Micro-channel flow guide structure based on impact jet, heat sink and semiconductor device

Abstract

The application belongs to the technical field of semiconductor devices, and discloses a micro-channel flow guide structure based on impact jet flow, a radiator and a semiconductor device, wherein the micro-channel flow guide structure based on impact jet flow comprises a first flow guide channel and a second flow guide channel; a first fin and a second fin are arranged in the first flow guide channel; a third fin is arranged in the second flow guide channel; the third fin is located between the first fin and the second fin and is used for making the cooling fluid impact the third fin to form impact jet flow; the application is particularly suitable for the semiconductor device with large heat dissipation under short-time pulse power working conditions, can form high-intensity impact jet flow, significantly improves the local peak heat dissipation capacity, and provides key technical support for the stable and reliable operation of the semiconductor device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and specifically to a microchannel flow guiding structure, heat sink, and semiconductor device based on impingement jet. Background Technology

[0002] Electronic devices are the basic units that make up electronic systems. They are responsible for processing and controlling electrical signals and realizing functions such as rectification, amplification, and switching. The core of electronic devices is semiconductor devices, which are made of materials such as silicon and germanium, whose conductivity is between that of conductors and insulators.

[0003] Semiconductor devices are the cornerstone of the modern electronics industry. They achieve their functions by precisely controlling the conductivity of materials. Diodes, transistors, and integrated circuits are all semiconductor devices. It is based on semiconductor technology that electronic devices have been able to develop rapidly towards miniaturization, intelligence, and high efficiency, profoundly changing human society.

[0004] Currently, heat dissipation technologies for semiconductor devices under continuous power consumption scenarios (such as vapor chambers and heat pipes) are quite mature. However, for chips that generate transient high heat flow under short-term pulsed power conditions, especially tiny "hot spots" such as computing cores and power amplifiers, traditional heat dissipation solutions suffer from severe lag. Heat bursts forth in a very short time and is difficult to quickly conduct from the inside of the silicon die and diffuse to the macroscopic heat sink, causing the junction temperature of the semiconductor device to spike instantly, forming a difficult-to-solve "local thermal bottleneck".

[0005] Therefore, there is an urgent need for a new technology that can solve the problem of poor local heat dissipation under short-time pulse power conditions. Summary of the Invention

[0006] The purpose of this invention is to provide a microchannel flow guiding structure, heat sink, and semiconductor device based on impingement jet, so as to overcome the above-mentioned problems in the prior art. This invention is particularly suitable for semiconductor devices that dissipate a lot of heat under short-time pulse power conditions. It can form a high-intensity impingement jet, significantly improve the local peak heat dissipation capacity, and provide key technical support for the stable and reliable operation of semiconductor devices.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0008] In a first aspect, the present invention provides a microchannel flow guiding structure based on impingement jet, including a first flow guiding channel and a second flow guiding channel;

[0009] The top of the first flow channel has a first inlet, a second inlet and a third inlet, with the first inlet and the second inlet located on either side of the third inlet;

[0010] The first flow channel has a first fin and a second fin located below the third inlet. A connecting channel is formed between the first fin and the second fin. One end of the connecting channel is connected to the third inlet, and the other end of the connecting channel is connected to the interior of the second flow channel.

[0011] The second flow channel has outlets at both ends. A third fin is provided inside the second flow channel. The third fin is located at the other end of the connecting channel and between the first fin and the second fin. It is used to allow the cooling fluid to flow through the connecting channel and impact the third fin to form an impact jet.

[0012] In some embodiments, the third fin is arranged along the central axis of the first and second flow channels.

[0013] In some embodiments, the vertical distance between the third fin and the first fin is equal to the vertical distance between the third fin and the second fin.

[0014] In some embodiments, the length of the third fin is 0.5 to 1.3 mm.

[0015] In some embodiments, the length of the third fin is 0.7 mm.

[0016] In some embodiments, the first fin and the second fin are symmetrically arranged at the bottom of the third inlet.

[0017] In some embodiments, the third entrance includes a first central entrance, a second central entrance, and a third central entrance arranged sequentially.

[0018] The first fin is located between the first central inlet and the second central inlet, and the second fin is located between the second central inlet and the third central inlet;

[0019] The distance between the first fin and the second fin is equal to the length of the second central inlet.

[0020] In some embodiments, the first flow channel and the second flow channel are connected by a heat sink middle section, the heat sink middle section including the first heat sink middle section and the second heat sink middle section;

[0021] The middle part of the first heat sink is located on the side of the first fin away from the second fin, and the middle part of the second heat sink is located on the side of the second fin away from the first fin;

[0022] The distance between the middle of the first heat sink and the middle of the second heat sink is equal to the length of the third inlet;

[0023] The vertical distance between the middle of the first heat sink and the first fin is equal to the length of the first central inlet, and the vertical distance between the middle of the second heat sink and the second fin is equal to the length of the third central inlet.

