Wafer testing system and detector

Abstract

The invention provides a wafer testing system, a probe card replacement method, and a probe capable of suppressing an increase in installation space and enabling replacement of a probe card to be automated at low cost. The wafer test system includes: a probe that includes a chuck holding a semiconductor wafer and a probe card having a probe, and that inspects a plurality of semiconductor chips formed on the semiconductor wafer by bringing the probe into contact with the plurality of semiconductor chips; a ceiling traveling-type automated guided vehicle that carries a cassette in which a plurality of semiconductor wafers before inspection are stored into the probe and collects a cassette in which a plurality of semiconductor wafers after inspection are stored from the probe; a conveyance control unit that controls the ceiling traveling type automated guided vehicle so as to convey the probe card between a probe card replacement position preset in the probe and a storage location of the probe card located at a location other than the probe; and a card transport mechanism that transports the probe card between the holding position and the replacement position in the probe.

Description

[0001] This application is a divisional application of the invention patent application with the application date of December 12, 2022, the application number of 202280089238.9, and the invention name of "Wafer test system, probe card replacement method, and probe". TECHNICAL FIELD

[0002] The present invention relates to a wafer test system for inspecting a semiconductor wafer using a probe, a probe card replacement method for replacing a probe card of the probe, and a probe for use in the wafer test system. BACKGROUND

[0003] A plurality of semiconductor chips having the same electric element circuit are formed on the surface of a semiconductor wafer. Each semiconductor chip is inspected for electric characteristics by a wafer test system before being cut one by one by a dicing machine in a semiconductor manufacturing process. The wafer test system is provided with a probe and a tester (see Patent Literature 1).

[0004] The probe moves a probe card having a probe in opposition to a wafer chuck on which the semiconductor wafer is held, so that the probe comes into electrical contact (contact) with the electrode pad of the semiconductor chip. The tester supplies various test signals to the semiconductor chip via a terminal connected to the probe, and receives and analyzes the signal output from the semiconductor chip to test whether the semiconductor chip operates normally.

[0005] In recent years, automation of the semiconductor manufacturing process is advancing, and automation is also advancing in the wafer test system. For example, in the wafer test system described in Patent Literature 1 described above, an overhead hoist transport (OHT) is used to place a cassette in which a plurality of semiconductor wafers that are the inspection targets are housed in a loading device of the probe. Then, in the wafer test system, the setting of the semiconductor wafer to the wafer chuck, the contact of the probe to each semiconductor chip of the semiconductor wafer, and the test of each semiconductor chip by the tester are performed. Then, the cassette in which the inspected semiconductor wafer is housed is recovered from the probe by the OHT. Thus, the inspection of the semiconductor wafer can be performed without an operator.

[0006] PRIOR ART DOCUMENTS

[0007] PATENT LITERATURE

[0008] Patent Literature 1: Japanese Patent Application Laid-Open No. 2007-329458 SUMMARY OF THE INVENTION

[0009] PROBLEMS TO BE SOLVED BY THE INVENTION

[0010] Furthermore, the types of semiconductor chips formed on semiconductor wafers are diverse, and the types of probe cards used in inspecting these chips are also diverse. Therefore, in wafer testing systems, there are situations where the type of probe card installed on the detector must be changed accordingly for each type of semiconductor chip being inspected. Previously, replacing probe cards in the detector required an operator, and this replacement was performed manually or semi-automatically. Therefore, devices delivered to the US and Europe need to meet specified safety standards (SEMI standard S2CE, etc.), such as requiring the power to be switched off the detector's drive unit when opening or closing the detector door during probe card replacement. Moreover, manual probe card replacement by an operator could potentially cause the probe card to fall out accidentally; therefore, there is a strong desire to automate the replacement of probe cards in the semiconductor manufacturing process.

[0011] To automate the replacement of probe cards for detectors, it is necessary to automate the retrieval of the old probe card from the detector and the loading of the new probe card into the detector. However, installing new equipment for probe card retrieval and loading in the semiconductor manufacturing process presents challenges in terms of cost and installation space.

[0012] The present invention was made in view of the following circumstances, and aims to provide a wafer testing system, a probe card replacement method, and a detector that can suppress the increase in setup space and automate probe card replacement at low cost.

[0013] Solution for solving the problem

[0014] A wafer testing system for achieving the objectives of this invention comprises: a detector having a suction cup for holding a semiconductor wafer and a probe card having probes, and performing semiconductor chip inspection by contacting the probes with multiple semiconductor chips formed on the semiconductor wafer; a roof-mounted unmanned transport vehicle that moves along a transport track while holding a box containing multiple semiconductor wafers, and moves the box containing the multiple semiconductor wafers before inspection into the detector and retrieves the box containing the multiple semiconductor wafers after inspection from the detector; a transport control unit that controls the roof-mounted unmanned transport vehicle to transport the probe cards between a pre-set probe card replacement position in the detector and a probe card storage location located outside the detector; a card transport mechanism provided in the detector that transports the probe cards between a holding position held in the detector and a replacement position; a separation control unit that controls the card transport mechanism to perform a separation process of transporting the probe card before replacement from the holding position to the replacement position; and an assembly control unit that controls the card transport mechanism to perform an assembly process of transporting a new probe card from the replacement position to the holding position.

[0015] According to this chip testing system, the probe cards of the detector can be replaced automatically using a canopy-mounted unmanned transport vehicle used for box handling.

[0016] In another embodiment of the wafer testing system of the present invention, the detector includes: a housing that houses a suction cup, a probe card, and a card transport mechanism; an opening formed in the housing and exposing the replacement position to the outside of the housing; a door that can be switched between an open state (opening the opening) and a closed state (covering the opening); a door opening / closing mechanism for switching the door between the open and closed states; and a door opening / closing control unit that drives the door opening / closing mechanism to switch the door from the closed state to the open state during separation processing and to switch the door from the open state to the closed state during assembly processing. This automates the opening and closing of the door during both separation and assembly processes.

[0017] In another embodiment of the wafer testing system of the present invention, the wafer testing system includes a human detection sensor that detects whether a person is intruding into a protected area pre-defined based on the position of a door. Based on the detection result of the human detection sensor, the door opening and closing control unit stops the drive of the door opening and closing mechanism while a person is intruding into the protected area. This prevents the door from colliding with a person or preventing hands or fingers from being trapped by the door.

[0018] In another embodiment of the wafer testing system of the present invention, if the door opening and closing control unit stops the drive of the door opening and closing mechanism midway, it restarts the drive of the door opening and closing mechanism in accordance with the change in the detection result of the human detection sensor from intrusion into the protected area by a person to no intrusion into the protected area. This reduces the time required for the operator to restart the operation.

[0019] In another embodiment of the wafer testing system of the present invention, the wafer testing system includes a card holding part that holds the probe card in a holding position for easy loading and unloading. A card transport mechanism has a tray capable of holding the probe card and transporting the tray between the holding position and a replacement position. A separation control unit sequentially executes a process of driving the card transport mechanism to transport the tray to the holding position, a process of releasing the probe card held by the card holding part so that the tray holds the probe card, and a process of driving the card transport mechanism to transport the tray from the holding position to the replacement position, as a separation process. An assembly control unit, when the tray in the replacement position holds a new probe card, sequentially executes a process of driving the card transport mechanism to transport the tray from the replacement position to the holding position, and a process of using the card holding part to hold the probe card, as an assembly process. Thus, both the separation and assembly processes can be automated, enabling fully automated replacement of the detector's probe card.

[0020] In another embodiment of the wafer testing system of the present invention, the detector has a card holder for holding the probe card, and a card transport mechanism transports the probe card and the card holder together between a holding position and a changing position.

[0021] In another embodiment of the wafer testing system of the present invention, the retaining member has a retaining hole for holding the probe card. A roof-mounted automated guided vehicle (AGV) places the probe card into the retaining hole of the retaining member at a replacement position. The wafer testing system includes multiple positioning portions provided at the opening edge of the retaining member forming the retaining hole. Each positioning portion has a guiding surface that guides the probe card into the retaining hole when it is placed there by the AGV. This allows for reliable guidance of the probe card into the retaining hole.

[0022] In another embodiment of the wafer testing system of the present invention, a transport control unit controls a roof-mounted automated guided vehicle (AGV) to perform a retrieval process that moves a probe card from its replacement location to a storage area before replacement, and a loading process that moves a new probe card from its storage area to the replacement location. The wafer testing system includes a human detection sensor that detects intrusions into a pre-defined protection area based on the replacement location. Based on the detection results of the human detection sensor, the transport control unit stops the retrieval process when someone intrudes into the protection area, and similarly stops the loading process when someone intrudes into the protection area. This prevents the roof-mounted AGV from colliding with people.

