Automatic detection system and detection method for single-wafer rod

Abstract

The invention provides an automatic detection system and method for a single-wafer rod, and relates to the technical field of detection. The system comprises a conveying assembly, a mounting frame, an appearance detection assembly, a robot, an electrical performance detection assembly and a controller. The mounting frame is arranged on the top of the conveying assembly. The appearance detection assembly is installed on the installation frame, and the detection end of the appearance detection assembly faces the conveying assembly. After the appearance detection assembly is installed, the appearance detection assembly can move in the X-axis direction and the Z-axis direction of the installation frame. The robot is installed on one side of the conveying assembly. The electrical performance detection assembly is installed on the robot through the installation plate. The controller is electrically connected with the conveying assembly, the mounting frame, the appearance detection assembly, the robot and the electrical performance detection assembly. Through the detection system, the detection efficiency and the accuracy of detection data can be improved, the missing detection condition is reduced and traceable, and potential safety hazards in the operation process of personnel are avoided. The invention further discloses an automatic detection method for the single-crystal round bar.

Description

Technical Field

[0001] This invention relates to the field of detection technology, and in particular to an automatic detection system and method for single crystal wafer rods. Background Technology

[0002] Currently, the industry mainly relies on manual inspection of single crystal wafers by placing the BCT400 inspection device against the end face of the single crystal wafer and manually pressing a button to activate the BCT400 inspection device to measure minority carriers and electrical resistance.

[0003] The visual inspection of single crystal wafers mainly relies on manual inspection using flashlights to gradually locate defects such as edge chipping and microcracks on the end faces. The data obtained from the inspection is then manually entered into the system to determine the condition of the crystal wafer. The entire inspection process is labor-intensive, time-consuming, and also suffers from problems such as inconsistent inspection locations and inaccurate inspection data. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides an automated single-crystal ingot inspection system. This system improves inspection efficiency, data accuracy, reduces missed detections, provides traceability, and eliminates safety hazards during manual operation. This invention also discloses an automated single-crystal ingot inspection method.

[0005] The technical solution adopted in this invention is:

[0006] An automatic inspection system for single-crystal wafers includes:

[0007] Conveying components;

[0008] Mounting bracket, mounted on top of the conveying assembly;

[0009] An appearance inspection component is mounted on the mounting frame, with its inspection end facing the conveying component. After the appearance inspection component is installed, it can move along the X-axis and Z-axis of the mounting frame.

[0010] A robot is mounted on one side of the conveying assembly;

[0011] An electrical performance testing component is mounted on the robot via a mounting plate.

[0012] The controller is electrically connected to the conveying assembly, mounting frame, appearance inspection assembly, robot, and electrical performance testing assembly.

[0013] Optionally, the conveying component can be added as required, and the added conveying component is equipped with the mounting frame, appearance inspection component, robot, and electrical performance inspection component installed on the robot.

[0014] Optionally, the mounting frame comprises:

[0015] a frame mounted on top of the conveying assembly by a gantry or a truss in the factory;

[0016] a slide rail mounted on the frame, the mounting direction of the slide rail being the same as the conveying direction of the conveying assembly;

[0017] two driving members respectively mounted at two ends of the slide rail;

[0018] two mounting sliders slidingly arranged on the slide rail and respectively connected to the movable ends of the two driving members;

[0019] a mounting rod mounted on the two mounting sliders, and the appearance detection assembly being mounted on the two mounting rods.

[0020] Optionally, the appearance detection assembly comprises:

[0021] a lifting assembly mounted on the mounting rod, the lifting assembly being mounted above the conveying assembly and the movable end of the lifting assembly facing the conveying assembly;

[0022] a light source module mounted on the movable end of the lifting assembly and arranged to face the end surface of the single crystal wafer rod after being mounted;

[0023] an image acquisition device mounted on the light source module and arranged to have its acquisition end facing the end surface of the single crystal wafer rod after being mounted.