[0024] Secondly, the present invention provides a microchannel heat sink based on impingement jet, comprising a plurality of microchannel flow guiding structures based on impingement jet arranged in parallel.

[0025] Thirdly, the present invention provides a semiconductor device in which the heat sink is a microchannel heat sink based on impingement jet.

[0026] The above technical solution has the following advantages or beneficial effects:

[0027] Firstly, this invention provides a microchannel flow guiding structure based on impinging jets, effectively solving the problem of poor local heat dissipation under short-term pulsed power conditions. Its core advantage lies in: by setting a first flow guiding channel, a first inlet, a second inlet, and a third inlet, and integrating a first fin and a second fin below the third inlet to form a connecting channel, and in conjunction with the third fin within the second flow guiding channel, it can effectively guide the cooling fluid through the connecting channel to impact the third fin at high speed under short-term pulsed power conditions, forming a high-intensity, clearly directed impinging jet that directly acts on local hot spots. This greatly enhances the local disturbance and convective heat transfer intensity of the cooling fluid, achieving rapid and concentrated heat removal, significantly improving heat dissipation capacity under transient high heat flux density conditions, and ensuring thermal reliability and stability under extreme pulsed conditions. Simultaneously, through the synergistic effect of the first fin, second fin, third fin, and the outlets at both ends of the second flow guiding channel, it ensures smooth discharge and efficient flow of the cooling fluid, eliminating the flow dead zones and uneven heat dissipation problems that easily occur in traditional designs.

[0028] In some embodiments, by arranging the third fin along the central axis, it is ensured that the cooling fluid ejected from the connecting channel can vertically and accurately impact the central region of the third fin, maximizing the utilization of the kinetic energy of the impact jet, forming a concentrated and efficient heat exchange zone directly below the local hot spot, significantly enhancing the heat dissipation intensity and improving the overall thermal uniformity of the structure.

[0029] In some embodiments, by setting the vertical distance between the third fin and the first and second fins to be equal, precise symmetry and coordination of the flow field are achieved, ensuring that the cooling fluid impacting downwards can be uniformly divided and discharged, eliminating flow deviation and local eddies caused by uneven flow resistance.

[0030] In some embodiments, by limiting the length of the third fin to a precise range of 0.5-1.3 mm, the flow boundary layer can be most effectively disrupted, the convective heat transfer intensity can be greatly enhanced, the local heat dissipation effect can be significantly improved, and the heat can be carried away quickly and uniformly under the impact of short-term high power, thereby maximizing the peak heat dissipation capacity.

[0031] In some embodiments, by precisely setting the length of the third fin to 0.7 mm, a sufficiently large surface area can be provided to efficiently capture the impinging jet and enhance heat transfer, while ensuring that the cooling fluid diffuses smoothly to both outlets after the impact, avoiding flow blockage or backflow, thereby achieving an optimal balance between impinging heat transfer efficiency and flow resistance at the microscale.

[0032] In some embodiments, by symmetrically arranging the first and second fins at the bottom of the third inlet, the cooling fluid can be uniformly guided, laying the foundation for the formation of an efficient impingement jet.

[0033] In some embodiments, by setting the spacing between the first fin and the second fin to be equal to the length of the second central inlet, the fluid from the second central inlet can flow vertically into the connecting channel without obstruction. At the same time, the cooling fluid from the first central inlet and the third central inlet is symmetrically guided to both sides. This not only increases the overall flow rate and momentum of the impinging jet, but also ensures that the impinging jet forms a wider and more uniform high-speed core region on the surface of the third fin, thereby achieving stronger and more uniform heat dissipation performance under pulsed high heat flux conditions.

[0034] In some embodiments, by setting the spacing between the middle portions of the first and second heat sinks to be equal to the length of the third inlet, an efficient vertical heat conduction path is formed, which can quickly conduct and diffuse the heat carried away by the impinging jet, significantly improving the response and dissipation capability to local high heat flux density. At the same time, by setting the vertical distance between the middle portion of the first heat sink and the first fin to be equal to the length of the first central inlet, and the vertical distance between the middle portion of the second heat sink and the second fin to be equal to the length of the third central inlet, the guiding space of the cooling fluid is precisely defined, the flow distribution is optimized and the disturbance is reduced, so that the cooling fluid can converge smoothly and enhance the jet flow, while improving the mechanical stability under thermal cycling.

