SMD (Surface Mount Device) thin-film capacitor

By connecting the pins to the core electrodes using a pluggable assembly, the problems of high capacitor repair costs and the impact of pin bending on performance in existing technologies are solved, enabling repeated disassembly and stable performance of the capacitor.

CN121331663APending Publication Date: 2026-01-13GUIZHOU WEIQING DEV GRP CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202511807705.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-03
Publication Date
2026-01-13

AI Technical Summary

Technical Problem

The existing method of connecting the leads and core electrodes of surface-mount film capacitors remains unchanged, which increases maintenance costs. Furthermore, the leads are prone to breakage when bent to match the soldering angle, affecting performance.

Method used

The pins and core electrodes are connected by a pluggable component, which enables electrical connection and disconnection, avoiding damage to soldering and the package. The pins are detachable and angle adjustable by using snap-fit ​​posts and a snap-fit ​​plate structure.

Benefits of technology

This enables repeated disassembly and repair of capacitors, avoiding performance impact caused by pin bending and reducing maintenance costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121331663A_ABST
    Figure CN121331663A_ABST
Patent Text Reader

Abstract

The invention relates to the technical field of capacitors, in particular to a patch type thin film capacitor which comprises a packaging body and a core arranged in the packaging body, and a first pin and a second pin are erected at the two ends of the packaging body respectively. The first pin and the second pin are electrically connected with a positive alloy electrode and a negative alloy electrode at the two ends of the core through a plug-in assembly respectively, and the plug-in assembly comprises first conductive rings which are arranged at the two ends of the packaging body and electrically connected with the positive alloy electrode and the negative alloy electrode. The first pin and the second pin are respectively provided with a clamping column which is electrically connected with the first conductive ring in a contact manner, two sides of one end of the packaging body are provided with bosses, and the bosses are provided with positioning adaptive assemblies which are matched with the plug-in assembly. The problems that in the prior art, the connection mode of the pin and the core electrode of the patch type thin film capacitor is not changed, so that the cost is increased, and the performance is affected due to the fact that the pin needs to be bent for adapting the welding angle are effectively solved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of capacitors, in particular to a patch type thin film capacitor. BACKGROUND

[0002] The patch type thin film capacitor has been widely used in consumer electronics, automotive electronics and other fields due to its small size, excellent high-frequency characteristics and high capacitance stability. However, the existing technology has the following key defects: The pins and electrode of the existing patch type thin film capacitor are usually fixed by welding or integrally injection molded. The welding type connection needs to bind the pins and the electrode by soldering, and the solder needs to be melted by heating when disassembling, which can easily cause electrode oxidation or packaging deformation. The capacitor cannot be reused, and the integrally injection molded structure directly integrates the pins, electrodes and packaging. Once the pins are loose or the circuit fails, the capacitor can only be replaced as a whole, significantly increasing the maintenance cost.

[0003] Moreover, when replacing the capacitor, the solder pad and the capacitor pin often do not match, and the pin of the capacitor needs to be bent to match the solder pad on the circuit, and then replaced and installed. However, in the actual installation process, the pin is easily broken and affects the contact performance when bent too much. SUMMARY

[0004] In view of the above problems, the patch type thin film capacitor provided by the present application effectively solves the problem of the patch type thin film capacitor in the prior art, that is, the pins and the electrode of the capacitor are connected in a way that cannot be disassembled, which increases the cost and affects the performance due to the need to bend the pins to match the welding angle.

[0005] To achieve the above purpose, the present application adopts the following technical scheme: The patch type thin film capacitor comprises a packaging body and a core arranged in the packaging body. The two ends of the packaging body are respectively provided with first pins and second pins. The first pins and the second pins are respectively electrically connected to the positive alloy electrode and the negative alloy electrode at both ends of the core through pull-out type assemblies. The pull-out type assemblies comprise first conductive rings arranged at both ends of the packaging body and electrically connected to the positive alloy electrode and the negative alloy electrode. The first pins and the second pins are respectively provided with clamping columns in contact type electrical connection with the first conductive rings. Both sides of one end of the packaging body are provided with bosses. The bosses are provided with positioning and adapting assemblies matched with the pull-out type assemblies. The positioning and adapting assemblies comprise plastic gears mounted on the first pins and the second pins. The bosses are provided with second clamping plates and third clamping plates elastically limited by the plastic gears.