[0023] In another embodiment of the wafer testing system of the present invention, a transport control unit controls an overhead-mounted unmanned transport vehicle to perform a retrieval process of transporting a probe card from the replacement location to a storage location before replacement, and a loading process of transporting a new probe card from the storage location to the replacement location. The overhead-mounted unmanned transport vehicle has a lifting and holding unit that can be raised and lowered freely and can hold the box or probe card for loading and unloading. The transport control unit performs the following processes as a retrieval process: moving the overhead-mounted unmanned transport vehicle to a position directly above the replacement location; lowering the lifting and holding unit to the replacement location; holding the probe card at the replacement location using the lifting and holding unit; raising the lifting and holding unit; and moving the overhead-mounted unmanned transport vehicle from the position directly above to the storage location. The transport control unit also performs the following processes as a loading process: holding the probe card in the storage location using the lifting and holding unit; moving the overhead-mounted unmanned transport vehicle from the storage location to the position directly above; lowering the lifting and holding unit; releasing the holding of the probe card at the replacement location using the lifting and holding unit; and raising the lifting and holding unit. Therefore, the probe cards of the detector can be replaced automatically using a canopy-mounted unmanned transport vehicle used for box transport.

[0024] In another embodiment of the wafer testing system of the present invention, the wafer testing system includes a card transport mechanism disposed on a detector and transporting probe cards between a holding position held within the detector and a replacement position. The card transport mechanism has a tray capable of holding probe cards and transporting the tray between the holding position and the replacement position. The wafer testing system includes a card sensor disposed on the tray and detecting whether there are probe cards on the tray. When the card sensor detects that there are no probe cards on the tray, the transport control unit performs a process of lowering the lifting holding unit. Correspondingly, when the detection result of the card sensor changes from no probe cards on the tray to probe cards on the tray, the lifting holding unit performs a process of releasing the probe cards and raising the lifting holding unit. This automates the loading process.

[0025] In another embodiment of the wafer testing system of the present invention, the transport track extends in the X direction among mutually orthogonal XYZ directions. The overhead-mounted automated guided vehicle (AGV) has a lifting and holding section that can be freely raised and lowered in the Z direction and adjusted in position within a predetermined movable range in the Y direction. The lifting and holding section can hold the cartridge or probe card for easy loading and unloading. The detector has a loading device positioned in the X direction at a location different from the replacement position, and the overhead-mounted AGV carries the cartridge. Within its movable range in the Y direction, the lifting and holding section can place the cartridge on the loading device and the probe card on the replacement position. Thus, the overhead-mounted AGV for cartridge transport can be used to retrieve probe cards from the replacement position and move probe cards to the replacement position.

[0026] The probe card replacement method for achieving the objectives of this invention replaces the probe card of a detector that includes a suction cup for holding a semiconductor wafer and a probe card with probes, and performs inspection by contacting the probes with multiple semiconductor chips formed on the semiconductor wafer. The probe card replacement method includes: a separation step in which a card transport mechanism of the detector performs a separation process to transport the probe card before replacement from a holding position held within the detector to a pre-set replacement position within the detector; a retrieval step in which a roof-mounted unmanned transport vehicle performs a retrieval process to transport the probe card before replacement, which has been transported to the replacement position, from the replacement position to a storage location for the probe card located outside the detector, wherein the roof-mounted unmanned transport vehicle moves along a transport track while holding a box containing multiple semiconductor wafers, and moves the box containing the multiple semiconductor wafers before inspection into the detector and retrieves the box containing the multiple semiconductor wafers after inspection from the detector; an insertion step in which the roof-mounted unmanned transport vehicle performs an insertion process to transport a new probe card from the storage location to the replacement position; and an assembly step in which the card transport mechanism performs an assembly process to transport a new probe card from the replacement position to the holding position.

[0027] A detector for achieving the purpose of the present invention includes a suction cup for holding a semiconductor wafer and a probe card with probes, and performs semiconductor chip inspection by contacting the probes with multiple semiconductor chips formed on the semiconductor wafer. The detector includes: a card transport mechanism that transports the probe card between a holding position within the detector and a replacement position for replacing the probe card; and a loading device that uses a roof-mounted unmanned transport vehicle to carry a box containing multiple semiconductor wafers. The roof-mounted unmanned transport vehicle is mobile along a transport track extending in the X direction of mutually orthogonal XYZ directions, and has a lifting and holding section that is freely movable in the Z direction and can be adjusted in the Y direction within a predetermined movable range. Within the movable range of the lifting and holding section in the Y direction, the lifting and holding section can place the box on the loading device, and the lifting and holding section can place the probe card at the replacement position. The probe card has a held portion held in the lifting and holding section, and the replacement position is a position where the probe card can be replaced by the roof-mounted unmanned transport vehicle.

[0028] Invention Effects

[0029] This invention can suppress the increase in setup space and automate probe card replacement at low cost. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of a chip testing system.

[0031] Figure 2 This is a schematic diagram of the detector and tester.

[0032] Figure 3 This is a top view of the retainer.

[0033] Figure 4 This is an enlarged view of the multiple positioning parts provided on the retaining element.

[0034] Figure 5 This is a three-dimensional view of the tray that holds the probe card and the card holder.

[0035] Figure 6 This is a top view of the tray.

[0036] Figure 7 This is an illustrative diagram used to explain the separation process when replacing the probe card.

[0037] Figure 8 This is an illustrative diagram used to explain the separation process when replacing the probe card.

[0038] Figure 9 This is an illustrative diagram illustrating the assembly process during probe card replacement.

[0039] Figure 10This is an illustrative diagram illustrating the assembly process during probe card replacement.

[0040] Figure 11 This is a 3D view of the door of the casing when it is switched to the open state.

[0041] Figure 12 This is a 3D view of the door of the shell when it is switched to the closed state.

[0042] Figure 13 This is an explanatory diagram of a laser scanner.

[0043] Figure 14 This is a schematic diagram of the OHT (Out-of-Touch) mechanism for wafer handling.

[0044] Figure 15 This is an explanatory diagram illustrating the conditions that enable the probe card recycling and loading processes performed by the wafer handling mechanism.

[0045] Figure 16 This is a functional block diagram of the detector control unit and the GEM host.

[0046] Figure 17 This is a flowchart illustrating the process of replacing the probe card of a detector performed by a wafer testing system.

[0047] Figure 18 It is used for explanation Figure 17 The diagram illustrates the separation process (replacement instruction) in step S1.

[0048] Figure 19 It is used for explanation Figure 17 The diagram illustrates the separation process (pallet handling) in step S1.

[0049] Figure 20 It is used for explanation Figure 1 The diagram shown in 7 illustrates the separation process of step S1 (starting the switch to the open state of the door).

[0050] Figure 21 It is used for explanation Figure 17 The diagram illustrates the separation process (emergency stop of the door opening and closing mechanism) in step S1.

[0051] Figure 22 It is used for explanation Figure 17 The diagram illustrates the separation process (the door opening and closing mechanism restarts) in step S1.

[0052] Figure 23 It is used for explanation Figure 17 The diagram illustrates the separation process (replacement preparation completion notification) in step S1.

[0053] Figure 24This is an explanatory diagram illustrating the recovery process (lowering of the lifting and holding part) in step S2 of step 17.

[0054] Figure 25 This is an explanatory diagram illustrating the recovery process (lifting of the lifting and holding part) in step S2 of step 17.

[0055] Figure 26 This is an explanatory diagram illustrating the loading process (transfer of the probe card) in step S3 shown in 17.

[0056] Figure 27 This is an explanatory diagram illustrating the loading process (lowering of the lifting and holding unit) of step S3 shown in 17.

[0057] Figure 28 This is an explanatory diagram used to illustrate the loading process (lifting of the lifting and holding part) of step S3 shown in 17.

[0058] Figure 29 This is an explanatory diagram illustrating the assembly process (assembly instruction) of step S4 shown in 17.

[0059] Figure 30 This is an explanatory diagram illustrating the assembly process (starting the switch to the closed state of the door) of step S4 shown in 17.

[0060] Figure 31 This is an explanatory diagram illustrating the assembly process (reading information, authentication result) of step S4 shown in 17.

[0061] Figure 32 This is an explanatory diagram illustrating the assembly process (probe card assembly) of step S4 shown in 17.

[0062] Figure 33 This is an explanatory diagram illustrating the assembly process (movement of the suction cup) in step S4 shown in 17.

[0063] Figure 34 This is an explanatory diagram illustrating the assembly process (replacement completion notification) of step S4 shown in 17.

