Sound box

Abstract

The invention provides a sound box, and relates to the technical field of electroacoustics. The sound box provided by the invention comprises a box body, a loudspeaker, a heating element and a superstructure, a first cavity is formed in the box body, and the loudspeaker and the heating element are installed in the first cavity; the superstructure is connected with the box body, a second cavity is formed in the superstructure, the second cavity is communicated with the first cavity, the superstructure is provided with at least one acoustic channel communicated with the exterior of the sound box and the second cavity, the acoustic channel is of a bent structure, the superstructure is made of a heat conduction material, and the heating element is located between the loudspeaker and the superstructure. The invention provides a sound box which can enhance the bass effect and improve the heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of electroacoustic technology, and more particularly to a speaker. Background Technology

[0002] Currently, as speakers become smaller and thinner, some problems are becoming increasingly prominent. On the one hand, miniaturization increases the stiffness of the speaker's vibration system, and the space reserved in the rear cavity is very limited. The smaller rear cavity increases the speaker's resonant frequency. Both of these factors reduce the speaker's low-frequency sensitivity, resulting in a lack of low-frequency components in the sound quality, making it difficult to meet people's high demands for bass. On the other hand, speaker miniaturization makes it difficult to dissipate internal heat, especially in high-power speakers. Their power amplifiers, digital signal processors, and batteries generate a lot of heat, and poor heat dissipation can lead to performance degradation, shortened lifespan, and even safety hazards. Current technologies such as bass reflex ports and passive radiators to address insufficient bass, as well as heat sinks and fans to address heat dissipation, only provide single functions and cannot simultaneously solve both acoustic and heat dissipation problems. Summary of the Invention

[0003] To address at least one of the problems mentioned in the background art, this application provides a speaker that can enhance bass performance and improve heat dissipation.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] This application provides a speaker, including a cabinet, a speaker, a heating element, and a superstructure; a first cavity is formed inside the cabinet, and the speaker and the heating element are installed in the first cavity;

[0006] The superstructure is connected to the enclosure, and a second cavity is formed inside the superstructure. The second cavity is connected to the first cavity. At least one acoustic channel is provided on the superstructure, which is a curved structure, connecting the outside of the speaker and the second cavity. The superstructure is made of thermally conductive material, and the heating element is located between the speaker and the superstructure.

[0007] As an optional implementation, a heat-conducting component is also included, which is disposed between the heating element and the superstructure to transfer the heat emitted by the heating element to the superstructure.

[0008] As an optional implementation, the heat-conducting component includes a heat-conducting boss and a heat-conducting medium. The first side of the heat-conducting boss is disposed on the superstructure, and the heat-conducting medium is disposed on the second side of the heat-conducting boss. The heating element and the heat-conducting medium abut against each other so that the heat emitted by the heating element can be transferred to the superstructure through the heat-conducting medium and the heat-conducting boss.

[0009] As an optional implementation, a heat sink is also included, which has multiple heat dissipation channels. The heat sink is arranged around the outside of the superstructure, or the heat sink is arranged at the end of the superstructure away from the housing.

[0010] As an optional implementation, the inner wall of the heat dissipation channel has a curved structure.

[0011] As an alternative implementation, the superstructure includes a top plate, a bottom plate, and a connecting plate connecting the top plate and the bottom plate. An acoustic channel is opened in the connecting plate, the top plate is connected to the housing, and the first surface of the heat-conducting boss is disposed on the top plate.

[0012] As an optional implementation, there are multiple acoustic channels, which are zigzag-shaped channels;

[0013] Alternatively, the acoustic channel may be a single channel, which may be in the shape of an Archimedean spiral.

[0014] As an optional implementation, the thermally conductive medium is thermally conductive grease, thermally conductive silicone, or thermally conductive double-sided tape.

[0015] As an alternative implementation, the box and superstructure can be cylindrical, cuboid, cube, or regular hexagonal.

[0016] As an alternative implementation, the speaker includes a superstructure with the back of the speaker facing the superstructure;

[0017] Alternatively, a superstructure can be provided at each of the opposite ends of the enclosure, with the front of the speaker facing one of the superstructures and the back of the speaker facing the other superstructure.

[0018] The speaker provided in this application includes a cabinet, a loudspeaker, a heating element, and a superstructure; a first cavity is formed inside the cabinet, and the loudspeaker and the heating element are installed in the first cavity; the superstructure is connected to the cabinet, and a second cavity is formed inside the superstructure, which is connected to the first cavity; at least one acoustic channel is provided on the superstructure, which is a curved structure, and the superstructure is made of a thermally conductive material; the heating element is located between the loudspeaker and the superstructure.