[0006] Preferably, the plug-in assembly further comprises a conductive rod integrally installed at the end of the first pin and the second pin, the end of the conductive rod is integrally provided with the clamping column, the clamping column is provided with a second conductive ring electrically connected with the first conductive ring, one end of the clamping column is provided with an insulating sleeve ring in sliding connection with the conductive rod, and the both ends of the packaging body are respectively provided with insulating blocks, and the insulating blocks are internally provided with sliding grooves in sliding connection with the clamping column and the insulating sleeve ring.

[0007] Preferably, one end of the insulating block is in sliding connection with a first sliding column, the both ends of the first sliding column are respectively provided with a plug ring and a first clamping plate, and the first clamping plate and the insulating block are provided with a first spring in sleeve connection with the first sliding column.

[0008] Preferably, the first clamping plate is in right angle type, the oblique edge end of the first clamping plate faces the insulating sleeve ring, and the clamping column is internally provided with a clamping groove corresponding to the insulating sleeve ring.

[0009] Preferably, the positioning and adapting assembly further comprises a fixing shaft fixedly installed on the boss, one end of the fixing shaft is in sliding connection with a second sliding column, one end of the second sliding column is fixedly connected with a sealing block, the sealing block and the fixing shaft are provided with a second spring in sleeve connection with the second sliding column, the other end of the second sliding column is fixedly installed on the second clamping plate, and the sealing block is fixedly connected with a third clamping plate.

[0010] Preferably, the third clamping plate is installed on the inner side of the plastic gear, and the third clamping plate protrudes outward from the second clamping plate.

[0011] Preferably, the positive alloy electrode and the negative alloy electrode are both made of copper-nickel-silver alloy material, and the packaging body is wrapped with polypropylene material.

[0012] Preferably, the both ends of the packaging body are further provided with lead-out end grooves in sliding connection with the first pin and the second pin.

[0013] Compared with the prior art, the present application has the following beneficial effects: 1. When the first pin and the second pin are pulled out in the reverse direction along the lead-out end groove, the clamping column is released from the limiting of the right angle end of the first clamping plate under the action of the insulating sleeve ring, and then the clamping column is pulled out, the second conductive ring is separated from the first conductive ring under the driving of the clamping column, the conductive path is disconnected, and the whole process does not need to damage the packaging body or the welding point, and the capacitor can be repeatedly disassembled, repaired or reused.

[0014] 2. By removing the second clamping plate's limit on the plastic gear and adjusting the welding angle of the first and second pins, the second clamping plate is re-engaged into the groove of the plastic gear using the action of the second spring, thus locking the welding angle of the first and second pins. This effectively prevents the first and second pins from being repeatedly bent to match the welding angle, which would affect their service life. Attached Figure Description

[0015] Figure 1 This is a modeling diagram of the surface-mount thin-film capacitor of the present invention; Figure 2 This is an isometric view of the surface-mount thin-film capacitor of the present invention; Figure 3 This is a cross-sectional view of the surface-mount thin-film capacitor of the present invention; Figure 4 This is a schematic diagram of the core of the surface-mount thin-film capacitor of the present invention; Figure 5 This is a schematic diagram of the structure of the first pin of the surface-mount thin-film capacitor of the present invention; Figure 6 This is a schematic diagram of the snap-fit ​​post and insulating collar of the surface-mount film capacitor of the present invention. Figure 7 This is a schematic diagram of the slot structure for the surface mount thin film capacitor of the present invention; Figure 8 This is a schematic diagram of the structure of the first card plate of the surface mount thin film capacitor of the present invention; Figure 9 This is a schematic diagram of the positioning adapter component for the surface mount thin film capacitor of the present invention. In the diagram: 1. Package body, 2. First pin, 3. Second pin, 4. Blocking ring, 5. Dielectric material, 6. Negative alloy electrode, 7. Positive alloy electrode, 8. First conductive ring, 9. Insulating block, 10. Lead-out end slot, 11. Boss, 12. First sliding post, 13. Insulating collar, 14. Snap-fit ​​post, 15. Second conductive ring, 16. First spring, 17. Slot, 18. First snap-fit ​​plate, 19. Plastic gear, 20. Second snap-fit ​​plate, 21. Third snap-fit ​​plate, 22. Sealing block, 23. Fixed shaft, 24. Second sliding post, 25. Second spring, 26. Conductive rod. Detailed Implementation

