Serial parameter testing machine

Abstract

The invention belongs to the field of wafer testing, and particularly relates to a serial parameter testing machine table which comprises a testing table body, a metal plate shell is arranged on the testing table body, a rack is fixedly connected to one side of the upper end face of the testing table body, a first support is fixedly connected to one side of the upper end of the rack, and a plurality of testing probes are transversely arranged on the first support at equal intervals. The rack is also provided with a wafer guiding assembly. According to the invention, continuous testing of a plurality of wafers can be realized by using the wafer guiding assembly, and in the whole testing process, under the guiding action of the baffle plate I, the baffle plate II and the guiding plate, the plurality of wafers with non-uniform postures can be converted into a horizontally-placed and transversely-arranged state, so that the wafers can be conveniently tested by the testing probe one by one, and the testing efficiency is improved. The wafers in the multiple conveying channels are tested at the same time, and the testing efficiency is high.

Description

Technical Field

[0001] This invention belongs to the field of wafer testing, specifically a serial parameter testing machine. Background Technology

[0002] A serial parameter testing machine is a precision automated device used to measure the electrical characteristics of each chip on a wafer sequentially before the wafer is diced into individual chips. This testing allows for the screening out of defective chips and the evaluation of the overall wafer's process quality, thereby preventing defective products from being used in subsequent expensive packaging and application stages and saving production costs.

[0003] Patent CN111426938B discloses a wafer jig and a wafer testing device incorporating the wafer jig. The wafer jig includes a jig body, clamping elements, and a clamping drive mechanism for clamping or releasing the wafer. The clamping elements include a connecting block, a clamping block, and a fixing device. The connecting block is connected to the clamping drive mechanism, and a sliding structure is provided between the connecting block and the clamping block. The clamping block is slidably disposed along the wafer clamping direction. The fixing device fixes the clamping block to the connecting block. This patent ensures that the wafer is aligned with the probe card by making the surface of the clamping block protrude 0-0.2 mm beyond the surface of the wafer facing the probe card, allowing testing to be performed while the wafer is clamped. The wafer testing device ensures that the wafer is tested while clamped, and after testing, the wafer is released by a drive element with an inclined surface when the wafer jig descends.

[0004] However, the above technical solutions still have the following shortcomings in practical applications:

[0005] Wafer testing is typically performed by bringing test probes into contact with test points on the wafer. To achieve batch inspection and improve efficiency, robotic arms combined with vision positioning technology are often used to sequentially remove wafers from wafer bins. However, when wafers in the bin are misaligned or have inconsistent orientations due to vibration or other reasons, the vision system struggles to accurately identify their contours and alignment marks. This can lead to robotic arm failures or incorrect positioning angles, thus interrupting the testing process and severely impacting inspection efficiency and the continuity of automated production. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art and solve at least one of the technical problems mentioned in the background art, the present invention proposes a serial parameter testing machine.

[0007] The technical solution adopted by the present invention to solve its technical problem is: a serial parameter testing machine, including a testing platform, a sheet metal shell is provided on the testing platform, a frame is fixedly connected to one side of the upper surface of the testing platform, a conveyor belt is provided on the frame, a support is fixedly connected to one side of the upper end of the frame, a plurality of test probes are arranged horizontally and equidistantly on the support, and a wafer guiding assembly is also provided on the frame.

[0008] The wafer guiding assembly includes a bracket two fixedly connected to one side of the rack. Multiple guide plates are laterally distributed and slidably connected to one side of the bracket two, and two adjacent guide plates together form a conveying channel. Baffles one are fixedly connected to both sides of the upper end of the rack, and baffles two are slidably arranged on the two baffles one.

[0009] It also includes wafer collection components;

[0010] The wafer collection assembly includes a slide fixedly connected to one side of the upper surface of the test bench, and multiple collection boxes are equidistantly distributed and slidably connected to the upper surface of the slide.