[0064] Explanation of reference numerals in the attached figures

[0065] 2. Wafer Testing System

[0066] 10 detectors

[0067] 11 Tester

[0068] 12 Laser Scanners

[0069] 14. Chip handling mechanism

[0070] 16 GEM Host

[0071] 18 Network

[0072] 20 bases

[0073] 21 Loading equipment

[0074] 22 suction cups

[0075] 24. Suction Cup Moving Mechanism

[0076] 26. Card holding section

[0077] 28. Locking and retaining components

[0078] 30 probe cards

[0079] 30a probe

[0080] 30b Retaining part

[0081] 32-card handling mechanism

[0082] 34. Shell

[0083] 34a Opening

[0084] 35 doors

[0085] 36 Connecting parts

[0086] 38 card retention holes

[0087] 40 Positioning Section

[0088] 40a Guide surface

[0089] 42 pallets

[0090] 44 Retaining member retaining hole

[0091] 46 Retaining element sensor

[0092] 48-card sensor

[0093] 49-door opening and closing mechanism

[0094] 50 Storage locations

[0095] 52 Transport Track

[0096] 54a Lifting and Holding Section

[0097] 58 Detector Control Unit

[0098] 60. Transceiver Control Department

[0099] 62 Inspection and Control Department

[0100] 64 Separation Control Unit

[0101] 66 Assembly Control Department

[0102] 68 Scanner Control Unit

[0103] 70-door opening and closing control unit

[0104] 80. Check the start control unit

[0105] 82 Separation Process Start Control Unit

[0106] 84 Recycling Control Department

[0107] 86 Moving into Control Department

[0108] 88 Assembly Processing Start Control Section

[0109] 90 Certification Control Department

[0110] A Difference

[0111] C1 Center Location

[0112] C2 Center Location

[0113] CS box

[0114] H people

[0115] PA protected area

[0116] T1 Replacement Instruction

[0117] T2 Replacement Preparation Complete Notification

[0118] T3 Assembly Instructions

[0119] T4 Read Information

[0120] T5 certification results

[0121] W Semiconductor wafer

[0122] WA Warning Area

[0123] Y0 Assembly position

[0124] Y1 Check location

[0125] Y2 Tray Switch Position

[0126] Y3 connection position

[0127] ΔY is the range of motion. Detailed Implementation

[0128] [Overall Structure of the Wafer Testing System]

[0129] Figure 1 This is a schematic diagram of chip testing system 2. (As shown...)Figure 1 As shown, the wafer testing system 2 automatically checks the electrical characteristics of each semiconductor chip (not shown) of the semiconductor wafer W using the detector 10 described later. Additionally, the wafer testing system 2 automatically replaces the probe card 30 of the detector 10.

[0130] The wafer testing system 2 generally includes a detector 10 and a tester 11 (see reference). Figure 2 The system includes a laser scanner 12, a wafer handling mechanism 14, and a GEM host 16, which serves as a GEM (Generic Model for Communications and Control of Manufacturing Equipment) computer. It should be noted that the wafer testing system 2 is equipped with multiple detectors 10 (see reference...). Figure 14 ).

[0131] Each detector 10, the wafer transport mechanism 14, and the GEM host 16 are interconnected via a known network 18. It should be noted that the network 18 actually connecting the detectors 10 and the GEM host 16 is different from the network 18 connecting the wafer transport mechanism 14 and the GEM host 16 (see [reference]). Figure 16 Additionally, each detector 10 is connected to the wafer transport mechanism 14 (OHT54) via an I / O interface 19 (according to SEMI-E48) (see reference). Figure 16 Additionally, the laser scanner 12 is connected to the detector 10 and, via the detector 10 and the network 18, to the GEM host 16.

[0132] [detector]

[0133] Figure 2 This is a schematic diagram of detector 10 and tester 11. It should be noted that in the mutually orthogonal XYZ directions in the diagram, the XY direction is the horizontal direction, and the Z direction is the vertical direction. For example... Figure 2 As shown, the detector 10 generally includes a base 20 and a load port 21 (see reference). Figure 13 The detector 10 includes a suction cup 22, a suction cup moving mechanism 24, a retaining part 26, a retaining member 28, a probe card 30, a card transport mechanism 32, and a housing 34 for housing them. It should be noted that the detailed structure of the detector 10 is known technology (for example, see Japanese Patent Application Publication No. 2018-117096), therefore only a part of the structure of the detector 10 will be described here.

[0134] On the base 20, the suction cup 22 is held movable in each of the XYZ directions and is held to rotate freely in the θ direction about an axis parallel to the Z direction. Additionally, on the base 20, the card handling mechanism 32 is held movable freely in the Y direction.

[0135] In loading device 21 (refer to) Figure 13 Using the OHT54 of the wafer transport mechanism 14 (described later), a cassette CS containing multiple semiconductor wafers W to be inspected is placed. It should be noted that, although not shown in the diagram, the detector 10 is equipped with a transport mechanism that moves the semiconductor wafers W between the loading device 21 and the suction cup 22.

[0136] The semiconductor wafer W is held on the upper surface of the suction cup 22 using various holding methods such as vacuum adsorption. A temperature adjustment section (not shown) is provided inside the suction cup 22 for adjusting the temperature of the semiconductor wafer W.

[0137] Furthermore, a connecting portion 36 is provided on the suction cup 22, opposite to the card transport mechanism 32 described later. The connecting portion 36 is used to connect the suction cup 22 and the card transport mechanism 32. The connecting portion 36 is stored inside the suction cup 22 except when the probe card 30 is being replaced, and protrudes from the side of the suction cup 22 in the Y direction to connect with the card transport mechanism 32 during the replacement of the probe card 30. Thus, the suction cup 22 and the card transport mechanism 32 can move as a unit when the probe card 30 is being replaced. It should be noted that the connecting portion 36 may also be omitted, and the suction cup 22 and the card transport mechanism 32 may always move as a unit.

[0138] The suction cup moving mechanism 24 is a known actuator, such as a motor. This suction cup moving mechanism 24 can move the suction cup 22 along the XYZθ direction. This allows the semiconductor wafer W held on the suction cup 22 to move relative to the probe 30a (described later) along the XYZθ direction. Furthermore, when the probe card 30 is replaced, the suction cup moving mechanism 24 moves the suction cup 22 and the card transport mechanism 32 together along the Y direction. It should be noted that a mechanism for moving the card transport mechanism 32 can also be provided separately from the suction cup moving mechanism 24.

[0139] The retaining part 26 (also called the head carrier) is positioned above the suction cup 22 in the Z direction and holds the retaining member 28 in a position that allows for easy loading and unloading. The retaining member 28 holds the outer periphery of the probe card 30. Thus, the retaining part 26 can hold the probe card 30 in a position that allows for easy loading and unloading by means of the retaining member 28.

[0140] Figure 3 This is a top view of the retainer 28. Figure 4 This is an enlarged view of the plurality of positioning parts 40 provided on the retaining member 28.

[0141] likeFigure 3 as well as Figure 4 As shown, the card holder 28 has a card holder hole 38 for holding the outer periphery of the probe card 30. In addition, the card holder 28 has a plurality of positioning portions 40 provided at intervals along the opening edge forming the card holder hole 38.

[0142] Each positioning part 40 is configured such that, when the probe card 30 is placed in the card holding hole 38 via the OHT54 described later (see reference 40), Figure 27 The guide surface 40a guides the probe card 30 towards the retaining hole 38. The guide surface 40a is an inclined surface whose lower end in the Z direction is located on the opening edge of the retaining hole 38, and which is inclined in a manner that gradually moves away from the retaining hole 38 in the horizontal direction as it tends to move upward in the Z direction. As a result, the probe card 30 can be guided towards the retaining hole 38 along the guide surface 40a of each positioning part 40.

[0143] return Figure 2 The probe card 30 has probes 30a arranged accordingly to the configuration of electrode pads on which multiple semiconductor chips (not shown) are formed on the semiconductor wafer W. Additionally, a lifting and holding portion 54a (see reference 54a) is provided on the upper surface of the probe card 30, which constitutes the OHT54 of the wafer transport mechanism 14 described later. Figure 1 The held part 30b is held in place. Furthermore, the probe card 30 is provided with a connection terminal (not shown) that is electrically connected to the probe 30a, and the tester 11 is connected to this connection terminal.

[0144] The tester 11 supplies various test signals to the electrode pads of each semiconductor chip on the semiconductor wafer W via the connection terminals of the probe card 30 and the probe 30a, and receives and analyzes the signals output from the electrode pads to check (test) whether the semiconductor chips are operating normally. It should be noted that the structure and testing method of the tester 11 are known technologies, so detailed descriptions are omitted.

[0145] Such probe cards 30 for inspecting semiconductor chips are replaced, for example, depending on the type of semiconductor chip or after a predetermined number of inspections. In the wafer testing system 2 of this embodiment, the probe cards 30 are automatically replaced using the suction cup moving mechanism 24 described above, the card transport mechanism 32 described later, and the wafer transport mechanism 14 described later. The term "replacement of probe cards 30" here also includes the case where a new probe card 30 is installed on the detector 10 when the detector 10 is not equipped with a probe card 30, but in this embodiment, the case where the probe card 30 that has been held in the card holding part 26 before replacement is replaced with a new probe card 30 is described as an example.

