Space load detector support structure and mounting method considering vibration isolation and heat dissipation
By introducing heat sinks, flexible heat-conducting cables, and heat-conducting plates into the detector support structure, and combining them with copper and hard aluminum alloy materials, the problems of vibration isolation and heat dissipation of the detector under vibration and temperature changes are solved, achieving both stability and heat dissipation of the detector and improving its reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-05
- Publication Date
- 2026-04-17
AI Technical Summary
Existing detector support structures cannot simultaneously solve the problems of vibration isolation and heat dissipation for space payload detectors. Especially under compact conditions, the vibration isolators prevent heat from being dissipated in time, resulting in excessively high detector temperatures.
The structure employs a heat sink, flexible heat-conducting cable, heat-conducting plate, and support frame. Heat is transferred to the heat sink through the heat-conducting plate for heat dissipation, and vibration is isolated by the flexible heat-conducting cable. Combining the excellent thermal conductivity of copper material with the rigidity of 2A12 hard aluminum alloy, it achieves both vibration isolation and heat dissipation.
This achieves stability and heat dissipation of the detector under vibration and temperature change conditions, avoids detector failure caused by vibration and temperature changes, and improves the reliability and service life of the detector.
Smart Images

Figure CN121262808B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a detector support structure, specifically to a space load detector support structure and installation method that combines vibration isolation and heat dissipation. Background Technology
[0002] Space remote sensing technology has undergone years of development and plays a significant role in Earth science research and resource and environmental monitoring. Due to the stringent requirements of space missions on the energy efficiency and resource utilization of space payloads, the structural design of space payloads is trending towards compactness and lightweight design. To meet the detection requirements of optical systems, small detectors are widely used. The support structure of these detectors needs to consider both structural stability to avoid the impact of vibrations and other factors, and thermal design to prevent displacement caused by temperature gradients.
[0003] Space payloads are subjected to strong vibrations, typically reaching 5g to 10g (g being the acceleration due to gravity), in ground environments, especially during launch. These strong vibrations can cause displacement or damage to internal components of the detector. For example, vibrations can lead to solder joint detachment or loosening of wiring on the detector circuit board and pins, resulting in short circuits, signal transmission interruptions, and affecting normal operation and data transmission. During on-orbit operation, the thermoelectric cooler (TEC) deeply cools the CCD to avoid the impact of dark current noise on imaging quality. However, the hot end of the TEC generates a large amount of heat, causing temperature changes in the detector. More importantly, the materials of the detector circuit board and the supporting structure differ, resulting in different coefficients of linear expansion, specific heat capacity, and other performance parameters. These parameters change non-linearly with temperature, leading to different deformations of the circuit board and supporting structure during temperature changes. Under large temperature differences, this can easily cause positional shifts in the detector or even cause it to fail.
[0004] Currently, domestic and international measures to limit the impact of vibration on detectors mainly involve using vibration isolators or vibration isolation pads. Appropriate vibration isolators, such as metal-rubber isolators and air spring isolators, are installed between the detector and the supporting structure to isolate the transmission of vibration. However, in situations with limited space, it is impossible to place large structures like vibration isolators on the detector assembly. Vibration isolation pads are generally used, but these pads can prevent the detector from dissipating heat effectively, leading to excessively high detector temperatures. Therefore, it is impossible to achieve both vibration isolation and heat dissipation simultaneously.
[0005] The design of detector support structures under compact conditions requires consideration of both vibration isolation and heat dissipation. However, the traditional detector support structure design approach described above cannot simultaneously address the vibration isolation and heat dissipation issues of space payload detectors. Summary of the Invention
[0006] To address the technical problem that existing detector support structures cannot simultaneously solve the vibration isolation and heat dissipation issues of space payload detectors, this invention provides a space payload detector support structure and installation method that takes into account both vibration isolation and heat dissipation.
[0007] To achieve the above objectives and complete the above inventive concept, the present invention adopts the following technical solution:
[0008] A space load detector support structure that combines vibration isolation and heat dissipation is unique in that:
[0009] Includes heat sink, flexible heat-conducting cable, heat-conducting plate and bracket;
[0010] The heat sink is connected to the temperature control surface of the external space load;
[0011] One end of the flexible heat-conducting cable is connected to the heat sink, and the other end is connected to the heat-conducting plate;
[0012] The heat-conducting plate is provided with a glue injection groove that matches the detector pin, a temperature probe mounting groove that matches the temperature probe integrated on the temperature probe mounting hole on the detector circuit board, and a fixing hole that matches the pre-fixing hole on the detector circuit board and the detector body.