[0019] The speaker provided in this application first propagates the sound emitted by the loudspeaker in a first cavity inside the enclosure. Since the superstructure is connected to the enclosure and its internal second cavity communicates with the first cavity, the sound further enters the second cavity and then exits the speaker through an acoustic channel on the superstructure. The curved acoustic channel alters the phase and path of the sound during propagation, lowering the resonant frequency of the internal cavity and allowing the loudspeaker to couple and resonate with it. This effectively improves the speaker's low-frequency sensitivity and significantly enhances the bass effect. Furthermore, when the speaker is operating, the heating element installed in the first cavity generates heat. Since the heating element is located between the loudspeaker and the superstructure, the heat is transferred to the superstructure. The superstructure, made of thermally conductive material, quickly absorbs the heat from the heating element due to its excellent thermal conductivity. The heat is then exchanged with the outside air through the outer surface of the superstructure, dissipating the heat into the surrounding environment, thus effectively removing heat from the speaker's interior. Simultaneously, the loudspeaker's sound emission excites airflow, and some of the hot air can also be dissipated to the outside of the speaker through the acoustic channel. This dual heat dissipation method effectively improves the speaker's heat dissipation performance. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of a first overall structure of a speaker provided in an embodiment of this application;

[0022] Figure 2 for Figure 1 Exploded view;

[0023] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0024] Figure 4 for Figure 1 The main view;

[0025] Figure 5 for Figure 4 Sectional view at point AA;

[0026] Figure 6 for Figure 4 Sectional view at point BB;

[0027] Figure 7 A schematic diagram showing that the heat sink in the speaker provided in the embodiment of this application is disposed at the end of the superstructure away from the cabinet;

[0028] Figure 8 A first schematic diagram showing that the inner wall of the heat dissipation channel in the speaker provided in this application has a curved structure;

[0029] Figure 9 A second schematic diagram showing that the inner wall of the heat dissipation channel in the speaker provided in this application has a curved structure;

[0030] Figure 10 A schematic diagram showing that the acoustic channel in the speaker provided in the embodiments of this application is in the shape of an Archimedean spiral;

[0031] Figure 11 A schematic diagram showing that the cabinet and superstructure of the speaker provided in the embodiments of this application are cube-shaped;

[0032] Figure 12 A schematic diagram showing that the cabinet and superstructure of the speaker provided in the embodiments of this application are in the shape of regular hexagonal prisms;

[0033] Figure 13 This is a schematic diagram showing that a superstructure is provided at each of the two opposite ends of the speaker enclosure provided in the embodiments of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100-speaker;

[0036] 110 - Enclosure;

[0037] 111 - First cavity;

[0038] 120-speaker;

[0039] 130 - Heating element;

[0040] 140-Superstructure;

[0041] 141 - Second cavity;

[0042] 142 - Acoustic Channel;

[0043] 143-Top plate;

[0044] 144 - Base Plate;

[0045] 145 - Connecting plate;

[0046] 150 - Thermal conductive component;

[0047] 151 - Boss;

[0048] 152 - Thermal conductive medium;

[0049] 160-Heat dissipation plate;

[0050] 161 - Heat dissipation channel. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] In this application, the terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” “outer,” “vertical,” “horizontal,” “lateral,” and “longitudinal” indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0053] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0054] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0055] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0056] Miniaturization of speaker enclosures increases the rigidity of the speaker's vibration system, but the limited space in the rear cavity raises the enclosure's resonant frequency. Both of these factors reduce the enclosure's low-frequency sensitivity. Furthermore, it makes it difficult to dissipate heat within the enclosure. Current technologies for addressing insufficient bass, such as bass reflex ports and passive radiators, as well as heat sinks and fans for heat dissipation, only offer single-function solutions and cannot simultaneously address both acoustic and thermal issues.

