Full-automatic chip-mounting die bonder for semiconductor diode

Abstract

The invention belongs to the technical field of die bonders, and particularly relates to a full-automatic surface-mount die bonder for a semiconductor diode. Comprising a machine body, and a wafer table is arranged in the center of the machine body; the machine body is also provided with a dispensing head and a die bonding head. The full-automatic chip-mounting die bonder for the semiconductor diode further comprises an alternating working unit. According to the invention, the alternate working unit is arranged, and the alternate working unit can carry out alternate dispensing and die bonding operation on the substrates on the two stations, so that continuous dispensing and die bonding can be realized, the processing waiting time of the die bonder is further reduced, and seamless alternation of dispensing and die bonding of the substrates is realized; and the defects caused by an assembly line are overcome.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of die bonder, and particularly relates to a full-automatic die bonder for semiconductor diode. BACKGROUND

[0002] The die bonder, also known as a chip mounter, is a core equipment in semiconductor packaging and post-process; The traditional die bonder carries out dispensing and die bonding separately, that is, dispensing and die bonding cannot be carried out simultaneously, and the next process must be carried out after one of the processes is completed, so that the two devices cannot work simultaneously, thereby increasing the waiting period of the equipment; in the prior art, there is also a flow line type, and the dispensing and die bonding equipment can work simultaneously, but this mode is high in cost and has the following defects: 1. the workbench needs to move back and forth between the dispensing position and the die bonding position with a heavy support plate, and such "sudden stop-sudden start" movement is the largest vibration source of the whole machine, and the vibration can cause the dispensing needle to shake, affect the consistency of the shape and volume of the glue point, and cause the die bonding head to shake when being placed, thereby causing the chip to tilt, deviate, the imaging of the vision camera to be blurred, and the recognition accuracy to be reduced; 2. after dispensing, the glue point is still in a "wet" and unstable state, and the workbench needs to immediately move to the die bonding position, and the movement process can cause the glue point to shake, spread or even pull a thread due to inertial force, and affect the final shape; 3. the whole production line is in series and locked, and if the product needs to be replaced, the distances and parameters of multiple positions such as the dispensing position and the die bonding position need to be adjusted, the machine is complex to adjust, and the time consumption is long; 4. the single track and the complex workbench movement mechanism are single-point failure sources, and once the mechanism fails, the whole machine stops producing; In view of this, the application provides a full-automatic die bonder for semiconductor diode to solve the above technical problems. SUMMARY

[0003] In order to make up for the defects of the prior art, the two work positions of the substrate can be alternately dispensed and die bonded, so that dispensing and die bonding can be continuously carried out; and the application provides a full-automatic die bonder for semiconductor diode.

[0004] The technical scheme adopted by the application to solve the technical problems is as follows: a full-automatic die bonder for semiconductor diode, comprising: a machine body, a wafer table is arranged at the central part of the machine body; a dispensing head and a die bonding head are further arranged on the machine body; the full-automatic die bonder for semiconductor diode further comprises: an alternating work unit, the alternating work unit can alternately dispense and die bond the substrates on the two work positions, so that dispensing and die bonding can be continuously carried out, thereby reducing the processing waiting time of the die bonder, realizing seamless alternation of substrate dispensing and die bonding, and overcoming the defects caused by the flow line.

[0005] Preferably, the alternating work unit comprises: a crossbeam, two ends of the machine body are provided with a crossbeam, the crossbeam spans above the machine body; the crossbeam can move forward and backward relative to the machine body; two workstations are respectively distributed at the top of the two ends of the machine body; a first seat is rotatably connected below the top of the crossbeam, a first motor is fixedly connected to the top of the crossbeam, and the first motor can drive the first seat to rotate; a glue dispensing head is arranged at a position close to one end of the bottom of the first seat, and the glue dispensing head can move along the length direction of the first seat; a second seat is arranged at a position close to the other end of the bottom of the first seat, a die bonding head is arranged at the bottom of the second seat, the second seat can move along the length direction of the first seat, and the die bonding head can move along the length direction of the second seat; a conveying plate is arranged at a position close to both sides inside each of the workstations, and a first conveying belt is arranged at the bottom of one side of the conveying plate inside each of the workstations; a receiving groove is formed at one end of each of the workstations, a first telescopic rod is fixedly connected to the bottom of each of the receiving grooves, and a lifting plate is fixedly connected to the top of each of the first telescopic rods; a notch is formed at one end of the conveying plate opposite to the receiving groove, a first plate is fixedly connected to the bottom of the other end of the conveying plate opposite to the receiving groove, and a gap is left between the bottom of the first plate and the bottom of the workstation.

