Low-cost high-performance heat-conducting silicone grease as well as preparation method and application thereof

Abstract

The invention discloses low-cost high-performance heat-conducting silicone grease as well as a preparation method and application thereof, and belongs to the technical field of silicone grease. The heat-conducting silicone grease is prepared from the following components in parts by mass: 5 to 15 parts of organic silicone oil, 0.2 to 1.0 part of powder treating agent and 60 to 250 parts of heat-conducting filler, the heat-conducting filler is selected from aluminum hydroxide, aluminum oxide, boron nitride, aluminum nitride, graphene powder or copper powder. The 2.0-6.0 W / (m.K) heat-conducting silicone grease provided by the invention is high in heat conductivity, moderate in viscosity, good in smearing property and insulativity, relatively low in oil penetration rate and good in comprehensive performance. The preparation process is simple, the used raw materials are cheap and easy to obtain and do not need special treatment, and the production cost is low. The heat-conducting silicone grease with excellent comprehensive performance is prepared at low cost by accurately controlling the particle size, the proportion and the dosage of the heat-conducting filler, reasonably selecting and matching materials and optimizing the process.

Description

Technical Field

[0001] This invention belongs to the technical field of silicone grease, specifically to a low-cost, high-performance thermal conductive silicone grease, its preparation method, and its application. Background Technology

[0002] With the rapid development of electronic technology, the integration and power of electronic components have continued to increase, leading to a sharp increase in the heat generated during equipment operation. Excessive temperature can seriously affect the performance stability and lifespan of electronic components, and even cause equipment failure. Therefore, heat dissipation has become a key bottleneck restricting the development of electronic equipment.

[0003] Thermal grease, as a core thermal interface material, is mainly used to fill the microscopic gaps between electronic devices and heat sinks, reduce contact thermal resistance, and improve heat transfer efficiency. Its technological development has always revolved around three major goals: high thermal conductivity, low thermal resistance, and long lifespan. Through matrix modification, filler innovation, and structural design, it has continuously broken through performance bottlenecks.

[0004] However, existing thermal greases have many drawbacks: in high temperature and high humidity environments, silicone oil is prone to volatilization or oxidation; during thermal cycling, fillers are prone to sedimentation and oil seepage, leading to cracking and performance degradation of the grease; at the same time, high thermal conductivity greases present a contradiction between insulation and spreadability. Metal fillers have excellent thermal conductivity but are prone to electrical conductivity, while insulating thermal conductive materials require a high addition amount (>80%) to ensure thermal conductivity, which leads to a sharp increase in grease viscosity, decreased fluidity, and significantly increased coating difficulty.

[0005] Therefore, developing a 2.0~6.0 W thermal grease that combines low interfacial thermal resistance, long service life, excellent spreadability, and insulation to meet the market's high-end demand for heat dissipation of electronic devices is of great practical significance and application value. Summary of the Invention

[0006] To address the problems of high thermal resistance, poor stability, high cost, and difficulty in balancing spreadability and insulation in existing thermal greases, this invention provides a thermal grease that balances performance and cost, along with its preparation method and applications. This achieves a balance between high thermal conductivity, good filling properties, excellent insulation, low oil seepage rate, and low cost. Furthermore, the preparation process is simple, the raw materials are inexpensive and readily available, requiring no special treatment, resulting in low production costs.

[0007] To achieve the above objectives, the present invention adopts the following solution: a low-cost, high-performance thermal grease, comprising the following components by mass: 5-15 parts of organosilicon oil, 0.2-1.0 parts of powder treatment agent, and 60-250 parts of thermally conductive filler; wherein the thermally conductive filler is selected from aluminum hydroxide, aluminum oxide, boron nitride, aluminum nitride, graphene powder, or copper powder.

[0008] In a preferred embodiment, the thermal conductivity of the low-cost, high-performance thermal grease is 2.0~6.0 W / (m·K).