[0057] In view of this, this application provides a speaker enclosure comprising a cabinet, a speaker, a heating element, and a superstructure. A first cavity is formed inside the cabinet, and the speaker and heating element are installed in the first cavity. The superstructure is connected to the cabinet, and a second cavity is formed inside the superstructure, which communicates with the first cavity. At least one acoustic channel is provided on the superstructure, connecting the outside of the speaker and the second cavity. The acoustic channel is a curved structure. The superstructure is made of a thermally conductive material, and the heating element is located between the speaker and the superstructure. When the speaker is working, the sound emitted by the speaker propagates from the first cavity to the second cavity, and then exits the speaker through the acoustic channel on the superstructure. The curved acoustic channel alters the phase and path of the sound during propagation, reducing the resonant frequency of the internal cavity of the speaker. This allows the speaker to couple and resonate with the internal cavity, effectively improving the low-frequency sensitivity of the speaker and significantly enhancing the bass effect. Meanwhile, the heat generated by the heating element can be transferred to the superstructure, and then dissipated to the outside of the speaker. In addition, when the speaker emits sound, it excites the air to flow, and some of the hot air can also be dissipated to the outside of the speaker through the acoustic channel. In this way, the heat dissipation performance of the speaker is effectively improved through this dual heat dissipation method.

[0058] Figure 1 This is a schematic diagram of a first overall structure of a speaker provided in an embodiment of this application; Figure 2 for Figure 1 Exploded view; Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 for Figure 1 The main view; Figure 5 for Figure 4 Sectional view at point AA; Figure 6 for Figure 4 Sectional view at point BB; Figure 7 A schematic diagram showing that the heat sink in the speaker provided in the embodiment of this application is disposed at the end of the superstructure away from the cabinet; Figure 8 A first schematic diagram showing that the inner wall of the heat dissipation channel in the speaker provided in this application has a curved structure; Figure 9 A second schematic diagram showing that the inner wall of the heat dissipation channel in the speaker provided in this application has a curved structure; Figure 10 A schematic diagram showing that the acoustic channel in the speaker provided in the embodiments of this application is in the shape of an Archimedean spiral; Figure 11 A schematic diagram showing that the cabinet and superstructure of the speaker provided in the embodiments of this application are cube-shaped; Figure 12 A schematic diagram showing that the cabinet and superstructure of the speaker provided in the embodiments of this application are in the shape of regular hexagonal prisms; Figure 13 This is a schematic diagram showing that a superstructure is provided at each of the two opposite ends of the speaker enclosure provided in the embodiments of this application.

[0059] You can refer to this. Figures 1 to 13 This application provides a speaker 100, including a housing 110, a speaker 120, a heating element 130, and a superstructure 140. A first cavity 111 is formed inside the housing 110, and the speaker 120 and the heating element 130 are installed in the first cavity 111. The superstructure 140 is connected to the housing 110, and a second cavity 141 is formed inside the superstructure 140. The second cavity 141 is connected to the first cavity 111. At least one acoustic channel 142 is provided on the superstructure 140, which connects the outside of the speaker 100 and the second cavity 141. The acoustic channel 142 is a curved structure. The superstructure 140 is made of a thermally conductive material. The heating element 130 is located between the speaker 120 and the superstructure 140.

[0060] When the speaker 100 provided in this embodiment is working, the sound emitted by the speaker 120 first propagates in the first cavity 111 inside the enclosure 110. Since the superstructure 140 is connected to the enclosure 110 and its internal second cavity 141 communicates with the first cavity 111, the sound further enters the second cavity 141 and then exits the speaker 100 through the acoustic channel 142 on the superstructure 140. The curved acoustic channel 142 alters the phase and path of the sound during propagation, reducing the resonant frequency of the internal cavity of the speaker 100. This allows the speaker 120 to couple and resonate with the internal cavity of the speaker 100, effectively improving the low-frequency sensitivity of the speaker 100 and significantly enhancing the bass effect. In addition, when the speaker 100 is working, the heating element 130 installed in the first cavity 111 generates heat. Since the heating element 130 is located between the speaker 120 and the superstructure 140, the heat is transferred to the superstructure 140. The superstructure 140 is made of thermally conductive material, and with its good thermal conductivity, it can quickly absorb the heat from the heating element 130. The heat is exchanged with the outside air through the outer surface of the superstructure 140, and the heat is dissipated to the surrounding environment, thereby effectively dissipating the heat inside the speaker 100. At the same time, when the speaker 120 emits sound, it will excite the air to flow, and some of the hot air flow can also be dissipated to the outside of the speaker 100 through the acoustic channel 142. In this way, the heat dissipation performance of the speaker 100 is effectively improved through this dual heat dissipation method.

