An automated processing equipment for circuit board substrates

Abstract

This application relates to an automated substrate processing equipment for circuit boards, belonging to the field of circuit board substrate processing technology. It includes a base, a processing table disposed above the base, a first moving mechanism, and a cutting head. A cleaning device is disposed below the first moving mechanism. The cleaning device includes a mounting frame, a first transmission component, a second transmission component, and a liquid delivery component disposed on the mounting frame; the first transmission component includes a wheel frame. This automated substrate processing equipment for circuit boards allows for timely cleaning of the processing area by the cleaning device while the cutting head is processing, preventing debris generated during processing from affecting subsequent processing and improving processing quality. Furthermore, the rollers have through holes, allowing liquid to be delivered through the liquid delivery component, enabling various cleaning methods such as spraying and immersion. These methods can be adjusted according to different processing needs and cleaning requirements, improving the applicability of the equipment.

Description

Technical Field

[0001] This application relates to the field of circuit board substrate processing technology, and in particular to an automated circuit board substrate processing equipment. Background Technology

[0002] The substrate is the basic carrier for assembling electronic components and interconnecting circuits. It provides physical support for electronic components and establishes conductive paths. The copper layer covering the surface of the substrate is patterned to form a wire network, enabling signal transmission between integrated circuits.

[0003] A search revealed that patent document CN120480436A discloses an automated processing equipment for a spaceborne circuit board substrate. The equipment includes a support base with a sliding table slidably connected to its inner wall. A cooling mechanism is also provided on the inner wall of the support base. The cooling mechanism includes a support platform, the inner wall of which is fixedly connected to the inner wall of the support base. An isolation plate is fixedly connected to the inner wall of the support platform. A collection groove is formed on the surface of the isolation plate, and a connecting hole is formed in the groove wall. An adsorption mechanism is provided on the surface of the isolation plate, and the adsorption mechanism includes a support plate, the bottom of which is fixedly connected to the surface of the isolation plate. This application uses the cooling mechanism to cool the substrate during the substrate cutting process and simultaneously collect cutting residue.

[0004] Regarding the aforementioned related technologies, the inventors have discovered at least the following problems: the application lacks active and efficient local cooling, and the solution relies on negative pressure to draw air for heat dissipation, which is extremely inefficient. For the high temperatures generated during cutting, this passive air cooling cannot effectively prevent deformation of the heat-affected zone. Therefore, an automated processing equipment for circuit board substrates is proposed to solve the problems mentioned above. Summary of the Invention

[0005] To address the shortcomings of existing technologies and improve cooling performance, this application provides an automated substrate processing equipment for circuit boards, which has advantages such as high efficiency and automatic control cleaning, effectively solving the problems described in the background art.

[0006] This application provides an automated substrate processing equipment for circuit boards, which adopts the following technical solution:

[0007] An automated processing equipment for circuit board substrates includes a base, a processing table disposed above the base, a first moving mechanism, and a cutting head. A cleaning device is disposed below the first moving mechanism. The cleaning device includes a mounting frame, a first transmission component, a second transmission component, and an infusion component disposed on the mounting frame.

[0008] The first transmission assembly includes a wheel frame, a roller rotatably mounted inside the wheel frame, and a drive shaft. One end of the drive shaft is connected to the end of the roller, and the other end of the drive shaft is connected to the second transmission assembly. The roller has several through holes inside.

[0009] The second transmission assembly includes a rotating seat and a transmission component 1 connected to the drive spindle. The second transmission assembly also includes a second transmission component and a third transmission component connected to the infusion assembly.

[0010] The infusion assembly includes a housing, a booster tube disposed inside the housing, and a piston disposed inside the housing. The booster tube is hollow inside, and the piston is located above the booster tube. A valve tube communicating with the roller is installed at the end of the booster tube, and a valve connected to the transmission component is disposed inside the valve tube.

