Wafer processing apparatus integrating gripping and flipping functions

Abstract

The application relates to the technical field of wafer processing devices, in particular to a wafer processing device integrating wafer grabbing and overturning functions, wherein a support frame is connected to the side of a fixed base away from the end of a mechanical arm; a wafer grabbing component comprises clamping arms and a clamping head, a clamping space for clamping a wafer is formed between the two clamping arms, and the clamping head is arranged on the side of the clamping arms facing the clamping space; a rotary driving mechanism comprises a permanent magnet rotor, an electromagnetic stator and a magnetic suspension controller, the permanent magnet rotor is fixedly connected with an overturning carrier, the electromagnetic stator is arranged in the support frame, the magnetic suspension controller is arranged in the fixed base, and the magnetic suspension controller is configured to control the generation of a radial air gap between the permanent magnet rotor and the electromagnetic stator, so that the permanent magnet rotor rotates relative to the electromagnetic stator with the overturning carrier. The wafer grabbing component and the rotary driving mechanism based on the magnetic suspension controller are integrated, and the synchronous completion of the wafer grabbing and overturning functions is realized.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, and in particular to a wafer processing device that integrates gripping and flipping functions. Background Technology

[0002] In semiconductor manufacturing, wafers need to be frequently transferred between different process chambers or workstations, and due to process requirements (such as double-sided operation, double-sided inspection, bonding operations, etc.), they often need to be flipped at 180° or a specific angle. However, in traditional technology, wafer gripping and flipping are usually completed by two separate sets of equipment: first, the wafer is gripped by a vacuum chuck or mechanical gripper and translated to the target position, and then flipped by an independent flipping mechanism (such as a rotary motor and a fixture). This step-by-step operation has the following significant drawbacks: First, it is inefficient, as gripping and flipping require two sets of equipment working together, which not only increases the number of process steps but also significantly increases the space occupied by the equipment. Second, it carries a high risk of damage. During discrete operations, the wafer needs to be removed from the fixed support multiple times (e.g., from the gripping fingers to the flipping fixture), making the wafer susceptible to edge damage or breakage due to positioning deviations, especially for thin wafers (thickness ≤150μm). Third, it lacks precision. The position and angle of the wafer after flipping are prone to cumulative errors due to multiple transfers, which directly affects the alignment accuracy of subsequent processes; for example, photolithography alignment marks may shift. Finally, it has poor adaptability. Traditional grippers or chucks can usually only achieve single-plane gripping (e.g., front-side adsorption) and cannot be compatible with some flipping scenarios with special process requirements, such as situations where the back of the wafer needs to be attached to the support surface. To solve the above problems, this invention proposes a wafer processing device that integrates gripping and flipping functions. Summary of the Invention

[0003] To address the aforementioned problems, the present invention aims to provide a wafer processing device that integrates gripping and flipping functions, by integrating a wafer gripping component with a rotation drive mechanism based on a magnetic levitation controller, thereby enabling the simultaneous completion of wafer gripping and flipping functions.

[0004] To achieve the above objectives, the present invention provides a wafer processing apparatus integrating gripping and flipping functions, comprising:

[0005] A fixed base is connected to the end of the robotic arm, and a support frame is connected to the side opposite to the end of the robotic arm;

[0006] A flip-up support is located on the side of the fixed base facing away from the end of the robotic arm;

[0007] A wafer gripping component includes gripping arms and gripping heads. Two gripping arms are provided and disposed on the flipping support. A gripping space for gripping the wafer is formed between the two gripping arms. The gripping heads are disposed on the side of the gripping arms facing the gripping space. The two gripping arms move closer or further away along the radial direction of the flipping support to allow the gripping heads to grip or release the wafer.

[0008] A rotary drive mechanism is disposed between the fixed base and the flipping support member. The rotary drive mechanism includes a permanent magnet rotor, an electromagnetic stator, and a magnetic levitation controller. The permanent magnet rotor is rotatably disposed on the side of the support frame away from the fixed base, and one end of the permanent magnet rotor located outside the support frame is fixedly connected to the flipping support member. The electromagnetic stator is disposed inside the support frame and coaxially covers the permanent magnet rotor located inside the support frame. The magnetic levitation controller is disposed inside the fixed base and connected to the electromagnetic stator. The magnetic levitation controller is configured to control the generation of a radial air gap between the permanent magnet rotor and the electromagnetic stator, so that the permanent magnet rotor carries the flipping support member and rotates relative to the electromagnetic stator.

[0009] Optionally, the wafer processing device integrating gripping and flipping functions further includes a rotating part disposed on the support frame, the rotating part comprising:

[0010] A fixing seat is fixedly disposed on the side of the support frame away from the fixing base;

[0011] A support ring is sleeved on the outside of the permanent magnet rotor, and one end of the support ring is fixedly inserted into the fixed base;

[0012] A sealing ring is fitted over the permanent magnet rotor and positioned between the permanent magnet rotor and the support ring. An annular groove is recessed on the inner wall of the support ring, and the sealing ring is embedded in the annular groove. The sealing ring, the support ring, and the permanent magnet rotor are coaxially arranged.

[0013] Optionally, the electromagnetic stator includes:

[0014] A stator core is disposed within the support frame. The stator core has a cylindrical structure. A plurality of stator slots are uniformly arranged on the inner ring wall of the stator core. The plurality of stator slots are arranged sequentially along the axial direction of the stator core. The slot cavity of the stator slot has a ring structure.

[0015] An insulating frame is disposed in the stator slot, and at least three insulating frames are disposed in the same stator slot, with the three insulating frames being distributed at equal intervals along the circumference of the stator slot;

[0016] A coil is embedded in the insulating frame. The number of coils is set to a certain number. The number of insulating frames in the same stator slot is matched with the number of coils. There is an electrical angle difference between two adjacent coils in the same stator slot.

[0017] Optionally, the wafer processing apparatus integrating gripping and flipping functions further includes an elastic element disposed between the gripping head and the gripping arm, the gripping head and the gripping arm being connected by the elastic element, and the elastic element extending or shortening along the axial direction of the elastic element to allow the gripping head to move away from or towards the gripping arm relative to the gripping arm.

[0018] Optionally, each clamping arm is provided with a plurality of clamping heads, and the plurality of clamping heads are arranged at equal intervals along the extension direction of the clamping arm.

[0019] Optionally, the wafer gripping component further includes a driving assembly, the driving assembly comprising:

[0020] A first driver is disposed on the flipping support member, and the first driver has two opposing driving ends;

[0021] A connector is slidably disposed on the flipping support. Two connectors are provided and are fixedly connected to the two clamping arms one to one. The driving end of the first driver is connected to the connector so as to drive the two clamping arms to move closer or further away through the first driver and the connector.

[0022] Optionally, the wafer processing apparatus integrating gripping and flipping functions further includes a fixing link disposed between the fixed base and the flipping carrier, the fixing link comprising:

[0023] A first annular component is disposed on the fixed base, and the first annular component covers the outside of the support frame;

[0024] The second annular component is disposed on the flipping support component, and the second annular component is coaxially disposed outside the first annular component and the permanent magnet rotor;

[0025] A support shaft is provided between the first annular component and the second annular component, and the first annular component and the second annular component are rotatably connected through the support shaft.

[0026] Optionally, the fixed link further includes a sealing member disposed between the first annular member and the second annular member, the sealing member being sleeved on the outside of the first annular member, and the sealing member slidingly abutting against the side of the second annular member that is close to each other.

[0027] Optionally, the wafer processing apparatus integrating gripping and flipping functions further includes:

[0028] A first position feedback element is disposed on the permanent magnet rotor and / or the electromagnetic stator to collect the rotation angle signal of the permanent magnet rotor in real time.

[0029] The controller communicates or is electrically connected to the first position feedback element and the magnetic levitation controller to control the magnetic levitation controller based on the rotation angle signal fed back by the first position feedback element, so as to further control the rotation angle of the permanent magnet rotor.

[0030] Optionally, the wafer processing apparatus integrating gripping and flipping functions further includes:

[0031] A second position feedback element is disposed on the clamping head or between the clamping head and the clamping arm. The second position feedback element is used to collect the clamping force signal when the clamping head clamps the wafer in real time. The second position feedback element is communicatively or electrically connected to the first driver and the controller so that after the controller receives the clamping force signal fed back by the second position feedback element, it controls the first driver to adjust the clamping force of the clamping head on the wafer.