[0013] The mounting holes are used to fix the detector body and detector circuit board to the heat-conducting plate respectively by external fasteners when installing the detector body;
[0014] The detector circuit board and detector body to be installed are respectively set on the upper and lower end faces of the heat-conducting plate, and the detector pins pass through the glue injection groove and are connected to the corresponding holes on the detector circuit board. The temperature probe on the detector circuit board is placed in the temperature probe mounting slot. Both the glue injection groove and the temperature probe mounting slot are filled with glue.
[0015] The upper end of the bracket is connected to the detector circuit board, and the lower end is connected to the external optical platform.
[0016] Furthermore, the stent includes an upper stent, a trimming pad, and a lower stent;
[0017] The upper end face of the upper bracket is provided with a placement slot that is adapted to the detector body, and the detector body to be installed is placed in the placement slot.
[0018] The upper bracket, trimming pad, and lower bracket are all provided with bracket mounting holes that are compatible with the circuit board mounting holes on the detector circuit board. The upper end face of the upper bracket abuts against the lower end face of the detector circuit board, and the lower end face abuts against the lower bracket through the trimming pad. An external bracket fastener passes through the circuit board mounting holes, the bracket mounting holes on the upper bracket and the trimming pad, and connects to the bracket mounting holes on the lower bracket, thereby connecting the detector circuit board to the upper bracket, the trimming pad, and the lower bracket.
[0019] The lower end face of the lower bracket is bonded to the external optical platform.
[0020] Furthermore, there are two glue injection channels, which are respectively set on both sides of the middle of the heat-conducting plate along the width direction, and the length direction of both glue injection channels is set along the length direction of the heat-conducting plate.
[0021] There are two sets of fixing holes; each set has at least two fixing holes, and the fixing holes in the same set are evenly distributed along the length of the heat-conducting plate; the two sets of fixing holes are located on the outer side of the two glue injection grooves along the width of the heat-conducting plate.
[0022] Sealing rings are provided on the upper end face of the heat-conducting plate around the two glue injection grooves.
[0023] A flexible heat-conducting cable is connected to one end of the heat-conducting plate along its length, and a temperature probe mounting slot is located on the upper side of the other end.
[0024] Furthermore, at least two heat sink mounting holes are provided on the end face of the heat sink. One end face of the heat sink is connected to the temperature control surface of the external space load through the heat sink mounting holes and external mounting components; the other end face of the heat sink is the heat dissipation surface of the heat sink.
[0025] One end of the flexible heat-conducting cable is provided with a heat dissipation end interface, and the other end is provided with a heat-conducting end interface; one end of the flexible heat-conducting cable is connected to the heat sink through the heat dissipation end interface;
[0026] At least two mounting step holes are provided on one end face of the heat-conducting plate; the heat-conducting plate is connected to the heat-conducting end interface of the flexible heat-conducting cable through the mounting step holes.
[0027] Furthermore, a first through groove and a second through groove are provided on both long sides of the heat-conducting plate. The first through groove and the second through groove are respectively located at both ends of the glue injection channel along the length direction of the heat-conducting plate. A first gap is provided between one end of the first through groove and the two ends of the glue injection channel, and a second gap is provided between the other end of the first through groove and one end of the heat-conducting plate. The other end of the second through groove penetrates the other end of the heat-conducting plate.
[0028] The portion of the upper end face of the upper bracket outside the placement slot passes through the first through slot and the second through slot and connects to the detector circuit board.
[0029] Furthermore, the heat sink and the heat conduction plate are both made of copper;
[0030] The flexible heat-conducting cable is made of braided copper wire;
[0031] The upper support, trimming pad, and lower support are all integrally machined from 2A12 hard aluminum alloy.
[0032] Furthermore, the upper surface of the detector body to be installed, which contacts the heat-conducting plate, is coated with vacuum thermal grease.
