Wafer transfer device

Abstract

A wafer transfer device relates to the field of semiconductor processing, including: a workbench, both sides are drying zone and temporary storage area, temporary storage area along the length direction is provided with a plurality of through holes, and one side is provided with a support frame, the through hole is provided with a limiting ring moving along the vertical direction, the support frame is provided with a storage frame; the turnover mechanism includes a rotating plate rotatably installed in the support frame, a plurality of rotating turnover plates are arranged on the side surface of the rotating plate along the length direction, a semicircular clasp is arranged on the end surface of the turnover plate, the clasp is used for accommodating the wafer, limiting rods moving along the circumference are arranged at both ends of the clasp, limiting rods are arranged at both ends of the limiting rods, and the limiting rods are used for limiting the wafer, and the limiting rods are used for limiting the wafer. When the turnover plate is matched in the limiting ring; the transfer mechanism includes a supporting rod arranged in the support frame and moving along the vertical direction, a plurality of supporting rods are arranged on the supporting rod and moving along the axis, and the supporting rod is used for supporting the wafer and transferring to the storage frame. The device can automatically transfer the wafer to the storage frame, avoid burns, and improve production efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and particularly to a wafer transfer device. BACKGROUND

[0002] A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit. In a process of processing the wafer into an integrated semiconductor, one step is to fill glass powder in a groove on the wafer surface, and to melt the glass powder by high temperature to change the glass powder from powder to liquid, and to form a transparent glass passivation layer after cooling. In the process of applying the glass powder, in order to enable the glass powder to be stably attached to the wafer surface, the glass powder is dissolved to become a slurry. Therefore, after the glass powder is attached to the wafer surface, the wafer needs to be subjected to a drying treatment, and then is transferred into a high-temperature process.

[0003] In the prior art, the wafer with the attached glass powder is directly placed in a drying area of a workbench. Since the temperature of the drying area is very high, and in order to avoid contaminating the wafer, the wafer cannot be directly taken by hand. After the glass powder is solidified, the wafer is generally clamped by tweezers and transferred to a storage rack. However, it is very inconvenient to clamp the wafer by the tweezers. During the clamping process, attention needs to be paid to avoid touching the drying area, otherwise, a scalding situation will occur, which makes the efficiency relatively low. In addition, the wafer is also prone to slipping after being clamped and transferred, which causes the wafer to break and leads to waste of products. SUMMARY

[0004] In view of the above-mentioned deficiencies of the related prior art, the present application provides a wafer transfer device which can automatically transfer the dried wafer to a storage frame, thereby avoiding the scalding situation, improving the production efficiency, and having strong practicability.

[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technology:

[0006] A wafer transfer device comprises a workbench, a turnover mechanism, and a transfer mechanism.

[0007] The length direction of the top surface of the workbench is respectively provided with a drying area and a temporary storage area on both sides, the temporary storage area is provided with a plurality of through holes arranged at intervals along the length direction thereof, one side of the temporary storage area is provided with a support frame, the through holes are provided with limiting rings arranged to move in the vertical direction, one end of the support frame is provided with a storage frame arranged to move along the length direction thereof, and the storage frame is used for storing wafers; the turnover mechanism comprises a rotating plate rotatably installed in the support frame, a plurality of turnover plates are arranged on the side surface of the rotating plate along the length direction thereof, the turnover plates are rotatably arranged around the radial direction perpendicular to the rotating plate, and the end surface of each turnover plate is provided with a semicircular clamping ring for accommodating a wafer, two limiting rods are symmetrically arranged at the two ends of the clamping ring and move towards each other along the circumference of the turnover plate, the limiting rods are used for limiting the side wall of the wafer, and a clamping plate is arranged at the end of each limiting rod for limiting the end surface of the wafer, and in use, the turnover plate is matched in the limiting ring; the transfer mechanism comprises a support rod arranged in the support frame and arranged to move in the vertical direction, a plurality of bearing plates are arranged on the support rod to move along the axis thereof, the bearing plates are V-shaped, and the top end of each bearing plate is provided with a clamping groove for receiving the wafer on the turnover plate and transferring the wafer into the storage frame.