[0011] Preferably, threaded rods are rotatably provided at both ends of the upper side of the second bracket, and multiple bidirectional threads are intermittently provided on the threaded rods, and each bidirectional thread is threadedly connected to two guide plates. A motor is fixedly connected to one side of the upper end of the second bracket, and the output end of the motor is fixedly connected to one end of the threaded rod.

[0012] Preferably, a cylinder three is fixedly connected to one side of the baffle, and the piston end of the cylinder three is fixedly connected to one end of the baffle.

[0013] Preferably, a cylinder is fixedly connected to one side of the guide plate, a pressure block is fixedly connected to the piston end of the cylinder, and multiple vision sensors are arranged horizontally and equidistantly on one side of the bracket.

[0014] Preferably, a telescopic plate is inserted into and slidably connected to one end of the guide plate on the frontmost and rearmost sides. The end of the telescopic plate is in contact with a surface of the baffle. A spring is fixedly connected to one end of the telescopic plate, and one end of the spring is fixedly connected to the inner wall of the guide plate.

[0015] Preferably, multiple cylinders are equidistantly distributed and fixedly connected to the upper surface of the slide block. The piston end of each cylinder is fixedly connected to one side of the collection box. The collection box is provided with two collection compartments, and a pull-out box is inserted into the inner cavity of each collection compartment.

[0016] Preferably, it also includes a friction-type guide auxiliary component;

[0017] The friction-type guide auxiliary assembly includes a roller rotatably mounted on one end of the guide plate, with friction cloth wound around two adjacent rollers. Multiple support rods are equidistantly distributed and fixed to one side of the upper end of the bracket, and a support roller is fixedly connected to one end of each support rod. The support roller is in contact with the surface of the friction cloth.

[0018] Preferably, a motor is fixedly connected to one end of the guide plate, and the output end of the motor is fixedly connected to one end of the roller.

[0019] Preferably, it also includes an attitude adjustment component;

[0020] The attitude adjustment component includes a push plate slidably connected to one side of the bottom of the second baffle. A first connecting rod is rotatably disposed on one side of the upper end of the push plate. A second connecting rod is rotatably disposed at one end of the first connecting rod. One end of the second connecting rod is rotatably disposed on the second baffle.

[0021] Preferably, a second motor is fixedly connected to one side of the upper end of the second baffle, and the output end of the second motor is fixedly connected to one end of the second connecting rod.

[0022] The beneficial effects of this invention are as follows:

[0023] 1. The serial parameter testing machine of this invention utilizes a wafer guiding assembly to achieve continuous testing of multiple wafers. During the entire testing process, multiple wafers with inconsistent orientations are transformed into a horizontally aligned, flat arrangement under the guidance of baffle one, baffle two, and a guide plate. This facilitates individual testing of each wafer by the test probes. Furthermore, wafers in multiple transport channels can be tested simultaneously, resulting in high testing efficiency. Compared to the method of using a robotic arm to grip wafers, this solution has lower visual recognition difficulty, reducing the likelihood of gripping failures or positioning angle errors, thus ensuring testing continuity. In addition, the wafer collection assembly allows for the separate collection of qualified and unqualified wafers for subsequent use.

[0024] 2. The serial parameter testing machine of the present invention utilizes a friction-type guiding auxiliary component. When the wafer moves between two transport channels, it comes into contact with the friction cloth. The friction cloth prevents the wafer from entering between the two adjacent transport channels. Furthermore, the friction between the friction cloth and the wafer causes the wafer to move into the transport channel, thereby avoiding changes in the spacing between the two adjacent transport channels, which could lead to the wafer entering the gap between the two transport channels or getting stuck in the gap, thus ensuring the normal progress of subsequent testing.