[0009] In a preferred embodiment, the low-cost, high-performance thermal grease has a thermal conductivity of 2.0~2.5 W / (m·K) and comprises the following components by mass: 5~15 parts of silicone oil, 0.2~1.0 parts of powder treatment agent, and 60~100 parts of thermally conductive filler; the thermally conductive filler comprises the following components by mass: 0~50 parts of spherical alumina with D50=20μm, 0~50 parts of aluminum hydroxide with D50=5μm, 0~50 parts of spherical alumina with D50=5μm, 0~40 parts of spherical alumina with D50=3μm, 0~35 parts of near-spherical alumina with D50=1μm, and 0~25 parts of alumina with D50=0.8μm.

[0010] In a preferred embodiment, the low-cost, high-performance thermal grease has a thermal conductivity of 2.5~3.5 W / (m·K) and comprises the following components by mass: 5-15 parts of silicone oil, 0.2-1.0 parts of powder treatment agent, and 100-150 parts of thermally conductive filler; the thermally conductive filler comprises the following components by mass: 0-80 parts of spherical alumina with D50=20μm, 10-100 parts of spherical alumina with D50=5μm, 0-50 parts of spherical alumina with D50=3μm, 0-40 parts of near-spherical alumina with D50=1μm, and 0-30 parts of alumina with D50=0.8μm.

[0011] In a preferred embodiment, the low-cost, high-performance thermal grease has a thermal conductivity of 3.5~4.5 W / (m·K) and comprises the following components by mass: 5~15 parts of silicone oil, 0.2~1.0 parts of powder treatment agent, and 150~190 parts of thermally conductive filler; the thermally conductive filler comprises the following components by mass: 0~60 parts of spherical alumina with D50=45μm, 20~120 parts of spherical alumina with D50=20μm, 10~80 parts of spherical alumina with D50=5μm, 0~70 parts of spherical alumina with D50=4μm, 0~60 parts of spherical alumina with D50=3μm, 0~40 parts of alumina with D50=0.8μm, and 0~30 parts of near-spherical alumina with D50=0.6μm.

[0012] In a preferred embodiment, the low-cost, high-performance thermal grease has a thermal conductivity of 4.5~5.5 W / (m·K) and comprises the following components by mass: 5~15 parts of silicone oil, 0.2~1.0 parts of powder treatment agent, and 150~190 parts of thermally conductive filler; the thermally conductive filler comprises the following components by mass: 0~50 parts of spherical alumina with D50=45μm, 30~90 parts of spherical alumina with D50=20μm, 0~80 parts of spherical alumina with D50=4μm, and 0~40 parts of near-spherical alumina with D50=0.6μm.

[0013] In a preferred embodiment, the low-cost, high-performance thermal grease has a thermal conductivity of 5.5 to 6.0. W / (m·K), by mass parts, comprises the following components: 5-15 parts of silicone oil, 0.2-1.0 parts of powder treatment agent, and 160-200 parts of thermally conductive filler; the thermally conductive filler, by mass parts, comprises the following components: 0-50 parts of spherical alumina with D50=45μm, 30-90 parts of spherical alumina with D50=20μm, 30-80 parts of spherical alumina with D50=5μm, 0-80 parts of spherical alumina with D50=4μm, 0-40 parts of near-spherical alumina with D50=0.6μm, 0-20 parts of spherical aluminum nitride with D50=5-10μm, 0-15 parts of spherical copper powder with D50=0-20μm, 0-5 parts of graphene powder, and 0-5 parts of sheet-like boron nitride with a side length of 5-20μm.

[0014] In the preferred embodiment, the viscosity of the silicone oil at 23±2℃ is 20~5000 mPa▪s.

[0015] In a preferred embodiment, the silicone oil is selected from at least dimethyl silicone oil, vinyl silicone oil, or polytrimethylphenyl silicone oil.

[0016] In a preferred embodiment, the powder treatment agent is at least selected from 123X dispersant, R-6541 composite modifier, or F-02 powder modifier.

