Temperature measurement and calibration device and method for testing semiconductor device

Abstract

The invention belongs to the technical field of semiconductor temperature measurement, and particularly discloses a temperature measurement and calibration device and method for semiconductor device testing, the temperature measurement and calibration device for semiconductor device testing comprises a box body, and a carrying table is arranged in the box body. According to the invention, through the movement of the carrying table, different measurement areas of the calibration substrate on the carrying surface correspond to the contact type temperature sensing surface, and the multi-degree-of-freedom fine adjustment function of the flexible spring or the compression spring group enables the contact type temperature sensing surface to be well attached to areas to be measured with different planeness and parallelism. The moving distance Z1 of the carrying table enables the contact type temperature sensing surface and different to-be-measured areas to carry out temperature detection under approximately equal pressure, and enables the box body to be in a sealed state, thereby meeting the environmental conditions of low temperature measurement and calibration. Finally, full-automatic high-precision and high-repeatability temperature measurement and calibration are realized, and meanwhile, the condition of moisture condensation of the structure and devices in the box body is avoided.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor temperature measurement, and particularly relates to a temperature measurement calibration device for semiconductor device testing and a method thereof. BACKGROUND

[0002] The high-low temperature detection device is the core equipment in semiconductor device testing. The temperature control precision requirement of the industrial-grade device testing has been improved from ±2℃ to within ±0.5℃. However, some high-end devices, such as devices in the biological medical and aerospace fields, often require the detection device to achieve a temperature control precision within ±0.1℃. In order to make the device under test in the same testing condition, the loading table also needs to achieve high temperature uniformity on the basis of high temperature control precision, such as a multi-point temperature range less than 1℃.

[0003] The temperature measurement substrate is processed and assembled, that is, the temperature sensing device (temperature probe such as thermocouple or thermal resistance) is embedded or attached in the form of near-approximate material of the product to be tested, so as to detect and calibrate the temperature of the substrate loading table. The temperature measurement substrate usually carries multiple temperature sensing devices (such as 17) in a uniform arrangement, and is connected to the acquisition and display device through a test cable. The temperature sensor inside the loading table for feedback can be calibrated, and the temperature distribution on the surface of the loading table can be efficiently measured and displayed.

[0004] However, the temperature measuring substrate may have the following problems: 1. Multiple temperature sensing devices, such as thermal resistors, are usually calibrated synchronously in a constant temperature tank after production and manufacturing is completed, and the temperature measuring accuracy of the full temperature range (such as -65℃ to +300℃) is better than the industrial level, so as to cope with the challenge of the temperature control accuracy of the aforementioned detection equipment. However, during the process of embedding or mounting the temperature sensing device, there are errors in the processing of the temperature sensing position, manual errors, joint surface thermal resistance errors, and surrounding environment thermal resistance errors, which will reduce the temperature measuring accuracy of the calibrated temperature sensing device. 2. The overall calibration method of the temperature measuring substrate can be selected to avoid various errors from assembly, but this calibration method needs to use a large-size constant temperature tank to complete, which will further increase the cost of multiple temperature sensing devices and precision processing substrates in terms of technical difficulty and cost; 3. The test cable of multiple temperature sensing devices needs a reasonable arrangement method to separate it from the temperature measuring substrate as much as possible to avoid measurement errors caused by a large number of cables. Therefore, this temperature measuring method generally cannot adapt to the online measurement and calibration of the machine in a closed state, that is, it cannot reproduce the actual detection environment; 4. In order to reduce the thermal capacity of the wiring, thinner wiring is generally selected, which has low reliability and no electromagnetic shielding effect, and the substrate material used for permanent fixation of the temperature sensing device is hard and brittle and easy to damage, so that the maintenance cost of the overall temperature measuring substrate is too high; 5. Due to the fragile nature of the temperature measuring substrate, manual careful operation is required to complete the temperature calibration and detection of the loading table, and the detection process is difficult to realize automation to reduce the labor intensity and human error of the operator.

[0005] Therefore, it is necessary to invent a temperature measurement calibration device for semiconductor device testing and a method thereof to solve the above problems. SUMMARY

[0006] In view of the above problems, the present application provides a temperature measurement calibration device for semiconductor device testing and a method thereof to solve the problems raised in the background art.

