Wafer transfer robot machining method

Abstract

The application provides a processing method of a wafer conveying mechanical arm, which comprises the following steps: placing the mechanical arm after mechanical processing in a mold, covering a cover plate and fastening, and obtaining the wafer conveying mechanical arm after annealing treatment. The processing method can reduce the flatness of the mechanical arm to below the flatness required by wafer manufacturing, and is simple to operate and suitable for industrial production.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment processing, and relates to a processing method of a robotic arm, particularly a processing method of a robotic arm for wafer handling. Background Technology

[0002] In the semiconductor chip manufacturing process, an A5083 robotic arm is used to handle wafers. The wafers require very high flatness, which places extremely high demands on the robotic arm itself. If the flatness of the robotic arm exceeds a tolerance of 0.05mm, the wafer will be scrapped. Current machining methods cannot guarantee a flatness of less than 0.05mm; they can only achieve around 0.10mm. After subsequent polishing, the flatness of the robotic arm can even reach over 0.30mm.

[0003] CN107470184A discloses a method, apparatus, and polishing equipment for controlling the flatness of a polishing process. The method includes the following steps: applying corresponding polishing pressures to multiple pressure zones of a wafer being processed by the polishing equipment for polishing; obtaining the polishing thickness and polishing time of each pressure zone; calculating the actual removal rate of each pressure zone based on its polishing thickness and polishing time; calculating the removal rate drift of each pressure zone based on its actual removal rate and corresponding reference removal rate; and adjusting the landing point of the polishing slurry based on the removal rate drift of each pressure zone.

[0004] CN210092055U discloses a wafer support platform, including a base plate. A negative pressure groove is provided on the base plate, and a large number of top pillars are evenly distributed on the bottom surface of the negative pressure groove. The top surfaces of all the top pillars are flush and on the same plane, thus forming a support surface for the wafer. Multiple negative pressure holes penetrating downwards through the base plate are formed on the bottom surface of the negative pressure groove. While this device can mitigate the impact of flatness during wafer processing, it cannot ignore the influence of the flatness of other processing equipment on the wafer. Summary of the Invention

[0005] To address the technical problems existing in the prior art, the present invention provides a processing method for a robotic arm for wafer handling. The processing method can reduce the flatness of the robotic arm to below the flatness required for wafer manufacturing, and is simple to operate and suitable for industrial production.

[0006] To achieve the above-mentioned technical effects, the present invention adopts the following technical solution:

[0007] This invention provides a processing method for a robotic arm used for wafer handling, the processing method comprising:

[0008] The machined robotic arm is placed in a mold, covered and secured, and then annealed to obtain the wafer handling robotic arm.

[0009] As a preferred embodiment of the present invention, the mold includes a groove, the outline of which and the internal structure of the groove completely match the shape and surface structure of the robotic arm.

[0010] As a preferred embodiment of the present invention, the mold includes at least 8 fixing holes, which are used to fix the mold and the cover plate.

[0011] The number of fixing holes can be 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19 or 20, etc., but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0012] As a preferred embodiment of the present invention, the upper part of the mold includes at least two fixing holes, the middle part includes at least three fixing holes, and the lower part includes at least three fixing holes.

[0013] The number of fixing holes at the top of the mold can be 3, 4, 5 or 6, the number of fixing holes in the middle can be 2, 3, 4, 5 or 6, and the number of fixing holes at the bottom can be 3, 4, 5 or 6, but it is not limited to the listed values. Other unlisted values ​​within each range are also applicable.

[0014] As a preferred embodiment of the present invention, the fixing hole is located at the edge of the mold and the edge of the groove.

[0015] As a preferred embodiment of the present invention, the cover plate has the same size and shape as the mold, and the fixing hole positions of the cover plate correspond one-to-one with the fixing hole positions of the mold.

[0016] As a preferred technical solution of the present invention, the torque for tightening the screw in the fastening process is 40 to 60 N·m, such as 42 N·m, 45 N·m, 48 N·m, 50 N·m, 52 N·m, 55 N·m or 58 N·m, but it is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0017] As a preferred embodiment of the present invention, the annealing temperature is 180–220°C, and the time is 1–3 hours. The temperature can be 185°C, 190°C, 195°C, 200°C, 205°C, 210°C, or 215°C, etc., and the time can be 1.2 hours, 1.5 hours, 1.8 hours, 2.0 hours, 2.2 hours, 2.5 hours, or 2.8 hours, etc., but is not limited to the listed values; other unlisted values ​​within the above ranges are also applicable.