[0146] During probe card 30 replacement, the card transport mechanism 32, together with the suction cup moving mechanism 24, performs a separation process to transport the card holder 28 and the original probe card 30 as a whole from the "holding position" to the "replacement position," and an assembly process to transport the card holder 28 and the new probe card 30 as a whole from the "replacement position" to the "holding position." The holding position is where the probe card 30 and the card holder 28 are held by the card holder 26. The replacement position is the position in the detector 10 where the probe card 30 is replaced; more specifically, it is the position where the OHT54 (see below) can be used to replace the probe card. Figure 1 The location for retrieval and insertion of probe card 30 (refer to...) Figure 8 ).

[0147] The card handling mechanism 32 is connected to the suction cup 22 via the previously described connecting part 36 during the replacement of the probe card 30 (see reference). Figure 7 This allows the card holder 28 and the probe card 30 to be moved together between the holding position and the changing position.

[0148] Card transport mechanism 32 holds the generally flat tray 42, which is capable of holding (supporting) the probe card 30 and the card holder 28, in a folded state parallel to the XZ plane (see reference). Figure 2 ) and the upright state parallel to the XY plane (refer to Figure 7 The pallet 42 can be moved freely. Furthermore, the pallet handling mechanism 32 keeps the upright pallet 42 able to move freely up and down in the Z direction (see reference). Figure 7 ).

[0149] Figure 5 This is a perspective view of the tray 42 that holds (supports) the probe card 30 and the card holder 28. Figure 6 This is a top view of tray 42. (Example) Figure 5 as well as Figure 6 As shown, the tray 42 has a retainer retaining hole 44 for holding the outer periphery of the card retainer 28, and holds the card retainer 28 in the upright state described above using the retainer retaining hole 44. Thus, the tray 42 holds the probe card 30 and the card retainer 28 together.

[0150] The tray 42 is equipped with multiple retainer sensors 46 for detecting the presence or absence of the retainer 28 and multiple card sensors 48 for detecting the presence or absence of the probe card 30. Each retainer sensor 46 is, for example, a press-type (or pressure-sensitive) sensor mounted on the bottom surface of the retainer retaining hole 44. When the retainer 28 is held in the retainer retaining hole 44, each retainer sensor 46 changes its sensor output value by being pressed by the retainer 28. Thus, the presence or absence of the retainer 28 on the tray 42 can be detected based on the sensor output values ​​of each retainer sensor 46.

[0151] Each card sensor 48 is, for example, a press-type sensor disposed inside the retainer retaining hole 44. The sensor head of each card sensor 48 protrudes upward in the Z-direction from inside the card retaining hole 38 when the card retainer 28 is held in the retainer retaining hole 44. Therefore, when the probe card 30 is held in the card retaining hole 38, each card sensor 48 changes its sensor output value by being pressed by the card retainer 28. Thus, the presence or absence of the probe card 30 on the tray 42 can be detected based on the sensor output values ​​of each card sensor 48.

[0152] Figure 7 as well as Figure 8 This is an explanatory diagram illustrating the separation process during the replacement of probe card 30. It should be noted that... Figure 7 as well as Figure 8 (To be continued) Figure 9 as well as Figure 10 In order to avoid complicating the accompanying drawings, the internal structure of the detector 10 and the probe card 30 are described in a simplified manner. The size of the probe card 30 and the card holder 28 is emphasized compared to the tray 42, so as to clearly show that the probe card 30 and the card holder 28 are transported using the tray 42.

[0153] like Figure 7 As shown by reference numeral 7A in the attached drawing, before the separation process begins, the suction cup 22 is positioned vertically below the card holding part 26, i.e., inspection position Y1. Meanwhile, the card transport mechanism 32 is positioned in the replacement position. Furthermore, the tray 42 of the card transport mechanism 32 is switched to a folded-down state.

[0154] like Figure 7 As shown by reference numeral 7B in the attached drawing, when the separation process begins, the suction cup moving mechanism 24 moves the suction cup 22 to the connection position Y3. The connection position Y3 is adjacent to the replacement position and is where the suction cup 22 can be connected to the card transport mechanism 32. Then, the connecting part 36 protrudes from the side of the suction cup 22 in the Y direction and connects with the card transport mechanism 32. As a result, the suction cup 22 and the card transport mechanism 32 can move integrally in the Y direction.

[0155] like Figure 7 As shown by reference numeral 7C in the attached drawing, after the suction cup 22 and the card transport mechanism 32 are connected, the suction cup moving mechanism 24 moves the suction cup 22 to the tray switching position Y2 between the inspection position Y1 and the connection position Y3. After this movement is completed, the card transport mechanism 32 switches the tray 42 from the folded state to the upright state.

[0156] like Figure 7As shown by reference numeral 7D in the attached drawing, after the tray 42 is switched to the upright state, the suction cup moving mechanism 24 moves the suction cup 22 to the separation / assembly position Y0. This separation / assembly position Y0 is the position where the tray 42 is positioned vertically below the retaining part 26, more specifically, where the retainer retaining hole 44 of the tray 42 aligns with the retaining member 28 held in the retaining part 26. After this movement is completed, the card transport mechanism 32 raises the tray 42, transporting it to a position where it contacts the retaining member 28 held by the retaining part 26. Thus, the retaining member 28 is held within the retainer retaining hole 44 of the tray 42, and the probe card 30 is held by means of this retaining member 28.

[0157] like Figure 8 As shown by reference numeral 8A in the attached drawing, when the probe card 30 and the card holder 28 held by the tray 42 and the holding of the card holder 28 by the card holder part 26 are released, the sensor output values ​​of each holder sensor 46 and the output values ​​of each card sensor 48 change. Thus, the probe card 30 and the card holder 28 are held by the tray 42.

[0158] like Figure 8 As shown by reference numeral 8B in the attached drawing, when the holding of the card holder 28 by the card holder 26 is released, the card transport mechanism 32 lowers the tray 42.

[0159] like Figure 8 As shown by reference numeral 8C in the attached drawing, when the descent of the tray 42 is complete, the suction cup moving mechanism 24 moves the suction cup 22 to the connection position Y3. This moves the tray 42 of the card transport mechanism 32 to the replacement position, thereby also moving the probe card 30 and the card holder 28 to the replacement position. It should be noted that a door 35, described in detail later, is provided in front of the replacement position. Therefore, when the suction cup moving mechanism 24 moves the tray 42 toward the replacement position, it temporarily stops the transport of the tray 42 in front of the door 35, and resumes the transport of the tray 42 after the door 35 opens (see later description). Figure 22 The probe card 30 is transported to the replacement location via tray 42, thereby enabling the retrieval from tray 42 before replacement by OHT54 (described later). Figure 25 ) and the transfer of the new probe card 30 to the tray 42 by the OHT54 (see reference) Figure 27 ).

[0160] Figure 9 as well as Figure 10 This is an explanatory diagram illustrating the assembly process during the replacement of probe card 30.

[0161] like Figure 9As shown by reference numeral 9A in the attached drawing, when the new probe card 30 is held in place by the card holder 28 on the tray 42 at the replacement position, as Figure 9 As shown by reference numeral 9B in the attached drawing, the suction cup moving mechanism 24 moves the suction cup 22 to the separation / assembly position Y0. This adjusts the position of the tray 42, probe clip 30, and clip retainer 28 to be vertically below the clip retainer 26. Then, the clip transport mechanism 32 raises the tray 42. This causes the clip retainer 28 and probe clip 30, held on the tray 42, to rise as well.

[0162] like Figure 9 As shown by reference numeral 9C in the attached drawing, the rise of the tray 42 by the card transport mechanism 32 continues until the card holder 28 reaches the card holder portion 26 (holding position). Thus, the tray 42, probe card 30, and card holder 28 are transported from the changing position to the holding position, and the card holder portion 26 holds the card holder 28 when this transport is complete. As a result, a new probe card 30 is fitted into the card holder portion 26 by means of the card holder 28.

[0163] like Figure 10 As indicated by reference numeral XA in the attached drawing, when the card retaining part 26 holds the card retaining member 28, the card transport mechanism 32 lowers the tray 42. As a result, the holding of the card retaining member 28 by the tray 42 is released.

[0164] like Figure 10 As indicated by reference numeral XB in the attached diagram, when the descent of the tray 42 is complete, the suction cup moving mechanism 24 moves the suction cup 22 to the tray switching position Y2. After this movement is completed, the card handling mechanism 32 switches the tray 42 from the upright state to the folded state.

[0165] like Figure 10 As indicated by reference numeral XC in the attached diagram, after switching to the folded-over state of the tray 42, the suction cup moving mechanism 24 moves the suction cup 22 to the connection position Y3. Then, the connection part 36 is housed inside the suction cup 22, thereby disengaging the suction cup 22 from the card transport mechanism 32. As a result, the card transport mechanism 32 is positioned in the changeover position before the separation process begins.

[0166] like Figure 10 As indicated by reference numeral XD in the attached drawing, when the connection between the suction cup 22 and the card transport mechanism 32 is released, the suction cup moving mechanism 24 moves the suction cup 22 to the inspection position Y1. Thus, the assembly process is completed.

