Dual-channel active flow control liquid cooling device and method

Abstract

The application belongs to the field of semiconductor device heat sink, and particularly relates to a double-layer channel active flow control liquid cooling device and method, wherein the double-layer channel active flow control liquid cooling device comprises a heat dissipation channel and a jet flow device; the heat dissipation channel comprises a channel I and a channel II which are isolated from each other, and the channel I and the channel II have a common medium inlet and a common medium outlet; a plurality of flow-around columns are arranged in the channel I, the flow-around columns are hollow, one end of the hollows penetrates into the channel II, and the other end of the hollows leads out of the heat dissipation channel; and the jet flow device is communicated with the hollows of the flow-around columns outside the heat dissipation channel. The application has high heat exchange efficiency, low flow resistance, excellent temperature uniformity and compact structure through the coupling of the double-layer channel and the jet flow device, and is particularly suitable for the thermal management of high-power electronic equipment.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of semiconductor device heat sink, and particularly relates to a double-layer channel active flow control liquid cooling device and method. BACKGROUND

[0002] With the rapid development of artificial intelligence computing, high-performance servers and other technologies, the chip heat flux continues to rise, and the power consumption of its heat dissipation design has far exceeded the limit of air-cooled heat dissipation, posing unprecedented challenges to thermal management technology. Liquid cooling has become a key solution to high heat flux heat dissipation problems due to its high heat conduction efficiency, but the mainstream jet flow liquid cooling relies on mechanical pumps to drive the cooling liquid, and there are problems such as complex system, high energy consumption, etc. Immersion liquid cooling faces problems such as insufficient cooling liquid compatibility, long-term reliability verification, and high cost. In addition, the traditional liquid cooling micro-channel design brings the disadvantage of significantly increased flow resistance while improving the heat exchange area, resulting in increased pumping power, and the flow field in the channel is difficult to actively control, and the temperature uniformity is poor, which easily forms local hot spots, affecting the reliability and life of the chip. In view of this, a high-efficiency, low-consumption, and excellent temperature-uniformity liquid cooling heat dissipation scheme is proposed. SUMMARY

[0003] The technical problem to be solved by the present application is to provide a double-layer channel active flow control liquid cooling device and method. Through the coupling of the double-layer channel and the jet flow device, high heat exchange efficiency, low flow resistance, excellent temperature uniformity and compact structure are achieved, which is particularly suitable for the thermal management of high-power electronic equipment.

[0004] The present application provides a double-layer channel active flow control liquid cooling device, comprising a heat dissipation channel and a jet flow device.

[0005] The heat dissipation channel comprises a channel I and a channel II which are isolated from each other, and the channel I and the channel II have a common medium inlet and a medium outlet.

[0006] A plurality of flow-around columns are arranged in the channel I, the flow-around columns are hollow inside, and one end of the hollow part penetrates into the channel II, and the other end of the hollow part leads out of the heat dissipation channel.

[0007] The jet flow device is connected to the hollow part of the flow-around column outside the heat dissipation channel.

[0008] Further, an inlet channel is arranged between the inlet end of the channel I and the channel II and the medium inlet.

[0009] An outlet channel is arranged between the outlet end of the channel I and the channel II and the medium outlet.

[0010] Further, the inlet channel is of a gradually expanding structure, and the outlet channel is of a gradually tapering structure.

[0011] Further, a plurality of partition plates II are arranged on the channel I and / or the channel II.

[0012] The plurality of partition plates II divide the channel I and / or the channel II into a plurality of sub-channels along the flow direction.

[0013] Further, when the plurality of partition plates II are arranged on the channel I and the channel II, the partition plate II in the channel I corresponds to the partition plate II in the channel II.

[0014] Further, the flow-around columns are arranged in a rectangular array in the channel I.

[0015] Further, the fluid jet device is a fluid jet actuator.

[0016] Further, the fluid jet actuator is a synthetic double fluid jet actuator.

