MEMS array health management method and related device

Abstract

The invention provides a health management method of an MEMS (Micro Electro Mechanical System) array and a related device, and belongs to the field of micro electro mechanical sensor digital signal processing. The method comprises the following steps: constructing a mutual support degree matrix of a plurality of chips; calculating the support degree of each chip in the MEMS array based on the mutual support degree matrix of the plurality of chips; performing normalization processing on the support degree of each chip in the MEMS array to obtain the support degree of each chip in the MEMS array after normalization processing; based on the normalized support degree of each chip in the MEMS array, determining a threshold value indicating whether the state of each chip in the MEMS array is healthy or not; and performing health management on the MEMS array according to the size relationship between the normalized support degree of each chip in the MEMS array and a threshold value indicating whether the state of each chip in the MEMS array is healthy or not, thereby obtaining a health management result of the MEMS array. According to the invention, the problem of low reliability of a low-cost MEMS array is solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of digital signal processing of micro-electro-mechanical sensor, and particularly relates to a health management method of MEMS array and related device. BACKGROUND

[0002] As a core component of missile weapons, the inertial measurement unit (IMU) has a decisive influence on the navigation and guidance accuracy. At present, the high price cost and huge space volume of the "two light" (laser and optical fiber) IMU have become the bottleneck of the innovative development of large quantities of low-cost, miniaturized and intelligent navigation and guidance systems, which seriously restricts its application range in the field of weapon equipment.

[0003] The low-cost IMU based on micro-electro-mechanical system (MEMS) technology has the advantages of small size, light weight, batch manufacturing and extremely low cost, and becomes an important means to break through the current predicament and innovate the development of navigation and guidance systems.

[0004] The measurement accuracy of the low-cost MEMS chip is low, and the array composed of multiple chips can effectively improve the measurement accuracy. However, the low-cost MEMS chip has the disadvantages of poor repeatability and high abnormality rate, which leads to low reliability of the low-cost MEMS array.

[0005] In order to improve the reliability of the MEMS array, it is necessary to manage the health of the MEMS array. The mutual support degree between multiple chips is used to represent the measurement difference between the chips, and the threshold is set to identify abnormal chips, which can effectively avoid the problem of abnormal output signal of the low-precision MEMS chip, and further improve the reliability of the low-cost MEMS array. SUMMARY

[0006] The purpose of the application is to provide a health management method of MEMS array and related device, which solves the problem of low reliability of low-cost MEMS array in the prior art.

[0007] In order to achieve the above purpose, the application adopts the following technical scheme: In the first aspect, the application provides a health management method of MEMS array, comprising the following steps: Collecting original data of a plurality of chips in the MEMS array; Judging the effectiveness of the collected original data of the plurality of chips in the MEMS array to obtain effective chips; Determining the certainty error compensation of the effective chips to obtain the effective chips after certainty error compensation; Based on the effective chips after deterministic error compensation, construct a mutual support matrix for several chips; Based on the mutual support matrix of several chips, calculate the support of each chip in the MEMS array; The support of each chip in the MEMS array is normalized to obtain the normalized support of each chip in the MEMS array. Based on the normalized support of each chip in the MEMS array, the threshold for determining whether each chip in the MEMS array is healthy or not is determined. Based on the relationship between the normalized support of each chip in the MEMS array and the threshold of whether each chip in the MEMS array is healthy or not, health management of the MEMS array is performed to obtain the health management results of the MEMS array.

[0008] A further improvement of the present invention is that, in the step of judging the validity of the original data of several chips in the collected MEMS array to obtain valid chips, if there are invalid chips among the several chips in the collected MEMS array, the original data of several chips in the MEMS array are re-collected after troubleshooting the MEMS array hardware.

