Temperature, humidity and pressure composite sensor

Abstract

The invention, which relates to the technical field of the sensor, discloses a temperature-humidity-pressure composite sensor comprising a housing, a first PCBA board, a second PCBA board, a mounting seat and a protective cover. The peripheral side of the shell is provided with external threads used for connection and installation, the installation base is arranged in the shell, the first PCBA board and the second PCBA board are fixedly connected to the two opposite sides of the installation base respectively, and the first PCBA board is electrically connected to the second PCBA board. The first PCBA board is provided with an acquisition device for detecting temperature, pressure and humidity, and the protective cover is connected to the shell and covers the first PCBA board; the second PCBA board is provided with a power supply and a signal processing device, and one end, far away from the first PCBA board, of the second PCBA board is provided with an electrical interface; and a pouring sealant is poured in the shell, is arranged on one side, facing the second PCBA board, of the mounting seat, and is fixedly connected with the second PCBA board, the shell and the mounting seat. The invention has the advantages of simplicity in manufacturing, high assembly efficiency and low cost.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a temperature, humidity and pressure composite sensor. Background Technology

[0002] A temperature, humidity, and pressure composite sensor is a measurement sensor that integrates temperature, humidity, and pressure detection. It is installed in various electromechanical equipment, cabinets, and other systems to measure the ambient temperature, humidity, and pressure. These sensors are typically threaded, with the sensor housing machined with mounting threads, and are securely mounted to the equipment panel using washers and nuts.

[0003] A prior art temperature, humidity, and pressure composite sensor includes a housing, a PCBA board, a sintered metal base, and a protective cover. The housing covers the PCBA board and has threads for mounting connections. A data acquisition circuit assembly and a conditioning circuit assembly are soldered onto the PCBA board. The data acquisition circuit assembly is located at one end of the PCBA board and is used to acquire temperature, humidity, and pressure parameters. The protective cover covers the PCBA board at the end where the data acquisition circuit is located. The sintered metal base is mounted on the PCBA board and located between the data acquisition circuit assembly and the conditioning circuit assembly, serving as the structural and circuit connection. The sintered metal base has pins for electrical connection to the two PCBA sides. Specifically, the pins are sealed to the metal base using a glass sintering process, with both ends of the pins extending out from both sides of the sintered metal base. The glass serves as a seal and insulation.

[0004] During the assembly of this sensor, the pins on both sides of the metal sintering base need to be bent into shape and then welded to the PCBA boards on both sides. At the same time, the metal sintering base and the outer shell are connected by welding. The PCBA is positioned by the machining groove on the metal sintering base. This process has problems such as complex manufacturing process, low yield, and high cost. Summary of the Invention

[0005] The purpose of this invention is to provide a temperature, humidity and pressure composite sensor, which has the advantages of simple manufacturing, high assembly efficiency and low cost.

[0006] The above-mentioned technical objective of the present invention is achieved through the following technical solution: This invention provides a temperature, humidity, and pressure composite sensor, which includes a housing, a first PCBA board, a second PCBA board, a mounting base, and a protective cover. The outer periphery of the housing is provided with external threads for connection and installation. The mounting base is disposed inside the housing. The first PCBA board and the second PCBA board are respectively fixedly connected to opposite sides of the mounting base, and the first PCBA board is electrically connected to the second PCBA board. The first PCBA board is equipped with a data acquisition device for detecting temperature, pressure and humidity. The protective cover is connected to the outer shell and covers the first PCBA board. The second PCBA board is equipped with a power supply and signal processing device. The end of the second PCBA board away from the first PCBA board extends out of the outer shell and is equipped with an electrical interface. The outer casing is filled with potting compound, which is located on the side of the mounting base facing the second PCBA board. The potting compound fixes the second PCBA board, the outer casing, and the mounting base.