[0032] Optionally, the wafer processing apparatus integrating gripping and flipping functions further includes a vacuum gripping component disposed on the flipping carrier, the vacuum gripping component comprising:

[0033] Vacuum suction holes are provided on the wafer bearing surface of the flipping carrier. The number of vacuum suction holes is set to several, and the several vacuum suction holes are arranged in multiple concentric rings or in a matrix on the wafer bearing surface.

[0034] The gas channel has one end connected to the vacuum suction port and the other end connected to an external vacuum generator.

[0035] Optionally, the rotation angle of the flipping support is between 0° and 360°.

[0036] Optionally, the flipping support is a circular or square plate structure, and the surface roughness of the flipping support is less than or equal to 1.6 μm.

[0037] Optionally, the wafer processing apparatus integrating gripping and flipping functions further includes a mechanical limiting component, the mechanical limiting component comprising:

[0038] A limiting block is disposed on the outer ring wall of the first annular component;

[0039] A plurality of limiting pins are provided, and the plurality of limiting pins are arranged along the circumference of the second annular member and are movably disposed on the inner annular wall of the second annular member. The limiting pins and the limiting blocks are disposed on the same radial surface of the second annular member.

[0040] The second actuator is provided in a plurality of manner, and the driving ends of the plurality of second actuators are connected one-to-one with the plurality of limiting pins. The second actuator drives the limiting pins to extend or shorten relative to the second annular member. When the limiting pin is in the extended state, the distance between the end of the limiting pin away from the inner annular wall of the second annular member and the inner annular wall of the second annular member is greater than the distance between the end of the limiting block away from the outer annular wall of the first annular member and the inner annular wall of the second annular member. When the limiting pin is in the shortened state, the distance between the end of the limiting pin away from the inner annular wall of the second annular member and the inner annular wall of the second annular member is less than the distance between the end of the limiting block away from the outer annular wall of the first annular member and the inner annular wall of the second annular member.

[0041] Optionally, the mechanical limiting component further includes:

[0042] A signal transmitter is disposed on the outer side wall of the first annular component, and the transmitting end of the signal transmitter faces the limiting pin;

[0043] A signal receiver is disposed on the inner sidewall of the second annular component. The number of signal receivers is set to a certain number, and the signal receivers are respectively configured in one-to-one correspondence with the limit pins and the second drivers that drive the limit pins. Each signal receiver serves as a pre-detection point for the limit pin it is configured with, and is located upstream of the rotational movement trajectory of the limit pin it is configured with. The receiving end of the signal receiver faces the signal transmitter to collect the signal emitted by the signal transmitter.

[0044] The controller is communicatively or electrically connected to the signal receiver and the second driver respectively. After receiving the signal fed back by the signal receiver, the controller controls the second driver configured corresponding to the signal receiver to drive the limit pin to perform an extension or shortening movement.

[0045] Optionally, the mechanical limiting component further includes:

[0046] The second gear ring is sleeved on the outside of the permanent magnet rotor. The second gear ring is coaxially rotatably disposed on the end of the first ring member away from the fixed base. The second gear ring is connected to the limiting block.

[0047] The first gear ring meshes with the second gear ring;

[0048] A third actuator is disposed on the first annular component or the fixed base. The driving end of the third actuator is connected to the first gear ring so that by driving the first gear ring to rotate, the second gear ring drives the limiting block to rotate on the outer ring wall of the first annular component.

[0049] Optionally, the mechanical limiting component further includes:

[0050] A buffer pad is fitted over the limiting pin, or is provided on the side of the limiting block facing the limiting pin when it abuts the limiting pin.

[0051] The beneficial effects of this invention are as follows:

[0052] This invention integrates a wafer gripping component with a rotation drive mechanism based on a magnetic levitation controller, enabling the simultaneous completion of wafer gripping and flipping functions. It effectively solves the problems of cumbersome processes, low efficiency, easy damage to wafers due to multiple transfers, and poor positioning accuracy that exist in traditional discrete equipment. It significantly improves the operational efficiency and safety of wafer processing, and is especially suitable for fine operations on thin wafers. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the structure of the wafer processing device integrating gripping and flipping functions in an embodiment of the present invention;

[0054] Figure 2 for Figure 1 Enlarged structural diagram of structure A in the middle;

[0055] Figure 3 for Figure 1 A magnified schematic diagram of the B-structure;

[0056] Figure 4 This is a schematic diagram of the structure of the wafer processing device integrating gripping and flipping functions in an embodiment of the present invention, in which the signal transmitter and signal receiver are respectively disposed on the first ring component and the second ring component;

[0057] Figure 5 for Figure 2 A magnified schematic diagram of the C-structure.

[0058] Explanation of reference numerals in the attached figures:

[0059] 1. Fixed base; 2. Support frame; 3. Tilting bearing component; 4. Permanent magnet rotor; 5. Electromagnetic stator; 51. Stator core; 52. Stator slot; 53. Insulating frame; 54. Coil; 6. Clamping arm; 7. Clamping head; 8. Magnetic levitation controller; 9. Fixed base; 10. Support ring; 11. Sealing ring; 12. Elastic component; 13. First driver; 14. Drive end; 15. Connector; 16. First annular component; 17. Second annular component; 18. Support shaft; 19. Sealing component; 20. First position feedback component; 21. Second position feedback component; 22. Vacuum suction hole; 23. Limiting block; 24. Limiting pin; 25. Second driver; 26. Signal transmitter; 27. Signal receiver; 28. Second gear ring; 29. ​​First gear ring; 30. Third driver. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.

[0061] To address the problems existing in the prior art, embodiments of the present invention provide a wafer processing apparatus that integrates gripping and flipping functions, such as... Figure 1 and Figure 2 As shown, the device includes a fixed base 1, a flipping carrier 3, a wafer gripping component, and a rotary drive mechanism. This embodiment integrates the fixed base 1, the flipping carrier 3, the wafer gripping component, and the rotary drive mechanism into a compact whole. After the device is connected to the robotic arm via the fixed base 1, the wafer can be gripped by the wafer gripping component at the same workstation without transferring the wafer. The rotary drive mechanism then drives the flipping carrier 3 to precisely flip the wafer, which greatly simplifies the operation process, shortens the process time, and fundamentally avoids possible bumps, scratches, or positioning errors that may occur during multiple clamping and transfer of the wafer. This significantly improves the efficiency, safety, and positioning accuracy of wafer processing.

[0062] In one embodiment, such as Figure 1As shown, the fixed base 1 is connected to the end of the robotic arm, and a support frame 2 is connected to the side opposite to the end of the robotic arm. In this embodiment, the support frame 2 provides a high-rigidity and stable support structure for the fixed base 1, which not only ensures the stability of the connection with the end of the robotic arm and can accurately transmit the movement of the robotic arm to the entire device, but also provides sufficient and regular installation positions for components such as the electromagnetic stator 5 of the rotary drive mechanism. At the same time, it helps to disperse the torque and stress borne by the device during the gripping and flipping of the wafer, thereby ensuring the overall stability and accuracy of the operation.

[0063] In one embodiment, the support frame 2 may be a rectangular ring structure, a cylindrical structure, a rectangular tubular structure, or a circular tube structure.

[0064] In one embodiment, such as Figure 1 As shown, the flipping support 3 is located on the side of the fixed base 1 facing away from the end of the robotic arm (in Figure 1 In the embodiment, it can be understood as the left side).

[0065] In one embodiment, such as Figure 1 As shown, the flipping support 3 is a circular or square plate structure, and the surface roughness of the flipping support 3 is less than or equal to 1.6 μm. In this embodiment, the circular or square plate structure gives the flipping support 3 a regular and stable bearing surface, which can uniformly support the wafer and adapt to different process requirements. At the same time, controlling the surface roughness to within 1.6 μm can greatly reduce contact damage with the back of the wafer, effectively avoiding scratches or particle contamination. This ensures the surface quality of the wafer during gripping, flipping, and placement, and also provides a good sealing foundation for possible integrated functions such as vacuum adsorption.