[0167] Figure 11 This is a 3D view of the door 35 of the housing 34 when switched to the open state. Figure 12 This is a perspective view of door 35 of housing 34 in its closed state. (See image below.) Figure 11 as well as Figure 12As shown, the housing 34 has an opening 34a that exposes the tray 42, etc., which is moved to the replacement position, to the outside. It should be noted that, in this embodiment, a portion of the tray 42, etc., which is moved to the replacement position, protrudes from the opening 34a to the outside of the housing 34.

[0168] The housing 34 is rotatably provided with an open state that can be switched to open the opening 34a (see reference). Figure 11 ) and the closed state covering the opening 34a (refer to Figure 12 The door 35 is opened and closed using a door opening and closing mechanism 49 (see reference) consisting of a known actuator such as a motor. Figure 16 The door opening and closing mechanism 49 switches the door 35 to the open state during the separation process before the tray 42 is moved to the replacement position. Additionally, during the assembly process, the door opening and closing mechanism 49 switches the door 35 to the closed state after the tray 42 is housed inside the housing 34.

[0169] [Laser Scanner]

[0170] Figure 13 This is an explanatory diagram of the laser scanner 12. (As shown...) Figure 13 And as already stated Figure 1 As shown, the laser scanner 12 is equivalent to the human detection sensor of the present invention and is disposed near the door 35 (opening 34a) of the detector 10. This laser scanner 12, for example, emits and scans infrared laser light, and detects the distance of the human H by detecting the infrared laser light reflected from the human H, who is the object being detected. By adjusting the position of the laser scanner 12 and the scanning range of the infrared laser, it is possible to detect intrusions by human H into the pre-defined protection zone PA and warning zone WA, based on the position change and the position of the door 35.

[0171] The protected area PA is the area within which there is a possibility that a person H may collide with the opening and closing door 35 or have their hand caught in the opening and closing door; that is, the area within which there is danger when a person H intrudes during the opening and closing of the door 35.

[0172] The warning zone WA is set outside the protected zone PA and is used to warn individuals H who may intrude into the protected zone PA. It should be noted that the setting of the warning zone WA can also be omitted.

[0173] The detection signal output from the laser scanner 12 is input to the detector 10, and then input to the GEM host 16 (described later) via the detector 10 and the network 18.

[0174] [Wasteel Handling Organization]

[0175] Figure 14This is a schematic diagram of the OHT54 of the wafer handling mechanism 14. (As shown...) Figure 14 And as already stated Figure 1 As shown, the wafer handling mechanism 14 has multiple detectors 10 arranged in a two-dimensional configuration along the XY direction and a designated storage location 50 (see reference). Figure 1 The wafer transport mechanism 14 transports a cassette CS containing multiple semiconductor wafers W between multiple detectors 10. Specifically, the wafer transport mechanism 14 performs the following actions for each of the multiple detectors 10: the loading (also called loading) of the cassette CS containing multiple semiconductor wafers W before inspection relative to the detector 10, and the unloading (also called unloading) of the cassette CS containing multiple semiconductor wafers W after inspection from the detector 10.

[0176] The wafer handling mechanism 14 includes multiple handling tracks 52 and multiple overhead-mounted unmanned transport vehicles (OHTs) 54. Each handling track 52 extends along the X direction and multiple tracks are arranged along the Y direction in the overhead structure of the semiconductor manufacturing process (not shown). That is, the handling tracks 52 are arranged for each column of detectors 10 arranged along the X direction. More specifically, when viewed from above in the Z direction, the handling tracks 52 are arranged in the overhead structure for each column of detectors 10 in a manner that intersects with the loading devices 21 of each detector 10 within the column.

[0177] One end of each transport track 52 is connected to a storage location 50. This storage location 50 stores multiple boxes CS containing multiple semiconductor wafers W before inspection, and also stores multiple probe cards 30 of various types corresponding to the types of semiconductor chips in the semiconductor wafers W. It should be noted that the storage location 50 for the boxes CS and the storage location 50 for the probe cards 30 can also be located in different locations.

[0178] Each OHT54 is provided for each transport track 52 and travels along the transport track 52. Therefore, each OHT54 can move freely in the X direction. Thus, the OHT54 can move towards a position directly above (including approximately directly above) the loading device 21 of each detector 10 in each column of the detector 10. In addition, each OHT54 is equipped with a lifting and holding part 54a that can be raised and lowered freely in the Z direction (vertical direction) and can be adjusted in position in the Y direction.

[0179] The lifting and holding unit 54a can release and hold the box CS containing multiple semiconductor wafers W when the box CS is placed or retrieved relative to the loading device 21.

[0180] During the loading of the case CS onto the loading device 21, after the OHT 54 moves to the storage location 50, the lifting and holding section 54a is lowered to hold the case CS. Next, the OHT 54 raises the lifting and holding section 54a, which holds the case CS, and moves it to a position directly above the loading device 21 of the detector 10 designated by the GEM host 16 (described later). Then, after the OHT 54 lowers the lifting and holding section 54a to place the case CS onto the loading device 21, the holding of the case CS by the lifting and holding section 54a is released. Thus, the case CS, i.e., the multiple semiconductor wafers W before inspection, can be transported from the storage location 50 to the loading device 21.

[0181] When the cassette CS is retrieved from the loading device 21, after the OHT 54 moves to a position directly above the loading device 21 of the detector 10 to be retrieved, the lifting and holding section 54a is lowered to hold the cassette CS mounted on the loading device 21. Next, the OHT 54 raises the lifting and holding section 54a holding the cassette CS and moves it to the storage location 50. Then, after the OHT 54 lowers the lifting and holding section 54a to the storage location 50, the holding of the cassette CS by the lifting and holding section 54a is released. Thus, the cassette CS, i.e., the multiple inspected semiconductor wafers W, can be moved from the loading device 21 to the storage location 50.

[0182] This wafer handling mechanism 14 is used not only for loading and recycling the housing CS, but also for replacing the probe card 30. Specifically, the wafer handling mechanism 14 performs a recycling process for each of the plurality of detectors 10, which involves recovering the probe card 30 before replacement from the tray 42 that has been transported to the replacement position through a separation process and transporting it to the storage location 50, and a loading process for transporting the new probe card 30 from the storage location 50 to the tray 42 located at the replacement position before the assembly process. At this time, each detector 10 adjusts the center position of the loading device 21 and the replacement position of the tray 42 to enable the recovery and loading processes of the probe card 30 performed by the wafer handling mechanism 14.

[0183] Figure 15 This is an explanatory diagram illustrating the conditions under which the probe card 30 can be retrieved and loaded by the wafer transport mechanism 14. It should be noted that a single detector 10 is used as an example for this explanation.

[0184] As already described, the OHT54 moves along the transport track 52, thus allowing free movement in the X direction. On the other hand, the lifting and holding section 54a of the OHT54 can be adjusted in the Y direction, but its range of motion ΔY is limited (e.g., to a few tens of millimeters). Furthermore, when each detector 10 is installed in the semiconductor manufacturing process, there is a possibility of setting errors in the XY directions. Therefore, as... Figure 15 As shown, in order to enable the retrieval and loading processes of the probe card 30 performed by the wafer handling mechanism 14, the center position C1 of the loading device 21 of each detector 10 in the above column and the center position C2 of the tray 42 (holding hole 44) located at the replacement position need to be arranged in a roughly straight line along the X direction.

[0185] Therefore, in this embodiment, the center positions C1 and C2 of each detector 10 are adjusted such that the center position C1 of each detector 10 converges within the movable range ΔY in the Y direction of the housing CS held by the lifting and holding unit 54a, and the center position C2 of each detector 10 converges within the movable range ΔY in the Y direction of the probe card 30 held by the lifting and holding unit 54a. The setting position of each detector 10 is also adjusted. Thus, within its movable range in the Y direction, the lifting and holding unit 54a can place the housing CS onto the loading device 21 and can place the probe card 30 into the replacement position. It should be noted that the higher the setting position accuracy of each detector 10, i.e., the position accuracy of the center position C1, the greater the difference A between the center position C1 and the center position C2 can be; conversely, the lower the position accuracy of the center position C1, the greater the need to reduce the difference A.

[0186] In this way, for each column of detectors 10, the center positions C1 and C2 of each detector 10 in the column are arranged approximately on the same straight line in the X direction, thereby allowing the position of the lifting and holding part 54a of the OHT54 to be adjusted to be directly above the center position C2. Therefore, the lifting and holding part 54a can be lowered to hold the held part 30b of the probe card 30. As a result, the OHT54 can be used to retrieve the probe card 30 before replacement from the card holder 28 on the tray 42, or to place a new probe card 30 in the card holder hole 38 of the card holder 28 on the tray 42. Consequently, the retrieval and loading processes of the probe card 30 performed by the wafer transport mechanism 14 can be realized.

