State detection of adhesive connections

Abstract

The invention relates to a method for determining the state of a connection system having a first adhesive part, a second adhesive part and a sensor device. The method can be used in particular for determining the relative position of the adhesive elements relative to each other, in which a first adhesive element is brought close to and / or mounted on a second adhesive element and at least one parameter related to the positioning is detected by means of a sensor device. After the adhesive parts are aligned, final installation (reinstallation if necessary) can be carried out. The method can likewise be used to detect the adhesion of the first adhesive member to the second adhesive member and / or to determine the loading or unloading of the adhesive connection. The invention also relates to a connection system, which is provided for carrying out the above-mentioned method (possibly comprising an improvement of the method), and to a kit having a connection system and a functional element. The invention also relates to a method for producing the aforementioned connection system.

Description

TECHNICAL FIELD

[0001] The invention relates to a method for status detection of a connection system. The invention also relates to a connection system which is designed to carry out the method described above, and to a kit having the connection system and a functional element, in particular a mobile router. The invention also relates to a method for producing the connection system described above and to an improved version of the connection system described above, wherein the connection system has a communication component. BACKGROUND

[0002] It is known to combine connection systems, in particular manually separable connection systems, with sensors and devices for further processing and / or transmitting sensor data.

[0003] CN114608623A describes a flexible two-dimensional sensor device, in which a Klettverschluss is used, in which a conductive structure is provided on the back of the respective adhesive element, while a sensor is provided on the back of the respective opposite adhesive element. The connection of the sensor to the conductive structure is achieved by conductive elements which penetrate from the back of the Klettverschluss to the adhesive surface respectively locally. The respective conductive elements can come into contact with one another when the adhesive connection is established.

[0004] DE102018104774B3 describes an electrode which can be worn on the skin, which can be used as a sensor. The skin contact layer of the electrode is provided on one part of a Klettverschluss and can be positioned flexibly on the wearing area forming the second part of the Klettverschluss. The conduction of the electrical potential through the Klettverschluss connection is ensured by the electrical conductivity of the respective Klettverschluss parts, preferably by means of a silver coating.

[0005] US5714706A discloses an insole which can be used as an input area for controlling sound. Here, a piezoelectric sensor is arranged on a base plate by means of a Klettverschluss.

[0006] DE102010060222B4 describes a textile having electrical or electronic components, in particular sensors, for example. The textile is equipped with a contact structure having a Klettverschluss. The clasp parts of the Klettverschluss each have electrically conductive contact elements by means of which an electrically conductive connection can be established via the Klettverschluss.

[0007] CN105640542B, CN218501232U and CN109350015A each describe an arrangement system for sensors for medical use. Here, a Klettverschluss is used respectively for connecting the sensors to a carrier material or for fixing the sensor carrier on a patient.

[0008] US2020 / 0338750A1 discloses a microstructured adhesive attachment, in which electrodes and / or piezoelectric elements can be considered as components of the adhesive attachment. Here, the piezoelectric elements are primarily used as force and contact sensors.

[0009] WO03 / 085273A1 describes a hook and loop fastener that can be separated by electrical excitation. Here, some portions of the hooks of the fastener component are made of an electrically responsive shape memory material, wherein each hook has another electrically "inert" material. When an electric current is directed through the hooks, the hooks straighten and release the hook and loop connection. For this purpose, the hook and loop fastener, or at least some portions thereof, must have corresponding conductivity.

[0010] DE202021002148U1 discloses a fabric suspension device having an information device that can be reversibly fixed to the suspension device on one side. This can be achieved, for example, by Velcro. In one embodiment, the information device has one or more RFID transponders (Radio Frequency Identification).

[0011] CN212433805U and CN209560579U respectively describe the fixation of RFID transponders by means of Velcro.

[0012] US2012 / 0123291A1 discloses a measuring device for determining bioimpedance. For this purpose, multiple probes are mounted on a flexible band. The band is additionally equipped with a device for wirelessly transmitting impedance data. In some embodiments, the band is secured to the body using Velcro.

[0013] US10265019B2 similarly describes a sensor device in which sensors for monitoring physiological parameters are mounted on a flexible headband (or similar headwear), which can be secured to the body, for example, using Velcro. Sensor data transmission can also be achieved via a wireless data transmission module disposed on the headband.

[0014] US11039530B2 describes a communication device disposed on fabric and which can be mounted on clothing to realize a "smart clothing system". Here, the communication device may in particular have an NFC (Near Field Communication) sensor and be secured to the clothing by means of Velcro. The controller of the communication device can be housed in a housing that can be closed by Velcro.

[0015] In existing technologies, parameters measured by sensors do not characterize the properties of the connection system itself. Summary of the Invention

[0016] In contrast, the object of the present invention is to enable the determination of the state of a connection system, and in particular the state of a connection system used to establish a re-detachable connection.

[0017] According to the present invention, the objective is achieved by the method for state detection according to claim 1, the connection system according to claim 8, the kit according to claim 15, and the method for manufacturing the connection system according to claim 16. The dependent claims provide preferred embodiments.

