Radio frequency device
By introducing a design that allows energy transfer through the air inside the shielding cover structure in the radio frequency device, the problem of severe energy loss at high frequencies is solved, achieving low-loss characteristics, and making it suitable for 5G FR2 band and high-frequency millimeter wave applications.
Patent Information
- Application Number
- CN202511446213.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-10
- Publication Date
- 2026-01-09
AI Technical Summary
Existing radio frequency devices suffer from severe energy loss at high frequencies, especially in the FR2 millimeter wave band. Traditional substrate-integrated waveguide designs still suffer from energy loss and cannot meet the high-frequency bandwidth requirements of 5G.
The design includes a substrate assembly and a shielding cover structure. Energy is transferred through air inside the shielding cover structure. Taking advantage of the low dielectric loss characteristics of air, the antenna signal is transmitted through the substrate assembly and the shielding cover structure.
It effectively reduces insertion loss, improving it by 4dB compared to traditional 60mm stripline transmission, meeting the higher frequency band requirements of 5G FR2, and is suitable for high-frequency millimeter wave applications.
Smart Images
Figure CN121310399A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a radio frequency device, and more particularly to a radio frequency device with a simple structure. Background Technology
[0002] With the evolution of mobile communication networks, in order to expand bandwidth for the ever-growing digital applications, the 5G generation, in addition to the limited bandwidth of FR1's sub-6GHz, is also expanding to higher frequency bands in the FR2 millimeter wave band. Recently, the 3GPP standard has also been pushed to 71GHz (Band n263). However, at such high frequencies, the RF striplines within the substrate will cause even more severe energy loss.
[0003] In recent years, to reduce insertion loss, substrate integrated waveguide (SIW) designs have been adopted to significantly increase the conductor area, thereby mitigating the impact of the small surface area of traditional leads and conductor surface roughness. The transmission principle of SIW is similar to that of traditional rectangular waveguides, utilizing two rows of metal vias arranged in a dielectric substrate to confine electromagnetic waves within a rectangular cavity formed by the two rows of metal vias and the upper and lower metal layers.
[0004] Folded substrate integrated waveguide design distributes electromagnetic waves in a folded manner within two cavity structures for transmission. Its advantage is that it reduces the width by half compared to traditional substrate integrated waveguides, but it requires a three-layer PCB layout. Although substrate integrated waveguides have the advantage of lower loss compared to traditional RF traces, there is still energy loss when electromagnetic waves propagate through the substrate medium. Summary of the Invention
[0005] The technical problem to be solved by the present invention is to provide a radio frequency device that addresses the shortcomings of the prior art, comprising: a substrate assembly including at least a first stripline feed terminal, the first stripline feed terminal receiving an antenna signal; and a shielding cover structure disposed on one side of the substrate assembly, the shielding cover structure being connected to the first stripline feed terminal, the shielding cover structure including a recessed structure; wherein the antenna signal is transmitted through the substrate assembly and the shielding cover structure.
[0006] Optionally, the inner side of the recessed structure of the shielding cover structure is connected to the first strip feed end via a first block.
[0007] Optionally, the shielding cover structure is a hollow structure, the recessed structure is disposed in the middle region of the shielding cover structure, the structural thickness of the shielding cover structure is 0.15mm, the shielding cover structure includes an outer height, an outer length, and an outer width, the outer height is 1.15mm, the outer length is 56.5mm, and the outer width is 7.3mm, the recessed structure includes a recessed length, a recessed width, and a recessed depth, the recessed length is 52.2mm, the recessed width is 3.2mm, and the recessed depth is 0.7mm.
[0008] Optionally, the shielding cover structure further includes an inner height, an inner length, and an inner width, wherein the inner height is 1 mm, the inner length is 56.2 mm, and the inner width is 7 mm.
[0009] Optionally, the shielding cover structure includes a first shielding short sidewall, a second shielding short sidewall, a first shielding long sidewall, and a second shielding long sidewall. The first shielding short sidewall and the second shielding short sidewall are disposed opposite to each other, the first shielding long sidewall and the second shielding long sidewall are disposed opposite to each other, the first shielding long sidewall is disposed between the first shielding short sidewall and the second shielding short sidewall, and the second shielding long sidewall is disposed between the first shielding short sidewall and the second shielding short sidewall. The recessed structure includes a first recessed short sidewall, a second recessed short sidewall, a first recessed long sidewall, and a second recessed long sidewall. The first recessed short sidewall and the second recessed short sidewall are disposed opposite to each other, the first recessed long sidewall and the second recessed long sidewall are disposed between the second recessed short sidewall and the second recessed long sidewall, and the second recessed short sidewall is disposed between the second recessed short sidewall and the second recessed long sidewall.