[0024] Optionally, the acquisition center of the image acquisition device coincides with the axis of the single crystal wafer rod on the conveying device after being mounted.

[0025] Optionally, the electrical performance detection assembly comprises:

[0026] a BCT400 detection device mounted on the mounting plate;

[0027] a four-probe resistance tester mounted on the mounting plate and located on one side of the BCT400 detection device after being mounted;

[0028] wherein, during the detection process, the BCT400 detection device and the four-probe resistance tester are both in contact with the cross section of the single crystal wafer rod.

[0029] A single crystal wafer rod automatic detection method, comprising the following steps:

[0030] S01, placing a single crystal wafer rod on a conveying device;

[0031] S02, conveying the single crystal wafer rod to an appearance detection station;

[0032] S03, collect image information of the single crystal wafer rod, and identify the significant features in the image information;

[0033] S04, classify the significant features, and eliminate the significant features affecting the subsequent processing, and the significant features not affecting the subsequent processing are normally forwarded;

[0034] S05, the single crystal wafer rod normally forwarded is conveyed to an electrical property detection working position, and the electrical property of the single crystal wafer rod is detected;

[0035] S06, the detection data is input into the system, and whether the crystal rod is qualified is determined according to the input data, and the qualified crystal rod is forwarded to a processing station, and the unqualified crystal rod is forwarded to a reverse cutting station.

[0036] Optionally, the step S03 of collecting the image information of the single crystal wafer rod and identifying the significant features in the image information comprises the following steps.

[0037] S031, the position of the image collection device is adjusted according to the length of the single crystal wafer rod;

[0038] S032, after the image collection device walks to the focal length position, the significant features of the single crystal wafer rod are collected through the visual image.

[0039] Optionally, the significant features include edge collapse and hidden crack.

[0040] Optionally, in the S05, when the single crystal wafer rod is conveyed to the electrical property detection working position, the BCT400 detection device and the four-probe resistance tester are both attached to the end surface of the single crystal wafer rod, and the minority carrier and the resistance of the end surface of the single crystal wafer rod are detected after the attachment.

[0041] Compared with the prior art, the beneficial effects of the present application are:

[0042] 1. The system can automatically detect the single crystal wafer rod, effectively improving the detection efficiency. In the detection process, the measurement error in the manual measurement process can be reduced, the consistency of the detection position can be improved, and the accuracy of the data after detection can be improved.

[0043] 2. The detection efficiency is improved compared with manual detection.

[0044] 3. The detection position is accurate, the consistency is high, and the data is accurate.

[0045] 4. The crystal rod end surface is fully detected, and the missed detection is eliminated.

[0046] 5. The detection data is automatically uploaded and can be traced.

[0047] 6. No manual intervention is needed, and personnel operation safety hazards are eliminated. BRIEF DESCRIPTION OF DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced. Obviously, the accompanying drawings in the following description only represent some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 It is a schematic diagram of the overall structure of the single wafer rod automatic detection system.

[0050] Figure 2 It is a schematic diagram of the mounting rack and the appearance detection assembly of the single wafer rod automatic detection system.

[0051] Figure 3 It is a schematic diagram of the appearance detection assembly.

[0052] Figure 4 It is a schematic diagram of the robot and the electrical performance detection assembly.

[0053] Figure 5 It is a schematic diagram of the conveying assembly.

[0054] Reference signs:

[0055] 1, conveying assembly;

[0056] 2, mounting rack; 21, frame; 22, sliding rail; 23, driving member; 24, mounting sliding block; 25, mounting rod;

[0057] 3, appearance detection assembly; 31, lifting assembly; 32, light source module; 33, image acquisition device;

[0058] 4, robot;

[0059] 5, electrical performance detection assembly; 51, BCT400 detection equipment; 52, four-probe resistance tester;

[0060] 6, controller. DETAILED DESCRIPTION

[0061] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0062] In the description of the application, it needs to be understood that the terms "center", "top", "bottom", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0063] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, or it can be communicated; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0064] In the present application, unless otherwise explicitly specified and limited, "on" or "under" the first feature of the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0065] The following disclosure provides many different embodiments or examples for implementing different structures of the application. In order to simplify the disclosure of the application, the components and arrangements of specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the application. In addition, the present application can repeatedly refer to the same reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0066] The embodiments of the application will be described in detail below with reference to the accompanying drawings.