[0016] like Figures 1-9As shown, a surface-mount film capacitor includes a package 1 and a core disposed within the package 1. The package 1 has a first pin 2 and a second pin 3 at its two ends. The first pin 2 and the second pin 3 are electrically connected to the positive alloy electrode 7 and the negative alloy electrode 6 at both ends of the core via a plug-in assembly. The plug-in assembly includes a first conductive ring 8 disposed at both ends of the package 1 and electrically connected to the positive alloy electrode 7 and the negative alloy electrode 6. The first pin 2 and the second pin 3 are respectively fitted with snap-fit ​​posts 14 that are electrically connected to the first conductive ring 8 in contact. Both sides of one end of the package 1 have protrusions 11. The protrusions 11 are provided with positioning adapter components that cooperate with the plug-in assembly. The positioning adapter components include plastic gears 19 mounted on the first pin 2 and the second pin 3. The protrusions 11 are provided with a second locking plate 20 and a third locking plate 21 that elastically limit the plastic gears 19.

[0017] The core also includes a dielectric material 5 disposed between the positive alloy electrode 7 and the negative alloy electrode 6.

[0018] The plug-in assembly also includes a conductive rod 26 integrally mounted at the ends of the first pin 2 and the second pin 3. The end of the conductive rod 26 is integrally mounted with the snap-fit ​​post 14. The snap-fit ​​post 14 is provided with a second conductive ring 15 electrically connected to the first conductive ring 8. One end of the snap-fit ​​post 14 is provided with an insulating collar 13 slidably connected to the conductive rod 26. Insulating blocks 9 are respectively installed at both ends of the package body 1. The insulating blocks 9 have grooves inside that are slidably connected to the snap-fit ​​post 14 and the insulating collar 13. One end of the insulating block 9 is slidably connected to a first sliding post 12. The two ends of the first sliding post 12 are respectively equipped with a blocking ring 4 and a first locking plate 18. A first spring 16 is provided between the first locking plate 18 and the insulating block 9 and is sleeved and connected to the first sliding post 12. The first locking plate 18 is right-angled, and the inclined end of the first locking plate 18 faces the insulating collar 13. The snap-fit ​​post 14 has a slot 17 corresponding to the insulating collar 13.

[0019] like Figure 7 and 8As shown, as the locking post 14 penetrates deeper into the slide groove, it contacts the right-angled first locking plate 18 on one side of the insulating block 9. The inclined end of the first locking plate 18 faces the locking post 14. Under the action of the insertion force, the locking post 14 squeezes the inclined end of the first locking plate 18, pushing the first locking plate 18 to move away from the slide groove along the first slide post 12. At the same time, it compresses the first spring 16 on the first slide post 12. When the locking post 14 is inserted into the first conductive ring 8, the first spring 16 releases its elastic potential energy, pushing the first locking plate 18 to reset. The first locking plate 18 stops at the position between the locking post 14 and the insulating block 9. Between the retaining rings 13, the right-angled end of the first retaining plate 18 is attached to the retaining post 14, limiting the outward movement of the retaining post 14 and preventing it from arbitrarily dislodging. Simultaneously, the second conductive ring 15 on the retaining post 14 is fully attached to the first conductive ring 8 of the package body 1, achieving a complete electrical path from the first pin 2 to the conductive rod 26, the retaining post 14, the second conductive ring 15, the first conductive ring 8, and the positive alloy electrode 7 or the corresponding negative alloy electrode 6 of the second pin 3. When maintenance or capacitor replacement is required, the operator presses the first pin 2 or the second pin 3 inwards. The insulating collar 13 continues to press the inclined end of the first clamping plate 18. After the first clamping plate 18 presses the first spring 16, it moves outward. The insulating collar 13 moves to the right-angle end of the first clamping plate 18, prioritizing the outward movement of the sealing block 22. The second clamping plate 20 and the third clamping plate 21 release their restriction on the circumference and outward movement of the plastic gear 19. The insulating collar 13, blocked by the first clamping plate 18, enters the slot 17 of the clamping post 14. At this time, the first clamping plate 18 and the clamping post 14 form an integral connection. On the outer ring surface, since both ends of the insulating collar 13 are arc-shaped inclined surfaces, when the first pin 2 and the second pin 3 are pulled out in the opposite direction along the lead end groove 10, the locking post 14 is released from the right angle end of the first locking plate 18 under the action of the insulating collar 13, and then the locking post 14 is pulled out. The locking post 14 drives the second conductive ring 15 to separate from the first conductive ring 8, and the conductive path is broken. The whole process does not require damage to the package body 1 or solder joints, and the capacitor can be repeatedly disassembled, repaired or reused.