[0010] Optionally, the first block includes a first block height, a first block length, and a first block width, wherein the first block height is 0.3 mm, the first block length is 0.4 mm, and the first block width is 0.3 mm.
[0011] Optionally, the substrate assembly includes a substrate length and a substrate width. The substrate length is 60 mm, and the substrate width is greater than 7.3 mm. The substrate assembly is a multilayer circuit board. The substrate assembly also includes multiple metal vias, a first signal metal via, and a first solder pad. The stripline feed end is disposed in the substrate assembly. The signal metal via connects the first stripline feed end and the first solder pad. The multiple metal vias are disposed on both sides of the first stripline feed end.
[0012] Optionally, it further includes a second block, which is disposed on the opposite side relative to the first block and is in contact with the recessed structure.
[0013] Optionally, the first block and the second block are both metal blocks.
[0014] Optionally, the second block includes a second block height, a second block length, and a second block width. The second block height is 0.3 mm, the second block length is 0.4 mm, and the second block width is 0.3 mm. The substrate assembly also includes a second stripline feed end and a second solder pad. The recessed structure of the shielding cover structure is connected to the second stripline feed end through the second block and the second solder pad.
[0015] One of the beneficial effects of this invention is that the radio frequency device provided by this invention allows antenna signals to transmit energy through air within the shielding structure. Utilizing the low dielectric loss of air, the insertion loss is improved by 4dB compared to the previous 60mm stripline transmission. Furthermore, the low-loss characteristics of this embodiment can meet the higher frequency band requirements of 5G FR2, making it highly suitable for high-frequency millimeter-wave applications.
[0016] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of a radio frequency device according to the first embodiment of the present invention.
[0018] Figure 2 yes Figure 1 A top view of the radio frequency device.
[0019] Figure 3 yes Figure 1 A schematic diagram of one side of the radio frequency device.
[0020] Figure 4 yes Figure 1 A side view of one side of the radio frequency device.
[0021] Figure 5 yes Figure 1 Front view of the radio frequency device.
[0022] Figure 6 , Figure 7 , Figure 8 as well as Figure 9 yes Figure 1 A schematic diagram of the circuit boards of each layer of the substrate assembly.
[0023] Figure 10 yes Figure 1 A top view of the electric field strength of the radio frequency device.
[0024] Figure 11 yes Figure 1 A side view of the electric field strength of the radio frequency device.
[0025] Figure 12 yes Figure 10 A cross-sectional view of the electric field strength of the radio frequency device.
[0026] Figure 13 yes Figure 1 Comparison of S-parameters between the RF device and the 60mm stripline feed.
[0027] Figure 14 yes Figure 1 A schematic diagram of an application of a radio frequency device. Detailed Implementation
[0028] The following specific embodiments illustrate the implementation of the "radio frequency device" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, the term "or" as used herein may include, depending on the actual situation, any combination of any one or more of the associated listed items.
[0029] [First Embodiment]
[0030] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 as well as Figure 9 . Figure 1 This is a schematic diagram of a radio frequency device according to the first embodiment of the present invention. Figure 2 yes Figure 1 A top view of the radio frequency device. Figure 3 yes Figure 1 A schematic diagram of one side of the radio frequency device. Figure 4 yes Figure 1 A side view of one side of the radio frequency device. Figure 5yes Figure 1 Front view of the radio frequency device. Figure 6 , Figure 7 , Figure 8 as well as Figure 9 yes Figure 1 A schematic diagram of the circuit boards of each layer of the substrate assembly.
[0031] In this embodiment, a radio frequency device RFD1 is disclosed. The radio frequency device RFD1 includes at least a substrate assembly CB1 and a shielding cover structure CS1.
[0032] The substrate assembly CB1 also includes a first stripline feed terminal SL1. The first stripline feed terminal SL1 receives an antenna signal.
