Mapping device and loading port device
By using a sensor system with the first and second optical axes tilted and intersecting in the mapping device, the problem of decreased detection accuracy under substrate flexure is solved, and high-precision substrate overlap and flexure state detection is achieved.
Patent Information
- Application Number
- CN202510949124.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-07-11
- Filing Date
- 2025-07-10
- Publication Date
- 2026-01-13
AI Technical Summary
Existing mapping devices have difficulty accurately detecting the overlap and flexural state of substrates when the substrates are flexed, resulting in a decrease in detection accuracy.
A sensor system with first and second optical axes is used. The first optical axis extends along the container opening, and the second optical axis extends laterally at an angle. The overlap and flexural state of the substrate are determined by the combined detection values of the two.
This technology enables high-precision detection of substrate overlap and flexural state even under substrate flexural conditions, improving the accuracy and reliability of the detection.
Smart Images

Figure CN121335451A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a mapping device and a load port device having the mapping device. BACKGROUND
[0002] Generally, in order to detect the storage state of the substrates (whether or not overlapped, whether or not inclined, etc.), the load port is provided with a mapping device (see Patent Document 1). The mapping device of Patent Document 1 has a transmission type sensor. The optical axis of the sensor extends in the horizontal direction along the opening of the container. When the sensor is lowered inside the container, the light emitted from the sensor is sequentially irradiated to the plurality of substrates stored in the container (specifically, the end portion of the substrate located on the opening side of the container). During this period, based on the signal output from the sensor, it is possible to detect the storage state of the substrates stored in the container.
[0003] However, a plurality of shelves for arranging the substrates are provided on both side walls of the container. Generally, one substrate is arranged on one shelf, but sometimes two or more substrates are occasionally arranged on one shelf. In the case where the substrates do not flex, the detection value when the sensor detects two overlapped substrates is different from the detection value when the sensor detects one substrate. This is because the detection distance (moving distance in the vertical direction of the sensor) when the sensor detects two overlapped substrates is different from the detection distance when the sensor detects one substrate. Therefore, it is possible to detect whether or not the substrates are overlapped based on the detection value of the sensor.
[0004] PRIOR ART DOCUMENTS
[0005] PATENT DOCUMENT
[0006] Patent Document 1: Japanese Patent Application Publication No. 2011-35384 SUMMARY
[0007] PROBLEMS TO BE SOLVED BY THE INVENTION
[0008] However, in the case where the substrate (particularly, the central portion of the substrate) flexes, it is sometimes difficult to detect whether or not the substrates are overlapped. Assuming that the flexing amount of one substrate is equivalent to the sum of the thicknesses of two substrates, the detection distance when the sensor detects one flexed substrate is equal to the detection distance when the sensor detects two overlapped substrates (in which the substrate does not flex). Therefore, the detection value of the sensor when one substrate flexes is equal to the detection value of the sensor when two substrates (but the substrate does not flex) are overlapped. In this case, based on the detection value of the sensor, it is not possible to distinguish between the flexing of one substrate and the overlapping of two substrates. In this way, in the existing mapping device, in the case where the substrate flexes, it is difficult to accurately detect the storage state of the substrate.
[0009] The present invention was made in view of this actual situation, and its object is to provide a mapping device that can accurately detect the storage state of the object to be detected regardless of whether the object to be detected is bent or not, and a loading port having the mapping device.
[0010] Technical solutions for solving the problem
[0011] To achieve the above objectives, the present invention provides a mapping device.
[0012] The storage state of a plate-shaped object to be tested, stored in a container, is detected, wherein:
[0013] A first sensor having a first optical axis extending along the opening of the container; and
[0014] The second sensor has a second optical axis that extends toward the side of the container in a manner that obliquely intersects the first optical axis.
[0015] The mapping device of the present invention has a first sensor having a first optical axis extending along the opening of a container. Therefore, when the first sensor moves in a vertical direction, at a predetermined timing, the first optical axis intersects the end (hereinafter, "front end") of the object to be detected located on the opening side of the container. At this time, based on the detection value of the signal output from the first sensor, it is possible to detect whether the objects overlap or flex.
[0016] Furthermore, the mapping device of the present invention includes a second sensor with a second optical axis that extends toward the side of the container at an angle intersecting the first optical axis. Therefore, when the second sensor moves vertically, the second optical axis intersects at least the side portion of the object being detected. Generally, the side portion of the object being detected is positioned on shelves provided on both sides of the container, making it less prone to bending. Therefore, in the case of bending of one object being detected, the detection value (detection distance L) of the second sensor becomes a value corresponding to the thickness (T) of one object being detected. Furthermore, in the case of n (n ≥ 2) objects being detected overlapping, the detection value (detection distance L') of the second sensor becomes a value corresponding to the sum of the thicknesses of the n objects being detected (n × T). Therefore, L ≠ L', and based on the detection value of the second sensor, it is possible to determine whether the objects being detected overlap or bend.
[0017] Alternatively, the second optical axis may be tilted such that it approaches the side wall of the container as it moves deeper into the container. In this case, the second optical axis is tilted toward the side of the object being detected and intersects with the side of the object. As described above, because the side of the object being detected is not easily bent, the detection value of the second sensor becomes a value corresponding to the thickness of one object being detected or the sum of the thicknesses of n objects being detected. Therefore, it is possible to determine whether the objects being detected overlap or whether the objects being detected are bent based on the detection value of the second sensor.
[0018] Alternatively, when viewed from above, the object to be detected is square in shape, having a first side parallel to the opening and a second side perpendicular to the first side. The second optical axis intersects the first and second sides at the corners of the object. In this case, the second optical axis intersects with a portion of the side of the object that is less prone to bending. Therefore, based on the detection values of the second sensor, it is possible to detect with higher accuracy whether the object (e.g., a square substrate) overlaps or flexes.
[0019] Alternatively, when viewed from above, the object being detected is circular in shape, and the second optical axis intersects with a first point and a second point on the outer periphery of the object being detected, at least one of the first point and the second point being located on the side of the container. In this case, the second optical axis intersects with a portion of the side of the object being detected that is less prone to bending. Therefore, based on the detection values of the second sensor, it is possible to detect with higher accuracy whether the object being detected (e.g., a circular substrate) overlaps or whether it is bent.
[0020] Alternatively, the first sensor may have a first light-emitting part and a first light-receiving part that receives light emitted from the first light-emitting part, and the second sensor may have a second light-emitting part and a second light-receiving part that receives light emitted from the second light-emitting part. The height positions of the first light-emitting part and the first light-receiving part are equal to the height positions of the second light-emitting part and the second light-receiving part. When the height positions of the first light-emitting part and the first light-receiving part are different from those of the second light-emitting part and the second light-receiving part, the vertical movement distance of the first sensor or the second sensor is reduced by a distance corresponding to the difference. Conversely, when the height positions of the first light-emitting part and the first light-receiving part are equal to those of the second light-emitting part and the second light-receiving part, both the first sensor and the second sensor can move from the top to the bottom of the container. Therefore, the first sensor and the second sensor can detect the storage status of the object over a wide range.