[0017] Further, when the flow-around columns are arranged in a rectangular array,

[0018] The synthetic double fluid jet actuator comprises a plurality of transverse grooves arranged in an array along the flow direction, and each transverse groove covers a row of hollow flow-around columns outside the communication heat dissipation channels arranged transversely.

[0019] The transverse grooves are connected to at least one fluid jet outlet of the synthetic double fluid jet actuator.

[0020] The application also provides a double-layer channel active flow control liquid cooling method using the double-layer channel active flow control liquid cooling device, comprising the following steps:

[0021] S1, the heat source is installed outside the channel II.

[0022] S2, the medium inlet flows into the cooling medium into the channel I and the channel II, and the cooling medium exchanges heat with the inner wall of the channel I and the channel II and the side wall of the flow-around column, and then flows out from the medium outlet.

[0023] When the cooling medium passes through the flow-around column in the channel I, the flow-around is enhanced, and the heat exchange effect is improved.

[0024] The fluid jet device injects fluid jet into the channel II through the hollow of the flow-around column, enhances the flow-around and destroys the boundary layer of the heat exchange surface, and improves the heat exchange effect.

[0025] The double-layer channel active flow control liquid cooling device provided by the application has the following beneficial effects:

[0026] First, the double-layer channel design and the surrounding column structure effectively increase the heat transfer area and reduce fluid turbulence. When the jet device is not in operation, the double-layer channel significantly reduces the average temperature of the heat source compared to the single-layer channel, demonstrating the advantages of the double-layer structure in enhancing heat transfer and suppressing localized overheating.

[0027] Second, the flow diversion effect of the double-layer channel significantly reduces the system flow resistance, and the pressure drop is significantly lower than that of the single-layer structure. After the jet device is turned on, due to the flow diversion and buffering effect of the double-layer channel, the increase in pressure drop is small, far lower than the increase in pressure drop of the single-layer channel, indicating that the structure effectively controls energy consumption and pumping power while improving heat exchange efficiency.

[0028] Third, the jetting device introduces the jet through the hollow channel of the flow column, forming a vertical impact jet within channel II, which disrupts the temperature boundary layer and promotes the mixing of hot and cold fluids. The calculation example shows that after activating the jetting device, the double-layer channel can significantly reduce the maximum temperature difference of the heat source, avoiding localized high-temperature areas and ensuring the temperature uniformity of the heat source.

[0029] Fourth, the integration of the jet device and the surrounding column enables active heat dissipation, allowing for dynamic adjustment of the jet intensity based on the heat load, further improving heat exchange efficiency. The numerical example verifies that the system temperature drops significantly after the jet device is activated, demonstrating the crucial role of active control in high heat flux scenarios.

[0030] V. The flow-around column combines the functions of flow-around and jet channels, keeping one side of channel II flat for easy installation of heat sources. It also achieves efficient integration of the double-layer channel and jet device, making it suitable for heat dissipation of electronic devices with limited space.

[0031] In summary, this invention, through the coupling of a double-layer channel and a jet device, combines high heat exchange efficiency, low flow resistance, excellent temperature uniformity, and compact structure, making it particularly suitable for thermal management of high-power electronic devices. Attached Figure Description

[0032] Appendix Figure 1 This is a schematic diagram of the structure of the present invention;

[0033] Appendix Figure 2 This is a top view of the present invention;

[0034] Appendix Figure 3 For the appendix Figure 2 Sectional view along line AA;

[0035] Appendix Figure 4 For the appendix Figure 3 A magnified view of a section at point C;

[0036] Appendix Figure 5 For the appendix Figure 2 Sectional view along the BB direction;

[0037] AppendixFigure 6 schematic diagram of explosion of the present application;

[0038] Figure Figure 7 schematic diagram of front view of the present application; Figure 6

[0039] Figure Figure 8 schematic diagram of front view of the present application; Figure 7 Figure

