Electronic device

Abstract

The invention discloses an electronic device which comprises a loudspeaker, a first support, a second support, a printed circuit board and a printed circuit board, the loudspeaker and the printed circuit board are located on the first side of the first support, the second support is located on the second side of the first support, and the first side and the second side are the two opposite sides of the first support. The first support and the second support enclose to form a first cavity, the first support, the second support and the printed circuit board enclose to form a second cavity, the first cavity is communicated with the second cavity, and the loudspeaker is communicated with the first cavity. Therefore, the loudspeaker is communicated with the first cavity, and the first cavity is communicated with the second cavity, so that the cavity of the loudspeaker is expanded, and the sounding effect of the loudspeaker is enhanced.

Description

Technical Field

[0001] This application belongs to the field of electronic technology, specifically relating to an electronic device. Background Technology

[0002] With the continuous development of electronic technology, electronic devices are playing an increasingly important role in people's lives. Current electronic devices typically include speakers, and to facilitate sound production, a speaker enclosure is usually required. However, current speaker enclosures are relatively small, resulting in poor sound quality. Summary of the Invention

[0003] This application aims to provide an electronic device that can solve the problem of poor sound output from a speaker.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] This application provides an electronic device, including: a speaker, a first bracket, a second bracket, a printed circuit board, and a printed circuit board. The speaker and the printed circuit board are located on a first side of the first bracket, and the second bracket is located on a second side of the first bracket. The first side and the second side are opposite sides of the first bracket. The first bracket and the second bracket enclose a first cavity, and the first bracket, the second bracket, and the printed circuit board enclose a second cavity. The first cavity and the second cavity are connected, and the speaker is connected to the first cavity.

[0006] In an embodiment of this application, the electronic device includes: a speaker, a first bracket, a second bracket, and a printed circuit board. The speaker and the printed circuit board are located on a first side of the first bracket, and the second bracket is located on a second side of the first bracket. The first side and the second side are opposite sides of the first bracket. The first bracket and the second bracket enclose a first cavity, and the first bracket, the second bracket, and the printed circuit board enclose a second cavity. The first cavity and the second cavity are connected. Thus, since the speaker is connected to the first cavity, and the first cavity and the second cavity are connected, the cavity of the speaker is enlarged, thereby enhancing the sound output of the speaker.

[0007] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0008] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0009] Figure 1 This is one of the exploded views of the electronic device provided in the embodiments of this application;

[0010] Figure 2 This is one of the structural schematic diagrams of the electronic device provided in the embodiments of this application;

[0011] Figure 3 The embodiments of this application provide the following: Figure 2 Sectional view of line AA in the middle;

[0012] Figure 4 The embodiments of this application provide the following: Figure 2 Sectional view of the middle BB line;

[0013] Figure 5 The embodiments of this application provide the following: Figure 2 A cross-sectional view of the CC line;

[0014] Figure 6 This is the second exploded view of the electronic device provided in the embodiments of this application;

[0015] Figure 7 This is the third exploded view of the electronic device provided in the embodiments of this application;

[0016] Figure 8 This is the fourth exploded view of the electronic device provided in the embodiments of this application;

[0017] Figure 9 This is the fifth exploded view of the electronic device provided in the embodiments of this application;

[0018] Figure 10 This is the sixth exploded view of the electronic device provided in the embodiments of this application;

[0019] Figure 11 This is a second schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0020] Figure 12 The embodiments of this application provide the following: Figure 11 A cross-sectional view of the DD line. Detailed Implementation

[0021] Embodiments of this application will now be described in detail, with examples of these embodiments illustrated in the accompanying drawings. Throughout the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] like Figures 1 to 12 As shown, Figure 1 An exploded view of an electronic device provided in an embodiment of this application, such as... Figure 1 As shown, the electronic device includes: a speaker 10, a first bracket 20, a second bracket 30, and a printed circuit board 40. The speaker 10 and the printed circuit board 40 are located on the first side of the first bracket 20, and the second bracket 30 is located on the second side of the first bracket 20. The first side and the second side are opposite sides of the first bracket 20. The first bracket 20 and the second bracket 30 enclose to form a first cavity 100. The first bracket 20, the second bracket 30, and the printed circuit board 40 enclose to form a second cavity 200. The first cavity 100 and the second cavity 200 are connected. The speaker 10 is connected to the first cavity 100.