[0007] In order to achieve the above object, the present application provides the following technical scheme: a temperature measurement calibration device for semiconductor device testing, comprising a box, the inside of the box is provided with a loading table, and the top of the loading table is provided with a loading surface, a calibration substrate is placed on the top of the loading surface, the material and size of the calibration substrate are the same as those of an actual substrate product, and the calibration substrate is used to restore the surface temperature of the actual substrate product, the loading table is installed on the top of a positioning unit, and the positioning unit is on the top of an upper computer unit, a calibration unit is arranged on the inner top surface of the box, a display unit is installed on the outside of the box, and the upper computer unit is used to control the positioning unit, the calibration unit and the display unit; the calibration unit comprises a visual detection module, a temperature measurement module and a support frame; the support frame is installed on the inner top surface of the box, and the visual detection module and the temperature measurement module are arranged in the support frame; the temperature measurement module comprises a contact temperature sensing surface, a first temperature sensing head, a temperature sensor, a flexible spring, a first housing and a first upper cover; the first temperature sensing head is installed at the center of the flexible spring through an inner ring surface on the top of the first temperature sensing head, the temperature sensor is installed in the first temperature sensing head, the contact temperature sensing surface is arranged on the bottom surface of the first temperature sensing head, and the contact temperature sensing surface is arranged on the bottom surface of the support frame and used to detect the temperature of the calibration substrate on the top of the loading surface, the first housing is installed on the top of the flexible spring, the first upper cover is installed on the top of the first housing through a plurality of screws, and the temperature sensor is connected with a lead wire through a lead wire.

[0008] Further, the flexible spring is provided in a circular plate structure, a plurality of grooves are formed on the surface of the flexible spring, and an integrated spring piece is formed.

[0009] Further, when the contact temperature sensing surface contacts the calibration substrate on the top of the loading surface, the reaction force of the calibration substrate on the contact temperature sensing surface causes the flexible spring to be slightly deformed, and the bottom surface of the contact temperature sensing surface is attached to the top surface of the calibration substrate.

[0010] Further, the temperature measurement module further comprises a second temperature sensing head, a second housing, a second upper cover, a piston and a compression spring group; the second upper cover is installed on the top of the second housing through a plurality of screws, the second upper cover is connected with the lead wire in cooperation with the second housing, the piston is arranged in the second housing, the top surface of the piston is connected with the bottom surface of the second upper cover through a plurality of compression spring groups, the first temperature sensing head is connected with the temperature sensor in the first temperature sensing head, and the temperature sensor is connected with the lead wire through a lead wire.

[0011] Further, the inside of the support frame is provided with a clamping component for defining a temperature measuring module, the clamping component comprises: a side frame, a chuck, a side rod and a first elastic member; the temperature measuring module is provided with a side frame on both sides, the inside end of the side frame is provided with an arc structure, the chuck is inside the side frame, two side rods are fixed on the outside end of the chuck, the inside wall of the side frame is provided with an inner plate, the two side rods correspond to the two inner plates, and the side rod penetrates the inner plate, and the outside surface of the chuck is connected to the inside surface of the inner plate by the first elastic member.

[0012] Further, the inside of the side frame is provided with a locking member for locking the side rod, the locking member comprises: a vertical rod, a round frame and a rotating rod; the inside of the side frame is provided with two vertical rods, the two vertical rods correspond to the two side rods, the surface of the vertical rod is connected to two round frames by two connecting rods, the two round frames are oppositely arranged, and a rotating rod is rotatably connected between the two round frames, and a plurality of missing grooves are formed in the surface of the side rod, and the rotating rod is buckled with the missing grooves.

[0013] Further, the top end and the bottom end of the vertical rod are provided with protrusions, the inside top surface and the inside bottom surface of the side frame are provided with sliding grooves, the two protrusions correspond to the two sliding grooves, the protrusion is inside the sliding groove, and the adjacent two vertical rods are connected by a second elastic member.

[0014] Further, the top surface of the top protrusion is provided with a insertion hole, the top surface of the side frame is provided with a through hole, and a insertion rod is inserted into the through hole, and the insertion rod is vertically inserted into the insertion hole by the through hole.

[0015] The application also provides a temperature measurement calibration method for semiconductor device testing, which applies the temperature measurement calibration device for semiconductor device testing. S1, the calibration substrate is placed on the top of the loading surface by the mechanical arm, the positioning unit of the upper computer unit moves the loading table, the moving loading table moves the calibration substrate on the loading surface to the bottom of the calibration unit, and the calibration substrate corresponds to the contact temperature sensing surface; S2, the loading table moves the calibration substrate on the loading surface upwards until the calibration substrate contacts the contact temperature sensing surface, and the visual detection module and the temperature measuring module monitor the calibration substrate, and the visual detection and temperature measurement and calibration results are displayed on the display unit.

[0016] The technical effects and advantages of the application are as follows: 1. The present application is characterized in that the different measurement areas of the calibration substrate are corresponded with the contact temperature sensing surface by the movement of the loading platform, the multi-degree-of-freedom fine adjustment function of the flexible spring or the compression spring group makes the contact temperature sensing surface fully contact with the calibration substrate, under a certain pressure, the contact temperature sensing surface is well fitted with the to-be-measured area with different flatness and parallelism, the temperature detection of the contact temperature sensing surface on different areas of the calibration substrate is realized, the environmental conditions of low-temperature temperature measurement and calibration are met when the box is in a sealed state, the full-automatic high-precision high-repeatability temperature measurement and calibration are realized, and the dew formation of the structure and the device inside the box is avoided.