[0018] In this invention, limiting the annealing temperature not only ensures the flatness of the robotic arm after processing, but also avoids adverse effects on the mechanical properties of the robotic arm.

[0019] As a preferred embodiment of the present invention, the annealing is performed under vacuum conditions, wherein the vacuum degree is ≤3.0×10⁻⁶. -2 MPa, such as 0.5 × 10 -2 MPa, 1.0×10 -2 MPa, 1.5×10 -2 MPa, 2.0×10 -2 MPa or 2.5×10 -2 MPa, etc., but not limited to the listed values; other unlisted values ​​within this range also apply.

[0020] In this invention, the flatness of the robotic arm is effectively reduced through mold fastening and annealing. The number and distribution of the fixing holes in the mold affect the fastening effect, and thus the flatness. Similarly, the choice of annealing conditions also affects the flatness. Therefore, the design of the mold and the reasonable selection of annealing conditions in this invention improve the processing effect on the flatness of the robotic arm.

[0021] As a preferred embodiment of the present invention, the processing method of the robotic arm for wafer handling includes:

[0022] The machined robotic arm is placed in the mold, the cover plate is closed and tightened, and the tightening torque of the screws is 40-60 N·m, the temperature is 180-220℃, and the vacuum degree is ≤3.0×10⁻⁶. -2 After annealing at MPa for 1-3 hours, the wafer handling robotic arm is obtained.

[0023] The contour and internal structure of the groove perfectly match the shape and surface structure of the robotic arm; the mold includes at least 8 fixing holes for fixing the mold and the cover plate, and the fixing holes are located at the edge of the mold and the edge of the groove; the upper part of the mold includes at least 2 fixing holes, the middle part includes at least 3 fixing holes, and the lower part includes at least 3 fixing holes; the size and shape of the cover plate are the same as those of the mold, and the positions of the fixing holes of the cover plate correspond one-to-one with the positions of the fixing holes of the mold.

[0024] Compared with the prior art, the present invention has at least the following beneficial effects:

[0025] This invention provides a processing method for a robotic arm used for wafer handling. The processing method can reduce the flatness of the robotic arm after machining to about 0.03 mm, and is simple to operate and suitable for industrial production. Attached Figure Description

[0026] Figure 1 A schematic diagram of the structure of the processing and unloading arm in a specific embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the mold used in the specific embodiments of this invention.

[0028] The present invention will now be described in further detail. However, the examples described below are merely simplified examples of the present invention and do not represent or limit the scope of protection of the present invention. The scope of protection of the present invention is determined by the claims. Detailed Implementation

[0029] To better illustrate the present invention and facilitate understanding of its technical solutions, typical but non-limiting embodiments of the present invention are as follows:

[0030] Example 1

[0031] This embodiment provides a processing method for a robotic arm used for wafer handling, the processing method including:

[0032] The mechanical arm (e.g.) after machining Figure 1 (As shown) is placed in a mold, the mold structure is as follows Figure 2 As shown, cover the plate and tighten it. The screws are tightened to a torque of 40 N·m, at 180°C and a vacuum degree of 3.0 × 10⁻⁶. -2 After annealing at MPa for 3 hours, the wafer handling robotic arm is obtained.

[0033] The contour and internal structure of the groove perfectly match the shape and surface structure of the robotic arm; the mold includes 8 fixing holes for fixing the mold and the cover plate, and the fixing holes are located at the edge of the mold and the edge of the groove; the upper part of the mold includes 2 fixing holes, the middle part includes 3 fixing holes, and the lower part includes 3 fixing holes; the size and shape of the cover plate are the same as those of the mold, and the positions of the fixing holes of the cover plate correspond one-to-one with the positions of the fixing holes of the mold.