[0017] In a preferred embodiment, the D50 particle size of the thermally conductive filler is 1 nm to 50 μm.

[0018] The method for preparing the low-cost, high-performance thermal grease includes the following steps: mixing the formulated amount of organosilicon oil and powder treatment agent for the first time, then adding thermally conductive filler, mixing for the second time, heating, and mixing for the third time to obtain the thermal grease.

[0019] In the preferred embodiment, the thermally conductive filler is pre-treated by drying before use.

[0020] In a further preferred embodiment, the drying temperature is 100~180 ℃ and the drying time is 8~10 h.

[0021] In the preferred embodiment, the thermally conductive fillers are added sequentially in order of particle size from largest to smallest or from smallest to largest.

[0022] In a further preferred embodiment, the time interval between the addition of each component in the thermally conductive filler is 10-20 minutes.

[0023] In the preferred embodiment, the rotation speed of the first mixing is 100~120 rpm, and the mixing time is 5~10 min.

[0024] In a preferred embodiment, the rotation speed of the second mixing is 180–190 rpm.

[0025] In a preferred embodiment, the heating temperature is 80–130 °C.

[0026] In the preferred embodiment, the third mixing is carried out under vacuum, and the mixing time is 1 to 2 hours.

[0027] In a further preferred embodiment, the vacuum degree of the vacuum state is -0.092 to -0.098 MPa.

[0028] In the preferred embodiment, after the third mixing is completed, the mixture obtained from the third mixing is transferred to a three-roll mill and ground 1 to 3 times.

[0029] In a further preferred embodiment, the mixture obtained from grinding is transferred from a three-roll mill to a planetary centrifugal mixer and stirred for 20 to 30 minutes under a vacuum environment of -0.092 to -0.098 MPa.

[0030] The application of the low-cost, high-performance thermal grease in heat dissipation of electronic components.

[0031] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention focuses on optimizing the performance of thermal grease. It employs a refined design strategy for the proportioning of thermally conductive fillers with multi-level particle sizes, endowing the fillers with excellent adaptive filling characteristics. This allows them to accurately fill air gaps in thermal grease application scenarios, thereby constructing a highly dense and ordered thermally conductive network structure within the silicone oil matrix. This network structure effectively shortens the heat transfer path, significantly reduces contact thermal resistance and bulk thermal resistance, and achieves a significant improvement in thermal conductivity, providing an effective thermal solution for high-power-density applications such as electronic devices.

[0032] 2. In the preparation of thermal grease in this invention, the average particle size of the powder used is below 50μm. While pursuing a high filling rate to enhance thermal conductivity, this invention modifies the surface of the filler using different powder treatment agents to precisely control the interaction and interfacial compatibility between the filler system and the silicone oil. Three-roll milling is used to reduce surface roughness, resulting in a finer appearance and a smoother surface, increasing the actual contact area and facilitating smoother heat transfer. Furthermore, the prepared 2.0~4.0W thermal grease exhibits good rheological properties, maintaining a low and controllable viscosity and suitable thixotropy. The 5.0~6.0W thermal grease uses extremely low viscosity polytrimethylphenyl silicone oil (resistant to high and low temperatures and with strong oxidation resistance) to also achieve a certain degree of fluidity, increasing the service life of this high thermal conductivity grease. These product characteristics ensure good coating uniformity and ease of operation during actual application, while avoiding problems such as application difficulties due to excessive viscosity and flow caused by poor thixotropy.

[0033] 3. The preparation process of this invention is simple and convenient, and the raw materials are readily available and inexpensive. It can significantly improve product performance while controlling costs. It is suitable for large-scale production to meet market demand. The core of this invention is to precisely control the particle size, ratio, and amount of thermally conductive filler, rationally select and match materials, optimize the process, and produce commonly used 2.0~6.0 W thermally conductive silicone grease with excellent comprehensive performance at low cost. Detailed Implementation

[0034] The technical solution of the present invention will be further described and illustrated below through examples. All raw materials used in the examples are commercially available or prepared using conventional methods.

