Solder layer aging test method, system, equipment and medium

Abstract

The invention provides a solder layer aging test method, system and device and a medium. The solder layer aging test method comprises the steps that a prefabricated solder shell is placed in a test area in a multi-physics coupling environment; synchronously applying a thermal field, a mechanical vibration field and an electromagnetic field to the prefabricated solder shell so as to perform an accelerated aging test on the prefabricated solder shell; after the accelerated aging test is completed, the performance of the prefabricated solder shell is monitored, and an aging test result is obtained; wherein in the accelerated aging test process, the field parameters of the mechanical vibration field and / or the electromagnetic field are dynamically adjusted according to the state parameters of the thermal field based on a preset quantitative coupling relationship. According to the invention, the accuracy and reliability of the test result are greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a solder layer aging test method, system, device and medium. BACKGROUND

[0002] In the field of electronic package reliability evaluation, the durability test of the solder layer of the prefabricated solder shell usually adopts a single environmental stress acceleration method or a simple sequential stress loading method. The existing technology mainly includes standardized test methods such as high temperature and high humidity storage test, high temperature storage test, temperature cycle test and mechanical vibration test. These methods examine the aging behavior of the solder material by applying a single type of environmental stress within a certain period of time, or sequentially applying different environmental stresses in a predetermined order.

[0003] However, the solder layer in actual application often needs to withstand the combined action of multiple environmental stresses, and the existing test method artificially separates these environmental stresses that should exist simultaneously and tests them independently or sequentially, resulting in a large gap between the test conditions and the actual use environment. This disconnection between test conditions and actual working conditions makes it difficult for the test results to truly reflect the actual aging behavior of the solder layer under complex use environment, and also cannot accurately predict its service life. SUMMARY

[0004] In order to overcome the defects of the above-mentioned prior art, the present application provides a solder layer aging test method, system, device and medium.

[0005] The specific technical solutions are as follows: A solder layer aging test method, comprising: placing a prefabricated solder shell in a test area in a multi-physical field coupling environment; synchronously applying a thermal field, a mechanical vibration field and an electromagnetic field to the prefabricated solder shell to perform accelerated aging test on the prefabricated solder shell; monitoring the performance of the prefabricated solder shell after the accelerated aging test is completed to obtain an aging test result; wherein, during the accelerated aging test, based on a preset quantitative coupling relationship, dynamically adjusting field parameters of the mechanical vibration field and / or the electromagnetic field according to state parameters of the thermal field.

[0006] In one embodiment, the quantitative coupling relationship includes at least one of the following relationships: the vibration frequency of the mechanical vibration field is positively correlated with the absolute value and the rate of change of the temperature of the thermal field; the vibration amplitude of the mechanical vibration field is negatively correlated with the temperature of the thermal field; the field strength of the electromagnetic field is positively correlated with the temperature of the thermal field.

[0007] In one embodiment, when the quantitative coupling relationship is that the vibration amplitude of the mechanical vibration field is negatively correlated with the temperature of the thermal field, the dynamic adjustment of the field parameters of the mechanical vibration field and / or the electromagnetic field according to the state parameters of the thermal field based on the preset quantitative coupling relationship comprises: acquiring the temperature of the thermal field and comparing the temperature with a preset temperature threshold; when the temperature of the thermal field is lower than the preset temperature threshold, controlling the vibration amplitude of the mechanical vibration field to maintain at a first vibration amplitude value; when the temperature of the thermal field is higher than the preset temperature threshold and approaches the eutectic temperature of the pre-prepared solder shell, controlling the vibration amplitude of the mechanical vibration field to decrease according to a power law from the first vibration amplitude value to a second vibration amplitude value as the temperature increases; wherein the first vibration amplitude value is greater than the second vibration amplitude value.

[0008] In one embodiment, when the quantitative coupling relationship is that the field strength of the electromagnetic field is positively correlated with the temperature of the thermal field, the dynamic adjustment of the field parameters of the mechanical vibration field and / or the electromagnetic field according to the state parameters of the thermal field comprises: acquiring the temperature of the thermal field and comparing the temperature of the thermal field with a preset first temperature range threshold and a preset second temperature range threshold; when the temperature of the thermal field is within the preset first temperature range threshold, controlling the field strength of the electromagnetic field to automatically weaken; when the temperature of the thermal field is within the preset second temperature range threshold, controlling the field strength of the electromagnetic field to automatically strengthen.

[0009] In one embodiment, the method further comprises: during the accelerated aging test, controlling the vibration intensity peak value of the mechanical vibration field to be delayed by a preset phase difference in time relative to the temperature peak value of the thermal field; wherein the phase difference is determined based on the thermal inertia parameter of the solder layer.

