0006] In one possible implementation, the heat source component is further comprising: the heat source component is arranged in a sheet shape, and the heat source component is hollowed out to allow the atomized gas to pass through.

[0007] In one possible embodiment, the second substrate has a first groove on one side opposite to the first substrate, the first substrate is disposed within the first groove, and the heat source is disposed between the bottom of the first substrate and the first groove; and / or, A second groove is provided on the side of the first substrate opposite to the second substrate.

[0008] In one embodiment, the material further includes a first colloid, which is bonded between the first substrate and the second substrate.

[0009] In one embodiment, the device further includes a second colloid disposed between the second substrate and the heat source.

[0010] In one possible implementation, the method further includes: the diameter of the first through hole gradually decreases along the direction in which the liquid flows from the first through hole.

[0011] In one embodiment, the diameter of the second through hole is larger than the diameter of the first through hole.

[0012] In one embodiment, the projection of the heat source on the second substrate at least partially covers the second through hole.

[0013] In one embodiment, the second through hole is strip-shaped.

[0014] In one embodiment, the heat source component is mesh-like to allow it to be perforated, the heat source component includes metal lines, and the projection of the opening of the first through hole on the first substrate on the side opposite to the heat source component at least partially overlaps with the projection of the metal lines on the first substrate.

[0015] In one embodiment, the diameter of the first through hole on the side opposite the heat source is smaller than the width of the metal line.

[0016] In one embodiment, the heat source component includes an integrally formed body portion and a flattened portion, the flattened portion having a free end, the body portion including metal lines, and the width of the free end of the flattened portion being greater than the width of the metal lines.

[0017] In one embodiment, the first substrate and / or the second substrate have a third through hole, and the heat source includes an electrode. The third through hole is used to expose the electrode so that the electrode can be electrically connected to an external circuit.

[0018] According to a second aspect of this application, an atomizing core is provided, comprising the micro heat source component described in any of the foregoing items.

[0019] According to a third aspect of this application, an electronic device is provided, comprising the micro heat source assembly described in any of the foregoing items.

[0020] In one embodiment, the electronic device further includes a housing comprising a cavity in which the micro-heat source assembly is located. (A semi-enclosed space to prevent gas from passing through elsewhere.) According to a fourth aspect of this application, a method for manufacturing a micro heat source component is provided, the method comprising: A first substrate and a second substrate are provided, wherein the first substrate has at least one first through hole and the second substrate has a second through hole; A heat source is provided, wherein the heat source, the first substrate, and the second substrate are stacked and disposed between the first substrate and the second substrate. The heat source is used to heat liquid flowing in from the first through hole to form atomized gas, and the second through hole is used to allow the atomized gas to pass through.

[0021] In one embodiment, the method for stacking the heat source, the first substrate, and the second substrate includes: Provides a first carrier plate, a second carrier plate, and a plurality of heat source components. The first carrier plate, the second carrier plate, and a plurality of heat source components are stacked and arranged, with the plurality of heat source components laid flat between the first carrier plate and the second carrier plate; The first and second carrier plates after being cut and stacked are used to form a plurality of the micro heat source components. The cut first carrier plate includes a plurality of first substrates, and the cut second carrier plate includes a plurality of second substrates. Each micro heat source component includes a first substrate, a heat source element and a second substrate stacked together.

[0022] In one possible implementation, it further includes: The first colloid is coated between the first substrate and the second substrate.

[0023] In one embodiment, the method further includes coating a second colloid between the second substrate and the heat source.

[0024] This application provides a micro heat source component and its manufacturing method, an atomizing core, and an electronic device. The micro heat source component includes: a first substrate having at least one first through hole; a second substrate stacked with the first substrate, the second substrate having a second through hole; and a heat source component disposed between the first substrate and the second substrate. The heat source component is used to heat liquid flowing in from the first through hole to form atomized gas, and the second through hole is used to allow the atomized gas to pass through. This effectively solves the problem of dry burning caused by poor contact between the heat source component and the liquid in traditional electronic atomizing devices, and significantly improves the device's lifespan and safety.

[0025] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0026] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily apparent from the following detailed description taken in conjunction with the accompanying drawings. Several embodiments of this application are illustrated in the drawings by way of example and not limitation, in which: In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0027] Figure 1 This illustration shows a schematic diagram of a micro heat source component according to an embodiment of this application; Figure 2 This illustration shows a schematic diagram of a first through hole provided in an embodiment of this application; Figure 3 A schematic diagram of an exemplary heat source structure is provided in one embodiment of this application; Figure 4 A schematic diagram of yet another exemplary micro heat source component provided in an embodiment of this application; Figure 5 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application; Figure 6 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application; Figure 7 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application; Figure 8 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application; Figure 9 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application; Figure 10(a) is a three-dimensional structural schematic diagram of an exemplary micro heat source component provided in an embodiment of this application; Figure 10(b) is a top view schematic diagram of an exemplary micro heat source component provided in an embodiment of this application; Figure 11 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application; Figure 12 This is a schematic diagram of another exemplary heat source structure provided in an embodiment of this application; Figure 13(a) is a three-dimensional structural schematic diagram of another exemplary micro heat source component provided in an embodiment of this application; Figure 13(b) is a top view of an exemplary micro heat source component provided in an embodiment of this application; Figure 14(a) is a three-dimensional split schematic diagram of another exemplary micro heat source component provided in an embodiment of this application; Figure 14(b) is an exemplary top-view three-dimensional schematic diagram provided in an embodiment of this application; Figure 14(c) is a schematic diagram of another exemplary micro heat source component structure provided in an embodiment of this application; Figure 15 A schematic diagram of another exemplary micro heat source component structure provided in an embodiment of this application; Figure 16This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 17 A flowchart illustrating a method for manufacturing a micro heat source component according to an embodiment of this application; Figure 18 This is a schematic diagram illustrating the fabrication process of a micro heat source component according to an embodiment of this application.

