Semiconductor deposition process equipment base center positioning jig

Abstract

The invention discloses a semiconductor deposition process equipment base center positioning jig which comprises a deformable main body which is of a hollow structure, is connected with an air pipe and deforms after being inflated; one end of the air pipe is connected with an air source, the other end of the air pipe is connected with the deformable body, and the air pipe is used for filling pressure air into the deformable body. According to the method, the alignment success rate can be improved, the PM Fail rate can be reduced, and the Uptime of the equipment can be increased.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and in particular to a center positioning fixture for a semiconductor deposition process equipment base. Background Technology

[0002] Semiconductor deposition equipment is an advanced semiconductor manufacturing process primarily used for atomic layer deposition (ALD) and plasma-enhanced atomic layer deposition (PEALD) processes. Precise operation of semiconductor deposition equipment requires accurate positioning of its mechanical parts (base center). Errors inevitably occur after a period of operation, necessitating regular calibration and repositioning of the semiconductor deposition equipment.

[0003] Current technology for calibrating the center of mechanical parts relies on whether a calibration piece (such as a calibration post) can smoothly pass through the central through-hole of the part being calibrated, combined with human tactile feedback, as the judgment criterion. This approach has low calibration accuracy, requires manual judgment, has low calibration efficiency, and still has a certain failure rate.

[0004] Therefore, there is an urgent need for a base center positioning fixture that can improve the success rate of center alignment between parts, reduce preventive maintenance (PM Fail rate), and increase equipment uptime. Summary of the Invention

[0005] The summary of this invention introduces a series of simplified concepts, all of which are simplifications of existing technologies in the field, and will be further explained in detail in the detailed description section. This summary is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] The technical problem to be solved by the present invention is to provide a base center positioning fixture for semiconductor deposition process equipment that can improve the success rate of center alignment between parts, reduce preventive maintenance, and increase equipment uptime.

[0007] To solve the above-mentioned technical problems, the present invention provides a semiconductor deposition process equipment base center positioning fixture, comprising:

[0008] The deformable body is formed into a hollow structure, which is connected to an air tube and deforms when inflated.

[0009] The trachea has one end connected to a gas source and the other end connected to a deformable body, and is used to pressurize the deformable body.

[0010] Preferably, the semiconductor deposition process equipment base center positioning fixture is further improved to include:

[0011] The tee is connected to the air pipe and is used to connect to the pressure relief valve.

[0012] Preferably, the deformable body of the semiconductor deposition process equipment base center positioning fixture is made of fluororubber.

[0013] Preferably, the semiconductor deposition process equipment base center positioning fixture is further improved so that the deformable body is formed into a hollow cylinder.

[0014] Preferably, the semiconductor deposition process equipment base center positioning fixture is further improved such that the diameter of the deformable body is less than or equal to the diameter of the through hole of the part being calibrated.

[0015] Preferably, the semiconductor deposition process equipment base center positioning fixture is further improved to include:

[0016] The first pressure sensor is arranged inside the deformable body. When the pressure reaches a first specified threshold, it sends a trigger signal to the gas source to stop the inflation.

[0017] Preferably, the semiconductor deposition process equipment base center positioning fixture is further improved to include:

[0018] An elastic surround is arranged around the part being calibrated. When the air source stops supplying air to the deformable body, it radially clamps the part being calibrated through the through hole.

[0019] Preferably, in a further improvement, the semiconductor deposition process equipment base center positioning fixture has an elastic surrounding member that is a hollow annular strip structure, and the elastic surrounding member is also connected to an air source.

[0020] The second pressure sensor is arranged inside the elastic surround;

[0021] After the air source stops inflating the deformable body, it inflates the elastic surrounding component. When the pressure reaches the second specified threshold, it sends a trigger signal to the air source to stop inflating.

[0022] The working principle and technical effects of this invention are explained below;

[0023] refer to Figures 1-3 As shown, when calibrating the center positioning of the base, the deformable body is inserted into and passes through the center through hole of the base, and then the gas source is activated to supply gas to the deformable body.