[0018] The method includes: bringing a first adhesive attachment close to and / or attaching it to a second adhesive attachment; and detecting at least one parameter regarding the state of the adhesive bond formed or to be formed between the first and second adhesive attachments via a sensor device. The second adhesive attachment may, if necessary, be present in the form of a surface. If the first adhesive attachment initially only comes into contact with the second adhesive attachment, final attachment is performed after detecting the at least one parameter, at which point at least one additional parameter may be detected during a subsequent iteration of the method.

[0019] The state of an adhesive bond can refer to the presence or absence of an adhesive bond. Therefore, the parameters can provide information about whether adhesive bonds have formed between the adhesive attachments. For example, a predetermined minimum distance can be set between the adhesive attachments. Furthermore, for example, in the case of an adhesive bond, a minimum clamping force detected by a pressure sensor can be set. This ensures controlled proximity and / or installation of the adhesive attachments.

[0020] Alternatively or additionally, the parameters may provide information about whether the adhesive attachments are ready to form an adhesive bond. In other words, whether the adhesive attachments are correctly positioned and / or aligned with each other to form a predetermined adhesive bond.

[0021] Alternatively or additionally, the state of the adhesive bond can refer to the strength of the formed adhesive bond. This allows for achieving sufficient adhesive bond strength and / or early detection of any reduction in adhesive bond strength. For example, the value of the parameter can be compared with a known reference value whose effect on the strength of the adhesive bond is known. For example, the clamping force between the adhesive attachments can be used to assess the strength of the adhesive bond.

[0022] The proximity and / or installation of the first adhesive attachment on the second adhesive attachment is particularly based on at least one parameter detected regarding the state of the adhesive connection, especially when using at least one parameter.

[0023] The method can be configured to evaluate at least one parameter. Specifically, this involves comparing the parameter with stored reference values ​​and / or lookup tables, and / or calculating reference values ​​based on the parameter, which allows for the establishment of a preferably unique correspondence between the parameter value and a known state of the adhesive fastener. Thus, the state of the adhesive connection can be determined particularly reliably based on the parameter.

[0024] Particularly preferably, the state of the adhesive connection is determined directly between the adhesive attachments using the at least one parameter. In other words, the connection of the adhesive attachments is determined based on the internal and / or external influences on the adhesive hook and loop fastener. Thus, conclusions regarding the load and / or bearing capacity of the adhesive attachments or adhesive connections can be given regardless of whether adhesive hook and loop fasteners are used. For example, conclusions regarding the permissible load of the adhesive hook and loop fastener or adhesive connection can be drawn from the external tensile load acting on the adhesive hook and loop fastener and the holding force per unit area of ​​the adhesive attachment.

[0025] The assessment can be specifically configured to determine physical state quantities from the at least one parameter. In other words, the state quantities of the adhesive fasteners can be inferred from the determined parameter. In particular, the contact condition and / or clamping force of the adhesive fasteners can be determined from the relative positions of the individual adhesive fasteners to each other. For example, when adhesive fasteners are installed together, a small distance between them may indicate a strong adhesive bond. A medium distance may indicate a weakened adhesive bond, while a large distance may indicate that the adhesive bond has reached its load limit. Typically, the relative positions of the individual adhesive fasteners are determined by positioning them between reference points fixed on the adhesive fasteners. This allows for the consideration of deformation of the adhesive fasteners, particularly expansion and / or compression.

[0026] Preferably, the method can be configured to output at least one parameter, the value of the parameter, other determined physical quantities, and / or the state of the adhesive bond. The output can be visual. The output can be fed into an electronic monitoring system for further processing. This allows for particularly reliable monitoring of the adhesive bond.

[0027] The method is typically performed with computer assistance. In other words, the method is performed using at least one computer. The method is particularly preferably performed automatically.

[0028] The steps of the method can be repeated, particularly multiple times. Here, if the adhesive bond does not form as expected, the adhesive attachments can be separated from each other again. Thus, the mutual approach and / or installation of the adhesive attachments can be performed iteratively to ensure the desired adhesive bond is achieved.

[0029] Preferably, the sensor element of the sensor device detects one of the following physical quantities between the first adhesive attachment and the second adhesive attachment: displacement, strain, force, pressure, radiation energy, mass concentration, or magnetic field strength.

[0030] The sensor device typically includes at least one technical sensor for detecting parameters related to the state of adhesive bonding.

[0031] In a particularly preferred variant of the method, the sensor element is an optical sensor element, a magnetic sensor, a pressure sensor, a force sensor, or a strain sensor.

[0032] The sensor elements in the optical sensor element group can be, for example, sensors that detect the radiant energy of ambient lighting, or sensors that detect by reflecting a previously emitted light beam. Hall effect sensors and reed switches are particularly suitable in the magnetic sensor group. Bidirectional differential pressure elements are preferably suitable for use as pressure sensors. Examples of force and strain sensors include mechanical, capacitive, inductive, and piezoelectric sensor elements. In principle, any sensor element suitable for detecting at least one of the parameters can be used. The examples listed here for the functional principles of the sensor elements should not be construed as an exhaustive list. In particular, it is conceivable that the sensor elements may belong to multiple categories (e.g., fiber optic strain sensors).