[0006] Preferably, a second telescopic rod is fixedly connected between each of the conveying plates and the two ends of the workstations.

[0007] Preferably, a third plate is fixedly connected to the top of each of the conveying plates between the first plate and the second plate. The crossbeam can move forward and backward relative to the machine body, the second seat can move along the length direction of the first seat, and the die bonding head can move along the length direction of the second seat. The above driving mode can refer to the prior art. The substrates are placed in the two workstations, the glue dispensing head and the die bonding head are respectively used for dispensing and die bonding operations without affecting each other. When the operations on both sides are completed, the first motor drives the first seat to rotate, so as to realize the transposition of the glue dispensing head and the die bonding head. The substrate originally subjected to dispensing is subjected to die bonding, the substrate originally subjected to die bonding is conveyed, and a new substrate is replaced to continue dispensing. The new substrate is arranged between the first plate and the second plate, the first conveying belt can be driven to convey the new substrate between the first plate and the second plate, and after die bonding, the substrate is conveyed to the lifting plate. One substrate is placed on the lifting plate, and the lifting plate is lowered by a distance, so that the top of the placed substrate is always flush with the bottom of the workstation. Until the receiving groove is filled with substrates, the substrates can be taken out by workers. The second telescopic rod can drive the conveying plate and the third plate to move, so that the second telescopic rod and the third plate are arranged to adapt to substrates of different sizes.

[0008] Preferably, each of the transport plates has a sliding groove on one side that is close to each other. The sliding groove is located above the first conveyor belt. A pressure plate is slidably connected to one side of each transport plate that is close to each other. The pressure plate extends into the sliding groove. A cavity is formed inside the pressure plate. A rod is slidably connected inside the pressure plate. A ring is fixedly connected to the part of the rod located in the cavity. A spring is fixedly connected between the ring and the side wall of the cavity. A pressing block is slidably connected to the part of the pressure plate located inside the sliding groove. A connecting plate is fixedly connected to the pressing block. The pressing block is fixedly connected to the rod through the connecting plate. The pressing block can contact the side wall of the sliding groove.

[0009] Preferably, the No. 1 plate is composed of a support plate and a sliding plate. The support plate is located on both sides of the sliding plate. The support plate is fixedly connected to the bottom of the workstation. The sliding plate is slidably connected to the support plate. The pressure plate is slidably connected to the sliding plate. The bottom of the pressure plate is flush with the bottom of the sliding plate. The pressure plate is used to hold the edge of the substrate for better fixation; the sliding plate is used to limit the amount of substrate transported to ensure that only one substrate is transported at a time; the pressure plate can drive the sliding plate to move up and down together; in the normal state, due to the action of the first spring, the extrusion block squeezes the sliding groove to achieve the limit of the pressure plate. When the first lever is pressed, the first spring is compressed, the first lever drives the extrusion block to retract, release the limit, and the pressure plate can move freely.

[0010] Preferably, a suction cup is provided in the central part of the workstation.

[0011] Preferably, a second conveyor belt is provided in the center of the workstation, the suction cup is located on the second conveyor belt, a first magnet is slidably connected inside the suction cup, a second spring is fixed between the first magnet and the bottom of the suction cup, and an electromagnet is fixedly connected to the workstation near the front and rear ends and corresponding to the bottom of the suction cup, the first electromagnet can repel the first magnet. The suction cups are designed to better secure and transport the substrate. Because the substrate is fragile, it cannot be excessively clamped by the transport plate, which may result in insufficient transport force. Therefore, the suction cups are used to assist in securing and transporting the substrate. The second conveyor belt can be driven. At the front and rear ends of the workstation, and corresponding to the area below the suction cups, there are two electromagnets. One electromagnet is close to the receiving groove, and the other electromagnet is located between the first and second plates. The first electromagnet can repel the first magnet, so when the suction cup moves to the first electromagnet, the suction cup can release its attraction and re-attach after the power is turned off.