[0187] It should be noted that, in this embodiment, in order to hold the probe card 30 using the lifting and holding part 54a of the OHT54 for replacing (recovering, placing) the case CS, the holding part 30b of the probe card 30 is adjusted to a shape and configuration that can be held by the lifting and holding part 54a. For example, the holding part 30b of the probe card 30 may be common to the holding part of the case CS (not shown).

[0188] [Detector Control Unit]

[0189] Figure 16 This is a functional block diagram of the detector control unit 58 of detector 10 and the GEM host 16. (See diagram below.) Figure 16 As shown, in addition to the parts already described, the detector 10 is also provided with a detector control unit 58.

[0190] The detector control unit 58, under the control of the GEM host 16 (described later), comprehensively controls the operation of the detector 10 and includes arithmetic circuits composed of various processors and memory. These processors include CPUs (Central Processing Units), GPUs (Graphics Processing Units), ASICs (Application Specific Integrated Circuits), and programmable logic devices (such as SPLDs (Simple Programmable Logic Devices), CPLDs (Complex Programmable Logic Devices), and FPGAs (Field Programmable Gate Arrays)). It should be noted that the various functions of the detector control unit 58 can be implemented by a single processor or by multiple processors of the same or different types.

[0191] The detector control unit 58 is connected to a tester 11, a suction cup moving mechanism 24, a card transport mechanism 32, a retainer sensor 46, a card sensor 48, and a door opening and closing mechanism 49, and is also connected to a laser scanner 12 via a connection interface not shown. Furthermore, the detector control unit 58 is connected to the GEM host 16 via a communication interface not shown and a network 18.

[0192] The detector control unit 58 executes the control program read from the storage unit (not shown), thereby functioning as the transceiver control unit 60, the inspection control unit 62, the separation control unit 64, the assembly control unit 66, the scanner control unit 68, and the door opening and closing control unit 70.

[0193] During the replacement of probe card 30, the transceiver control unit 60 exchanges various information with the GEM host 16 via network 18. For example, the transceiver control unit 60 receives a "replacement instruction" for probe card 30 from the GEM host 16 before the separation process begins. Additionally, the transceiver control unit 60 sends a "replacement preparation completed notification" to the GEM host 16 after the separation process is completed. Furthermore, the transceiver control unit 60 receives a "start instruction for assembly process" from the GEM host 16 after the loading process performed by OHT54 is completed.

[0194] Additionally, after the door 35 is switched to the closed state during the assembly process, the transceiver control unit 60 sends the information from the probe card 30 to the GEM host 16 to obtain the "read information" of the probe card 30 (see reference). Figure 31 Additionally, the transceiver control unit 60 receives the "authentication result" of the probe card 30 sent from the GEM host 16 in response to the transmission of "read information". Furthermore, after the assembly process is completed, the transceiver control unit 60 sends a "replacement completion notification" of the probe card 30 to the GEM host 16.

[0195] Furthermore, during the insertion process of the probe card 30 (especially during the lifting and lowering of the lifting and holding unit 54a), the transceiver control unit 60 outputs the sensor output values ​​of both the holding member sensor 46 and the card sensor 48 to the GEM host 16. It should be noted that the output values ​​of each sensor can be continuously output to the GEM host 16.

[0196] Furthermore, during the operation of the laser scanner 12, the transceiver control unit 60 transmits the detection signal output from the laser scanner 12 to the GEM host 16 via the network 18. It should be noted that the transceiver control unit 60 also exchanges various information (such as inspection instructions for the semiconductor wafer W) with the GEM host 16 at times other than when the probe card 30 is being replaced, but these are known technologies, so specific descriptions are omitted here.

[0197] Under the control of the GEM host 16, the inspection control unit 62 controls the tester 11 and the suction cup moving mechanism 24 to perform the alignment of the semiconductor wafer W held on the suction cup 22 with the probe 30a, the contact of the probe 30a with the semiconductor chip of the semiconductor wafer W, and the test performed by the tester 11.

[0198] Under the control of the GEM host 16, the separation control unit 64 controls the suction cup moving mechanism 24, the connecting part 36, the card transport mechanism 32, and the card holding part 26, and performs the aforementioned functions. Figure 7 as well as Figure 8 The separation process is shown. Additionally, after the separation process is completed, the separation control unit 64 sends a "replacement preparation complete notification" from the transceiver control unit 60 to the GEM host 16 via the network 18.

[0199] Under the control of the GEM host 16, the assembly control unit 66 controls the suction cup moving mechanism 24, the connecting part 36, the card transport mechanism 32, and the card holding part 26, and performs the aforementioned functions. Figure 9 as well as Figure 10 The assembly process is shown. Additionally, during the assembly process, the assembly control unit 66 reads information from the probe card 30 using a known method and sends this "read information" from the transceiver control unit 60 to the GEM host 16 via the network 18. Furthermore, after the assembly process is completed, the assembly control unit 66 sends a "replacement completion notification" from the transceiver control unit 60 to the GEM host 16 via the network 18.

[0200] During the period from the start of the switch from the open state of the door 35 via the door opening / closing mechanism 49 during the separation process to the end of the switch from the closed state of the door 35 via the door opening / closing mechanism 49 during the assembly process, the scanner control unit 68 continuously detects intrusions of any person H into the protected area PA and the warning area WA using the laser scanner 12. It should be noted that the laser scanner 12 can also perform detection continuously.

[0201] When the tray 42 is moved to the door 35 during the separation process, the door opening and closing control unit 70 drives the door opening and closing mechanism 49 to switch the door 35 from the closed state to the open state. Conversely, when the tray 42 is stored inside the housing 34 during the assembly process, the door opening and closing control unit 70 drives the door opening and closing mechanism 49 to switch the door 35 from the open state to the closed state.

[0202] During the opening and closing of the door 35 by the door opening and closing mechanism 49, the door opening and closing control unit 70 acquires the detection signal input from the laser scanner 12. Furthermore, based on the detection result of the laser scanner 12, the door opening and closing control unit 70 stops the operation of the door opening and closing mechanism 49 if a person H intrudes into the protected area PA. Thus, the opening and closing of the door 35 can be stopped before the door 35 collides with a person or before a hand (finger) is pinched.

[0203] Furthermore, the door opening and closing control unit 70 continuously stops the operation of the door opening and closing mechanism 49 while a person H intrudes into the protected area PA. Moreover, based on the detection results of the laser scanner 12, the door opening and closing control unit 70 restarts the operation of the door opening and closing mechanism 49 accordingly, switching from an intrusion by a person H into the protected area PA to an intrusion by no person H into the protected area PA.

[0204] [GEM Hosting]

[0205] The GEM host 16 provides overall control over the operation of multiple detectors 10 and multiple OHT54, and includes arithmetic circuits composed of various processors and memory. It should be noted that the various functions of the GEM host 16 can be implemented by a single processor, or by multiple processors of the same or different types. Furthermore, as long as the operation of multiple detectors 10 and multiple OHT54 can be controlled comprehensively, control devices other than the GEM host 16 can also be used.

[0206] The GEM host 16 executes a control program read from a storage unit not shown, thereby functioning as an inspection start control unit 80, a separation process start control unit 82, a recycling control unit 84, a loading control unit 86, an assembly process start control unit 88, and an authentication control unit 90.

[0207] After the case CS is moved from storage location 50 to loading device 21 of detector 10 by OHT 54, the inspection start control unit 80 outputs an inspection instruction for semiconductor wafer W to detector 10 via network 18. This inspection instruction is input to inspection control unit 62 via transceiver control unit 60. Inspection control unit 62 then controls tester 11 and suction cup moving mechanism 24 to perform semiconductor chip testing on semiconductor wafer W.

[0208] At the designated replacement time for replacing the probe card 30, the separation process start control unit 82 outputs a replacement instruction for the probe card 30 to the transceiver control unit 60 of the detector 10 via the network 18. This replacement instruction is input to the separation control unit 64 and the door opening / closing control unit 70 via the transceiver control unit 60. As a result, the separation control unit 64 controls the suction cup moving mechanism 24, the connecting part 36, the card transport mechanism 32, and the card holding part 26 to perform the separation process, and sends a "replacement preparation completed notification" from the transceiver control unit 60 to the GEM host 16 upon completion of the separation process. Additionally, the door opening / closing control unit 70 activates the door opening / closing mechanism 49 midway through the separation process to switch the door 35 to the open state.

[0209] It should be noted that the timing of replacing the probe card 30 can be exemplified by the following: when the type of semiconductor chip of the semiconductor wafer W to be inspected is changed, when the probe card 30 has been used more than a specified number of times, and when the operator manually inputs a replacement instruction for the probe card 30 into the GEM host 16.

[0210] The recycling control unit 84 and the loading control unit 86 constitute the transport control unit of the present invention, and control the OHT54 of the wafer transport mechanism 14 to perform transport between the replacement position of the probe card 30 and the storage location 50.