[0033] The at least one parameter allows for the conclusion of the absolute position of the first adhesive attachment. Alternatively or additionally, the at least one parameter allows for the conclusion of the position of the first adhesive attachment relative to the second adhesive attachment. It may be advantageous in this regard to initially bring the adhesive attachments close to each other and then connect them in subsequent method steps. It is also conceivable that, in order to determine the positioning, the first adhesive attachment is installed multiple times within an iterative process and re-detached if necessary, until final installation is achieved in the desired position, with the method being executed multiple times during this iterative process.

[0034] Furthermore, the at least one parameter can also reflect the adhesion state of the first adhesive attachment on the second adhesive attachment in at least one region of the connection system. In this case, the adhesive connection can be established particularly during the first method step.

[0035] Alternatively or additionally, the at least one parameter allows for the conclusion regarding the adhesive bond load. For example, the preload that should be applied during bond establishment can be detected and checked. Furthermore, it can be checked whether the adhesive bond load remains within the expected range after a defined period of time. Detecting the adhesive bond load includes detecting an unloaded state. In particular, an unloaded state can occur when the system is open, i.e., without an adhesive bond being established. This is also understood in the present context as a conclusion regarding the adhesive bond load.

[0036] When performing the method according to the invention, different characteristics of the state of the connection system and / or multiple parameters of different local regions of the connection system can be selectively detected.

[0037] The sensor device further preferably has multiple sensor elements of the same or different types for detecting the at least one parameter.

[0038] A sensor array can be constructed by setting up multiple sensor elements, which can be used to achieve simple position determination. Furthermore, information can be obtained by comparing data from different, preferably similar, sensor elements.

[0039] In one embodiment of the method, the data or a portion of the data from the sensor device is preferably stored, at least temporarily, in the storage device of the connection system. When using the storage device, there is no need for real-time data processing (e.g., during data transmission or processing).

[0040] In another embodiment, a data processing device connected to the system is used to process the data from the sensor devices. Preferably, this allows data from different sensor elements to be combined and / or compared to each other to derive the at least one parameter.

[0041] In a particularly preferred improvement to the method according to the invention, data detected by the sensor device is wirelessly transmitted using the communication components of the connection system. Here, the data may be processed before transmission and / or transmitted as raw data.

[0042] Passive components are particularly suitable for use as communication components, as they do not have their own power supply. In this case, wireless transmission can be carried out, in particular, by a reading device that provides the necessary power in the presence of a magnetic or electromagnetic field.

[0043] The objective is also achieved by a connection system having a first adhesive attachment, a second adhesive attachment, a sensor device, and a controller, the connection system being configured to perform the method according to the invention. The sensor device may in particular have one or more sensors disposed in or formed on or on a sensor membrane (carrier membrane).

[0044] To ensure the feasibility of implementing the method in various improved versions, the connection system preferably includes storage devices and / or data processing devices. It may be particularly advantageous for the connection system to have multiple storage devices and / or data processing devices.

[0045] Particularly preferred is that the sensor device is disposed on or constituted on or in the first adhesive attachment and / or on or in the second adhesive attachment. In particular, the following embodiments are preferred, in which one or more sensor elements are integral components of the structure of each of the adhesive attachments or one of the adhesive attachments.

[0046] The adhesive attachment is preferably two corresponding halves of an adhesive hook and loop fastener or clip-on fastener, wherein one of the adhesive attachments preferably has a hook, umbrella-shaped structure, or palm-shaped adhesive element, while the other adhesive attachment preferably has a looped tape, velvet tape, fabric, nonwoven fabric, and / or a similarly hooked, umbrella-shaped structure, or palm-shaped adhesive element. Here, the looped tape, velvet tape, fabric, or nonwoven fabric particularly has loops and / or fibers for forming an active connection with the corresponding adhesive element.

[0047] Similarly, it can be envisioned that the two adhesive attachments have two halves of a snap fastener adapted for mating. Likewise, the adhesive attachments may each have multiple such halves.

[0048] In an alternative embodiment, one of the adhesive attachments has a microstructure for utilizing intermolecular forces. The microstructure is preferably a protrusion extending from a carrier material, and the protrusion preferably has a height of 20 μm to 800 μm, particularly preferably 40 μm to 70 μm, and especially preferably 50 μm to 60 μm. The protrusion, as a material, is particularly elastomer. Here, the areal density of the protrusion is preferably 10,000 protrusions / cm². 2 Up to 100,000 protrusions / cm 2 Within a certain range, particularly preferred is 15,000 protrusions / cm. 2 Up to 50,000 protrusions / cm 2 Within this range. Furthermore, the protrusions particularly have a maximum width of 500 nm to 3 μm, especially preferably 30 to 100 μm. In this case, the corresponding adhesive attachment has a sufficiently smooth surface and can be, for example, formed by a wall or a glass plate.

[0049] Similarly, it is conceivable to implement the connection system using adhesives or adhesive layers.

[0050] To ensure the feasibility of implementing the particularly preferred improvements discussed above regarding the method, the connection system preferably has a communication component.

[0051] Further preferably, the communication component is disposed or configured on or in one of the adhesive attachments. Similar to the arrangement / configuration of a sensor device, the following embodiments are also preferred, in which the communication component is an integral part of the structure of one or two adhesive attachments. Furthermore, similar to the arrangement / configuration of a sensor device, the communication component may also be disposed or configured on or in a carrier film.