[0017] 2. The present application is characterized in that the elastic force of the first elastic member makes the two clamps close to each other, the temperature measurement module with different outer diameters is clamped between the two side frames, the stability of the temperature measurement module inside the support frame is ensured, so that the contact temperature sensing surface at the bottom end of the temperature measurement module is always at the bottom of the support frame, and the contact temperature sensing surface can correspond to the loading surface or the substrate.

[0018] 3. The present application is characterized in that the insertion rod is matched with the insertion hole, the side rod is clamped with the temperature measurement module with different outer diameters by the missing slot buckle side rod, so that the stability of the temperature measurement module inside the side frame is ensured, and the temperature measurement module inside the support frame is prevented from shaking in the contact process of the contact temperature sensing surface. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is the whole schematic diagram of the temperature measurement and calibration device for semiconductor device test of the embodiment of the present application; Figure 2 is the internal component schematic diagram of the calibration unit of the embodiment of the present application; Figure 3 is the whole schematic diagram of the temperature measurement module of the first embodiment of the present application; Figure 4 is the bottom surface component schematic diagram of the temperature measurement module of the first embodiment of the present application; Figure 5 is the flexible spring schematic diagram of the first embodiment of the present application; Figure 6 is the whole schematic diagram of the temperature measurement module of the second embodiment of the present application; Figure 7 is the sectional stereoscopic schematic diagram of the temperature measurement module of the second embodiment of the present application; Figure 8 is the whole schematic diagram of the clamping component of the embodiment of the present application; Figure 9 is the internal component schematic diagram of the side frame of the embodiment of the present application; Figure 10 is the whole schematic diagram of the locking member of the embodiment of the present application; In the figure: 1, box body; 2, loading platform; 201, loading surface; 3, positioning unit; 4, upper computer unit; 5, calibration unit; 6, display unit; 7, visual detection module; 8, temperature measurement module; 801, contact type temperature sensing surface; 802, first temperature sensing head; 803, temperature sensor; 804, flexible spring; 805, first housing; 806, first upper cover; 807, inner ring surface; 808, lead wire; 9, support frame; 10, second temperature sensing head; 11, second housing; 12, second upper cover; 13, piston; 14, compression spring set; 15, side frame; 151, sliding groove; 16, chuck; 17, side rod; 171, missing slot; 18, first elastic member; 19, vertical rod; 20, circular frame; 21, rotating rod; 22, convex strip; 23, second elastic member; 24, insertion rod. DETAILED DESCRIPTION

[0020] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the present application will be described clearly and completely below in conjunction with embodiments.

[0021] The present application provides a temperature measurement calibration device for semiconductor device testing, as shown in Figure 1 and Figure 2 shown, comprising a box body 1, the inside of which is provided with a loading platform 2, and the top of the loading platform 2 is installed with a loading surface 201, and a calibration substrate is placed on the top of the loading surface 201, the loading platform 2 is installed on the top of a positioning unit 3, and the positioning unit 3 is on the top of an upper computer unit 4, the inside top surface of the box body 1 is provided with a calibration unit 5, the outside of the box body 1 is installed with a display unit 6, and the upper computer unit 4 correspondingly controls the positioning unit 3, the calibration unit 5 and the display unit 6; the calibration unit 5 comprises a visual detection module 7, a temperature measurement module 8 and a support frame 9; the support frame 9 is installed on the inside top surface of the box body 1, and the inside of the support frame 9 is provided with the visual detection module 7 and the temperature measurement module 8, the positioning unit 3 is driven by a motor, and the visual detection module 7 is provided as a camera.

[0022] Wherein, the upper computer unit 4 is provided as a control device, the loading platform 2 is installed on the top of the positioning unit 3, the left-right direction is the X axis, the front-rear direction is the Y axis, and the up-down direction is the Z axis, the upper computer unit 4 controls the loading platform 2 to move in the X axis and Y axis directions inside the box body 1, and the positioning unit 3 makes the loading platform 2 to move up and down in the Z direction.

[0023] Specifically, the calibration substrate is placed on the top of the loading surface 201 automatically by a mechanical arm, and a cover plate is sealed on the top of the box body 1, the upper computer unit 4 moves the calibration substrate to the bottom of the calibration unit 5 through the positioning unit 3, the visual detection module 7 cooperates with the positioning unit 3, at this time the upper computer unit 4 performs center positioning on the calibration substrate on the loading surface 201, so as to obtain the initial coordinates of the calibration substrate.

[0024] In order to ensure the contact effect of the contact temperature sensing surface 801 and the calibration substrate, the contact temperature sensing surface 801 of the temperature measurement module 8 is mechanically positioned and aligned to the focal plane of the visual detection module 7, and the initial Z coordinate of the calibration substrate is also aligned to the focal plane during temperature measurement. Then, the calibration substrate is raised by Z1 through the positioning unit 3 to generate a micro-extrusion force corresponding to the distance Z1 between the contact temperature sensing surface 801 and the calibration substrate, reduce the contact thermal resistance between the contact temperature sensing surface 801 and the calibration substrate, and improve the accuracy and repeatability of multi-point temperature measurement.