[0011] Optionally, the moving mechanism includes a gantry frame disposed above the base, a linear module disposed on the gantry frame, and a slide table slidably mounted on the side of the gantry frame and connected to the linear module. Two mounting platforms are installed on the outer wall of the slide table, and the two mounting platforms are distributed vertically. An electric telescopic rod connected to the bottom mounting platform is installed on the top mounting platform, and the bottom mounting platform is slidably disposed. The cutting head is detachably mounted on the bottom mounting platform.

[0012] Optionally: The bottom side of the processing table and both sides of the gantry are provided with a second moving mechanism connected to the machine base, and a first guide rod penetrating the interior of the top mounting table is installed on the upper surface of the bottom mounting table.

[0013] Optionally: The mounting bracket is bolted to the lower surface of the bottom mounting platform, the wheel frame is U-shaped, the wheel frame is located below the mounting bracket, and a guide is provided between the wheel frame and the mounting bracket.

[0014] Optionally, the guide includes a second guide rod fixed to the upper surface of the wheel frame and a return spring, the top end of the second guide rod penetrating the interior of the wheel frame, and the top side of the return spring being fixed to the lower surface of the wheel frame.

[0015] Optionally: The first transmission component is located inside the rotating seat, and the side of the rotating seat away from the first transmission component is connected to the second transmission component. The first transmission component includes a rotor disposed inside the rotating seat. A centrifugal block is disposed outside the rotor and abuts against the inside of the rotating seat. An elastic shaft is disposed between the centrifugal block and the rotor. The rotor is fixed to the outer surface of the drive shaft.

[0016] Optionally, the transmission component one further includes a sliding sleeve sleeved on the outer surface of the drive spindle. The sliding sleeve is composed of a sliding sleeve and a rotating sleeve. A connecting rod is hinged between the outer side of the rotating sleeve and the centrifugal block. The sliding sleeve and the rotating sleeve are rotatably connected, and the sliding sleeve is connected to the transmission component three.

[0017] Optionally: The transmission component two includes a crank sleeved on the end of the drive spindle, one side of the crank is fixed to the rotating seat, and the top end of the crank is provided with a connecting shaft and a connecting rod, wherein one end of the connecting shaft is hinged to the connecting rod, the other end of the connecting shaft is fixed with a connecting sleeve sleeved on the outer surface of the valve tube, and the other end of the connecting rod is hinged to the top side of the crank.

[0018] Optionally: The transmission component three includes a connecting arm fixed to the outer surface of the sliding sleeve, a connecting rod installed on the outer wall of the connecting arm, and a swing arm hinged to the valve at the other end of the connecting rod.

[0019] Optionally: the booster pipe is internally connected to the valve pipe, the bottom end of the booster pipe extends to the outside of the housing, and an adjusting rod for raising and lowering the piston is installed on the top side of the housing, and the outer wall of the piston is bolted to the end of the adjusting rod.

[0020] In summary, this application includes at least one of the following beneficial technical effects:

[0021] 1. This invention integrates a cleaning device below a moving mechanism. While the cutting head is processing, the cleaning device can clean the processing area in a timely manner, avoiding the impact of debris generated during processing on subsequent processing, thus improving processing quality. Furthermore, the rollers have through holes inside, and liquid is delivered through the liquid delivery component, enabling various cleaning methods such as spraying and immersion. These methods can be adjusted according to different processing needs and cleaning requirements, improving the applicability of the equipment.

[0022] 2. This invention, through the design of rollers, greatly optimizes the cleaning process. Traditional cleaning methods often fail to comprehensively and evenly cover the processing area, easily resulting in cleaning dead zones, leading to residual debris and impurities that affect subsequent processing accuracy and circuit board quality. However, the rollers in this device have surfaces that fit tightly against the processing area, continuously and stably cleaning the processing surface from all directions during rotation. Several through holes inside the rollers, in conjunction with the liquid delivery component, can accurately and evenly spray cleaning fluid onto the processing surface, effectively removing debris, dust, and residual chemicals generated during processing. This ensures that the processing area remains clean at all times, significantly improving cleaning efficiency and uniformity, and providing a strong guarantee for high-quality circuit board substrate processing.