[0052] The meaning of the phrase "an integral part of the structure" can be derived from the manufacturing methods claimed below. However, it is understood that structures manufactured by other methods, consisting of one or more adhesive attachments and sensor devices and / or communication components, are also included in this feature, but those manufacturing methods produce structural complexes of similar form.

[0053] The communication component may be configured to have a storage device; furthermore, the communication component may be configured to optionally or additionally have a data processing device.

[0054] As described above, passive components are particularly suitable for use as communication components, operating without the need for a power supply. For example, passive RFID (Radio Frequency Identification) transponders, especially NFC (Near Field Communication) transponders, HF (High Frequency) transponders, or UHF (Ultra-High Frequency) transponders, are used here. In this case, data transmission requires an external reading device. Advantages here include, in particular, simple structure, simple connectivity, low power consumption, and interoperability. Nevertheless, the method and connection system according to the invention can also be implemented using active or semi-passive communication components. Besides active and semi-passive RFID transponders, this particularly includes devices that communicate using technologies such as Bluetooth, infrared transmission, Wi-Fi, mobile phones, ZigBee, or LoRaWAN (Long-Range Wide Area Network).

[0055] In one embodiment, the connection system has at least two, preferably more than two, communication components. For example, multiple RFID transponders equipped with sensor elements can be arranged in an array on an adhesive attachment; in this case, the signals from the transponders can be used for location determination. Alternatively, the sensor device can be formed by the RFID transponder itself. In this case, the RFID transponder does not have a separate sensor element but provides both a sensor device and a communication component. For example, by using a reading device located on corresponding adhesive attachments in the connection system, conclusions about the relative positions of each adhesive attachment with respect to each other can be drawn by determining which corresponding RFID transponder responds to a query from the reading device.

[0056] In a preferred application, the connectivity system is integrated with a functional element as a kit. The functional element can be, in particular, a mobile router, preferably a 5G router. Here, the functional element is preferably mounted on an adhesive attachment. If the functional element is a mobile router, it can selectively operate independently of the connectivity system's sensor devices and / or communication components, or be configured to read, receive, and forward data from the sensor devices. In contrast, the functional element can be understood as any object to which it is attached, for which the state of the associated adhesive connection should be determined. In particular, other network components (e.g., repeaters) or other electronic components (screens, LED films) can be considered as functional elements.

[0057] The objective is also achieved by a method for manufacturing a connection system, wherein a sensor device is integrated into or disposed on a first and / or second adhesive attachment. This integration / disposition is achieved by weaving or embedding, particularly embedding into a cavity, or by surface bonding.

[0058] An alternative or other method step includes integrating / setting the communication component in or on a first and / or second adhesive attachment by weaving, embedding, especially embedding into a cavity, surface bonding, printing, or vapor deposition.

[0059] These two method steps do not necessarily have to be performed sequentially. It is also conceivable, for example, to embed the sensor device and communication components simultaneously in the same cavity. Furthermore, it is possible to implement the manufacturing method using only one of the method steps, with the corresponding other method step being optional. In this case, the connection system can be configured as explained above and / or in the accompanying drawings.

[0060] A particularly advantageous implementation of the manufacturing method can be achieved by using continuous sensor films and / or continuous films carrying communication components, in which the respective sensors or communication elements are arranged or formed on or in the films at regular intervals. This allows the connection system to be manufactured in a continuous process. For example, an adhesive attachment can be unrolled from a roll (or supplied directly from its own production process), and an adhesive can be applied to the attachment in a continuous process. Then, in another continuous process, the sensor film and / or the film carrying the communication component can be applied to the adhesive. Here, the respective films can also be unrolled from a roll, in particular. Next, a second adhesive layer can be applied, in particular, to achieve the embedding of the respective carrier film.

[0061] In a similar manner, continuous production can be achieved by separately mounting the sensor device / communication component (along with a portion of the carrier membrane if necessary) on the back side of the adhesive attachment and then covering it with an adhesive layer.

[0062] Other advantages of the invention become apparent from the specification and drawings. Similarly, the features described above and to be further explained can be used individually or in any combination according to the invention. The embodiments shown and described should not be construed as an exhaustive enumeration, but rather as exemplary features used to describe the invention. Attached Figure Description

[0063] In the attached image:

[0064] Figure 1 A kit is shown that includes functional elements and a connectivity system, which is in the form of a mobile router, the connectivity system including a sensor device and two communication components, the sensor device having optical sensor elements;

[0065] Figure 2a A partially sectional side view shows another connection system in a connected state, the connection system having magnets and sensor devices as well as communication components, the sensor devices having magnetic sensors;

[0066] Figure 2b Show Figure 2a A partially sectional side view of the connection system in a separated state;

[0067] Figure 3a A partially sectional side view shows another connection system in a connected state, the connection system having magnets and sensor devices as well as communication components, the sensor devices having magnetic sensors;

[0068] Figure 3b Show Figure 3a A partially sectional side view of the connection system in a separated state;

[0069] Figure 4a Partially shown is another connection system in a separated state and a display, the connection system having a magnet and a sensor device having a magnetic sensor;

[0070] Figure 4b Partially shown Figure 4a The connection system and its corresponding display in the case of misaligned or close connections;

[0071] Figure 4c Partially shown Figure 4a and 4b The connection system and its corresponding display in a correctly aligned or close-proximity state;

[0072] Figure 5a A partially sectional side view of another connection system with a sensor device is shown in a connected and loaded state along the connection direction, and the output value of a pressure sensor is shown.