[0034] Example 2

[0035] This embodiment provides a processing method for a robotic arm used for wafer handling, the processing method including:

[0036] The mechanical arm (e.g.) after machining Figure 1 (As shown) is placed in a mold, the mold structure is as follows Figure 2 As shown, cover the plate and tighten it. The screws are tightened to a torque of 60 N·m at 220°C and a vacuum degree of 1.0 × 10⁻⁶. -2 After annealing at MPa for 1 hour, the robotic arm for wafer handling is obtained;

[0037] The contour and internal structure of the groove perfectly match the shape and surface structure of the robotic arm; the mold includes 8 fixing holes for fixing the mold and the cover plate, and the fixing holes are located at the edge of the mold and the edge of the groove; the upper part of the mold includes 2 fixing holes, the middle part includes 3 fixing holes, and the lower part includes 3 fixing holes; the size and shape of the cover plate are the same as those of the mold, and the positions of the fixing holes of the cover plate correspond one-to-one with the positions of the fixing holes of the mold.

[0038] Example 3

[0039] This embodiment provides a processing method for a robotic arm used for wafer handling, the processing method including:

[0040] The mechanical arm (e.g.) after machining Figure 1 (As shown) is placed in a mold, the mold structure is as follows Figure 2 As shown, cover the plate and tighten it. The screws are tightened to a torque of 50 N·m at 200°C and a vacuum degree of 2.0 × 10⁻⁶. -2 After annealing at MPa for 2 hours, the wafer handling robotic arm is obtained.

[0041] The contour and internal structure of the groove perfectly match the shape and surface structure of the robotic arm; the mold includes 8 fixing holes for fixing the mold and the cover plate, and the fixing holes are located at the edge of the mold and the edge of the groove; the upper part of the mold includes 2 fixing holes, the middle part includes 3 fixing holes, and the lower part includes 3 fixing holes; the size and shape of the cover plate are the same as those of the mold, and the positions of the fixing holes of the cover plate correspond one-to-one with the positions of the fixing holes of the mold.

[0042] Example 4

[0043] This embodiment provides a processing method for a robotic arm used for wafer handling, the processing method including:

[0044] The mechanical arm (e.g.) after machining Figure 1 (As shown) Place it in the mold, cover it with the cover plate and tighten it. The tightening torque of the screws is 50 N·m, 200℃ and vacuum degree 2.0 × 10⁻⁶. -2 After annealing at MPa for 2 hours, the wafer handling robotic arm is obtained.

[0045] The contour and internal structure of the groove perfectly match the shape and surface structure of the robotic arm; the mold includes 10 fixing holes for fixing the mold and the cover plate, and the fixing holes are located at the edge of the mold and the edge of the groove; the upper part of the mold includes 3 fixing holes, the middle part includes 3 fixing holes, and the lower part includes 4 fixing holes; the size and shape of the cover plate are the same as those of the mold, and the positions of the fixing holes of the cover plate correspond one-to-one with the positions of the fixing holes of the mold.

[0046] Example 5

[0047] This embodiment provides a processing method for a robotic arm used for wafer handling, the processing method including:

[0048] The mechanical arm (e.g.) after machining Figure 1 (As shown) Place it in the mold, cover it with the cover plate and tighten it. The tightening torque of the screws is 50 N·m, 200℃ and vacuum degree 2.0 × 10⁻⁶. -2 After annealing at MPa for 2 hours, the wafer handling robotic arm is obtained.

[0049] The contour and internal structure of the groove perfectly match the shape and surface structure of the robotic arm; the mold includes 12 fixing holes for fixing the mold and the cover plate, and the fixing holes are located at the edge of the mold and the edge of the groove; the upper part of the mold includes 3 fixing holes, the middle part includes 5 fixing holes, and the lower part includes 4 fixing holes; the size and shape of the cover plate are the same as those of the mold, and the positions of the fixing holes of the cover plate correspond one-to-one with the positions of the fixing holes of the mold.

[0050] Comparative Example 1

[0051] Except for the mold, which includes 6 fixing holes for fixing the mold and the cover plate, and the fixing holes are located at the edge of the mold and the edge of the groove; and the mold has 2 fixing holes at the top, 2 fixing holes in the middle, and 2 fixing holes at the bottom, all other conditions in this comparative example are the same as in Example 3.

[0052] Comparative Example 2

[0053] Except for the fact that the annealing is performed directly by the robotic arm (without being placed in the mold), the conditions in this comparative example are the same as those in Example 3.