[0066] In one embodiment, such as Figure 1 As shown, the wafer gripping component includes clamping arms 6 and clamping heads 7. Two clamping arms 6 are provided and mounted on the flipping support 3, forming a clamping space (not shown) between the two clamping arms 6. The clamping heads 7 are located on the side of the clamping arms 6 facing the clamping space. This embodiment achieves a deep structural integration of the wafer gripping component and the flipping function by directly mounting two clamping arms 6 with clamping heads 7 on the flipping support 3 and forming an adjustable clamping space. The clamping heads 7 act directly on the wafer edge from the radially inner side, enabling stable and precise clamping. This ensures that the wafer remains firmly fixed and accurately positioned when rotating or flipping with the flipping support 3, effectively preventing slippage or displacement of the wafer during dynamic processes and improving the reliability and safety of the entire processing.

[0067] In one embodiment, such as Figure 1 As shown, the two clamping arms 6 move closer or further away in the radial direction of the flipping support 3 to clamp or release the wafer with the clamping head 7. This embodiment enables safe, efficient, and non-destructive clamping of the wafer. By making the two clamping arms 6 move synchronously towards or away from each other in the radial direction of the flipping support 3, the diameter of wafers of different sizes can be precisely adapted, and uniform and controllable clamping force can be applied from both sides of their edges. This radial clamping method not only firmly fixes the wafer and prevents it from slipping or shaking during high-speed rotation or flipping, ensuring the stability of the process, but also enables rapid wafer loading and unloading by controlling the release of the clamping force, greatly improving the automation level and production efficiency of the operation.

[0068] In one embodiment, such as Figure 1 As shown, the rotary drive mechanism is located between the fixed base 1 and the tilting support 3. This embodiment is equivalent to constructing an integrated power and transmission hub between the fixed end of the robotic arm (connected via the fixed base 1) and the tilting support 3 that needs to perform the action. This makes the drive source (rotary drive mechanism) close to the action actuator (tilting support 3), resulting in the shortest and most direct power transmission path, thereby significantly improving transmission efficiency and the response speed and control accuracy of the tilting motion. At the same time, this compact "sandwich" layout optimizes the overall structure of the device, reduces unnecessary space occupation, and brings the center of gravity of the equipment closer to the robotic arm, improving the stability and rigidity during operation.

[0069] In one embodiment, such as Figure 1 As shown, the rotary drive mechanism includes a permanent magnet rotor 4, an electromagnetic stator 5, and a magnetic levitation controller 8.

[0070] In one embodiment, such as Figure 1 As shown, the permanent magnet rotor 4 is rotatably mounted on the side of the support frame 2 away from the fixed base 1 (in... Figure 1 In this embodiment, the permanent magnet rotor 4 (which can be understood as the left end) extends one end of the permanent magnet rotor 4 (which can be understood as the left end) to the outside of the support frame 2 and is directly fixedly connected to the flipping support 3, forming a highly efficient cantilever beam drive structure. This layout allows the permanent magnet rotor 4 to act as a direct drive shaft, transmitting the torque generated by the rotary drive mechanism to the flipping support 3 with almost no loss, resulting in a simple and efficient power transmission path. At the same time, the support frame 2 provides stable support for the rotation of the permanent magnet rotor 4 and spatially isolates the drive unit (such as the internal electromagnetic stator 5) from the working unit (flipping support 3 and wafer), protecting the precision drive components from external contamination and making the overall structure more compact, which is beneficial for the miniaturization and integration of the device.

[0071] In one embodiment, such as Figure 1 As shown, the electromagnetic stator 5 is housed within the support frame 2 and coaxially encloses the permanent magnet rotor 4 located within the support frame 2. This embodiment coaxially encloses the electromagnetic stator 5 outside the permanent magnet rotor 4 and accommodates it within the support frame 2, forming a stable and efficient electromagnetic drive core. This "outer stator, inner rotor" structure ensures the uniformity and symmetry of the electromagnetic field, providing a smooth and precise rotational driving force for the permanent magnet rotor 4. Simultaneously, the support frame 2 not only provides a robust mounting foundation and positioning accuracy for the electromagnetic stator 5 but also protects the internal precision electrical components from external mechanical impacts and environmental pollution, thereby significantly improving the reliability, control accuracy, and service life of the entire rotary drive mechanism. Furthermore, it allows the tilting support 3 to achieve ±0.01° angle control without contact.

[0072] In one embodiment, such as Figure 1 As shown, the magnetic levitation controller 8 is located within the fixed base 1 and connected to the electromagnetic stator 5. The magnetic levitation controller 8 is configured to control the generation of a radial air gap between the permanent magnet rotor 4 and the electromagnetic stator 5, so that the permanent magnet rotor 4, carrying the flipping support 3, rotates relative to the electromagnetic stator 5. This embodiment integrates the magnetic levitation controller 8 inside the fixed base 1 and directly controls the electromagnetic stator 5, enabling precise maintenance of the radial air gap between the permanent magnet rotor 4 and the electromagnetic stator 5 through active electromagnetic force. This non-contact magnetic levitation drive method fundamentally eliminates mechanical friction and wear, achieving not only high precision, high stability, and rapid response in the rotation process, but also significantly reducing the risk of particulate matter generation and greatly extending equipment life. It is particularly suitable for wafer processing scenarios with extremely high requirements for cleanliness and motion control precision.

[0073] In one embodiment, the radial air gap can specifically be 0.3~1.0 mm.

[0074] In one embodiment, such as Figure 2As shown, the wafer processing device integrating gripping and flipping functions also includes a rotating part disposed on the support frame 2. The rotating part includes a fixed base 9 and a support ring 10. The fixed base 9 is fixedly disposed on the side of the support frame 2 away from the fixed base 1. The support ring 10 is sleeved on the permanent magnet rotor 4, and one end of the support ring 10 is fixedly inserted into the fixed base 9. In this embodiment, the fixed base 9 and the support ring 10 constitute an independent and stable rotating support unit. The fixed base 9 rigidly connects the rotating part to the edge of the support frame 2, ensuring the stability of the support. The support ring 10 serves as a precision bearing seat for the permanent magnet rotor 4, providing precise radial positioning and reliable circumferential constraint for its rotation, effectively suppressing the radial runout and vibration of the permanent magnet rotor 4, thereby ensuring the stability and positional accuracy of the flipping carrier 3 and the wafer during the rotation process. At the same time, it evenly distributes the load of the rotating drive mechanism to the support frame 2, enhancing the rigidity of the overall structure.

[0075] In one embodiment, such as Figure 2 As shown, the rotating part also includes a sealing ring 11, which is sleeved on the permanent magnet rotor 4 and located between the permanent magnet rotor 4 and the support ring 10. An annular groove is recessed on the inner wall of the support ring 10, and the sealing ring 11 is embedded within this annular groove. The sealing ring 11, the support ring 10, and the permanent magnet rotor 4 are coaxially arranged. This embodiment, by embedding the sealing ring 11 within the annular groove of the support ring 10 and ensuring its tight coaxial fit with the permanent magnet rotor 4, forms an effective dynamic sealing barrier between the support ring 10 and the rotor. This barrier can support the smooth rotation of the flipping support 3 with extremely low friction, and effectively isolate particulate contaminants from the external environment from entering the precision drive components (such as the electromagnetic stator 5) inside the device. It also prevents potentially generated wear particles from escaping and contaminating the wafer, thereby significantly improving the cleanliness and long-term operational reliability of the device while ensuring smooth rotation.

[0076] In one embodiment, such as Figure 2 As shown, the electromagnetic stator 5 includes a stator core 51, an insulating frame 53, and a coil 54.

[0077] In one embodiment, such as Figure 2As shown, the stator core 51 is disposed within the support frame 2. The stator core 51 has a cylindrical structure, and a plurality of stator slots 52 are uniformly arranged on the inner ring wall of the stator core 51. The plurality of stator slots 52 are arranged sequentially along the axial direction of the stator core 51, and the slot cavity of the stator slot 52 has an annular structure. In this embodiment, the cylindrical stator core 51, the support frame 2, and the permanent magnet rotor 4 form a coaxial layout, ensuring the symmetry and efficiency of the magnetic circuit distribution. The annular stator slots 52 arranged sequentially along the axial direction on its inner ring wall provide a regular and sufficient space for the electromagnetic coil 54, so that the magnetic field can be generated uniformly along the circumferential direction, thereby providing a stable and uniform torque rotational driving force for the permanent magnet rotor 4, effectively reducing torque fluctuations and improving the control accuracy and stability of the tumbling motion.