[0021] Alternatively, the second sensor may have a second light-emitting part and a second light-receiving part that receives light emitted by the second light-emitting part. One of the second light-emitting part and the second light-receiving part is located on the front side of the container closer to the first sensor, and the other of the second light-emitting part and the second light-receiving part is located on the depth side of the container closer to the first sensor. In this case, when the first sensor and the second sensor move in the vertical direction, the second optical axis intersects the side portion of the object being detected at the timing when the first optical axis intersects the front end of the object being detected. Therefore, by acquiring the detection values of the first sensor and the second sensor at virtually the same timing, the detection speed of the mapping device is improved.
[0022] Alternatively, the second sensor can be composed of a pair of second sensors, with the second optical axis of one second sensor and the second optical axis of the other second sensor separating as they move deeper into the container. In this case, viewed from the opening side of the container, the second optical axis of one sensor extends towards one side of the container in the horizontal direction (e.g., the left side). Furthermore, the second optical axis of one sensor intersects the side portion of the object being detected in the horizontal direction (e.g., the left side). Conversely, viewed from the opening side of the container, the second optical axis of the other sensor extends towards the other side of the container in the horizontal direction (e.g., the right side). Furthermore, the second optical axis of the other sensor intersects the side portion of the object being detected in the horizontal direction (e.g., the right side). Thus, the second sensor can detect the storage state of the object being detected based on the detection values of the side portions on both sides of the object. Therefore, the second sensor can detect the storage state of the object being detected with high accuracy.
[0023] Alternatively, at least one of the first optical axis and the second optical axis may be tilted relative to the horizontal plane. In this case, the detection distance of at least one of the first and second optical axes increases according to the tilt angle of the first and second optical axes. Therefore, it is possible to detect whether the detected object overlaps or whether the detected object is bent with high precision.
[0024] Alternatively, the mapping device may also include a mapping arm parallel to the opening, and a clamp mounted on the mapping arm and equipped with the first sensor and the second sensor. When the mapping arm moves towards the opening of the container, the first sensor and the second sensor enter the interior of the container. In this state, when the mapping arm moves vertically, the first optical axis intersects the front end of the object being detected, and the second optical axis intersects the side portion of the object being detected. Thus, the detection values of the first sensor and the second sensor can be obtained.
[0025] To achieve the aforementioned objective, the present invention provides a loading port device comprising:
[0026] The mapping device for any of the above;
[0027] A setting section, used for setting the container; and
[0028] A door that opens and closes the lid of the container.
[0029] For example, if the mapping device detects overlap or deflection of the object to be detected, interference between the arm and the object can be prevented by stopping the operation of the arm (an arm of a semiconductor manufacturing apparatus assembled in a loading port device) used to process the object. Furthermore, once it is confirmed that there is safe space for the arm to enter between adjacent shelves, the arm begins processing the object, thereby preventing damage to the arm or the object. Attached Figure Description
[0030] Figure 1 This is a schematic diagram of a loading port device having a mapping apparatus according to a first embodiment of the present invention.
[0031] Figure 2 Yes Figure 1 The diagram shows a schematic of the loading port device when the container is installed.
[0032] Figure 3 yes Figure 2 A schematic diagram showing the mapping device entering the container.
[0033] Figure 4 yes Figure 3 A schematic diagram of the mapping device descending.
[0034] Figure 5 Viewed from the opening side Figure 2 The container shown is a cross-sectional view.
[0035] Figure 6 Viewed from above Figure 2 The container shown is a cross-sectional view.
[0036] Figure 7 yes Figure 1 A three-dimensional view of the mapping device shown.
[0037] Figure 8 yes Figure 7 The diagram shows a three-dimensional view of the first sensor, the second sensor, and the fixture.
[0038] Figure 9 It is used to explain by Figure 7 The diagram shows a conceptual diagram of the detection mechanism of the object being detected, consisting of the first sensor and the second sensor.
[0039] Figure 10A It is used for explanation Figure 7 A conceptual diagram showing the direction of movement of the first sensor.
[0040] Figure 10B It is used for explanation Figure 7 A conceptual diagram showing the direction of movement of the second sensor.
[0041] Figure 11 It is a conceptual diagram representing the deflection and overlap of the test object contained in a container.
[0042] Figure 12A This is a conceptual diagram used to illustrate the detection mechanism when the first and second sensors detect the overlap of the objects being detected.
[0043] Figure 12B This is a conceptual diagram used to illustrate the detection mechanism when the first and second sensors detect the deflection of the object being detected.
[0044] Figure 13 This is a perspective view of the mapping device according to the second embodiment of the present invention.
[0045] Figure 14 yes Figure 13 The first and second sensors are shown in a 3D view.
[0046] Figure 15 yes Figure 10A A perspective view of a modified example of the first sensor shown. Detailed Implementation
[0047] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, the illustrations are merely schematic and exemplary for the purpose of understanding the present invention, and the appearance and size ratios may differ from the actual product. Additionally, the present invention is not limited to the following embodiments.
[0048] First Implementation Method
[0049] like Figure 1 As shown, the mapping device 20 of the first embodiment of the present invention is provided in the loading port device 1. The mapping device 20 detects contents stored in the container 10 ( Figure 2 This is a device for detecting the storage status (whether there is overlap, bending, tilting, misalignment, or protrusion towards the opening of container 10) of multiple plate-shaped objects in a container. In this embodiment, the objects to be detected by the mapping device 20 are multiple substrates 100. The substrate 100 is a square semiconductor wafer (silicon wafer) with a rectangular shape when viewed from above. However, the substrate 100 may also be a semiconductor wafer with a circular shape when viewed from above. Alternatively, the substrate 100 may also be a glass substrate with a rectangular or circular shape when viewed from above.
[0050] The loading port device 1 is assembled on the substrate 100 ( Figure 2This is used in a semiconductor manufacturing apparatus (not shown) to perform processes (heat treatment, doping with the addition of specific impurities, photolithography, exposure, etching, etc.). The loading port device 1 is a unit that functions as an interface between the container 10 and the semiconductor manufacturing apparatus.
[0051] exist Figure 2 and Figure 3 In the diagram, the X-axis is along the horizontal direction and is perpendicular to the opening 14 of the container 10. Figure 3 The axes are parallel to each other. The Y-axis is a horizontal axis perpendicular to the opening 14 of the container 10. The Z-axis is a vertical axis. Hereinafter, the direction along the Z-axis will be defined as the up-down direction, and the direction along the Y-axis will be defined as the front-back direction. Furthermore, the positive direction of the Z-axis will be defined as "up," and the negative direction of the Z-axis will be defined as "down." Similarly, the negative direction of the Y-axis will be defined as "forward," and the positive direction of the Y-axis will be defined as "backward."