[0028] Figure label: 11-First substrate, 12-Second substrate, 13-Heat source, 111-First through hole, 121-Second through hole, 131-Metal line, 122-First groove, 112-Second groove, 14-First colloid, 15-Second colloid, 130-Body part, 132-Planing part, 16-Third through hole, 123-First cavity space, 113-Second cavity space. Detailed Implementation

[0029] To make the objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The micro heat source component is the core heating unit of an electronic atomization device. It consists of a multi-layer substrate and a heating element. Its core function is to rapidly and efficiently heat liquids (such as atomizing liquids) to a vaporized state while ensuring structural stability and durability. Currently, to reduce costs, the substrate of the micro heat source component is mostly made of glass substrates (such as silica-based glass). However, due to the large difference in the coefficients of thermal expansion between the glass substrate and the heating element, the glass substrate is prone to local cracking or overall breakage, resulting in a low yield. To solve the above problems, this embodiment provides a new micro heat source component structure.

[0031] Figure 1 A schematic diagram of a micro heat source assembly provided in an embodiment of this application includes: a first substrate 11, a second substrate 12, and a heat source component 13, wherein, A first substrate 11 is provided with at least one first through hole 111; a second substrate 12 is stacked with the first substrate 11 and has a second through hole 121; a heat source 13 is disposed between the first substrate 11 and the second substrate 12, the heat source 13 is used to heat the liquid flowing in from the first through hole 111 to make the liquid form atomized gas, and the second through hole 121 is used to allow the atomized gas to pass through.

[0032] The first substrate 11 is a support substrate, which can be made of glass or polymer composite materials, etc. Its surface has at least one first through-hole 111 for liquid (such as atomizing liquid) to flow from the external storage space into the area where the heat source 13 is located. The first through-hole 111 penetrates the first substrate 11, and its position must be precisely aligned with or at least partially aligned with the heating area of ​​the heat source 13 to ensure that the liquid can directly contact or approach the surface of the heating area. The distribution density and structural size of the first through-hole 111 can be matched with its applicable scenario and target atomization rate. For example, in high-frequency atomization scenarios, an array-type porous structure can be used, such as... Figure 2 As shown. The shape of the first through hole 111 can be circular, rectangular, trapezoidal, or polygonal, etc. Figure 1 and Figure 2 The shape of the first through hole is merely illustrative and is not limited in this embodiment.

[0033] The second substrate 12 and the first substrate 11 can be stacked together by bonding, welding, or snap-fit ​​structures. The material of the second substrate 12 can be the same as or different from that of the first substrate 11. The second substrate 12 has a second through hole 121, which, together with the first substrate 11, forms a sealed or semi-sealed cavity to restrict the flow path of liquid and atomized gas, and allows the atomized gas to be smoothly discharged through the second through hole 121. Figure 1 As shown, Figure 1 The second substrate 12 and the first substrate 11 are schematically arranged in the form of a semi-sealed cavity. It should be noted that the shape of the second through hole 121 is not limited in this embodiment. In an optional embodiment, the diameter of the second through hole 121 is usually larger than that of the first through hole 111 to ensure smooth flow of atomized gas and avoid blockage.

[0034] The heat source 13 is embedded between the first substrate 11 and the second substrate 12, directly or indirectly contacting the bottom of the first through hole 111, and is used to rapidly heat the liquid flowing into the first through hole 111 to an atomized state. The heat source 13 can be a heating film, a resistance heating wire, or a microchip heater, etc., and its shape can be a sheet structure, a three-dimensional plate structure, or a mesh structure, etc. It is connected to an external power supply through electrodes, and the heating power can be selectively adjusted freely according to the needs through a temperature control module to achieve different atomization rates. Specifically, in this embodiment, when the micro heat source component is in operation, liquid flows into the surface of the heat source component 13 or its vicinity through the first through hole 111 of the first substrate 11, rapidly absorbs heat, and vaporizes into atomized gas. Then, the atomized gas is discharged along the second through hole 121 of the second substrate 12 to complete the liquid-to-gas conversion process.