[0035] Secondly, the present invention provides a microchannel heat sink based on impingement jets. By arranging several microchannel flow guiding structures based on impingement jets in parallel, the heat dissipation is scaled up and arrayed. Each microchannel flow guiding structure based on impingement jets can independently generate a high-intensity impingement jet, thereby forming a uniform and dense impingement cooling area within the entire microchannel heat sink based on impingement jets. The array layout not only significantly improves the total heat dissipation power and heat diffusion efficiency, but also ensures that when facing large-area or non-uniformly distributed heat sources, it can achieve efficient and uniform heat dissipation, significantly enhancing the overall thermal management capability and reliability under harsh pulse power conditions.

[0036] Thirdly, the present invention provides a semiconductor device, wherein the microchannel heat sink based on impingement jet is particularly suitable for semiconductor devices that dissipate a large amount of heat under short-time pulse power conditions, and can significantly improve the local peak heat dissipation capacity, providing key technical support for the stable and reliable operation of semiconductor devices. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the microchannel flow guiding structure based on impingement jet in Embodiment 1 of this specification;

[0038] Figure 2 This is a schematic diagram of the microchannel heat sink based on impingement jet in Embodiment 1 of this specification;

[0039] Figure 3 This is a schematic diagram of the microchannel flow guiding structure based on impingement jet in Embodiment 2 of this specification;

[0040] Figure 4 This is a schematic diagram of the microchannel heat sink based on impingement jet in Embodiment 2 of this specification;

[0041] Figure 5 This is a schematic diagram of the microchannel flow guiding structure based on impingement jet in Embodiment 3 of this specification;

[0042] Figure 6 This is a schematic diagram of the microchannel heat sink based on impingement jet in Embodiment 3 of this specification;

[0043] Figure 7 This is a schematic diagram of the microchannel flow guiding structure based on impingement jet in Embodiment 4 of this specification;

[0044] Figure 8 This is a schematic diagram of the microchannel heat sink based on impingement jet in Embodiment 4 of this specification;

[0045] Figure 9 This is a schematic diagram of the microchannel flow guiding structure based on impingement jet in Embodiment 5 of this specification;

[0046] Figure 10 This is a schematic diagram of the microchannel heat sink based on impingement jet in Embodiment 5 of this specification;

[0047] Figure 11 This is a schematic diagram of the simulation experimental system in this manual;

[0048] Figure 12 Peak pressure drop at the inlet With the entrance Reynolds number Re A schematic diagram of the changing relationship;

[0049] Figure 13 Peak pressure drop at the inlet Ratio to length A schematic diagram of the changing relationship;

[0050] Figure 14 The highest temperature of the heat sink substrate T bottom Ratio to length A schematic diagram of the changing relationship;

[0051] Figure 15 For maximum temperature difference | T bottom - T ave |Ratio to length A schematic diagram of the changing relationship;

[0052] Figure 16 For Nusel number With the entrance Reynolds number Re A schematic diagram of the changing relationship;

[0053] Figure 17 The overall thermal performance coefficient With the entrance Reynolds number Re A schematic diagram of the changing relationship;

[0054] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically:

[0055] 1. First inlet; 2. Second inlet; 3. First central inlet; 4. First fin; 5. Second fin; 6. Third fin; 7. First outlet; 8. Second outlet; 9. Central part of the first heat sink; 10. Circulating constant temperature water bath; 11. Three-phase variable frequency DC power supply; 12. Adjustable DC power supply; 13. Computer; 14. Data acquisition / switching unit integrator; 15. AC adjustable transformer; 16. Diverter valve; 17. Digital peristaltic pump; 18. Pressure monitoring sensor; 31. Second central inlet; 32. Third central inlet; 91. Central part of the second heat sink. Detailed Implementation

[0056] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0057] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0059] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0060] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0061] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0062] Example 1:

[0063] This embodiment provides a microchannel flow guiding structure based on impingement jet, see [link to documentation]. Figure 1 This includes a first guide channel and a second guide channel;

[0064] The first flow channel has a first inlet 1, a second inlet 2, and a third inlet at its top, with the first inlet 1 and the second inlet 2 located on either side of the third inlet. The third inlet includes a first central inlet 3, a second central inlet 31, and a third central inlet 32 ​​arranged in parallel. A first fin 4 and a second fin 5 are arranged below the third inlet within the first flow channel. The first fin 4 and the second fin 5 are symmetrically arranged at the bottom of the third inlet. The first fin 4 is located between the first central inlet 3 and the second central inlet 31, and the second fin 5 is located between the second central inlet 31 and the third central inlet 32. The distance between the first fin 4 and the second fin 5 is equal to the length of the second central inlet 31. A connecting channel is formed between the first fin 4 and the second fin 5. One end of the connecting channel is connected to the second central inlet 31, and the other end of the connecting channel is connected to the interior of the second flow channel.