[0012] Preferably, a pressing airbag is fixedly installed at the bottom of the pressure plate corresponding to the position of the lifting plate. A second cavity is opened inside the machine body on both sides of the first electromagnet near the lifting plate. A control plate is slidably connected in the second cavity. A third spring is fixedly connected between the control plate and the side wall of the second cavity. A connecting pipe is fixedly connected to the second cavity. The connecting pipe is connected to the corresponding pressing airbag. When the first electromagnet is energized, it can attract the control plate, and at this time the pressing airbag contracts. Under normal conditions, the press airbag is inflated. When the substrate is transported close to the lifting plate, the suction cup needs to release the substrate. Therefore, the first electromagnet is energized, repelling the first magnet and causing the suction cup to release. At this time, the first electromagnet also attracts the control board, the third spring extends, the press airbag contracts, and the substrate successfully enters above the lifting plate. At this time, the substrate is located below the press airbag. Subsequently, the lifting plate descends, the first electromagnet is de-energized, the third spring resets, the press airbag expands, and the substrate is squeezed onto the lifting plate and removed from the first conveyor belt.

[0013] The beneficial effects of this invention are as follows: 1. The fully automatic semiconductor diode die bonding machine of the present invention, by setting up an alternating working unit, can perform alternating dispensing and die bonding operations on substrates at two workstations to achieve uninterrupted dispensing and die bonding, thereby reducing the processing waiting time of the die bonding machine and achieving seamless alternation of substrate dispensing and die bonding; and overcomes the disadvantages of the production line.

[0014] 2. The fully automatic semiconductor diode mounting and die bonding machine of the present invention has substrates placed in two stations. The dispensing head and the die bonding head are used for dispensing and die bonding operations separately without affecting each other. After the operation on both sides is completed, the first motor drives the first seat to rotate, realizing the interchange of the dispensing head and the die bonding head. The substrate that was originally dispensing is now die bonded. The substrate that was originally die bonded is transported and replaced with a new substrate to continue dispensing. A new substrate is placed between the first board and the second board. The first conveyor belt can be driven to transport the new substrate between the first board and the second board. After die bonding, it is transported to the lifting plate. Each time a die bonded substrate is placed on the lifting plate, it descends a certain distance, so that the top of the placed substrate is always flush with the bottom of the station, until the receiving tank is full of substrates, which can be removed by the operator. The extension and retraction of the second telescopic rod can drive the transport plate and the third board to move. Therefore, the second telescopic rod and the third board are set to accommodate substrates of different sizes. Attached Figure Description

[0015] The invention will now be further described with reference to the accompanying drawings.

[0016] Figure 1 This is the three-dimensional representation of the present invention. Figure 1 ; Figure 2 This is the three-dimensional representation of the present invention. Figure 2 ; Figure 3 yes Figure 2 Enlarged view of a portion at point A; Figure 4 This is a partial three-dimensional representation of the present invention. Figure 1 ; Figure 5 This is a partial three-dimensional representation of the present invention. Figure 2 ; Figure 6 yes Figure 5 A magnified view of section B; Figure 7 This is a partial three-dimensional representation of the present invention. Figure 3 ; Figure 8 This is a top sectional view of the pressure plate of the present invention; Figure 9 This is a cross-sectional view of the second conveyor belt of the present invention; Figure 10 This is a schematic diagram of the interior of cavity number two of the present invention; In the diagram: 1. Machine body; 11. Wafer stage; 12. Dispensing head; 13. Die-bonding head; 2. Alternating work unit; 21. Workstation; 22. Crossbeam; 23. Seat 1; 24. Motor 1; 25. Seat 2; 26. Transport plate; 27. Conveyor belt 1; 3. Receiving tank; 31. Telescopic rod 1; 32. Lifting plate; 4. Plate 1; 41. Plate 2; 5. Telescopic rod 2; 6. Plate 3; 7. Slide 71. Moving groove; 72. Pressure plate; 73. Cavity 1; 74. Rod 1; 75. Ring 1; 76. Spring 1; 77. Extrusion block; 8. Connecting plate; 98. Support plate; 99. Sliding plate; 90. Suction cup; 91. Conveyor belt 2; 92. Magnet 1; 93. Spring 2; 94. Electromagnet 1; 95. Pressing airbag; 96. Cavity 2; 97. Control board; 98. Spring 3; 99. Connecting pipe. Detailed Implementation