[0035] In this embodiment, through-holes are provided on the first substrate 11 and the second substrate 12. Liquid can enter the heat source 13 through the first through-hole 111, and atomized gas can be discharged through the second through-hole 121. Since the first substrate 11 and the second substrate 12 clamp and fix the heat source 13 in the middle, not only can the liquid be atomized normally, but it also reduces the possibility of deformation of the heat source 13, thereby avoiding the phenomenon of dry burning due to the liquid not being able to contact the heat source 13 caused by the deformation of the heat source 13, thus improving the product's lifespan and safety.

[0036] In one embodiment, the heat source 13 is arranged in a sheet shape, and the heat source 13 is hollowed out to allow the atomizing gas to pass through, such as... Figure 3 As shown, Figure 3 This is a schematic diagram of an exemplary heat source structure provided in an embodiment of the present application, including a metal circuit 131.

[0037] The heat source component 13 employs a hollow sheet-like structure design, such as honeycomb holes, mesh holes, arrayed through holes, or metal lines, forming a uniformly distributed porous channel on its surface. The arrangement direction of the hollow holes is consistent with the flow path of the atomized gas. The beneficial effects of this structural design include, but are not limited to, maintaining the overall heating function while providing a path for the flow of atomized gas, and effectively avoiding substrate damage caused by localized overheating and the problem of dry burning of the heat source component 13. It should be noted that... Figure 3 The metal circuit 131 is merely an exemplary illustration, and this embodiment does not limit the specific circuit diagram or structure of the heat source component 13.

[0038] In another embodiment, the second substrate 12 has a first groove 122 on one side opposite to the first substrate 11, the first substrate 11 is disposed within the first groove 122, and a heat source is disposed between the bottom of the first substrate 11 and the first groove 122. Figure 4 As shown.

[0039] Figure 4 This is a schematic diagram of another exemplary micro heat source component provided in an embodiment of this application. The shape of the first groove 122 can be flexibly designed according to functional requirements, such as, but not limited to, the following forms: strip-shaped groove, arc-shaped groove, grid-shaped groove, etc. Specifically, the first groove 122 is provided on the side of the second substrate 12 facing the first substrate 11, and the first substrate 11 is embedded therein. The heat source component 13 is clamped between the first substrate 11 and the bottom of the groove 122, reducing deformation of the heat source component 13 due to high temperature through a limiting effect; furthermore, the heat source component 13 can be directly attached to or not attached to the bottom of the first groove 122. Figure 4 Only one example of a fitting method is shown.

[0040] In addition, the heat source component 13 may not be fitted to the bottom of the first groove 122, forming a gap buffer space with the first groove 122 (as described below). Figure 8 (As shown). In this embodiment, a gas buffer chamber is formed in the first groove 122, and the gas flows out through the second through hole 121, which avoids the atomized airflow from directly impacting the glass surface. Combined with the directional flow of the hollow heat source 13, this includes, but is not limited to, significantly reducing the substrate breakage rate.

[0041] In another embodiment, a second groove 112 is provided on the side of the first substrate 11 opposite to the second substrate 12, such as... Figures 5-6 As shown. Figure 5 This is a schematic diagram of another exemplary micro heat source component provided in an embodiment of this application, wherein the shape of the second groove 112 may be the same as or different from that of the first groove 122, and its structural form is not limited. In this embodiment, by providing a second groove 112 on the side of the first substrate 11 opposite to the second substrate 12, liquid can directly contact the heat source component 13 embedded in the second groove 112 through the first through hole 111. Figure 5 As shown, the heat source 13 is directly embedded in the second groove 112 and fits against the bottom of the second groove 112.

[0042] In other embodiments, the heat source 13 may not be in contact with the bottom of the second groove 112, leaving a certain gap. This gap in the second groove 112 acts as a buffer, preventing excessive liquid from directly impacting the heat source surface and allowing the liquid to spread evenly on the heat source 13. Furthermore, the continuous heating function of the heat source 13 during operation creates a localized heating chamber within the gap in the second groove 112. This has beneficial effects, including but not limited to improving the heating efficiency of the liquid and further shortening the atomization time. Figure 6 This is a schematic diagram of another exemplary micro heat source component provided in an embodiment of this application. It includes a first groove 122 on one side of the second substrate 12 opposite to the first substrate 11, and a second groove 112 on the side of the first substrate 11 opposite to the second substrate 12. The heat source component 13 is disposed within the first groove 122 and the second groove 112. This embodiment, by providing a double-groove structure on the upper and lower surfaces of the heat source component 13, forms a sealed chamber, effectively improving the airtightness of the atomizing core, preventing leakage of atomized gas from unintended paths. Furthermore, the liquid can directly contact the heat source component 13 along a preset path for heating and atomization through the first through-hole 111, and then be discharged directly through the second through-hole 121 along the preset path. This includes, but is not limited to, achieving precise control of liquid flow, efficient heat transfer, significantly improving atomization efficiency, and extending the service life of the device.