[0009] A further improvement of this invention is that the formula for calculating the mutual support matrix of several chips is as follows:

[0010] in, This is the mutual support matrix of several chips. Indicates the first in the MEMS array N The mutual support between the first chip and the second chip, Indicates the first in the MEMS array N The mutual support between the first chip and the second chip, This indicates the first chip and the second chip in the MEMS array. N Interoperability between individual chips This indicates the second chip and the third chip in the MEMS array. N Interoperability between individual chips N This represents the number of chips in the MEMS array.

[0011] A further improvement of this invention is that the formula for calculating the support degree of each chip in the MEMS array is as follows:

[0012] in, express t The first time in the MEMS array i Support for individual chips, represents the mutual support degree between the first chip and the second chip in the MEMS array at the moment, t i represents the mutual support degree between the first chip and the second chip in the MEMS array at the moment, j N represents the number of chips in the MEMS array. t represents the mutual support degree between the first chip and the second chip in the MEMS array at the moment, i j The calculation formula of the mutual support degree between the first chip and the second chip in the MEMS array at the moment is:

[0013] wherein, k represents a proportional factor, represents the output signal of the first chip in the MEMS array at the moment, t represents the output signal of the second chip in the MEMS array at the moment. i j

[0014] The further improvement of the present application is that the calculation formula of the normalized support degree of each chip in the MEMS array is:

[0015] wherein, represents the normalized support degree of the first chip in the MEMS array at the moment, t represents the support degree of the first chip in the MEMS array at the moment, i represents the number of chips in the MEMS array. t i N The further improvement of the present application is that the calculation formula of the threshold of the state health of each chip in the MEMS array is:

[0016] wherein,

[0017] represents the threshold of the state health of the first chip in the MEMS array at the moment, represents the normalized support degree of the first chip in the MEMS array at the moment, t represents the number of chips in the MEMS array. i t j N

[0018] ​​​​​​​​​​​​​​​The further improvement of the present application is that after obtaining the health management result of the MEMS array, the number of healthy chips in the MEMS array is counted according to the health management result of the MEMS array.

[0019] In a second aspect, the present application provides a health management system of a MEMS array, comprising: a data acquisition module, configured to collect original data of a plurality of chips in the MEMS array; a judgment module, configured to judge the validity of the collected original data of the plurality of chips in the MEMS array, and obtain valid chips; a deterministic error compensation module, configured to compensate the valid chips for deterministic error, and obtain the valid chips after deterministic error compensation; a matrix construction module, configured to construct a mutual support degree matrix of the plurality of chips based on the valid chips after deterministic error compensation; a support degree calculation module, configured to calculate the support degree of each chip in the MEMS array based on the mutual support degree matrix of the plurality of chips; a normalization processing module, configured to normalize the support degree of each chip in the MEMS array, and obtain the normalized support degree of each chip in the MEMS array; a threshold determination module, configured to determine the threshold of whether each chip in the MEMS array is healthy based on the normalized support degree of each chip in the MEMS array; a health management module, configured to perform health management on the MEMS array according to the size relationship between the normalized support degree of each chip in the MEMS array and the threshold of whether each chip in the MEMS array is healthy, and obtain the health management result of the MEMS array.

[0020] In a third aspect, the present application provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the health management method of the MEMS array as described above when executing the computer program.

[0021] In a fourth aspect, the present application provides a storage medium, which stores a computer program, and the computer program implements the steps of the health management method of the MEMS array as described above when executed by a processor.

[0022] Compared with the prior art, the present application has the following beneficial effects: The proposed health management method for MEMS arrays has two main aspects. First, it assesses the validity of raw data from several chips within the MEMS array to identify valid chips. This process quickly eliminates chips with obvious faults, improving the accuracy of subsequent health management results and thus enhancing the reliability of low-cost MEMS arrays. Second, it performs health management on the MEMS array based on the relationship between the normalized support of each chip and the threshold values ​​for the health status of each chip. This yields health management results, facilitating subsequent optimization of abnormal chips and further improving the reliability of low-cost MEMS arrays. Attached Figure Description