[0040] Figure Figure 9 schematic diagram of front view of the present application; Figure 7 Figure

[0041] Figure Figure 10 schematic diagram of front view of the present application; Figure 7 Figure

[0042] Figure Figure 11 schematic diagram of calculation domain grid of the present application;

[0043] Figure Figure 12 schematic diagram of temperature and pressure drop table of different working conditions of the present application;

[0044] Figure Figure 13 schematic diagram of velocity cloud of channel I of the present application;

[0045] Figure Figure 14 schematic diagram of velocity cloud of channel II of the present application.

[0046] In the figure, 1-heat dissipation channel; 11-channel I; 111-flowing column; 112-hollow; 12-channel II; 13-medium inlet; 14-medium outlet; 15-inlet channel; 16-outlet channel; 17- partition I; 18-partition II; 2-synthetic double jet exciter; 21-transverse groove; 22-jet outlet; 3-heat source. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0048] It should be noted that all directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the accompanying drawings), and if the specific posture changes, the directionality indications also change accordingly.

[0049] ​In addition, the descriptions such as "first", "second" and the like in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implying the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0050] In the present application, unless otherwise explicitly specified and limited, the terms "connection", "fixation" and the like should be understood broadly, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection, or physical connection or wireless communication connection; can be directly connected, or indirectly connected through intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0051] In addition, the technical solutions of various embodiments of the present application can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection required by the present application.

[0052] As shown in the accompanying drawings Figure 1 -attached Figure 14 The present application provides a double-layer channel active flow control liquid cooling device, which comprises a heat dissipation channel 1 and a jet device.

[0053] The heat dissipation channel 1 comprises a channel I 11 and a channel II 12 which are isolated from each other, preferably, a partition plate I 17 is arranged in the heat dissipation channel 1, the channel I 11 and the channel II 12 are separated by the partition plate I 17, the channel I 11 and the channel II 12 have a common medium inlet 13 and a medium outlet 14, the medium inlet 13 flows into cooling medium into the channel I 11 and the channel II 12, and the cooling medium exchanges heat with the inner wall of the channel I 11 and the channel II 12 and the side wall of the flow-around column 111, and then flows out from the medium outlet 14;

[0054] A plurality of flow-around columns 111 are arranged in the channel I 11, the flow-around column 111 is hollow 112 inside, one end of the hollow 112 penetrates into the channel II 12, and the other end of the hollow 112 leads out of the heat dissipation channel 1;

[0055] The jet flow device is communicated with the hollow 112 of the flow-around column 111 outside the heat dissipation channel 1. That is, the flow-around column 111 not only serves as a flow-around structure in the channel I 111, but also serves as a jet flow channel, so that the jet flow of the jet flow device located at one side of the heat dissipation channel 1 in the channel I 111 can be introduced into the channel II 112, and the side of the heat dissipation channel 1 located at the channel II 112 is kept flat, so that the heat source 3 is conveniently installed.

[0056] The double-layer channel active flow control liquid cooling device has the following beneficial effects:

[0057] First, the double-layer channel design (channel I 111 and channel II 112) and the flow-around column 111 structure effectively increase the heat exchange area and fluid disturbance. Calculation examples show that, in the case that the jet flow device does not work, the double-layer channel can reduce the average temperature of the heat source 3 from 98°C to 87.6°C, and significantly reduce the maximum temperature from 110°C to 99.8°C, which proves the advantages of the double-layer structure in enhancing heat transfer and suppressing local overheating.

[0058] Second, the flow distribution of the double-layer channel significantly reduces the system flow resistance. In the calculation example, the pressure drop is reduced by 33.5% compared with the single-layer structure. After the jet flow device is turned on, due to the flow distribution buffer of the double-layer channel, the pressure drop only increases by 5%, which is much lower than the 14.8% increase of the single-layer channel, indicating that this structure effectively controls the energy consumption and pumping power while improving the heat exchange efficiency.