[0008] Further, the side surface of the turnover plate is provided with a rotating shaft rotatably installed in the rotating plate and provided with a first driven gear, the first driven gear is engaged with a rack, the two ends of the rack are arranged in an end plate, the end plate is installed on the rotating plate, the bottom of the rack is connected to the moving end of a first horizontal linear mechanism, and the first horizontal linear mechanism is installed on the rotating plate and arranged along the length direction thereof.

[0009] Further, the side surface of the through hole is provided with a through groove penetrating the side surface of the workbench, and the side surface of the limiting ring is provided with a notch, both of which are used for accommodating the rotating shaft.

[0010] Further, the end surface of the turnover plate is provided with two symmetrically arranged arc-shaped holes, the limiting rods are arranged in the arc-shaped holes, and the lower ends of the limiting rods are installed on connecting rods, one end of each connecting rod is rotatably installed on a connecting shaft and is sleeved on an arc-shaped rod, the connecting shaft is installed at the center of the turnover plate, one end of the arc-shaped rod is installed on a bottom plate, the bottom plate is installed on the turnover plate, a first spring is sleeved on the arc-shaped rod, the two ends of the first spring are respectively abutted to the connecting rod and the bottom plate and are always in a compressed state, the other end of the arc-shaped rod is provided with a baffle for abutting to the connecting rod, a second driven gear is installed on the limiting rod, the second driven gear is engaged with a toothed plate, the toothed plate is arc-shaped and is installed on the turnover plate.

[0011] Further, the bottom of each limiting ring is installed on a lifting frame, the lifting frame is connected to the moving end of a first vertical lifting mechanism, the first vertical lifting mechanism is installed on the workbench, the lifting frame is provided with a cross rod arranged along the length direction thereof, the cross rod is sleeved with a moving frame, the moving frame is connected to the moving end of a second horizontal linear mechanism, the second horizontal linear mechanism is installed on the lifting frame, and two symmetrically arranged push rods are arranged below each through hole, the push rods are installed on the moving frame and used for pushing the connecting rod.

[0012] Further, the side of the turnover plate away from the snap ring is provided with a recess, the inner wall of the limiting ring is provided with a protrusion, the protrusion is arc-shaped, and the inner diameter is the same as that of the snap ring, and in application, the protrusion is matched in the recess.

[0013] Further, the side wall of the recess is provided with two grooves for penetrating the bearing plate.

[0014] Further, the side of the bearing plate except the one closest to the storage frame is provided with a horizontal plate, the horizontal plate is provided with a guide rod penetratingly, the two ends of the guide rod are installed on the connecting plate, the connecting plate is installed on the supporting rod, a second spring is sleeved on the guide rod, the two ends of the second spring are respectively abutted to the horizontal plate and the connecting plate close to the storage frame, and are always in a compressed state, and the guide rod is provided with a stop ring for abutting to the horizontal plate.

[0015] Further, the outer side of the bearing plate farthest from the storage frame is provided with a push plate, the push plate is L-shaped, and the upper end penetrates into the moving end of the third horizontal linear mechanism, and the third horizontal linear mechanism is installed on the support frame.

[0016] Further, the two ends of the support frame are provided with side plates, the side plates are provided with long strip holes arranged vertically, the supporting rods penetrate through the long strip holes and are connected to the moving end of the second vertical lifting mechanism, and the second vertical lifting mechanism is installed on the support frame.

[0017] Further, the side of the bearing plate is provided with two top rods respectively located on the two sides of the supporting rod, in application, the upper end of the top rod is in contact with the connecting rod, the top rod is installed on the bottom frame, and the bottom frame is movably arranged in the vertical direction.