[0017] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0018] like Figure 1 , Figure 2 , Figure 4As shown, the fully automatic semiconductor diode die bonding machine of the present invention includes: a machine body 1, with a wafer stage 11 disposed in the central part of the machine body 1; the machine body 1 is also provided with a dispensing head 12 and a die bonding head 13; the fully automatic semiconductor diode die bonding machine also includes: an alternating working unit 2, with two workstations 21 disposed on the machine body 1, the alternating working unit 2 can perform alternating dispensing and die bonding operations on the substrates at the two workstations 21, so as to realize uninterrupted dispensing and die bonding, thereby reducing the processing waiting time of the die bonding machine and realizing seamless alternation of substrate dispensing and die bonding; In traditional die bonders, dispensing and die bonding are performed separately, meaning they cannot be done simultaneously. One process must be completed before the next can begin, increasing downtime. While some existing technologies use assembly lines where dispensing and die bonding can operate concurrently, this method is costly and has the following drawbacks: 1. The worktable, carrying a heavy support plate, needs to move back and forth a long distance and frequently between the dispensing and die bonding positions. This "sudden stop-start" motion is the largest vibration source for the entire machine. Vibration causes: dispensing needle vibration, affecting the shape and volume consistency of the glue dots; and vibration when the die bonding head is placed, causing chip tilting and offset, blurring the image in the vision camera, and reducing recognition accuracy. 2. After dispensing, the glue dots are still "wet". "In unstable conditions, the worktable needs to be moved to the die-bonding position immediately. This movement process may cause: the glue dots to vibrate, spread, or even string due to inertial force, affecting the final shape; 3. The entire production line is connected and locked. If the product needs to be changed, it may be necessary to adjust the distance and parameters of multiple positions such as the glue dispensing position and the die-bonding position. The machine adjustment is complicated and time-consuming; 4. The single track and complex worktable movement mechanism are single-point failure sources. Once the mechanism fails, the whole machine stops production; Therefore, an alternating work unit 2 is set up. The alternating work unit 2 can perform alternating glue dispensing and die-bonding operations on the substrates on the two workstations 21 to achieve uninterrupted glue dispensing and die-bonding, thereby reducing the processing waiting time of the die-bonding machine and achieving seamless alternation of substrate glue dispensing and die-bonding; and overcome the disadvantages of the assembly line."