[0059] Third, the jet flow device introduces jet flow through the hollow 112 of the flow-around column 111, forms a vertical impingement jet flow in the channel II 112, destroys the temperature boundary layer, and promotes the mixing of cold and hot fluids. Calculation examples show that, after the jet flow device is turned on, the double-layer channel can reduce the maximum temperature difference of the heat source 3 from 37°C to 25°C, avoiding local high-temperature areas and ensuring the temperature uniformity of the heat source 3.

[0060] Fourth, the integration of the jet flow device and the flow-around column 111 realizes active heat dissipation, and dynamically adjusts the jet flow intensity according to the heat load, further improving the heat exchange efficiency. Calculation examples verify that the system temperature decreases significantly after the jet flow device is turned on, which reflects the key role of active control in high heat flux scenarios.

[0061] Fifth, the flow-around column 111 has the functions of flow-around and jet flow channel, so that the side of the channel II 112 remains flat, facilitating the installation of the heat source 3, and realizing the efficient integration of the double-layer channel and the jet flow device, which is suitable for the heat dissipation of electronic equipment with limited space.

[0062] In summary, the coupling of the double-layer channel and the jet flow device has high heat exchange efficiency, low flow resistance, excellent temperature uniformity and compact structure, and is particularly suitable for the heat management of high-power electronic equipment.

[0063] In one embodiment, an inlet channel 15 is arranged between the inlet ends of the channel I 11 and the channel II 12 and the medium inlet 13.

[0064] An outlet channel 16 is arranged between the outlet ends of the channel I 11 and the channel II 12 and the medium outlet 14.

[0065] In this embodiment, the inlet channel 15 and the outlet channel 16 are arranged to form a buffer and flow-distribution space in structure. The cooling medium from the medium inlet 13 can be guided to be distributed more smoothly and uniformly to the channel I 11 and the channel II 12, effectively reducing the heat exchange efficiency and the risk of local hot spots caused by uneven flow distribution. At the same time, the outlet channel 16 helps to collect the fluid from the two channels and guide it out smoothly, avoiding vortex or backflow at the outlet, further stabilizing the system flow field and ensuring the reliability of the heat dissipation performance.

[0066] In addition, the transition design of the inlet channel 15 and the outlet channel 16 avoids the local pressure loss caused by the sudden change of the flow cross-section when the cooling medium enters and leaves the double-layer channel. This smooth flow path optimization, in combination with the flow distribution effect of the double-layer channel itself, contributes to the significant reduction of the total pressure drop of the system, thereby achieving lower pumping power consumption and higher system energy efficiency.

[0067] In addition, the arrangement of the inlet channel 15 and the outlet channel 16 not only improves the structural compactness of the heat dissipation device, but also simplifies the manufacturing and assembly process. The inlet channel 15 and the outlet channel 16 serve as an integrated flow channel module, which is convenient for connection with external pipeline systems through the medium inlet 13 and the medium outlet 14, improving the engineering applicability and reliability of the product.

[0068] In one embodiment, the inlet channel 15 is of a gradually expanding structure, and the outlet channel 16 is of a gradually tapering structure.

[0069] In this embodiment, the inlet channel 15 adopts a gradually expanding structure, which can effectively reduce the average flow velocity of the cooling medium after flowing in from the medium inlet 13, and at the same time convert part of the dynamic pressure into static pressure. This reduces the momentum of the fluid directly, and at the same time increases the static pressure of the inlet chamber, thereby providing more superior conditions for the uniform and smooth distribution of the cooling medium to the channel I 11 and the channel II 12. This ensures the consistency and stability of the double-layer channel heat exchange, and reduces the risk of local overheating caused by uneven distribution from the source.