[0073] Figure 5b Show Figure 5a A partially sectional side view of the connection system in a connected state and under load in the opposite direction of the connection, showing the corresponding sensor output values;

[0074] Figure 5c Show Figure 5a and 5b A partially sectional side view of the connection system in the separated state, showing the corresponding sensor output values;

[0075] Figure 5d Show Figures 5a to 5c Visualization of the output values;

[0076] Figure 6a A flowchart illustrating an improved version of the method according to the present invention is shown;

[0077] Figure 6b A flowchart illustrating another improvement to the method according to the present invention is shown;

[0078] Figure 7 A flowchart illustrating the manufacturing method of the connection system;

[0079] Figure 8 Four variations of the first adhesive attachment with sensor devices are shown in partial view;

[0080] Figure 9 Another variation of the first adhesive attachment with a sensor device is shown in part. Detailed Implementation

[0081] Figure 1 Shown is a kit 1 including functional elements, here in the form of a mobile router 11, and a connection system 10 having a first adhesive attachment 12, which is designed as a two-part attachment within the scope of the present illustration. The first adhesive attachment 12 is disposed on a second adhesive attachment 14 (partially shown) by means of its microstructured surface 13.

[0082] In the current embodiment, the second adhesive attachment 14 is formed of a glass plate. A first optical sensor element 15 and a second optical sensor element 17 are embedded in the first adhesive attachment 12, and the first and second optical sensor elements respectively detect radiant energy. These two optical sensor elements 15 and 17 constitute the sensor device 16.

[0083] Each optical sensor element 15, 17 is coupled to a corresponding communication component 18, 19. In the current embodiment, the communication components 18, 19 are configured as RFID transponders having data processing devices 20, 21 and antennas 22, 23, respectively. Here, the corresponding data processing devices 20, 21 respectively include storage devices 42, 43. In an improved embodiment, the controller 44 is configured to perform the method 100 according to the invention (see... Figure 6a ).

[0084] A mobile router 11 is mounted on the back of the first adhesive attachment 12. The mobile router 11 can be fixed to the first adhesive attachment 12 via an optional connection mechanism, for example, using adhesive. The mobile router 11 can be selectively configured as a reading device for reading data from the sensor device 16. It is also conceivable that the mobile router 11 operates independently of the communication components 18 and 19.

[0085] Within the scope of the illustrated embodiments, under conditions of moderate illumination of the surrounding environment by natural and / or artificial light, the attachment state of the first adhesive attachment 12 on the second adhesive attachment 14 can be derived by comparing sensor data from optical sensor elements 15 and 17. In another embodiment, the sensor elements 15 and 17 can actively emit light beams and detect data regarding the reflection of said light beams.

[0086] Figure 2a and Figure 2bAnother embodiment of the connection system 10 is shown in partial and partially sectional side views. Here, the first adhesive attachment 12 has a cavity 24 in particular, in which a sensor device 16 is embedded. The sensor device 16 is constituted by a magnetic sensor 27, here in the form of a reed switch. The second adhesive attachment 14 has a permanent magnet 29 (magnetic lines shown) embedded in a cavity 25 of the second adhesive attachment 14, which is adapted to trigger the magnetic sensor 27 when proximity / connection occurs between the first and second adhesive attachments 12, 14. In the illustrated embodiment, the adhesive connection can be established by an adhesive snap 26, for example via umbrella-shaped structures 31, 33 respectively provided on the first and second adhesive attachments 12, 14.

[0087] exist Figure 2a The diagram shows the connection system 10 in a connected state, where the permanent magnet 29 exerts a significant influence on the magnetic sensor 27. This causes the contact springs within the magnetic sensor 27 to connect to each other, and the magnetic sensor 27 generates a corresponding signal.

[0088] exist Figure 2b The diagram shows the connection system 10 in a separated state, where the magnetic sensor 27 is outside the sensing range of the permanent magnet 29, and the contact springs of the magnetic sensor 27 are separated from each other. Figure 2a and 2b In the illustrated state, sensor data is transmitted to communication component 18. Figure 1 Similar to the implementation scheme, the communication component 18 is configured as an RFID transponder. Unlike the sensor device 16, in this embodiment, the communication component 18 is not an integral part of the adhesive attachments 12, 14.

[0089] Figure 3a and Figure 3b Another embodiment of the connection system 10 is shown in partial and partially sectional side views, respectively. Here, the operating principles of the sensor device 16 and the communication component 18, as well as the basic structure of the connection system 10, correspond to... Figure 2a and Figure 2b The implementation scheme is shown here. Unlike the previous scheme, another form of adhesive fastener 26 is shown here, which is in the form of Velcro. The first adhesive attachment 12 has a loop 36 with a textured surface 35, and the second adhesive attachment 14 has an umbrella-shaped structure 33 that can be hooked to the loop 36 of the textured surface 35.