[0065] The first flow channel and the second flow channel are connected by a heat sink middle section. The heat sink middle section includes a first heat sink middle section 9 and a second heat sink middle section 91 arranged in parallel. The first heat sink middle section 9 is located on the side of the first fin 4 away from the second fin 5, and the second heat sink middle section 91 is located on the side of the second fin 5 away from the first fin 4. The distance between the first heat sink middle section 9 and the second heat sink middle section 91 is equal to the length of the third inlet. The vertical distance between the first heat sink middle section 9 and the first fin 4 is equal to the length of the first middle inlet 3. The vertical distance between the second heat sink middle section 91 and the second fin 5 is equal to the length of the third middle inlet 32.

[0066] The second flow channel has outlets at both ends, including a first outlet 7 and a second outlet 8. The first outlet 7 is located at the end of the second flow channel near the first inlet 1, and the second outlet 8 is located at the end of the second flow channel near the second inlet 2. A third fin 6 is provided on the inner bottom wall of the second flow channel. The third fin 6 is located at the other end of the connecting channel. The third fin 6 is arranged along the central axis of the first flow channel and the second flow channel, and is located between the first fin 4 and the second fin 5. The vertical distance between the third fin 6 and the first fin 4 is equal to the vertical distance between the third fin 6 and the second fin 5. The length of the third fin 6 is 0.5 mm, which is used to allow the cooling fluid to flow through the connecting channel and impact the third fin 6 to form an impact jet.

[0067] Specifically, the first inlet 1 and the second inlet 2 are located at the two ends of the top wall of the first guide channel, and the third inlet is located in the middle of the top wall of the first guide channel.

[0068] Specifically, the top of the first flow channel is the top of the heat sink, and the first inlet 1, the second inlet 2 and the third inlet are all opened on the top of the heat sink. The bottom of the second flow channel is the heat sink substrate, and the third fin 6 is located on the top of the heat sink substrate. The heat sink substrate is a copper-molybdenum substrate.

[0069] Specifically, the middle portion 9 of the first heat sink and the middle portion 91 of the second heat sink are arranged parallel to the top of the heat sink, and the middle portion 9 of the first heat sink and the middle portion 91 of the second heat sink are arranged parallel to the base of the heat sink.

[0070] Specifically, the angle between the first fin 4, the second fin 5 and the bottom of the third inlet is 90°, and the angle between the third fin 6 and the bottom wall of the second guide channel is 90°.

[0071] This embodiment also provides a microchannel heat sink based on impinging jets, see [link / reference]. Figure 2 It includes 25 microchannel flow guiding structures based on impact jets arranged in parallel.

[0072] Specifically, two adjacent first flow channels are connected by a first partition, which separates the first inlet 1, the second inlet 2 and the third inlet of the two adjacent first flow channels. The outlets of two adjacent second flow channels are connected by a second partition.

[0073] Specifically, the overall length of the microchannel heat sink based on impingement jet described in this embodiment is 20 mm, the overall width is 20 mm, and the overall height is 2.4 mm. Among them, the width of a single first flow channel or a single second flow channel is 0.4 mm, the height of a single first flow channel or a single second flow channel is 0.9 mm, the height of the top of the heat sink of a single first flow channel is 0.2 mm, the height of the middle part 9 of the first heat sink or the middle part 91 of the second heat sink is 0.2 mm, the height of the base of the heat sink of a single second flow channel is 0.2 mm, and the thickness of a single first partition or a single second partition is 0.4 mm.

[0074] This embodiment also provides a semiconductor device in which the heat sink adopts the microchannel heat sink based on impingement jet.

[0075] Example 2:

[0076] See Figure 3 and Figure 4 The difference from Embodiment 1 is that the length of the third fin 6 is 0.7 mm.

[0077] Example 3:

[0078] See Figure 5 and Figure 6 The difference from Embodiment 1 is that the length of the third fin 6 is 0.9 mm.

[0079] Example 4:

[0080] See Figure 7 and Figure 8 The difference from Embodiment 1 is that the length of the third fin 6 is 1.1 mm.

[0081] Example 5:

[0082] See Figure 9 and Figure 10 The difference from Embodiment 1 is that the length of the third fin 6 is 1.3 mm.