[0007] Furthermore, the mounting base is integrally injection molded with a connecting pin. The first end and the second end of the connecting pin extend from opposite sides of the mounting base and are bent radially. The first PCBA board is provided with a first connecting hole that is inserted and electrically connected to the first end of the connecting pin. The second PCBA board is provided with a second connecting hole that is inserted and electrically connected to the second end of the connecting pin.

[0008] Furthermore, the outer shell has a limiting step protruding radially inward, the limiting step being disposed on the side of the mounting base facing the first PCBA board, and the mounting base abutting against the limiting step axially.

[0009] Furthermore, an annular sealing groove is formed around the periphery of the mounting base, and a sealing ring is disposed within the annular sealing groove, the sealing ring sealing the periphery of the mounting base and the inner wall of the outer shell.

[0010] Furthermore, the housing is provided with a support step and a limiting buckle. The support step abuts against one side of the second PCBA board, and the limiting buckle engages with the other side of the second PCBA board.

[0011] Furthermore, a second guide notch is provided on the outer edge of the second PCBA board, and a second guide protrusion perpendicular to the surface of the second PCBA board is provided inside the outer shell, the second guide protrusion cooperating with the second guide notch.

[0012] Furthermore, a limiting flange is radially protruding on the outer periphery of the housing, the limiting flange being disposed at the end of the external thread of the housing, and the diameter of the limiting flange being larger than the diameter of the portion of the housing with the external thread.

[0013] Furthermore, the mounting base is a rubber sealing plug, the first PCBA board and the second PCBA board are integrally connected, the mounting base has a through hole, the first PCBA board passes through the through hole and extends out of the mounting base on the side facing the protective cover.

[0014] Furthermore, a connecting plate portion is integrally connected between the first PCBA board and the second PCBA board. The width of the connecting plate portion is smaller than the width of the first PCBA board and the second PCBA board. The through hole fits into the connecting plate portion. The mounting base has an expansion joint that communicates with the through hole. The expansion joint extends along the width direction of the connecting plate portion and penetrates the outer periphery of the mounting base.

[0015] Furthermore, a limiting protrusion is radially protruding from the outer periphery of the mounting base, and a limiting annular groove is provided on the inner wall of the outer shell, with the limiting protrusion embedded in the limiting annular groove; And / or, the mounting base is in the shape of a frustum with a diameter that gradually decreases along the direction close to the second PCBA board, and a constricted portion is formed inside the housing to fit the mounting base, and the mounting base is limited and fitted to the constricted portion.

[0016] In summary, the present invention has the following beneficial effects: 1. In the temperature, humidity and pressure composite sensor, the temperature, pressure and humidity information of the environment are collected by the acquisition device on the first PCBA board. A protective cover is placed outside the first PCBA board to protect the acquisition device. The second PCBA board is electrically connected to the first PCBA board. The power supply and signal processing device on the second PCBA board supplies power to the first PCBA board and processes the detection information of the first PCBA board. The second PCBA board is connected to an external power supply and control system through an electrical interface, thereby supplying power to the temperature, humidity and pressure composite sensor and outputting detection information.

[0017] The first PCBA board and the second PCBA board are fixedly connected to the opposite sides of the mounting base and electrically connected. The second PCBA board is fixedly connected to the shell and the mounting base by potting compound. Therefore, there is no need to set up a metal sintering base or to perform welding connection process on the metal sintering base. Only potting compound is used for potting and fixing. This makes the temperature, humidity and pressure composite sensor manufacturing process simple, assembly efficiency high, yield good, and cost low, making it suitable for large-scale production.

[0018] 2. The mounting base is integrally injection molded with connecting pins. Compared to the traditional metal sintered base solution that uses glass sintering to fix the pins to the metal sintered base, this solution simplifies the setting of connecting pins and reduces process costs. The two ends of the connecting pins extend and bend towards the opposite side of the mounting base. The first PCBA board and the second PCBA board are respectively provided with the first connecting hole and the second connecting hole. Therefore, when assembling and manufacturing this temperature, humidity and pressure composite sensor, it is only necessary to install the first connecting plate on one side of the mounting base so that the first end of the connecting pin mates with the first connecting hole, and install the second connecting plate on the other side of the mounting base so that the second end of the connecting pin mates with the second connecting hole. This achieves the physical connection of the first PCBA board, the mounting base and the second PCBA board as well as the electrical connection of the first PCBA board and the second PCBA board. The operation is simple and quick, and the assembly efficiency is high.