[0025] The host computer unit 4 is connected with the calibration unit 5, the display unit 6 and the positioning unit 3. The host computer unit 4 can receive the motion instructions provided by the visual detection module 7 in the calibration unit 5, control the translation of the loading table 2 along the X / Y / Z three axes through the positioning unit 3, and display the visual detection and temperature calibration results on the screen of the display unit 6.

[0026] In the embodiment, the loading table 2 and the calibration substrate are moved through the positioning unit 3 to make the loading surface 201 and the calibration substrate placed thereon meet the position conditions for temperature measurement and calibration, and the movement of the loading table 2 makes the different measurement regions of the calibration substrate correspond to the contact temperature sensing surface 801, so as to realize the temperature detection of the different measurement regions of the calibration substrate.

[0027] When the box 1 is in a sealed state, the loading table 2 and the calibration substrate are moved through the positioning unit 3 to make the loading surface 201 and the calibration substrate placed thereon meet the environmental conditions for low-temperature temperature measurement and calibration, so as to realize the full-automatic temperature measurement and calibration and avoid the condensation of the structures and devices inside the box 1.

[0028] In order to define the temperature measurement module 8 inside the support frame 9, the temperature measurement module 8 is clamped by clamping components. Figure 2 Figure 8 Figure 9 In the embodiments, the clamping components include a side frame 15, a chuck 16, a side rod 17 and a first elastic member 18, the first elastic member 18 is provided as a spring piece; the temperature measurement module 8 is provided with the side frame 15 on both sides, the side frame 15 is fixed on the inner bottom surface of the support frame 9, the inner side end of the side frame 15 is provided as an arc structure, the chuck 16 is inside the side frame 15, the outer side end of the chuck 16 is fixed with two side rods 17, the two inner side walls of the side frame 15 are provided with inner plates, the two side rods 17 correspond to the two inner plates one by one, and the side rod 17 penetrates through the inner plate, and the outer side surface of the chuck 16 is connected to the inner side surface of the inner plate through the first elastic member 18.

[0029] ​​Specifically, the side lever 17 is pulled, the side lever 17 moves inside the inner plate, the moving side lever 17 pulls the chuck 16 to be close to the inner plate, the chuck 16 gradually enters the inside of the side frame 15, and the chuck 16 is pressed with the inner plate to extrude the first elastic element 18 until the chuck 16 completely enters the inside of the side frame 15. The temperature measurement module 8 is placed between the two side frames 15, at this time, the contact type temperature sensing surface 801 at the bottom end of the temperature measurement module 8 extends to the inside bottom of the support frame 9, the tension applied to the side lever 17 is released, the elastic force of the first elastic element 18 makes the chuck 16 close to the temperature measurement module 8 until the arc-shaped structure of the chuck 16 is attached to the surface of the temperature measurement module 8, at this time, the elastic force of the first elastic element 18 makes the two chucks 16 cooperate to clamp the temperature measurement module 8.

[0030] In the embodiment, the two chucks 16 are close to each other by the elastic force of the first elastic element 18, which facilitates clamping the temperature measurement module 8 with different outer diameters between the two side frames 15, ensures the stability of the temperature measurement module 8 inside the support frame 9, so that the contact type temperature sensing surface 801 at the bottom end of the temperature measurement module 8 is always at the bottom of the support frame 9, facilitating the contact type temperature sensing surface 801 to correspond to the placement surface 201 or the substrate.

[0031] In order to limit the chuck 16, the side lever 17 is locked by the locking element, and the side lever 17 is locked by the locking element in the Figure 8 to Figure 10 In the embodiment, the side frame 15 is provided with a locking element for locking the side lever 17, and the locking element comprises a vertical lever 19, a circular frame 20 and a rotating lever 21. The side frame 15 is provided with two vertical levers 19, and the two vertical levers 19 correspond to the two side levers 17. The surface of the vertical lever 19 is connected to the two circular frames 20 by two connecting rods respectively. The two circular frames 20 are oppositely arranged, and the rotating lever 21 is rotatably connected between the two circular frames 20. The surface of the side lever 17 is provided with a plurality of missing grooves 171, and the rotating lever 21 is buckled with the missing grooves 171. The top end and the bottom end of the vertical lever 19 are provided with protrusions 22, and the inside top surface and the inside bottom surface of the side frame 15 are provided with sliding grooves 151. The two protrusions 22 correspond to the two sliding grooves 151, and the protrusion 22 is inside the sliding groove 151. The second elastic element 23 is connected between the adjacent two vertical levers 19, and the second elastic element 23 is provided as an elastic sheet. The top surface of the top protrusion 22 is provided with a insertion hole, the top surface of the side frame 15 is provided with a through hole, and the insertion rod 24 is inserted into the through hole. The insertion rod 24 is vertically inserted into the insertion hole through the through hole.