[0023] 3. In this invention, the first transmission component, through structures such as centrifugal blocks, realizes the function of automatically adjusting the actions of relevant components according to the rotational speed of the drive spindle. For example, at a certain rotational speed, the movement of the centrifugal blocks drives the sliding sleeve to move, thereby triggering subsequent cleaning actions, so that the cleaning operation is adapted to the operating state of the equipment. The second transmission component, through the linkage design of the crank connecting rod mechanism and the third transmission component, converts the rotation of the drive spindle into the opening and closing action of the valve, realizing precise liquid delivery control. It has a compact structure and high transmission efficiency. Attached Figure Description

[0024] Figure 1 This is a three-dimensional view of the entire application;

[0025] Figure 2 This is a schematic diagram of the mobile mechanism of this application;

[0026] Figure 3 This is a schematic diagram of the overall cleaning equipment used in this application;

[0027] Figure 4 This is a schematic diagram of the transmission assembly and the infusion assembly of this application;

[0028] Figure 5 This is a bottom view of the transmission assembly of this application;

[0029] Figure 6 This is a bottom view of the infusion assembly of this application;

[0030] Figure 7 This application Figure 6 A magnified structural diagram of structure A is shown below;

[0031] Figure 8 This is a schematic diagram of the transmission component of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Machine base; 2. Machining table; 3. Moving mechanism one; 31. Gantry frame; 32. Linear module; 33. Slide table; 34. Electric telescopic rod; 35. Mounting platform; 36. First guide rod; 4. Cutting head; 5. Moving mechanism two; 6. Cleaning equipment; 7. Mounting frame; 8. Transmission assembly one; 81. Wheel frame; 82. Roller; 83. Through hole; 84. Guide component; 841. Second guide rod; 842. Return spring; 85. Drive spindle; 9. Transmission assembly two; 91. Rotary seat; 92. Transmission component one; 921, rotor; 922, centrifuge block; 923, elastic shaft; 924, sliding sleeve; 925, connecting rod; 93, Transmission component two; 931, crank; 932, connecting rod; 933, connecting shaft; 934, Transmission component three; 9341, connecting arm; 9342, connecting rod; 9343, swing arm; 94, connecting sleeve; 10, infusion assembly; 101, housing; 102, pressurizing pipe; 103, adjusting rod; 104, piston; 105, valve pipe; 106, valve. Detailed Implementation

[0034] The following is in conjunction with the appendix Figures 1-8 This application will be described in further detail.

[0035] This application discloses an automated substrate processing device for circuit boards. Please refer to... Figures 1-8 An automated processing equipment for circuit board substrates includes a base 1, a processing table 2 disposed above the base 1, a moving mechanism 3, and a cutting head 4. The moving mechanism 3 includes a gantry frame 31 disposed above the base 1, a linear module 32 disposed on the gantry frame 31, and a slide table 33 slidably mounted on the side of the gantry frame 31 and connected to the linear module 32. Two mounting platforms 35 are mounted on the outer wall of the slide table 33, and the two mounting platforms 35 are distributed vertically. An electric telescopic rod 34 connected to the bottom mounting platform 35 is mounted on the top mounting platform 35. The bottom mounting platform 35 is slidably disposed, and the top mounting platform 35 is fixedly disposed. The cutting head 4 is detachably mounted on the bottom mounting platform 35.