[0019] As a specific embodiment of the present invention, such as Figure 1 , Figure 2 , Figure 4 , Figure 7As shown, the alternating work unit 2 includes: a crossbeam 22, which is provided at both ends of the machine body 1 and spans across the top of the machine body 1; the crossbeam 22 can move back and forth relative to the machine body 1; two workstations 21 are respectively distributed at the top ends of the machine body 1; a first seat 23, which is rotatably connected to the bottom of the crossbeam 22, and a first motor 24 is fixed to the top of the crossbeam 22, which can drive the first seat 23 to rotate; a dispensing head 12 is provided at one end of the bottom of the first seat 23, which can move along the length of the first seat 23; a second seat 25 is provided at the other end of the bottom of the first seat 23, and a die bonding head 13 is provided at the bottom of the second seat 25, which can move along the length of the first seat 23. The die bonding head 13 can move along the length of the second seat 25; a transport plate 26 is provided in the part near both sides inside each station 21, and a first conveyor belt 27 is provided at the bottom of the side of the transport plates 26 that are close to each other inside each station 21; a receiving groove 3 is opened at one end of each station 21, a first telescopic rod 31 is fixedly connected to the bottom of each receiving groove 3, and a lifting plate 32 is fixedly connected to the top of each first telescopic rod 31; a notch is opened at one end of each transport plate 26 opposite to the receiving groove 3, a first plate 4 is fixedly connected to the bottom of the station 21 and at one end of the notch of the transport plate 26, and a gap is left between the bottom of the first plate 4 and the bottom of the station 21; a second plate 41 is fixedly connected to the bottom of the station 21 and at the other end of the notch of the transport plate 26. like Figure 1 , Figure 4 As shown, each transport plate 26 is fixedly connected to both ends of the workstation 21 by a second telescopic rod 5; like Figure 4 , Figure 5 As shown, each transport plate 26 is fixed to the top of the gap with plate number 6, and plate number 6 is located between plate number 1 4 and plate number 2 41. During operation, the crossbeam 22 can move back and forth relative to the machine body 1, the second seat 25 can move along the length of the first seat 23, and the die-bonding head 13 can move along the length of the second seat 25. The above driving method can refer to existing technology. Substrates are placed in both workstations 21. The dispensing head 12 and the die-bonding head 13 are used for dispensing and die-bonding operations respectively, without affecting each other. When both sides have completed their operations, the first motor 24 drives the first seat 23 to rotate, realizing the interchange of the dispensing head 12 and the die-bonding head 13. The substrate that was originally being dispensed is now being die-bonded, and the substrate that was originally being die-bonded is transported to a new substrate for dispensing to continue. Adhesive; A new substrate is placed between plate 4 and plate 41. Conveyor belt 27 can be driven to transport the new substrate between plate 4 and plate 41, perform die bonding, and then transport it to lifting plate 32. Each time a die-bonded substrate is placed on lifting plate 32, it descends a certain distance so that the top of the placed substrate is always flush with the bottom of station 21 until the receiving groove 3 is full of substrates, which can be taken out by the staff; the extension and retraction of telescopic rod 5 can drive the transport plate 26 and plate 6 to move. Therefore, the setting of telescopic rod 5 and plate 6 is to accommodate substrates of different sizes.

[0020] As a specific embodiment of the present invention, such as Figure 4 , Figure 5 , Figure 8 As shown, each transport plate 26 has a sliding groove 7 on one side that is close to each other. The sliding groove 7 is located above the first conveyor belt 27. Each transport plate 26 has a pressure plate 71 slidably connected to one side that is close to each other. The pressure plate 71 extends into the sliding groove 7. A cavity 72 is formed inside the pressure plate 71. A rod 73 is slidably connected inside the pressure plate 71. A ring 74 is fixedly connected to the part of the rod 73 located in the cavity 72. A spring 75 is fixedly connected between the ring 74 and the side wall of the cavity 72. A pressing block 76 is slidably connected to the part of the pressure plate 71 located inside the sliding groove 7. A connecting plate 77 is fixedly connected to the pressing block 76. The pressing block 76 is fixedly connected to the rod 73 through the connecting plate 77. The pressing block 76 can contact the side wall of the sliding groove 7. like Figure 5 , Figure 6 As shown, plate 4 consists of a support plate 8 and a sliding plate 81. The support plate 8 is located on both sides of the sliding plate 81. The support plate 8 is fixedly connected to the bottom of the workstation 21. The sliding plate 81 is slidably connected to the support plate 8. The pressure plate 71 is slidably connected to the sliding plate 81. The bottom of the pressure plate 71 is flush with the bottom of the sliding plate 81. During operation, the pressure plate 71 is used to press down on the edge of the substrate for better fixation; the sliding plate 81 is used to limit the amount of substrate transported to ensure that only one substrate is transported at a time; the pressure plate 71 can drive the sliding plate 81 to move up and down together; in the normal state, due to the action of the first spring 75, the pressing block 76 presses the sliding groove 7 to limit the pressure plate 71. When the first lever 73 is pressed down, the first spring 75 is compressed, and the first lever 73 drives the pressing block 76 to retract, releasing the limit, and the pressure plate 71 can move freely.