[0033] Meanwhile, the present invention also provides a method for installing a space load detector that combines vibration isolation and heat dissipation. Based on the aforementioned support structure for the space load detector that combines vibration isolation and heat dissipation, its special feature is that it includes the following steps:
[0034] Step 1: Pre-solder the temperature probe to the temperature probe mounting hole on the detector circuit board;
[0035] Step 2: Place the detector circuit board and the detector body on the upper and lower sides of the heat-conducting plate, respectively;
[0036] Step 3: Align the detector pins with the corresponding holes on the detector circuit board and insert them into the corresponding holes on the detector circuit board. Use external fasteners, pre-fixed holes, and fixing holes to pre-fix the detector circuit board, heat conduction plate, and detector body.
[0037] Step 4: Fill the glue channel and temperature probe mounting slot of the heat guide plate with glue, and the thickness of the glue layer in the glue channel shall not be less than 2 / 3 of the depth of the glue channel.
[0038] Step 5: During the colloid fixation process, remove the external fixing parts, let it stand for a set time, and then fix the detector circuit board, heat conduction plate and detector body a second time.
[0039] Step 6: Before the adhesive is fixed, solder the detector pins into the corresponding holes in the detector circuit board, and let it stand on a horizontal platform to allow the adhesive layer to cure, so that the detector circuit board, heat-conducting plate and detector body form a whole detector assembly for subsequent assembly and adjustment.
[0040] Step 7: Connect the detector assembly to the upper end face of the bracket;
[0041] Step 8: Connect one end of the flexible heat-conducting cable to the heat sink and the other end to the heat-conducting plate;
[0042] Step 9: Connect the heat sink to the temperature control surface of the external space load, and connect the lower end of the bracket to the external optical platform to complete the installation.
[0043] Furthermore, in step 2, vacuum thermal grease is first applied to the upper surface of the detector body, and then the upper surface of the detector body is connected to the lower surface of the heat-conducting plate.
[0044] In step 4, the colloid is GD414 silicone rubber.
[0045] The beneficial effects of this invention are:
[0046] 1. This invention incorporates a heat-conducting plate between the detector body and the detector circuit board. This plate allows heat to be transferred to a heat sink via a flexible heat-conducting cable. Heat dissipation is achieved through a combination of the heat sink's surface and the temperature control surface of the external space load. Simultaneously, the presence of the heat-conducting plate necessitates an increase in the length of the detector pins. A glue-filled groove is used to fix the pins in place, improving their stability and preventing breakage due to strong external vibrations during rocket launch. The flexible heat-conducting cable effectively isolates vibrations generated by thin-walled components such as the outer shell during operation or launch, enabling the support structure to simultaneously provide vibration isolation and heat dissipation.
[0047] 2. The heat-conducting plate, flexible heat-conducting cable, and heat sink of the present invention are all made of copper, which has excellent thermal conductivity. The flexible heat-conducting cable allows for more flexible structural design and wider applicability. The heat dissipation capacity can be adjusted by changing parameters such as the length and cross-sectional area of the flexible heat-conducting cable and the area of the heat sink.
[0048] 3. The upper support, trimming pad, lower support and other structural components of the present invention are all made of 2A12 hard aluminum alloy, which has good rigidity and toughness. At the same time, by performing secondary processing on the trimming pad, the amount of defocusing that may occur during the assembly or testing of the detector can be compensated. Attached Figure Description
[0049] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;
[0050] Figure 2 This is a schematic diagram of the structure of the heat-conducting plate, the detector body, and the detector circuit board in an embodiment of the present invention;
[0051] Figure 3 This is a schematic diagram of the structure of the heat sink, flexible heat-conducting cable, and heat-conducting plate in an embodiment of the present invention;
[0052] Figure 4 This is a schematic diagram of the heat-conducting plate in an embodiment of the present invention;
[0053] Figure 5 for Figure 4 A bottom view;
[0054] Figure 6 This is a schematic diagram of the existing detector body.
[0055] Figure 7 This is a schematic diagram of the structure of an existing detector circuit board.