[0083] The performance of the microchannel heat sinks based on impinging jets described in Examples 1-5 of this specification will be evaluated through simulation experiments below:

[0084] To build a simulation experiment system, see [link / reference]. Figure 11 The simulation experimental system includes: a circulating constant temperature water bath 10, a three-phase frequency conversion DC power supply 11, an adjustable DC power supply 12, a computer 13, a data acquisition / switching unit integrator 14, an AC adjustable transformer 15, a diverter valve 16, a digital peristaltic pump 17, a pressure monitoring sensor 18, a temperature monitor, a ceramic heating element, and the microchannel heat sink based on impingement jet described in Examples 1-5 of this specification;

[0085] One end of the circulating constant temperature water bath 10 is connected to a digital peristaltic pump 17, a three-phase variable frequency DC power supply 11, an adjustable DC power supply 12, and a computer 13. The digital peristaltic pump 17 is connected to a diversion valve 16. The adjustable DC power supply 12 is connected to the three-phase variable frequency DC power supply 11 and the computer 13 in sequence. The computer 13 is connected to the data acquisition / switching unit integrator 14 and the diversion valve 16 in sequence. The other end of the circulating constant temperature water bath 10 is connected to an AC adjustable transformer 15 and a diversion valve 16 in sequence. The diversion valve 16 is connected to a microchannel radiator based on impact jet. The microchannel radiator based on impact jet is connected to a pressure monitoring sensor 18.

[0086] The temperature monitor is located inside the microchannel heat sink based on impingement jet. The temperature monitor is connected to the computer 13 and the power supply respectively. The ceramic heating element is connected to the microchannel heat sink based on impingement jet and the power supply respectively. The power supply can be a three-phase frequency conversion DC power supply 11 or an adjustable DC power supply 12, which can be adjusted adaptively according to the site conditions.

[0087] The circulating constant temperature water bath 10, the digital peristaltic pump 17, the diversion valve 16, the microchannel heat sink based on impact jet and the pressure monitoring sensor 18 form a high and low temperature circulation system;

[0088] The pressure monitoring sensor 18 can also be called a smart digital pressure gauge, and the AC adjustable transformer 15 is model STG-500 W (Synchronous Transformer Governor-500 Watt).

[0089] This simulation experiment strictly follows laboratory rules and regulations, and personnel must cooperate throughout the entire operation. The specific operating steps are as follows:

[0090] Step 1: Establish a simulation experiment system and carefully check whether each piece of equipment in the simulation experiment system is installed accurately to avoid wiring errors or omissions.

[0091] Step 2: After confirming that the installation is correct, start the circulating constant temperature water bath 10 and set the initial temperature of the circulating constant temperature water bath 10.

[0092] Step 3: In order to make the cooling fluid reach the target temperature, turn on the pressure monitoring sensor 18, computer 13, digital peristaltic pump 17, temperature monitor and AC adjustable transformer 15 in sequence to ensure stable operation of the equipment.

[0093] Step 4: When configuring the digital peristaltic pump 17, select the quantitative input mode to inject the cooling fluid, set the target volumetric flow rate, and at the same time check whether the high and low temperature circulation system is leaking to ensure that the simulation experiment proceeds smoothly.

[0094] Step 5: Adjust the output voltage of the AC adjustable transformer 15 using the knob until the display screen of the AC adjustable transformer 15 stably displays 200 V;

[0095] Step 6: Keep the initial settings of the high and low temperature cycling system unchanged to ensure continuous and stable operation of the simulation experiment system;

[0096] Step 7: When the readings of the temperature monitor and the pressure monitoring sensor 18 remain constant, it indicates that the simulation experiment system has reached a stable state, and the data acquisition / switching unit integrator 14 is started to acquire data.

[0097] Step 8: After completing the entire set of data recording, first turn off the AC adjustable transformer 15, wait 1-2 minutes, and then stop the operation of the digital peristaltic pump 17. This ensures that the ceramic heating element cools down quickly and avoids overheating damage. Then prepare for the next round of simulation experiments.

[0098] Step nine: During subsequent operation, while keeping other variables constant, adjust the flow rate of the cooling fluid using the digital peristaltic pump 17 to collect the next set of measurement data.

[0099] Step 10: After all simulation experiments are completed, shut down the high and low temperature circulation system, digital peristaltic pump 17, pressure monitoring sensor 18 and temperature monitor, drain the cooling fluid from each device, and restore all instruments / equipment to their original positions.

[0100] See Figure 12 Simulation results reveal that the reference model and the peak inlet pressure drop of the microchannel heat sink based on impingement jet described in Examples 1-5 of this invention are consistent. The changing behavior varies significantly, and the inlet peak pressure drop... This refers to the maximum pressure loss value among all inlets; where the reference model is a traditional double-layer flat microchannel radiator, and for a traditional double-layer flat microchannel radiator, the inlet peak pressure drop is... With the entry Reynolds number Re The increase in [value] shows a linear growth, indicating the presence of laminar flow characteristics; in contrast, the microchannel heat sinks based on impinging jets described in Examples 1-5 of this specification, at the same inlet Reynolds number... Re Peak pressure drop at the inlet Significantly higher, and with increasing inlet Reynolds number Re The upward trend is steeper, reflecting nonlinear characteristics and indicating the presence of turbulent behavior. The nonlinearity observed in the figure is attributed to the interaction between the impinging jet and the cooling loop, as well as the high inlet Reynolds number. Re The enhanced corner mixing effect is achieved by the cooling circuit, which is formed by a first central inlet 3, a second central inlet 31, a third central inlet 32, a first outlet 7, and a second outlet 8, wherein the high inlet Reynolds number... Re Set as Re ≥7.