[0023] Figure 1 This is a flowchart of the MEMS array health management method of the present invention; Figure 2 This is a schematic diagram of the health management system for the MEMS array of the present invention; Figure 3 This is a flowchart of the health management method for MEMS arrays in Embodiment 4 of the present invention; Figure 4 This is the MEMS array verification platform in Embodiment 4 of the present invention; Figure 5 The results of the simulation of the outlier signal output in Embodiment 4 of the present invention (without introducing health management); Figure 6 This is the result of health management after outputting the wild value signal in Embodiment 4 of the present invention; Figure 7 The simulation results are shown in Embodiment 4 of the present invention. Figure 8 This is the result of health management following continuous abnormal signal output in Embodiment 4 of the present invention; Figure 9 This is the simulation result of low-precision signal output in Embodiment 4 of the present invention; Figure 10 This is the result of health management of low-precision signal output in Embodiment 4 of the present invention; Figure 11 This is a schematic diagram of the structure of the electronic device of the present invention. Detailed Implementation

[0024] To further understand the content of this invention, the invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments are merely illustrative and not limiting of the invention.

[0025] Example 1: The flowchart of the health management method for MEMS arrays of this invention is as follows: Figure 1As shown, the health management method for MEMS arrays of the present invention includes the following steps: S1. Collect raw data from several chips in the MEMS array; S2. Determine the validity of the raw data of several chips in the collected MEMS array to obtain valid chips; S3. Perform deterministic error compensation on the effective chip to obtain the effective chip after deterministic error compensation; S4. Based on the effective chips after deterministic error compensation, construct a mutual support matrix for several chips; S5. Based on the mutual support matrix of several chips, calculate the support of each chip in the MEMS array; S6. Normalize the support of each chip in the MEMS array to obtain the normalized support of each chip in the MEMS array. S7. Based on the normalized support of each chip in the MEMS array, determine the threshold for whether each chip in the MEMS array is healthy or not. S8. Based on the relationship between the normalized support of each chip in the MEMS array and the threshold of whether each chip in the MEMS array is healthy or not, perform health management on the MEMS array to obtain the health management results of the MEMS array.

[0026] Example 2: A schematic diagram of the health management system for the MEMS array of this invention is shown below. Figure 2 As shown, the health management system for the MEMS array of the present invention includes: The data acquisition module is used to collect raw data from several chips in the MEMS array; The judgment module is used to judge the validity of the raw data of several chips in the collected MEMS array and to identify the valid chips. The deterministic error compensation module is used to perform deterministic error compensation on the effective chip to obtain the effective chip after deterministic error compensation; The matrix construction module is used to construct a mutual support matrix of several chips based on the effective chips after deterministic error compensation. The support calculation module is used to calculate the support of each chip in the MEMS array based on the mutual support matrix of several chips. The normalization module is used to normalize the support of each chip in the MEMS array, so as to obtain the normalized support of each chip in the MEMS array. The threshold determination module is used to determine the threshold for the health status of each chip in the MEMS array based on the normalized support of each chip in the MEMS array. The health management module is used to perform health management on the MEMS array based on the relationship between the normalized support of each chip in the MEMS array and the threshold of whether each chip in the MEMS array is healthy or not, and to obtain the health management result of the MEMS array.

[0027] Example 3: The health management method for MEMS arrays of the present invention includes the following steps: S1. Collect raw data from several chips in the MEMS array.

[0028] S2. Determine the validity of the raw data of several chips in the collected MEMS array to obtain valid chips.

[0029] If several chips in the acquired MEMS array are invalid during this step, the original data of several chips in the MEMS array will be reacquired after troubleshooting the MEMS array hardware.

[0030] The following is a detailed explanation of this step: If the raw data of one chip or the raw data of one axis of a chip in a MEMS array contains all 0 signals or all NAN (Not a Number) signals, it indicates that there are invalid chips in the MEMS array. After troubleshooting the MEMS array hardware (if a chip in the MEMS array is faulty, replace the chip in the MEMS array; if the circuit is faulty, modify the hardware design), the raw data of the chips in the MEMS array should be collected again.