[0032] Specifically, the elastic force of the second elastic member 23 causes the two vertical rods 19 to move away from each other, the vertical rods 19 slide in the sliding groove 151 by the convex strip 22, and the moving vertical rods 19 cause the circular frame 20 to move towards the side rod 17 by the connecting rod, at this time, the surface of the rotating rod 21 between the two circular frames 20 is in close contact with the surface of the side rod 17. When the chuck 16 moves towards the temperature measurement module 8 by the elastic force of the first elastic member 18, the chuck 16 causes the side rod 17 to move on the surface of the rotating rod 21, the moving side rod 17 causes the rotating rod 21 to rotate between the two circular frames 20, until the inner side of the chuck 16 contacts the temperature measurement module 8, at this time, the rotating rod 21 corresponds to the missing groove 171 of the side rod 17, the elastic force of the second elastic member 23 causes the convex strip 22 to move inside the sliding groove 151, at this time, the rotating rod 21 is buckled inside the missing groove 171, the insertion hole of the top convex strip 22 corresponds to the through hole, and the insertion rod 24 is vertically inserted into the insertion hole through the through hole, at this time, the vertical rod 19 buckles the side rod 17 by the rotating rod 21 between the two circular frames 20, avoiding the movement of the side rod 17 inside the side frame 15.

[0033] In this embodiment, by cooperating the insertion rod 24 with the insertion hole, the rotating rod 21 buckles the side rod 17 by the missing groove 171, at this time, the side rod 17 cooperates with the chuck 16 to clamp temperature measurement modules 8 with different outer diameters, thereby ensuring the stability of the temperature measurement module 8 inside the side frame 15, and avoiding the shaking of the temperature measurement module 8 inside the support frame 9 during the contact process of the contact temperature sensing surface 801.

[0034] Embodiment 1: In order to realize the temperature detection of different measurement areas of the calibration substrate, the temperature measurement module 8 is used to detect the calibration substrate, and the temperature measurement module 8 is used to detect the calibration substrate, Figure 2 to Figure 5 In this embodiment, the temperature measurement module 8 comprises a contact temperature sensing surface 801, a first temperature sensing head 802, a temperature sensor 803, a flexible spring 804, a first housing 805, and a first upper cover 806; the first temperature sensing head 802 is installed at the center of the flexible spring 804 by an inner ring surface 807 at the top, and the temperature sensor 803 is installed inside the first temperature sensing head 802, the bottom surface of the first temperature sensing head 802 is provided with the contact temperature sensing surface 801, and the contact temperature sensing surface 801 is on the bottom surface of the support frame 9, used to detect the temperature of the calibration substrate on the top of the placement surface 201, the top of the flexible spring 804 is provided with the first housing 805, and the top of the first housing 805 is provided with the first upper cover 806 by a plurality of screw rods, and the temperature sensor 803 is connected with a lead wire 808 by a wire.

[0035] The flexible spring 804 is provided in a circular plate structure, and a plurality of grooves are formed on the surface of the flexible spring 804 to form an integrated spring sheet. By designing grooves with different widths and depths on the equal-thickness austenitic stainless steel plate, a variable-thickness integrated spring sheet with elasticity is formed, and the elasticity can be realized by changing the width, depth and number of the grooves. The flexible spring 804 can realize self-matching of the measured plane with different flatness and parallelism, that is, it can adapt to the measured plane with different flatness and parallelism, so that the calibration substrate and the contact temperature sensing surface 801 are well fitted under the action of pressure. When the contact temperature sensing surface 801 contacts the calibration substrate on the top of the placement surface 201, the counterforce of the calibration substrate on the contact temperature sensing surface 801 causes the flexible spring 804 to deform slightly, and the bottom surface of the contact temperature sensing surface 801 is fitted on the top surface of the calibration substrate.

[0036] Specifically, the first temperature sensing head 802 is fixed relative to the flexible spring 804 by mechanical fixing or adhesive fixing, etc. At this time, the first temperature sensing head 802 is installed on the inner ring surface 807 of the flexible spring 804, and the temperature sensor 803 is fixed at the bottom of the inner cavity of the first temperature sensing head 802 by using a high-temperature-resistant and high-thermal-conductivity adhesive, and the outer side corresponds to the contact temperature sensing surface 801. The flexible spring 804 is connected to the first housing 805 by mechanical fixing, and the lead wire 808 is clamped and fixed and the whole is packaged by cooperating the first upper cover 806 with the first housing 805. The temperature measurement module 8 can contact the calibration substrate under a certain pressure by the contact temperature sensing surface 801, conduct heat to the temperature sensor 803 inside the first temperature sensing head 802 by using heat conduction, and finally realize temperature detection of different regions of the calibration substrate by the contact temperature sensing surface 801 through conversion and output of electrical and temperature signals. The temperature of the placement table 2 can be measured and automatically calibrated on line in a closed state, so as to ensure the temperature accuracy and temperature uniformity requirements of the electrical performance test of the substrate product at a low cost and a simplified process.