[0043] Figure 7 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application, as shown below. Figure 7 As shown, the micro heat source component further includes a first colloid 14, which is connected between the first substrate 11 and the second substrate 12. In this embodiment, the first colloid 14 is used to achieve reliable adhesion between the first substrate 11 and the second substrate 12. The adhesion method includes, but is not limited to, segmented dispensing, selective bonding with localized curing, or covering a large area of ​​the contact area between the first substrate 11 and the second substrate 12, to achieve beneficial effects such as preventing deformation of the micro heat source component or improving the structural durability of the micro heat source component. It should be noted that this embodiment does not limit the location of the first colloid 14. Figure 7 The location is merely for illustrative purposes.

[0044] Figure 8 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application, as shown below. Figure 8 As shown, the micro heat source assembly also includes a second colloid 15, which is disposed between the second substrate 12 and the heat source component 13. The second colloid 15 may be the same as or different from the first colloid 14, and its colloid material and specific bonding method can be flexibly selected according to the material and operating temperature of the heat source component 13. In this embodiment, the second substrate 12 is provided with a first groove 122. The second colloid 15, pre-formed into a shape, is placed at the bottom of the first groove 122 to bond the second substrate 12 and the heat source component 13, including but not limited to achieving precise positioning of the heat source component 13 and preventing it from shifting under thermal expansion, vibration, or mechanical force.

[0045] It should be noted that, since the second colloid 15 in this embodiment is a pre-formed shape with a certain thickness, a gap space is left between the heat source 13 and the second substrate 12 within the first groove 122. In addition, the first substrate 11 can be disposed outside the first groove 122 (e.g., Figure 7 As shown in the figure, it can also be set within the first groove 122. In this embodiment, the setting position of the first substrate 11 is not limited.

[0046] In another embodiment, the micro heat source assembly further includes: along the direction of liquid inflow from the first through-hole 111, the aperture of the first through-hole 111 gradually decreases, such as... Figure 9 As shown. Figure 9 A schematic diagram of another exemplary micro heat source component provided in an embodiment of this application, as shown below. Figure 9 As shown, the self-driving flow characteristic design of the gradually decreasing aperture of the first through hole 111 includes, but is not limited to, forcing the liquid to flow rapidly along the axis of the through hole due to gravity by reducing the aperture, so as not to block the opening of the upper diameter of the first through hole (far from the second substrate 12).

[0047] In another embodiment, the diameter of the second through hole 121 is larger than the diameter of the first through hole 111, such as... Figure 9As shown. The first through-hole 111 is dedicated to precisely controlling the directional flow of liquid. The gradually decreasing aperture structure enhances the capillary effect and reduces residual liquid, thereby improving the liquid atomization efficiency. The second through-hole 121 is designed specifically for atomizing gas. By increasing the aperture, the gas flow resistance is reduced, including but not limited to ensuring its rapid and sufficient discharge, and preventing gas from accumulating inside the second substrate 12, which would affect the atomization efficiency of the liquid in the micro heat source 13.

[0048] In another embodiment, the projection of the heat source 13 onto the second substrate 12 at least partially covers the second through hole 121, as shown in Figures 10(a)-10(b). Figure 10(a) is a three-dimensional structural schematic diagram of an exemplary micro heat source component provided in an embodiment of this application, and Figure 10(b) is a top view schematic diagram of an exemplary micro heat source component provided in an embodiment of this application. In this embodiment, the heating area of ​​the heat source 13 is precisely aligned with the position of the second through hole 121. When the heat source 13 is mounted on the second substrate 12, the coverage area of ​​its vertical projection onto the second substrate 12 must overlap with the second through hole 121 to ensure that the heating area directly faces the second through hole 121. Furthermore, the atomized gas generated when the heat source 13 is working can directly enter the second through hole 121 along the shortest path, avoiding being blocked by the non-hole areas of the second substrate 12 (such as the solid part of the second substrate 12).

[0049] This embodiment only requires simple alignment of the opening in the second substrate 12 with the heat source 13, including but not limited to achieving efficient gas extraction, reducing process costs, and avoiding problems such as aging or shortened lifespan caused by abnormal temperature rise of the heat source 13 due to gas-liquid mixing blockage or local thermal resistance.

[0050] In another embodiment, the second through hole 121 is strip-shaped, such as... Figure 11 . Figure 11 This is a schematic diagram of another exemplary micro heat source component provided in an embodiment of this application. Since strip-shaped through-holes can be rapidly formed through processes such as laser cutting, chemical etching, or mechanical stamping, they are particularly suitable for high-precision opening of brittle substrates such as glass. Compared to multi-hole arrays or irregularly shaped holes, the processing error of a single strip-shaped hole is easier to control, reducing defects caused by hole position misalignment or irregular shape. The beneficial effects of this strip-shaped through-hole design include, but are not limited to, improving the production yield of the second through-hole 121, reducing production costs, and rapidly increasing the discharge speed of atomized gas, avoiding gas stagnation.