[0090] exist Figure 3a The image shows connection system 10, which is also in a connected state. Figure 3b The device is in a detached state.

[0091] Figure 4a , Figure 4b andFigure 4c Another embodiment of the connection system 10 is shown in partial detail. The sensor device 16 has a plurality of magnetic sensors 37, which are configured as Hall effect sensors. It is also conceivable that the magnetic sensors 27 could be designed as reed switches (see [reference]). Figures 2a to 3b The sensor device 16 is integrated into the first adhesive attachment 12. The second adhesive attachment 14 has a permanent magnet 29. One or more communication components 18, 19 (see...) Figure 1 This is used to transmit unprocessed or processed sensor data, based on which a display about the positioning of the first adhesive attachment 12 relative to the second adhesive attachment 14 is output on the display 39. It is understood that in the current embodiment, the connection system 10 is configured such that it is sufficient for the adhesive attachments 12 and 14 to be close to each other for the purpose of outputting the display; in this case, establishing an actual adhesive connection is optional for this purpose. Furthermore, it is understood that the illustrated display does not necessarily require a visual display 39, but can also be achieved by a display 39 that functions, for example, acoustically and / or tactilely. It is also conceivable that the display 39 is disposed or configured on the connection system 10, in which case wireless data transmission is not required, and communication components 18 and 19 (see...) are not used or not present at all. Figure 1 ).

[0092] exist Figure 4a The connection system 10 is shown in a separated, non-approaching state. Here, data from the sensor device 16 of the first adhesive attachment 12 is used to display this state, which may also include the disappearance of the signal. The distinction between the non-approaching and approaching states is achieved by the detectability of the permanent magnet 29 by at least one magnetic sensor 37.

[0093] exist Figure 4b The display shows adhesive attachments 12 and 14 close to or connected to each other, where their relative positions do not correspond to the preset configuration. In this situation, the generated display indicates both a misconfiguration and the corrective measures to be taken.

[0094] exist Figure 4c The image shows the first and second adhesive attachments 12 and 14 in a state where they are close to or connected to each other, and the relative positions of the first and second adhesive attachments conform to a set alignment. The display on the display element 39 indicates the corresponding state.

[0095] Figure 5a , Figure 5b and Figure 5cAnother embodiment of the connection system 10 is shown in partial and partially sectional side views, respectively. The sensor device 16 has a pressure sensor 41, particularly a bidirectional differential pressure sensor 41. Within the scope of the present illustration, the pressure sensor 41 is schematically shown as a mechanical element. It will be understood that other forms of pressure sensor 41, such as piezoresistive elements, may also be used. The sensor device 16 is particularly embedded in the cavity 24 of the first adhesive attachment 12. Other components of the connection system 10 correspond to... Figure 2a and 2b The implementation scheme shown in the figure.

[0096] exist Figure 5a The diagram shows a connection system 10 in a connected state, where a first adhesive attachment 12 is loaded by a force F in the direction of a second adhesive attachment 14 (i.e., along the connection direction). Here, the second adhesive attachment 14 is fixed in position. The force F can be applied manually, for example, during the initial connection of the adhesive attachments 12 and 14. A pressure sensor 41 of the sensor device 16 detects the action of the force F on the contact surfaces of the adhesive attachments 12 and 14 in the form of a pressure p1.

[0097] exist Figure 5b In this process, force G acts on the system, and the second adhesive attachment 14 is also fixed in position. Force G can be, for example, the gravity acting on the first adhesive attachment 12. Force G applies a load to the connection between the first and second adhesive attachments 12 and 14 in the opposite direction to the connection direction, at which time the pressure sensor 41 detects a value p2.

[0098] exist Figure 5c In this case, the connection between the first adhesive attachment 12 and the second adhesive attachment 14 is separated or has already separated. In this situation, the pressure sensor 41 records a value p0. This indicates that the adhesive connection has separated intentionally or unintentionally. By means of the sensor value, the connection state and load state (or load state and unloaded state) of the connection system 10 can be reliably determined. This is advantageous during normal use of the connection system 10, as well as during inspection and improvement of the connection system 10. The connection system 10 preferably has multiple pressure sensors 41 (not shown).

[0099] exist Figure 5d The middle shows Figures 5a to 5c A visual representation of the values ​​p1, p0, and p2 in the dataset.

[0100] Figure 6a The diagram shows a flowchart of a preferred improvement variation of the method 100 according to the present invention. In step A), the first adhesive attachment 12 (see...) Figure 1 Installed on the second adhesive attachment 14 (see Figure 1 On. In step B), via sensor device 16 (see Figure 1) Detect a parameter. In step C), via communication component 18 (see Figure 1 Send processed or unprocessed sensor data.

[0101] Figure 6b A flowchart is shown for another variation of the method 100 according to an improved scheme. In step A), the first adhesive attachment 12 (see...) Figure 1 ) Near the second adhesive attachment 14 (see Figure 1 In step B), the sensor device 16 (see...) Figure 1 The detection involves parameters related to positioning. Here, in particular, the detection of adhesive attachments 12 and 14 (see...) Figure 1 ) in a plane parallel to its surface extension (corresponding to Figure 1 , 4a The relative position within the plane of 4c. In step C), this is performed via communication component 18 (see...). Figure 1 Send processed or unprocessed sensor data. Depending on the content of the sensor data, sub-steps B) and C) can be executed multiple times sequentially. In step D), the first adhesive attachment 12 (see...) is... Figure 1 Installed on the second adhesive attachment 14 (see Figure 7 Alternatively, step B) can be performed again after step D) to detect another parameter.