[0019] 3. The side of the mounting base facing the first PCBA board abuts against the limiting step axially. Thus, when potting compound is poured, the potting compound acts on the side of the mounting base facing the second PCBA board. The side of the mounting base facing the first PCBA board is axially limited by the limiting step, making it difficult for the mounting base to move axially under the action of the potting compound, thus ensuring the quality of the finished product. The mounting base is pressed tightly against the limiting step under the action of the potting compound, improving the sealing between the mounting base and the housing. The potting compound is less likely to enter the side where the first PCBA board is located and affect the first PCBA board.

[0020] 4. The mounting base is sealed against the inner wall of the housing by the outer circumferential sealing ring, which further makes it difficult for potting compound to enter the side of the mounting base facing the first PCBA board.

[0021] 5. The second bracket is equipped with a support step and a limiting buckle. When the second PCBA board is installed, the second PCBA board is engaged with the limiting buckle and abuts against the support step. The support step and the limiting buckle limit the second PCBA board on opposite sides of the board surface perpendicular to the second PCBA board, so that the second PCBA board is less likely to shake during glue pouring, thus improving the yield.

[0022] 6. The second guide bump engages with the second guide notch to facilitate the positioning of the second PCBA board within the second bracket and its engagement with the connecting pins on the mounting base; simultaneously, the second guide notch and the second guide bump engage to transmit stress along the axial direction of the housing, further preventing the second PCBA board from shifting along the axial direction of the housing and improving the stability of the temperature, humidity and pressure composite sensor assembly.

[0023] 7. In one embodiment, the mounting base uses a rubber sealing plug, and the first PCBA board and the second PCBA board are integrally connected and mate with the through hole on the mounting base. This connects the first PCBA board, the second PCBA board, and the mounting base into a single unit, ensuring electrical connection between the first PCBA board and the second PCBA board. This arrangement further reduces the number of parts to be installed, reduces labor costs, and improves manufacturing efficiency.

[0024] 8. A connecting plate is integrally formed between the first PCBA board and the second PCBA board. The width of the connecting plate is smaller than the width of the first PCBA board and the second PCBA board, and the connecting plate fits into the through hole. This makes the first PCBA board and the second PCBA board confined to the mounting base, and the overall structure is more stable. The connecting plate can be deformed by the expansion joint and squeezed into the through hole, which facilitates the connection with the mounting base. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the vertical cross-sectional structure of the temperature, humidity and pressure composite sensor according to Embodiment 1 of the present invention.

[0026] Figure 2 This is a schematic diagram of the temperature, humidity and pressure composite sensor of Embodiment 1 of the present invention mounted on the mounting plate.

[0027] Figure 3 This is a three-dimensional structural diagram of the mounting base, the first PCBA board, and the second PCBA board according to Embodiment 1 of the present invention.

[0028] Figure 4 This is an exploded structural diagram of the mounting base, the first PCBA board, and the second PCBA board according to Embodiment 1 of the present invention.

[0029] Figure 5 This is a three-dimensional structural schematic diagram of the temperature, humidity and pressure composite sensor of Embodiment 1 of the present invention.

[0030] Figure 6 This is an exploded structural diagram of the temperature, humidity and pressure composite sensor of Embodiment 1 of the present invention.

[0031] Figure 7 This is a schematic diagram of the vertical cross-sectional structure of the temperature, humidity and pressure composite sensor of Embodiment 2 of the present invention.

[0032] Figure 8 This is a three-dimensional structural diagram of the mounting base, the first PCBA board, and the second PCBA board according to Embodiment 2 of the present invention.