[0026] The speaker 10 can be understood as a device in an electronic device used to produce sound. For example, the speaker 10 can produce sound by vibrating, and the audio performance of the speaker 10 can be changed by the first cavity 100 and the second cavity 200, that is, the sound production effect of the speaker 10 can be enhanced.

[0027] Since the speaker 10 is positioned closer to the first bracket 20 in the first bracket 20 and the second bracket 30, the first bracket 20 can be referred to as the upper bracket cover, and the second bracket 30 can be referred to as the lower bracket cover.

[0028] The specific manner in which the first cavity 100 and the second cavity 200 are connected is not limited here; alternatively, see [link to relevant documentation]. Figure 12 The first cavity 100 and the second cavity 200 can be connected by a cavity channel 300, and the cavity channel 300 can be regarded as part of the first cavity 100 and the second cavity 200, thereby achieving the effect of further increasing the volume of the first cavity 100 and the second cavity 200.

[0029] It should be noted that the specific structure and formation method of the cavity channel 300 are not limited here. Optionally, the structure of the cavity channel 300 can be a straight channel or a curved channel, and the width of the cross-section of the cavity channel 300 can be smaller than the width of the cross-section of the first cavity 100 and the width of the cross-section of the second cavity 200, respectively. Optionally, the formation method of the cavity channel 300 can be described as follows: the gap between the first support 20 and the second support 30 constitutes the cavity channel 300, and the cavity channel 300 is located between the first cavity 100 and the second cavity 200.

[0030] Optionally, the first cavity 100 and the second cavity 200 can be staggered, that is, the first region of the first support 20 and the second region of the second support 30 can enclose to form the first cavity 100, and the first region and the second region can be regions that are opposite to each other; while the third region of the first support 20, the fourth region of the second support 30 and the printed circuit board 40 can enclose to form the second cavity 200, and the fourth region can be opposite to the printed circuit board 40, while the two ends of the third region can be adjacent to the fourth region and the printed circuit board 40 respectively; and the first region and the third region can be two different regions on the first support 20, and the second region and the fourth region can be two different regions on the second support 30.

[0031] It should be noted that, due to the staggered arrangement of the first cavity 100 and the second cavity 200, the thickness of the entire electronic device can be reduced compared to the stacked arrangement of the first cavity 100 and the second cavity 200, thereby reducing the volume of the electronic device and making it thinner and lighter.

[0032] The printed circuit board 40 can be referred to as the motherboard. The printed circuit board 40 can be used to power the electronic components of the electronic device. For example, the printed circuit board 40 can power the speaker 10.

[0033] In this embodiment, the first support 20 and the second support 30 enclose a first cavity 100, and the first support 20, the second support 30 and the printed circuit board 40 enclose a second cavity 200. The first cavity 100 and the second cavity 200 are connected. Since the speaker 10 is connected to the first cavity 100 and the first cavity 100 and the second cavity 200 are connected, the first cavity 100 and the second cavity 200 can be understood as the cavity of the speaker 10, thereby expanding the cavity of the speaker 10. The speaker 10 can emit sound through the connected first cavity 100 and the second cavity 200, thereby enhancing the sound emission effect of the speaker 10.

[0034] It should be noted that both the first cavity 100 and the second cavity 200 can be referred to as the rear cavity of the speaker 10. For example, the first cavity 100 can be referred to as rear cavity 1 or the first rear cavity, and the second cavity 200 can be referred to as rear cavity 2 or the second rear cavity. That is, the diaphragm of the speaker 10 can be located on the side of the speaker 10 away from the first bracket 20.

[0035] As an optional implementation, see [link to implementation details]. Figure 7 and Figure 10 The first bracket 20 is provided with a first through hole 21, and a plurality of protruding ribs 22 are provided in the circumferential direction at one end of the first through hole 21 facing the second bracket 30. The speaker 10 is connected to the first cavity 100 through the first through hole 21.

[0036] The first support 20 may have a first through hole 21, and the shape of the first through hole 21 is not limited here.

[0037] For example, the cross-section of the first through hole 21 can be circular, elliptical, or rectangular.