[0102] Figure 1 The connection system 10 is shown (see diagram). Figure 1 A flowchart of the manufacturing method 200 for the sensor device 16 is provided. In step I, the sensor device 16 (see...) is... Figure 1 For example, it can be integrated into the first adhesive attachment 12 (see...). Figure 1 In step II, communication component 18 (see...) is connected to the communication module 18. Figure 1 For example, it can be integrated into the first adhesive attachment 12 (see...). Figure 8 Alternatively, step II can be performed first, followed by step I, or steps I and II can be performed simultaneously. Further alternatively, only one of the steps can be performed.

[0103] Figure 1 The connection system 10 is shown (see Figure 2a The first adhesive attachment 12 has four variations, and the connection system has a sensor device 16. The four variations differ only in their implementation of the adhesive fastener 26 (see...). Figure 7 Adhesive elements. A palmate shape is shown here. The adhesive element 45, hook 47, adhesive layer 49, and half of snap 51.

[0104] In step I of manufacturing method 200 (see...)Figure 1 These four variants are manufactured in an advantageous manner. In this case, the sensor device 16 has a strain sensor 53 disposed in a carrier membrane 55. The carrier membrane 55 with the strain sensor 53 is disposed on the first adhesive attachment 12 by an adhesive layer 57'. Another adhesive layer 57' ensures the embedding of the carrier membrane 55. Here, it should be noted again that the adhesive layer 49 is not for embedding the carrier membrane 55, but for establishing the connection system 10 (see...). Figure 9 The adhesive layer 49 may be provided with a release liner (not shown) during production.

[0105] Figure 8 Another variation of the first adhesive attachment 12 with sensor device 16 is shown. Here, the first adhesive attachment has a nonwoven fabric 59 with corresponding fibers 61. Sensor device 16 has a force sensor 63 disposed in a carrier film 55. The carrier film 55 with force sensor 63 is partially disposed on the back side of the first adhesive attachment 12 and embedded by an adhesive layer 57". The variation shown is similar to... ​ The variant can also be manufactured in a continuous production process.

[0106] In summary, considering all the illustrations in the accompanying drawings, the present invention relates to a method 100 for determining the state of a connection system 10 having a first adhesive attachment 12, a second adhesive attachment 14, and a sensor device 16. The method 100 is particularly useful for determining the relative positions of the adhesive attachments 12 and 14 with respect to each other, wherein the first adhesive attachment 12 is brought close together and / or mounted onto the second adhesive attachment 14, and at least one parameter related to positioning is detected by the sensor device 16. After aligning the adhesive attachments 12 and 14, a final installation (reinstallation if necessary) can be performed. The method 100 is also particularly useful for detecting the attachment of the first adhesive attachment 12 to the second adhesive attachment 14 and / or for determining whether the adhesive connection is loaded or unloaded. In a preferred embodiment of the method 100, processed and / or unprocessed sensor data can be wirelessly transmitted via a communication component 18. Furthermore, the invention also relates to a connection system 10 configured to perform the aforementioned method 100 (possibly including improvements to the method 100), and a kit 1 having the connection system 10 and functional elements, particularly a mobile router 11. The present invention also relates to a method 200 for manufacturing the above-described connection system 10.

[0107] List of reference numerals

[0108] 1 kit

[0109] 10. Connection System

[0110] 11 Mobile Routers

[0111] 12 First attachment

[0112] 13 Microstructured surfaces

[0113] 14 Second Attachment

[0114] 15 First optical sensor element

[0115] 16 Sensor Devices

[0116] 17 Second optical sensor element

[0117] 18 Communication Components

[0118] 19 Communication Components

[0119] 20 Data processing devices

[0120] 21 Data processing device

[0121] 22 antennas

[0122] 23 antennas

[0123] 24. Cavity

[0124] 25 Cavity

[0125] 26. Adhesive Fasteners

[0126] 27. Magnetic sensor (reed switch)

[0127] 29 permanent magnet

[0128] 31 Umbrella-shaped structure

[0129] 33 Umbrella-shaped structure

[0130] 35. Woolen Belt

[0131] 36 rings

[0132] 37. Magnetic sensor (Hall sensor)

[0133] 39 Display devices

[0134] 41 Pressure Sensor

[0135] 42 Storage devices

[0136] 43 Storage devices

[0137] 44 Controller

[0138] 45 Palmate adhesive elements

[0139] 47 hooks

[0140] 49 Adhesive layer

[0141] 51 Half of the snap

[0142] 53 Strain Sensor

[0143] 55 Carrier membrane

[0144] 57' Adhesive layer

[0145] 57” Adhesive layer

[0146] 59 Nonwoven fabrics

[0147] 61 Fibers

[0148] 63 Force Sensor

[0149] 100 Methods for performing state detection on connected systems

[0150] 200 Methods for manufacturing connection systems.