[0078] In one embodiment, such as Figure 2 As shown, the insulating frame 53 is disposed in the stator slot 52, and at least three insulating frames 53 are disposed in the same stator slot 52. The three insulating frames 53 are distributed at equal intervals along the circumference of the stator slot 52. In this embodiment, at least three insulating frames 53 are distributed in a ring at equal intervals in the same annular stator slot 52, which can divide the coil 54 into multiple symmetrical units, making the electromagnetic field more uniformly distributed in the circumferential direction of the inner ring wall of the stator core 51. This effectively improves the sinusoidal nature of the magnetic field, reduces torque pulsation, and thus provides a more stable and precise rotational driving force for the permanent magnet rotor 4, significantly improving the control accuracy and operational stability of the wafer flipping process.

[0079] In one embodiment, such as Figure 2 As shown, the coil 54 is embedded within the insulating frame 53. Several coils 54 are arranged in sequence. The number of insulating frames 53 within the same stator slot 52 matches the number of coils 54, and there is an electrical angle difference between adjacent coils 54 within the same stator slot 52. This embodiment achieves a regular winding arrangement and reliable insulation by precisely embedding the coils 54 within the insulating frame 53 and ensuring that their number matches the number of insulating frames 53. Simultaneously, by generating a specific electrical angle difference between adjacent coils 54 within the same annular stator slot 52, the magnetic field distribution can be optimized, synthesizing a smoother and more continuous rotating magnetic field. This significantly reduces torque pulsation during the driving of the permanent magnet rotor 4, improves the smoothness and control precision of the flipping motion, and ensures the stability of the wafer during high-speed rotation.

[0080] In one embodiment, such as Figure 3As shown, the wafer processing device integrating gripping and flipping functions also includes an elastic element 12 disposed between the gripping head 7 and the gripping arm 6. The gripping head 7 and the gripping arm 6 are connected by the elastic element 12, and the elastic element 12 can extend or shorten along its axial direction to allow the gripping head 7 to move away from or closer to the gripping arm 6. This embodiment, by adding an elastic element 12 between the gripping head 7 and the gripping arm 6, allows the position of the gripping head 7 relative to the gripping arm 6 to have a certain elastic strain capability. This enables it to automatically compensate for minor unevenness or positional deviations on the wafer surface when gripping the wafer, thereby transforming rigid gripping force into flexible buffer contact. This effectively avoids crushing or scratching the wafer edges due to localized stress concentration, significantly improving operational safety and wafer protection while ensuring gripping stability. Meanwhile, the presence of the elastic element 12 can also reduce the initial clamping force required to overcome wafer orientation deviations by its own buffering effect, while ensuring reliable clamping. This reduces the output torque requirement of the clamping arm 6 drive component, which helps to miniaturize and save energy of the drive component, and further reduces the risk of wafer microcracks or damage caused by over-clamping, thus comprehensively improving the overall performance and reliability of the device.

[0081] In one embodiment, the elastic element 12 can be a helical spring, a disc spring, a polyurethane elastomer, or a rubber component; wherein the helical spring can provide a stable linear buffering force, the disc spring is suitable for scenarios with compact space and requiring large damping, while the polyurethane elastomer or rubber component can simultaneously achieve buffering, vibration reduction, and adapt to multi-dimensional fine adjustment, thereby flexibly selecting according to specific working conditions, ensuring both the compliance and accuracy of clamping, and enhancing the ability to protect the wafer from damage.

[0082] In one embodiment, the clamping head 7 can be made of engineering plastics such as polyetheretherketone (PEEK), high-strength engineering ceramics, or elastic materials such as polyurethane or silicone. PEEK and engineering ceramics have high hardness, low wear, and cleanliness resistance, making them suitable for high-precision positioning scenarios. Polyurethane or silicone, on the other hand, provides excellent elasticity and a high coefficient of friction, achieving smooth contact while enhancing clamping stability and effectively preventing scratches on wafer edges or particulate contamination. This balances the reliability of clamping with the surface protection requirements of the wafer.

[0083] In one embodiment, the clamping arm 6 can be straight, L-shaped, or arc-shaped; the straight arm type is simple in structure and easy to control, and is suitable for linear push-pull clamping; the L-shaped clamping arm 6 can adapt to a specific spatial layout or achieve a specific angle adjustment of the clamping head 7 through its bending part; while the arc-shaped clamping arm 6 can better fit the curvature of the wafer edge, making the clamping force distribution more uniform, thereby improving the stability of clamping and the adaptability to the wafer under complex working conditions.

[0084] In one embodiment, such as Figure 1 As shown, each clamping arm 6 is provided with a plurality of clamping heads 7, and the plurality of clamping heads 7 are arranged at equal intervals along the extension direction of the clamping arm 6. In this embodiment, by arranging multiple clamping heads 7 at equal intervals along the extension direction of a single clamping arm 6, the clamping force can be distributed to multiple contact points on the edge of the wafer, effectively avoiding stress concentration or wafer warping deformation that may be caused by concentrated force at a single point; this multi-point uniform clamping method significantly improves the stability and balance of clamping, ensuring that the wafer maintains a stable posture during gripping, moving and high-speed flipping, preventing displacement or slippage, thereby greatly enhancing the reliability and safety of operation.

[0085] In the above embodiments, the extension direction of the clamping arm 6 can be understood as the direction in which the clamping arm 6 extends from the end of the clamping arm 6 near the support frame 2 toward the end of the clamping arm 6 away from the support frame 2, that is, the length direction of the clamping arm 6; this direction is usually parallel to the diameter direction or chord direction of the wafer, thereby ensuring that multiple clamping heads 7 can be evenly arranged along the arc or straight line segment of the wafer edge to achieve a stable and reliable clamping effect.

[0086] In one embodiment, such as Figure 1 As shown, the wafer gripping component further includes a driving assembly, which includes a first driver 13 and a connector 15.

[0087] In one embodiment, such as Figure 1 As shown, the first driver 13 is disposed on the flip carrier 3, and the first driver 13 has two opposing drive ends 14. In this embodiment, the first driver 13 is directly disposed on the flip carrier 3 and has two drive ends 14 with relative movement. It can synchronously and directly control the two clamping arms 6 to move towards or away from each other through a single drive source. This not only simplifies the transmission structure and reduces the complexity and space occupation of the mechanism, but also ensures the synchronicity and symmetry of the movement of the two clamping arms 6, thereby realizing fast, accurate and center-aligned clamping and release of the wafer, effectively avoiding wafer position shift or uneven clamping force caused by asynchronous movement.

[0088] In one embodiment, the first driver 13 can be a dual-axis motor, a dual-head cylinder, or a linear motor module; wherein the dual-axis motor can provide precise servo control to achieve high-precision adjustment of clamping force, the dual-head cylinder has a compact structure and rapid response, and is suitable for scenarios with high speed requirements, while the linear motor module can achieve contactless drive and avoid particulate contamination, thereby flexibly selecting the drive method according to different precision, speed and cleanliness requirements, and optimizing the performance and reliability of wafer clamping.

[0089] In one embodiment, such as Figure 1As shown, the connector 15 is slidably disposed on the flip-up support 3. Two connectors 15 are provided and fixedly connected to the two clamping arms 6 one-to-one. The driving end 14 of the first driver 13 is connected to the connector 15, so that the two clamping arms 6 can be driven to move closer or further away through the first driver 13 and the connector 15. In this embodiment, the two slidable connectors 15 directly and synchronously transmit the linear motion of the two driving ends 14 of the first driver 13 to the corresponding clamping arms 6, efficiently converting the concentrated output of the first driver 13 into precise radial opening and closing movements of the clamping arms 6. This not only simplifies the transmission chain and improves response speed and positioning accuracy, but also ensures the symmetry and stability of the clamping forces on both sides, thereby achieving fast, stable, and centered reliable clamping of the wafer.

[0090] In one embodiment, the connector 15 can be a slider, a linkage, or a flexible hinge mechanism; wherein the slider cooperates with the linear guide rail to achieve high-precision linear displacement transmission, the linkage mechanism can flexibly adapt to the layout space and amplify the drive stroke, and the flexible hinge can achieve gapless and frictionless motion conversion, thereby providing stable and reliable motion transmission for the clamping arm 6 according to different precision, rigidity and cleanliness requirements, ensuring the accuracy and smoothness of the wafer clamping process.