[0051] In another embodiment, such as Figure 3As shown in Figure 10(a), the heat source 13 is arranged in a mesh pattern to allow for perforation. The heat source 13 includes metal lines 131. The projection of the opening of the first through-hole 111 on the first substrate 11 on the side opposite to the heat source 13 at least partially overlaps with the projection of the metal lines on the first substrate 11. The perforated areas of the metal lines 131 formed by the mesh layout (such as a grid, honeycomb, or cross-linear structure) constitute the heating path of the heat source 13. This design maintains the thermal / electrical conductivity of the metal lines 131 while reducing the material usage and weight of the heat source 13 through perforation, and simultaneously provides a channel for liquid flow.

[0052] As shown in Figures 10(a) and 10(b), in this embodiment, the projection of the first through-hole 111 onto the opening facing the heat source 13 (i.e., the metal line 131 near the heat source 13) must overlap (partially or completely overlap) with the projection of the metal line 131 onto the surface of the first substrate 11. This allows the first through-hole 111 to directly guide the liquid to the heating area of ​​the metal line 131, including but not limited to ensuring that the liquid is in full contact with the heated metal line 131. Direct contact shortens the heat transfer path, reduces thermal resistance, and reduces energy loss. Simultaneously, the perforated mesh arrangement of the metal line 131, including but not limited to, increases the heat dissipation area, ensuring uniform heat distribution, thereby improving the liquid heating efficiency and rapidly heating it into atomized gas.

[0053] In another embodiment, the diameter of the first through-hole 111 on the side opposite the heat source 13 is smaller than the width of the metal line 131. Since the metal line 131 is the main heat-generating area, because the diameter of the first through-hole 111 is smaller than the width of the metal line 131, the liquid can only partially contact the heat-generating area of ​​the metal line 131 through the through-hole, such as the center of the line, rather than covering the entire width of the line. This prevents the liquid from falling through the hollowed-out area on the metal line 131, increasing the contact area between the liquid and the metal line 131, allowing the liquid to rapidly atomize upon contact with the metal line 131, forming an atomized gas. This embodiment, through precise alignment of the first through-hole 111 and the metal line 131 and a specific width design, includes, but is not limited to, improving atomization efficiency and preventing liquid residue from flowing down through the hollowed-out area.

[0054] Figure 12 This is a schematic diagram of another exemplary heat source structure provided in an embodiment of this application, as shown below. Figure 12 As shown, the heat source component 13 includes an integrally formed body portion 130 and a flattening portion 132. The flattening portion 132 has a free end. The body portion 130 includes a metal line 131. The width of the free end of the flattening portion 132 is greater than the width of the metal line 131.

[0055] In this embodiment, the free end of the flattening portion 132 is designed to clamp with the edges of two glass substrates (such as the first substrate 11 and the second substrate 12) during assembly. This design of a wider free end provides a larger contact area with the two substrates, allowing the metal circuitry to be uniformly clamped during assembly. Furthermore, the portion of the free end that extends beyond the metal circuitry 131 serves as a physical limiting structure for the metal circuitry 131, further reducing the probability of displacement or deformation of the metal circuitry 131 under high-temperature conditions.

[0056] In another embodiment, the first substrate 11 and / or the second substrate 12 have a third through hole 16, and the heat source 13 includes an electrode 133. The third through hole 16 is used to expose the electrode 133 to facilitate electrical connection between the electrode 133 and an external circuit. As shown in Figures 10(a)-10(b), this embodiment is illustrated by providing a third through hole 16 on the first substrate 11. As shown in Figures 10(a)-10(b), in this embodiment, when the heat source is assembled, the electrode 133 of the heat source 13 is exposed through the third through hole 16 on the first substrate 11.

[0057] In this embodiment, the electrode 133 is typically located in the edge region of the heat source component 13, such as the non-heat-generating area of ​​the main body, and is designed as a sheet, protrusion, or other structure to ensure stable contact with the external conductor. The design of the third through-hole 16 avoids the location of the metal line 131 of the heat source component 13 as much as possible. In this embodiment, the external conductor can be directly connected to the electrode 133 exposed through the third through-hole 16 by means of bonding, welding, snap-fitting, or spring pressing. This ingenious design structure, which directly exposes the electrode through the third through-hole 16, includes, but is not limited to, eliminating the need for the conductive layer fabrication on the substrate surface, simplifying the process, and reducing manufacturing costs.

[0058] In another embodiment, the third through-hole 16 can also be disposed on the second substrate 12, as shown in Figures 13(a)-13(b). Figure 13(a) is a three-dimensional structural schematic diagram of an exemplary micro heat source component provided in an embodiment of this application, and Figure 13(b) is a top view schematic diagram of an exemplary micro heat source component provided in an embodiment of this application. As shown in Figures 13(a)-13(b), in this embodiment, the third through-hole 16 can also be disposed at the edge of the second substrate 12 according to the usage requirements of the micro heat source component. After assembling the first substrate 11, the second substrate 12, and the heat source component 13, the electrode 133 exposed by the third through-hole 16 on the second substrate 12 is connected to the external circuit to achieve the heating purpose.