[0033] Figure 9 This is an exploded structural diagram of the mounting base, the first PCBA board, and the second PCBA board according to Embodiment 2 of the present invention.

[0034] Figure 10 This is an exploded structural diagram of the temperature, humidity and pressure composite sensor of Embodiment 2 of the present invention.

[0035] In the picture: 1000, Temperature, Humidity, and Pressure Composite Sensor; 100, Housing; 110, External Thread; 120, Limiting Step; 130, Limiting Flange; 140, Limiting Annular Groove; 200, First PCBA Board; 210, Data Acquisition Device; 220, First Connecting Hole; 230, First Guide Notch; 240, Connecting Plate; 300, Second PCBA Board; 310, Electrical Interface; 320, Second Connecting Hole; 330, Second Guide Notch; 400 410. Mounting base; 420. Connecting pin; 430. Annular sealing groove; 441. Sealing ring; 450. First bracket; 461. First guide protrusion; 470. Second bracket; 480. Support step; 492. Limiting buckle; 403. Second guide protrusion; 460. Through hole; 470. Expansion joint; 480. Limiting protrusion; 500. Protective cover; 600. Nut; 700. Washer; 800. Mounting plate; 900. Encapsulating adhesive. Detailed Implementation

[0036] The invention will now be further described with reference to the accompanying drawings.

[0037] Example 1 This embodiment discloses a temperature, humidity, and pressure composite sensor 1000, referring to... Figure 1 The temperature, humidity, and pressure composite sensor 1000 includes a housing 100, a first PCBA board 200, a second PCBA board 300, a mounting base 400, and a protective cover 500. The outer periphery of the housing 100 is provided with external threads 110 for connection and installation. The mounting base 400 is disposed inside the housing 100. The first PCBA board 200 and the second PCBA board 300 are respectively fixedly connected to opposite sides of the mounting base 400, and the first PCBA board 200 is electrically connected to the second PCBA board 300. The protective cover 500 covers the first PCBA board 200 to protect it.

[0038] Reference Figure 1 , Figure 2 and Figure 5 In this embodiment, the temperature, humidity, and pressure composite sensor 1000 is installed at the desired location by engaging with the nut 600 through the external thread 110 on the outer periphery of the housing 100. Specifically, a through hole is formed in the mounting plate 800 at the desired installation location. After the gasket 700 is fitted onto the housing 100, it passes through the through hole in the mounting plate 800. Then, the nut 600 is threaded onto the external thread 110 of the housing 100 and tightened.

[0039] Reference Figure 2 and Figure 5 A limiting flange 130 is radially protruding from the outer periphery of the housing 100, and the limiting flange 130 is disposed at the end of the external thread 110 of the housing 100. The diameter of the limiting flange 130 is larger than the diameter of the portion of the housing 100 with the external thread 110. The side of the washer 700 away from the nut 600 abuts against the limiting flange 130 so that the nut 600 is threadedly locked into the housing 100.

[0040] Reference Figure 3 and Figure 4 The first PCBA board 200 is equipped with a data acquisition device 210 for detecting temperature, pressure, and humidity. A protective cover 500 is connected to the outer casing 100 and covers the first PCBA board 200. Specifically, the data acquisition device 210 may include a temperature sensor, a pressure sensor, and a humidity sensor. The temperature sensor, pressure sensor, and humidity sensor are conventional existing technologies (such as thermistors, piezoresistors, and hygroscopic resistors), which will not be described in detail here. The temperature sensor, pressure sensor, and humidity sensor are soldered and fixed to the first PCBA board 200 and electrically connected to the first PCBA board 200.

[0041] The second PCBA board 300 is equipped with power supply and signal processing devices, which are soldered onto and electrically connected to the second PCBA board 300. One end of the second PCBA board 300, furthest from the first PCBA board 200, extends out of the housing 100 and is equipped with an electrical interface 310. The second PCBA board 300 connects to an external power supply and control system via the electrical interface 310, thereby powering the temperature, humidity, and pressure composite sensor 1000 and outputting detection information.