[0035] Example 1 A low-cost, high-performance thermal grease, comprising the following raw materials in parts by weight: 10 parts of dimethyl silicone oil (viscosity at 25 °C is about 5000 mPa▪s), 0.5 parts of powder treatment agent (R-6541 composite modifier), 40 parts of spherical alumina (D50=5μm), and 32 parts of near-spherical alumina (D50=1μm).

[0036] The above-mentioned method for preparing low-cost, high-performance thermal grease includes the following steps: S1. Pour dimethyl silicone oil and R-6541 composite modifier into a planetary centrifugal mixer and stir at 120 rpm for 5 min; S2. Add the thermally conductive fillers in descending order of particle size, such as 5μm spherical alumina and 1μm near-spherical alumina, into a planetary centrifugal mixer. Stir at 190 rpm for 10 min after each addition. S3. Heat to 80~100℃, and stir the mixture for 30~60 minutes in a vacuum environment (vacuum degree maintained at -0.092~-0.098MPa) at a speed of 190rpm / min. S4. Transfer the mixture obtained in step S3 from the planetary centrifugal mixer to a three-roll mill and grind it 2-3 times to finally obtain low-cost, high-performance thermal grease.

[0037] Example 2 A low-cost, high-performance thermal grease is prepared from the following raw materials in parts by weight: 10 parts of dimethyl silicone oil (viscosity at 25 °C is about 1000 mPa▪s), 0.6 parts of powder treatment agent (R-6541 composite modifier), 85 parts of spherical alumina (D50=5μm), and 28 parts of near-spherical alumina (D50=1μm).

[0038] The preparation method of the above-mentioned low-cost, high-performance thermal grease is consistent with that in Example 1.

[0039] Example 3 A low-cost, high-performance thermal grease is prepared from the following raw materials in parts by weight: 5 parts of dimethyl silicone oil (viscosity at 25 ℃ is about 100 mPa▪s), 5 parts of dimethyl silicone oil (viscosity at 25 ℃ is about 500 mPa▪s), 0.9 parts of powder treatment agent (123X dispersant), 104 parts of spherical alumina (D50=20μm), 52 parts of spherical alumina (D50=5μm), and 30 parts of angular alumina (D50=0.8μm).

[0040] The preparation method of the above-mentioned low-cost, high-performance thermal grease is consistent with that in Example 1.

[0041] Example 4 A low-cost, high-performance thermal grease, comprising the following raw materials in parts by weight: 9 parts of polytrimethylphenyl silicone oil (viscosity at 25 °C is approximately 22 mPa·s), 0.5 parts of powder treatment agent (FO2 modifier), 47.4 parts of spherical alumina (D50=45μm), 34.1 parts of spherical alumina (D50=20μm), 69.1 parts of spherical alumina (D50=4μm), and 20.6 parts of near-spherical alumina (D50=0.6μm).

[0042] The preparation method of the above-mentioned low-cost, high-performance thermal grease is basically the same as that in Example 1, except that: in step S2, the thermally conductive fillers are added sequentially to the planetary centrifugal mixer in order of increasing particle size, with spherical alumina and spherical alumina being added in turn.

[0043] Example 5 A low-cost, high-performance thermal grease is prepared from the following raw materials in parts by weight: 10 parts of polytrimethylphenyl silicone oil (viscosity at 25 °C is approximately 22 mPa▪s), 1 part of powder modifier (R-6541 composite modifier), 32 parts of spherical alumina (D50=45μm), 80 parts of spherical alumina (D50=20μm), 52 parts of spherical alumina (D50=5μm), 30 parts of near-spherical alumina (D50=0.6μm), 10 parts of spherical aluminum nitride (D50=10μm), 2.4 parts of flake boron nitride (D50=10μm), 1.2 parts of spherical copper powder (0~20μm), and 0.5 parts of nano-scale graphene powder.