[0070] The outlet channel 16 adopts a gradually tapering structure, which can make the fluid flow velocity from the two channels increase smoothly, and the pressure transition smoothly, effectively recovering the kinetic energy of the fluid and reducing the local energy loss at the medium outlet 14.

[0071] In one embodiment, a plurality of partitions 118 are arranged on the channel I 11 and / or the channel II 12.

[0072] The plurality of partitions 118 divide the channel I 11 and / or the channel II 12 into a plurality of sub-channels along the flow direction.

[0073] In this embodiment, the long flow channel is divided into a plurality of independent sub-channels by the partitions 118, ensuring that the cooling medium must flow through the entire pre-set heat exchange length in each flow path. This completely avoids the phenomenon that the fluid may not flow through certain areas without partitions 118, which tends to choose the path with the smallest flow resistance, thereby ensuring complete cooling coverage of the entire radiator panel.

[0074] In addition, the partitions 118 themselves also produce local flow disturbance effects at the entrances and exits of the sub-channels. This large-scale disturbance generated by the sub-channel structure, combined with the small-scale, high-intensity turbulence generated by the jet flow and / or the small-scale turbulence generated by the flow-around column 111, together builds a multi-scale composite flow disturbance field in the flow channel, which can more fully and completely destroy the temperature boundary layer in the entire flow field, achieve efficient mixing of hot and cold fluids, and thus improve the heat exchange performance to a higher level.

[0075] In one embodiment, a plurality of partitions 118 are arranged on the channel I 11 and the channel II 12, and the partitions 118 in the channel I 11 correspond one-to-one to the partitions 118 in the channel II 12.

[0076] In this embodiment, the corresponding partition structure makes the flow channel geometry and flow path of the channel I 11 and the channel II 12 completely mirror-symmetric in the vertical direction. This symmetry ensures that the flow resistance characteristics of the upper and lower channels are highly consistent. In parallel flow paths, the consistency of flow resistance is the fundamental guarantee of uniform flow distribution.

[0077] In addition, the aligned partitions 118 collectively form a support skeleton, greatly enhancing the mechanical strength and stiffness of the entire radiator core, and can more effectively resist fluid pressure fluctuations and external loads. At the same time, the aligned partitions 118 provide a shorter and more direct heat path for heat conduction from the channel II 12 (attached to the heat source 3 side) to the cooling medium in the channel I 11, improving the overall thermal conductivity efficiency and helping to further reduce the temperature of the heat source 3.

[0078] In one embodiment, the flow-around columns 111 are arranged in a rectangular array in the channel I 11.

[0079] In this embodiment, the rectangular array is a kind of regular arrangement, and this highly ordered arrangement makes the flow separation, vortex generation and jet impact position when the cooling medium flows through the flow column 111 present strict regularity. This highly regular and predictable flow field characteristics makes the flow resistance, heat transfer coefficient and other key parameters of the whole heat dissipation system can be more accurately predicted and controlled in the design and simulation stage, greatly improves the consistency and design reliability of product performance.

[0080] In addition, the wake vortex and low speed area generated by the rectangular array of flow column 111 downstream, and the jet impact point introduced by the hollow 112 structure, form a regular, periodic distribution of enhanced heat transfer point array on the whole heat transfer surface. This uniform distribution of disturbance is like laying a uniform temperature net on the heat source surface, which can systematically and without omission destroy the temperature boundary layer on the whole surface, thereby maximizing the elimination of local hot spots, achieving the ultimate uniformity of the heat source surface temperature, and achieving a significant reduction in maximum temperature difference.

[0081] In addition, this arrangement makes the flow column 111 form a regular internal support frame in the channel, which can uniformly bear the pressure from the partition and the fluid, and enhance the overall structural rigidity.

[0082] In a preferred embodiment, the partition 118 in the channel 111 corresponds to the partition 118 in the channel 112. And each sub-channel of the channel 111 is correspondingly provided with a column of flow column 111, that is, the flow column 111 is arranged in a rectangular array.