[0056] The attached figures are labeled as follows:
[0057] 01-Detector pin, 02-Detector circuit board, 03-Detector body, 04-Pre-fixing hole, 05-Socket, 06-Temperature probe mounting hole, 07-Circuit board mounting hole;
[0058] 1-Heat sink, 11-Heat sink mounting holes, 12-Heat sink heat dissipation surface;
[0059] 2-Flexible heat-conducting cable, 21-Heat dissipation end interface, 22-Heat-conducting end interface;
[0060] 3-Heat-conducting plate, 31-Glue injection groove, 32-Temperature probe mounting groove, 33-Fixing hole, 34-Sealing ring, 35-First through groove, 36-Second through groove, 37-Mounting step hole;
[0061] 4-Support, 41-Upper support, 42-Trim pad, 43-Lower support. Detailed Implementation
[0062] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0063] This invention provides a space load detector support structure that combines vibration isolation and heat dissipation, such as... Figure 1 As shown, the detector support structure includes a heat sink 1, a flexible heat-conducting cable 2, a heat-conducting plate 3, and a bracket 4.
[0064] See Figure 3 The heat sink 1 is made of T1 copper and is in the shape of a thin plate. One end face of the heat sink 1 is connected to the temperature control surface of the external space load. The outer contour of the heat sink 1 can be designed according to the structure of the temperature control surface to maximize the contact area. The other end face of the heat sink 1 is the heat dissipation surface 12.
[0065] Specifically, to facilitate the installation of the heat sink 1, at least two heat sink mounting holes 11 are provided on the end face of the heat sink 1. In this embodiment, six heat sink mounting holes 11 are provided as an example. In other embodiments of the present invention, the number of heat sink mounting holes 11 can be specifically set according to the installation stability requirements. The heat sink 1 is connected to the temperature control surface of the external space load through the heat sink mounting holes 11 and external mounting parts (bolts).
[0066] See Figure 3 The flexible heat-conducting cable 2 is made of braided copper wire; a heat dissipation end interface 21 is provided at one end of the flexible heat-conducting cable 2, and a heat-conducting end interface 22 is provided at the other end; one end of the flexible heat-conducting cable 2 is connected to the heat sink 1 through external bolts and the heat dissipation end interface 21 to ensure full contact between the contact surfaces.
[0067] See Figures 3-5 The heat-conducting plate 3 is made of T1 copper material.
[0068] The heat-conducting plate 3 is provided with at least two mounting step holes 37 for connecting to the heat-conducting end interface 22 on the flexible heat-conducting cable 2, a temperature probe mounting groove 32 for mounting a temperature probe, a glue injection groove 31 adapted to the detector pin 01, a temperature probe mounting groove 32 adapted to the temperature probe integrated at the temperature probe mounting hole 06 on the detector circuit board 02, and a fixing hole 33 adapted to the pre-fixing hole 04 on the detector circuit board 02 and the detector body 03.
[0069] In this embodiment, two mounting step holes 37 are used as examples. The two mounting step holes 37 are located on both sides of one end of the heat-conducting plate 3 along its width direction. The heat-conducting plate 3 is connected to the mounting step holes 37 and the heat-conducting end interface 22 through an external heat-conducting cable mounting component, thereby connecting and assembling the heat-conducting plate 3 with the flexible heat-conducting cable 2.
[0070] Based on the arrangement of the detector pins 01 on the detector body 03, two glue injection slots 31 are provided. The two glue injection slots 31 are respectively located on both sides of the middle of the heat-conducting plate 3 along the width direction, and the length direction of the two glue injection slots 31 is also along the length direction of the heat-conducting plate 3. At the same time, a sealing ring 34 is provided on the upper end surface of the heat-conducting plate 3, around the two glue injection slots 31. The function of the sealing ring 34 is to form a sealed space at the position of the glue injection slot 31 by applying pressure to the detector circuit board 02 and deforming the sealing ring 34, so as to prevent the glue from evaporating and causing pollution in the space environment.
[0071] The fixing holes 33 are used to fix the detector body 03 and the detector circuit board 02 to the heat-conducting plate 3 respectively by external fasteners when installing the detector body 03, thereby ensuring that the contact surface between the detector body 03 and the heat-conducting plate 3 is sealed and leak-proof when applying glue to the glue injection groove 31. There are two sets of fixing holes 33; each set has at least two fixing holes 33. In this embodiment, two fixing holes 33 are used as an example. The fixing holes 33 in the same set are evenly distributed along the length direction of the heat-conducting plate 3, and the interval between the two fixing holes 33 in the same set is less than the length of the glue injection groove 31. The two sets of fixing holes 33 are located on the outer side of the two glue injection grooves 31 along the width direction of the heat-conducting plate 3.