[0033] A shielding cover structure CS1 is disposed on one side of the substrate assembly CB1. The shielding cover structure CS1 is connected to the first stripline feed terminal SL1. The shielding cover structure CS1 includes a recessed structure DS1. Antenna signals are transmitted through the substrate assembly CB1 and the shielding cover structure CS1.
[0034] The inner side of the recessed structure DS1 of the shielding cover structure CS1 is connected to the first strip wire feed end SL1 through a first block BK1.
[0035] The shielding cover structure CS1 is a hollow structure. The recessed structure DS1 is located in the middle region of the shielding cover structure CS1. The structural thickness CST of the shielding cover structure CS1 is 0.15 mm. The shielding cover structure CS1 includes an outer height EH, an outer length EL, and an outer width EW. The outer height EH is 1.15 mm. The outer length EL is 56.5 mm. The outer width EW is 7.3 mm. The recessed structure DS1 includes a recess length DL, a recess width DW, and a recess depth DD. The recess length DL is 52.2 mm. The recess width DW is 3.2 mm. The recess depth DD is 0.7 mm.
[0036] The shielding cover structure CS1 also includes an inner height INH, an inner length INL, and an inner width INW. The inner height INH is 1 mm. The inner length INL is 56.2 mm. The inner width INW is 7 mm.
[0037] The shielding cover structure CS1 includes a first short shielding sidewall CSW1, a second short shielding sidewall CSW2, a first long shielding sidewall CLW1, and a second long shielding sidewall CLW2. The first short shielding sidewall CSW1 and the second short shielding sidewall CSW2 are disposed opposite to each other. The first long shielding sidewall CLW1 and the second long shielding sidewall CLW2 are also disposed opposite to each other. The first long shielding sidewall CLW1 is disposed between the first short shielding sidewall CSW1 and the second short shielding sidewall CSW2. The second long shielding sidewall CLW2 is disposed between the first short shielding sidewall CSW1 and the second short shielding sidewall CSW2.
[0038] The recessed structure DS1 includes a first recessed short sidewall DSW1, a second recessed short sidewall DSW2, a first recessed long sidewall DLW1, and a second recessed long sidewall DLW2. The first recessed short sidewall DSW1 and the second recessed short sidewall DSW2 are disposed opposite to each other. The first recessed long sidewall DLW1 and the second recessed long sidewall DLW2 are also disposed opposite to each other. The first recessed short sidewall DSW1 is located between the first recessed long sidewall DLW1 and the second recessed long sidewall DLW2. The second recessed short sidewall DSW2 is located between the first recessed long sidewall DLW1 and the second recessed long sidewall DLW2.
[0039] The distance DB1 between the first concave short sidewall DSW1 and the first shielding short sidewall CSW1 is 2.0 mm. The distance DB2 between the first concave long sidewall DLW1 and the first shielding long sidewall CLW1 is 1.75 mm. Similarly, the distance DB4 between the second concave short sidewall DSW2 and the second shielding short sidewall CSW2 is 2.0 mm. The distance DB3 between the second concave long sidewall DLW2 and the second shielding long sidewall CLW2 is 1.75 mm.
[0040] The first block BK1 includes a first block height BH1, a first block length BL1, and a first block width BW1. The first block height BH1 is 0.3 mm. The first block length BL1 is 0.4 mm. The first block width BW1 is 0.3 mm.
[0041] The radio frequency device RFD1 further includes a second block BK2. The second block BK2 is disposed on the opposite side of the first block BK1 and contacts the recessed structure DS1. That is, the first block BK1 and the second block BK2 are disposed opposite each other and on opposite sides of the recessed structure DS1. In this embodiment, the first block BK1 and the second block BK2 are disposed on one side of the bottom sidewall of the recessed structure DS1 and contact the bottom sidewall of the recessed structure DS1. The first block BK1 is disposed at one end near the first recessed short sidewall DSW1. The second block BK2 is disposed at one end near the second recessed short sidewall DSW2. Furthermore, the first block BK1 and the second block BK2 are each a metal block.