[0083] In this embodiment, the complex overall flow field is divided into a plurality of identical cooling units. Each cooling unit is composed of an upper sub-channel, a lower sub-channel, and a column of flow column 111 connecting the two. So that the cooling medium experiences the same flow process in each unit.

[0084] In one embodiment, the jet device is a jet exciter. The jet exciter can actively disturb with high efficiency and zero net mass flow. The jet exciter sucks in and discharges cooling medium from the channel 112 through membrane vibration, without the need for additional cooling medium conveying pipeline and working medium, but can generate strong and periodic jet in the flow passage. This means that the system obtains an extremely efficient additional power source to enhance heat transfer without increasing the total cooling medium flow and pump power, maximizing energy efficiency.

[0085] The jet exciter itself has the characteristics of small volume and low power consumption, and can be easily integrated into a compact double-layer channel heat dissipation system without significantly increasing the volume and complexity of the whole heat dissipation module. This natural compatibility makes this technology very suitable for embedded integration of modern electronic devices (such as CPU, GPU, power chip, etc.) which are extremely sensitive to space.

[0086] In addition, the jet flow generated by the jet flow exciter is precisely guided to the surface of the heat source 3 through the hollow 112 of the flow-around column 111 to the channel II 112. This design enables the limited energy generated by the exciter to be concentrated in the near-wall area where heat exchange needs to be strengthened, and directly acts on the heat source 3 in the form of vertical impact, avoiding the dissipation of energy in the main flow, and realizing efficient and precise use of disturbance energy. In addition, the suction process of the jet flow exciter can suck the cooling medium into the excitation cavity, which can also improve the flow effect of the cooling medium in the channel II 112.

[0087] In one embodiment, the jet flow exciter is a synthetic double jet flow exciter 2. In this embodiment, the synthetic double jet flow exciter 2 can significantly reduce additional energy consumption while allowing the exciter to operate stably at a higher frequency. Higher jet flow frequency means more continuous and intensive fluid disturbance to the surface of the heat source 3, which can more efficiently destroy the temperature boundary layer and thus achieve ultimate heat exchange enhancement and temperature uniformity control.

[0088] In one embodiment, when the flow-around column 111 is arranged in a rectangular array;

[0089] The synthetic double jet flow exciter 2 includes a plurality of transverse grooves 21 arranged in the flow direction, and each transverse groove 21 covers a row of hollow 112 of the flow-around column 111 outside the communication heat dissipation channel 1 arranged transversely;

[0090] The transverse groove 21 is connected to at least one jet flow outlet 22 of the synthetic double jet flow exciter 2.

[0091] In this embodiment, there is no need for a separate jet flow outlet 22 for each flow-around column 111, and full coverage jet flow impact on the entire heat source 3 can be achieved through the minimum jet flow outlet 22, significantly reducing the complexity and control difficulty of the exciter.

[0092] The jet flow generation and intensity of the row of flow-around columns 111 connected by the same transverse groove 21 have high consistency, which fundamentally ensures the synchronization and uniformity of jet flow cooling in the direction perpendicular to the flow, effectively avoiding local temperature fluctuations caused by asynchronous jet flow.

[0093] The combination of the transverse groove 21 and the flow-around column 111 arranged in a rectangular array enables active jet flow points to be distributed at each column position (i.e. any cross section in the flow direction) of the heat source 3. This design ensures that the cooling medium can continuously be disturbed and heat exchange enhanced by jet flow throughout the flow path from the inlet to the outlet, realizing active temperature management of the heat source 3 without dead angle and throughout the entire flow channel.