[0018] The beneficial effects of the present application are that: the wafer is carried and collected by the turnover plate, and can be automatically turned over into a vertical state and transferred to the bearing plate, avoiding manual clamping and transferring of the wafer, effectively avoiding the situation that the worker is scalded; the wafer can be automatically transferred to the storage frame through the movement of the bearing plate, thereby effectively improving the wafer transfer efficiency and positively affecting the improvement of production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0019] The drawings described herein are only for illustrating the selected embodiments, rather than all possible embodiments, and are not intended to limit the scope of the present application.

[0020] Figure 1 It is a whole structure perspective view of the embodiment of the present application.

[0021] Figure 2 It is a whole structure perspective view of another state of the embodiment of the present application.

[0022] Figure 3 It is a bottom view perspective view of the workbench of the embodiment of the present application.

[0023] Figure 4 It is a three-dimensional schematic view of the overturning mechanism of the embodiment of the present application.

[0024] Figure 5 It is a three-dimensional schematic view of the overturning plate of the embodiment of the present application.

[0025] Figure 6 It is a three-dimensional schematic view of the overturning plate of the embodiment of the present application.

[0026] Figure 7 It is a three-dimensional schematic view of the transfer mechanism of the embodiment of the present application.

[0027] Figure 8 It is an enlarged schematic view of A of Figure 7

[0028] Legend: 100 - workbench, 200 - overturning mechanism, 300 - transfer mechanism, 101 - through hole, 102 - support frame, 103 - limiting ring, 104 - storage frame, 105 - through slot, 106 - lifting frame, 107 - cross rod, 108 - moving frame, 109 - push rod, 110 - protruding block, 111 - side plate, 112 - long hole, 201 - rotating plate, 202 - overturning plate, 203 - snap ring, 204 - limiting rod, 205 - clamping plate, 206 - rotating shaft, 207 - first driven gear, 208 - rack, 209 - end plate, 210 - arc-shaped hole, 211 - connecting rod, 212 - connecting shaft, 213 - arc-shaped rod, 214 - bottom plate, 215 - first spring, 216 - baffle, 217 - second driven gear, 218 - toothed plate, 219 - recess, 220 - groove, 301 - support rod, 302 - bearing plate, 303 - clamping groove, 304 - cross plate, 305 - guide rod, 306 - connecting plate, 307 - second spring, 308 - blocking ring, 309 - top rod, 310 - bottom frame, 311 - push plate. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the embodiments of the present application are described in detail below in combination with the drawings, but the embodiments described in the present application are part of the embodiments of the present application, not all the embodiments.

[0030] As shown in Figures 1-8 , the present application provides a wafer transfer device, which comprises: a workbench 100, an overturning mechanism 200, and a transfer mechanism 300.