[0061] The above embodiment also includes a heat-conducting component 150, which is disposed between the heating element 130 and the superstructure 140 to transfer the heat dissipated by the heating element 130 to the superstructure 140. The heat-conducting component 150, positioned between the speaker 120 and the superstructure 140, can quickly transfer the heat generated by the heating element 130 to the superstructure 140, improving heat conduction efficiency and increasing the contact area, allowing more heat to be conducted simultaneously. In conjunction with the heat exchange on the outer surface of the superstructure 140 and the airflow cooling of the acoustic channel 142, a highly efficient heat dissipation cycle is formed, effectively solving the problem of heat accumulation inside the speaker 100 and ensuring the stability and reliability of the speaker 100's operation.

[0062] In the above embodiment, the heat-conducting component 150 includes a heat-conducting boss 151 and a heat-conducting medium 152. The first side of the heat-conducting boss 151 is disposed on the superstructure 140, and the heat-conducting medium 152 is disposed on the second side of the heat-conducting boss 151. The heating element 130 and the heat-conducting medium 152 abut against each other, so that the heat emitted by the heating element 130 can be transferred to the superstructure 140 through the heat-conducting medium 152 and the heat-conducting boss 151. The heat-conducting medium 152, in close contact with the heating element 130, can quickly adhere to the surface of the heating element 130 due to its excellent thermal conductivity, efficiently absorbing the heat generated by the heating element 130 during operation and transferring the heat to the connected heat-conducting boss 151, which then relays the heat to the superstructure 140. This step-by-step heat transfer method ensures the efficiency and stability of heat conduction.

[0063] The above embodiments also include a heat sink 160, which has multiple heat dissipation channels 161. The heat sink 160 is arranged around the outside of the superstructure 140, or the heat sink 160 is arranged at the end of the superstructure 140 away from the enclosure 110. It is understood that the heat sink has a large surface area, providing more space for heat exchange. When heat is transferred from the heat-generating components (such as the heat-generating element 130) inside the speaker 100 to the heat sink 160 through the heat-conducting component 150 and the superstructure 140, the heat sink 160 can utilize its large surface area to exchange heat with the outside air, dissipating the heat and preventing heat accumulation inside the speaker 100, thus ensuring the stable operation of all components of the speaker 100. When the heat sink 160 is arranged around the outside of the superstructure 140, it can maximize contact with the superstructure 140, forming a tight heat transfer path. The heat absorbed by the superstructure 140 can be quickly conducted to the heat sink 160, and the design of the heat sink 160 surrounding the superstructure 140 greatly increases the contact area with the air. Air can flow freely around the heat sink 160, carrying away heat from the heat sink 160 in a timely manner, achieving efficient convection cooling, and ensuring that the superstructure 140 can continuously and effectively absorb and dissipate heat from inside the speaker 100.

[0064] When the heat sink 160 is located at the end of the superstructure 140 away from the enclosure 110, the heat sink 160 can be directly exposed to the external environment, reducing the obstruction of heat transfer. This is conducive to the heat sink 160 quickly dissipating heat into the surrounding air, avoiding poor heat dissipation due to the enclosure 110 blocking or obstructing it. At the same time, it can also prevent the enclosure 110 from absorbing the heat dissipated by the heat sink 160 and heating up to a certain extent, further improving the overall heat dissipation effect.

[0065] In the above embodiment, the inner wall of the heat dissipation channel 161 is a curved surface structure. It can be understood that curved surfaces have more complex and varied geometric shapes, which directly increases the contact area between the heat sink 160 and the air. When air flows through the heat dissipation channel 161, every part of the curved inner wall can fully contact the air. A larger contact area means that the air can absorb more heat from the heat sink 160, thus carrying away the heat more efficiently and significantly improving the heat dissipation effect. Specifically, this curved surface structure can be a unidirectional curved surface or a multi-directional curved wavy surface.