[0094] The application also provides a double-layer channel active flow control liquid cooling method using the double-layer channel active flow control liquid cooling device, comprising the following steps:

[0095] S1, the heat dissipation channel 1 is located outside the channel II 12 and installs a heat source 3;

[0096] S2, the medium inlet 13 flows into the cooling medium into the channel I 11 and the channel II 12, and the cooling medium exchanges heat with the inner wall of the channel I 11 and the channel II 12 and the side wall of the flow column 111, and then flows out from the medium outlet 14;

[0097] The cooling medium enhances the flow around when passing through the flow column 111 in the channel I 11, thereby improving the heat exchange effect;

[0098] The jet flow device injects jet flow into the channel II 12 through the hollow 112 of the flow column 111, enhances the flow around and destroys the boundary layer of the heat exchange surface, and improves the heat exchange effect.

[0099] In order to further illustrate the excellent performance of the structure in the application, four working conditions are designed according to whether the synthetic double jet flow exciter 2 works and the number of layers of the heat dissipation channel 1. Through preliminary simulation, the comprehensive performance of the four working conditions is compared, as shown in Table 1:

[0100] Table 1 Working conditions used for calculation

[0101]

[0102] Among them, case 1 and case 3 pass cooling working medium into the channel II 12 of the heat dissipation channel 1, and case 2 and case 4 pass cooling working medium into the channel I 11 and the channel II 12. The flow field is simulated by using Fluent 2020 R2, the number of grids is 8123341, the three-dimensional model grid is as shown in Figure 11 , the turbulence model is SST k-w, the cooling working medium is liquid water, and the material of the heat dissipation channel 1 is copper. The heat flux of the heat source 3 is 250W / cm², and the total flow of the system is 1.2LPM.

[0103] The system average temperature, the highest temperature and the pressure drop calculated by the four working conditions are as follows: Figure 12As shown, the average temperature of the heat source 3 in the double-layer channel is reduced from 98°C to 87.6°C, and the maximum temperature is significantly reduced from 110°C to 99.8°C, compared with the single-layer channel without the synthetic double-jet exciter 2. This indicates that the heat exchange performance of the double-layer structure is better than that of the single-layer structure, which can more effectively take away heat and suppress local overheating. In addition, the pressure drop of the double-layer channel is reduced by 33.5% compared with the single-layer structure, effectively reducing the flow resistance of the system. After the synthetic double-jet exciter 2 is turned on, the average temperature and the maximum temperature of the heat source 3 are greatly reduced, and the overall heat exchange performance of the system is rapidly improved. However, due to the influence of the jet disturbance of the synthetic double-jet exciter 2, the system pressure drop of the single-layer channel increases by 14.8% compared with the working condition without jet disturbance, while the double-layer channel only increases by 5%, indicating that the flow splitting effect of the double-layer channel effectively slows down the increase of the system pressure drop. In addition, compared with the single-layer channel without the synthetic double-jet exciter 2, the double-layer channel with the synthetic double-jet exciter 2 can reduce the maximum temperature difference of the heat source 3 from 37°C to 25°C. Therefore, coupling the synthetic double-jet exciter 2 with the double-layer channel can have high heat exchange efficiency, low flow resistance, and excellent temperature uniformity.

[0104] Figure 13 For the velocity cloud diagram of the channel I 11 with the flow-around column 111, it can be seen that when the liquid water flows near the flow-around column 111, due to the reduction of the flow passage cross-sectional area, the liquid water is accelerated to a medium-high speed jet in the narrow gap, and a large range of blue low-speed backflow area is clearly formed downstream of each rib. The liquid water collides, separates and bypasses the flow-around column 111, and forms a stable separation vortex behind the flow-around column 111, which continuously entrains fluid, destroys the temperature boundary layer near the wall, and realizes efficient mixing and energy exchange of cold and hot fluids. Figure 14 For the temperature cloud diagram of the jet-impacted wall surface in the channel II 12, the left side shows the moment when the synthetic double-jet exciter 2 is closed, and the heat source 3 presents a single and continuous high-temperature core area; the right side shows the moment when the synthetic double-jet exciter 2 is turned on, at this time, the front cavity of the synthetic double-jet exciter 2 is blowing, and the rear cavity is suction, and the generated jet promotes the mixing of the surrounding fluid through the entrainment effect. Specifically, the center of the heat source 3 is vertically impacted by multiple jets, forming multiple parallel low-temperature zones, the high-temperature core area is divided and reduced, effectively controlling the temperature rise and avoiding local overheating.