[0021] As a specific embodiment of the present invention, such as Figure 4 , Figure 9 As shown, a suction cup 9 is provided in the central part of workstation 21; like Figure 9 As shown, a second conveyor belt 91 is set in the center of the workstation 21, and a suction cup 9 is located on the second conveyor belt 91. A first magnet 92 is slidably connected inside the suction cup 9. A second spring 93 is fixed between the first magnet 92 and the bottom of the suction cup 9. An electromagnet 94 is fixedly connected to the workstation 21 near the front and rear ends and below the suction cup 9. The first electromagnet 94 can repel the first magnet 92. During operation, the suction cup 9 is designed to better fix and transport the substrate. Because the substrate is fragile, it cannot be excessively clamped by the transport plate 26, which may result in insufficient transport force. Therefore, the suction cup 9 is used to assist in fixing and transporting the substrate. The second conveyor belt 91 can be driven. At the workstation 21, near the front and rear ends, and corresponding to the lower part of the suction cup 9, there is a first electromagnet 94. One first electromagnet 94 is close to the receiving groove 3, and the other first electromagnet 94 is located between the first plate 4 and the second plate 41. The first electromagnet 94 can repel the first magnet 92. Therefore, when the suction cup 9 moves to the first electromagnet 94, the suction cup 9 can release the adsorption and re-adsorb after the power is turned off.

[0022] As a specific embodiment of the present invention, such as Figure 2 , Figure 3 , Figure 10 As shown, a pressing airbag 95 is fixedly installed at the bottom of the pressure plate 71 corresponding to the position of the lifting plate 32. A second cavity 96 is opened on both sides of the first electromagnet 94 located near the lifting plate 32 inside the body 1. A control plate 97 is slidably connected in the second cavity 96. A third spring 98 is fixedly connected between the control plate 97 and the side wall of the second cavity 96. A connecting pipe 99 is fixedly connected to the second cavity 96. The connecting pipe 99 is connected to the corresponding pressing airbag 95. When the first electromagnet 94 is energized, it can attract the control plate 97, and at this time the pressing airbag 95 contracts. During operation, the press airbag 95 is normally in an inflated state. When the substrate is transported close to the lifting plate 32, the suction cup 9 needs to release the substrate. Therefore, the first electromagnet 94 is energized, repelling the first magnet 92 and causing the suction cup 9 to release. At this time, the first electromagnet 94 also attracts the control board 97, the third spring 98 extends, the press airbag 95 contracts, and the substrate successfully enters above the lifting plate 32. At this time, the substrate is located below the press airbag 95. Subsequently, the lifting plate 32 descends, the first electromagnet 94 is de-energized, the third spring 98 resets, the press airbag 95 inflates, and squeezes the substrate onto the lifting plate 32 to detach it from the first conveyor belt 27.

[0023] The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention without departing from the spirit and scope of the present invention. Any modifications or equivalent substitutions should be covered within the protection scope of the claims of the present invention.

Claims

1. A fully automatic die bonding machine for semiconductor diodes, comprising: The machine body (1) has a wafer stage (11) in the center; the machine body (1) is also provided with a dispensing head (12) and a die bonding head (13); The feature is that the fully automatic semiconductor diode die bonding machine further includes: Alternating work unit (2): The machine body (1) is provided with two workstations (21). The alternating work unit (2) can perform alternating dispensing and die bonding operations on the substrates at the two workstations (21) to achieve uninterrupted dispensing and die bonding, thereby reducing the processing waiting time of the die bonding machine and realizing seamless alternation of substrate dispensing and die bonding.

2. The fully automatic semiconductor diode surface mount and die bonder according to claim 1, characterized in that: The alternating work unit (2) includes: A crossbeam (22) is provided at both ends of the machine body (1), and the crossbeam (22) spans across the top of the machine body (1); the crossbeam (22) can move back and forth relative to the machine body (1); the two workstations (21) are respectively distributed at the top two ends of the machine body (1); A No. 1 seat (23) is rotatably connected to the bottom of the top of the crossbeam (22). A No. 1 motor (24) is fixed to the top of the crossbeam (22). The No. 1 motor (24) can drive the No. 1 seat (23) to rotate. A dispensing head (12) is provided at one end of the bottom of the No. 1 seat (23). The dispensing head (12) can move along the length direction of the No. 1 seat (23). A No. 2 seat (25) is provided at the other end of the bottom of the No. 1 seat (23). A die bonding head (13) is provided at the bottom of the No. 2 seat (25). The No. 2 seat (25) can move along the length direction of the No. 1 seat (23). The die bonding head (13) can move along the length direction of the No. 2 seat (25). A transport plate (26) is provided in each workstation (21) near both sides. A first conveyor belt (27) is provided at the bottom of the side of the transport plates (26) that are close to each other in each workstation (21). A receiving groove (3) is opened at one end of each workstation (21). A first telescopic rod (31) is fixedly connected to the bottom of each receiving groove (3). A lifting plate (32) is fixedly connected to the top of each first telescopic rod (31). A notch is opened at one end of each transport plate (26) relative to the receiving groove (3). A first plate (4) is fixedly connected to the bottom of the workstation (21) at one end of the notch of the transport plate (26). A gap is left between the bottom of the first plate (4) and the bottom of the workstation (21). A second plate (41) is fixedly connected to the bottom of the workstation (21) at the other end of the notch of the transport plate (26).