[0059] It should be noted that since the electrode 133 consists of two independent regions, two corresponding third through holes 16 need to be set. In this embodiment, it is possible to concentrate the two through holes on the same substrate (such as the first substrate 11 or the second substrate 12), or to support cross-substrate distribution. That is, the third through holes 14 can be flexibly set on the first substrate 11 and the second substrate 12 respectively (not shown in the figure). In this embodiment, the position layout of the third through holes 16 can be flexibly configured according to the specific usage requirements of the micro heat source component, and its specific setting position is not limited.

[0060] Figures 14(a)-14(c) are schematic diagrams of another exemplary micro heat source component provided in an embodiment of this application. Figure 14(a) is a three-dimensional split schematic diagram of an exemplary micro heat source component provided in an embodiment of this application; Figure 14(b) is a top-view three-dimensional schematic diagram of an exemplary micro heat source component provided in an embodiment of this application; and Figure 14(c) is a structural schematic diagram of another exemplary micro heat source component provided in an embodiment of this application. As shown in Figures 14(a)-14(c), the structural feature is that both the first substrate 11 and the heat source component 13 are disposed within the first groove 122 of the second substrate 12. In this embodiment, the first substrate 11 and the heat source component 13 are disposed within the first groove 122 of the second substrate 12, forming an encapsulated structure. Installation is simple; only an adhesive needs to be applied around the first groove 122 of the second substrate 12. This includes, but is not limited to, improving the structural stability of the heat source component assembly, simplifying the processing technology, and effectively preventing direct damage to the heat source component from external mechanical impacts, dust, liquids, or high-temperature environments.

[0061] Figure 15 A schematic diagram of another exemplary micro heat source component structure provided in an embodiment of this application is shown below. Figure 15 As shown, the structure includes a first substrate 11, a first through-hole 111, a second substrate 12, a second through-hole 121, a heat source 13, a first colloid 14, and a second colloid 15. This structure, supported by the first colloid 14 and the second colloid 15, creates two cavity-like spatial structures (first cavity space 123 and second cavity space 113) between the first substrate 11 and the second substrate 12. The thickness of the first colloid 14 is greater than that of the second colloid 15. Thus, the first through-hole 111 does not directly cover the heat source 13, ensuring that the liquid flows smoothly and makes more complete contact with the heat source 13, thereby achieving atomization. The second through-hole 121 on the second substrate 12 also does not obstruct the heat source 13, allowing the atomized gas to pass smoothly; the process is not described in detail here.

[0062] One embodiment of this application also provides an atomizing core, including the micro heat source component structure as described above.

[0063] The atomizing core is the core component of an atomizer, e-cigarette, or other atomizing electronic product. It is mainly responsible for heating and vaporizing liquid medicine, e-liquid, or other liquids that need to be atomized to produce a mist-like gas and achieve the atomization effect.

[0064] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the structure and implementation principle of the micro heat source component described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.

[0065] Figure 16 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application, as shown below. Figure 16 As shown, it includes electronic device 160 and the aforementioned micro heat source component 161.

[0066] In practice, the electronic device 160 includes, but is not limited to, atomizers, humidifiers, temperature controllers, drug delivery systems, smart wearable devices, micro-analytical instruments, beauty devices, de-icers for automobiles or aerospace, exhaust gas treatment equipment for vehicles or equipment, and other related devices, without specific limitations.

[0067] In another embodiment, such as Figure 16 As shown, the electronic device 160 also includes a housing 162, which includes a cavity in which the micro-heat source component 161 is located. In this embodiment, the housing 162 forms a semi-enclosed space, through which liquid flows in through a designated channel for atomization, and then through a designated channel for atomized gas to flow out, preventing the atomized gas from flowing out through other channels.

[0068] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the structure and implementation principle of the micro heat source component described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.

[0069] Figure 17 A flowchart illustrating a method for fabricating a micro heat source component according to an embodiment of this application is provided. The method specifically includes: Step S1710: Provide a first substrate and a second substrate, wherein the first substrate has at least one first through hole and the second substrate has a second through hole.

[0070] In this application, the first substrate and the second substrate can be manufactured using conventionally known materials, such as glass substrates, ceramic substrates, silicon substrates, or polymer substrates. A glass substrate is preferred in this embodiment, but this application is not limited to using a glass substrate. The materials of the first substrate and the second substrate can be the same or different, and their shapes are not limited.

[0071] The first substrate has at least one first through hole, and the second substrate has a second through hole. The first through hole and the second substrate can be glass substrates. The first through hole and the second through hole can be through glass vias (TGV), which are vertical electrical interconnection vias that pass through the glass substrate, allowing liquids and / or gases to flow in or out smoothly.

[0072] In this design, the first through-hole on the first substrate has a smaller diameter than the second through-hole on the second substrate. The first through-hole can be configured such that its diameter gradually decreases along the direction in which the liquid flows into it. The second through-hole can be configured as a strip-shaped structure.

[0073] Step S1720: Provide a heat source component. The heat source component, a first substrate, and a second substrate are stacked and disposed between the first substrate and the second substrate. The heat source component is used to heat the liquid flowing in from the first through hole to make the liquid form atomized gas. The second through hole is used to allow the atomized gas to pass through.