[0037] In order to restore the real working condition of the substrate product, the temperature of the placement table 2 is generally controlled by the temperature adjusting mechanism in the placement table 2, so as to change the test temperature of the substrate product fixed on the upper surface of the placement table 2. Therefore, the material of the temperature adjusting mechanism of the placement table 2 is generally selected to be a material with high thermal conductivity, which can improve the overall test efficiency by improving the temperature control efficiency, and can make all the devices to be tested on the substrate product under the same test conditions by improving the temperature uniformity of the placement surface 201, which helps to improve the accuracy of the test results.

[0038] In view of the high thermal conductivity of the temperature adjusting mechanism, the temperature control system of the loading table 2 is provided with at least one temperature sensor 803 to detect and output the current temperature of the loading table 2, and to realize temperature adjustment of the loading table 2 through communication with the temperature measuring module 8 and the host computer unit 4. In addition, the continuously improved temperature control accuracy can only be realized by calibrating the temperature sensor inside the loading table 2; and the temperature accuracy and uniformity of the loading table 2 and its loading surface 201 need to be periodically detected and calibrated before production and after changing the test temperature.

[0039] Embodiment 2: In order to realize temperature detection of different measurement areas of the calibration substrate, the temperature measuring module 8 detects the calibration substrate, and the temperature sensor 803 detects the temperature of the calibration substrate in different measurement areas of the calibration substrate. Figure 2 、 Figure 6 and Figure 7 The temperature measuring module 8 further comprises a second temperature sensing head 10, a second shell 11, a second upper cover 12, a piston 13 and a compression spring set 14. The second upper cover 12 is installed on the top of the second shell 11 by a plurality of screws. The second upper cover 12 is clamped with the second shell 11 to cooperate with the lead wire 808. The piston 13 is arranged inside the second shell 11. The top surface of the piston 13 corresponds to the bottom surface of the second upper cover 12 by a plurality of compression spring sets 14. The first temperature sensing head 802 is clamped at the center of the bottom of the piston 13. The temperature sensor 803 is arranged inside the first temperature sensing head 802. The temperature sensor 803 is connected to the lead wire 808 by a lead wire.

[0040] Specifically, the first temperature sensing head 802 is connected to the bottom end of the piston 13 by mechanical fixing or adhesive fixing. The piston 13 is vertically inserted into the second shell 11. The compression spring set 14 is sleeved on the top of the piston 13. The second upper cover 12 is placed on the top of the second shell 11 by a plurality of screws. The first upper cover 806 cooperates with the first shell 805 to clamp and fix the lead wire 808 and realize overall packaging.

[0041] The piston 13 is in contact with the stepped surface inside the second shell 11 under the compression of the high-rigidity compression spring set 14. The high-rigidity compression spring set 14 realizes the pressure application of the contact type temperature sensing surface 801 to the calibration substrate to realize good contact between the two and improve the temperature control accuracy. Compared with the single spring scheme, the compression spring set 14 composed of three springs can realize the self-matching effect of the measured plane similar to the flexible spring 804, that is, under the action of pressure, the contact type temperature sensing surface 801 is well fitted with the measured surface with different flatness and parallelism.

[0042] The temperature measuring module 8 can be in contact with the calibration substrate under certain pressure through the contact temperature sensing surface 801, heat is conducted to the temperature sensor 803 inside the second temperature sensing head 10 by heat conduction, and then the temperature signal is converted and outputted through the electric signal, so that the temperature detection of different points of the surface to be measured by the contact temperature sensing surface 801 is finally realized.

[0043] Embodiment 3: The application further provides a temperature measurement calibration method for semiconductor device testing, which applies the temperature measurement calibration device for semiconductor device testing and comprises the following steps: S1, the calibration substrate is placed on the top of the loading surface 201 by the mechanical arm, the loading table 2 is moved by the positioning unit 3 of the upper computer unit 4, the calibration substrate on the loading surface 201 is moved to the bottom of the calibration unit 5 by the moving loading table 2, and the calibration substrate is corresponded to the contact temperature sensing surface 801; S2, the calibration substrate on the loading surface 201 is moved upward by the loading table 2 until the calibration substrate is in contact with the contact temperature sensing surface 801, and the visual detection module 7 and the temperature measuring module 8 monitor the calibration substrate, and the visual detection and temperature calibration results are displayed on the display unit 6.