[0052] In this embodiment, "parallel" is not limited to strict parallelism; states that deviate from strict parallelism by a few degrees (e.g., 3°) or less are also included in the concept of "parallel." Similarly, "perpendicular" is not limited to strict perpendicularity; states that deviate from strict perpendicularity by a few degrees (e.g., 3°) or less are also included in the concept of "perpendicular."
[0053] Container 10 is, for example, a FOUP (Front-Opening Unified Pod): a front-opening integrated transport and storage container. Container 10 is used to seal, store, and transport multiple substrates 100. Container 10 is disposed in the mounting section 3 of the loading port device 1. Container 10 is transported to the mounting section 3, for example, by an automatic transport device.
[0054] like Figure 2 As shown, container 10 has a main body 11 and a lid 15. Multiple substrates 100 are housed inside the main body 11. The multiple substrates 100 are arranged in multiple layers along the vertical direction (see reference). Figure 5 An opening 14 is formed on the front (rear) side of the main body 11. Figure 3 Multiple substrates 100 are moved in and out of the main body 11 through the opening 14 via the robotic arm of the semiconductor manufacturing apparatus (not shown).
[0055] like Figure 2 and Figure 3 As shown, the cover 15 can be detachably installed on the opening 14. By installing the cover 15 on the opening 14, the interior of the main body 11 is sealed, and the interior of the container 10 can be maintained in a high cleanliness state.
[0056] like Figure 5As shown, multiple shelves 12a and multiple shelves 12b are provided inside the main body 11. The shelves 12a and multiple shelves 12b are arranged at certain intervals along the Z-axis. The shelves 12a and multiple shelves 12b extend along the Y-axis and are opposite each other along the X-axis. The shelves 12a are mounted on a side wall 16a and protrude inwards from the side wall 16a in the X-axis direction, the side wall 16a being located on one side of the main body 11 in the X-axis direction. The shelves 12b are mounted on a side wall 16b and protrude inwards from the side wall 16b in the X-axis direction, the side wall 16b being located on the other side of the main body 11 in the X-axis direction. The shelves 12a can also be arranged away from the side wall 16a. Similarly, the shelves 12b can also be arranged away from the side wall 16b.
[0057] The substrate 100 has a side portion 110a located on one side in the X-axis direction and a side portion 110b located on the other side in the X-axis direction. The side portion 110a is disposed on a shelf 12a, and the side portion 110b is disposed on a shelf 12b. The side portions 110a and 110b are supported by the shelves 12a and 12b, respectively, while the central portion of the substrate 100 in the X-axis direction is not supported.
[0058] like Figure 1 and Figure 2 As shown, the loading port device 1 has at least a mapping device 20. In this embodiment, the loading port device 1 also includes a frame 2, a mounting section 3, a door 4, a door arm 5, a first drive section 50, a second drive section 60, a third drive section 70, and a sensor position detection section 80. However, the structure of the loading port device 1 is not limited to... Figure 1 and Figure 2 The structure shown can also omit any of the above components.
[0059] Frame 2 is configured to face the front of container 10 (the side with lid 15). A frame opening 6 is formed on frame 2. The frame opening 6 is positioned corresponding to the opening 14, and the size of the frame opening 6 corresponds to the size of the opening 14. Figure 3 As shown, when the opening 14 is inserted into the frame opening 6, the container 10 is connected to the frame 2. The robotic arm of the semiconductor manufacturing apparatus (not shown) moves the substrate 100 in and out of the container 10 via the frame opening 6. The shapes of the frame opening 6 and the opening 14 are not particularly limited, for example, they are rectangular.
[0060] The setting unit 3 is a platform for setting the container 10, and it is configured to move in the front-to-back direction. When the setting unit 3 moves forward, the container 10 set on the setting unit 3 moves forward. When the setting unit 3 moves backward, the container 10 set on the setting unit 3 moves backward.
[0061] Door 4 moves relative to frame opening 6 in a front-to-back direction, opening and closing frame opening 6. Additionally, door 4 opens and closes container opening 14 while holding lid 15. When door 4 retracts from opening 14 while engaged with lid 15, lid 15 is removed from container 10. When door 4 moves towards opening 14 while engaged with lid 15, lid 15 is installed on container 10. Figure 3 and Figure 4 As shown, the door 4 moves up and down relative to the frame opening 6 while the cover 15 is held.
[0062] Door arm 5 is fixed to door 4 and supports door 4. Door arm 5 is directly or indirectly connected to first drive unit 50. Door arm 5 is configured to move vertically via drive of first drive unit 50. First drive unit 50 is, for example, an air-driven rodless cylinder, having a movable body 51 and cylinder barrel 52. Compressed air is supplied to and discharged from cylinder barrel 52. Movable body 51 moves vertically up and down along cylinder barrel 52 under the control of air pressure of compressed air within cylinder barrel 52.
[0063] When the movable body 51 descends along the cylinder 52, the door arm 5 descends accordingly. Conversely, when the movable body 51 rises along the cylinder 52, the door arm 5 rises accordingly.
[0064] The second drive unit 60 freely drives the door arm 5 in the front-to-back direction and also freely drives the door arm 5 to rotate. The door arm 5 rotates about the second drive unit 60 as the center of rotation. Figure 2 and Figure 3 As shown, the second drive unit 60 rotates rearward to move the door arm 5 away from the frame opening 6. Additionally, although detailed illustrations are omitted, the second drive unit 60 rotates forward to move the door arm 5 closer to the frame opening 6. The second drive unit 60 is directly or indirectly connected to the movable body 51. Therefore, the door arm 5 and the second drive unit 60 rise and fall together with the movable body 51 as it moves up and down.
[0065] The third drive unit 70 freely drives the support arm 21 of the mapping device 20 in the front-to-back direction, and also freely drives the support arm 21 to rotate. The support arm 21 rotates about the third drive unit 70 as its rotation center. Figure 2 and Figure 3 As shown, the third drive unit 70 rotates the support arm 21 forward (towards the opening 14). Additionally, although detailed illustrations are omitted, the third drive unit 70 rotates the support arm 21 backward (away from the opening 14). The third drive unit 70 is directly or indirectly connected to the movable body 51. Therefore, the support arm 21 and the third drive unit 70 rise and fall together with the movable body 51 as it rises and falls.
[0066] The sensor position detection unit 80 is a position detection sensor (e.g., a transmissive sensor) that detects the vertical position of the sensors (first sensor 30, second sensor 40a, and second sensor 40b, described later) in the mapping device 20. The signal output by the sensor position detection unit 80 is provided to the arithmetic unit 90 of the mapping device 20. Based on the signal output from the sensor position detection unit 80, the arithmetic unit 90 determines the vertical position of the mapping sensor relative to the substrate 100.
[0067] like Figure 1 As shown, the mapping device 20 is disposed around the door 4 of the loading port device 1. The mapping device 20 detects contents stored in the container 10. Figure 2 The substrate 100 is in a stored state. The mapping device 20 has a support arm 21, a mapping arm 22, and clamps 23a and 23b. Figure 7 ), First sensor 30 ( Figure 7 ), second sensor 40a and 40b ( Figure 7 ), and arithmetic unit 90 ( Figure 2 ).