[0025] 3. The serial parameter testing machine of the present invention utilizes an attitude adjustment component to make the pusher plate slide back and forth during the wafer movement into the transport channel. If the wafer rests against the second baffle, it will be pushed by the pusher plate to lay flat, thereby effectively avoiding the situation where the wafer is in an upright state during the movement, which would prevent it from smoothly entering the transport channel and obstructing subsequent wafers, thus affecting the normal operation of the testing work. Attached Figure Description

[0026] The invention will now be further described with reference to the accompanying drawings.

[0027] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0028] Figure 2 This is a three-dimensional structural schematic diagram of the present invention from another perspective;

[0029] Figure 3 This is a schematic diagram of the three-dimensional structure of the conveyor belt.

[0030] Figure 4 This is a schematic diagram of the three-dimensional structure of the support frame at two locations;

[0031] Figure 5 This is a schematic diagram of a three-dimensional structure of the baffle.

[0032] Figure 6 yes Figure 5 Enlarged view of a portion of point A in the middle;

[0033] Figure 7 This is a three-dimensional structural diagram of the frame.

[0034] Figure 8 yes Figure 7 Enlarged view of a section at point B in the middle;

[0035] Figure 9 This is a half-section planar structural diagram showing the connection relationship between the guide plate and the telescopic plate;

[0036] Figure 10 This is a three-dimensional structural diagram of the slide block;

[0037] Figure 11 This is a schematic diagram of the three-dimensional structure of the telescopic plate.

[0038] Figure 12 This is a schematic diagram of the three-dimensional structure of the pressing block;

[0039] Figure 13 This is a schematic diagram of the three-dimensional structure at the guide plate.

[0040] Figure 14 yes Figure 13 Enlarged view of a section at point C.

[0041] In the diagram: 1. Sheet metal casing; 2. Test bench; 3. Conveyor belt; 4. Frame; 5. Support 1; 6. Slide; 7. Collection box; 8. Baffle 1; 9. Baffle 2; 10. Support 2; 11. Cylinder 1; 12. Roller; 13. Cylinder 2; 14. Motor 1; 15. Cylinder 3; 16. Guide plate; 17. Threaded rod; 18. Push plate; 19. Connecting rod 1; 20. Connecting rod 2; 21. Motor 2; 22. Vision sensor; 23. Test probe; 24. Motor 3; 25. Friction cloth; 26. Support rod; 27. Telescopic plate; 28. Pressure block; 29. ​​Pull-out box; 30. Spring; 31. Support roller. Detailed Implementation

[0042] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Please refer to Figures 1-14 The present invention provides a technical solution: a serial parameter testing machine, including a test table 2, a sheet metal shell 1 on the test table 2, a frame 4 fixedly connected to one side of the upper end face of the test table 2, a conveyor belt 3 on the frame 4, a bracket 5 fixedly connected to one side of the upper end face of the frame 4, a plurality of test probes 23 are arranged horizontally at equal intervals on the bracket 5, and a wafer guiding assembly is also provided on the frame 4.

[0044] The wafer guiding assembly includes a support 10 fixedly connected to one side of the rack 4. Multiple guide plates 16 are laterally distributed and slidably connected on one side of the support 10, and two adjacent guide plates 16 together form a conveying channel. Baffles 8 are fixedly connected to both sides of the upper end of the rack 4, and baffles 9 are slidably arranged on the two baffles 8.

[0045] It also includes wafer collection components;

[0046] The wafer collection assembly includes a slide 6 fixedly connected to one side of the upper surface of the test stage 2, and multiple collection boxes 7 are equidistantly distributed and slidably connected to the upper surface of the slide 6.

[0047] In this embodiment, as Figures 3-5 , Figures 7-13 As shown, threaded rods 17 are rotatably installed at both ends of the upper side of bracket 2 10. Multiple bidirectional threads are intermittently installed on the threaded rods 17, and each bidirectional thread is threadedly connected to two guide plates 16. Motor 14 is fixedly connected to one side of the upper end of bracket 2 10, and the output end of motor 14 is fixedly connected to one end of threaded rod 17.