[0044] Working principle of the application: Referring to Figure 1 to Figure 10 As shown in the figure, the metal part corresponding to the support frame 9 on the top of the box body 1 is opened, the side rod 17 is pulled, the side rod 17 moves inside the inner plate, the moving side rod 17 pulls the chuck 16 close to the inner plate, the chuck 16 gradually enters the inside of the side frame 15, and the chuck 16 is extruded with the inner plate to extrude the first elastic member 18 until the chuck 16 completely enters the inside of the side frame 15. The temperature measuring module 8 is placed between the two side frames 15, at this time, the contact temperature sensing surface 801 at the bottom of the temperature measuring module 8 extends to the inside bottom of the support frame 9, the tension applied to the side rod 17 is released, the elastic force of the first elastic member 18 makes the chuck 16 close to the temperature measuring module 8 until the arc-shaped structure of the chuck 16 is attached to the surface of the temperature measuring module 8, at this time, the elastic force of the first elastic member 18 makes the two chucks 16 clamp the temperature measuring module 8.

[0045] The elastic force of the second elastic member 23 causes the two vertical rods 19 to move away from each other, and the vertical rods 19 slide in the sliding grooves 151 by means of the protrusions 22; the moving vertical rods 19 cause the circular frames 20 to move towards the side rods 17 by means of the connecting rods, and at this time, the surfaces of the rotating rods 21 between the two circular frames 20 are in close contact with the surfaces of the side rods 17. When the clamp head 16 moves towards the temperature measurement module 8 by the elastic force of the first elastic member 18, the clamp head 16 causes the side rods 17 to move on the surfaces of the rotating rods 21, and the moving side rods 17 cause the rotating rods 21 to rotate between the two circular frames 20, until the inner side of the clamp head 16 contacts the temperature measurement module 8, at which time the rotating rods 21 correspond to the missing grooves 171 of the side rods 17, the elastic force of the second elastic member 23 causes the protrusions 22 to move in the sliding grooves 151, at which time the rotating rods 21 are buckled in the missing grooves 171, the insertion holes of the top protrusions 22 correspond to the through holes, and the insertion rods 24 are vertically inserted into the insertion holes through the through holes, at which time the vertical rods 19 buckle the side rods 17 by means of the rotating rods 21 between the two circular frames 20, so as to avoid the movement of the side rods 17 in the side frames 15.

[0046] The support frame 9 of the calibration unit 5 is fixed on the inner top surface of the box body 1, the calibration substrate is placed on the top of the placement surface 201, and the cover plate is sealed on the top of the box body 1. The substrate is moved to the bottom of the calibration unit 5 by the positioning unit 3, the vision detection module 7 cooperates with the positioning unit 3, at which time the calibration substrate on the placement surface 201 is circularly positioned by the upper computer unit 4, so as to obtain the initial coordinates of the calibration substrate.

[0047] The contact temperature sensing surface 801 of the temperature measurement module 8 is mechanically positioned and aligned with the focal plane of the vision detection module 7, and at the time of temperature measurement, the calibration substrate is also lifted to the focal plane of the vision detection module 7 as the initial Z coordinate of the calibration substrate. The calibration substrate is lifted by the positioning unit 3 by a distance Z1, so as to generate a corresponding extrusion force between the contact temperature sensing surface 801 and the calibration substrate, reduce the contact thermal resistance between the contact temperature sensing surface 801 and the calibration substrate, and improve the temperature measurement accuracy and repeatability.

[0048] The upper computer unit 4 is connected with the calibration unit 5, the display unit 6 and the positioning unit 3, the upper computer unit 4 can receive the motion instruction provided by the vision detection module 7 in the calibration unit 5, control the placement table 2 to move along the X / Y / Z three axes by the positioning unit 3, and display the vision detection and temperature calibration results on the screen of the display unit 6.

[0049] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit it.

Claims

1. A temperature measurement calibration device for semiconductor device testing comprising a housing (1), characterized in that: The box (1) is internally provided with a loading platform (2), and the loading platform (2) is provided with a loading surface (201) on the top, and the calibration substrate is placed on the top of the loading surface (201); the loading platform (2) is installed on the top of the positioning unit (3), and the positioning unit (3) is on the top of the upper computer unit (4); the calibration unit (5) is arranged on the inner top surface of the box (1), and the display unit (6) is arranged on the outer side of the box (1), and the upper computer unit (4) controls the positioning unit (3), the calibration unit (5) and the display unit (6); The calibration unit (5) comprises a visual detection module (7), a temperature measurement module (8) and a support frame (9); The support frame (9) is installed on the inner top surface of the box (1), and the visual detection module (7) and the temperature measurement module (8) are arranged in the support frame (9); the temperature measurement module (8) comprises a contact temperature sensing surface (801), a first temperature sensing head (802), a temperature sensor (803), a flexible spring (804), a first housing (805) and a first upper cover (806); The first temperature sensing head (802) is installed at the center of the flexible spring (804) through an inner ring surface (807) on the top, and the temperature sensor (803) is installed in the first temperature sensing head (802); the contact temperature sensing surface (801) is arranged on the bottom surface of the first temperature sensing head (802) and is arranged on the bottom surface of the support frame (9), and is used for detecting the temperature of the calibration substrate on the top of the loading surface (201); the first housing (805) is installed on the top of the flexible spring (804), and the first upper cover (806) is installed on the top of the first housing (805) through a plurality of screws; and the temperature sensor (803) is connected with a lead wire (808) through a wire.