3. The fully automatic semiconductor diode surface mount and die bonder according to claim 2, characterized in that: Each of the transport plates (26) is fixedly connected to both ends of the workstation (21) by a No. 2 telescopic rod (5).

4. The fully automatic semiconductor diode surface mount and die bonder according to claim 3, characterized in that: Each of the transport plates (26) is fixed to a third plate (6) at the top of the notch, the third plate (6) being located between the first plate (4) and the second plate (41).

5. The fully automatic semiconductor diode surface mount and die bonder according to claim 4, characterized in that: Each of the transport plates (26) has a sliding groove (7) on one side that is close to each other. The sliding groove (7) is located above the first conveyor belt (27). Each of the transport plates (26) has a pressure plate (71) slidably connected to one side that is close to each other. The pressure plate (71) extends into the sliding groove (7). A cavity (72) is formed inside the pressure plate (71). A rod (73) is slidably connected inside the pressure plate (71). The rod (73) is located at the first... A ring (74) is fixedly connected to the cavity (72), and a spring (75) is fixedly connected between the ring (74) and the side wall of the cavity (72); a pressing block (76) is slidably connected to the pressure plate (71) inside the sliding groove (7), and a connecting plate (77) is fixedly connected to the pressing block (76). The pressing block (76) is fixedly connected to the rod (73) through the connecting plate (77); the pressing block (76) can contact the side wall of the sliding groove (7).

6. The fully automatic semiconductor diode surface mount and die bonder according to claim 5, characterized in that: The first plate (4) is composed of a support plate (8) and a sliding plate (81). The support plate (8) is located on both sides of the sliding plate (81). The support plate (8) is fixedly connected to the bottom of the workstation (21). The sliding plate (81) is slidably connected to the support plate (8). The pressure plate (71) is slidably connected to the sliding plate (81). The bottom of the pressure plate (71) is flush with the bottom of the sliding plate (81).

7. The fully automatic semiconductor diode surface mount and die bonder according to claim 6, characterized in that: The workstation (21) is equipped with a suction cup (9) in the center.

8. The fully automatic semiconductor diode surface mount and die bonder according to claim 7, characterized in that: A second conveyor belt (91) is provided in the center of the work station (21). The suction cup (9) is located on the second conveyor belt (91). A first magnet (92) is slidably connected inside the suction cup (9). A second spring (93) is fixed between the first magnet (92) and the bottom of the suction cup (9). An electromagnet (94) is fixedly connected to the work station (21) near the front and rear ends and below the suction cup (9). The first electromagnet (94) can repel the first magnet (92).

9. A fully automatic semiconductor diode surface mount and die bonder according to claim 8, characterized in that: A pressing airbag (95) is fixedly installed at the bottom of the pressure plate (71) corresponding to the position of the lifting plate (32). A second cavity (96) is opened on both sides of the first electromagnet (94) inside the body (1) and located near the lifting plate (32). A control plate (97) is slidably connected in the second cavity (96). A third spring (98) is fixed between the control plate (97) and the side wall of the second cavity (96). A connecting pipe (99) is fixedly connected to the second cavity (96). The connecting pipe (99) is connected to the corresponding pressing airbag (95). When the first electromagnet (94) is energized, it can attract the control plate (97), and at this time the pressing airbag (95) contracts.

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