[0066] In the above embodiments, the superstructure 140 includes a top plate 143, a bottom plate 144, and a connecting plate 145 connecting the top plate 143 and the bottom plate 144. An acoustic channel 142 is formed on the connecting plate 145. The top plate 143 is connected to the housing 110, and the first surface of the heat-conducting boss 151 is disposed on the top plate 143. It can be understood that the superstructure 140, through the combination of the top plate 143, the bottom plate 144, and the connecting plate 145, forms a stable frame structure, providing a reliable carrier for both acoustic and heat-conducting functions, and achieving precise connection with the housing 110 and the heat-conducting component 150. Specifically, the top plate 143 is directly connected to the enclosure 110. On the one hand, it ensures a stable assembly between the superstructure 140 and the enclosure 110, allowing the second cavity 141 inside the superstructure 140 to smoothly communicate with the first cavity 111 of the enclosure 110. This provides a continuous and sealed propagation path for sound waves to enter the second cavity 141 from the first cavity 111 and then exit through the acoustic channel 142 of the connecting plate 145, ensuring the stable realization of bass enhancement. On the other hand, the top plate 143 serves as the mounting base for the heat-conducting boss 151, fixing the first surface of the heat-conducting boss 151 onto it. This allows the heat-conducting component 150 to form a tight heat transfer connection with the superstructure 140 through the top plate 143, allowing the heat from the heating element 130 to be transferred through the heat transfer mechanism. After the heat-conducting medium 152 and the heat-conducting protrusion 151 are transferred to the top plate 143, they can quickly diffuse to the entire superstructure 140 (including the bottom plate 144 and the connecting plate 145), and then dissipate through the outer surface of the superstructure 140 or the matching heat sink 160, ensuring the integrity and efficiency of the heat conduction path. The connecting plate 145, as the carrier for opening the acoustic channel 142, is designed to support the top plate 143 and the bottom plate 144, maintaining the overall shape of the superstructure 140. It can also adjust the phase and path of the sound waves through the curved layout of the acoustic channel 142 (in conjunction with the previous design), further assisting in bass enhancement. This allows the superstructure 140 to achieve synergy in both acoustic conduction and heat transfer, while also ensuring the stability of the structural support.

[0067] In the above embodiments, the acoustic channel 142 has multiple channels, and the acoustic channel 142 is a zigzag channel; or, the acoustic channel 142 has a single channel, and the acoustic channel 142 is an Archimedean spiral. When the acoustic channel 142 is set as multiple zigzag channels, on the one hand, the zigzag bending structure can significantly extend the sound wave propagation path within the limited space of the connecting plate 145, which provides sufficient distance for sound wave phase adjustment, and can more accurately offset the problem of high resonance frequency caused by the small volume cavity of the speaker 100, so that the low frequency sound wave vibration is more complete; on the other hand, the parallel design of multiple channels can make each channel smaller, which is suitable for the miniaturization requirements of the speaker, and the layout of multiple channels can also adapt to the structural strength requirements of different areas of the connecting plate 145, taking into account both acoustic performance and structural stability.

[0068] When the acoustic channel 142 is designed as an Archimedean spiral, an extremely long continuous propagation path can be constructed in a very small planar space, and the path has a smooth curve transition, which can reduce the risk of airflow noise. At the same time, the spiral-shaped channel can guide the sound waves to diffuse evenly along the spiral trajectory, avoiding the local accumulation of sound waves in the channel, so that the low-frequency vibrations act more evenly on the internal space of the speaker 100. It is especially suitable for speaker 100 designs that require high space utilization and pursue the softness of low frequencies. It can optimize the resonance frequency through the long path and reduce sound wave interference with the smooth curve, thereby enhancing the richness of the bass.

[0069] In the above embodiments, the thermally conductive medium 152 is thermally conductive grease, thermally conductive silicone, or thermally conductive double-sided tape. Thermally conductive grease is a paste-like fluid with high fluidity, allowing for seamless filling of the contact surface through application. It is particularly suitable for scenarios requiring extremely high thermal conductivity and perfect fit, and can adaptively adjust to the shape of the contact surface to maximize the thermal contact area. Thermally conductive silicone is an elastic solid (or semi-solid) that combines thermal conductivity with some cushioning. It not only fills gaps but also absorbs slight displacements caused by vibrations between the heating element 130 and the thermally conductive protrusion 151 during speaker 100 operation, preventing component wear caused by rigid contact. It also possesses a certain degree of insulation to prevent short-circuit risks. Thermally conductive double-sided tape adds an adhesive fixing function on top of thermal conductivity, firmly fixing the heating element 130 and the thermally conductive protrusion 151 without additional fasteners. This simplifies the assembly process while still ensuring stable heat transfer, making it suitable for scenarios with high requirements for assembly efficiency and structural compactness. The selection of three thermal conductive media 152 not only ensures consistent heat transfer efficiency, but also provides a flexible adaptation solution for different structural designs and assembly requirements, further enhancing the reliability and practicality of the thermal conductive component 150.