[0068] like Figure 1 As shown, the support arm 21 is composed of a rod-shaped component. The support arm 21 is arranged along the outer edge of the door 4 and the door arm 5, surrounding them. The mapping arm 22, also composed of a rod-shaped component, is mounted on the support arm 21. The mapping arm 22 is fastened to the support arm 21 using bolts or other fastening components. However, the mapping arm 22 can also be integrated with the support arm 21.
[0069] like Figure 6 As shown, the mapping arm 22 is arranged parallel to the horizontal plane and parallel to the opening 14 (relative to the X-axis). However, the mapping arm 22 may also be tilted less than 5 degrees relative to the horizontal plane. Additionally, the mapping arm 22 may also be tilted less than 5 degrees in the horizontal direction relative to the X-axis. Figure 7 As shown, the cross-sectional shape of the mapping arm 22 is not particularly limited, for example, it can be rectangular. The mapping arm 22 follows the support arm 21 ( Figure 1 It moves forward and backward and up and down.
[0070] Clamps 23a and 23b are composed of plate-shaped components bent into an L-shape. Clamps 23a and 23b are mounted on the mapping arm 22 and are separated along the axial direction of the mapping arm 22. Clamp 23a is located at one end of the mapping arm 22 along its axial direction, and clamp 23b is located at the other end. Clamp 23a has a mirror-symmetrical shape with respect to clamp 23b.
[0071] Clamp 23a has a first portion 24a and a second portion 25a, and clamp 23b has a first portion 24b and a second portion 25b. The first portions 24a and 24b extend parallel to the mapping arm 22. The first portions 24a and 24b are mounted to the mapping arm 22 using fasteners such as bolts. The second portions 25a and 25b are continuous with and orthogonal to the first portions 24a and 24b, respectively. The angle formed by the first portions 24a and 25a is 90 degrees, but it can be less than 90 degrees or greater than 90 degrees. Similarly, the angle formed by the first portions 24b and 25b is 90 degrees, but it can be less than 90 degrees or greater than 90 degrees.
[0072] like Figure 6 As shown, the second portions 25a and 25b extend forward in a manner that protrudes toward the opening 14. As the mapping arm 22 moves forward, at least a portion (the front end) of the second portion 25a passes through the opening 14 and enters the interior of the container 10. More specifically, at least a portion of the second portion 25a enters between the side portion 110a of the substrate 100 and the side wall 16a of the container 10.
[0073] Additionally, as the mapping arm 22 descends, at least a portion (front end) of the second part 25b passes through the opening 14 and enters the interior of the container 10. More specifically, the second part 25b enters between the side portion 110b of the substrate 100 and the side wall 16b of the container 10.
[0074] When the second part 25a is disposed on the side of the side part 110a and the second part 25b is disposed on the side of the side part 110b, the end of the substrate 100 on the opening 14 side (hereinafter, the front end 112 of the substrate 100) is clamped from both sides by the second part 25a and the second part 25b.
[0075] The first portions 24a and 24b are arranged parallel to the opening 14, and the second portions 25a and 25b are arranged perpendicular to the opening 14. The second portions 25a and 25b extend along the Y-axis, but may also be inclined to the side of the container 10 at less than 10 degrees relative to the Y-axis.
[0076] like Figure 8 As shown, the first sensor 30 is an optical sensor (transmission type sensor), and the detection substrate 100 ( Figure 6 The front end 112 of the sensor 30. The first sensor 30 has a first light-emitting part 31 and a first light-receiving part 32 that receives light emitted from the first light-emitting part 31. The first light-emitting part 31 is, for example, a visible light LED, an infrared LED, an ultraviolet LED, or a laser diode. The first light-receiving part 32 is, for example, a phototransistor, a photodiode, or an infrared detection element.
[0077] The first light-emitting part 31 is opposite to the first light-receiving part 32 along the X-axis. The first sensor 30 has a portion along the container 10 ( Figure 6 The first optical axis 33 extends from the opening 14 of the first light-emitting part 31. The first optical axis 33 is the optical axis of the light emitted by the first light-emitting part 31. Figure 9 In this diagram, for ease of understanding, the first optical axis 33 is shown as a virtual straight line connecting the first light-emitting part 31 and the first light-receiving part 32, intersecting the substrate 100 (so that the light passes through the substrate 100). In reality, the light emitted by the first light-emitting part 31 does not pass through the substrate 100 but is blocked by it. Figure 8 As shown, the first light-emitting part 31 is disposed on the clamp 23a, and the first light-receiving part 32 is disposed on the clamp 23b. However, the first light-emitting part 31 may also be disposed on the clamp 23b, and the first light-receiving part 32 may be disposed on the clamp 23a.
[0078] The first light-emitting part 31 is disposed at the end (front end) of the second part 25a in the Y-axis direction. The first light-receiving part 32 is disposed at the end (front end) of the second part 25b in the Y-axis direction. The first light-emitting part 31 and the first light-receiving part 32 are respectively disposed in the second parts 25a and 25b, so that the first optical axis 33 and the mapping arm 22 ( Figure 6 (or parallel to the opening 14.)
[0079] The second sensor 40a is an optical sensor (transmission type sensor), which has a second light-emitting part 41a and a second light-receiving part 42a that receives the light emitted by the second light-emitting part 41a. The second light-emitting part 41a is, for example, a visible light LED, an infrared LED, an ultraviolet LED, or a laser diode. The second light-receiving part 42a is, for example, a phototransistor, a photodiode, or an infrared detection element. The second optical axis 43a is the optical axis of the light emitted by the second light-emitting part 41a. Figure 9 In this diagram, for ease of understanding, the second optical axis 43a is shown as a virtual straight line connecting the second light-emitting part 41a and the second light-receiving part 42a, intersecting the substrate 100 (so that the light passes through the substrate 100). In reality, the light emitted by the second light-emitting part 41a does not pass through the substrate 100 but is blocked by the substrate 100.
[0080] like Figure 8 As shown, the second light-emitting part 41a is disposed at the end (front end) of the first part 24a in the X-axis direction. The second light-receiving part 42a is disposed at the end (front end) of the second part 25a in the Y-axis direction. However, it is also possible that the second light-emitting part 41a is disposed at the front end of the second part 25a, and the second light-receiving part 42a is disposed at the front end of the first part 24a. Figure 9As shown, the second light-receiving part 42a is located on the depth side (negative Y-axis direction side) of the container 10, which is closer to the first sensor 30 (first light-emitting part 31). The second light-emitting part 41a is located on the front side (positive Y-axis direction side) of the container 10, which is closer to the first sensor 30 (first light-emitting part 31).