[0105] The above is only an embodiment of the present application, and does not limit the present application in any way. Any person skilled in the art can make many possible changes, modifications or modifications to the technical solutions of the present application without departing from the scope of the technical solutions of the present application, and equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application shall fall within the scope of protection of the technical solutions of the present application.

Claims

1. A double-layer channel active flow control liquid cooling device, characterized in that, The heat dissipation channel (1) comprises a channel I (11) and a channel II (12) which are isolated from each other, and the channel I (11) and the channel II (12) have a common medium inlet (13) and a medium outlet (14); The channel I (11) is provided with a plurality of flow-around columns (111) inside, the flow-around column (111) is hollow (112) inside, and the hollow (112) penetrates to the channel II (12) at one end and leads out of the heat dissipation channel (1) at the other end; The flow-around column (111) hollow (112) outside the heat dissipation channel (1) is communicated by the fluidic device; The fluidic exciter is a synthetic double fluidic exciter (2); When the flow-around column (111) is arranged in a rectangular array; The synthetic double fluidic exciter (2) comprises a plurality of transverse grooves (21) arranged in an array along the flow direction, and each transverse groove (21) covers a row of flow-around column (111) hollow (112) outside the heat dissipation channel (1) arranged transversely; The transverse groove (21) at least communicates one fluidic outlet (22) of the synthetic double fluidic exciter (2). An inlet channel (15) is arranged between the inlet end of the channel I (11) and the channel II (12) and the medium inlet (13); 2. The dual-layer channel active flow control liquid cooling device of claim 1, wherein, An outlet channel (16) is arranged between the outlet end of the channel I (11) and the channel II (12) and the medium outlet (14). The inlet channel (15) is of a gradually expanding structure, and the outlet channel (16) is of a gradually tapering structure.

3. The dual-layer channel active flow control liquid cooling device of claim 2, wherein, A plurality of partition plates II (18) are arranged on the channel I (11) and / or the channel II (12) at intervals; 4. The dual-layer channel active flow control liquid cooling device of claim 1, wherein, The channel I (11) and / or the channel II (12) are divided into a plurality of sub-channels along the flow direction by the plurality of partition plates II (18). When a plurality of partition plates II (18) are arranged on the channel I (11) and the channel II (12) at intervals, the partition plate II (18) in the channel I (11) corresponds to the partition plate II (18) in the channel II (12) one by one.

5. The dual-layer channel active flow control liquid cooling device of claim 4, wherein the first and second layers are formed of a material selected from the group consisting of: copper, aluminum, and combinations thereof. The flow-around column (111) is arranged in a rectangular array in the channel I (11).

6. The dual-layer channel active flow control liquid cooling device of claim 1, wherein, The method comprises the following steps:

7. A double-layer channel active flow control liquid cooling method using the double-layer channel active flow control liquid cooling device according to any one of claims 1 to 6, characterized in that, S1, a heat source (3) is installed outside the channel II (12) of the heat dissipation channel (1); S2, the medium inlet (13) flows into cooling medium into the channel I (11) and the channel II (12), and the cooling medium exchanges heat with the inner wall of the channel I (11) and the channel II (12) and the side wall of the flow-around column (111) and then flows out from the medium outlet (14); When the cooling medium passes through the flow-around column (111) in the channel I (11), the flow is enhanced, and the heat exchange effect is improved; The fluidic device injects fluid into the channel II (12) through the hollow (112) of the flow-around column (111), enhances the flow and destroys the boundary layer of the heat exchange surface, and improves the heat exchange effect. ​

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