[0101] See Figure 13 To comprehensively explore the inlet peak pressure drop of the microchannel heat sink based on impingement jet described in Examples 1-5 of this invention, Characteristics: The flow velocity V1 of the cooling fluid at the first central inlet 3, the second central inlet 31, and the third central inlet 32 ​​in Examples 1-5 is set to 0.65 m / s. Analysis is performed when the inlet Reynolds number... Re When the peak inlet pressure drop is 359.32, the peak inlet pressure drop is... Ratio to length The relationship, among which, Indicates the specified length within the second flow channel. This indicates the total length of the second guide channel. This represents the ratio of the specified length within the second guide channel to the total length, simply referred to as the length ratio; the results show that the inlet peak pressure drop in Examples 1-5... All appear stably At 0.2, it is worth noting that the inlet peak pressure drop at the third fin 6 (0.7 mm in length) in Example 2 is significant. The maximum value (3.55 kPa) is found in Examples 1-5. This maximum value mainly originates from the impact jet array formed when the length of the third fin 6 is 0.7 mm. The cooling fluid undergoes a significant change in direction at the third fin 6, resulting in an increase in local pressure resistance.

[0102] See Figure 14 The heat distribution of the heat sink substrate is a direct indicator of the cooling efficiency of the microchannel radiator based on the impinging jet. The figure shows the heat distribution along the central axis (also known as the centerline) of the heat sink substrate under a flow velocity of V1 of 0.65 m / s. According to the numerical simulation results, the temperature of the reference model (traditional double-layer flat microchannel radiator) along the horizontal axis shows a continuous upward trend, approximately linearly related, and the highest observed temperature of the heat sink substrate is... T bottom The temperature reached 323.26 K, an increase of 5.94 K from the initial temperature of 317.32 K. In contrast, the temperature changes of the microchannel heat sinks based on impinging jets described in Examples 1-5 of this invention exhibited almost the same trend: an initial increase followed by a decrease. Notably, the final temperature of the microchannel heat sinks based on impinging jets described in Examples 1-5 after cooling was slightly lower than the initial temperature. Among them, the highest temperature of the heat sink substrate of the microchannel heat sink based on impinging jets described in Example 2 was... T bottom With a K of only 315.17, it significantly enhances local heat dissipation capabilities compared to the reference model.

[0103] See Figure 15 To deeply analyze the thermal behavior of the reference model (traditional double-layer flat microchannel heat sink) and the microchannel heat sink based on impinging jet described in Examples 1-5 of this invention, the figure shows the average heat sink substrate temperature distribution along the horizontal axis under a flow velocity of V1 of 0.65 m / s. Simulation results show that the minimum temperature difference between the microchannel heat sink based on impinging jet described in Examples 1-5 and the reference model is close to zero. The maximum temperature difference of the microchannel heat sink based on impinging jet described in Examples 1-5 is... T bottom - T ave |Only 1.22 K, while the maximum temperature difference of the reference model| T bottom - T ave | Up to 3.23 K, where, T aveThis indicates the average temperature of the cooling fluid; more importantly, in Examples 1-5, the microchannel radiator based on impinging jets described in Example 3... A significant temperature peak appears at 0.425, with the maximum temperature difference | T bottom - T ave | is 1.43 K, and the microchannel heat sink based on impinging jet described in Example 2 is also in A temperature peak exists at 0.425, and the maximum temperature difference is | T bottom - T ave | At only 1.21 K, it performs best in Examples 1-5. The smaller temperature difference corresponds to a reduction in thermal stress, which can effectively prevent thermal warping and improve the thermal stability of the radiator.

[0104] See Figure 16 This demonstrates the Nusel number With the entrance Reynolds number Re The relationship between these parameters provides a basis for evaluating the heat transfer performance of the microchannel heat sink based on impingement jet described in Examples 1-5 of this specification and the reference model (traditional double-layer flat microchannel heat sink). Numerical simulation results show that when the length of the third fin 6 is 0.5 mm (Example 1), at the inlet Reynolds number... Re Nusel number = 580.44 The value is as high as 64.44, which is higher than the reference model at the same entry Reynolds number. Re Nusel number = 580.44 33.78, an increase of 90.76%.