[0081] like Figure 8 As shown, the second sensor 40b is a transmission-type sensor, which has a second light-emitting part 41b and a second light-receiving part 42b that receives the light emitted by the second light-emitting part 41b. The second light-emitting part 41b can be, for example, a visible light LED, an infrared LED, an ultraviolet LED, or a laser diode. The second light-receiving part 42b can be, for example, a phototransistor, a photodiode, or an infrared detection element. The second optical axis 43b is the optical axis of the light emitted by the second light-emitting part 41b. Figure 9 In this diagram, for ease of understanding, the second optical axis 43b is shown as a virtual straight line connecting the second light-emitting part 41b and the second light-receiving part 42b, intersecting the substrate 100 (so that the light passes through the substrate 100). In reality, the light emitted by the second light-emitting part 41b does not pass through the substrate 100 but is blocked by the substrate 100.
[0082] like Figure 8 As shown, the second light-emitting part 41b is disposed at the end (front end) of the first part 24b in the X-axis direction. The second light-receiving part 42b is disposed at the end (front end) of the second part 25b in the Y-axis direction. However, it is also possible that the second light-emitting part 41b is disposed at the front end of the second part 25b, and the second light-receiving part 42b is disposed at the front end of the first part 24b. Figure 9 As shown, the second light-receiving part 42b is located on the depth side (negative Y-axis direction side) of the container 10, which is closer to the first sensor 30 (first light-receiving part 32). The second light-emitting part 41b is located on the front side (positive Y-axis direction side) of the container 10, which is closer to the first sensor 30 (first light-receiving part 32).
[0083] like Figure 6 As shown, the second optical axis 43a extends toward the side of the container 10 in a manner that obliquely intersects the first optical axis 33. Viewed from the front side (opening 14 side) of the container 10, the second optical axis 43a is obliquely approaching the side wall 16a as it extends deeper into the container 10. The second optical axis 43a is obliquely toward the side portion 110a of the substrate 100 and imaginarily intersects the side portion 110a. The oblique angle θa of the second optical axis 43a relative to the first optical axis 33 is not particularly limited, and is 30°≦θa≦60°.
[0084] Similarly, the second optical axis 43b extends laterally toward the container 10 in a manner that obliquely intersects the first optical axis 33. Viewed from the front side of the container 10, the second optical axis 43b is obliquely approaching the side wall 16b as it extends deeper into the container 10. Therefore, the second optical axis 43b is obliquely toward the side portion 110b of the substrate 100 and imaginarily intersects the side portion 110b. The oblique angle θb of the second optical axis 43b relative to the first optical axis 33 is not particularly limited, and is 30°≦θb≦60°. Angle θb is equal to angle θa, but they can also be different.
[0085] When inspecting the substrate 100, the second optical axis 43a intersects the first side S1 of the substrate 100, which is parallel to the opening 14, at the corner 111a of the substrate 100, and intersects the second side S2, which is perpendicular to the first side S1. More specifically, the second optical axis 43a intersects obliquely with the end of the first side S1 on the negative X-axis direction and obliquely with the end of the second side S2 on the positive Y-axis direction.
[0086] Here, the end of the first side S1 in the negative X-axis direction refers to the portion from the intersection of the first side S1 and the second side S2 to within 25% (preferably within 10%, more preferably within 5%, and particularly preferably within 3%) of the length of the first side S1 along the X-axis. Similarly, the end of the second side S2 in the positive Y-axis direction refers to the portion from the intersection of the first side S1 and the second side S2 to within 25% (preferably within 10%, more preferably within 5%, and particularly preferably within 3%) of the length of the second side S2 along the Y-axis. Furthermore, the corner 111a of the substrate 100 refers to the range from the intersection of the first side S1 and the second side S2 to a predetermined length. However, the predetermined length is either the length of the end of the first side S1 in the negative X-axis direction or the length of the end of the second side S2 in the positive Y-axis direction.
[0087] When inspecting the substrate 100, the second optical axis 43b intersects the first side S1 of the substrate 100, which is parallel to the opening 14, at the corner 111b of the substrate 100, and also intersects the third side S3, which is perpendicular to the first side S1. More specifically, the second optical axis 43b intersects obliquely with the end of the first side S1 on the positive X-axis direction, and also intersects obliquely with the end of the third side S3 on the positive Y-axis direction.
[0088] Here, the end of the first side S1 in the positive X-axis direction refers to the portion from the intersection of the first side S1 and the third side S3 to within 25% (preferably within 10%, more preferably within 5%, and particularly preferably within 3%) of the length of the first side S1 along the X-axis. Similarly, the end of the third side S3 in the positive Y-axis direction refers to the portion from the intersection of the first side S1 and the third side S3 to within 25% (preferably within 10%, more preferably within 5%, and particularly preferably within 3%) of the length of the third side S3 along the Y-axis. Furthermore, the corner 111b of the substrate 100 refers to the range from the intersection of the first side S1 and the third side S3 to a predetermined length. However, the predetermined length is either the length of the end of the first side S1 in the positive X-axis direction or the length of the end of the third side S3 in the positive Y-axis direction.
[0089] The second optical axis 43a and the second optical axis 43b separate as they move toward the depth of the container 10 (in the direction of moving forward from the opening 14). The virtual extension of the second optical axis 43a intersects the side wall 16a of the container 10 at an angle, and also intersects the opening 14 (opening surface) at an angle. Similarly, the virtual extension of the second optical axis 43b intersects the side wall 16b of the container 10 at an angle, and also intersects the opening 14 (opening surface) at an angle.
[0090] like Figure 7 As shown, the distance between the first light-emitting part 31 and the first light-receiving part 32 and the reference position (e.g., Figure 5 The height of the bottom of the container 10 shown is equal to the height of the second light-emitting part 41a and the second light-receiving part 42a from the reference position. However, a difference of ±7% (preferably ±5%, more preferably ±3%) between these height positions is also possible. Additionally, the distance from the reference position of the first light-emitting part 31a and the first light-receiving part 32a (e.g., Figure 5 The height of the bottom of the container 10 shown is equal to the height of the second light-emitting part 41b and the second light-receiving part 42b from the reference position. However, there may be a difference of ±7% (preferably ±5%, more preferably ±3%) between these height positions.
[0091] Furthermore, the first light-emitting part 31 and the first light-receiving part 32 are located on the same plane as the second light-emitting part 41a and the second light-receiving part 42a. Therefore, the first optical axis 33 and the second optical axis 43a are located on the same plane. Additionally, the first light-emitting part 31 and the first light-receiving part 32 are located on the same plane as the second light-emitting part 41b and the second light-receiving part 42b. Therefore, the first optical axis 33 and the second optical axis 43b are located on the same plane.
[0092] Figure 2 The arithmetic unit 90 shown is based on the signal output from the sensor position detection unit 80, from... Figure 7The signal output from the first sensor 30 shown, and from Figure 7 The signals output by the second sensors 40a and 40b shown are used to determine the storage status of the substrate 100 stored in the container 10.