[0024] The deformable body expands and deforms to fill the through hole. During the inflation and expansion process, if the part and the deformable body are not concentric, the deformable body will first contact the edge of the part and the inside of the through hole.

[0025] At this point, the deformable body is subjected to uneven force, which will exert force on the parts and push them to move until the center of the parts is aligned with the deformable body, so that the deformable body is subjected to uniform force.

[0026] Alternatively, the base parts can be straightened by external force (e.g., manually). Because the deformable body expands, the base parts cannot move relative to each other, thus completing the center positioning between the base parts.

[0027] In a preferred embodiment of the present invention, an elastic surrounding component is added. By inflating the elastic surrounding component with an air source, the movement of each base component is restricted, which, combined with the restrictive effect of the expansion of the deformable main body within the central through hole, replaces the step of manual straightening.

[0028] This invention improves the alignment success rate: Traditional alignment methods rely on a cylindrical Teflon calibration post with a diameter of 39.95 mm, judging alignment by touch and physical permeability. This method has tolerance issues, which may result in the calibration post not being able to be placed in the center of the component, or even if it is placed, the alignment accuracy cannot be guaranteed.

[0029] This invention uses an inflatable deformable body to automatically adjust the position of parts, ensuring that the center of the parts is aligned with the deformable body, thereby improving the success rate of center alignment between parts.

[0030] This invention reduces PM failure rate: traditional methods rely on operator experience and tactile sense, which introduces human error. The deformable body of this invention reduces reliance on operator experience, automatically achieving alignment through physical expansion and uniform force distribution, thus improving alignment stability and consistency.

[0031] Because the alignment process is more precise and automated, equipment failures caused by misaligned parts are reduced, thereby lowering the failure rate of preventive maintenance (PM).

[0032] This invention can increase equipment uptime: reduce equipment downtime caused by misaligned parts, improve equipment uptime, and increase production efficiency. Attached Figure Description

[0033] The accompanying drawings are intended to illustrate the general characteristics of the methods, structures, and / or materials used in specific exemplary embodiments of the invention, supplementing the description in the specification. However, the drawings are schematic diagrams not drawn to scale and may not accurately reflect the precise structural or performance characteristics of any of the given embodiments. The drawings should not be construed as limiting or restricting the range of numerical values ​​or properties covered by exemplary embodiments of the invention. The invention will now be described in further detail with reference to the accompanying drawings and specific embodiments:

[0034] Figure 1 This is a schematic diagram of the usage process of the present invention. Figure 1 .

[0035] Figure 2 This is a schematic diagram of the usage process of the present invention. Figure 2 .

[0036] Figure 3 This is a schematic diagram of the usage process of the present invention. Figure 3 . Detailed Implementation

[0037] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can fully understand other advantages and technical effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through different specific embodiments, and various details in this specification can also be applied based on different viewpoints, with various modifications or changes made without departing from the overall design concept of the invention. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. The following exemplary embodiments of the present invention can be implemented in many different forms and should not be construed as being limited to the specific embodiments set forth herein. It should be understood that these embodiments are provided to make the disclosure of the present invention thorough and complete, and to fully convey the technical solutions of these exemplary embodiments to those skilled in the art. It should be understood that when an element is referred to as "connected" or "combined" to another element, the element can be directly connected or combined to the other element, or there may be intermediate elements. The difference is that when an element is referred to as "directly connected" or "directly combined" to another element, there are no intermediate elements. Throughout the drawings, the same reference numerals always denote the same elements.

[0038] First embodiment;

[0039] This invention provides a center positioning fixture for a semiconductor deposition process equipment base, comprising:

[0040] The deformable body is made of fluororubber and is formed into a hollow cylindrical structure. It is connected to an air tube and deforms when inflated.

[0041] The trachea has one end connected to a gas source and the other end connected to a deformable body, and is used to pressurize the deformable body.

[0042] The tee is connected to the air pipe and is used to connect to the pressure relief valve.

[0043] Preferably, the diameter of the deformable body is less than or equal to the diameter of the through hole of the part being calibrated.