[0042] Reference Figures 1 to 6 In this embodiment, the mounting base 400 is installed inside the housing. Specifically, after the first PCBA board 200 and the second PCBA board 300 are respectively connected to opposite sides of the mounting base 400 along the axial direction of the housing 100, potting compound 900 is injected into the housing 100. The potting compound 900 is disposed on the side of the mounting base 400 facing the second PCBA board 300, and the potting compound 900 fixes the second PCBA board 300, the housing 100, and the mounting base 400. Therefore, there is no need to set up a metal sintering base, nor is there a need for welding connection operations on the metal sintering base. Only potting compound 900 is used for potting and fixing, making the temperature, humidity, and pressure composite sensor 1000 simple to manufacture, with high assembly efficiency, good yield, and low cost, suitable for large-scale production.

[0043] In this embodiment, the mounting base 400 is an injection molded part, and a connecting pin 410 is integrally injection molded inside the mounting base 400. The first end and the second end of the connecting pin 410 respectively extend from opposite sides of the mounting base 400 and are bent radially (i.e., the two ends of the connecting pin 410 are bent at 90°). The first PCBA board 200 is provided with a first connecting hole 220 that is inserted and electrically connected to the first end of the connecting pin 410, and the second PCBA board 300 is provided with a second connecting hole 320 that is inserted and electrically connected to the second end of the connecting pin 410. When assembling and manufacturing the temperature, humidity, and pressure composite sensor 1000, it is only necessary to mount the first connecting plate on one side of the mounting base 400, so that the first end of the connecting pin 410 mates with the first connecting hole 220, and mount the second connecting plate on the other side of the mounting base 400, so that the second end of the connecting pin 410 mates with the second connecting hole 320. This achieves the physical connection between the first PCBA board 200, the mounting base 400, and the second PCBA board 300, as well as the electrical connection between the first PCBA board 200 and the second PCBA board 300. The operation is simple and quick, and the assembly efficiency is high. Compared with the traditional solution of fixing the pins to the metal sintered base through glass sintering process, the connection pin 410 setting in this solution is simpler and the process cost is lower.

[0044] Multiple connector pins 410 are provided, and correspondingly, the number of first connector holes 220 and second connector holes 320 is the same as the number of connector pins 410, so that multiple current and signal transmissions can be performed between the first PCBA board 200 and the second PCBA board 300. In this embodiment, four connector pins 410 are specifically provided, two of which are used to form a current supply loop and the other two are used to form an information transmission loop; correspondingly, four first connector holes 220 and four second connector holes 320 are provided. In addition, in other embodiments, the number of connector pins 410 may also be provided.

[0045] Reference Figure 1The outer casing 100 has a radially inwardly protruding limiting step 120, which is located on the side of the mounting base 400 facing the first PCBA board 200. The mounting base 400 abuts against the limiting step 120 axially, thus limiting the mounting base 400 on the side of the mounting base 400 facing the first PCBA board 200. When potting compound 900 is poured, the potting compound 900 acts on the side of the mounting base 400 facing the second PCBA board 300. The side of the mounting base 400 facing the first PCBA board 200 is axially limited by the limiting step 120, making it difficult for the mounting base 400 to shift axially under the action of the potting compound 900, ensuring the quality of the finished product. At the same time, the mounting base 400 is pressed tightly against the limiting step 120 under the action of the potting compound 900, improving the sealing between the mounting base 400 and the outer casing 100, and preventing the potting compound 900 from entering the side where the first PCBA board 200 is located and affecting the first PCBA board 200.

[0046] Reference Figure 3 and Figure 4 A ring-shaped sealing groove 420 is formed around the periphery of the mounting base 400, and a sealing ring 430 is provided inside the ring-shaped sealing groove 420. The sealing ring 430 seals the periphery of the mounting base 400 and the inner wall of the outer shell 100, further improving the sealing performance between the mounting base 400 and the inner wall of the outer shell 100, making it difficult for the potting compound 900 to enter the side of the mounting base 400 facing the first PCBA board 200.