[0211] When the "replacement preparation complete notification" is input from the transceiver control unit 60 via the network 18, the recovery control unit 84 controls the OHT 54 to begin the recovery process. Specifically, the recovery control unit 84 sequentially performs the following operations: moving the OHT 54 to a position directly above the replacement position; lowering the lifting and holding unit 54a to the replacement position; holding the probe card 30 by the lifting and holding unit 54a; raising the lifting and holding unit 54a; and transporting the probe card 30 to the storage location 50 by the OHT 54.

[0212] After the recycling process is completed, the loading control unit 86 controls the OHT 54 to start the loading process. Specifically, the loading control unit 86 initially performs a process of using the OHT 54 to move the probe card 30 corresponding to the semiconductor wafer W to be inspected from the storage location 50 to a position directly above the replacement location.

[0213] Next, the loading control unit 86, based on the sensor output value of the card sensor 48 input from the transceiver control unit 60 via network 18, performs a descent process of the lifting and holding unit 54a to the replacement position (tray 42) and a release process of the probe card 30 by the lifting and holding unit 54a. In this case, the loading control unit 86 continues the descent process until the sensor output value of the card sensor 48 changes, that is, the card sensor 48 is pressed by the probe card 30, and performs a release process accordingly with the change in the sensor output value. Next, the loading control unit 86 performs an elevation process of the lifting and holding unit 54a.

[0214] It should be noted that, based on the detection signal from the laser scanner 12 input from the transceiver control unit 60 via the network 18, the retrieval control unit 84 and the loading control unit 86, when an intrusion of a person H into the protected area PA occurs, stop the drive of the OHT 54, especially the lifting and lowering of the lifting and holding unit 54a. Furthermore, while the intrusion of a person H into the protected area PA continues, the retrieval control unit 84 and the loading control unit 86 stop the drive of the OHT 54, and restart the drive of the OHT 54 accordingly when the state of an intrusion of a person H into the protected area PA changes to a state of no intrusion of a person H into the protected area PA.

[0215] After the loading process is completed, the assembly process start control unit 88 outputs a start instruction for the assembly process of the probe card 30 to the detector 10. This start instruction is input to the assembly control unit 66 and the door opening / closing control unit 70 via the transceiver control unit 60. As a result, the assembly control unit 66 controls the suction cup moving mechanism 24, the connecting part 36, the card transport mechanism 32, and the card holding part 26 to perform the assembly process, and sends "read information" and "replacement completion notification" from the transceiver control unit 60 to the GEM host 16. In addition, the door opening / closing control unit 70 drives the door opening / closing mechanism 49 to switch the door 35 to the closed state during the assembly process.

[0216] When the "read information" of the probe card 30 is input from the transceiver control unit 60 via the network 18 during the assembly process, the authentication control unit 90 authenticates the probe card 30 using a known method and sends the authentication result to the transceiver control unit 60 via the network 18. This authentication result is then input to the assembly control unit 66 via the transceiver control unit 60. Therefore, the assembly control unit 66 continues the assembly process if the authentication result is appropriate, and stops the assembly process if the result is inappropriate.

[0217] [The Role of a Wafer Testing System]

[0218] Figure 17 This is a flowchart illustrating the process of replacing the probe card 30 of the detector 10 performed by the wafer testing system 2 with the above-described structure (equivalent to the probe card replacement method of the present invention). Figure 17 As shown, when the probe card 30 of the detector 10 is replaced, under the control of the GEM host 16, for each detector 10, the separation process (step S1, equivalent to the separation step), the retrieval process (step S2, equivalent to the retrieval step), the loading process (step S3, equivalent to the loading step), and the assembly process (step S4, equivalent to the assembly step) are executed sequentially.

[0219] <Separation Processing>

[0220] Figures 18 to 23 It is used for explanation Figure 17 The diagram illustrates the separation process in step S1. Figure 18 As shown, at the designated replacement time of the probe card 30, the separation process start control unit 82 outputs a replacement instruction T1 for the probe card 30 to the detector 10 via the network 18. This replacement instruction T1 is input to the separation control unit 64 and the door opening / closing control unit 70 via the transceiver control unit 60 of the detector 10.

[0221] like Figure 19As shown, upon receiving the replacement instruction T1, the separation control unit 64 controls the suction cup moving mechanism 24, the connecting part 36, the card transport mechanism 32, and the card holding part 26 to begin the separation process. Thus, as described above... Figure 7 as well as Figure 8 As shown, after the probe card 30 and the card holder 28 are held in the holding position on the tray 42, the tray 42 is moved to the door 35 by the suction cup moving mechanism 24.

[0222] On the other hand, such as Figure 20 As shown, upon receiving the replacement instruction T1, the door opening / closing control unit 70, when the tray 42 is moved to the door 35 by the suction cup moving mechanism 24, drives the door opening / closing mechanism 49 to switch from the closed state to the open state of the door 35. Furthermore, corresponding to this switch, the scanner control unit 68 begins detection by the laser scanner 12, i.e., detection of intrusion by any person H into the protected area PA. The detection results from the laser scanner 12 are continuously input to the door opening / closing control unit 70 and continuously input from the transceiver control unit 60 to the GEM host 16 via the network 18.

[0223] like Figure 21 As shown, based on the detection results of the laser scanner 12, the door opening and closing control unit 70 stops the operation of the door opening and closing mechanism 49 when a person H intrudes into the protected area PA. This prevents the door 35 from colliding with the person H. Furthermore, as... Figure 22 As shown, based on the detection results of the laser scanner 12, the door opening and closing control unit 70 restarts the drive of the door opening and closing mechanism 49 when the intrusion from a person H into the protected area PA is switched to an intrusion from a person H into the protected area PA. This reduces the time required for the operator to restart the process.

[0224] like Figure 23 As shown, when door 35 is switched to the open state, the transfer of tray 42 by suction cup moving mechanism 24 begins again, moving tray 42 to the replacement position. Consequently, the probe card 30 held by the card holder 28 on tray 42 is also moved to the replacement position. After this transfer is completed, separation control unit 64 sends a replacement preparation completion notification T2 to GEM host 16 via network 18 from transceiver control unit 60. Through the above, the separation process in step S1 is completed. It should be noted that after the separation process is completed, transceiver control unit 60 continuously outputs sensor output values ​​from card sensor 48, etc., to GEM host 16 via network 18.

[0225] <Recycling>

[0226] Figures 24 to 25 It is used for explanation Figure 17 A diagram illustrating the recycling process in step S2. (See diagram for example.)Figure 24 As shown, when the GEM host 16's recycling control unit 84 receives a replacement preparation completion notification T2 via network 18, it controls the chip transport mechanism 14's OHT 54 to sequentially perform the following processes: moving the OHT 54 to a position directly above the replacement position of the detector 10; lowering the lifting and holding unit 54a to the replacement position; and holding the held part 30b of the probe card 30 using the lifting and holding unit 54a. Next, as... Figure 25 As shown, the recovery control unit 84 controls the OHT54 to sequentially perform the process of raising the lifting holding unit 54a holding the probe card 30 and the process of using the OHT54 to transport the probe card 30 to the storage location 50.

[0227] It should be noted that, based on the detection results of the laser scanner 12 input from the transceiver control unit 60 via the network 18 during the execution of the above-described processes, the retrieval control unit 84 stops the drive of the OHT 54, especially the lifting and lowering of the lifting and holding unit 54a, when a person H intrudes into the protected area PA. This prevents the lifting and holding unit 54a from colliding with the person H. Furthermore, based on the detection results of the laser scanner 12, the retrieval control unit 84 restarts the drive of the OHT 54 when the intrusion from a person H into the protected area PA is switched to an intrusion from no person H into the protected area PA. This reduces the time required for the operator to restart the operation. With the above, the retrieval process in step S2 is completed.

[0228] <Moving In Process>

[0229] Figures 26 to 28 It is used for explanation Figure 17 The diagram illustrates the loading process in step S3. (See diagram for example.) Figure 26 As shown, when the recycling process is completed, the loading control unit 86 of the GEM host 16 controls the OHT 54 to move the OHT 54 to the storage location 50. Then, after the lifting and holding unit 54a holds the new probe card 30 corresponding to the semiconductor wafer W to be inspected, the OHT 54 is moved to a position directly above the replacement position.

[0230] Next, as Figure 27 As shown, the loading control unit 86 lowers the lifting holding part 54a holding the probe card 30. At this time, the loading control unit 86 continues the lowering process of the lifting holding part 54a based on the sensor output values ​​of each card sensor 48 input via the network 18 until the sensor output value changes, i.e., each card sensor 48 is pressed by the probe card 30. As already described, in the card holder 28 on the tray 42, a plurality of positioning parts 40 are provided around the card holder hole 38 (see reference). Figure 3 as well as Figure 4Therefore, even if a positional offset occurs in the XY position of the lifting and holding part 54a (e.g., ±2mm), the probe card 30 is guided into the card holding hole 38 by the guide surface 40a of each positioning part 40, and the probe card 30 is held in the card holding member 28.