[0031] ​The top surface of the workbench 100 is provided with a drying area and a temporary storage area on both sides in the length direction, the drying area is used for placing wafers being dried, the wafers dried can be pushed to the temporary storage area through a moving plate arranged in the width direction of the workbench 100, and the moving plate can be concave to avoid the side area of the moving plate moving out during the wafer transfer process, and since the two surfaces of the wafer are coated with glass powder, the wafer transfer process will not cause friction damage to the wafer surface, and in the subsequent processing process, the excess glass powder also needs to be removed, only the glass powder in the groove is left, so even if the glass powder is removed during the transfer process, it will not affect the normal progress of the subsequent process, the temporary storage area is provided with a plurality of through holes 101 arranged at intervals in the length direction, and is provided with a support frame 102 on one side, the through holes 101 are provided with a limiting ring 103 arranged in the vertical direction, one end of the support frame 102 is provided with a storage frame 104 arranged in the length direction, used for storing wafers; the turnover mechanism 200 includes a rotating plate 201 rotatably installed in the support frame 102, a plurality of turnover plates 202 are arranged on the side surface of the rotating plate 201 in the length direction, the turnover plates 202 are rotatably arranged around the radial direction perpendicular to the rotating plate 201, and the end surface is provided with a semicircular clamping ring 203 for accommodating the wafer, the clamping ring 203 is provided with two limiting rods 204 symmetrically arranged at both ends and moving towards each other along the circumference of the turnover plate 202, for limiting the side wall of the wafer, and the end of the limiting rod 204 is provided with a clamping plate 205 for limiting the end surface of the wafer.When the wafer needs to be transferred from the drying area to the temporary storage area, the turnover plate 202 is fitted in the limiting ring 103, at this time the wafer is pushed to the temporary storage area by the moving plate until the side of the moving plate is tangent to the inner wall of the clamping ring 203, at this time a moving rod moving along the length direction of the workbench 100 can be arranged, and then the wafer is moved along the length direction of the workbench 100 by the moving rod, at this time the end of the clamping plate 205 faces the outer side of the turnover plate 202, that is, the wafer can fall on the turnover plate 202 and be limited by the clamping ring 203 and the limiting rod 204, then the limiting rod 204 is moved along the circumference of the turnover plate 202 while rotating around its own axis, so that the end of the clamping plate 205 faces the inner side of the turnover plate 202, thereby limiting the side and end surface of the wafer, then the limiting ring 103 is moved downward to release the limitation of the turnover plate 202, and the rotating plate 201 is rotated upward by 90 degrees, then the turnover plate 202 is rotated by 90 degrees, and then the rotating plate 201 is continuously rotated by 90 degrees, so that the wafer can be transferred to the transfer mechanism 300; the transfer mechanism 300 includes a supporting rod 301 arranged in the supporting frame 102 and moving in the vertical direction, a plurality of supporting plates 302 moving along the axis of the supporting rod 301 are arranged on the supporting rod 301, the supporting plates 302 are V-shaped and the top end is provided with a clamping groove 303 for receiving the wafer on the turnover plate 202, the limiting rod 204 is moved upward and the supporting plate 302 is moved downward, so that the wafer can be transferred, then the turnover plate 202 is reset, the supporting plate 302 is moved upward and reset, and moves toward the storage frame 104, then the supporting plate 302 is moved downward again, so that the wafer can be transferred to the storage frame 104.

[0032] Specifically, as shown in the figure, Figures 1-4 The turnover plate 202 is provided with a rotating shaft 206 on the side, the rotating shaft 206 is rotatably installed in the rotating plate 201 and is provided with a first driven gear 207, the first driven gear 207 is engaged with a rack 208, the two ends of the rack 208 are arranged in an end plate 209, the end plate 209 is installed on the rotating plate 201, the bottom of the rack 208 is connected to the moving end of a first horizontal linear mechanism, the first horizontal linear mechanism is installed on the rotating plate 201 and is arranged along the length direction of the rotating plate 201, the rack 208 is driven to move along the length direction of the rotating plate 201 by the first horizontal linear mechanism, and the turnover plate 202 is rotated under the meshing transmission of the first driven gear 207 and the rack 208, so that the wafer is changed from a horizontal state to a vertical state, so as to be transferred to the transfer mechanism 300, for the rotation of the rotating plate 201, a transmission shaft can be arranged at both ends of the rotating plate 201, the transmission shaft is rotatably installed in the supporting frame 102, and one end of one of the transmission shafts is connected to the output end of a power device, the rotation of the transmission shaft is driven by the power device to drive the rotation of the rotating plate 201, and the power device is installed on the supporting frame 102.

[0033] Specifically, as shown in Figures 2-4 The through hole 101 is provided with a through slot 105 penetrating to the side surface of the workbench 100, and the limiting ring 103 is provided with a notch, which are used for accommodating the rotating shaft 206, so that the turnover plate 202 does not interfere when located in the limiting ring 103, and the top surface of the limiting ring 103 is flush with the top surface of the workbench 100 when located at the top end of its stroke, and the top surface of the clamping ring 203 is flush with the top surface of the limiting ring 103, so that the wafer can be smoothly placed on the turnover plate 202.