[0036] Specifically, both the bottom side of the processing table 2 and both sides of the gantry 31 are equipped with a second moving mechanism 5 connected to the machine base 1. The second moving mechanism 5 on the bottom side of the processing table 2, connected to the machine base 1, gives the processing table 2 the ability to move horizontally. This allows the processing table 2 to be flexibly adjusted according to different processing needs. For example, when processing large circuit board substrates, the relative position of the substrate and the cutting head 4 can be changed by moving the processing table 2, thereby achieving comprehensive processing of the entire substrate. Furthermore, the precise control of the second moving mechanism 5 ensures the smoothness and accuracy of the movement of the processing table 2, further improving processing quality. A first guide rod 36, penetrating the interior of the top mounting table 35, is installed on the upper surface of the bottom mounting table 35. This guide rod plays a crucial guiding role when the electric telescopic rod 34 drives the bottom mounting table 35 to rise and fall. It ensures that the bottom mounting table 35 moves linearly in the vertical direction, avoiding inaccurate positioning of the cutting head 4 due to offset. Simultaneously, the first guide rod 36 enhances the connection stability between the two mounting tables 35, reducing vibration and shaking, further improving processing accuracy and quality.

[0037] It should be noted that the top side of the processing table 2 is provided with a fixture mounting hole; the cutting head 4, the moving mechanism 5 and the linear module 32 are all conventional technologies known to the public in the prior art, so their specific structural composition and working principle will not be described in detail in this article.

[0038] In this embodiment, a cleaning device 6 is provided below the moving mechanism 3. The cleaning device 6 includes a mounting frame 7, a transmission component 8, a transmission component 9, and an infusion component 10 mounted on the mounting frame 7. The mounting frame 7 is bolted to the lower surface of the bottom mounting platform 35. It is worth mentioning that by placing the cleaning device 6 below the moving mechanism 3, the cleaning device 6 can synchronously clean the processing area as the moving mechanism 3 moves. During the process of the cutting head 4 processing the circuit board substrate, the cleaning device 6 can remove debris, dust, and other impurities in real time, preventing impurities from accumulating in the processing area and affecting the processing accuracy and the service life of the cutting head 4. The synchronous cleaning method greatly improves the cleaning efficiency, reduces additional cleaning processes and time, and thus improves the overall production efficiency.

[0039] In this embodiment, the transmission component 8 includes a wheel frame 81, a roller 82 rotatably mounted inside the wheel frame 81, and a drive spindle 85. One end of the drive spindle 85 is connected to the end of the roller 82, and the other end of the drive spindle 85 is connected to the transmission component 9. The roller 82 has several through holes 83 inside. Through the several through holes 83 inside the roller 82, in conjunction with the liquid delivery component 10, the cleaning fluid can be evenly sprayed onto the processing surface. The cleaning fluid can not only enhance the cleaning effect and wash away the impurities adhering to the surface, but also play a role in cooling and lubrication, reducing the friction between the cutting head 4 and the substrate, and extending the service life of the cutting head 4.

[0040] In addition, the liquid is released directly on the cutting or cleaning area, avoiding the diffusion and waste caused by spraying, and realizing the precise use of liquid. During the rolling process, the roller 82 evenly applies the liquid to the substrate surface, pre-wetting and scrubbing the cutting area, improving cleaning efficiency, while avoiding liquid splashing and contaminating other precision components. At the same time, the continuous flow of liquid can effectively prevent cutting debris from accumulating in the through hole 83, and has a certain self-cleaning ability, ensuring the stability of long-term operation.

[0041] Specifically, the wheel frame 81 is U-shaped and located below the mounting frame 7. A guide member 84 is provided between the wheel frame 81 and the mounting frame 7. The guide member 84 includes a second guide rod 841 fixed to the upper surface of the wheel frame 81 and a return spring 842. The top end of the second guide rod 841 penetrates the interior of the wheel frame 81, and the top side of the return spring 842 is fixed to the lower surface of the wheel frame 81.

[0042] The transmission assembly 2 9 includes a rotating seat 91 connected to the drive spindle 85 and a transmission component 1 92, thereby transmitting power. The transmission assembly 2 9 drives the roller 82 to rotate through the drive spindle 85, realizing the automated operation of the cleaning device 6. Specifically, the transmission assembly 2 9 also includes a transmission component 2 93 and a transmission component 3 934 connected to the infusion assembly 10. The transmission component 1 92 is located inside the rotating seat 91. The side of the rotating seat 91 away from the transmission component 1 92 is connected to the transmission component 2 93. The transmission component 1 92 includes a rotor 921 disposed inside the rotating seat 91. A centrifugal block 922 is disposed outside the rotor 921 and abuts against the inside of the rotating seat 91. An elastic shaft 923 is disposed between the centrifugal block 922 and the rotor 921. The rotor 921 is fixed to the outer surface of the drive spindle 85.