[0070] In the above embodiments, the enclosure 110 and the superstructure 140 are cylindrical, cuboid, cube, or regular hexagonal in shape. The cylindrical, cuboid, cube, or regular hexagonal shape of the enclosure 110 and the superstructure 140 not only meets the space requirements of different application scenarios of the speaker 100, but also enhances the overall performance in terms of structure, acoustics, and heat dissipation.

[0071] In the above embodiments, the speaker 100 includes a superstructure 140, with the back of the speaker 120 facing the superstructure 140; or, a superstructure 140 is provided at each of the opposite ends of the enclosure 110, with the front of the speaker 120 facing one of the superstructures 140 and the back of the speaker 120 facing the other superstructure 140. When the speaker 100 has only one superstructure 140 and the back of the speaker 120 faces the superstructure 140, the sound generated at the back of the speaker 120 can be processed by the superstructure 140. This not only reduces the interference of the sound waves from the back of the speaker 120 to the front, but also makes full use of the sound waves from the back of the speaker 120 to effectively enhance the bass effect, making the sound emitted by the speaker 100 more powerful and richer.

[0072] The enclosure 110 has a superstructure 140 at each end, and the speaker 120 faces one superstructure 140 with its front facing one side and the other side facing the other. In this case, the sound emitted from both the front and back of the speaker 120 can be processed by the superstructure 140. By properly setting the resonant frequencies of the front and rear internal cavities of the speaker 120, the bass effect can be further improved, achieving deeper low-frequency extension. Furthermore, when the speaker enclosure 100 includes only one superstructure 140, this superstructure can also be located in the front cavity of the speaker enclosure 100, with the front of the speaker 120 facing this superstructure 140.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various implementations of this application.

Claims

1. A sound box, characterized in that, The sound box comprises a box, a loudspeaker, a heating element and a superstructure; the box is internally formed with a first cavity, and the loudspeaker and the heating element are installed in the first cavity; The superstructure is connected with the box, and the superstructure is internally formed with a second cavity, the second cavity is communicated with the first cavity, at least one acoustic channel is formed on the superstructure and communicated between the outside of the sound box and the second cavity, the acoustic channel is a curved structure, the superstructure is made of a heat-conducting material, and the heating element is located between the loudspeaker and the superstructure.

2. The sound box of claim 1, wherein, A heat-conducting assembly is further arranged between the heating element and the superstructure to transfer the heat emitted by the heating element to the superstructure through the heat-conducting assembly.

3. The sound box of claim 2, wherein, The heat-conducting assembly comprises a heat-conducting boss and a heat-conducting medium, the first surface of the heat-conducting boss is arranged on the superstructure, the heat-conducting medium is arranged on the second surface of the heat-conducting boss, and the heating element and the heat-conducting medium are in abutment to transfer the heat emitted by the heating element to the superstructure through the heat-conducting medium and the heat-conducting boss.

4. The sound box of claim 3, wherein, A heat-dissipating plate is further arranged, the heat-dissipating plate is provided with a plurality of heat-dissipating channels, and the heat-dissipating plate is arranged around the outside of the superstructure, or the heat-dissipating plate is arranged at the end of the superstructure away from the box.

5. The sound box of claim 4, wherein, The inner wall of the heat-dissipating channel is a curved surface structure.

6. The sound box according to any one of claims 3-5, characterized in that, The superstructure comprises a top plate, a bottom plate and a connecting plate connected between the top plate and the bottom plate, the acoustic channel is formed in the connecting plate, the top plate is connected with the box, and the first surface of the heat-conducting boss is arranged on the top plate.

7. The sound box according to any one of claims 1-5, characterized in that, The acoustic channel has a plurality of "Z" shaped channels. Alternatively, the acoustic channel has one acoustic channel, and the acoustic channel is in the shape of an Archimedes spiral.

8. The sound box according to any one of claims 3-5, characterized in that, The heat-conducting medium is a heat-conducting silicone grease, a heat-conducting silica gel or a heat-conducting double-sided adhesive tape.

9. The sound box according to any one of claims 1-5, characterized in that, The shapes of the box and the superstructure are a cylinder, a cuboid, a square or a regular hexagonal prism.

10. The sound box according to any one of claims 1-5, characterized in that, The sound box comprises one superstructure, and the back surface of the loudspeaker faces the superstructure. Alternatively, the box is provided with one superstructure at each of the opposite ends, the front surface of the loudspeaker faces one of the superstructures, and the back surface of the loudspeaker faces the other superstructure.

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