[0034] Specifically, as shown in Figures 4-6 The end surface of the turnover plate 202 is provided with two symmetrically arranged arc-shaped holes 210, the limiting rod 204 is penetrated in the arc-shaped hole 210, and the lower end is installed on the connecting rod 211. One end of the connecting rod 211 is rotatably installed on the connecting shaft 212 and is sleeved on the arc-shaped rod 213. The connecting shaft 212 is installed at the center of the turnover plate 202. One end of the arc-shaped rod 213 is installed on the bottom plate 214, which is installed on the turnover plate 202. The arc-shaped rod 213 is sleeved with the first spring 215, and the two ends of the first spring 215 abut to the connecting rod 211 and the bottom plate 214 respectively and are always in a compressed state. The other end of the arc-shaped rod 213 is provided with a baffle 216 for abutting to the connecting rod 211. The limiting rod 204 is installed with a second driven gear 217, which is engaged with a toothed plate 218. The toothed plate 218 is arc-shaped and is installed on the turnover plate 202. Under the action of the first spring 215, the limiting rod 204 always has a tendency to move away from the clamping ring 203. When the limiting rod 204 is located at the end of the arc-shaped hole 210 farthest from the clamping ring 203, the end of the clamping plate 205 faces the center of the turnover plate 202, and when the limiting rod 204 is located at the end of the arc-shaped hole 210 closest to the clamping ring 203, the end of the clamping plate 205 faces the outside of the turnover plate 202. Before transferring the wafer to the turnover plate 202, an external force opposite to the elastic force of the first spring 215 is applied to the connecting rod 211, so that the limiting rod 204 moves towards the clamping ring 203. At this time, under the meshing transmission of the second driven gear 217 and the toothed plate 218, the limiting rod 204 will be driven to rotate, and the first spring 215 will be further compressed. When the limiting rod 204 moves to the end of the arc-shaped hole 210 close to the clamping ring, the end of the clamping plate 205 faces the outside of the turnover plate 202. At this time, the wafer can be smoothly pushed onto the turnover plate 202. Then, the external force applied to the connecting rod 211 is removed. The connecting rod 211 will be reset under the action of the first spring 215, the limiting rod 204 will move back, and the clamping plate 205 will reorient to the center of the turnover plate 202, thereby limiting the side wall and end surface of the wafer, avoiding the wafer from falling during the transfer process.

[0035] Specifically, as shown in Figures 1-4As shown, the bottom of the limiting ring 103 is mounted on the lifting frame 106, the lifting frame 106 is connected to the moving end of the first vertical lifting mechanism, the first vertical lifting mechanism is mounted on the workbench 100, the lifting frame 106 is provided with a cross bar 107 arranged along the length direction thereof, the cross bar 107 is sleeved with a moving frame 108, the moving frame 108 is connected to the moving end of the second horizontal linear mechanism, the second horizontal linear mechanism is mounted on the lifting frame 106, two push rods 109 are arranged symmetrically below the through hole 101, the push rods 109 are mounted on the moving frame 108 and used to push the connecting rod 211, when it is needed to move the limiting rod 204 towards the clamping ring 203, the moving frame 108 is driven to move along the length direction of the cross bar 107 by the second horizontal linear mechanism, the push rod 109 is in contact with the connecting rod 211, and the connecting rod 211 is forced to rotate around the center of the turnover plate 202, so that the movement of the limiting rod 204 is realized, and when it is needed to move the turnover plate 202 out of the limiting ring 103, the lifting frame 106 is driven to move downward by the first vertical lifting mechanism until the limiting ring 103 is completely moved out of the through hole 101.

[0036] Specifically, as shown in Figure 2 、 Figure 4 In order to ensure that the wafer can be smoothly limited by the clamping ring 203 and the limiting rod 204 when the wafer is on the turnover plate 202, a recess 219 is arranged on the side of the turnover plate 202 away from the clamping ring 203, and a protrusion 110 is arranged on the inner wall of the limiting ring 103, the protrusion 110 is arc-shaped and has the same diameter as the clamping ring 203, when the turnover plate 202 is located in the limiting ring 103, the protrusion 110 is matched in the recess 219, the protrusion 110 and the clamping ring 203 form a circle, under the joint action of the protrusion 110 and the clamping ring 203, the side wall of the wafer can be directly limited, so that the wafer is coaxial with the turnover plate 202, and then it is ensured that the limiting rod 204 can smoothly contact the side wall of the wafer, avoiding the wafer from falling during the turnover of the turnover plate 202.