[0044] The preparation method of the above-mentioned low-cost, high-performance thermal grease is basically the same as that in Example 1, except that the thermal filler is added in the following order in step S2: 10μm flake boron nitride, 0.6μm spherical alumina, 5μm spherical alumina, 20μm spherical alumina, 45μm spherical alumina, spherical copper powder and nano-scale graphene powder are added together, and finally 10μm spherical aluminum nitride is added.

[0045] Example 6 A low-cost, high-performance thermal grease, comprising the following raw materials in parts by weight: 10 parts of dimethyl silicone oil (viscosity at 25 °C is approximately 1000 mPa▪s), 0.5 parts of powder treatment agent (R-6541 composite modifier), 45 parts of spherical alumina (D50=20μm), 30 parts of angular aluminum hydroxide (D50=5μm), and 15 parts of angular alumina (D50=0.8μm).

[0046] The preparation method of the above-mentioned low-cost, high-performance thermal grease is consistent with that in Example 1.

[0047] Example 7 A low-cost, high-performance thermal grease, comprising the following raw materials in parts by weight: 10 parts of dimethyl silicone oil (viscosity at 25 °C is approximately 1000 mPa▪s), 0.6 parts of powder treatment agent (R-6541 composite modifier), 75 parts of spherical alumina (D50=20μm), 35 parts of spherical alumina (D50=5μm), and 20 parts of angular alumina (D50=0.8μm).

[0048] The preparation method of the above-mentioned low-cost, high-performance thermal grease is consistent with that in Example 1.

[0049] Example 8 A low-cost, high-performance thermal grease is prepared from the following raw materials in parts by weight: 10 parts of dimethyl silicone oil (viscosity at 25°C is approximately 100 mPa·s), 0.5 parts of powder modifier (FO2 modifier), 46.3 parts of spherical alumina (D50=45μm), 38.6 parts of spherical alumina (D50=20μm), 66.5 parts of spherical alumina (D50=5μm), and 22.4 parts of near-spherical alumina (D50=0.6μm).

[0050] The preparation method of the above-mentioned low-cost, high-performance thermal grease is as described in Example 1.

[0051] Testing and Analysis The thermal conductivity, density, viscosity, volatility, and oil penetration of the thermal grease prepared in the test examples are as follows.

[0052] Thermal conductivity: Tested using a TIMA 5 thermal interface material analyzer according to ASTM D5470 standard.

[0053] Contact thermal resistance: Tested according to ASTM D5470 standard, the contact thermal resistance is obtained by testing the interfacial thermal resistance of specimens with different thicknesses and fitting the prior regression equation.

[0054] Viscosity test: A Brookfield (AMETEK) viscometer, model DV2T, with rotor No. 7, was used. The test was conducted at 20 rpm / min and 23±2 ℃. The data was collected after the viscosity test stabilized.

[0055] Volatility: Measured according to the method specified in Appendix D of GB / T 28610-2020.

[0056] Oil permeability: Tested using a steel mesh oil separator, referring to HG / T 2502-1993 5201 standard.

[0057] Filler ratio: the percentage of the mass of thermally conductive powder filler to the total mass of thermally conductive silicone grease.

[0058] The performance parameters of the thermal grease are shown in Table 1 below.