[0091] In one embodiment, the drive assembly further includes a reducer and an angle sensor. The reducer can increase the output torque and improve the motion resolution, ensuring that the clamping arm 6 can smoothly apply a precise clamping force. The angle sensor provides real-time feedback on the opening and closing angle of the clamping arm 6, forming a position closed loop with the controller. This enables automatic identification of the wafer diameter and precise positioning of the clamping point, further improving the adaptability and operational accuracy of the clamping process.

[0092] In one embodiment, such as Figure 1 As shown, the wafer processing device integrating gripping and flipping functions further includes a fixed connecting member disposed between the fixed base 1 and the flipping support 3. The fixed connecting member includes a first annular member 16, a second annular member 17, and a support shaft 18. The first annular member 16 is disposed on the fixed base 1 and covers the support frame 2. The second annular member 17 is disposed on the flipping support 3 and coaxially covers the first annular member 16 and the permanent magnet rotor 4. The support shaft 18 is disposed between the first annular member 16 and the second annular member 17, and the first annular member 16 and the second annular member 17 are rotatably connected through the support shaft 18.

[0093] In this embodiment, the first annular component 16 and the second annular component 17 are nested together and connected by a support shaft 18, thus constructing a stable and highly coaxial rotary support structure between the fixed base 1 and the flipping bearing component 3. This structure can not only reliably withstand the overturning torque generated by the flipping bearing component 3 and the wafer, ensuring the smoothness of the rotation process, but also surround the core drive components such as the permanent magnet rotor 4, forming an effective physical protection and cleanliness barrier. At the same time, its compact nested design optimizes the utilization of axial space and enhances the rigidity and integration of the overall structure.

[0094] In one embodiment, such as Figure 1 As shown, the fixed connection also includes a sealing member 19 disposed between the first annular member 16 and the second annular member 17. The sealing member 19 is sleeved on the outside of the first annular member 16, and the sealing member 19 slides against the side of the second annular member 17 that is close to each other. This embodiment provides a sliding sealing member 19 between the two annular members, which can form an effective sealing barrier at the dynamic interface where the first annular member 16 and the second annular member 17 rotate relative to each other. This can prevent particulate contaminants from the external environment from entering the internal precision components (such as the permanent magnet rotor 4 and the electromagnetic stator 5), and can also prevent wear particles that may be generated inside from escaping and contaminating the wafer. Thus, while ensuring rotational flexibility, it significantly improves the cleanliness and long-term operational reliability of the device.

[0095] In one embodiment, the seal 19 can be a rubber sealing ring 11, a polytetrafluoroethylene slip ring, or a magnetohydrodynamic seal; wherein the rubber sealing ring 11 can provide good elastic contact sealing, the polytetrafluoroethylene slip ring has a low coefficient of friction and wear-resistant properties, and is suitable for high-speed rotation conditions, while the magnetohydrodynamic seal can achieve completely contactless dynamic sealing, completely avoiding frictional dust generation, thereby providing reliable sealing protection for rotating connection parts according to different speed, cleanliness and life requirements, and ensuring the long-term stable operation of internal precision components.

[0096] In one embodiment, such as Figure 2As shown, the wafer processing device integrating gripping and flipping functions also includes a first position feedback element 20 and a controller (not shown). The first position feedback element 20 is disposed on the permanent magnet rotor 4 and / or the electromagnetic stator 5 to collect the rotation angle signal of the permanent magnet rotor 4 in real time. The controller is communicatively or electrically connected to the first position feedback element 20 and the magnetic levitation controller 8 to control the magnetic levitation controller 8 according to the rotation angle signal fed back by the first position feedback element 20, thereby further controlling the rotation angle of the permanent magnet rotor 4. This embodiment monitors the angle of the permanent magnet rotor 4 in real time through the first position feedback element 20, and the controller controls the magnetic levitation controller 8 in a closed loop according to the feedback signal, forming a high-precision angle servo system. This system can achieve real-time accurate calibration and dynamic stable control of the wafer flipping angle, effectively eliminating accumulated errors and external interference during the rotation process, and ensuring that the wafer can achieve extremely high angle positioning accuracy and repeatability at any process position.

[0097] In one embodiment, the first position feedback element 20 can be a rotary encoder, a rotary transformer, or a Hall sensor array; wherein the rotary encoder can provide high-resolution angle digital signals, the rotary transformer has strong anti-interference capabilities and is suitable for high-speed scenarios, and the Hall sensor array can achieve non-contact angle measurement by detecting changes in the magnetic field of the permanent magnet rotor 4, thereby providing accurate angle feedback for the closed-loop control system according to different accuracy, speed and reliability requirements, and ensuring high precision and high stability of the wafer flipping process.

[0098] In one embodiment, the controller can be a PLC, a dedicated motion control card, or an embedded DSP module; wherein the PLC is suitable for logic and sequential control of multiple I / O points, the motion control card can realize high-performance trajectory interpolation and synchronization of multiple axes, and the embedded DSP module can realize precise closed-loop control of current, speed, and position with powerful algorithm processing capabilities, thereby providing stable and reliable core control capabilities for the entire device according to the different requirements of the system for real-time performance, accuracy, and complexity.

[0099] In one embodiment, such as Figure 3As shown, the wafer processing device integrating gripping and flipping functions further includes a second position feedback element 21. The second position feedback element 21 is disposed on the clamping head 7 or between the clamping head 7 and the clamping arm 6. The second position feedback element 21 is used to collect the clamping force signal when the clamping head 7 clamps the wafer in real time. The second position feedback element 21 is communicatively or electrically connected to the first driver 13 and the controller so that after the controller receives the clamping force signal fed back by the second position feedback element 21, it controls the first driver 13 to adjust the clamping force of the clamping head 7 on the wafer. In this embodiment, the second position feedback element 21 monitors the clamping force signal in real time and performs closed-loop control of the first driver 13 via the controller. It can accurately sense and dynamically adjust the clamping force of the clamping head 7 on the wafer, effectively avoiding wafer slippage caused by insufficient clamping force or wafer microcracks and damage caused by excessive clamping force. Thus, while ensuring the reliability of gripping, it achieves flexible and safe clamping of the wafer, significantly improving the protection capability and process adaptability of thin and brittle wafers.

[0100] Of course, in other embodiments, the driving method of the two clamping arms 6 is not limited to the combination of the first driver 13 and the connector 15; it can also be a combination of a cylinder, a baffle, a push-pull rod, and a moving column (not shown). In this embodiment, the cylinder and the baffle are both fixed on the flipping support 3. In one embodiment, the cylinder and the baffle are arranged on the same side of the flipping support 3; the driving end of the cylinder is movably inserted into the baffle, and the moving column is fixedly connected to the end of the driving end away from the cylinder. Both clamping arms 6 are hinged to the baffle, and the two clamping arms 6 are respectively arranged on the left and right sides of the moving column. There are two push-pull rods, which are arranged between the moving column and the clamping arms 6, and the two ends of the push-pull rods are respectively hinged to the clamping arms 6 and the moving column. The purpose of this arrangement is that when the cylinder moves with the moving column, it will push or pull the end of the two clamping arms 6 away from the baffle through the push-pull rod to move away or closer, so as to achieve the release or clamping of the wafer. In this embodiment, the clamping head is positioned near the end of the clamping arm 6 away from the baffle.

[0101] In one embodiment, the second position feedback element 21 can be a micro pressure sensor, a strain gauge, or a piezoelectric thin film sensor; wherein the micro pressure sensor can directly measure the contact pressure to achieve high-precision quantitative feedback of the clamping force, the strain gauge indirectly calculates the clamping force by detecting the micro-strain of the clamping arm 6 or the clamping head 7, and has high reliability, while the piezoelectric thin film sensor can respond to dynamic force changes and is suitable for scenarios that require rapid force control, thereby realizing real-time and accurate monitoring and closed-loop control of the clamping force, ensuring the safety and compliance of the wafer clamping process.

[0102] In one embodiment, such as Figure 1 As shown, the wafer processing device integrating gripping and flipping functions also includes a vacuum gripping component disposed on the flipping support 3. The vacuum gripping component includes a vacuum suction hole 22 and a gas channel: the vacuum suction hole 22 is disposed on the wafer-bearing surface of the flipping support 3; one end of the gas channel is connected to the vacuum suction hole 22, and the other end is connected to an external vacuum generator; this embodiment provides a non-contact planar adsorption and fixation method for wafer processing by setting a vacuum suction hole 22 on the surface of the flipping support 3 and connecting it to a vacuum generator; this method can not only work in conjunction with mechanical clamping to enhance gripping stability, especially suitable for ultra-thin or surface-sensitive wafers, but also effectively avoid wafer slippage or displacement by uniformly distributing the adsorption force through negative pressure during the flipping process, significantly improving the reliability of operation and adaptability to wafers.