[0067] As Figure 1As shown, the embodiment of the present application provides a single wafer rod automatic detection system, which comprises a conveying assembly 1, a mounting frame 2, an appearance detection assembly 3, a robot 4, an electrical performance detection assembly 5 and a controller 6. The mounting frame 2 is on the top of the conveying assembly 1. The appearance detection assembly 3 is mounted on the mounting frame 2, and the detection end of the appearance detection assembly 3 is arranged towards the conveying assembly 1. When the appearance detection assembly 3 is mounted, the appearance detection assembly 3 can move along the X-axis and Z-axis directions of the mounting frame 2. The robot 4 is mounted on one side of the conveying assembly 1. The electrical performance detection assembly 5 is mounted on the robot 4 through a mounting plate (the mounting plate is mounted on the flange of the sixth axis of the robot 4, and the electrical performance detection assembly 5 is contacted with the end face of the single wafer rod through the shaft movement and rotation. The controller 6 is electrically connected with the conveying assembly 1, the mounting frame 2, the appearance detection assembly 3, the robot 4 and the electrical performance detection assembly 5.

[0068] When the single wafer rod is detected, the single wafer rod is placed on the conveying assembly 1. The single wafer rod is conveyed to the lower side of the mounting frame 2 through the conveying assembly 1. The position of the appearance detection assembly 3 mounted on the mounting frame 2 is adjusted according to the size information of the single wafer rod. Then the appearance information of the single wafer rod is detected through the appearance detection assembly 3. If the single wafer rod meets the subsequent processing conditions after detection, it is normally forwarded to the electrical performance detection station, and the electrical performance of the single wafer rod is detected through the electrical performance detection assembly 5. If it does not meet the subsequent processing conditions after detection, it is recycled.

[0069] In the detection process, the electrical performance detection assembly 5 is mounted on the flange of the sixth axis of the robot 4, and the electrical performance detection assembly 5 is contacted with the end face of the single wafer rod through the shaft movement and rotation. After contact, the data of the single wafer rod is collected.

[0070] In the appearance detection process, the more specific detection process is as follows: when the single wafer rod is located on the appearance detection station, the controller 6 controls the movement of the appearance detection assembly 3, the appearance detection assembly 3 moves along the X-axis and Z-axis of the mounting frame 2, so that the detection end of the appearance detection assembly 3 directly faces the end face of the single wafer rod, and the image information of the end face is collected. Then whether it meets the subsequent processing conditions is automatically judged according to the collected image information.

[0071] In the electrical performance detection process, the electrical performance detection assembly 5 is in contact with the end face of the single wafer rod.

[0072] The system can automatically detect the single wafer rod, and can effectively improve the detection efficiency. In the detection process, the measurement error in the manual measurement process can be reduced, the consistency of the detection position can be improved, and the problem of improving the accuracy of the data after detection can be solved.

[0073] At the same time, machine inspection can effectively prevent missed inspection, and the data after inspection is automatically uploaded, which is convenient for later tracing.

[0074] It should be noted that the robot 4 in the embodiment is a 6-axis robot 4. The specific structure and working principle are prior art, and will not be described here.

[0075] In one embodiment, as shown in Figure 1 In order to improve the detection efficiency, the conveying assembly 1 can be added as needed, and the added conveying assembly 1 is provided with a mounting frame 21, an appearance detection assembly 3, the robot 4 and the electrical performance detection assembly 5 mounted on the robot 4.

[0076] It should be noted that the conveying device in the embodiment is a roller conveyor, and the rotation direction of the roller is the same as the conveying direction of the single crystal wafer rod.