[0105] See Figure 17 To further evaluate the overall thermal performance of the microchannel heat sinks based on impinging jets described in Examples 1-5 of this specification, we introduce the Performance Evaluation Criterion of Integrated Heat Exchange (PEC) as an evaluation index, which can effectively reflect the degree of improvement in convective heat transfer performance. The evaluation index uses the overall thermal performance coefficient of the reference model (traditional double-layer flat microchannel heat sink). With a baseline value of 1, the expression for the evaluation index is PEC= In the formula, Indicates the initial Nusselt number; This represents the maximum pressure loss value among all inlets, i.e., the peak pressure drop at the inlet; This represents the initial pressure loss value at the inlet.

[0106] Except for Example 2 (where the length of the third fin 6 is 0.7 mm), Examples 1, 3, 4, 5, and the reference model all exhibit the same trend, specifically: when the inlet Reynolds number... Re When the coefficient of performance is stable in the range of 248.76 to 469.88, the overall thermal performance coefficient is... It fluctuated between 1.32 and 1.34; while Example 2 remained at the same inlet Reynolds number. Re It exhibits a significant improvement over the range, peaking at 1.41, and consistently demonstrates the best overall heat transfer performance. This is based on the overall thermal performance coefficient. The trend shows that when the length of the third fin 6 is 0.7mm, the heat dissipation performance is the most outstanding. It can significantly improve the convective heat transfer performance while maintaining an acceptable inlet peak pressure drop loss, thus achieving a relative balance between flow resistance and thermal resistance.

[0107] In summary, the research results confirm that the third fin 6 with a length of 0.5 mm (Example 1) and 0.7 mm (Example 2) has better heat transfer performance and lower thermal stress, and is more advantageous in thermal management applications compared with the reference model.

[0108] In the numerical simulations of the above simulation experiments, the flow and heat transfer behavior is described by the Navier-Stokes equations and the Fourier heat transfer equations. The main governing equations are as follows:

[0109] mass conservation equation: In the formula, This represents the gradient, which is a constant function and the vector in the direction of the maximum increment. Indicates the density of the cooling fluid; Represents the velocity in the horizontal direction;

[0110] Momentum conservation equation: In the formula, Indicates the pressure of the cooling fluid; Indicates dynamic viscosity;

[0111] Energy equation for cooling fluid flow rate: In the formula, Indicates temperature; Indicates the thermal conductivity of the cooling fluid; Indicates specific heat capacity;

[0112] Energy equation for heat sink substrate: In the formula, Indicates the thermal conductivity of the cooling fluid; Indicates the heat sink substrate; Indicates the thermal conductivity of the heat sink substrate; The symbol represents partial derivatives, used for performing partial derivative operations on variables; Represents the x-axis value; Represents the ordinate value; Represents the vertical coordinate value;

[0113] Boundary conditions: Examples 1-5;

[0114] First central entrance 3, second central entrance 31, and third central entrance 32 (z=0): , , , In the formula, Represents the velocity in the vertical direction; Represents the velocity in the vertical direction; This represents the initial velocity of the first central inlet 3, the second central inlet 31, and the third central inlet 32; This indicates the initial temperature of the first central inlet 3, the second central inlet 31, and the third central inlet 32;

[0115] Entry Reynolds number: , In the formula, Re Indicates the inlet Reynolds number; Indicates the hydraulic diameter; Indicates the width of a single first guide channel or a single second guide channel; Indicates the height of a single first guide channel or a single second guide channel;

[0116] Total thermal resistance: In the formula, Indicates the total thermal resistance; Indicates the highest temperature; Indicates the total heat load;

[0117] Total heat load: In the formula, Indicates heat flux density; Indicates the surface area of ​​the heat sink substrate;

[0118] Nusselt number: , In the formula, Represents the Nusselt number; This represents the average value of the heat transfer coefficient. This refers to the surface area of ​​a single first guide channel or a single second guide channel; This represents the average temperature difference between the cooling fluid and the heat sink substrate.

[0119] The numerical simulations of the above experiments were performed using ANSYS Fluent 2022 R1 (ANSYS Fluent 2022 Release 1, the first release of ANSYS fluid simulation software in 2022), and the governing equations were solved using the finite volume method. Pressure-velocity coupling was implemented using the SIMPLEC (Semi-Implicit Method for Pressure-Linked Equations Consistent) algorithm. Both the mass conservation equations and momentum conservation equations were discretized using a second-order upwind scheme to ensure numerical stability and accuracy. The residual convergence criteria were set as follows: continuity and velocity residuals were set to 10. -6 The energy residual is 10. -8 To simulate real operating conditions, the cooling fluid velocities at the first central inlet 3, the second central inlet 31, and the third central inlet 32 ​​were gradually varied from 0.25 m / s, 0.45 m / s, 0.65 m / s to 1.05 m / s, with corresponding inlet Reynolds numbers. Re The figures are 138.20, 248.76, 359.32, 469.88 and 580.44 respectively.