[0059] Table 1. Performance test data of various thermal greases

[0060] As shown in Table 1, compared to Examples 6-7, Examples 1-2 all used thermally conductive fillers with smaller particle sizes and silicone oils with higher viscosity, resulting in 2.0 W / m▪K and 3.0 W / m▪K thermally conductive greases with low thermal resistance, fine and uniform appearance, and good flowability. Compared to Example 8, the filler powder compounding and dispersant used in Example 3 resulted in a better overall performance improvement for the 4.0 W / m▪K thermally conductive grease. Example 4 used alumina as the filler to obtain a high-performance 5.0 W / m▪K thermally conductive grease. Example 5 used a small amount of various high thermal conductivity fillers to achieve 6.0 W / m▪K. Notably, the 5.0-6.0 W / m▪K thermally conductive greases, due to the use of ultra-low viscosity phenyl silicone oil, exhibited excellent performance in viscosity control, reduced volatility, and non-oil leakage, laying a solid foundation for product stability and reliability. These examples clearly demonstrate that the lower the volatile content of high-viscosity dimethyl silicone oil, the more beneficial it is to improving product performance; small-particle-size fillers have a significant effect on improving the appearance of silicone grease and reducing thermal resistance. When fillers with concentrated small particle sizes and narrow distribution are selected for compounding, fillers of different particle sizes act as tacit partners, making it easier to reasonably match and fill gaps, optimize packing density, and effectively reduce contact thermal resistance. In addition, appropriately increasing the content of small-particle-size powder can also reduce the oil creep phenomenon of silicone oil, further reducing the oil seepage rate and safeguarding the high-quality performance of thermally conductive silicone grease.

[0061] In summary, this invention cleverly utilizes filler processing technology to precisely control the particle size distribution of the filler, while simultaneously regulating the type and viscosity of the silicone oil. This allows for the reduction of the silicone grease viscosity while maintaining high filler content, thereby reducing oil seepage and preventing or avoiding oil-powder separation. Furthermore, by selecting appropriate raw materials and powder processing agents, and precisely controlling the kneading process temperature and time, a low thermal resistance (2.0~6.0 W / m▪K) thermally conductive silicone grease with excellent thermal conductivity and mechanical properties can be obtained.

[0062] It should be understood that the above embodiments are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the invention, and these equivalent forms also fall within the scope defined by the appended claims.

Claims

1. A low-cost high-performance heat-conducting silicone grease, characterized by, The low-cost high-performance thermal conductive silicone grease comprises the following components in parts by mass: 5-15 parts of silicone oil, 0.2-1.0 parts of powder treatment agent, and 60-250 parts of thermal conductive filler; the thermal conductive filler is selected from aluminum hydroxide, aluminum oxide, boron nitride, aluminum nitride, graphene powder or copper powder.

2. The low cost high performance thermal silicone grease as claimed in claim 1, wherein, The low-cost high-performance thermal conductive silicone grease comprises the following components in parts by mass: 5-15 parts of silicone oil, 0.2-1.0 parts of powder treatment agent, and 60-100 parts of thermal conductive filler; the thermal conductive filler is selected from aluminum hydroxide, aluminum oxide, boron nitride, aluminum nitride, graphene powder or copper powder. The thermal conductive filler comprises the following components in parts by mass: 0-50 parts of spherical aluminum oxide with D50=20 μm, 0-50 parts of aluminum hydroxide with D50=5 μm, 0-50 parts of spherical aluminum oxide with D50=5 μm, 0-40 parts of spherical aluminum oxide with D50=3 μm, 0-35 parts of spherical aluminum oxide with D50=1 μm, and 0-25 parts of aluminum oxide with D50=0.8 μm.

3. The low cost high performance thermal silicone grease as claimed in claim 1, wherein, The low-cost high-performance thermal conductive silicone grease comprises the following components in parts by mass: 5-15 parts of silicone oil, 0.2-1.0 parts of powder treatment agent, and 100-150 parts of thermal conductive filler; the thermal conductive filler is selected from aluminum hydroxide, aluminum oxide, boron nitride, aluminum nitride, graphene powder or copper powder. The thermal conductive filler comprises the following components in parts by mass: 0-80 parts of spherical aluminum oxide with D50=20 μm, 10-100 parts of spherical aluminum oxide with D50=5 μm, 0-50 parts of spherical aluminum oxide with D50=3 μm, 0-40 parts of spherical aluminum oxide with D50=1 μm, and 0-30 parts of aluminum oxide with D50=0.8 μm.