[0020] The positioning adapter component also includes a fixed shaft 23 fixedly installed on the boss 11. One end of the fixed shaft 23 is slidably connected to a second sliding column 24. One end of the second sliding column 24 is fixedly connected to a sealing block 22. A second spring 25 is provided between the sealing block 22 and the fixed shaft 23 and sleeved and connected to the second sliding column 24. The other end of the second sliding column 24 is fixedly installed on the second clamping plate 20. A third clamping plate 21 is fixedly connected to the sealing block 22. The third clamping plate 21 is installed inside the plastic gear 19 and protrudes outside the second clamping plate 20.

[0021] like Figure 9As shown, the boss 11 can extend the path of the lead-out slot 10, ensuring the installation depth of the first pin 2 and the second pin 3, effectively preventing moisture and dust from contacting the electrodes. After the first pin 2 and the second pin 3 are inserted into place, the second spring 25 resets. The plastic gear 19 installed on the first pin 2 and the second pin 3 will cooperate with the second locking plate 20 and the third locking plate 21 on the boss 11. The third locking plate 21 protrudes outside the second locking plate 20 and is located inside the plastic gear 19, indirectly limiting the inward movement of the locking post 14. Under the action of the second spring 25, the second sliding post 24 drives the second locking plate 20 to fit tightly against the tooth groove of the plastic gear 19, limiting the rotation of the locking post 14. When there is vibration or slight external force, since the second locking plate 20 and the third locking plate 21 are always in contact with the tooth groove of the plastic gear 19, the pins are prevented from being displaced due to vibration, further ensuring the contact stability between the second conductive ring 15 and the first conductive ring 8.

[0022] Both the positive alloy electrode 7 and the negative alloy electrode 6 are made of copper-nickel-silver alloy, and the encapsulation body 1 is made of polypropylene.

[0023] like Figure 1 and 2 As shown, the positive alloy electrode 7 and the negative alloy electrode 6 are made of copper-nickel-silver alloy, which has high conductivity and strong oxidation resistance, and can reduce current transmission loss; the package 1 is made of polypropylene, which has good temperature resistance and high insulation strength, and can isolate moisture and dust in the external environment, protecting the core and electrodes from corrosion.

[0024] Both ends of the package 1 are also provided with lead-out slots 10 that are slidably connected to the first pin 2 and the second pin 3.

[0025] like Figure 2 As shown, the lead-out end groove 10 can serve as a sliding guide for the first pin 2 and the second pin 3 of the package body 1, so that the conductive rod 26 integrally formed at the end of the first pin 2 and the second pin 3 drives the snap-fit ​​post 14 to be inserted into the sliding groove inside the insulating block 9.

[0026] The working process of this invention is as follows: The operator aligns the first pin 2 and the second pin 3 with the lead-out end slots 10 at both ends of the package body 1. The lead-out end slots 10 can serve as a sliding guide for the first pin 2 and the second pin 3 pre-set by the package body 1, so that the conductive rods 26 integrally formed at the ends of the first pin 2 and the second pin 3 drive the snap-fit ​​post 14 to be inserted into the sliding groove inside the insulating block 9. At this time, the second conductive ring 15 on the snap-fit ​​post 14, which is used to realize the electrode conduction, is connected to the first conductive rings 8 at both ends of the package body 1. The first conductive rings 8 have been pre-electrically connected to the positive alloy electrode 7 and the negative alloy electrode 6 of the core and are in a state of waiting to be contacted. The insulating sleeve 13 enters the sliding groove synchronously with the snap-fit ​​post 14.