[0072] To facilitate the assembly of the detector circuit board 02 with the bracket 4, a first through groove 35 and a second through groove 36 are provided on both long sides of the heat-conducting plate 3. The first through groove 35 and the second through groove 36 are located on both sides of the glue injection groove 31 along the length of the heat-conducting plate 3, and a first gap is provided between one end of the first through groove 35 and the two ends of the glue injection groove 31, and a second gap is provided between the other end of the first through groove 35 and one end of the heat-conducting plate 3. The other end of the second through groove 36 penetrates through the other end of the heat-conducting plate 3. The structure of the detector circuit board 02 and the detector body 03 is shown in the figure. Figure 6 and Figure 7 The detector circuit board 02 and detector body 03 to be installed are respectively disposed on the upper and lower end faces of the heat-conducting plate 3. The upper end face of the detector body 03 to be installed, which contacts the heat-conducting plate 3, is coated with vacuum thermal grease, which increases the contact area while improving the heat transfer coefficient. The detector pin 01 passes through the glue injection groove 31 and connects to the corresponding insertion hole 05 on the detector circuit board 02. The temperature probe on the detector circuit board 02 is installed in the temperature probe mounting groove 32. Both the glue injection groove 31 and the temperature probe mounting groove 32 are filled with glue, which can flexibly fix the detector pin 01 and the temperature probe. In this embodiment, the glue is specifically GD414 silicone rubber.
[0073] See Figure 1 The support 4 includes an upper support 41, a trimming pad 42, and a lower support 43; the upper support 41, the trimming pad 42, and the lower support 43 are all integrally formed from 2A12 hard aluminum alloy.
[0074] The upper end face of the upper bracket 41 is provided with a placement groove adapted to the detector body 03, and the detector body 03 to be installed is placed in the placement groove. The portion of the upper end face of the upper bracket 41 outside the placement groove passes through the first through groove 35 and the second through groove 36 and abuts against the detector circuit board 02. The upper bracket 41, the trimming pad 42, and the lower bracket 43 are all provided with bracket mounting holes adapted to the circuit board mounting holes 07. The lower end face of the upper bracket 41 abuts against the lower bracket 43 through the trimming pad 42, and is connected to the lower bracket 43 through the circuit board mounting holes 07, the bracket mounting holes on the upper bracket 41 and the trimming pad 42 by an external bracket fixing member passing through the bracket mounting holes on the circuit board mounting holes 07, the upper bracket 41 and the trimming pad 42, and the bracket mounting holes on the lower bracket 43. The three together form a structure as shown in the figure. Figure 2 The detector assembly shown.
[0075] When installing the aforementioned space load detector support structure that combines vibration isolation and heat dissipation, the following steps are specifically adopted:
[0076] Step 1: Pre-solder the temperature probe to the preset position on the detector circuit board 02.
[0077] Step 2: First, apply vacuum thermal grease to the upper surface of the detector body 03 to increase the heat transfer coefficient and the contact area. Then, place the detector circuit board 02 and the detector body 03 on the upper and lower sides of the heat-conducting plate 3 respectively.
[0078] Step 3: Align the detector pin 01 with the corresponding socket 05 on the detector circuit board 02 and insert it into the corresponding socket 05 on the detector circuit board 02. Use external fasteners, pre-fixing holes 04 and fixing holes 33 to pre-fix the detector circuit board 02, heat conduction plate 3 and detector body 03. Pre-fixing can pressurize the contact surface between the heat conduction plate 3 and the detector body 03. The deformation of the sealing ring 34 forms a sealing space at the location of the glue injection groove 31, ensuring that the contact surface between the detector body 03 and the heat conduction plate 3 is sealed and does not leak glue.
[0079] Step 4: Use a syringe to inject adhesive into the glue injection groove 31 of the heat-conducting plate 3 and the temperature probe mounting hole 06, and the thickness of the adhesive layer in the glue injection groove 31 shall not be less than 2 / 3 of the depth of the glue injection groove 31.
[0080] Step 5: During the colloid fixation process, remove the external fixing parts, let it stand for a set time, and then fix the detector circuit board 02, heat conduction plate 3 and detector body 03 a second time.