[0037] Specifically, as shown in Figure 2 、 Figure 5 、 Figure 8 In order to ensure that the wafer can be smoothly transferred to the bearing plate 302, two grooves 220 are arranged on the side wall of the recess 219, when the turnover plate 202 is turned to the vertical state and located above the bearing plate 302, the bearing plate 302 moves upward and enters the groove 220, at this time, at least a part of the wafer is located in the clamping groove 303.

[0038] Specifically, as shown in Figure 2 、 Figures 7-8As shown, except for the bearing plate 302 closest to the storage frame 104, the side of the rest of the bearing plate 302 is provided with a horizontal plate 304, the horizontal plate 304 is respectively provided with a guide rod 305, the two ends of the guide rod 305 are installed on the connecting plate 306, the connecting plate 306 is installed on the support rod 301, the second spring 307 is sleeved on the guide rod 305, the two ends of the second spring 307 are respectively abutted to the horizontal plate 304 and the connecting plate 306 close to the storage frame 104, and always in a compressed state, the guide rod 305 is provided with a stop ring 308 for abutting to the horizontal plate 304, when the horizontal plate 304 contacts with the stop ring 308, at this time, the turnover plate 202 is moved above the bearing plate 302, which can ensure that the bearing plate 302 smoothly supports the wafer, then the turnover plate 202 is reset, and the bearing plate 302 farthest from the storage frame 104 is moved towards the storage frame, the bearing plate 302 will be in contact and be pushed towards the storage frame 104, at this time, the second spring 307 is compressed in sequence, until all the bearing plates 302 are in contact with each other, then the storage frame 104 is moved towards the center of the support frame 102 by a predetermined distance, so that the wafer is located in the storage frame 104, then the bearing plate 302 is moved downward, so that the wafer is transferred to the storage frame 104, then the storage frame 104 is reset, and the bearing plate 302 is moved upward to reset, and the external force applied to the bearing plate 302 is gradually released, and the bearing plate 302 will be reset under the action of the second spring 307.

[0039] More specifically, as shown in Figure 7 , except for the two bearing plates 302 closest to the storage frame 104, the side of the rest of the horizontal plate 304 is provided with a through hole for passing through the guide rod 305, to avoid interference when the bearing plate 302 moves.

[0040] Specifically, as shown in Figure 2 , Figure 7 , the support frame 102 is provided with a side plate 111 at both ends, the side plate 111 is provided with a vertical long hole 112, the support rod 301 passes through the long hole 112, which can limit the movement of the support rod 301, and is connected to the moving end of the second vertical lifting mechanism, the second vertical lifting mechanism is installed on the support frame 102, after the bearing plate 302 supports the wafer, the support rod 301 is driven downward by the second vertical lifting mechanism, so that the wafer is moved out of the area of the turnover plate 202, then the turnover plate 202 is reset, and then the support rod 301 is moved upward, so as to transfer the wafer to the storage frame 104.

[0041] Specifically, as shown in Figure 2 , Figure 7As shown, the outer side of the bearing plate 302 farthest from the storage frame 104 is provided with a push plate 311, the push plate 311 is L-shaped, and the upper end is arranged in the moving end of the third horizontal linear mechanism, the third horizontal linear mechanism is installed on the support frame 102, when the support rod 301 moves up and down, the push plate 311 and the moving end of the third horizontal linear mechanism slide relative to each other to avoid interference, when it is necessary to drive the bearing plate 302 to move along the axis of the support rod 301, the third horizontal linear mechanism is used to drive the push plate 311 to move towards the bearing plate 302, the push plate 311 contacts the bearing plate 302 and forces the bearing plate 302 to move, until all the bearing plates 302 contact each other, after the wafer is transferred into the storage frame 104, the push plate 311 is moved back, and the bearing plate 302 is also reset in sequence under the action of the second spring 307.