[0031] If the original data of several chips in the MEMS array is normal, it means that the MEMS array is working normally, outputting a valid signal, and thus obtaining a valid chip.

[0032] S3. Perform deterministic error compensation on the effective chip to obtain the effective chip after deterministic error compensation.

[0033] In this step, a deterministic error model is used to perform deterministic error compensation on the effective chip, resulting in a deterministically compensated effective chip.

[0034] S4. Based on the effective chips after deterministic error compensation, construct a mutual support matrix for several chips.

[0035] The formula for calculating the mutual support matrix of several chips in this step is as follows:

[0036] in, This is the mutual support matrix of several chips. Indicates the first in the MEMS array N The mutual support between the first chip and the second chip, Indicates the first in the MEMS array N The mutual support between the first chip and the second chip, This indicates the first chip and the second chip in the MEMS array. N Interoperability between individual chips This indicates the second chip and the third chip in the MEMS array. N Interoperability between individual chips N This represents the number of chips in the MEMS array.

[0037] S5. Based on the mutual support matrix of several chips, calculate the support of each chip in the MEMS array.

[0038] The formula for calculating the support level of each chip in the MEMS array in this step is:

[0039] in, express t The first time in the MEMS array i Support for individual chips, express t The first time in the MEMS array i The chip and the first j Interoperability between individual chips N This indicates the number of chips in the MEMS array.

[0040] t The first time in the MEMS array i The chip and the first j Inter-chip support The calculation formula is:

[0041] in, k Indicates the scaling factor. express t The first time in the MEMS array i The output signal of each chip Indicates the first in the MEMS array j The output signal of each chip.

[0042] S6. Normalize the support of each chip in the MEMS array to obtain the normalized support of each chip in the MEMS array.

[0043] The formula for calculating the normalized support of each chip in the MEMS array in this step is:

[0044] in, express t The first time in the MEMS array i The normalized support level of each chip express t The first time in the MEMS array i Support for individual chips, N This indicates the number of chips in the MEMS array.

[0045] S7. Based on the normalized support of each chip in the MEMS array, determine the threshold for whether each chip in the MEMS array is healthy or not.

[0046] The formula for calculating the health threshold of each chip in the MEMS array in this step is as follows:

[0047] in, express t The first time in the MEMS array i The threshold for determining the health status of an individual chip. express t The first time in the MEMS array j The normalized support level of each chip N This indicates the number of chips in the MEMS array.

[0048] S8. Based on the relationship between the normalized support of each chip in the MEMS array and the threshold of whether each chip in the MEMS array is healthy or not, perform health management on the MEMS array to obtain the health management results of the MEMS array.

[0049] After obtaining the health management results of the MEMS array, the number of healthy chips in the MEMS array is counted based on the health management results.

[0050] The steps are explained in detail below: If the normalized support of each chip in the MEMS array is less than the threshold for the health status of each chip in the MEMS array, it indicates that the status of each chip in the MEMS array is abnormal (unhealthy).

[0051] If the normalized support of each chip in the MEMS array is greater than the threshold for the health status of each chip in the MEMS array, then the chip in the MEMS array is considered to be in a healthy state.

[0052] If all chips in the MEMS array are in a healthy state, output the measurement signals of each chip in the MEMS array.

[0053] If there are unhealthy chips in the MEMS array, and the number of healthy chips in the MEMS array is less than 2, then the status of each chip in the MEMS array is unhealthy. After troubleshooting the MEMS array hardware, the original data of several chips in the MEMS array should be collected again.

[0054] If there are unhealthy chips in the MEMS array, and the number of healthy chips in the MEMS array is greater than or equal to 2, count the number of healthy chips in the MEMS array.