[0054] Comparative Example 3

[0055] Except for the annealing being carried out under normal pressure, the conditions in this comparative example are the same as those in Example 3.

[0056] Comparative Example 4

[0057] Except for the annealing temperature of 150°C, the conditions in this comparative example are the same as those in Example 3.

[0058] Comparative Example 5

[0059] Except for the annealing temperature of 250°C, the conditions in this comparative example are the same as those in Example 3.

[0060] In embodiments 1-5 and comparative examples 1-5 of the present invention, the fastening components are hexagonal head screws, hexagonal nuts, flat washers, and spring washers.

[0061] The flatness of the robotic arms processed in Examples 1-5 and Comparative Examples 1-5 was tested using a flatness tester, and the results are shown in Table 1.

[0062] Table 1

[0063]

[0064]

[0065] The test results in Table 1 show that the flatness of the robotic arms processed by the methods provided in Examples 1-5 of this invention is approximately 0.03 mm. Comparative Example 1 reduced the number of fixing holes, resulting in a better fastening effect, and the flatness after processing was slightly higher than that of Example 3. Comparative Example 2 did not use a mold, resulting in the flatness of the robotic arm after processing being almost the same as before processing. Comparative Example 3 underwent annealing at normal pressure, and the flatness after processing was slightly higher than that of Example 3; while Comparative Examples 4 and 5 lowered and raised the annealing temperature respectively. Lowering the annealing temperature to a limited range resulted in a slight increase in flatness compared to Example 3. While raising the annealing temperature had little effect on flatness, it may have reduced the mechanical strength of the robotic arm.

[0066] The applicant declares that the detailed structural features of the present invention are illustrated through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must rely on the above detailed structural features to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions for the components selected in the present invention, additions of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

[0067] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0068] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not describe the various possible combinations separately.

[0069] Furthermore, various different embodiments of the present invention can be combined in any way, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed by the present invention.

Claims

1. A processing method for a robotic arm used for wafer handling, characterized in that, The processing method includes: The machined robotic arm is placed in a mold, covered and secured with a cover plate, and then annealed to obtain the wafer handling robotic arm.

2. The processing method according to claim 1, characterized in that, The mold includes a groove, the outline of which and the internal structure perfectly match the shape and surface structure of the robotic arm.

3. The processing method according to claim 1 or 2, characterized in that, The mold includes at least 8 fixing holes for fixing the mold and the cover plate.

4. The processing method according to claim 3, characterized in that, The upper part of the mold includes at least two fixing holes, the middle part includes at least three fixing holes, and the lower part includes at least three fixing holes.

5. The processing method according to claim 3, characterized in that, The fixing hole is located at the edge of the mold and the edge of the groove.

6. The processing method according to any one of claims 1-5, characterized in that, The cover plate has the same size and shape as the mold, and the fixing holes of the cover plate correspond one-to-one with the fixing holes of the mold.

7. The processing method according to any one of claims 1-6, characterized in that, The torque for tightening the screws in the fastening process is 40–60 N·m.

8. The processing method according to any one of claims 1-7, characterized in that, The annealing temperature is 180–220°C, and the time is 1–3 hours.

9. The processing method according to any one of claims 1-8, characterized in that, The annealing is performed under vacuum conditions, wherein the vacuum degree is ≤3.0×10⁻⁶. -2 MPa.

10. The processing method according to any one of claims 1-9, characterized in that, The processing method includes: The machined robotic arm is placed in the mold, the cover plate is closed and tightened, and the tightening torque of the screws is 40-60 N·m, the temperature is 180-220℃, and the vacuum degree is ≤3.0×10⁻⁶. -2 After annealing at MPa for 1-3 hours, the wafer handling robotic arm is obtained. The contour and internal structure of the groove perfectly match the shape and surface structure of the robotic arm; the mold includes at least 8 fixing holes for fixing the mold and the cover plate, and the fixing holes are located at the edge of the mold and the edge of the groove; the upper part of the mold includes at least 2 fixing holes, the middle part includes at least 3 fixing holes, and the lower part includes at least 3 fixing holes; the size and shape of the cover plate are the same as those of the mold, and the positions of the fixing holes of the cover plate correspond one-to-one with the positions of the fixing holes of the mold.

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