[0077] As shown in Figure 5 In order to avoid position deviation of the single crystal wafer rod during conveying, the conveying assembly 1 comprises a conveying frame, conveying rollers, a power mechanism and a limiting piece. The conveying frame is fixed on the ground of the factory area by screws. The conveying pipe is provided with a plurality of conveying rollers along the conveying direction of the conveying frame. The power mechanism is installed on the conveying frame and connected with the conveying rollers for driving the conveying rollers to rotate. Two limiting pieces are installed on each conveying roller, and the two limiting pieces form a placing groove for placing the single crystal wafer rod.

[0078] When conveying the single crystal wafer rod, the single crystal wafer rod is placed on the conveying roller and placed in the limiting groove. During conveying, the limiting pieces on both sides of the single crystal wafer rod are used to limit it, so as to avoid deviation or direct falling from the conveying assembly 1 during conveying. Improve the safety of the single crystal wafer rod during conveying.

[0079] It should be noted that the power mechanism in the embodiment is a power mechanism that can drive the roller of the roller conveyor to rotate in the existing design. The specific structure and working principle will not be described here.

[0080] In order to avoid scratching the side wall of the single crystal wafer rod during conveying, one end of the limiting piece has a conical surface, and when the two limiting pieces are installed, the conical surfaces on the limiting pieces are oppositely arranged, and the single crystal wafer rod is in contact with the conical surface during conveying.

[0081] In one embodiment, as shown in Figure 1 and Figure 2As shown, the mounting frame 2 comprises a frame 21, a slide rail 22, two driving members 23, two mounting sliding blocks 24 and a mounting rod 25. The frame 21 is mounted on the top of the conveying assembly 1 through a gantry or a factory truss. The slide rail 22 is mounted on the frame 21, and the mounting direction of the slide rail 22 is the same as the conveying direction of the conveying assembly 1. The two driving members 23 are respectively mounted on the two ends of the slide rail 22. The two mounting sliding blocks 24 are respectively connected with the movable ends of the two driving members 23 and are slidingly arranged on the slide rail 22. The mounting rod 25 is arranged on each of the two mounting sliding blocks 24, and the appearance detection assembly 3 is mounted on the two mounting rods 25.

[0082] When the single crystal wafer rod needs to be detected, the two driving members 23 drive the mounting sliding blocks 24 to move according to the length of the single crystal wafer rod, so that the appearance detection assembly 3 mounted on the mounting rod 25 is located at the two ends of the single crystal wafer rod. The adjustment in this direction is adjustment along the X axis of the mounting frame 2.

[0083] The arrangement of the appearance detection assembly 3 at the two ends of the single crystal wafer rod can effectively improve the detection efficiency.

[0084] It should be noted that the driving member 23 is a cylinder, a hydraulic cylinder, an electric telescopic rod, a linear motor or other mechanisms that can realize linear motion.

[0085] In one embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , the appearance detection assembly 3 comprises a lifting assembly 31, a light source module 32 and an image acquisition device 33. The lifting assembly 31 is mounted on the mounting rod 25, and after being mounted, the lifting assembly 31 is located above the conveying assembly 1, and the movable end of the lifting assembly 31 is arranged towards the conveying assembly 1 after being mounted. The light source module 32 is mounted on the movable end of the lifting assembly 31, and after being mounted, the light source module 32 is arranged towards the end face of the single crystal wafer rod. The image acquisition device 33 is mounted on the light source module 32, and the acquisition end of the image acquisition device 33 is arranged towards the end face of the single crystal wafer rod. When the image acquisition device 33 is mounted, the acquisition center of the image acquisition device 33 coincides with the axis of the single crystal wafer rod on the conveying device.