[0038] In this embodiment, since the first bracket 20 is provided with a first through hole 21, the speaker 10 communicates with the first cavity 100 through the first through hole 21. Thus, the first through hole 21 can be regarded as part of the first cavity 100, thereby effectively increasing the volume of the first cavity 100 and further enhancing the sound output of the speaker 10. In addition, since multiple protruding ribs 22 are provided circumferentially at the end of the first through hole 21 facing the second bracket 30, the multiple protruding ribs 22 can enhance the circumferential connection strength of the end of the first through hole 21 facing the second bracket 30. At the same time, the multiple protruding ribs 22 can enhance the support effect on the first bracket 20, preventing the cavity from being damaged due to the collapse of the bracket.

[0039] It should be noted that when the first support 20 is provided with the first through hole 21, the first support 20, the second support 30 and the speaker 10 can be enclosed to form the first cavity 100. That is, the first cavity 100 includes the area enclosed by the first support 20 and the second support 30, the first through hole 21, and the area between the first support 20 and the speaker 10, thereby further expanding the volume of the first cavity 100.

[0040] As an optional implementation, see [link to implementation details]. Figure 10 The second bracket 30 is provided with a second through hole 31, and multiple protrusions 33 are provided along the inner wall circumferentially of the second through hole 31. The protrusions 22 and the protrusions 33 are in one-to-one contact.

[0041] The second support 30 may have a second through hole 31 on its surface facing the first support 20. The shape of the second through hole 31 is not limited here. Optionally, the second through hole 31 can refer to the description of the first through hole 21 above. That is, the shape of the cross-section of the second through hole 31 can also be circular, elliptical or rectangular, etc.

[0042] It should be noted that, optionally, the first through hole 21 and the second through hole 31 can be configured to correspond at least partially. For example, the above-mentioned corresponding configuration can be understood as a relative configuration, that is, the first through hole 21 and the second through hole 31 can be configured to correspond at least partially.

[0043] In this embodiment, the ribs 22, slats 33, the first support 20, and the second support 30 can enclose and form multiple channels, which can communicate with the first cavity 100. Thus, these channels can be considered part of the first cavity 100, effectively increasing the volume of the first cavity 100 and further enhancing the sound output of the speaker 10. Furthermore, the ribs 22 and slats 33 abut against each other, providing support between the first support 20 and the second support 30 to prevent cavity collapse. Simultaneously, by providing the ribs 22 and slats 33, multiple channels can be formed with the first support 20 and the second support 30, effectively increasing the volume of the first cavity 100. In some embodiments of this application, the ribs 22 are provided along the edge of the first through hole 21 towards the end facing the second support 30.

[0044] As an optional implementation, see [link to implementation details]. Figure 4 The electronic device also includes a sealing plate 32, the edge of which is circumferentially embedded in the second bracket 30 along the end of the second through hole 31 away from the first bracket 20, and the sealing plate 32 seals the end of the second through hole 31 away from the first bracket 20.

[0045] The specific material of the sealing plate 32 is not limited here. Optionally, the sealing plate 32 can be made of metal material, so the sealing plate 32 can be called a metal plate, and the metal plate has better reliability. Alternatively, the sealing plate 32 can be made of plastic material, which can reduce the weight of the sealing plate 32.

[0046] Optionally, the sealing plate 32 is embedded in the circumferential direction of the end of the second through hole 31 away from the first bracket 20, and seals the second through hole 31, avoiding the influence of the bracket thickness at the second through hole 31, further expanding the volume of the first cavity 100 and thus improving the sound effect.

[0047] Optionally, the wall of the second through hole 31 may be provided with a receiving groove, and the sealing plate 32 may be embedded in the receiving groove. In this way, the thickness of the second bracket 30 with the sealing plate 32 is equal to the thickness of the second bracket 30 itself, thereby reducing the thickness of the entire electronic device. At the same time, the wall of the second through hole 31 can also enhance the limiting effect on the sealing plate 32.

[0048] In this embodiment, the edge of the sealing plate 32 is embedded into the second bracket 30 along the circumferential direction of the end of the second through hole 31 away from the first bracket 20. This enhances the connection strength of the entire second bracket 30. At the same time, compared with the method of setting a plastic bracket on the second bracket 30, the space occupied by the sealing plate 32 in this embodiment is smaller than that occupied by the plastic bracket, thereby saving the space mentioned above. The saved space can be used to set the cavity of the speaker 10, thereby further enhancing the sound output effect of the speaker 10.

[0049] It should be noted that since the sealing plate 32 is used to seal the end of the second through hole 31 that is away from the first bracket 20, and the second through hole 31 can communicate with the first cavity 100, this can also enhance the sealing performance of the first cavity 100 and enhance the waterproof and dustproof performance of the first cavity 100.