[0047] Reference Figures 3 to 6 A second bracket 450 is fixedly connected to the side of the mounting base 400 facing the second PCBA board 300. In this embodiment, the second bracket 450 and the mounting base 400 are integrally injection molded to improve the overall structural strength and reduce the number of mold openings. Both the second bracket 450 and the mounting base 400 are approximately cylindrical in shape so as to be assembled into the housing 100.

[0048] The second bracket 450 includes a support step 451 and a limiting buckle 452. The support step 451 abuts against one side of the second PCBA board 300, and the limiting buckle 452 engages with the other side of the second PCBA board 300. When the second PCBA board 300 is installed, it engages with the limiting buckle 452 and abuts against the support step 451. The support step 451 and the limiting buckle 452 limit the second PCBA board 300 on opposite sides perpendicular to its surface, making the overall structure more stable and preventing it from shaking during glue application, thus improving the yield rate.

[0049] Reference Figure 4The second PCBA board 300 has a second guide notch 330 along its outer edge, and the second bracket 450 has a second guide protrusion 453 perpendicular to the surface of the second PCBA board 300. The second guide protrusion 453 engages with the second guide notch 330. Thus, the engagement of the second guide notch 330 and the second guide protrusion 453 guides the assembly of the second PCBA board 300, facilitating its positioning within the second bracket 450 and engagement with the connecting pins 410 on the mounting base 400. Simultaneously, the engagement of the second guide notch 330 and the second guide protrusion 453 transmits stress along the axial direction of the housing 100, further preventing the second PCBA board 300 from shifting along the axial direction of the housing 100 and improving the assembly stability of the temperature, humidity, and pressure composite sensor 1000.

[0050] Reference Figures 3 to 6 A first bracket 440 is fixedly connected to the side of the mounting base 400 facing the first PCBA board 200. The first bracket 440 and the mounting base 400 are integrally injection molded, and the first PCBA board 200 is installed in the first bracket 440.

[0051] Preferably, a first guide notch 230 is provided on the outer edge of the first PCBA board 200, and a first guide protrusion 441 perpendicular to the surface of the first PCBA board 200 is provided inside the first bracket 440. The first guide protrusion 441 engages with the first guide notch 230. Thus, the engagement of the first guide notch 230 and the first guide protrusion 441 guides the assembly of the first PCBA board 200, facilitating the positioning of the first PCBA board 200 within the second bracket 450 and its engagement with the connecting pins 410 on the mounting base 400.

[0052] In this embodiment, the protective cover 500 is made of sintered metal powder to form a microporous structure, which effectively isolates contaminants such as dust and liquid water, providing IP protection for the temperature, pressure, and humidity acquisition device 210. The protective cover 500 is installed over the first PCBA board 200 and snaps onto the end of the housing 100. In other embodiments, the protective cover 500 may also be connected to the housing 100 by threaded connection, welding, or other suitable methods.

[0053] The manufacturing steps of a temperature, humidity, and pressure composite sensor 1000 in this embodiment are as follows: First, the first PCBA board 200 and the second PCBA board 300 are respectively installed into the first bracket 440 and the second bracket 450. The first connecting hole 220 on the first PCBA board 200 and the first end of the connecting pin 410 are inserted and engaged. The second PCBA board 300 is engaged with the limiting buckle 452. The second connecting hole 320 on the second PCBA board 300 and the second end of the connecting pin 410 are inserted and engaged. Then, the sealing ring 430 is installed into the annular sealing groove 420. The first PCBA board 200, the mounting base 400, and the second PCBA board 300 are connected together and installed into the housing 100, so that the mounting base 400 abuts against the limiting step 120. Then, the protective cover 500 is installed on the side of the housing 100 where the first PCBA board 200 is installed. The potting compound 900 is poured from the side of the housing 100 away from the protective cover 500. The curing port of the potting compound 900 fixes the second PCBA board 300, the housing 100 and the mounting base 400 together.