[0044] Second embodiment;

[0045] This invention provides a center positioning fixture for a semiconductor deposition process equipment base, comprising:

[0046] The deformable body is made of fluororubber and is formed into a hollow cylindrical structure. It is connected to an air tube and deforms when inflated.

[0047] The trachea has one end connected to a gas source and the other end connected to a deformable body, and is used to pressurize the deformable body.

[0048] The first pressure sensor is arranged inside the deformable body. When the pressure reaches a first specified threshold, it sends a trigger signal to the gas source to stop the inflation.

[0049] Preferably, the diameter of the deformable body is less than or equal to the diameter of the through hole of the part being calibrated.

[0050] Third embodiment;

[0051] This invention provides a center positioning fixture for a semiconductor deposition process equipment base, comprising:

[0052] The deformable body is made of fluororubber and is formed into a hollow cylindrical structure. It is connected to an air tube and deforms when inflated.

[0053] The trachea has one end connected to a gas source and the other end connected to a deformable body, and is used to pressurize the deformable body.

[0054] The first pressure sensor is arranged inside the deformable body. When the pressure reaches a first specified threshold, it sends a trigger signal to the gas source to stop the inflation.

[0055] The elastic surrounding part is arranged around the part being calibrated. When the air source stops supplying air to the deformable body, it radially clamps the part being calibrated in the through hole of the part being calibrated.

[0056] The elastic surround is a hollow annular strip structure, and the elastic surround is also connected to the air source;

[0057] The second pressure sensor is arranged inside the elastic surround;

[0058] After the air source stops inflating the deformable body, it inflates the elastic surrounding component. When the pressure reaches the second specified threshold, it sends a trigger signal to the air source to stop inflating.

[0059] The first specified threshold and the second specified threshold can be calibrated.

[0060] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that, unless expressly defined herein, terms such as those defined in a general dictionary shall be interpreted as having the meaning consistent with their meaning in the relevant field context, and not as having an idealized or overly formal meaning.

[0061] The present invention has been described in detail above through specific embodiments and examples, but these are not intended to limit the invention. Many modifications and improvements can be made by those skilled in the art without departing from the principles of the invention, and these should also be considered within the scope of protection of the present invention.

Claims

1. A semiconductor deposition process equipment base center positioning jig, characterized by, Comprising: a deformable body formed as a hollow structure, connected to a gas tube, which, when inflated, deforms; a gas tube, one end of which is connected to a gas source, the other end of which is connected to the deformable body, which is used to inflate the deformable body with pressure gas.

2. The semiconductor deposition process equipment susceptor center positioning fixture of claim 1, wherein, Further comprising: a tee connected to the gas tube, which is used to connect a pressure relief valve.

3. The semiconductor deposition process equipment susceptor center positioning fixture of claim 1, wherein: The deformable body is made of fluorine rubber.

4. The semiconductor deposition process equipment susceptor center positioning fixture of claim 1, wherein: The deformable body is formed as a hollow cylinder.

5. The semiconductor deposition process equipment susceptor center positioning fixture of claim 4, wherein: The diameter of the deformable body is less than or equal to the diameter of the through hole of the calibrated part.

6. The semiconductor deposition process equipment susceptor center positioning fixture of claim 1, wherein, Further comprising: a first pressure sensor arranged in the deformable body, which sends a trigger signal to the gas source to stop inflation when the pressure reaches a first specified threshold.

7. The semiconductor deposition process equipment susceptor center positioning fixture of claim 6, wherein, Further comprising: a flexible ring-shaped member arranged around the calibrated part, which radially tightens the calibrated part when the gas source stops inflating the deformable body.

8. The semiconductor deposition process equipment base center positioning jig of claim 7, wherein: the flexible ring-shaped member is a hollow annular belt structure, and the flexible ring-shaped member is also connected to the gas source; a second pressure sensor is arranged in the flexible ring-shaped member; the gas source inflates the flexible ring-shaped member after stopping inflating the deformable body, and the second pressure sensor sends a trigger signal to the gas source to stop inflation when the pressure reaches a second specified threshold.

Images