[0042] Specifically, as shown in Figure 2 、 Figure 7 In order to enable the wafer to be smoothly transferred to the bearing plate 302, two top rods 309 are arranged on one side of the bearing plate 302, and the top rods 309 are arranged on both sides of the support rod 301, the top rods 309 are installed on the base frame 310, and the base frame 310 is arranged to move in the vertical direction, for example, the base frame 310 is connected to the moving end of a vertical lifting mechanism, and the vertical lifting mechanism is installed on the support frame 102, when the turnover plate 202 is above the bearing plate 302, the top rod 309 is moved upwards, the upper end of the top rod 309 contacts the connecting rod 211, and the connecting rod 211 is forced to rotate upwards, the limiting rod 204 is moved upwards, and the limiting rod 204 no longer limits the side wall of the wafer, at this time, the bearing plate 302 is moved downwards, and the wafer can move synchronously with the bearing plate 302 under the action of its own gravity, then the top rod 309 is moved downwards to reset, the limiting rod 204 is automatically reset, then the turnover plate 202 is moved back to reset, and then the bearing plate 302 is moved upwards, and the subsequent wafer transfer operation can be performed.

[0043] For the movement of the storage frame 104, a U-shaped frame moving along the length direction of the support frame 102 can be arranged, the opening of the U-shaped frame faces the center of the support frame 102, and the storage frame 104 is placed in the U-shaped frame, and for the movement of the U-shaped frame, it only needs to be connected to the moving end of a horizontal moving mechanism.

[0044] The above is only the preferred embodiment of the present application, and is not used to limit the present application, and obviously, those skilled in the art can make various modifications and changes to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and changes of the present application belong to the scope of the claims of the present application and the equivalent technology, the present application also intends to include these modifications and changes.

Claims

1. A wafer transfer apparatus, characterized in that, include: The workbench (100) has a drying area and a temporary storage area on both sides of its top surface along its length. The temporary storage area has multiple through holes (101) arranged at intervals along its length, and a support frame (102) is provided on one side. A limiting ring (103) that moves vertically is provided in the through hole (101). A storage frame (104) that moves along its length is provided at one end of the support frame (102) for storing wafers. The flipping mechanism (200) includes a rotating plate (201) rotatably mounted in the support frame (102). The rotating plate (201) has multiple flipping plates (202) along its length on its side. The flipping plates (202) are rotatably arranged about themselves in a radial direction perpendicular to the rotating plate (201), and the end face is provided with a semi-circular retaining ring (203) for accommodating the wafer. The retaining ring (203) has two symmetrically arranged limiting rods (204) at both ends, which move towards each other along the circumference of the flipping plate (202) for limiting the sidewall of the wafer. The end of the limiting rod (204) is provided with a retaining plate (205) for limiting the end face of the wafer. In application, the flipping plate (202) is fitted in the limiting ring (103). The transfer mechanism (300) includes a support rod (301) disposed in the support frame (102) and movable in the vertical direction. The support rod (301) is provided with a plurality of carrier plates (302) movable along its axis. The carrier plate (302) is V-shaped and has a slot (303) at the top for receiving the wafer on the flip plate (202) and transferring it to the storage frame (104).

2. The wafer transfer apparatus according to claim 1, characterized in that, The rotating plate (202) has a rotating shaft (206) on its side. The rotating shaft (206) is rotatably installed in the rotating plate (201) and has a first driven gear (207) installed thereon. The first driven gear (207) meshes with a rack (208). Both ends of the rack (208) are inserted into the end plate (209). The end plate (209) is installed on the rotating plate (201). The bottom of the rack (208) is connected to the moving end of the first horizontal linear mechanism. The first horizontal linear mechanism is installed on the rotating plate (201) and arranged along its length.