[0027] As the locking post 14 penetrates deeper into the groove, it contacts the right-angled first locking plate 18 on one side of the insulating block 9. The inclined end of the first locking plate 18 faces the locking post 14. Under the action of the insertion force, the locking post 14 presses against the inclined end of the first locking plate 18, pushing the first locking plate 18 to move away from the groove along the first sliding post 12. At the same time, it compresses the first spring 16 on the first sliding post 12. When the locking post 14 is inserted into the first conductive ring 8, the first spring 16 releases its elastic potential energy, pushing the first locking plate 18 to reset. The first locking plate 18 is stopped between the locking post 14 and the insulating collar 13. The right-angle end of the first locking plate 18 is attached to the locking post 14, which limits the outward movement of the locking post 14 and prevents the locking post 14 from detaching at will. At the same time, the second conductive ring 15 on the locking post 14 is completely attached to the first conductive ring 8 of the package body 1, realizing a complete electrical path from the first pin 2 to the conductive rod 26 to the locking post 14 to the second conductive ring 15 to the first conductive ring 8 to the positive alloy electrode 7 or the second pin 3 to the corresponding negative alloy electrode 6.

[0028] After the first pin 2 and the second pin 3 are inserted into place, the second spring 25 resets. The plastic gear 19 installed on the first pin 2 and the second pin 3 will cooperate with the second locking plate 20 and the third locking plate 21 on the boss 11. The third locking plate 21 protrudes outside the second locking plate 20 and is located inside the plastic gear 19, indirectly limiting the inward movement of the locking post 14. Under the action of the second spring 25, the second sliding post 24 drives the second locking plate 20 to closely adhere to the tooth groove of the plastic gear 19, limiting the rotation of the locking post 14. When there is external vibration or slight external force, due to the second locking plate 20 and the third locking plate 21 is always in contact with the groove of the plastic gear 19 to prevent the pin from shifting due to vibration, further ensuring the contact stability between the second conductive ring 15 and the first conductive ring 8. In addition, by removing the limit of the plastic gear 19 by the second clamping plate 20, the welding angle of the first pin 2 and the second pin 3 can be adjusted. The second spring 25 is used again to re-clamp the second clamping plate 20 into the groove of the plastic gear 19, locking the welding angle of the first pin 2 and the second pin 3. This effectively avoids the first pin 2 and the second pin 3 from being repeatedly bent to match the welding angle, which would affect the service life of the first pin 2 and the second pin 3.

[0029] After the circuit is powered on, the current flows from the circuit board pads to the first pin 2, through the conductive rod 26 and the second conductive ring 15 of the snap-fit ​​post 14 to the first conductive ring 8, and then through the first conductive ring 8 to the positive alloy electrode 7 of the core. After the dielectric material 5 inside the core completes the charge storage and release, the current flows out from the negative alloy electrode 6, through the first conductive ring 8, the second conductive ring 15, the snap-fit ​​post 14, and the conductive rod 26 on the other side to the second pin 3, and finally flows back to the circuit board to realize the charging and discharging function of the capacitor. The positive alloy electrode 7 and the negative alloy electrode 6 are made of copper-nickel-silver alloy, which has high conductivity and strong oxidation resistance, and can reduce current transmission loss. The package 1 is made of polypropylene, which has good temperature resistance and high insulation strength, and can isolate moisture and dust in the external environment, protecting the core and electrodes from corrosion.

[0030] When a capacitor needs repair or replacement, the operator should press the first pin 2 or the second pin 3 inwards. The insulating collar 13 continues to press the inclined end of the first clamping plate 18. After the first clamping plate 18 presses the first spring 16, it moves outward. The insulating collar 13 moves to the right-angle end of the first clamping plate 18 and prioritizes the outward movement of the sealing block 22. The second clamping plate 20 and the third clamping plate 21 release the restriction on the circumference and outward movement of the plastic gear 19. The insulating collar 13 is blocked by the first clamping plate 18 and enters the slot 17 of the locking post 14. At this time, the first clamping plate 18 and the locking post 14 form an integral connecting outer ring surface. Since both ends of the insulating collar 13 are arc-shaped inclined surfaces, when the first pin 2 and the second pin 3 are pulled out in the opposite direction along the lead-out end slot 10, the locking post 14 is released from the restriction of the right-angle end of the first clamping plate 18 on the locking post 14 under the action of the insulating collar 13, and then the locking post 14 is pulled out. The locking post 14 drives the second conductive ring 15 to separate from the first conductive ring 8, and the conductive path is broken.