[0048] A cylinder 15 is fixedly connected to one side of baffle 8, and the piston end of cylinder 15 is fixedly connected to one end of baffle 9.

[0049] A cylinder 11 is fixedly connected to one side of the guide plate 16. A pressure block 28 is fixedly connected to the piston end of the cylinder 11. Multiple vision sensors 22 are arranged horizontally and equidistantly on one side of the bracket 5.

[0050] The frontmost and rearmost guide plates 16 are connected to one end of a telescopic plate 27 which is slidably connected. The end of the telescopic plate 27 is in contact with the surface of the baffle 8. A spring 30 is fixedly connected to one end of the telescopic plate 27, and one end of the spring 30 is fixedly connected to the inner wall of the guide plate 16.

[0051] Multiple cylinders 13 are horizontally and equidistantly distributed and fixedly connected to the upper surface of the slide block 6. The piston end of the cylinder 13 is fixedly connected to one side of the collection box 7. The collection box 7 is provided with two collection compartments, and a pull-out box 29 is inserted into the inner cavity of the collection compartment.

[0052] Specifically, in existing technologies, wafer testing is typically performed by bringing test probes 23 into contact with test points on the wafer. To achieve batch inspection and improve inspection efficiency, robotic arms combined with vision positioning technology are often used to sequentially remove wafers from the wafer cassette. However, when wafers in the cassette are misaligned or have inconsistent orientations due to vibration or other reasons, the vision system struggles to accurately identify their contours and alignment marks, leading to robotic arm failures or incorrect positioning angles, thus interrupting the testing process and severely impacting inspection efficiency and the continuity of automated production.

[0053] Therefore, in order to solve the above problems, the working principle of this embodiment is as follows:

[0054] This solution is used for wafers of the same specifications in the same batch. Since adjacent guide plates 16 cooperate to form a conveying channel, the width of the conveying channel can be adjusted by using motor 14 to rotate threaded rod 17 according to the diameter of the wafer to be tested. The multi-segment bidirectional threads on threaded rod 17 allow multiple guide plates 16 to slide simultaneously, thus adjusting the width of the conveying channel until it equals the diameter of the wafer. Furthermore, when the foremost and rearmost guide plates 16 move, the telescopic plate 27 remains in contact with the surface of baffle 8 under the action of spring 30. Subsequently, cylinder 3 15 drives baffle 9 to rise and fall, adjusting the distance between the bottom of baffle 9 and the surface of conveyor belt 3, ensuring this distance equals the wafer thickness.

[0055] Then, multiple wafers in the material box are poured uniformly between two baffles 8. The conveyor belt 3 is then driven to move, and the wafers will move into the conveying channel formed by the guide plate 16. Since only one flat wafer can pass through the bottom of the baffle 9 at a time, and the width of the conveying channel is equal to the diameter of the wafer, the wafers entering the conveying channel will be arranged in a linear horizontal arrangement. Furthermore, since there are multiple conveying channels, the wafers can randomly enter different conveying channels. Since multiple vision sensors 22 are aligned with different conveyor channels, when a vision sensor 22 detects that a wafer has moved below the test probe 23, cylinder 11 descends and uses pressure block 28 to hold the wafer in place, preventing it from moving with the conveyor belt 3. The test probe 23 can then be used to test the wafer. After the test, the pressure block 28 is driven away from the wafer, and the wafer continues to move and falls into the corresponding collection box 7. Since the collection box 7 has two collection compartments and a pull-out box 29 inside each compartment, cylinder 23 can be used to move the collection box 7 according to the test results, so that different collection compartments of the collection box 7 are aligned with the falling wafers, and qualified and unqualified wafers fall into different pull-out boxes 29 respectively, thereby achieving wafer classification. Then repeat the above operation until all wafers have been tested. Throughout the testing process, under the guidance of baffle 8, baffle 9, and guide plate 16, multiple wafers with inconsistent orientations can be transformed into a horizontally arranged position, facilitating individual testing by the test probes 23. Furthermore, wafers in multiple transport channels can be tested simultaneously, resulting in high testing efficiency. Compared to the method of using a robotic arm to grip wafers, this solution has lower visual recognition difficulty, is less prone to gripping failures or positioning angle errors, and ensures the continuity of testing.