[0050] It should be noted that the connection method between the first bracket 20 and the second bracket 30 is not limited here.

[0051] As an optional implementation, see [link to implementation details]. Figure 7 At least a portion of the first bracket 20 is provided with a connector 90 on the edge facing the second bracket 30, and the first bracket 20 and the second bracket 30 are connected by the connector 90.

[0052] The specific structure of the connector 90 is not limited here. Optionally, the connector 90 may include at least one of the following: adhesive, ultrasonic welding material, double-sided adhesive, etc.

[0053] Alternatively, there can be two connectors 90. One connector 90 can be disposed on the first bracket 20, and the other connector 90 can be disposed on the second bracket 30. The structures of the two connectors 90 can be matched with each other. For example, the connector 90 includes a first connector and a second connector. The structure of the first connector is a groove, and the structure of the second connector is a protrusion that matches the groove. In this way, the connection stability between the first bracket 20 and the second bracket 30 can be further enhanced.

[0054] In this embodiment of the application, the first bracket 20 and the second bracket 30 are connected by a connector 90, which can further enhance the connection stability between the first bracket 20 and the second bracket 30, that is, further enhance the connection effect between the first bracket 20 and the second bracket 30.

[0055] The aforementioned ultrasonic welding parts can also be called ultrasonic welding lines or ultrasonic wires. Ultrasonic welding lines or ultrasonic wires can be understood as: ultrasonic welding parts or ultrasonic wires are connectors obtained by ultrasonic welding technology, which is a technology that uses 15-70kHz high-frequency vibration waves to weld thermoplastic materials.

[0056] It should be noted that when the convex strip 33 and the convex rib 22 are provided, that is, the convex strip 33 and the convex rib 22 are fixedly connected by the above-mentioned connector 90, which can enhance the connection stability between the convex strip 33 and the convex rib 22.

[0057] As another alternative implementation, the first support 20 has a bone position between its edges, the rib 22 is connected to the bone position, the rib 22 is connected to the rib 33 through the connector 90, and the bone position is fixedly connected to the second support 30 through the connector 90. In this way, the connection stability between the rib 33 and the rib 22 can be further enhanced.

[0058] It should be noted that when the convex strip 33 and convex rib 22 have good elasticity, for example, when the convex strip 33 and convex rib 22 can be made of elastic material, the convex strip 33 and convex rib 22 can also play a buffering role between the first support 20 and the second support 30.

[0059] As an optional implementation, see [link to implementation details]. Figure 1 , Figure 4 The electronic device also includes a first sealing component 60, which is disposed between the speaker 10 and the first bracket 20. The first sealing component 60 is disposed circumferentially at one end of the first through hole 21 facing the speaker 10.

[0060] In this embodiment of the application, when a first sealing component 60 is provided and the first sealing component 60 is disposed between the speaker 10 and the first bracket 20, the first sealing component 60 can also be combined with the first bracket 20 and the second bracket 30 to form a first cavity 100, thereby further increasing the volume of the first cavity 100 and enhancing the sealing performance of the first cavity 100.

[0061] The specific structure of the first sealing component 60 is not limited here. Optionally, the first sealing component 60 can be a sealing gasket, a sealing block, or a sealing sheet, etc.

[0062] As an optional implementation, see [link to implementation details]. Figure 4 The first bracket 20 is also provided with a third through hole 23, and the third through hole 23 is connected to the second cavity 200.

[0063] The cross-sectional shape of the third through hole 23 is not limited here. Optionally, the cross-sectional shape of the third through hole 23 can be circular, elliptical, or rectangular, etc.

[0064] In this embodiment of the application, since the first support 20 is also provided with a third through hole 23, and the third through hole 23 is connected to the second cavity 200, the third through hole 23 can also be understood as part of the second cavity 200, that is, the volume of the second cavity 200 is further increased.

[0065] As an optional implementation, see [link to implementation details]. Figure 4 A second sealing component 70 is provided circumferentially at one end of the third through hole 23 facing the printed circuit board 40. The first bracket 20 abuts against the printed circuit board 40 through the second sealing component 70, and the second bracket 30 abuts against the side of the first bracket 20 away from the printed circuit board 40.

[0066] When a second sealing component 70 is provided, the second sealing component 70 can also be combined with the first bracket 20, the second bracket 30 and the printed circuit board 40 to form a second cavity 200, thereby further increasing the volume of the second cavity 200.