[0086] When detecting the appearance of the single crystal wafer rod, the X-axis direction is adjusted to the position, and then the position of the Z-axis direction is adjusted by the lifting assembly 31. After the lifting assembly 31 is lowered to the preset position, the center of the collection end of the image collection device 33 mounted on the lifting assembly 31 coincides with the axis of the single crystal wafer rod. After the coincidence, the two-dimensional code information on the end face of the single crystal wafer rod is collected first, and then the image information of the end face is collected. In order to improve the scanning efficiency and the collection of the image information, the light source module 32 is mounted on the movable end of the lifting assembly 31, the image collection device 33 is mounted on the light source module 32, and the light source module 32 provides light for the image collection device 33. The quality of the image information in the collection process is improved, and it is convenient to quickly judge whether the single crystal wafer rod has the edge collapse and hidden crack problems.

[0087] It should be noted that the lifting assembly 31 is a mechanism that can realize linear motion, such as a pneumatic cylinder, a hydraulic cylinder, and an electric telescopic rod. The image collection device 33 is an industrial camera. The light source module 32 is a light supplement device for the existing camera.

[0088] The lifting assembly 31, the image collection device 33, and the light source module 32 are all existing designs, and their specific structures and working principles will not be described here.

[0089] In one embodiment, as shown in Figure 1 and Figure 4 The electrical performance detection assembly 5 includes a BCT400 detection device 51 and a four-probe resistance tester 52. The BCT400 detection device 51 is mounted on the mounting plate. The four-probe resistance tester 52 is mounted on the mounting plate and is located on one side of the BCT400 detection device 51 after installation. During the detection process, the BCT400 detection device 51 and the four-probe resistance tester 52 are in contact with the section of the single crystal wafer rod.

[0090] When the single crystal wafer rod reaches the electrical performance detection station, the robot 4 drives the electrical performance detection assembly 5 to detect it. More specifically, the BCT400 detection device 51 and the four-probe resistance tester 52 are fixed to the mounting plate on the robot 4, and the robot 4 drives the electrical performance detection assembly 5 to automatically move to the corresponding detection position according to different rod diameters. During detection, the BCT400 detection device 51 and the four-probe resistance tester 52 are attached to the end face of the single crystal wafer rod. After attachment, the BCT400 detection device 51 and the four-probe resistance tester 52 automatically trigger the minority carrier and resistance detection of the end face of the single crystal wafer rod and automatically upload to the system storage.

[0091] After the detection is completed, the data is automatically entered into the system, and the data is judged. If the data of the single crystal wafer rod is qualified, it is automatically transferred to the processing station. If the data of the single crystal wafer rod is unqualified, it is transferred to the reverse cutting station.

[0092] A single wafer rod automatic detection method, comprising the following steps:

[0093] S01, place the single wafer rod on the conveying device.

[0094] S02, convey the single wafer rod to the appearance detection station.

[0095] S03, collect image information of the single wafer rod, and identify the significant features in the image information.

[0096] S031, adjust the position of the image acquisition device 33 according to the length of the single wafer rod.

[0097] S032, after the image acquisition device 33 walks to the focal length position, the significant features of the single wafer rod are collected through visual image acquisition. The significant features are edge collapse and hidden cracks.

[0098] S04, classify the significant features, and eliminate the significant features affecting subsequent processing. The significant features not affecting subsequent processing are normally transferred.

[0099] S05, the normally transferred single wafer rod is conveyed to the electrical property detection station, and the electrical property of the single wafer rod is detected. During the detection, the BCT400 detection equipment 51 and the four-probe resistance tester 52 are in close contact with the end face of the single wafer rod, and after the close contact, the end face of the single wafer rod is detected. Minority carrier and resistance.

[0100] S06, enter the detection data into the system, determine whether the rod is qualified according to the entered data, and if qualified, transfer to the processing station, and if not qualified, transfer to the reverse cutting station.

[0101] 1, the single wafer rod is detected by the above method, which has the following advantages:

[0102] 2, the detection efficiency is obviously improved compared with manual detection.

[0103] 3, the detection position is accurate, the consistency is high, and the detection data is accurate.