[0054] Example 2 This embodiment discloses a temperature, humidity, and pressure composite sensor 1000, which is largely the same as the temperature, humidity, and pressure composite sensor 1000 in Embodiment 1, except that: Reference Figures 7 to 10 In this embodiment, the mounting base 400 is a rubber sealing plug, and the first PCBA board 200 and the second PCBA board 300 are integrally connected as a whole. The mounting base 400 has a through hole 460, through which the first PCBA board 200 passes and extends out of the mounting base 400 on the side facing the protective cover 500, thereby connecting the first PCBA board 200, the second PCBA board 300, and the mounting base 400 into a whole and ensuring the electrical connection between the first PCBA board 200 and the second PCBA board 300. This arrangement further reduces the number of parts to be installed, reduces labor costs, and improves manufacturing efficiency.

[0055] In this embodiment, a connecting plate portion 240 is integrally connected between the first PCBA board 200 and the second PCBA board 300. The width of the connecting plate portion 240 is smaller than the width of the first PCBA board 200 and the second PCBA board 300. The through hole 460 fits into the connecting plate portion 240, thereby limiting the first PCBA board 200 and the second PCBA board 300 to the mounting base 400 in the axial, circumferential, and radial directions, resulting in a more stable overall structure.

[0056] Reference Figure 8 and Figure 9The mounting base 400 has an expansion joint 470 that connects to the through hole 460. The expansion joint 470 extends along the width direction of the connecting plate portion 240 and penetrates the outer periphery of the mounting base 400. When assembling the mounting base 400 and the first PCBA board 200 and the second PCBA board 300, the connecting plate portion 240 can be squeezed into the through hole 460 after deformation of the expansion joint 470, which facilitates the connection with the mounting base 400.

[0057] Reference Figure 7 The mounting base 400 has a radially protruding limiting protrusion 480 on its outer periphery, and the inner wall of the outer shell 100 has a limiting annular groove 140, in which the limiting protrusion 480 is embedded. The limiting annular groove 140 axially limits the mounting base 400, making it less likely for the mounting base 400 to move axially when the potting compound 900 is poured.

[0058] In this embodiment, the mounting base 400 is a frustum-shaped structure with its diameter gradually decreasing towards the direction of the second PCBA board 300. A constricted portion is formed inside the outer shell 100 to fit the mounting base 400, and the mounting base 400 is positioned and fitted within the constricted portion. When assembling the mounting base 400 inside the outer shell 100, the mounting base 400 is squeezed into the outer shell 100, causing the outer periphery of the frustum-shaped mounting base 400 to fit and press against the constricted portion, sealing the inner cavity of the outer shell 100. This prevents potting compound from easily entering the first PCBA board 200 and affecting it.

[0059] The above description is only a preferred embodiment of the present invention. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the claims of this patent application are included in the scope of this patent application.

Claims

1. A temperature-humidity-pressure composite sensor, characterized by comprising: The temperature and humidity pressure composite sensor (1000) comprises a shell (100), a first PCBA board (200), a second PCBA board (300), a mounting seat (400) and a protective cover (500); an outer thread (110) for connecting installation is arranged on the outer circumferential side of the shell (100), the mounting seat (400) is arranged in the shell (100), the first PCBA board (200) and the second PCBA board (300) are fixedly connected to the opposite sides of the mounting seat (400) respectively, and the first PCBA board (200) is electrically connected to the second PCBA board (300); The first PCBA board (200) is provided with a collection device (210) for detecting temperature, pressure and humidity, the protective cover (500) is connected to the shell (100) and covers the first PCBA board (200) outside; the second PCBA board (300) is provided with a power supply and a signal processing device, and the end of the second PCBA board (300) away from the first PCBA board (200) extends out of the shell (100) and is provided with an electrical interface (310); The shell (100) is filled with a pouring sealant (900), the pouring sealant (900) is arranged on the side of the mounting seat (400) facing the second PCBA board (300), and the pouring sealant (900) fixedly connects the second PCBA board (300), the shell (100) and the mounting seat (400).