[0055] In this embodiment, the average value of the output signals of all healthy chips is taken, and this average value is assigned to the abnormal chip. The calculation formula is as follows:

[0056] in, express t The optimized output signal value of the time-anomaly chip. express t The first time in the MEMS array i The output signal of each chip, The number of health chips.

[0057] Example 4: The flowchart of the health management method for MEMS arrays in Embodiment 4 of the present invention is as follows: Figure 3 As shown, Figure 4 a and Figure 4 b represents a MEMS array verification platform at different angles (sampling frequency of 200Hz). This embodiment specifically uses four chips in a MEMS array as an example to introduce the method of the present invention: Step 1: Place the domestically produced MEMS array on the static base and collect the raw data of the four chips in the MEMS array.

[0058] Step 2: Determine the validity of the raw data from the four chips in the collected MEMS array.

[0059] Step 2(a): If the raw data of a certain chip or the raw data of the axis of a certain chip in the MEMS array contains all 0 signals or all NAN signals, it indicates that there are invalid chips among the four chips in the collected MEMS array. At this time, proceed to step 3. Step 2(b): If the original data of the four chips in the MEMS array is normal, it means that the MEMS array is working normally and outputs a valid signal. At this time, proceed to step 4.

[0060] Step 3: Troubleshoot the MEMS array hardware. If a chip in the MEMS array is faulty, replace the chip in the MEMS array. If the circuit is faulty, modify the hardware design. Then proceed to Step 1.

[0061] Step 4: Construct a deterministic error model and perform deterministic error compensation on the effective chips.

[0062] Step 5: Construct the mutual support matrix of the four chips and calculate the support of each chip in the MEMS array.

[0063] Step 5(a): Calculate the mutual support between any two MEMS chips;

[0064] in, k Indicates the scaling factor. express t The first time in the MEMS array i The output signal of each chip Indicates the first in the MEMS array j The output signal of each chip.

[0065] Step 5(b): Construct the mutual support matrix of the four chips.

[0066]

[0067] Step 5(c): Calculate the support degree of each chip in the MEMS array.

[0068]

[0069] in, express t The first time in the MEMS array i Support for individual chips, express t The first time in the MEMS array i The chip and the first j Interoperability between individual chips.

[0070] Step 5(d): Normalize the support of each chip in the MEMS array to obtain the normalized support of each chip in the MEMS array. The calculation formula is as follows:

[0071] in, express t The first time in the MEMS array i The normalized support level of each chip expresst The first time in the MEMS array i Support for individual chips.

[0072] Step 6: Based on the normalized support of each chip in the MEMS array, determine the threshold for whether each chip in the MEMS array is healthy or not.

[0073] Step 6(a): Select half of the average support of other chips as the threshold based on the number of MEMS chips. If the normalized support of each chip in the MEMS array is less than the threshold for whether each chip in the MEMS array is healthy or not, it means that the state of each chip in the MEMS array is abnormal (unhealthy).

[0074] If the normalized support of each chip in the MEMS array is greater than the threshold for the health status of each chip in the MEMS array, then the chip in the MEMS array is considered to be in a healthy state.

[0075] The formula for calculating the health threshold of each chip in a MEMS array is as follows:

[0076] in, express t The first time in the MEMS array i The threshold for determining the health status of an individual chip. express t The first time in the MEMS array j The support level of each chip after normalization.

[0077] Step 6(b): If all chips in the MEMS array are in a healthy state, proceed to step 8. Step 6(c): If there are unhealthy chips in the MEMS array and the number of healthy chips is less than 2, then all chips are in an unhealthy state, and step 3 is performed. Step 6(d): If there are unhealthy chips in the MEMS array, and the number of healthy chips is greater than or equal to 2, then proceed to step 7; Step 7: Count the number of healthy chips in the MEMS array, average the output signals of all healthy chips, and assign the average value to the abnormal chips. The calculation formula is:

[0078] in, express t The optimized output signal value of the time-anomaly chip. express t The output signal of the i-th chip in the MEMS array at time t. The number of health chips.