[0104] 4, the end face of the single wafer rod is detected comprehensively, and the missed detection situation is eliminated.

[0105] 5, the detection data is automatically uploaded and can be traced.

[0106] 6, without manual intervention, safety hazards in the operation process are eliminated.

[0107] Finally, it should be noted that the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art will appreciate that the technical solutions described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalent ones. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A single wafer rod automatic detection system, characterized by, The application relates to a single crystal wafer rod appearance and electrical performance detection system. The system comprises a conveying assembly, a mounting frame mounted on the top of the conveying assembly, an appearance detection assembly mounted on the mounting frame and having a detection end directed towards the conveying assembly, a robot mounted on one side of the conveying assembly, an electrical performance detection assembly mounted on the robot through a mounting plate, and a controller electrically connected with the conveying assembly, the mounting frame, the appearance detection assembly, the robot and the electrical performance detection assembly. The mounting frame comprises a frame mounted on the top of the conveying assembly through a gantry or a factory truss, a slide rail mounted on the frame and having the same mounting direction as the conveying direction of the conveying assembly, two driving members respectively mounted on the two ends of the slide rail, two mounting sliding blocks slidably arranged on the slide rail and respectively connected with the movable ends of the two driving members, and a mounting rod mounted on the two mounting sliding blocks and having the appearance detection assembly mounted thereon. The appearance detection assembly comprises a lifting assembly mounted on the mounting rod and located above the conveying assembly after being mounted, and a light source module mounted on the movable end of the lifting assembly and directed towards the end surface of the single crystal wafer rod after being mounted. The electrical performance detection assembly comprises a BCT400 detection device mounted on the mounting plate and a four-probe resistance tester mounted on the mounting plate and located on one side of the BCT400 detection device after being mounted. The BCT400 detection device and the four-probe resistance tester are both in contact with the section of the single crystal wafer rod during detection. The system comprises the following steps.

2. The single wafer rod automatic detection system of claim 1, wherein S01, placing a single crystal wafer rod on a conveying device; 3. The single wafer rod automatic detection system of claim 1, wherein S02, conveying the single crystal wafer rod to an appearance detection station; S03, collecting image information of the single crystal wafer rod and identifying the significant features in the image information; S04, classifying the significant features, eliminating the significant features affecting subsequent processing, and normally forwarding the single crystal wafer rod not affecting subsequent processing; S05, conveying the single crystal wafer rod normally forwarded to an electrical performance detection station and detecting the electrical performance of the single crystal wafer rod; S06, inputting the detection data into a system, determining whether the single crystal wafer rod is qualified according to the input data, forwarding the single crystal wafer rod to a processing station if the single crystal wafer rod is qualified, and forwarding the single crystal wafer rod to a re-cutting station if the single crystal wafer rod is unqualified. The step S03 of collecting image information of the single crystal wafer rod and identifying the significant features in the image information comprises the following steps.

4. The single wafer rod automatic detection system of claim 3, wherein S031, adjusting the position of the image collection device according to the length of the single crystal wafer rod. ​ ​ ​ 5. The single wafer rod automatic detection system of claim 4, wherein ​ 6. The single wafer rod automatic detection system of claim 1, wherein ​ ​ ​ ​ 7. An automatic inspection method for single-crystal wafers, characterized in that, ​ ​ ​ ​ ​ ​ ​ 8. The method of claim 7, wherein the step of automatically detecting the single wafer rod is characterized by: ​ ​ S032、Image acquisition device walks to the focal length position, and the significant features of the single wafer rod are collected through visual image acquisition.

9. The method of claim 7 or 8, wherein The significant features include: edge collapse and hidden cracks.

10. The method of claim 3, wherein the method further comprises: In the S05, when the single wafer rod is transported to the electrical property detection station, the BCT400 detection equipment and the four-probe resistance tester are both attached to the end face of the single wafer rod, and the minority carrier and the resistance of the end face of the single wafer rod are detected after the attachment.

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