[0042] The second block BK2 also includes a second block height (not shown), a second block length (not shown), and a second block width (not shown). The second block height (not shown) is 0.3 mm, the second block length (not shown) is 0.4 mm, and the second block width (not shown) is 0.3 mm. The substrate assembly CB1 also includes a second stripline feed terminal SL2. The second block BK2 is in contact with the second stripline feed terminal SL2.
[0043] The substrate assembly CB1 includes a substrate length CBL and a substrate width CBW. The substrate length CBL is 60 mm. The substrate width CBW is greater than 7.3 mm. The substrate assembly CB1 is a multilayer circuit board. The substrate assembly CB1 also includes a second stripline feed terminal SL2, multiple metal vias VIA, a first signal metal via CVIA1, a second signal metal via (not shown in the figure), a first pad SP1, and a second pad SP2. The first stripline feed terminal SL1 and the second stripline feed terminal SL2 are disposed within the substrate assembly CB1. The first signal metal via CVIA1 connects the first stripline feed terminal SL1 and the first pad SP1. The second signal metal via (not shown in the figure) connects the second stripline feed terminal SL2 and the second pad SP2.
[0044] Multiple metal through-holes (VIA) are provided on both sides of the first stripline feed end SL1 and the second stripline feed end SL2.
[0045] In this embodiment, the substrate assembly CB1 is a 4-layer circuit board (PCB) with a total length of 60mm and a symmetrical structure at both ends. The top layer of the substrate assembly CB1 is covered by a metal shielding structure CS1. The antenna signal is fed in through the first stripline feed terminal SL1 located in the inner layer of the substrate assembly CB1. After the antenna signal enters below the shielding structure CS1 through the first stripline feed terminal SL1, it is connected to the first pad SP1 on the top layer of the substrate assembly CB1 through the signal metal via CVIA1. A first block BK1 is connected above the first pad SP1. The first block BK1 contacts the recessed structure DS1 of the shielding structure CS1 to propagate the antenna signal.
[0046] Please see Figure 10 , Figure 11 as well as Figure 12 . Figure 10 yes Figure 1 A top view of the electric field strength of the radio frequency device. Figure 11 yes Figure 1 A side view of the electric field strength of the radio frequency device. Figure 12 yes Figure 10 A cross-sectional view of the electric field strength of the radio frequency device.
[0047] Depend on Figure 10 The electric field intensity distribution diagram shows that when the electromagnetic wave of the antenna signal propagates, the electric field intensity is concentrated in the cavity within the shielding structure CS1. From... Figure 11 (Side view) and Figure 12 As can be seen, after the antenna signal is fed in from the first stripline feed end SL1 in the inner layer, the energy is transferred to the first block BK1 through the first signal metal through hole CVIA1, and then converted into a bent electric field vector by the first block BK1 and the concave structure DS1.
[0048] Please see Figure 13 , Figure 13 yes Figure 1 A comparison of the S-parameters of the RF device and the 60mm stripline. Furthermore, from... Figure 13 The S-parameter comparison chart clearly shows that the RF device RFD1 in this embodiment has 4dB less insertion loss at 48GHz compared to a 60mm stripline of the same length. Furthermore, within the n258~n262 frequency band of FR2 (24~48.2GHz), the return loss is above 15dB, even reaching 20dB. This indicates that the RF device RFD1 in this embodiment is quite suitable for 5G millimeter wave or higher frequency band applications.
[0049] Please see Figure 14 , Figure 14 yes Figure 1A schematic diagram of an application of a radio frequency device. Figure 14 This is a schematic diagram of the device under test (DUT) being tested with two radio frequency devices, RFD11 and RFD12.
[0050] With the increasing frequency of millimeter-wave applications, the RF path loss on the test substrate becomes more severe. Excessive path loss limits the signal strength that test instruments can receive, resulting in a smaller dynamic range and thus affecting signal integrity and quality. This phenomenon is even more pronounced on the test substrate (load board) of Automatic Test Equipment (ATE). Test substrates are typically about 40cm x 40cm in size. The RF signal wiring on the substrate is at least several tens of centimeters long, further exacerbating energy loss. Figure 14 As illustrated in the previous embodiment, there is a significant loss difference of more than 4dB within a length of 60mm, which translates to a signal strength loss of approximately 7dB per 10cm length.