[0103] In one embodiment, such as Figure 1 As shown, the number of vacuum suction holes 22 is set to several, and the several vacuum suction holes 22 are arranged in multiple concentric rings or a matrix on the wafer support surface. In this embodiment, the multiple vacuum suction holes 22 are evenly arranged on the support surface in the form of concentric rings or a matrix. The vacuum suction holes 22 in different areas can be flexibly used according to the wafer size, so that the adsorption force is evenly distributed on the back of the wafer. This effectively avoids wafer bending or hidden damage caused by local stress concentration, thereby providing stable, reliable and comprehensive support for wafers of different specifications during vacuum gripping, significantly improving the adaptability and safety of operation.

[0104] In one embodiment, the number of vacuum suction holes 22 can be specifically 6 to 24; 6 to 8 suction holes are suitable for the basic fixation of small-sized wafers, 12 to 16 suction holes can provide uniform and reliable adsorption force for standard-sized wafers, and 18 to 24 suction holes can ensure that large-sized or ultra-thin wafers obtain sufficient support and stability during high-speed flipping, thereby flexibly configuring according to different process requirements, and optimizing airflow efficiency while ensuring gripping reliability.

[0105] In one embodiment, the rotation angle of the flipping carrier 3 is between 0° and 360°. This gives the flipping carrier 3 a full-circumference rotation capability from 0° to 360°, which not only meets basic requirements such as 180° flipping commonly encountered in wafer processing, but also enables precise adjustment at any angle, adapting to diverse process requirements (such as multi-angle detection, oblique alignment, etc.). Simultaneously, it provides flexibility for path optimization, avoids mechanical interference, and significantly improves the equipment's versatility and adaptability in complex semiconductor manufacturing processes.

[0106] In one embodiment, the rotation angle of the flipping support 3 includes, but is not limited to, 80°, 90°, 100°, 170°, 180° and 270°.

[0107] In one embodiment, such as Figure 2 As shown, the wafer processing device integrating gripping and flipping functions further includes mechanical limiting components, which include limiting blocks 23, limiting pins 24, and second drivers 25. The limiting blocks 23 are disposed on the outer ring wall of the first annular member 16. The limiting pins 24 are movably disposed on the inner ring wall of the second annular member 17, and there are several limiting pins 24 arranged along the circumference of the second annular member 17. The limiting pins 24 and the limiting blocks 23 are located on the same radial plane of the second annular member 17. There are several second drivers 25, and the driving ends 14 of the several second drivers 25 are connected one-to-one with the several limiting pins 24. The second driver 25 drives the limiting pin 24 to extend or shorten relative to the second annular member 17. When the limiting pin 24 is in the extended state, the distance between the end of the limiting pin 24 away from the inner annular wall of the second annular member 17 and the inner annular wall of the second annular member 17 is greater than the distance between the end of the limiting block 23 away from the outer annular wall of the first annular member 16 and the inner annular wall of the second annular member 17. When the limiting pin 24 is in the shortened state, the distance between the end of the limiting pin 24 away from the inner annular wall of the second annular member 17 and the inner annular wall of the second annular member 17 is less than the distance between the end of the limiting block 23 away from the outer annular wall of the first annular member 16 and the inner annular wall of the second annular member 17.

[0108] In the above embodiment, a limiting block 23 is provided on the first annular component 16, and a limiting pin 24 controlled by the second driver 25 is provided on the second annular component 17, forming an actively adjustable mechanical limiting system. This system can drive the limiting pin 24 to extend and mechanically interfere with the limiting block 23 when needed (such as at a specific process angle or during power failure protection), thereby rigidly limiting the rotation range of the flipping bearing 3, effectively preventing overshoot or accidental rotation, and providing dual protection for high-precision angle positioning and device safety. Furthermore, this embodiment arranges several limiting pins 24 circumferentially and on the same radial plane as the limiting block 23, and precisely controls their extension and retraction lengths. This ensures that when the limiting pin 24 is extended, it can reliably form mechanical interference with the limiting block 23, rigidly locking the rotation angle; while when it is shortened, it completely disengages from the interference area, ensuring free rotation. This design achieves programmable, multi-point flexible limitation of the flipping angle range, ensuring full-circumference rotation capability during normal operation, and enabling rapid and precise mechanical positioning and safety protection when needed.

[0109] Meanwhile, this embodiment achieves independent and precise control of the state of each limit pin 24 by independently configuring a second driver 25 for each limit pin 24. This enables the device to flexibly and selectively extend or retract the limit pin 24 at a specific position according to different process requirements, thereby dynamically setting multiple variable mechanical limit points. This not only greatly enhances the flexibility and intelligence of angle restriction, but also provides a reliable hardware foundation for realizing complex multi-angle process sequences.

[0110] In one embodiment, the specific number of limiting pins 24 can be 2 to 8. Two limiting pins 24 can achieve basic safety limiting at 180° intervals, four limiting pins 24 can provide locking of commonly used process angles at 90° intervals, and six to eight limiting pins 24 can achieve more precise angle control at 60° or 45° intervals. This allows for flexible configuration of limiting points according to the angle accuracy requirements of different processes, improving the versatility and adaptability of the equipment while ensuring safety. Of course, other embodiments are not limited to 2 to 8 pins, which will not be elaborated here.

[0111] In one embodiment, the second driver 25 can be a miniature cylinder, a piezoelectric ceramic driver, or a voice coil motor; wherein the miniature cylinder can provide stable linear thrust and has a low cost, the piezoelectric ceramic driver can achieve nanometer-level precise displacement control and is suitable for ultra-high precision limiting, and the voice coil motor can achieve high-speed, high-response contactless drive, thereby providing a flexible and reliable drive solution for mechanical limiting components according to different requirements for limiting accuracy, speed and reliability.

[0112] In one embodiment, such as Figure 4 As shown, the mechanical limiting component further includes a signal transmitter 26 and a signal receiver 27. The signal transmitter 26 is disposed on the outer side wall of the first annular member 16, and the transmitting end of the signal transmitter 26 faces the limiting pin 24. The signal receiver 27 is disposed on the inner side wall of the second annular member 17. A plurality of signal receivers 27 are provided, and each plurality of signal receivers 27 is respectively configured in one-to-one correspondence with a plurality of limiting pins 24 and a plurality of second drivers 25 driving the limiting pins 24. 27 serves as the pre-detection point for the corresponding limit pin 24 and is located upstream of the rotational trajectory of the corresponding limit pin 24. The receiving end of the signal receiver 27 faces the signal transmitter 26 to collect the signal emitted by the signal transmitter 26. The controller is communicatively or electrically connected to the signal receiver 27 and the second driver 25 respectively. After receiving the signal fed back by the signal receiver 27, the controller controls the second driver 25, which is configured corresponding to the signal receiver, to drive the limit pin 24 to extend or shorten.

[0113] It is worth noting that the number of limit pins 24 and signal receivers 27 are set in a one-to-one correspondence, such as... Figure 4 As shown in the embodiment, the number of signal receivers 27 and limit pins 24 is set to 6. The signal receivers 27 are arranged near the connection between the limit pin 24 and the second annular member 17. For example, at the 12 o'clock position, the signal receiver 27 is located at the upper left corner of the limit pin 24. The plurality of signal receivers 27 are respectively configured in a one-to-one correspondence with the plurality of limit pins 24 and the plurality of second drivers 25 driving the limit pins 24. This means that the control operations of the limit pins 24, the second drivers 25 driving the limit pins 24, and the signal receivers 27 are in a one-to-one correspondence. That is, when the controller receives a signal from the signal receiver 27 at the 12 o'clock position, it controls the corresponding second driver 25 to drive the limit pin 24 at the 12 o'clock position to perform a shortening or extending movement. Each of the signal receivers 27 serves as a pre-detection point for the corresponding limit pin 24 and is located upstream of the rotational trajectory of the corresponding limit pin 24. This is intended to trigger the control signal in advance and reserve sufficient program response and mechanical execution time for the driving action of the subsequent limit pin 24.