[0081] Step 6: Before the colloid is fixed, solder the detector pin 01 into the corresponding socket 05 of the detector circuit board 02. After soldering, cut off the excessively long detector pin 01 and let it stand on a horizontal platform to wait for the colloid to cure (48 hours in this embodiment). This allows the detector circuit board 02, the heat-conducting plate 3, and the detector body 03 to form a whole detector assembly for subsequent assembly and adjustment.
[0082] Step 7: Connect the detector assembly to the upper end face of bracket 4.
[0083] Step 8: Connect one end of the flexible heat-conducting cable 2 to the heat sink 1 and the other end to the heat-conducting plate 3.
[0084] Step 9: Connect the heat sink 1 to the temperature control surface of the external space load, connect the lower end face of the bracket 4 to the external optical platform, and then trim the trimming pad as needed to realize the assembly and adjustment of the detector assembly and complete the installation.
[0085] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A space load detector support structure that combines vibration isolation and heat dissipation, characterized in that: It includes a heat sink (1), a flexible heat-conducting cable (2), a heat-conducting plate (3), and a bracket (4); The heat sink (1) is connected to the temperature control surface of the external space load; One end of the flexible heat-conducting cable (2) is connected to the heat sink (1), and the other end is connected to the heat-conducting plate (3); The heat-conducting plate (3) is provided with a glue injection groove (31) adapted to the detector pin (01), a temperature probe mounting groove (32) adapted to the temperature probe integrated in the temperature probe mounting hole (06) on the detector circuit board (02), and a fixing hole (33) adapted to the pre-fixing hole (04) on the detector circuit board (02) and the detector body (03); The fixing hole (33) is used to fix the detector body (03) and the detector circuit board (02) to the heat-conducting plate (3) respectively by external fasteners when installing the detector body (03); The detector circuit board (02) and detector body (03) to be installed are respectively set on the upper and lower end faces of the heat-conducting plate (3), and the detector pin (01) passes through the glue injection groove (31) and connects to the corresponding socket (05) on the detector circuit board (02). The temperature probe on the detector circuit board (02) is placed in the temperature probe mounting slot (32); both the glue injection groove (31) and the temperature probe mounting slot (32) are filled with glue. The upper end face of the bracket (4) is connected to the detector circuit board (02), and the lower end face is connected to the external optical platform.
2. The space load detector support structure that combines vibration isolation and heat dissipation according to claim 1, characterized in that: The support (4) includes an upper support (41), a trimming pad (42), and a lower support (43); The upper end face of the upper bracket (41) is provided with a placement groove that is adapted to the detector body (03), and the detector body (03) to be installed is placed in the placement groove. The upper bracket (41), trimming pad (42) and lower bracket (43) are all provided with bracket mounting holes that are compatible with the circuit board mounting holes (07) on the detector circuit board (02). The upper end face of the upper bracket (41) abuts against the lower end face of the detector circuit board (02), and the lower end face abuts against the lower bracket (43) through the trimming pad (42). An external bracket fixing member passes through the circuit board mounting hole (07), the bracket mounting holes on the upper bracket (41) and the trimming pad (42), and connects to the bracket mounting hole on the lower bracket (43), thereby connecting the detector circuit board (02) with the upper bracket (41), the trimming pad (42) and the lower bracket (43). The lower end face of the lower bracket (43) is bonded to the external optical platform.
3. The space load detector support structure that combines vibration isolation and heat dissipation according to claim 2, characterized in that: The heat-conducting plate (3) is provided with a first through groove (35) and a second through groove (36) on both long sides. The first through groove (35) and the second through groove (36) are respectively located at both ends of the glue injection channel (31) along the length direction of the heat-conducting plate (3). A first gap is provided between one end of the first through groove (35) and the two ends of the glue injection channel (31). A second gap is provided between the other end of the first through groove (35) and one end of the heat-conducting plate (3). The other end of the second through groove (36) penetrates the other end of the heat-conducting plate (3). The portion of the upper end face of the upper bracket (41) outside the placement slot passes through the first through slot (35) and the second through slot (36) and connects to the detector circuit board (02).