[0043] In this embodiment, the transmission component 92 further includes a sliding sleeve 924 sleeved on the outer surface of the drive spindle 85. The sliding sleeve 924 consists of a sliding sleeve and a rotating sleeve. A connecting rod 925 is hinged between the outer side of the rotating sleeve and the centrifugal block 922. The sliding sleeve and the rotating sleeve are rotatably connected, and the sliding sleeve is connected to the transmission component 934. It should be noted that the elastic shaft 923 consists of a limiting rod and a limiting spring, and the limiting rod is telescopically connected to the rotor 921. The number of centrifugal block 922, elastic shaft 923, and connecting rod 925 is at least two, which can form multiple force points during transmission. These force points cooperate with each other, which can make the transmission smoother and reduce vibration and deviation caused by uneven force on individual components.

[0044] It is important to note that the rotational speed of roller 82 is strictly positively correlated with the moving speed of the equipment, i.e., the processing speed. This rotational speed signal is captured and amplified in real time through transmission component 8 and transmission component 9, and is ultimately converted into precise control of the infusion component 10, thus possessing the advantage of speed self-adaptation. For example, when the processing speed increases, causing the roller 82 to rotate at a high speed, the centrifugal force increases, and the linkage mechanism increases the opening of the infusion component 10, increasing the liquid flow rate to cope with the faster processing rhythm and more debris generation; conversely, the flow rate is reduced, thereby achieving automatic matching between cleaning intensity and processing speed, avoiding the problems of "liquid waste at low speed" or "incomplete cleaning at high speed". Moreover, the entire control process is realized entirely by mechanical structure, without the participation of electronic components such as sensors and controllers, and the response is rapid.

[0045] In addition, roller 82 is made of wear-resistant and corrosion-resistant materials, possessing excellent mechanical properties and chemical stability, enabling it to maintain stable performance during long-term cleaning operations. Its surface undergoes special treatment, making it less prone to adhering debris and impurities, thus reducing wear on roller 82 caused by incomplete cleaning.

[0046] To achieve linkage between transmission component 2 9 and infusion component 10, transmission component 2 93 includes a crank 931 sleeved on the end of drive main shaft 85. One side of crank 931 is fixed to rotating seat 91. The top end of crank 931 is provided with connecting shaft 933 and connecting rod 932. One end of connecting shaft 933 is hinged to connecting rod 932. The other end of connecting shaft 933 is fixed with connecting sleeve 94 sleeved on the outer surface of valve tube 105. The other end of connecting rod 932 is hinged to the top side of crank 931. Specifically, transmission component 3 934 includes a connecting arm 9341 fixed to the outer surface of sliding sleeve. Connecting rod 9342 is installed on the outer wall of connecting arm 9341. The other end of connecting rod 9342 is hinged to valve 106 with swing arm 9343.

[0047] The infusion assembly 10 in this embodiment includes a housing 101, a booster tube 102 disposed inside the housing 101, and a piston 104 disposed inside the housing 101. The booster tube 102 is hollow inside, and the piston 104 is located above the booster tube 102. A valve tube 105 communicating with a roller 82 is installed at the end of the booster tube 102, and a valve 106 connected to a transmission component 934 is disposed inside the valve tube 105. The valve tube 105 is composed of a straight tube and a flexible tube.