[0114] In this embodiment, when the signal receiver 27 receives the signal from the signal transmitter 26, the second driver 25 controls the limit pin 24 to extend and form mechanical contact with the limit block 23, stopping the rotation of the flipping support 3. When it is necessary to adjust the flipping angle of the flipping support 3 again, the second driver 25 is controlled to drive the limit pin 24 to shorten, thereby losing mechanical contact, and the flipping support 3 can continue to rotate. This embodiment, through the cooperation of the signal transmitter 26 and the receiver, constitutes a non-contact angle positioning detection system, which can accurately determine the relative position of the limit block 23 and each limit pin 24 in real time. The controller controls the corresponding second driver 25 to act accordingly, realizing the automatic and precise linkage of the extension and retraction states of the limit pin 24. Thus, without the need for physical contact detection, the identification of the rotation angle and the intelligent start and stop of the mechanical limit are automatically completed, significantly improving the automation, response speed and reliability of angle control.

[0115] In one embodiment, the signal transmitter 26 and the signal receiver 27 can be an infrared pair, a laser rangefinder, or a Hall sensor array, respectively. The infrared pair is low in cost and easy to implement on / off detection, the laser rangefinder can provide high-precision distance signals to achieve more accurate position prediction, and the Hall sensor array can achieve non-contact angle measurement by detecting changes in magnetic field. Thus, depending on the different requirements of the system for detection accuracy, anti-interference and cost, it can provide reliable position feedback for the automatic limit system.

[0116] In one embodiment, the signal receiver 27 can be positioned at key angular locations such as 0°, 90°, 180°, and 270° on the second annular component 17. By deploying the receiver at these reference angles, it is possible to accurately detect whether the flipping support 3 has reached the core process positions such as horizontal, vertical, or inverted. This provides a crucial angular reference signal for the intelligent linkage control of the limit pin 24, ensuring that the wafer can quickly and accurately stop at the preset important working position during the flipping process. Of course, in other embodiments, the angles are not limited to those mentioned above, and will not be elaborated here.

[0117] In one embodiment, such as Figure 5 As shown, the mechanical limiting component further includes a second gear ring 28, a first gear ring 29, and a third driver 30; the second gear ring 28 is sleeved on the outside of the permanent magnet rotor 4, and the second gear ring 28 is coaxially rotatably disposed on the end of the first annular member 16 away from the fixed base 1, and the second gear ring 28 is connected to the limiting block 23; the first gear ring 29 meshes with the second gear ring 28; the third driver 30 is disposed on the first annular member 16 or the fixed base 1, and the driving end of the third driver 30 is connected to the first gear ring 29, so that by driving the first gear ring 29 to rotate, the second gear ring 28 drives the limiting block 23 to rotate on the outer ring wall of the first annular member 16. This embodiment uses a transmission mechanism consisting of a third driver 30, a first gear ring 29, and a second gear ring 28 to actively drive the limiting block 23 to precisely adjust its angular position in the circumferential direction, thereby dynamically changing the trigger point of the mechanical limit. This allows the device to preset the limit angle without relying on the rotation of the flipping carrier 3 itself, which not only greatly improves the flexibility and efficiency of the limit setting, but also enables more complex multi-angle process sequences or dynamic obstacle avoidance, enhancing the intelligence and adaptability of the equipment.

[0118] In one specific embodiment, when the limiting block 23 is at the 12 o'clock position, the mechanical abutment limit can only be performed at the 12 o'clock position; when it is necessary to abut the limit at the 3 o'clock position, the third driver 30 is controlled to drive the limiting block 23 to rotate clockwise to the 3 o'clock position and stop through the second gear ring 28 and the first gear ring 29, at which point the mechanical abutment limit is located at the 3 o'clock position.

[0119] It is worth noting that the signal transmitter 26 moves along with the movement of the limiting block 23. The two can be integrated, or the signal transmitter 26 can be fixed to the limiting block 23.

[0120] In one embodiment, the third driver 30 can be a stepper motor, a servo motor, or a miniature rotary cylinder; wherein the stepper motor can achieve precise angle indexing control, the servo motor can provide high torque and closed-loop position feedback to ensure positioning accuracy, and the miniature rotary cylinder is suitable for pneumatic scenarios that require rapid response, thereby providing a flexible and reliable drive scheme for the dynamic position adjustment of the limit block 23 according to different requirements for angle adjustment accuracy, speed and drive mode.

[0121] In one embodiment, the mechanical limiting component further includes a buffer pad (not shown), which is sleeved on the limiting pin 24 or disposed on the side of the limiting block 23 facing the limiting pin 24 when it abuts against the limiting pin 24. This embodiment adds a buffer pad to the contact area between the limiting pin 24 and the limiting block 23, which can effectively absorb the impact energy generated by the collision through the elastic deformation of the buffer material at the moment the mechanical limiting action occurs, transforming hard contact into flexible buffering. This significantly reduces the impact noise between the limiting pin 24 and the limiting block 23, prevents structural components from being damaged by instantaneous overload, slows down vibration transmission, and improves the smoothness of the limiting action and the service life and reliability of the entire device.

[0122] In one embodiment, the wafer processing device integrating gripping and flipping functions operates as follows:

[0123] The rotary drive mechanism first drives the flipping support 3 to rotate, so that the side of the flipping support 3 with the clamping arms 6 faces the wafer to be processed. Then, the robotic arm moves the integrated device directly above the wafer to be processed. Subsequently, the wafer gripping component starts to work. The two clamping arms 6 move towards each other and retract under the control of the first driver 13, so that the gripping head 7 smoothly contacts the edge of the wafer. The clamping force is precisely controlled by the second position feedback component 21, achieving a firm yet non-destructive gripping, effectively avoiding edge stress concentration or microcracks that may be caused by traditional rigid gripping.

[0124] After the robotic arm moves the integrated gripping and flipping wafer processing unit, which has already gripped the wafer, to a safe origin position, the rotary drive mechanism is activated. The magnetic levitation controller 8 works first, precisely controlling the generation of a 0.5mm radial air gap between the permanent magnet rotor 4 and the electromagnetic stator 5. This non-contact magnetic levitation drive fundamentally eliminates mechanical friction and wear, laying the foundation for high-speed and stable rotation. Subsequently, according to preset instructions, the controller applies an orderly changing current to the windings of the electromagnetic stator 5, driving the permanent magnet rotor 4 to precisely flip the entire flipping support 3 and the wafer by 180°. During this process, the high-resolution first position feedback element 20 monitors the rotation angle in real time and feeds the signal back to the controller, forming a closed-loop control to ensure that the flipping action is fast and the endpoint position (180°) is accurate, preparing for subsequent processes (such as double-sided processing, inspection, or bonding).

[0125] After the flipping action is completed, the robotic arm moves again, carrying the device to the target workstation (such as a process chamber or transfer platform). Upon reaching the designated position, the gripping arm 6 smoothly releases under the controller's command, safely and accurately placing the wafer in the target position. Throughout the entire process, the wafer remains firmly fixed on the same set of devices, eliminating the need for transfer between different fixtures, greatly reducing the risk of bumps, scratches, and positional errors caused by multiple positioning and handover operations.

[0126] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the present invention. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A wafer processing apparatus integrating a gripping and flipping function, characterized by, The utility model relates to a wafer flipping device, including: Fixed base, with mechanical arm end connects, and the side away from the mechanical arm end is connected with support frame; Turnover carrier, set up in the fixed base side away from the mechanical arm end; Wafer grabbing component, including clamping arm and clamping head, the clamping arm is equipped with two and sets up on the turnover carrier, two the clamping arm between formation clamping wafer's clamping space, the clamping head is set up in the clamping arm side towards the clamping space, two the clamping arm along the radial of turnover carrier does close or far away movement to make the clamping head clamping or loosening the wafer; Rotary drive mechanism, set up between the fixed base and the turnover carrier, the rotary drive mechanism includes permanent magnet rotor, electromagnetic stator and magnetic suspension controller, the permanent magnet rotor rotation sets up in the support frame side away from the fixed base, and the permanent magnet rotor is located in the support frame outside one end with the turnover carrier fixed connection, the electromagnetic stator sets up in the support frame, and the same coaxial cover is set up in the permanent magnet rotor outside in the support frame, the magnetic suspension controller sets up in the fixed base and is connected with the electromagnetic stator, the magnetic suspension controller is configured as control the permanent magnet rotor with the electromagnetic stator between generation radial air gap, to make the permanent magnet rotor with the turnover carrier relatively the electromagnetic stator rotates.