[0079] Step 8: Output the measurement signals of the four chips in the MEMS array.

[0080] Step 9: Repeat step 1 Step 8: Process the output data of several chips in the MEMS array at the next moment.

[0081] When two chips in a MEMS array have outlier outputs, without health management and with health management, the output signals of each chip are as follows: Figure 5 and Figure 6 As shown. From Figure 6 As can be seen, the introduction of health management effectively isolated outlier output faults.

[0082] When a chip in a MEMS array exhibits abnormal output over a certain period of time, and health management is not implemented, the output signals of each chip will be as follows: Figure 7 and Figure 8 As shown. From Figure 8 As can be seen from the data, after the introduction of health management, the abnormal output signal of the MEMS_4 chip is optimized by the signals of the other healthy chips, while the signal remains unchanged during other normal time periods, effectively isolating the continuous abnormal output fault of the signal.

[0083] When all chips in the MEMS array output normally, but the output signal accuracy of one chip is lower than that of the other three chips, and health management is not implemented, the output signals of each chip are as follows: Figure 9 and Figure 10 As shown. Before the introduction of health management, the average noise level of the MEMS_1 chip (blue) was 0.6%. After the introduction of health management, the average noise level of the MEMS_1 chip (blue) was 0.4%. From... Figure 10 As can be seen, health management technology effectively optimizes the low-precision output signal of the chip, thereby improving the output accuracy of the MEMS array.

[0084] Example 5: Please see Figure 11 As shown, the present invention also provides an electronic device 100 for a health management method of a MEMS array; the electronic device 100 includes a memory 101, at least one processor 102, a computer program 103 stored in the memory 101 and executable on the at least one processor 102, and at least one communication bus 104.

[0085] The memory 101 can be used to store the computer program 103. The processor 102 implements the steps of the MEMS array health management method described in Embodiment 1 by running or executing the computer program stored in the memory 101 and calling the data stored in the memory 101. The memory 101 may mainly include a program storage area and a data storage area. The program storage area may store the operating system, at least one application program required for a function (such as sound playback function, image playback function, etc.), etc.; the data storage area may store data created according to the use of the electronic device 100 (such as audio data), etc. In addition, the memory 101 may include non-volatile memory, such as hard disk, memory, plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, at least one disk storage device, flash memory device, or other non-volatile solid-state storage device.

[0086] The at least one processor 102 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The processor 102 may be a microprocessor or any conventional processor. The processor 102 is the control center of the electronic device 100, connecting various parts of the electronic device 100 via various interfaces and lines.

[0087] The memory 101 in the electronic device 100 stores multiple instructions to implement a health management method for a MEMS array, and the processor 102 can execute the multiple instructions to achieve the following: Collect raw data from several chips in a MEMS array; The validity of the raw data of several chips in the collected MEMS array is judged to obtain the valid chips; Deterministic error compensation is performed on the effective chip to obtain the effective chip after deterministic error compensation; Based on the effective chips after deterministic error compensation, construct a mutual support matrix for several chips; Based on the mutual support matrix of several chips, calculate the support of each chip in the MEMS array; The support of each chip in the MEMS array is normalized to obtain the normalized support of each chip in the MEMS array. Based on the normalized support of each chip in the MEMS array, the threshold for determining whether each chip in the MEMS array is healthy or not is determined. Based on the relationship between the normalized support of each chip in the MEMS array and the threshold of whether each chip in the MEMS array is healthy or not, health management of the MEMS array is performed to obtain the health management results of the MEMS array.

[0088] Example 6: If the modules / units integrated in the electronic device 100 are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, and a read-only memory (ROM).