[0056] In this embodiment, as Figure 14 As shown, it also includes a friction-type guide auxiliary component;

[0057] The friction-type guide auxiliary assembly includes a roller 12 rotatably mounted on one end of the guide plate 16, and a friction cloth 25 is wound around two adjacent rollers 12. Multiple support rods 26 are distributed laterally at equal intervals and fixedly connected to one side of the upper end of the bracket 2 10. A support roller 31 is fixedly connected to one end of the support rod 26, and the support roller 31 is in contact with the surface of the friction cloth 25.

[0058] One end of the guide plate 16 is fixedly connected to a motor 24, and the output end of the motor 24 is fixedly connected to one end of the roller 12.

[0059] Specifically, in the above embodiments, although multiple wafers can be moved to different transport channels for testing, when the distance between the transport channels changes, the distance between two adjacent transport channels will also change. As a result, the wafer may enter the gap between the two transport channels or get stuck in the gap, thereby affecting the normal progress of subsequent testing.

[0060] Therefore, in order to solve the above problems, the working principle of this embodiment is as follows:

[0061] When the distance between the two conveyor channels changes, motor 24 drives roller 12 to rotate, keeping the unwound portion of friction cloth 25 taut and in contact with support roller 31. During the process of multiple wafers entering the conveyor channels, the rotation of roller 12 driven by motor 24 allows for the regular winding and unwinding of the same friction cloth 25 under the coordinated rotation of the two rollers 12. When the wafer moves between the two conveyor channels, it will come into contact with the friction cloth 25. The friction cloth 25 can prevent the wafer from entering between the two adjacent conveyor channels. Furthermore, the friction between the friction cloth 25 and the wafer will cause the wafer to move into the conveyor channel, thereby avoiding the situation where the distance between the two adjacent conveyor channels changes, which could lead to the wafer entering the gap between the two conveyor channels or getting stuck in the gap, thus ensuring the normal progress of subsequent testing.

[0062] In this embodiment, as Figure 5 , Figure 6 , Figure 14 As shown, it also includes an attitude adjustment component;

[0063] The attitude adjustment component includes a push plate 18 that is slidably connected to one side of the bottom of the second baffle 9. A first connecting rod 19 is rotatably mounted on one side of the upper end of the push plate 18. A second connecting rod 20 is rotatably mounted on one end of the first connecting rod 19. One end of the second connecting rod 20 is rotatably mounted on the second baffle 9.

[0064] A motor 21 is fixedly connected to one side of the upper end of the baffle 2 9, and the output end of the motor 21 is fixedly connected to one end of the connecting rod 20.

[0065] Specifically, in the above embodiments, although the wafers can be arranged into the transport channel through the coordinated cooperation of multiple structures, if the wafers are in an upright state, they are prone to leaning against the baffle 29. Not only will they be unable to enter the transport channel smoothly, but they will also block subsequent wafers, thereby affecting the normal progress of the testing work.

[0066] Therefore, in order to solve the above problems, the working principle of this embodiment is as follows:

[0067] During the process of moving the wafer to the transport channel, the motor 21 drives the connecting rod 20 to rotate, which, with the cooperation of the connecting rod 19, causes the push plate 18 to slide back and forth. If the wafer leans against the baffle 29, it will be pushed by the push plate 18 to make it flat, thus effectively avoiding the situation where the wafer is in an upright state during the movement, which would prevent it from entering the transport channel smoothly and block subsequent wafers, thereby affecting the normal progress of the testing work.