2. The temperature measurement calibration device for semiconductor device testing according to claim 1, wherein: The flexible spring (804) is in a circular plate structure, and a plurality of grooves are formed on the surface of the flexible spring (804) to form an integrated spring piece.

3. The temperature measurement calibration device for semiconductor device testing according to claim 2, wherein: When the contact temperature sensing surface (801) contacts the calibration substrate on the top of the loading surface (201), the reaction force of the calibration substrate on the contact temperature sensing surface (801) causes the flexible spring (804) to deform slightly, and the bottom surface of the contact temperature sensing surface (801) is attached to the top surface of the calibration substrate.

4. The temperature measurement calibration device for semiconductor device testing according to claim 1, wherein: The temperature measurement module (8) further comprises a second temperature sensing head (10), a second housing (11), a second upper cover (12), a piston (13) and a compression spring group (14). The second shell (11) top is provided with a second upper cover (12) by a plurality of screws, the second upper cover (12) is matched with the second shell (11) to clamp the lead (808), the second shell (11) is internally provided with a piston (13), and the piston (13) top surface is correspondingly clamped with the second upper cover (12) bottom surface by a plurality of compression spring groups (14), the piston (13) bottom center is clamped with a first temperature sensing head (802), and the first temperature sensing head (802) is internally provided with a temperature sensor (803), and the temperature sensor (803) is connected with the lead (808) by a wire.

5. The temperature measurement calibration device for semiconductor device testing of claim 1, wherein: The support frame (9) is provided with a clamping part for limiting the temperature measurement module (8) on the inner side, and the clamping part comprises a side frame (15), a chuck (16), a side rod (17) and a first elastic member (18); The temperature measurement module (8) is provided with a side frame (15) on both sides, the inner side end of the side frame (15) is provided in an arc-shaped structure, the chuck (16) is inside the side frame (15), two side rods (17) are fixed to the outer side end of the chuck (16), inner walls of the side frame (15) are provided with inner plates, the two side rods (17) correspond to the two inner plates one by one, the side rods (17) penetrate through the inner plates, and the outer side surface of the chuck (16) is connected to the inner side surface of the inner plate by the first elastic member (18).

6. The temperature measurement calibration device for semiconductor device testing of claim 5, wherein: The side frame (15) is provided with a locking member for locking the side rod (17) inside, and the locking member comprises a vertical rod (19), a circular frame (20) and a rotating rod (21); The side frame (15) is provided with two vertical rods (19) inside, the two vertical rods (19) correspond to the two side rods (17) one by one, the surfaces of the vertical rods (19) are connected to two circular frames (20) by two connecting rods respectively, the two circular frames (20) are oppositely arranged, and the rotating rod (21) is rotatably clamped between the two circular frames (20), and the surface of the side rod (17) is provided with a plurality of missing slots (171), and the rotating rod (21) is buckled with the missing slot (171).

7. The temperature measurement calibration device for semiconductor device testing of claim 6, wherein: The top end and the bottom end of the vertical rod (19) are provided with protrusions (22), the inner side top surface and the inner side bottom surface of the side frame (15) are provided with sliding grooves (151), the two protrusions (22) correspond to the two sliding grooves (151) one by one, the protrusions (22) are inside the sliding grooves (151), and the second elastic member (23) is connected between the adjacent two vertical rods (19).

8. The temperature measurement calibration device for semiconductor device testing of claim 7, wherein: The top surface of the top protrusion (22) is provided with a jack, the top surface of the side frame (15) is provided with a through hole, and the through hole is inserted with a plug rod (24), and the plug rod (24) is vertically inserted into the jack inside the through hole.

9. A temperature measurement calibration method for semiconductor device testing, characterized by: The method applies the temperature measurement calibration device for semiconductor device testing of claim 1, comprising the following steps: S1, the calibration substrate is placed on the top of the loading surface (201) by the mechanical arm, the upper computer unit (4) moves the loading table (2) by the positioning unit (3), the moving loading table (2) moves the calibration substrate on the loading surface (201) to the bottom of the calibration unit (5), and the calibration substrate corresponds to the contact type temperature sensing surface (801); S2, the loading table (2) moves the calibration substrate on the loading surface (201) upward until the calibration substrate contacts the contact type temperature sensing surface (801), and the visual detection module (7) and the temperature measurement module (8) monitor the calibration substrate, and the visual detection and temperature measurement and calibration results are displayed on the display unit (6).

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