[0231] When the probe card 30 is held by the card holder 28, as described above, the sensor output values ​​of each card sensor 48 change, thereby causing the input control unit 86 to determine whether the probe card 30 is not held on the card holder 28 (tray 42) or whether the probe card 30 is held on the card holder 28 (tray 42). Then, the input control unit 86 stops the descent process of the lifting holding unit 54a and releases the holding of the probe card 30 (held part 30b) by the lifting holding unit 54a. As a result, a new probe card 30 is transported from the storage location 50 to the replacement location. Next, as Figure 28 As shown, the lifting and holding section 54a is raised by moving the control unit 86.

[0232] It should be noted that, based on the detection results of the laser scanner 12 input from the transceiver control unit 60 via the network 18 during the loading process, the loading control unit 86 stops the drive of the OHT 54 while the person H is intruding into the protected area PA, just as it was during the recovery process described above, and restarts the drive of the OHT 54 accordingly when the person H leaves the protected area PA. This prevents the lifting and holding unit 54a from colliding with the person H. With the above, the loading process of step S3 is completed.

[0233] Assembly Processing

[0234] Figures 29 to 34 It is used for explanation Figure 17 The diagram illustrates the assembly process in step S4. Figure 29 As shown, when the loading process is completed, the assembly process start control unit 88 outputs an assembly instruction T3 for the probe card 30 to the detector 10 via the network 18. This assembly instruction T3 is input to the assembly control unit 66 and the door opening / closing control unit 70 via the transceiver control unit 60 of the detector 10.

[0235] Then, the assembly control unit 66, upon receiving the assembly instruction T3, controls the suction cup moving mechanism 24, the connecting part 36, the card transport mechanism 32, and the card holding part 26 to begin the assembly process. Thus, as described above... Figure 9 As shown, the tray 42 is moved toward the holding position by the suction cup moving mechanism 24 and the card handling mechanism 32.

[0236] On the other hand, such as Figure 30As shown, when the door opening / closing control unit 70, having received assembly instruction T3, is housed within the housing 34 by the tray 42 being moved toward the holding position, it actuates the door opening / closing mechanism 49 to switch the door 35 from the open state to the closed state. At the same time, based on the detection results from the laser scanner 12, the door opening / closing control unit 70 stops the actuation of the door opening / closing mechanism 49 while a person H is intruding into the protected area PA. This prevents the door 35 from colliding with the person H or trapping their hand or fingers.

[0237] like Figure 31 As shown, after switching the door 35 to the closed state (or before switching), the assembly control unit 66 reads the information of the probe card 30 held by the card holder 28 on the tray 42, and sends the read information T4 from the transceiver control unit 60 to the authentication control unit 90 of the GEM host 16 via the network 18. Then, the authentication control unit 90 authenticates the probe card 30 based on the read information T4 input via the network 18, and sends the authentication result T5 to the assembly control unit 66 via the network 18 and the transceiver control unit 60. Upon receiving the authentication result T5, the assembly control unit 66 continues the assembly process if the authentication result T5 is appropriate, and stops the assembly process if it is inappropriate.

[0238] Additionally, when the authentication of the probe card 30 is completed, the scanner control unit 68 terminates the detection performed by the laser scanner 12.

[0239] like Figure 32 As shown, while the assembly process continues, in accordance with the description Figure 9 As shown, after the tray 42 is moved to the holding position by the suction cup moving mechanism 24 and the card transport mechanism 32, the card holding part 26 holds the card holding member 28. Thus, the transport of the probe card 30 to the holding position is completed, and a new probe card 30 is assembled in the card holding part 26.

[0240] like Figure 33 As shown, when the new probe card 30 is assembled into the card holding part 26, as previously described... Figure 10 As shown, after the tray 42 is lowered by the card transport mechanism 32, the suction cup 22 is moved by the suction cup moving mechanism 24, the card transport mechanism 32 switches to the folded state of the tray 42, and the connection between the suction cup 22 and the card transport mechanism 32 is released, the suction cup 22 is moved by the suction cup moving mechanism 24 to the inspection position Y1.

[0241] like Figure 34 As shown, when the suction cup 22 completes its movement to the inspection position Y1, the assembly control unit 66 sends a replacement completion notification from the transceiver control unit 60 to the GEM host 16 via the network 18. With the above, the assembly process in step S4 is completed.

[0242] As described above, in this embodiment, the OHT54 of the wafer transport mechanism 14, which loads and retrieves the cassette CS (semiconductor wafer W) of the detector 10, is used in the semiconductor manufacturing process to load and retrieve the probe card 30 of the detector 10, thereby eliminating the need to install new equipment for loading and retrieving the probe card 30 in the semiconductor manufacturing process. As a result, the increase in setup space within the semiconductor manufacturing process can be suppressed, and the replacement of the probe card 30 can be automated at low cost.

[0243] [other]

[0244] In the above embodiment, the separation process was described as starting when the card holding part 26 holds the card holding member 28 and the probe card 30. However, there are also cases where the separation process starts when the card holding part 26 does not hold the card holding member 28 and the probe card 30. In the separation process (step S1) in this case, the previously described... Figure 7 The state indicated by reference numeral 7C in the attached figure is towards Figure 8 The state transition is shown by reference numeral 8C in the attached figure. Then, the recycling process (step S2) is omitted, and the loading process (step S3) and assembly process (step S4) are executed sequentially.

[0245] In the above embodiment, the wafer testing system 2 is provided with multiple detectors 10, but the number of detectors 10 can also be one.

[0246] In the above embodiment, when a person H intrudes into the protected area PA, the opening and closing of the door 35 and the driving of the OHT54 are stopped. However, for example, a warning (warning sound, warning display, etc.) can be issued to the person H at the time when the intrusion of the person H into the warning area WA occurs, based on the detection result of the laser scanner 12.

[0247] In the above embodiment, a laser scanner 12 is used to detect intrusions of unmanned person H into the protected area PA and the warning area WA. However, intrusions of unmanned person H into the protected area PA can also be detected by image analysis of images captured by a surveillance camera. Various known human detection sensors can also be used.

[0248] In the above embodiment, the OHT54 was described as an example of the wafer handling mechanism 14, but various known wafer handling mechanisms such as Automated Guided Vehicle (AGV) and Overhead Shuttle (OHS) that can handle the handling of boxes CS (or semiconductor wafers W) can also be used.

[0249] In the above embodiment, the probe card 30 is moved between the storage location 50 and the replacement location using the wafer transport mechanism 14, which is used to place and retrieve the cassette CS (semiconductor wafer W). However, a transport mechanism other than the wafer transport mechanism 14 can also be used to move the probe card 30 between the storage location 50 and the replacement location.

Claims

1. A wafer testing system, wherein the wafer testing system is provided with: a prober provided with a chuck that holds a semiconductor wafer and a probe card that has probes, and performs inspection of semiconductor chips formed on the semiconductor wafer by bringing the probes into contact with the semiconductor chips; an automated guided vehicle; a transfer control section that controls the automated guided vehicle to transfer the probe card between a replacement position of the probe card in the prober and a storage location of the probe card at a location outside the prober; a card transfer mechanism provided in the prober and that transfers the probe card between a holding position in the prober and the replacement position; a separation control section that controls the card transfer mechanism to perform a separation process of transferring the probe card before replacement from the holding position to the replacement position; and an assembly control section that controls the card transfer mechanism to perform an assembly process of transferring a new probe card from the replacement position to the holding position, the prober is provided with: a housing that houses the chuck, the probe card, and the card transfer mechanism; an opening portion formed in the housing and that exposes the replacement position to the outside of the housing; a door that can be switched between an open state that opens the opening portion and a closed state that covers the opening portion; a door opening and closing mechanism for switching the door between the open state and the closed state; and a door opening and closing control section that drives the door opening and closing mechanism to switch the door from the closed state to the open state in the separation process, and drives the door opening and closing mechanism to switch the door from the open state to the closed state in the assembly process.

2. A prober provided with a chuck that holds a semiconductor wafer and a probe card that has probes, and performs inspection of semiconductor chips formed on the semiconductor wafer by bringing the probes into contact with the semiconductor chips, wherein the prober is provided with: a card transfer mechanism that transfers the probe card between a holding position in the prober and a replacement position where replacement of the probe card is performed by an automated guided vehicle; a housing that houses the chuck, the probe card, and the card transfer mechanism; an opening portion formed in the housing and that exposes the replacement position to the outside of the housing; a door that can be switched between an open state that opens the opening portion and a closed state that covers the opening portion; a door opening and closing mechanism for switching the door between the open state and the closed state; and a door opening and closing control section that drives the door opening and closing mechanism to switch the door from the closed state to the open state in a separation process where the card transfer mechanism transfers the probe card before replacement from the holding position to the replacement position, and drives the door opening and closing mechanism to switch the door from the open state to the closed state in an assembly process where the card transfer mechanism transfers a new probe card from the replacement position to the holding position. ​

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