4. The low cost high performance thermal silicone grease as claimed in claim 1, wherein, The low-cost high-performance thermal conductive silicone grease comprises the following components in parts by mass: 5-15 parts of silicone oil, 0.2-1.0 parts of powder treatment agent, and 150-190 parts of thermal conductive filler; the thermal conductive filler is selected from aluminum hydroxide, aluminum oxide, boron nitride, aluminum nitride, graphene powder or copper powder. The thermal conductive filler comprises the following components in parts by mass: 0-60 parts of spherical aluminum oxide with D50=45 μm, 20-120 parts of spherical aluminum oxide with D50=20 μm, 10-80 parts of spherical aluminum oxide with D50=5 μm, 0-70 parts of spherical aluminum oxide with D50=4 μm, 0-60 parts of spherical aluminum oxide with D50=3 μm, 0-40 parts of aluminum oxide with D50=0.8 μm, and 0-30 parts of spherical aluminum oxide with D50=0.6 μm.

5. The low cost high performance thermal silicone grease as claimed in claim 1, wherein, The low-cost high-performance thermal conductive silicone grease comprises the following components in parts by mass: 5-15 parts of silicone oil, 0.2-1.0 parts of powder treatment agent, and 150-190 parts of thermal conductive filler; the thermal conductive filler is selected from aluminum hydroxide, aluminum oxide, boron nitride, aluminum nitride, graphene powder or copper powder. The thermal conductive filler comprises the following components in parts by mass: 0-50 parts of spherical aluminum oxide with D50=45 μm, 30-90 parts of spherical aluminum oxide with D50=20 μm, 0-80 parts of spherical aluminum oxide with D50=4 μm, and 0-40 parts of spherical aluminum oxide with D50=0.6 μm.

6. The low cost high performance thermal silicone grease as claimed in claim 1, wherein, The low-cost high-performance thermal conductive silicone grease has a thermal conductivity of 5.5-6.0 W / (m*K) and comprises the following components in mass fraction: 5-15 parts of silicone oil, 0.2-1.0 parts of powder treatment agent and 160-200 parts of thermal conductive filler; The thermal conductive filler comprises the following components in mass fraction: 0-50 parts of spherical alumina with D50=45 μm, 30-90 parts of spherical alumina with D50=20 μm, 30-80 parts of spherical alumina with D50=5 μm, 0-80 parts of spherical alumina with D50=4 μm, 0-40 parts of spherical-like alumina with D50=0.6 μm, 0-20 parts of spherical aluminum nitride with D50=5-10 μm, 0-15 parts of spherical copper powder with D50=0-20 μm, 0-5 parts of graphene powder and 0-5 parts of flaky boron nitride with edge length of 5-20 μm.

7. The low cost high performance thermal silicone grease as claimed in claim 1, wherein, The silicone oil has a viscosity of 20-5000 mPa*s at 23±2 ℃, is at least selected from dimethyl silicone oil, vinyl silicone oil or polytrimethylphenyl silicone oil, the powder treatment agent is at least selected from 123X dispersant, R-6541 composite modifier or F-02 powder modifier, and the thermal conductive filler has a D50 particle size of 1 nm-50 μm.

8. A method for preparing the low-cost high-performance thermal conductive silicone grease according to any one of claims 1 to 7, characterized in that, The method comprises the following steps: mixing a formula amount of silicone oil and powder treatment agent for the first time, then adding thermal conductive filler for the second time, heating for the third time, and obtaining the thermal conductive silicone grease.

9. The method of claim 8, wherein the low-cost high-performance thermal silicone grease is prepared by adding 0.1 to 0.5 parts by weight of the thermally conductive filler to 100 parts by weight of the base silicone grease. The thermal conductive filler is dried and pretreated before use, the thermal conductive filler is added in order from large to small or from small to large in particle size, the heating temperature is 80-130 ℃, the third mixing is carried out in a vacuum state for 1-2 h, and the mixture obtained after the third mixing is transferred to a three-roll grinding machine for grinding for 1-3 times.

10. Application of the low-cost high-performance thermal conductive silicone grease in heat dissipation of electronic components according to any one of claims 1-7.

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