[0051] [Beneficial Effects of the Examples]
[0052] One of the beneficial effects of this invention is that the radio frequency device provided by this invention allows antenna signals to transmit energy through air within the shielding structure. Utilizing the low dielectric loss of air, the insertion loss is improved by 4dB compared to the previous 60mm stripline transmission. Furthermore, the low-loss characteristics of this embodiment can meet the higher bandwidth requirements of 5G FR2, making it highly suitable for high-frequency millimeter-wave applications.
[0053] The above-disclosed content is only a preferred and feasible embodiment of the present invention and is not intended to limit the claims of the present invention. Therefore, all equivalent technical changes made based on the description and drawings of the present invention are included in the claims of the present invention.
Claims
1. A radio frequency device, characterized in that, include: A substrate assembly includes at least a first stripline feed terminal, wherein the first stripline feed terminal receives an antenna signal; as well as A shielding cover structure is disposed on one side of the substrate assembly. The shielding cover structure is connected to the first strip line feed end. The shielding cover structure includes a recessed structure. The antenna signal is transmitted through the substrate assembly and the shielding cover structure.
2. The radio frequency device according to claim 1, characterized in that, The inner side of the recessed structure of the shielding cover is connected to the first strip feed end via a first block.
3. The radio frequency device according to claim 2, characterized in that, The shielding cover structure is a hollow structure, and the recessed structure is located in the middle area of the shielding cover structure. The structural thickness of the shielding cover structure is 0.15mm. The shielding cover structure includes an outer height, an outer length, and an outer width. The outer height is 1.15mm, the outer length is 56.5mm, and the outer width is 7.3mm. The recessed structure includes a recessed length, a recessed width, and a recessed depth. The recessed length is 52.2mm, the recessed width is 3.2mm, and the recessed depth is 0.7mm.
4. The radio frequency device according to claim 3, characterized in that, The shielding cover structure also includes an inner height, an inner length, and an inner width. The inner height is 1 mm, the inner length is 56.2 mm, and the inner width is 7 mm.
5. The radio frequency device according to claim 4, characterized in that, The shielding cover structure includes a first shielding short sidewall, a second shielding short sidewall, a first shielding long sidewall, and a second shielding long sidewall. The first shielding short sidewall and the second shielding short sidewall are arranged opposite to each other, the first shielding long sidewall and the second shielding long sidewall are arranged opposite to each other, the first shielding long sidewall is disposed between the first shielding short sidewall and the second shielding short sidewall, and the second shielding long sidewall is disposed between the first shielding short sidewall and the second shielding short sidewall. The recessed structure includes a first recessed short sidewall, a second recessed short sidewall, a first recessed long sidewall, and a second recessed long sidewall. The first recessed short sidewall and the second recessed short sidewall are disposed opposite to each other, and the first recessed long sidewall and the second recessed long sidewall are disposed opposite to each other. The first recessed short sidewall is disposed between the second recessed short sidewall and the second recessed long sidewall, and the second recessed short sidewall is disposed between the second recessed short sidewall and the second recessed long sidewall.
6. The radio frequency device according to claim 5, characterized in that, The first block includes a first block height, a first block length, and a first block width. The first block height is 0.3 mm, the first block length is 0.4 mm, and the first block width is 0.3 mm.
7. The radio frequency device according to claim 6, characterized in that, The substrate assembly includes a substrate length and a substrate width. The substrate length is 60 mm, and the substrate width is greater than 7.3 mm. The substrate assembly is a multilayer circuit board. The substrate assembly also includes multiple metal vias, a first signal metal via, and a first solder pad. The stripline feed end is disposed in the substrate assembly. The signal metal via connects the first stripline feed end and the first solder pad. The multiple metal vias are disposed on both sides of the first stripline feed end.
8. The radio frequency device according to claim 7, characterized in that, It also includes a second block, which is disposed on the other side relative to the first block and is in contact with the recessed structure.
9. The radio frequency device according to claim 8, characterized in that, The first block and the second block are both metal blocks.
10. The radio frequency device according to claim 9, characterized in that, The second block includes a second block height, a second block length, and a second block width. The second block height is 0.3 mm, the second block length is 0.4 mm, and the second block width is 0.3 mm. The substrate assembly also includes a second stripline feed end and a second solder pad. The recessed structure of the shielding cover structure is connected to the second stripline feed end through the second block and the second solder pad.