[0074] The heat source component is plate-shaped and has a perforated design to allow the atomized gas to pass through.

[0075] In this embodiment, the second substrate has a first groove on one side relative to the first substrate, the first substrate is disposed in the first groove, and the heat source is disposed between the bottom of the first substrate and the first groove; and / or, the first substrate has a second groove on one side relative to the second substrate.

[0076] In this embodiment, the heat source component can be mesh-like to allow the heat source component to be hollowed out. The heat source component includes metal lines, and the projection of the opening of the first through hole on the side of the heat source component relative to the first substrate at least partially overlaps with the projection of the metal lines on the first substrate.

[0077] In this embodiment, the diameter of the first through hole on the side opposite the heat source can be smaller than the width of the metal line, and / or the projection of the heat source on the second substrate at least partially covers the second through hole.

[0078] In this embodiment, the heat source may include an integrally formed body and a flattened part. The flattened part has a free end, the body includes metal lines, and the width of the free end of the flattened part is greater than the width of the metal lines.

[0079] In this embodiment, the heat source may include an electrode, and a third through hole is provided on the first substrate and / or the second substrate. The third through hole is used to expose the electrode so that the electrode can be electrically connected to an external circuit.

[0080] The heat source component assembly in this embodiment requires two substrates, a first substrate and a second substrate, as support. Liquid flows in through at least one first through hole provided on the first substrate, is heated into atomized gas by the heat source component, and atomized gas flows out through a second through hole provided on the second substrate.

[0081] In one embodiment of this application, a method for stacking heat source components, a first substrate, and a second substrate includes: providing a first carrier plate, a second carrier plate, and a plurality of heat source components; stacking the first carrier plate, the second carrier plate, and the plurality of heat source components, with the plurality of heat source components laid flat between the first carrier plate and the second carrier plate; cutting the stacked first carrier plate and the second carrier plate to form a plurality of micro heat source assemblies, wherein the cut first carrier plate includes a plurality of first substrates, the cut second carrier plate includes a plurality of second substrates, and each micro heat source assembly includes a stacked first substrate, a heat source component, and a second substrate.

[0082] The first carrier plate can be used to cut into multiple first substrates, and the second carrier plate can be used to cut into multiple second substrates.

[0083] The stacked manufacturing method of the heat source component, the first substrate, and the second substrate in this embodiment can achieve efficient integration of miniaturized components through mass production. For example, this embodiment can provide two large substrates (a first carrier plate and a second carrier plate) and multiple pre-prepared heat source components. The heat source components are evenly laid on the surface of the first carrier plate, and then the second carrier plate is covered to form a "carrier plate-heat source component-carrier plate" sandwich structure, ensuring precise alignment of all heat source components with the upper and lower substrates, thereby providing a stable processing foundation for subsequent cutting.

[0084] Then, in this embodiment, the laminated structure can be divided using techniques such as laser cutting or precision stamping. The cutting path runs along a preset array arrangement, dividing the first carrier plate into multiple independent first substrates, the second carrier plate into a corresponding number of second substrates, and the heat source components in the sandwich layer are simultaneously divided into individual components. Each micro heat source component ultimately includes a first substrate, a second substrate, and a heat source component sandwiched in between, forming an independent functional unit.

[0085] In another embodiment, the manufacturing method further includes: applying a first colloid between the first substrate and the second substrate; and / or applying a second colloid between the second substrate and the heat source component. The first and second colloids may be the same or different, and this embodiment does not limit their specific materials or forms. This embodiment can use the first colloid to bond the first substrate and the second substrate, and use the second colloid to bond the second substrate and the heat source component, including but not limited to improving the stability of the heat source component assembly structure.

[0086] Figure 18 This is a schematic diagram illustrating the fabrication process of a micro heat source component according to an embodiment of this application. Figure 18 As shown in (a), the heat source component 13 can adopt any sheet-like hollow structure disclosed in the above embodiments; such as Figure 18As shown in (b) in this embodiment, the second adhesive 15 is applied to the non-hollowed-out position of the heat source 13 by dispensing, such as applying the second adhesive 15 to the edge area.

[0087] like Figure 18 As shown in (c), in this embodiment, the heat source 13 coated with the second colloid 15 can be placed in a suspended manner above the second substrate 12. The second substrate 12 can be a rectangular plate-shaped glass substrate, and the second substrate 12 has an elongated second through hole 121. In this embodiment, by precisely aligning the heat source 13 with the second substrate 12, the dispensing area can be kept away from the second through hole 121, thereby ensuring that the subsequent atomized gas flow path is not obstructed. At the same time, by using the second colloid 15 as a local support point, a gap is formed between the heat source 13 and the second substrate 12, so that the glass of the heat source 13 will not break due to the difference in thermal expansion coefficients with the second substrate 12.