3. The wafer transfer apparatus according to claim 2, characterized in that, The through hole (101) has a through groove (105) extending through to the side of the worktable (100), and the limiting ring (103) has a notch on its side, both of which are used to accommodate the rotating shaft (206).

4. The wafer transfer apparatus according to claim 1, characterized in that, The flip plate (202) has two symmetrically arranged arc-shaped holes (210) on its end face. The limiting rod (204) passes through the arc-shaped holes (210) and its lower end is installed on the connecting rod (211). One end of the connecting rod (211) is rotatably installed on the connecting shaft (212) and sleeved on the arc-shaped rod (213). The connecting shaft (212) is installed at the center of the flip plate (202). One end of the arc-shaped rod (213) is installed on the base plate (214). The base plate (214) is installed on the flip plate (202). A first spring (215) is sleeved on the arc-shaped rod (213). The two ends of the first spring (215) abut against the connecting rod (211) and the base plate (214) respectively and are always in a compressed state. The other end of the arc-shaped rod (213) is provided with a baffle (216) for abutting against the connecting rod (211). The limiting rod (204) is equipped with a second driven gear (217), which meshes with a toothed plate (218). The toothed plate (218) is arc-shaped and is mounted on the flip plate (202).

5. The wafer transfer apparatus according to claim 4, characterized in that, The bottom of each limiting ring (103) is mounted on a lifting frame (106). The lifting frame (106) is connected to the moving end of the first vertical lifting mechanism. The first vertical lifting mechanism is mounted on the worktable (100). The lifting frame (106) is provided with a crossbar (107) arranged along its length. A movable frame (108) is sleeved on the crossbar (107). The movable frame (108) is connected to the moving end of the second horizontal linear mechanism. The second horizontal linear mechanism is mounted on the lifting frame (106). Two symmetrically arranged push rods (109) are provided below each through hole (101). The push rods (109) are mounted on the movable frame (108) and are used to push the connecting rod (211).

6. The wafer transfer apparatus according to claim 1, characterized in that, The flip plate (202) has a recess (219) on the side away from the retaining ring (203), and the inner wall of the limiting ring (103) has a protrusion (110). The protrusion (110) is arc-shaped and has the same inner diameter as the retaining ring (203). When in use, the protrusion (110) fits into the recess (219).

7. The wafer transfer apparatus according to claim 6, characterized in that, The recess (219) has two grooves (220) on its sidewall for passing through the support plate (302).

8. The wafer transfer apparatus according to claim 1, characterized in that, Except for the support plate (302) closest to the storage frame (104), the other support plates (302) are provided with horizontal plates (304) on their sides. Each horizontal plate (304) is provided with a guide rod (305). Both ends of the guide rod (305) are installed on the connecting plate (306). The connecting plate (306) is installed on the support rod (301). Each guide rod (305) is provided with a second spring (307). The two ends of the second spring (307) abut against the horizontal plate (304) and the connecting plate (306) near the storage frame (104) respectively, and are always in a compressed state. The guide rod (305) is provided with a retaining ring (308) for abutting against the horizontal plate (304). A push plate (311) is provided on the outer side of the bearing plate (302) furthest from the storage frame (104). The push plate (311) is L-shaped and its upper end passes through the moving end of the third horizontal linear mechanism, which is installed on the support frame (102).

9. The wafer transfer apparatus according to claim 1, characterized in that, The support frame (102) has side plates (111) at both ends. The side plates (111) have vertically arranged elongated holes (112) on their sides. The support rod (301) passes through the elongated holes (112) and is connected to the moving end of the second vertical lifting mechanism. The second vertical lifting mechanism is installed on the support frame (102).

10. The wafer transfer apparatus according to claim 4, characterized in that, Two top rods (309) are provided on one side of the bearing plate (302) respectively located on both sides of the support rod (301). When in use, the upper end of the top rod (309) contacts the connecting rod (211). The top rod (309) is installed on the base frame (310), and the base frame (310) is moved in the vertical direction.

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