2. The wafer processing apparatus integrating a gripping and flipping function according to claim 1, wherein, Also including set up on the support frame rotation part, the rotation part includes: Fixed seat, fixedly set up in the support frame side away from the fixed base; Support ring, cover set up in the permanent magnet rotor outside, and one end of the support ring is fixedly inserted on the fixed seat; Sealing ring, cover set up in the permanent magnet rotor outside, and set up between the permanent magnet rotor and the support ring, the inner ring wall of the support ring recesses a annular groove, the sealing ring is embedded in the annular groove, the sealing ring, the support ring and the permanent magnet rotor are coaxial arrangement.

3. The wafer processing apparatus integrating a gripping and flipping function according to claim 1, wherein, The electromagnetic stator includes: Stator core, set up in the support frame, the stator core is in cylindrical structure, the inner ring wall of the stator core is evenly provided with a plurality of stator slots, a plurality of the stator slots sequentially arrange along the axial direction of the stator core, the stator slot cavity is annular structure; Insulating framework, set up in the stator slot, and the number of the insulating framework in the same stator slot is at least three, three the insulating framework along the circumferential direction of the stator slot is equidistantly distributed; Coil, embedded in the insulating framework, the number of the coil is provided with a plurality of, the number of the insulating framework in the same stator slot and the number of the coil are matched and set, and there is an electrical angle difference between two adjacent coils in the same stator slot.

4. The wafer processing apparatus integrating a gripping and flipping function according to claim 1, wherein, Also including the elastic piece between the clamping head and the clamping arm, the clamping head and the clamping arm are connected through the elastic piece, and the elastic piece is elongated or shortened along the axial direction of the elastic piece to make the clamping head relatively the clamping arm do far away or close movement.

5. The wafer processing apparatus integrating a gripping and flipping function according to claim 1, wherein, A plurality of clamping heads are arranged on each clamping arm, and the plurality of clamping heads are equidistantly arranged along the extension direction of the clamping arm.

6. The wafer processing apparatus integrating a gripping and flipping function according to claim 1, wherein, The wafer grabbing member further comprises a driving assembly, the driving assembly comprising: a first driver arranged on the turnover carrier, the first driver having two opposite driving ends; a connecting piece slidingly arranged on the turnover carrier, the connecting piece being provided with two connecting pieces corresponding to the two clamping arms, and the driving ends of the first driver being connected with the connecting piece to drive the two clamping arms to move closer or farther away through the first driver and the connecting piece.

7. The wafer processing apparatus integrating a gripping and flipping function according to claim 6, wherein, Further comprising a fixed connecting piece arranged between the fixed base and the turnover carrier, the fixed connecting piece comprising: a first ring-shaped piece arranged on the fixed base, the first ring-shaped piece being arranged outside the support frame; a second ring-shaped piece arranged on the turnover carrier, the second ring-shaped piece being coaxially arranged outside the first ring-shaped piece and the permanent magnet rotor; a support shaft arranged between the first ring-shaped piece and the second ring-shaped piece, the first ring-shaped piece and the second ring-shaped piece being rotationally connected through the support shaft.

8. The wafer processing apparatus integrating a gripping and flipping function according to claim 7, wherein, The fixed connecting piece further comprises a sealing piece arranged between the first ring-shaped piece and the second ring-shaped piece, the sealing piece being arranged outside the first ring-shaped piece, and the sealing piece and the side of the second ring-shaped piece close to each other slidingly abutting.

9. The wafer processing apparatus integrating a gripping and flipping function according to claim 7, wherein, Further comprising: a first position feedback piece arranged on the permanent magnet rotor and / or the electromagnetic stator, to collect the rotation angle signal of the permanent magnet rotor in real time; a controller in communication or electrical connection with the first position feedback piece and the magnetic suspension controller, to control the magnetic suspension controller according to the rotation angle signal fed back by the first position feedback piece, to further control the rotation angle of the permanent magnet rotor.

10. The wafer processing apparatus integrating a gripping and flipping function according to claim 9, wherein, Further comprising: a second position feedback piece arranged on the clamping head or between the clamping head and the clamping arm, the second position feedback piece being used to collect the clamping force signal when the clamping head clamps the wafer in real time, the second position feedback piece being in communication or electrical connection with the first driver and the controller, to control the first driver to adjust the clamping force of the clamping head on the wafer after the controller receives the clamping force signal fed back by the second position feedback piece.

11. The wafer processing apparatus integrating gripping and flipping functions according to claim 1, wherein, Further comprising a vacuum grabbing member arranged on the turnover carrier, the vacuum grabbing member comprising: vacuum suction holes arranged on the wafer-carrying surface of the turnover carrier, the number of the vacuum suction holes being provided as several, and the several vacuum suction holes being arranged in multiple concentric circles or matrix on the wafer-carrying surface; a gas channel having one end in communication with the vacuum suction hole and the other end in communication with an externally arranged vacuum generator.

12. The wafer processing apparatus integrating a gripping and flipping function according to claim 1, wherein, The rotation angle of the turnover carrier is between 0° and 360°.

13. The wafer processing apparatus integrating gripping and flipping functions according to claim 1, wherein, The turnover carrier is in a circular or square plate structure, and the surface roughness of the turnover carrier is less than or equal to 1.6 μm.

14. The wafer processing apparatus integrating gripping and flipping functions according to claim 9, wherein, Further comprising a mechanical limiting member, the mechanical limiting member comprising: a limiting block arranged on the outer ring wall of the first ring-shaped piece; The limiting pins are arranged along the circumference of the second ring-shaped member and movably arranged on the inner ring wall of the second ring-shaped member, and the limiting pins and the limiting blocks are arranged on the same radial plane of the second ring-shaped member; The second drivers are arranged in a one-to-one correspondence with the limiting pins, and the second drivers drive the limiting pins to perform elongation or shortening movement relative to the second ring-shaped member; when the limiting pins are in the elongation state, the distance between the end portion of the limiting pins away from the inner ring wall of the second ring-shaped member and the inner ring wall of the second ring-shaped member is greater than the distance between the one end of the limiting block away from the outer ring wall of the first ring-shaped member and the inner ring wall of the second ring-shaped member; when the limiting pins are in the shortening state, the distance between the end portion of the limiting pins away from the inner ring wall of the second ring-shaped member and the inner ring wall of the second ring-shaped member is less than the distance between the one end of the limiting block away from the outer ring wall of the first ring-shaped member and the inner ring wall of the second ring-shaped member.

15. The wafer processing apparatus integrating a gripping and flipping function according to claim 14, wherein, The mechanical limiting member further comprises: The signal transmitter is arranged on the outer side wall of the first ring-shaped member, and the emission end of the signal transmitter faces the limiting pins; The signal receivers are arranged on the inner side wall of the second ring-shaped member, and the number of the signal receivers is arranged in a one-to-one correspondence with the limiting pins and the second drivers driving the limiting pins; each signal receiver is a pre-detection point of the corresponding limiting pin, and is arranged upstream of the rotation track of the corresponding limiting pin; the receiving end of the signal receiver faces the signal transmitter to collect the signals emitted by the signal transmitter; The controller is in communication or electrical connection with the signal receivers and the second drivers; after receiving the signals fed back by the signal receivers, the controller controls the second drivers corresponding to the signal receivers to drive the limiting pins to perform elongation or shortening movement.

16. The wafer processing apparatus integrating gripping and flipping functions according to claim 14, wherein, The mechanical limiting member further comprises: The second gear ring is arranged coaxially on the end of the first ring-shaped member away from the fixed base, and the second gear ring is connected with the limiting blocks; The first gear ring is engaged with the second gear ring; The third driver is arranged on the first ring-shaped member or the fixed base, and the driving end of the third driver is connected with the first gear ring, so that the second gear ring drives the limiting blocks to rotate on the outer ring wall of the first ring-shaped member by driving the first gear ring to rotate.

17. The wafer processing apparatus integrating gripping and flipping functions according to claim 14, wherein, The mechanical limiting member further comprises: The buffer pad is arranged outside the limiting pins or on the side of the limiting blocks facing the limiting pins when the limiting blocks abut against the limiting pins.

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