[0093] Next, the mechanism for detecting the storage state of the substrate 100 by the mapping device 20 will be explained. Figure 3 As shown, with the door 4 engaged with the cover 15, the cover 15 is removed from the container 10 when the door arm 5 rotates rearward. This opens the opening 14 of the container 10. In this state, the mapping arm 22 advances when the support arm 21 of the mapping device 20 rotates forward. Furthermore, as... Figure 6 As shown, the second parts 25a and 25b pass through the opening 14 and enter the interior of the container 10.
[0094] When the second part 25a and the second part 25b enter the interior of container 10, as Figure 4 As shown, mapping arm 22 descends together with gate arm 5. Then, Figure 7 The mapping device 20 shown (first sensor 30, second sensor 40a, second sensor 40b) detects the storage status of the multiple substrates 100 stored in the container 10.
[0095] Figure 10A This is a view of any one of the multiple substrates 100 housed in the container 10 from the front end 112 side. The first optical axis 33 of the first sensor 30 descends from a position above (1) of any one of the substrates 100 housed in the container 10 to a position below (3) as the mapping arm 22 descends. At position (1), the front end 112 is not located between the first light-emitting part 31 and the first light-receiving part 32. Therefore, the light emitted by the first light-emitting part 31 is not blocked by the front end 112 and reaches the first light-receiving part 32. Consequently, the first light-receiving part 32 receives light greater than a predetermined threshold.
[0096] Furthermore, at position (3), the front end 112 is not located between the first light-emitting part 31 and the first light-receiving part 32. Therefore, the light emitted by the first light-emitting part 31 is not blocked by the front end 112 and reaches the first light-receiving part 32. As a result, the first light-receiving part 32 receives light greater than a predetermined threshold.
[0097] On the other hand, at position (2), the front end 112 is located between the first light-emitting part 31 and the first light-receiving part 32. Therefore, the light emitted by the first light-emitting part 31 is blocked by the front end 112. As a result, the first light-receiving part 32 receives light less than a predetermined threshold. Thus, the amount of light received by the first light-receiving part 32 varies depending on whether there is a substrate 100 between the first light-emitting part 31 and the first light-receiving part 32. Therefore, the detection value of the signal output by the first sensor 30 becomes a value corresponding to the amount of light received by the first light-receiving part 32, which varies depending on whether there is a substrate 100 (front end 112) between the first light-emitting part 31 and the first light-receiving part 32. As will be described later, the amount of light received by the first light-receiving part 32 varies depending on the storage state of the substrate 100 in the container 10 (whether it overlaps, flexes, or is tilted).
[0098] Figure 10B This is a view from the corner 111a side of any one of the multiple substrates 100 housed in the container 10. The detection mechanism of the substrate 100 by the second sensor 40a of the second sensors 40a and 40b will be described below. The detection mechanism of the substrate 100 by the second sensor 40b is the same as that by the second sensor 40a, therefore, its detailed description is omitted.
[0099] As the mapping arm 22 descends, the second optical axis 43a of the second sensor 40a descends from a position (1) above any of the substrates 100 housed in the container 10 to a position (3) below. At position (1), the corner portion 111a is not located between the second light-emitting portion 41a and the second light-receiving portion 42a. Therefore, the light emitted by the second light-emitting portion 41a is not blocked by the corner portion 111a and reaches the second light-receiving portion 42a. Consequently, the second light-receiving portion 42a receives light exceeding a predetermined threshold.
[0100] Furthermore, at position (3), the corner portion 111a is not located between the second light-emitting portion 41a and the second light-receiving portion 42a. Therefore, the light emitted by the second light-emitting portion 41a is not blocked by the corner portion 111a and reaches the second light-receiving portion 42a. As a result, the second light-receiving portion 42a receives light greater than a predetermined threshold.
[0101] On the other hand, at position (2), the corner portion 111a is located between the second light-emitting portion 41a and the second light-receiving portion 42a. Therefore, the light emitted by the second light-emitting portion 41a is blocked by the corner portion 111a. As a result, the second light-receiving portion 42a receives light smaller than a predetermined threshold. Thus, the amount of light received by the second light-receiving portion 42a varies depending on whether there is a substrate 100 between the second light-emitting portion 41a and the second light-receiving portion 42a. Therefore, the detection value of the signal output by the second sensor 40a becomes a value corresponding to the amount of light received by the second light-receiving portion 42a, which varies depending on whether there is a substrate 100 (corner portion 111a) between the second light-emitting portion 41a and the second light-receiving portion 42a. As described later, the amount of light received by the second light-receiving portion 42a varies depending on the storage state of the substrate 100 in the container 10 (whether it overlaps, flexes, or is tilted, etc.).
[0102] Here, as Figure 11 As shown, sometimes two substrates 100 are occasionally overlapped on shelves 12a and 12b. Figure 12A As shown, when the first sensor 30 detects two substrates 100, the light emitted by the first light-emitting part 31 is blocked by the front end 112 of the two substrates 100. In other words, the first optical axis 33 intersects with the front end 112. During this period, the first sensor 30 descends a distance equivalent to twice the thickness T of the substrate 100. Therefore, when the first sensor 30 detects two overlapping substrates 100, the detected value of the signal output by the first sensor 30 becomes a value corresponding to twice the thickness T of the substrate 100 (the sum of the thicknesses of the two substrates 100: 2T).
[0103] On the other hand, as referenced Figure 10A As explained, when the first sensor 30 detects a substrate 100, the light emitted by the first light-emitting part 31 is blocked by the front end 112 of the substrate 100. During this period, the first sensor 30 descends a distance equivalent to the thickness T of the substrate 100. Therefore, when the first sensor 30 detects a substrate 100, the detected value of the signal output by the first sensor 30 becomes a value corresponding to the thickness T of the substrate 100.
[0104] Thus, when the substrate 100 is not flexed, the detection distance (movement distance) of the first sensor 30 when detecting two overlapping substrates 100 is twice the detection distance of the first sensor 30 when detecting one substrate 100. Therefore, the detection value of the first sensor 30 when detecting two overlapping substrates 100 is different from the detection value of the first sensor 30 when detecting one substrate 100. Therefore, the storage state of the substrate 100 (whether the substrates 100 overlap) can be determined based on the detection value of the first sensor 30.
[0105] However, as Figure 11As shown, when the substrate 100 (particularly the central portion of the substrate 100) is flexed, it is difficult to determine whether the substrate 100 overlaps or flexes using only the first sensor 30. Assuming that the flex of one substrate 100 is equivalent to the sum of the thicknesses of two substrates 100 (2T), the detection value of the first sensor 30 when detecting a flexed substrate 100 becomes a value corresponding to the sum of the thicknesses of the two substrates 100 (2T). On the other hand, as described above, the detection value of the first sensor 30 when detecting two overlapping substrates 100 becomes a value corresponding to the sum of the thicknesses of the two substrates 100 (2T).
[0106] Therefore, theoretically, the detection value of the first sensor 30 when detecting a single flexed substrate 100 is equal to the detection value of the first sensor 30 when detecting two overlapping substrates 100. In this case, the flexing of a single substrate 100 and the overlap of two unflexed substrates 100 cannot be determined based on the detection value of the first sensor 30.