[0089] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0090] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams.Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0091] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0092] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A health management method for a MEMS array, characterized in that, Includes the following steps: Collect raw data from several chips in a MEMS array; The validity of the raw data of several chips in the collected MEMS array is judged to obtain the valid chips; Deterministic error compensation is performed on the effective chip to obtain the effective chip after deterministic error compensation; Based on the effective chips after deterministic error compensation, construct a mutual support matrix for several chips; Based on the mutual support matrix of several chips, calculate the support of each chip in the MEMS array; The support of each chip in the MEMS array is normalized to obtain the normalized support of each chip in the MEMS array. Based on the normalized support of each chip in the MEMS array, the threshold for determining whether each chip in the MEMS array is healthy or not is determined. Based on the relationship between the normalized support of each chip in the MEMS array and the threshold of whether each chip in the MEMS array is healthy or not, health management of the MEMS array is performed to obtain the health management results of the MEMS array.

2. The health management method for a MEMS array according to claim 1, characterized in that, In the step of determining the validity of the raw data of several chips in the collected MEMS array to obtain valid chips, if there are invalid chips among the several chips in the collected MEMS array, the raw data of several chips in the MEMS array will be re-collected after troubleshooting the MEMS array hardware.

3. The health management method for a MEMS array according to claim 1, characterized in that, The formula for calculating the mutual support matrix of several chips is as follows: in, This is the mutual support matrix of several chips. Indicates the first in the MEMS array N The mutual support between the first chip and the second chip, Indicates the first in the MEMS array N The mutual support between the first chip and the second chip, This indicates the first chip and the second chip in the MEMS array. N Interoperability between individual chips This indicates the second chip and the third chip in the MEMS array. N Interoperability between individual chips N This represents the number of chips in the MEMS array.

4. The health management method for a MEMS array according to claim 1, characterized in that, The formula for calculating the support level of each chip in a MEMS array is: in, express t The first time in the MEMS array i Support for individual chips, express t The first time in the MEMS array i The chip and the first j Interoperability between individual chips N Indicates the number of chips in the MEMS array; t The first time in the MEMS array i The chip and the first j Inter-chip support The calculation formula is: in, k Indicates the scaling factor. express t The first time in the MEMS array i The output signal of each chip Indicates the first in the MEMS array j The output signal of each chip.

5. The health management method for a MEMS array according to claim 1, characterized in that, The formula for calculating the normalized support of each chip in a MEMS array is as follows: in, express t The first time in the MEMS array i The normalized support level of each chip express t The first time in the MEMS array i Support for individual chips, N This indicates the number of chips in the MEMS array.

6. The health management method for a MEMS array according to claim 1, characterized in that, The formula for calculating the health threshold of each chip in a MEMS array is as follows: in, express t The first time in the MEMS array i The threshold for determining the health status of an individual chip. express t The first time in the MEMS array j The normalized support level of each chip N This indicates the number of chips in the MEMS array.

7. The health management method for a MEMS array according to claim 1, characterized in that, After obtaining the health management results of the MEMS array, the number of healthy chips in the MEMS array is counted based on the health management results.

8. A health management system for a MEMS array, characterized in that, include: The data acquisition module is used to collect raw data from several chips in the MEMS array; The judgment module is used to judge the validity of the raw data of several chips in the collected MEMS array and to identify the valid chips. The deterministic error compensation module is used to perform deterministic error compensation on the effective chip to obtain the effective chip after deterministic error compensation; The matrix construction module is used to construct a mutual support matrix of several chips based on the effective chips after deterministic error compensation. The support calculation module is used to calculate the support of each chip in the MEMS array based on the mutual support matrix of several chips. The normalization module is used to normalize the support of each chip in the MEMS array, so as to obtain the normalized support of each chip in the MEMS array. The threshold determination module is used to determine the threshold for the health status of each chip in the MEMS array based on the normalized support of each chip in the MEMS array. The health management module is used to perform health management on the MEMS array based on the relationship between the normalized support of each chip in the MEMS array and the threshold of whether each chip in the MEMS array is healthy or not, and to obtain the health management result of the MEMS array.

9. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the health management method for the MEMS array according to any one of claims 1 to 7.

10. A storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the health management method for the MEMS array according to any one of claims 1 to 7.

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