[0120] The structure and working principle of the present invention will be further explained below:

[0121] The microchannel flow guiding structure based on impingement jet shown in Examples 1-5 of this specification includes the following steps when in use:

[0122] Step 1: Simultaneously introduce cooling fluid into the first inlet 1, the second inlet 2, and the third inlet;

[0123] Step two: After passing through the first inlet 1 and the second inlet 2, the cooling fluid enters the first guide channel. The cooling fluid through the first inlet 1 flows towards the first fin 4 and flows into the second guide channel under the action of the first fin 4. The cooling fluid through the second inlet 2 flows towards the second fin 5 and flows into the second guide channel under the action of the second fin 5. After passing through the third inlet, the cooling fluid enters the first guide channel and, under the synergistic action of the first fin 4 and the second fin 5, impacts the third fin 6 to split the flow. The split cooling fluid then flows into the second guide channel.

[0124] Specifically, the cooling fluid enters the first guide channel after passing through the third inlet. Under the action of the first fin 4 and the second fin 5, it impacts the third fin 6 and is diverted. The diverted cooling fluid then flows into the second guide channel, specifically including:

[0125] Cooling fluid enters the first guide channel after passing through the first central inlet 3, the second central inlet 31, and the third central inlet 32 ​​simultaneously. The cooling fluid after passing through the first central inlet 3 flows into the second guide channel under the action of the first fin 4. The cooling fluid after passing through the third central inlet 32 ​​flows into the second guide channel under the action of the second fin 5. The cooling fluid after passing through the second central inlet 31 is diverted by impacting the third fin 6 under the action of the connecting channel. A portion of the diverted cooling fluid flows into the second guide channel near the end of the first central inlet 3, and the other portion flows into the second guide channel near the end of the third central inlet 32.

[0126] Step 3: The cooling fluid flowing into the second guide channel under the action of the first fin 4 merges with a portion of the split cooling fluid and flows out through the first outlet 7; the cooling fluid flowing into the second guide channel under the action of the second fin 5 merges with another portion of the split cooling fluid and flows out through the second outlet 8.

[0127] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the above embodiments should be considered exemplary rather than restrictive in all respects.

[0128] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity; those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art. The above content is merely illustrative of the technical concept of the present invention and should not be construed as limiting the scope of protection of the present invention. Any modifications made to the technical solutions based on the technical concept proposed in this invention fall within the scope of protection of this invention.

Claims

1. A microchannel flow guiding structure based on impinging jets, characterized in that, The first flow channel and the second flow channel are included. The first flow channel is provided with a first inlet (1), a second inlet (2) and a third inlet at the top. The first flow channel is provided with a first fin (4) and a second fin (5) below the third inlet. The second flow channel is provided with an outlet at each end. The third fin (6) is located between the first fin (4) and the second fin (5) and is used to make the cooling fluid flow through the connecting channel to impact the third fin (6) to form an impinging jet.

2. A microchannel flow guiding structure based on impinging jets according to claim 1, characterized in that The first fin (4) and the second fin (5) are symmetrically arranged at the bottom of the third inlet.

3. A microchannel flow guiding structure based on impinging jets according to claim 2, characterized in that The third fin (6) is located between the first fin (4) and the second fin (5).

4. A microchannel flow guiding structure based on impinging jets according to claim 3, characterized in that The length of the third fin (6) is 0.5-1.3 mm.

5. A microchannel flow guiding structure based on impinging jets according to claim 1, wherein, The length of the third fin (6) is 0.7 mm. The first flow channel and the second flow channel are connected through the heat sink middle part. The first heat sink middle part (9) is located on the side of the first fin (4) away from the second fin (5), and the second heat sink middle part (91) is located on the side of the second fin (5) away from the first fin (4). The distance between the first heat sink middle part (9) and the second heat sink middle part (91) is equal to the length of the third inlet.

6. A microchannel heat sink based on impinging jets, characterized in that, The vertical distance between the first heat sink middle part (9) and the first fin (4) is equal to the length of the first middle inlet (3), and the vertical distance between the second heat sink middle part (91) and the second fin (5) is equal to the length of the third middle inlet (32).

7. A semiconductor device, characterized by A plurality of the micro-channel flow guide structures based on impinging jet according to any one of claims 1-5 are arranged side by side. The heat sink in the semiconductor device adopts the micro-channel heat sink based on impinging jet according to claim 6.

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