[0107] Therefore, in order to solve this problem, such as Figure 7 As shown, the mapping device 20 includes, in addition to the first sensor 30, at least one of the second sensors 40a and 40b (in this embodiment, both). Figure 9 As shown, the second optical axis 43a of the second sensor 40a extends toward the side of the container 10 in a manner that intersects the first optical axis 33 at an angle.
[0108] Therefore, as Figure 12B As shown, when the second sensor 40a detects the substrate 100, the second optical axis 43a intersects with the side portion 110a of the substrate 100 at the corner 111a. At this time, the light emitted by the second light-emitting part 41a is blocked by the side portion 110a of the flexible substrate 100. Here, the side portion 110a is generally disposed on the shelf 12a ( Figure 5 Therefore, it is not easily bent. Thus, during the period when the second optical axis 43a intersects with the side portion 110a of a flexible substrate 100, the second sensor 40a descends a distance equivalent to the thickness T of the substrate 100. Therefore, when the second sensor 40a detects a flexible substrate 100, the detected value of the signal output by the second sensor 40a becomes a value corresponding to the thickness T of the substrate 100.
[0109] In addition, such as Figure 12AAs shown, when the second sensor 40a detects two overlapping substrates 100, at the corner 111a of the two substrates 100, the second optical axis 43a intersects with the side portion 110a of the two substrates 100. At this time, the light emitted by the second light-emitting part 41a is blocked by the side portion 110a of the two overlapping substrates 100. As described above, the side portion 110a is generally disposed on the shelf 12a ( Figure 5 Therefore, it is not easily bent. Thus, during the period when the second optical axis 43a intersects with the side portions 110a of the two substrates 100, the second sensor 40a descends a distance equivalent to the sum of the thicknesses of the two substrates 100 (2T). Therefore, when the second sensor 40a detects the two overlapping substrates 100, the detected value of the signal output by the second sensor 40a becomes a value corresponding to the sum of the thicknesses of the two substrates 100 (2T).
[0110] As a result, the detection value of the second sensor 40a when detecting a single flexed substrate 100 (the value corresponding to the thickness T of the substrate 100) becomes a different value than the detection value of the second sensor 40a when detecting two overlapping substrates 100 (the value corresponding to the sum of the thicknesses of the two substrates 100, 2T). Therefore, it is possible to determine whether the substrates 100 overlap or flex based on the detection value of the second sensor 40a.
[0111] As explained above, in the mapping apparatus 20 of this embodiment, the storage state of the substrate 100 (whether it overlaps, whether it flexes, etc.) can be accurately detected regardless of whether the substrate 100 is flexed or not. In addition, in the mapping apparatus 20 of this embodiment, it is also possible to accurately detect whether the substrate 100 is tilted, misaligned, or protruding toward the opening side of the container 10.
[0112] In addition, such as Figure 7 As shown, the distance between the first light-emitting part 31 and the first light-receiving part 32 and the reference position (e.g., Figure 5 The height of the bottom of the container 10 shown is equal to the height of the second light-emitting part 41a and the second light-receiving part 42a from the reference position. When the height of the first light-emitting part 31 and the first light-receiving part 32 is different from the height of the second light-emitting part 41a and the second light-receiving part 42a, the vertical movement distance of the first sensor 30 or the second sensor 40a is reduced by a distance corresponding to the difference. Conversely, when the height of the first light-emitting part 31 and the first light-receiving part 32 is equal to the height of the second light-emitting part 41a and the second light-receiving part 42a, both the first sensor 30 and the second sensor 40a can detect the light from the container 10 (the bottom of the container 10 is at a height of 41a from the reference position). Figure 5 The upper end of the substrate 100 moves to the lower end. Therefore, the first sensor 30 and the second sensor 40a can detect the storage state of the substrate 100 in the container 10 over a wide range along the vertical direction.
[0113] In addition, such as Figure 9 As shown, the second light-emitting part 41a is located on the front side of the container 10 closer to the first sensor 30, and the second light-receiving part 42a is located on the depth side of the container 10 closer to the first sensor 30. Therefore, when the first sensor 30 and the second sensor 40a move in the vertical direction, at the time when the first optical axis 33 intersects with the front end 112 of the substrate 100, the second optical axis 43a intersects with the side portion 110a of the substrate 100. As a result, the detection values of the first sensor 30 and the second sensor 40a are acquired at virtually the same timing, thus improving the detection speed of the mapping device 20.
[0114] In addition, such as Figure 6 As shown, the second optical axis 43a and the second optical axis 43b separate as the container 10 is moved deeper. Therefore, when viewed from the opening 14 side, the second optical axis 43a extends toward the side wall 16a of the container 10. Furthermore, the second optical axis 43a imaginarily intersects with the side portion 110a of the substrate 100. Similarly, when viewed from the opening 14 side, the second optical axis 43b extends toward the side wall 16b of the container 10. Moreover, the second optical axis 43b imaginarily intersects with the side portion 110b of the substrate 100. Thus, the second sensors 40a and 40b can detect the storage state of the substrate 100 based on the detection values of the side portions 110a and 110b on both sides of the substrate 100. Therefore, the second sensors 40a and 40b can detect the storage state of the substrate 100 with high precision.
[0115] In addition, such as Figure 6 and Figure 7 As shown, the mapping device 20 has a mapping arm 22 parallel to the opening 14 and clamps 23a and 23b mounted on the mapping arm 22. The clamps 23a and 23b are equipped with a first sensor 30, a second sensor 40a, and a second sensor 40b. When the mapping arm 22 moves towards the opening 14 of the container 10, the first sensor 30, the second sensor 40a (second light-receiving part 42a), and the second sensor 40b (second light-receiving part 42b) enter the interior of the container 10. In this state, when the mapping arm 22 descends, the first optical axis 33 intersects the front end 112 of the substrate 100, and the second optical axes 43a and 43b intersect the side portions 110a and 110b of the substrate 100, respectively. Thus, the detection values of the first sensor 30 and the second sensors 40a and 40b can be obtained.
[0116] Furthermore, in this embodiment, the movement of the arm used to process the substrate 100 can be stopped based on the overlap of the plurality of substrates 100 or the bending of the substrate 100. This prevents interference between the arm and the substrate 100. Additionally, as... Figure 11As shown, it can be confirmed that there is a space for the arm to safely enter between adjacent shelves 12a, 12b and another shelf 12a, 12b in the vertical direction. This prevents damage to the arm or the base plate 100.
[0117] Second Implementation Method
[0118] Figure 13 The mapping device 20A of the second embodiment shown has the same structure as the mapping device 20 of the first embodiment, except for the points shown below. The same reference numerals are used for parts that are repeated in the mapping device 20 of the first embodiment, and detailed descriptions thereof are omitted.