[0048] It should be noted that the booster pipe 102 is internally connected to the valve pipe 105, ensuring that the cleaning fluid can accurately enter the valve pipe 105 from the booster pipe 102. This provides a basis for precise control of the flow rate and delivery time of the cleaning fluid. Furthermore, by opening and closing the valve 106 on the valve pipe 105, precise control of the cleaning fluid supply can be achieved to meet the different requirements of the cleaning fluid volume at different processing stages. Specifically, the bottom end of the booster pipe 102 extends to the outside of the housing 101, and an adjusting rod 103 for raising and lowering the piston 104 is installed on the top side of the housing 101. The outer wall of the piston 104 is bolted to the end of the adjusting rod 103. The position of the piston 104 can be adjusted in real time via the adjusting rod 103 according to processing requirements. This changes the size of the space above the cleaning fluid in the booster pipe 102, thereby changing the liquid pressure. For example, when the piston 104 moves downward, the space inside the booster pipe 102 decreases, the liquid pressure increases, and the cleaning fluid can be sprayed out through the valve pipe 105 at a faster speed and greater pressure, improving the cleaning effect. Conversely, when the piston 104 moves upward, the liquid pressure decreases, which is suitable for some processing stages with lower requirements for cleaning force. The adjustable pressure system can be flexibly adjusted according to different processing requirements, improving the applicability and cleaning effect of the equipment.

[0049] Combined with appendix Figures 1-8 The working principle of the above embodiments is as follows:

[0050] First, the circuit board substrate is fixed on the processing table 2. The positions of the processing table 2 and the gantry 31 are adjusted by the moving mechanism 2 5 so that the cutting head 4 and the cleaning device 6 are aligned with the processing area.

[0051] When cutting, the equipment is started, and the linear module 32 of the moving mechanism 1 3 drives the slide table 33 to move, which drives the cutting head 4 to cut the substrate. At the same time, the electric telescopic rod 34 can adjust the height of the bottom mounting platform 35 to adapt to substrates of different thicknesses. At this time, the cleaning device 6 moves synchronously with the moving mechanism 1 3, and the roller 82 contacts the substrate surface and rotates with the substrate or by its own drive. The rotation of the roller 82 is transmitted to the transmission component 2 9 through the drive spindle 85.

[0052] As the rotor 921 in transmission component 1 rotates, the centrifugal block 922 moves outward under the action of centrifugal force, while the connecting rod 925 pushes the sliding sleeve 924 to move axially. The movement of the sliding sleeve 924 controls the opening and closing of the valve 106 through transmission component 3 934, realizing the on-off control of the liquid. At the same time, the crank 931 in transmission component 2 93 rotates with the rotating seat 91, and drives the connecting sleeve 94 to move through the connecting rod 932 and the connecting shaft 933, causing the valve pipe 105 to swing or rotate, optimizing the spraying direction. In the infusion assembly 10, the liquid in the tank 101 flows into the through hole 83 of the roller 82 through the pressurization pipe 102 and the valve pipe 105 under the pressure of the piston 104, and is sprayed onto the substrate to clean debris and cool the cutting area.

[0053] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An automated processing equipment for circuit board substrates, comprising a base (1), a processing table (2) disposed above the base (1), a moving mechanism (3), and a cutting head (4), characterized in that: A cleaning device (6) is provided below the first moving mechanism (3), wherein the cleaning device (6) includes a mounting frame (7), a transmission component (8) and a transmission component (9) disposed on the mounting frame (7) and an infusion component (10). The first transmission assembly (8) includes a wheel frame (81), a roller (82) rotatably mounted inside the wheel frame (81), and a drive shaft (85). One end of the drive shaft (85) is connected to the end of the roller (82), and the other end of the drive shaft (85) is connected to the second transmission assembly (9). The roller (82) has several through holes (83) inside. The transmission assembly two (9) includes a rotating seat (91) and a transmission component one (92) connected to the drive spindle (85). The transmission assembly two (9) also includes a transmission component two (93) and a transmission component three (934) connected to the infusion assembly (10). The infusion assembly (10) includes a housing (101), a booster tube (102) disposed inside the housing (101), and a piston (104) disposed inside the housing (101). The booster tube (102) is hollow inside, and the piston (104) is located above the booster tube (102). A valve tube (105) communicating with the roller (82) is installed at the end of the booster tube (102), and a valve (106) connected to the transmission component three (934) is disposed inside the valve tube (105). The first transmission component (92) is located inside the rotating seat (91). The side of the rotating seat (91) away from the first transmission component (92) is connected to the second transmission component (93). The first transmission component (92) includes a rotor (921) disposed inside the rotating seat (91). A centrifugal block (922) is disposed outside the rotor (921) and abuts against the inside of the rotating seat (91). An elastic shaft (923) is disposed between the centrifugal block (922) and the rotor (921). The rotor (921) is fixed to the outer surface of the drive shaft (85). The transmission component 2 (93) includes a crank (931) sleeved on the end of the drive spindle (85). One side of the crank (931) is fixed to the rotating seat (91). The top end of the crank (931) is provided with a connecting shaft (933) and a connecting rod (932). One end of the connecting shaft (933) is hinged to the connecting rod (932). The other end of the connecting shaft (933) is fixed with a connecting sleeve (94) sleeved on the outer surface of the valve tube (105). The other end of the connecting rod (932) is hinged to the top side of the crank (931).