[0068] Working principle: Since adjacent guide plates 16 cooperate to form a conveying channel, the width of the conveying channel can be adjusted by using motor 14 to drive the threaded rod 17 to rotate according to the diameter of the wafer to be tested. The multi-segment bidirectional threads on the threaded rod 17 cause multiple guide plates 16 to slide simultaneously, thus adjusting the width of the conveying channel until it equals the diameter of the wafer. Furthermore, when the foremost and rearmost guide plates 16 move, the telescopic plate 27 remains in contact with the surface of the baffle 8 under the action of the spring 30. Subsequently, the cylinder 15 drives the baffle 9 to rise and fall, adjusting the distance between the bottom of the baffle 9 and the surface of the conveyor belt 3, making this distance equal to the wafer thickness. Then, multiple wafers in the material box are poured uniformly between two baffles 8. The conveyor belt 3 is then driven to move, and the wafers will move into the conveying channel formed by the guide plate 16. Since only one flat wafer can pass through the bottom of the baffle 9 at a time, and the width of the conveying channel is equal to the diameter of the wafer, the wafers entering the conveying channel will be arranged in a linear horizontal arrangement. Furthermore, since there are multiple conveying channels, the wafers can randomly enter different conveying channels. Since multiple vision sensors 22 are aligned with different conveyor channels, when a vision sensor 22 detects that a wafer has moved below the test probe 23, cylinder 11 descends and uses pressure block 28 to hold the wafer in place, preventing it from moving with the conveyor belt 3. The test probe 23 can then be used to test the wafer. After the test, the pressure block 28 is driven away from the wafer, and the wafer continues to move and falls into the corresponding collection box 7. Since the collection box 7 has two collection compartments and a pull-out box 29 inside each compartment, cylinder 23 can be used to move the collection box 7 according to the test results, so that different collection compartments of the collection box 7 are aligned with the falling wafers, and qualified and unqualified wafers fall into different pull-out boxes 29 respectively, thereby achieving wafer classification. Then repeat the above operation until all wafers have been tested. Throughout the testing process, under the guidance of baffle 8, baffle 9, and guide plate 16, multiple wafers with inconsistent orientations can be transformed into a horizontally arranged position, facilitating individual testing by the test probes 23. Furthermore, wafers in multiple transport channels can be tested simultaneously, resulting in high testing efficiency. Compared to the method of using a robotic arm to grip wafers, this solution has lower visual recognition difficulty, is less prone to gripping failures or positioning angle errors, and ensures the continuity of testing.When the distance between the two conveyor channels changes, motor 24 drives roller 12 to rotate, keeping the unwound portion of friction cloth 25 taut and in contact with support roller 31. During the process of multiple wafers entering the conveyor channels, the rotation of roller 12 driven by motor 24 allows for the regular winding and unwinding of the same friction cloth 25 under the coordinated rotation of the two rollers 12. When the wafer moves between the two conveyor channels, it will come into contact with the friction cloth 25. The friction cloth 25 can prevent the wafer from entering between the two adjacent conveyor channels. Furthermore, the friction between the friction cloth 25 and the wafer will cause the wafer to move into the conveyor channel, thereby avoiding the situation where the distance between the two adjacent conveyor channels changes, which could lead to the wafer entering the gap between the two conveyor channels or getting stuck in the gap, thus ensuring the normal progress of subsequent testing. During the process of moving the wafer to the transport channel, the motor 21 drives the connecting rod 20 to rotate, which, with the cooperation of the connecting rod 19, causes the push plate 18 to slide back and forth. If the wafer leans against the baffle 29, it will be pushed by the push plate 18 to make it flat, thus effectively avoiding the situation where the wafer is in an upright state during the movement, which would prevent it from entering the transport channel smoothly and block subsequent wafers, thereby affecting the normal progress of the testing work.