4. The space load detector support structure that combines vibration isolation and heat dissipation according to any one of claims 1-3, characterized in that: There are two glue injection channels (31), which are respectively arranged on both sides of the middle part of the heat-conducting plate (3) along the width direction, and the length direction of the two glue injection channels (31) is arranged along the length direction of the heat-conducting plate (3). The fixing holes (33) are in two sets; each set has at least two fixing holes (33), and the fixing holes (33) in the same set are evenly distributed along the length of the heat-conducting plate (3); the two sets of fixing holes (33) are located on the outside of the two glue injection grooves (31) along the width of the heat-conducting plate (3); The upper end face of the heat-conducting plate (3) is provided with sealing rings (34) on both sides of the two glue injection grooves (31); The flexible heat-conducting cable (2) is connected to one end of the heat-conducting plate (3) along its length, and the temperature probe mounting groove (32) is located on the upper surface of the other end.
5. The space load detector support structure that combines vibration isolation and heat dissipation according to claim 4, characterized in that: At least two heat sink mounting holes (11) are provided on the end face of the heat sink (1). One end face of the heat sink (1) is connected to the temperature control surface of the external space load through the heat sink mounting holes (11) and external mounting parts. The other end face of the heat sink (1) is the heat sink heat dissipation surface (12). One end of the flexible heat-conducting cable (2) is provided with a heat dissipation end interface (21), and the other end is provided with a heat-conducting end interface (22); one end of the flexible heat-conducting cable (2) is connected to the heat sink (1) through the heat dissipation end interface (21); At least two mounting step holes (37) are provided on one end face of the heat-conducting plate (3); the heat-conducting plate (3) is connected to the heat-conducting end interface (22) of the flexible heat-conducting cable (2) through the mounting step holes (37).
6. The space load detector support structure that combines vibration isolation and heat dissipation according to claim 2, characterized in that: The heat sink (1) and the heat conduction plate (3) are made of copper. The flexible heat-conducting cable (2) is made of braided copper wire; The upper support (41), trimming pad (42) and lower support (43) are all integrally formed from 2A12 hard aluminum alloy.
7. The space load detector support structure that combines vibration isolation and heat dissipation according to claim 1, characterized in that: The upper surface of the detector body (03) to be installed, which is in contact with the heat-conducting plate (3), is coated with vacuum thermal grease.
8. A method for installing a space load detector that combines vibration isolation and heat dissipation, based on the space load detector support structure that combines vibration isolation and heat dissipation as described in any one of claims 1-7, characterized in that, Includes the following steps: Step 1: Pre-solder the temperature probe to the temperature probe mounting hole (06) on the detector circuit board (02); Step 2: Place the detector circuit board (02) and the detector body (03) on the upper and lower sides of the heat-conducting plate (3), respectively; Step 3: Align the detector pin (01) with the corresponding socket (05) on the detector circuit board (02) and insert it into the corresponding socket (05) on the detector circuit board (02). Pre-fix the detector circuit board (02), heat conduction plate (3) and detector body (03) through external fasteners, pre-fixing holes (04) and fixing holes (33). Step 4: Apply adhesive to the glue injection groove (31) and temperature probe mounting groove (32) of the heat-conducting plate (3), and the thickness of the adhesive layer in the glue injection groove (31) shall not be less than 2 / 3 of the depth of the glue injection groove (31); Step 5: During the curing process of the colloid, remove the external fixing parts, let it stand for a set time, and then fix the detector circuit board (02), heat conduction plate (3) and detector body (03) a second time. Step 6: Before the adhesive is fixed, solder the detector pin (01) into the corresponding socket (05) of the detector circuit board (02), and let it stand on the horizontal platform to wait for the adhesive layer to cure, so that the detector circuit board (02), the heat conduction plate (3) and the detector body (03) form a whole detector assembly for subsequent assembly and adjustment. Step 7: Connect the detector assembly to the upper end face of the bracket (4); Step 8: Connect one end of the flexible heat-conducting cable (2) to the heat sink (1) and the other end to the heat-conducting plate (3); Step 9: Connect the heat sink (1) to the temperature control surface of the external space load, and connect the lower end of the bracket (4) to the external optical platform to complete the installation.
9. The installation method for a space load detector that combines vibration isolation and heat dissipation according to claim 8, characterized in that: In step 2, vacuum thermal grease is first applied to the upper surface of the detector body (03), and then the upper surface of the detector body (03) is connected to the lower surface of the heat-conducting plate (3). In step 4, the colloid is GD414 silicone rubber.
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