[0119] The mapping device 20A differs from the mapping device 20 of the first embodiment in that it has clamps 23aA and 23bA. Clamp 23aA has a first portion 24a and a second portion 25a, and also a third portion 26a. Clamp 23bA has a first portion 24b and a second portion 25b, and also a third portion 26b. The third portions 26a and 26b protrude from the first portions 24a and 24b along the Y-axis in a direction away from the mapping arm 22. The protruding directions of the third portions 26a and 26b are the same as the protruding directions of the second portions 25a and 25b, respectively.
[0120] like Figure 14 As shown, the second light-emitting part 41a is disposed in the third part 26a. However, the second light-receiving part 42a may also be disposed in the third part 26a. Additionally, the second light-emitting part 41b is disposed in the third part 26b. However, the second light-receiving part 42b may also be disposed in the third part 26b.
[0121] In this embodiment, the same effect as in the first embodiment can be obtained. Furthermore, in this embodiment, a third portion 26a is provided on clamp 23aA, and a third portion 26b is provided on clamp 23bA. Therefore, when clamps 23aA and 23bA are placed in container 10 (… Figure 5 When the second light-emitting parts 41a and 41b are inside the sensor, their front-to-back positions can be adjusted. This allows for adjustment of the detection accuracy of the second sensors 40a and 40b.
[0122] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the present invention.
[0123] Figure 7 At least one of the first optical axis 33 and the second optical axis 43a (43b) shown may also be tilted relative to the horizontal plane. For example, as Figure 15As shown, the first optical axis 33 can also be tilted relative to the horizontal plane. Although detailed illustrations are omitted, the second optical axis 43a can also be tilted relative to the horizontal plane. Additionally, the second optical axis 43b can also be tilted relative to the horizontal plane. In this case, depending on the tilt angle of at least one of the first optical axis 33 and the second optical axis 43a (43b), the detection distance (moving distance) of at least one of the first sensor 30 and the second sensor 40a (40b) increases. Therefore, for example, it is possible to detect with high precision whether the substrate 100 overlaps or whether the substrate 100 is flexed.
[0124] like Figure 11 As shown, when viewed from above, the substrate 100 has a rectangular shape, but it can also be circular. In this case, the second optical axis 43a intersects any two points on the outer periphery of the substrate 100. Preferably, at least one of these two points is located at... Figure 6 The side of the container 10 shown (side wall 16a side). That is, preferably the second optical axis 43a intersects at least one point on the outer periphery of the substrate 100 on the side of the container 10 (side wall 16a side).
[0125] Furthermore, the second optical axis 43b intersects any two points on the outer periphery of the substrate 100. Preferably, at least one of these two points is located on the side of the container 10 (sidewall 16b side). That is, preferably, the second optical axis 43b is on the side of the container 10 (sidewall 16b side) and intersects at least one point on the outer periphery of the substrate 100.
[0126] like Figure 7 As shown, the mapping device 20 has both a second sensor 40a and a second sensor 40b, but it may also have only one of the second sensors 40a and 40b.
[0127] The first sensor 30, the second sensor 40a and the second sensor 40b are optical sensors, but they can also be ultrasonic sensors or magnetic sensors, etc.
[0128] Explanation of reference numerals in the attached figures
[0129] 1…Loading port device
[0130] 2…Framework
[0131] 3…Setup Department
[0132] 4…door
[0133] 5…Gate arm
[0134] 6…Frame opening
[0135] 10… containers
[0136] 11…Main Body
[0137] 12a, 12b...shelves
[0138] 14…Opening
[0139] 15…cover
[0140] 16a, 16b... sidewalls
[0141] 20, 20A… mapping device
[0142] 21… Support arm
[0143] 22…Mapping Arm
[0144] 23a, 23b, 23aA, 23bA… Fixtures
[0145] 24a, 24b… Part 1
[0146] 25a, 25b… Part Two
[0147] 26a, 26b… Part Three
[0148] 30…First Sensor
[0149] 31…First Light-Generating Section
[0150] 32…First Light-receiving Section
[0151] 33…First optical axis
[0152] 40a, 40b… Second sensor
[0153] 41a, 41b... Second light-emitting part
[0154] 42a, 42b... Second light-receiving section
[0155] 43a, 43b... Second optical axis
[0156] 50…First Drive Unit
[0157] 51…movable bodies
[0158] 52… Cylinder barrel
[0159] 60…Second Drive Unit
[0160] 70…Third Drive Unit
[0161] 80… Sensor position detection unit
[0162] 90…Computational Department
[0163] 100...Substrate
[0164] 110a, 110b... Lateral section
[0165] 111a, 111b... Corner
[0166] 112…Front end.
Claims
1. A mapping device, wherein, The mapping device detects the storage status of the plate-shaped object to be detected within the container. The mapping device has: A first sensor having a first optical axis extending along the opening of the container; as well as The second sensor has a second optical axis that extends toward the side of the container in a manner that obliquely intersects the first optical axis.
2. The mapping apparatus according to claim 1, wherein, The second optical axis is tilted so that it approaches the side wall of the container as it moves deeper into the container.
3. The mapping apparatus according to claim 1 or 2, wherein, When viewed from above, the object being detected is square in shape. The object to be detected has a first side parallel to the opening and a second side perpendicular to the first side. The second optical axis intersects the first and second sides at the corner of the object being detected.
4. The mapping apparatus according to claim 1 or 2, wherein, When viewed from above, the object being detected appears to be circular. The second optical axis intersects with the first and second points on the outer periphery of the object being detected. At least one of the first point and the second point is located on the side of the container.
5. The mapping apparatus according to claim 1 or 2, wherein, The first sensor has a first light-emitting part and a first light-receiving part that receives light emitted by the first light-emitting part. The second sensor has a second light-emitting part and a second light-receiving part that receives light emitted by the second light-emitting part. The height positions of the first light-emitting part and the first light-receiving part are equal to the height positions of the second light-emitting part and the second light-receiving part.
6. The mapping apparatus according to claim 1 or 2, wherein, The second sensor has a second light-emitting part and a second light-receiving part that receives light emitted by the second light-emitting part. One of the second light-emitting part and the second light-receiving part is located on the front side of the container, which is closer to the first sensor. The other side of the second light-emitting part and the second light-receiving part is located on the side of the container that is closer to the depth than the first sensor.
7. The mapping apparatus according to claim 1 or 2, wherein, The second sensor consists of a pair of second sensors. The second optical axis of one second sensor and the second optical axis of another second sensor separate from each other as the container is moved deeper.
8. The mapping apparatus according to claim 1 or 2, wherein, At least one of the first optical axis and the second optical axis is inclined relative to the horizontal plane.
9. The mapping apparatus according to claim 1 or 2, wherein, It also has: A mapping arm, which is parallel to the opening; and The fixture is mounted on the mapping arm and is equipped with the first sensor and the second sensor.
10. A loading port device comprising: The mapping apparatus according to any one of claims 1 to 9; A setting section, used for setting the container; and A door that opens and closes the lid of the container.
Citation Information
Patent Citations
Load port device, and method of controlling each lifting mechanism of cover removal device and mapping device
JP2011035384A