[0069] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A serial parameter testing machine, comprising a testing platform (2), characterized in that: The test bench (2) is provided with a sheet metal shell (1), and a frame (4) is fixedly connected to one side of the upper end face of the test bench (2). A conveyor belt (3) is provided on the frame (4), and a support (5) is fixedly connected to one side of the upper end of the frame (4). Multiple test probes (23) are arranged horizontally at equal intervals on the support (5). A wafer guiding assembly is also provided on the frame (4). The wafer guiding assembly includes a second bracket (10) fixedly connected to one side of the frame (4). A number of guide plates (16) are distributed laterally and slidably connected on one side of the second bracket (10), and two adjacent guide plates (16) together form a conveying channel. Both sides of the upper end of the frame (4) are fixedly connected to a first baffle (8), and a second baffle (9) is slidably arranged on the two first baffles (8). It also includes wafer collection components; The wafer collection assembly includes a slide (6) fixedly connected to one side of the upper surface of the test stage (2), and multiple collection boxes (7) are equidistantly distributed and slidably connected to the upper surface of the slide (6).

2. The serial parameter testing machine according to claim 1, characterized in that: The upper two ends of the bracket (10) are rotatably provided with threaded rods (17). The threaded rods (17) are intermittently provided with multiple bidirectional threads, and each bidirectional thread is threadedly connected to two guide plates (16). The upper side of the bracket (10) is fixedly connected with a motor (14), and the output end of the motor (14) is fixedly connected to one end of the threaded rod (17).

3. The serial parameter testing machine according to claim 2, characterized in that: A cylinder three (15) is fixedly connected to one side of the baffle one (8), and the piston end of the cylinder three (15) is fixedly connected to one end of the baffle two (9).

4. The serial parameter testing machine according to claim 1, characterized in that: A cylinder (11) is fixedly connected to one side of the guide plate (16), and a pressure block (28) is fixedly connected to the piston end of the cylinder (11). Multiple vision sensors (22) are arranged horizontally and equidistantly on one side of the bracket (5).

5. A serial parameter testing machine according to claim 1, characterized in that: The guide plate (16) at the frontmost and rearmost sides is inserted into and slidably connected to a telescopic plate (27). The end of the telescopic plate (27) is in contact with the surface of the baffle (8). A spring (30) is fixedly connected to one end of the telescopic plate (27). One end of the spring (30) is fixedly connected to the inner wall of the guide plate (16).

6. The serial parameter testing machine according to claim 1, characterized in that: The upper surface of the slide (6) is equidistantly distributed with multiple cylinders (13) and fixedly connected. The piston end of the cylinder (13) is fixedly connected to one side of the collection box (7). The collection box (7) is provided with two collection compartments, and a pull-out box (29) is inserted into the inner cavity of the collection compartment.

7. A serial parameter testing machine according to claim 1, characterized in that: It also includes friction-guided auxiliary components; The friction-type guide auxiliary component includes a roller (12) rotatably mounted on one end of the guide plate (16), and a friction cloth (25) is wound around two adjacent rollers (12). Multiple support rods (26) are distributed and fixedly connected to one side of the upper end of the bracket (10). A support roller (31) is fixedly connected to one end of the support rod (26), and the support roller (31) is in contact with the surface of the friction cloth (25).

8. A serial parameter testing machine according to claim 7, characterized in that: One end of the guide plate (16) is fixedly connected to a motor (24), and the output end of the motor (24) is fixedly connected to one end of the roller (12).

9. A serial parameter testing machine according to claim 1, characterized in that: It also includes attitude adjustment components; The attitude adjustment component includes a push plate (18) slidably connected to one side of the bottom of the second baffle (9). A first connecting rod (19) is rotatably arranged on one side of the upper end of the push plate (18). A second connecting rod (20) is rotatably arranged at one end of the first connecting rod (19). One end of the second connecting rod (20) is rotatably arranged on the second baffle (9).

10. A serial parameter testing machine according to claim 9, characterized in that: A motor (21) is fixedly connected to one side of the upper end of the baffle (9), and the output end of the motor (21) is fixedly connected to one end of the connecting rod (20).

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