2. The automated substrate processing equipment for circuit boards according to claim 1, characterized in that: The moving mechanism (3) includes a gantry (31) set above the base (1), a linear module (32) set on the gantry (31), and a slide (33) slidably installed on the side of the gantry (31) and connected to the linear module (32). Two mounting platforms (35) are installed on the outer wall of the slide (33), and the two mounting platforms (35) are distributed vertically. An electric telescopic rod (34) connected to the bottom mounting platform (35) is installed on the top mounting platform (35), and the bottom mounting platform (35) is slidably set. The cutting head (4) is detachably installed on the bottom mounting platform (35).

3. The automated substrate processing equipment for circuit boards according to claim 2, characterized in that: The bottom side of the processing table (2) and both sides of the gantry frame (31) are provided with a second moving mechanism (5) connected to the machine base (1), and the upper surface of the bottom mounting platform (35) is provided with a first guide rod (36) that penetrates the interior of the top mounting platform (35).

4. The automated substrate processing equipment for circuit boards according to claim 2, characterized in that: The mounting bracket (7) is bolted to the lower surface of the mounting platform (35) at the bottom. The wheel frame (81) is U-shaped and located below the mounting bracket (7). A guide (84) is provided between the wheel frame (81) and the mounting bracket (7).

5. The automated substrate processing equipment for circuit boards according to claim 4, characterized in that: The guide member (84) includes a second guide rod (841) and a return spring (842) fixed to the upper surface of the wheel frame (81). The top end of the second guide rod (841) penetrates the interior of the wheel frame (81), and the top side of the return spring (842) is fixed to the lower surface of the wheel frame (81).

6. The automated substrate processing equipment for circuit boards according to claim 1, characterized in that: The first transmission component (92) further includes a sliding sleeve (924) sleeved on the outer surface of the drive spindle (85). The sliding sleeve (924) is composed of a sliding sleeve and a rotating sleeve. A connecting rod (925) is hinged between the outer side of the rotating sleeve and the centrifugal block (922). The sliding sleeve and the rotating sleeve are rotatably connected, and the sliding sleeve is connected to the third transmission component (934).

7. The automated substrate processing equipment for circuit boards according to claim 6, characterized in that: The transmission component three (934) includes a connecting arm (9341) fixed to the outer surface of the sliding sleeve. A connecting rod (9342) is installed on the outer wall of the connecting arm (9341). A swing arm (9343) is hinged between the other end of the connecting rod (9342) and the valve (106).

8. The automated substrate processing equipment for circuit boards according to claim 1, characterized in that: The booster pipe (102) is internally connected to the valve pipe (105), and the bottom end of the booster pipe (102) extends to the outside of the housing (101). An adjusting rod (103) for raising and lowering the piston (104) is installed on the top side of the housing (101), and the outer wall of the piston (104) is bolted to the end of the adjusting rod (103).

Images