Claims

1. A method (100) for detecting the state of a connection system (10), the connection system (10) having a first adhesive attachment (12) and a second adhesive attachment (14), establishing an adhesive connection between the first adhesive attachment and the second adhesive attachment, and the connection system (10) having a sensor device (16), the method (100) comprising the steps of: A) Bring the first adhesive attachment (12) close to the second adhesive attachment (14) and / or install the first adhesive attachment onto the second adhesive attachment; B) Detect at least one parameter related to the state of the adhesive connection using the sensor device (16); D) Install the first adhesive attachment (12) onto the second adhesive attachment (14), if this has not been done in step A).

2. The method (100) according to claim 1, wherein, The sensor device (16) has sensor elements (15, 27, 41, 53, 63) for detecting displacement, strain, force, pressure, radiation energy, mass concentration or magnetic field strength between the first adhesive attachment (12) and the second adhesive attachment (14).

3. The method (100) according to claim 1 or claim 2, wherein, The sensor device (16) has at least one of the following sensor elements (15, 27, 41, 53, 63); a) Optical sensor element (15); b) Magnetic sensor (27); c) Pressure sensor (41); d) Force sensor (53); e) Strain sensor (63); The at least one parameter is detected using the sensor elements (15, 27, 41, 53, 63); and / or The at least one parameter relates to: i. Positioning of the first adhesive attachment (12); ii. Attachment of the first adhesive attachment (12); and / or iii. The load of the adhesive connection includes the unloaded state of the adhesive connection.

4. The method (100) according to any one of the preceding claims, wherein, The sensor device (16) has two or more sensor elements (15, 27, 41, 53, 63) of the same or different types, and uses the sensor elements (15, 27, 41, 53, 63) to detect at least one parameter.

5. The method (100) according to any one of the preceding claims, wherein, The data of the sensor device (16) is stored, either completely or partially, at least temporarily in the storage device (42) of the connection system (10).

6. The method (100) according to any one of the preceding claims, wherein, The connection system (10) has a data processing device (20) in which data from the sensor device (16) is processed.

7. The method (100) according to any one of the preceding claims, wherein, The connection system (10) has a communication component (18), and the method (100) additionally includes the following step C): C) Wirelessly transmit processed or unprocessed data from the sensor device (16) using the communication component (18).

8. A connection system (10) having a first adhesive attachment (12), a second adhesive attachment (14), a sensor device (16), and a controller (44), the connection system (10) being configured to perform the method (100) according to any one of claims 1 to 4.

9. The connection system (10) according to claim 8, wherein, The connection system (10) has a storage device (42), and the connection system (10) is configured to perform the method (100) according to claim 5; and / or The connection system (10) has a data processing device (20) and is configured to perform the method (100) according to claim 6.

10. The connection system (10) according to any one of claims 8 or 9, wherein, The sensor device (16) is disposed or configured on or in the first adhesive attachment (12), and / or disposed or configured on or in the second adhesive attachment (14).

11. The connection system (10) according to any one of claims 8 to 10, wherein: a) The first adhesive attachment (12) and / or the second adhesive attachment (14) are part of an adhesive hook (26) having a hook (47), an umbrella-shaped structure (31, 33), a palm-shaped attachment element (45), a loop (36) of fiber (61) and / or a loop of a napped tape (35) or a velvet tape or a fabric or nonwoven fabric (59), and / or a half of a snap (51); b) The first adhesive attachment (12) or the second adhesive attachment (14) has a microstructure (13) for utilizing intermolecular forces to adhere to a smooth surface; and / or c) The first adhesive attachment (12) and / or the second adhesive attachment (14) have an adhesive layer (49).

12. The connection system (10) according to any one of claims 8 to 11, wherein, The connection system (10) has at least one communication component (18), and the connection system (10) is configured to perform the method (100) according to claim 7.

13. The connection system (10) according to claim 12, wherein, The at least one communication component (18) is disposed or constituted on or in the first adhesive attachment (12) and / or disposed or constituted on or in the second adhesive attachment (14).

14. The connection system (10) according to any one of claims 12 or 13, wherein, The at least one communication component (18) is a passive element that does not have its own power supply device, wherein the wireless transmission of data of the sensor device (16) can be triggered by means of a reading device.

15. A kit (1) having a connection system (10) according to any one of claims 8 to 14 and functional elements, particularly a mobile router (11), the functional elements being disposed on a first adhesive attachment (12) or a second adhesive attachment (14) of the connection system (10).

16. A method (200) for manufacturing a connection system (10), the method comprising the steps of: I. The connection system (10) is configured according to any one of claims 8 to 14, wherein the sensor device (16) is integrated into a first adhesive attachment (12) and / or a second adhesive attachment (14) by weaving, embedding, particularly embedding into a cavity (24), or by surface bonding, or integrated onto the first adhesive attachment (12) and / or the second adhesive attachment (14); and / or II. The connection system (10) is configured according to any one of claims 12 to 14, by means of weaving, embedding, particularly embedding into a cavity (24), or by surface bonding, or by printing, or by vapor deposition, integrating the communication component (18) into or onto a first adhesive attachment (12) and / or a second adhesive attachment (14).

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