2. A combined temperature, humidity and pressure sensor as claimed in claim 1, characterized in that The mounting seat (400) is integrally injection molded with a connecting pin (410), the first end and the second end of the connecting pin (410) respectively pass through the opposite sides of the mounting seat (400) and are radially bent, the first PCBA board (200) is provided with a first connecting hole (220) which is inserted and matched with the first end of the connecting pin (410) and is electrically connected, and the second PCBA board (300) is provided with a second connecting hole (320) which is inserted and matched with the second end of the connecting pin (410) and is electrically connected.

3. A combined temperature, humidity and pressure sensor as claimed in claim 1, characterized in that The shell (100) is radially convex to the inside and is provided with a limiting step (120), the limiting step (120) is arranged on the side of the mounting seat (400) facing the first PCBA board (200), and the mounting seat (400) abuts the limiting step (120) in the axial direction.

4. A combined temperature, humidity and pressure sensor as claimed in claim 3, characterized in that The mounting seat (400) is provided with an annular sealing groove (420) on the circumferential side, the annular sealing groove (420) is provided with a sealing ring (430), and the sealing ring (430) seals the circumferential side of the mounting seat (400) and the inner wall of the shell (100).

5. A combined temperature, humidity and pressure sensor as claimed in claim 1, characterized in that The mounting seat (400) is fixedly connected with a second support (450) on one side facing the second PCBA board (300), the second support (450) is provided with a supporting step (451) and a limiting buckle (452), the supporting step (451) abuts against one side of the second PCBA board (300), and the limiting buckle (452) is clamped on the other side of the second PCBA board (300).

6. A combined temperature, humidity and pressure sensor as claimed in claim 5, characterized in that The second PCBA board (300) is provided with a second guide notch (330) on the outer edge, and the second support (450) is provided with a second guide protrusion (453) perpendicular to the surface of the second PCBA board (300), and the second guide protrusion (453) is matched with the second guide notch (330).

7. A combined temperature, humidity and pressure sensor as claimed in claim 1, characterized in that The outer periphery of the shell (100) is radially provided with a limiting flange (130), the limiting flange (130) is arranged at the end of the outer thread (110) of the shell (100), and the diameter of the limiting flange (130) is greater than the diameter of the part of the shell (100) provided with the outer thread (110).

8. A combined temperature, humidity and pressure sensor as claimed in claim 1, characterized in that The mounting seat (400) is a rubber sealing plug, the first PCBA board (200) and the second PCBA board (300) are integrally connected, the mounting seat (400) is provided with a through hole (460), the first PCBA board (200) passes through the through hole (460) and extends to one side of the mounting seat (400) facing the protective cover (500).

9. A combined temperature, humidity and pressure sensor as claimed in claim 8, characterized in that The first PCBA board (200) and the second PCBA board (300) are integrally connected with a connecting plate portion (240), the width of the connecting plate portion (240) is less than the width of the first PCBA board (200) and the second PCBA board (300), the through hole (460) is matched with the connecting plate portion (240), the mounting seat (400) is provided with a deformation seam (470) communicating with the through hole (460), the deformation seam (470) extends along the width direction of the connecting plate portion (240) and penetrates the outer periphery of the mounting seat (400).

10. A combined temperature, humidity and pressure sensor as claimed in claim 8, characterized in that The outer periphery of the mounting seat (400) is radially provided with a limiting flange (480), the inner wall of the shell (100) is provided with a limiting ring groove (140), and the limiting flange (480) is embedded in the limiting ring groove (140); And / or, the mounting seat (400) is a circular truncated cone shape with a gradually decreasing diameter in the direction close to the second PCBA board (300), the shell (100) is formed with a necked portion matched with the mounting seat (400), and the mounting seat (400) is limitedly matched with the necked portion.

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