[0088] like Figure 18 As shown in (d) in this embodiment, a first colloid 14 with a specified shape is coated on the second substrate 12 at a position close to and surrounding the second colloid 15, while simultaneously adhering to and covering both sides of the heat source 13, for supporting and bonding the first substrate 11 to be stacked; as Figure 18 As shown in (e), in this embodiment, the first substrate 11 with the first through hole 111 is placed on the heat source 13 and the second colloid, so that a cavity is formed between the first substrate 11 and the heat source 13, so that the liquid flowing in from the first through hole 111 can enter the cavity and uniformly contact the heat source 13 for atomization.

[0089] In another embodiment, adhesive can be applied to the second substrate 12 as a first adhesive first, then the heat source 13 can be bonded, and then a second adhesive can be applied around the first adhesive, and then the first substrate 11 can be stacked.

[0090] The manufacturing method of this embodiment, through the precise coordinated design of aperture and position, includes, but is not limited to, significantly reducing assembly complexity, simplifying production steps, and making it suitable for large-scale mass production.

[0091] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0092] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application can be achieved, and this is not limited herein.

[0093] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0094] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A micro heat source component, characterized in that, The micro heat source component includes: The first substrate has at least one first through hole; The second substrate is stacked with the first substrate, and the second substrate has a second through hole; A heat source is disposed between the first substrate and the second substrate. The heat source is used to heat the liquid flowing in from the first through hole to make the liquid form atomized gas. The second through hole is used to allow the atomized gas to pass through.

2. The micro heat source component according to claim 1, characterized in that, Also includes: The heat source component is arranged in a sheet shape and has a hollowed-out design to allow the atomized gas to pass through.

3. The micro heat source component according to claim 1, wherein, The second substrate has a first groove on one side opposite to the first substrate, the first substrate is disposed within the first groove, and the heat source is disposed between the bottom of the first substrate and the first groove; and / or, A second groove is provided on the side of the first substrate opposite to the second substrate.

4. The micro heat source component according to claim 1, characterized in that, Also includes: A first colloid is attached between the first substrate and the second substrate.

5. The micro heat source component according to claim 1 or 4, characterized in that, Also includes: The second colloid is disposed between the second substrate and the heat source.

6. The micro heat source component according to claim 1, characterized in that, Also includes: Along the direction of liquid inflow from the first through hole, the diameter of the first through hole gradually decreases.

7. The micro heat source component according to claim 1, wherein, The diameter of the second through hole is larger than the diameter of the first through hole.

8. The micro heat source component according to claim 1, wherein, The projection of the heat source on the second substrate at least partially covers the second through hole.

9. The micro heat source component according to claim 1, wherein, The second through hole is strip-shaped.

10. The micro heat source component according to claim 1, wherein, The heat source component is mesh-like to allow it to be hollowed out. The heat source component includes metal lines. The projection of the opening of the first through hole on the first substrate on the side opposite to the heat source component overlaps at least partially with the projection of the metal lines on the first substrate.

11. The micro heat source assembly according to claim 10, wherein, The diameter of the first through hole on the side opposite the heat source component is smaller than the width of the metal line.

12. The micro heat source component according to claim 1, wherein, The heat source component includes an integrally formed body and a flattened part. The flattened part has a free end. The body includes metal lines. The width of the free end of the flattened part is greater than the width of the metal lines.

13. The micro heat source component according to claim 1, wherein, The first substrate and / or the second substrate have a third through hole, and the heat source includes an electrode. The third through hole is used to expose the electrode so that the electrode can be electrically connected to an external circuit.

14. An atomizing core comprising the micro heat source component as described in any one of claims 1-13.

15. An electronic device comprising a micro heat source assembly as described in any one of claims 1-13.

16. The electronic device of claim 12, further comprising a housing including a cavity, wherein the micro-heat source assembly is located within the cavity.

17. A method for manufacturing a micro heat source component, characterized in that, The method includes: A first substrate and a second substrate are provided, wherein the first substrate has at least one first through hole and the second substrate has a second through hole; A heat source is provided, wherein the heat source, the first substrate, and the second substrate are stacked and disposed between the first substrate and the second substrate. The heat source is used to heat liquid flowing in from the first through hole to form atomized gas, and the second through hole is used to allow the atomized gas to pass through.

18. The method according to claim 17, wherein, The method for stacking the heat source, the first substrate, and the second substrate includes: Provides a first carrier plate, a second carrier plate, and a plurality of heat source components. The first carrier plate, the second carrier plate, and a plurality of heat source components are stacked and arranged, with the plurality of heat source components laid flat between the first carrier plate and the second carrier plate; The first and second carrier plates after being cut and stacked are used to form a plurality of the micro heat source components. The cut first carrier plate includes a plurality of first substrates, and the cut second carrier plate includes a plurality of second substrates. Each micro heat source component includes a first substrate, a heat source element and a second substrate stacked together.

19. The method according to claim 17, characterized in that, Also includes: The first colloid is coated between the first substrate and the second substrate.

20. The method according to claim 17 or 19, characterized in that, Also includes: The second colloid is coated between the second substrate and the heat source.

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