[0067] The specific structure of the second sealing component 70 is not limited here. Optionally, the second sealing component 70 can be a sealing gasket, sealing block, silicone ring, waterproof ring, foam, or sealing sheet, etc.

[0068] In this embodiment of the application, a second sealing component 70 is provided circumferentially at one end of the third through hole 23 facing the printed circuit board 40. The second sealing component 70 can also be combined with the first bracket 20, the second bracket 30 and the printed circuit board 40 to form a second cavity 200, thereby further enhancing the sealing performance of the second cavity 200.

[0069] As an optional implementation, see [link to implementation details]. Figure 1 , Figure 4 The electronic device also includes a housing 50, a speaker 10 located between the first bracket 20 and the housing 50, and the speaker 10 and the housing 50 enclose a third cavity 400.

[0070] Since the first cavity 100 and the second cavity 200 can be referred to as the rear cavity, the third cavity 400 can be referred to as the front cavity. The third cavity 400 can be disconnected from the first cavity 100 and the second cavity 200, that is, the third cavity 400 and the first cavity 100 can be isolated by the speaker 10.

[0071] In this embodiment, since the speaker 10 and the housing 50 enclose a third cavity 400, the volume of the cavity of the speaker 10 is further increased, thereby further enhancing the sound output of the speaker 10.

[0072] As an optional implementation, see [link to implementation details]. Figure 4 The electronic device also includes a third sealing component 80, which is located between the speaker 10 and the housing 50, and the speaker 10 abuts against the housing 50 through the third sealing component 80.

[0073] The specific structure of the third sealing component 80 is not limited here. Optionally, the third sealing component 80 can be a sealing gasket, sealing block, or sealing sheet, etc.

[0074] In this embodiment, since the third sealing component 80 is located between the speaker 10 and the housing 50, the speaker 10 abuts against the housing 50 through the third sealing component 80. The third sealing component 80 can also form a third cavity 400 together with the speaker 10 and the housing 50. In this way, the sealing performance of the third cavity 400 can be further enhanced by the third sealing component 80, thereby further enhancing the sound output effect of the speaker 10.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: The speaker, a first bracket, a second bracket, and a printed circuit board are provided. The speaker and the printed circuit board are located on a first side of the first bracket, and the second bracket is located on a second side of the first bracket. The first side and the second side are opposite sides of the first bracket. The first bracket and the second bracket enclose a first cavity, and the first bracket, the second bracket, and the printed circuit board enclose a second cavity. The first cavity and the second cavity are connected, and the speaker is connected to the first cavity.

2. The electronic device according to claim 1, characterized in that, The first bracket is provided with a first through hole, and a plurality of protruding ribs are provided circumferentially at one end of the first through hole facing the second bracket. The speaker communicates with the first cavity through the first through hole.

3. The electronic device according to claim 2, characterized in that, The second bracket is provided with a second through hole, and multiple protruding ribs are arranged circumferentially along the inner wall of the second through hole, with each protruding rib abutting against the protruding rib.

4. The electronic device according to claim 3, characterized in that, The electronic device further includes a sealing plate, the edge of which is circumferentially embedded in the second bracket along the end of the second through hole away from the first bracket, and the sealing plate seals the end of the second through hole away from the first bracket.

5. The electronic device according to any one of claims 1 to 4, characterized in that, At least a portion of the first bracket has a connector on the edge facing the second bracket, and the first bracket and the second bracket are connected by the connector.

6. The electronic device according to claim 2, characterized in that, The electronic device further includes a first sealing component disposed between the speaker and the first bracket, the first sealing component being disposed circumferentially at one end of the first through hole facing the speaker.

7. The electronic device according to claim 1, characterized in that, The first bracket is also provided with a third through hole, and the third through hole communicates with the second cavity.

8. The electronic device according to claim 7, characterized in that, A second sealing component is provided circumferentially at one end of the third through hole facing the printed circuit board. The first bracket abuts against the printed circuit board through the second sealing component, and the second bracket abuts against the side of the first bracket away from the printed circuit board.

9. The electronic device according to claim 1, characterized in that, The electronic device also includes a housing, and the speaker is located between the first bracket and the housing.

10. The electronic device according to claim 9, characterized in that, The electronic device further includes a third sealing component located between the speaker and the housing.

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