[0031] The entire process does not require damaging the package 1 or solder joints, and the capacitor can be repeatedly disassembled, repaired, or reused.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that variations may be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A surface-mount film capacitor, characterized in that: The package includes a package body (1) and a core disposed within the package body (1). A first pin (2) and a second pin (3) are respectively disposed at both ends of the package body (1). The first pin (2) and the second pin (3) are electrically connected to the positive alloy electrode (7) and the negative alloy electrode (6) at both ends of the core via a plug-in assembly. The plug-in assembly includes a first conductive ring (8) disposed at both ends of the package body (1) and electrically connected to the positive alloy electrode (7) and the negative alloy electrode (6). The first pin (2)... The first and second pins (3) are respectively equipped with snap-fit ​​posts (14) that are electrically connected to the first conductive ring (8). Both sides of one end of the package (1) are provided with bosses (11). The bosses (11) are provided with positioning adapter components that cooperate with the plug-in components. The positioning adapter components include plastic gears (19) installed on the first pin (2) and the second pin (3). The bosses (11) are provided with a second clamping plate (20) and a third clamping plate (21) that are elastically limited by the plastic gears (19).

2. The surface-mount thin-film capacitor according to claim 1, characterized in that: The plug-in assembly also includes a conductive rod (26) integrally mounted at the ends of the first pin (2) and the second pin (3). The end of the conductive rod (26) is integrally mounted with the snap-fit ​​post (14). The snap-fit ​​post (14) is provided with a second conductive ring (15) electrically connected to the first conductive ring (8). One end of the snap-fit ​​post (14) is provided with an insulating collar (13) slidably connected to the conductive rod (26). Insulating blocks (9) are respectively installed at both ends of the package (1). The insulating blocks (9) have grooves inside that are slidably connected to the snap-fit ​​post (14) and the insulating collar (13).

3. The surface-mount thin-film capacitor according to claim 2, characterized in that: The insulating block (9) is slidably connected to a first sliding post (12) at one end. A blocking ring (4) and a first clamping plate (18) are respectively installed at both ends of the first sliding post (12). A first spring (16) is provided between the first clamping plate (18) and the insulating block (9) and is sleeved and connected to the first sliding post (12).

4. The surface-mount thin-film capacitor according to claim 3, characterized in that: The first card plate (18) is right-angled, and the inclined end of the first card plate (18) faces the insulating collar (13). The card slot (17) corresponding to the insulating collar (13) is opened in the card post (14).

5. The surface mount thin-film capacitor according to claim 1, characterized in that: The positioning adapter component also includes a fixed shaft (23) fixedly installed on the boss (11). One end of the fixed shaft (23) is slidably connected to a second slide column (24). One end of the second slide column (24) is fixedly connected to a sealing block (22). A second spring (25) is provided between the sealing block (22) and the fixed shaft (23) and sleeved and connected to the second slide column (24). The other end of the second slide column (24) is fixedly installed on the second card plate (20). A third card plate (21) is fixedly connected to the sealing block (22).

6. The surface-mount thin-film capacitor according to claim 5, characterized in that: The third clamping plate (21) is installed on the inside of the plastic gear (19), and the third clamping plate (21) protrudes outside the second clamping plate (20).

7. The surface mount film capacitor according to claim 1, characterized in that: The positive alloy electrode (7) and the negative alloy electrode (6) are both made of copper-nickel-silver alloy, and the encapsulation body (1) is made of polypropylene.

8. The surface-mount thin-film capacitor according to claim 1, characterized in that: The package (1) also has lead-out slots (10) at both ends that are slidably connected to the first pin (2) and the second pin (3).