[0010] In one embodiment, the quantitative coupling relationship is achieved through the following closed-loop control steps: a) monitoring the state parameters of the thermal field, mechanical vibration field and electromagnetic field in real time; b) calculating the quantitative coupling relationship in real time and generating control instructions according to the monitored state parameters; c) dynamically adjusting the field parameters of the mechanical vibration field and the electromagnetic field according to the control instructions, and feeding back the adjusted field parameters as new state parameters to step a) to form a closed-loop control loop.

[0011] In one embodiment, the thermal field is an asymmetric rapid thermal shock field profile based on actual operating condition data spectrum; And / or, the mechanical vibration field is a multi-axis random vibration field applied by a six-degree-of-freedom vibration table; And / or, the electromagnetic field is a low-frequency alternating magnetic field with adjustable field strength and frequency, driven by a pulsed power supply.

[0012] A solder layer aging test system for implementing any of the solder layer aging test methods described above, comprising: Sample mounting module for placing a pre-fabricated solder housing in a test area within a multiphysics coupling environment; An environmental application module is used to simultaneously apply a thermal field, a mechanical vibration field, and an electromagnetic field to the prefabricated solder shell to conduct accelerated aging tests on the prefabricated solder shell. An aging test module is used to monitor the performance of the prefabricated solder shell after the accelerated aging test is completed, and to obtain the aging test results. The environmental application module includes a dynamic control unit, which is used to dynamically adjust the field parameters of at least one of the mechanical vibration field and / or the electromagnetic field based on a preset quantitative coupling relationship and the state parameters of the thermal field.

[0013] A solder layer aging test device, comprising: A multiphysics coupling environment chamber, including a thermal management unit, a multi-axis vibration table and an electromagnetic coil array, is used to house a pre-fabricated solder shell and to simultaneously apply a thermal field, a mechanical vibration field and an electromagnetic field to the pre-fabricated solder shell. A sensor array is installed inside the multiphysics coupling environment chamber to monitor the state parameters and environmental parameters of the multiphysics coupling environment chamber. The central controller is communicatively connected to both the multiphysics coupling environment chamber and the sensor array; wherein the central controller is configured to perform any of the solder layer aging test methods described above.

[0014] A computer-readable storage medium storing a computer program that, when executed by a processor, implements the solder layer aging test method as described above.

[0015] This application has at least the following beneficial effects: This application provides a solder layer aging test method, comprising: placing a pre-fabricated solder shell in a test area of ​​a multi-physics coupling environment; simultaneously applying a thermal field, a mechanical vibration field, and an electromagnetic field to the pre-fabricated solder shell to perform an accelerated aging test; monitoring the performance of the pre-fabricated solder shell after the accelerated aging test is completed to obtain the aging test results; wherein, during the accelerated aging test, the field parameters of the mechanical vibration field and / or the electromagnetic field are dynamically adjusted according to the state parameters of the thermal field based on a preset quantitative coupling relationship.

[0016] This application constructs a collaborative attack test condition that highly simulates a real, complex service environment by simultaneously applying thermal, mechanical vibration, and electromagnetic fields based on a preset quantitative coupling relationship, and dynamically adjusting the parameters of the remaining fields according to the thermal field state. The multi-physics collaborative loading mechanism provided by this application can effectively reproduce the comprehensive failure modes of solder layers caused by the interaction of thermo-mechanical and electromagnetic stresses in actual applications (such as the coupling effect of thermal fatigue, creep, and electromigration). This solves the technical problem of the disconnect between traditional single or sequential stress testing and the actual failure mechanism, greatly improving the accuracy and reliability of the test results.

[0017] This application introduces a quantitative coupling relationship to precisely drive mechanical vibration fields and electromagnetic fields based on physical mechanisms, rather than the traditional blind stress superposition. This enables targeted and efficient acceleration of specific dominant failure mechanisms, thereby significantly shortening the testing cycle while maintaining test fidelity, saving substantial time and costs for product development and reliability assessment.

[0018] In summary, this application achieves a solder layer reliability test with high fidelity, high efficiency, and high-value data output through parameterized dynamic coupling of multi-physics fields, thereby improving the quality and reliability of electronic packaging products. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart illustrating the solder layer aging test method provided in Embodiment 1. Figure 2 This is a schematic diagram of the solder layer aging test system provided in Embodiment 2.

[0021] Figure label: 1-Sample mounting module; 2-Environmental application module; 3-Aging test module. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] In the description of this application, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] The multi-physics coupling environment described in this application refers to a test environment capable of simultaneously generating and controlling thermal, mechanical vibration, and electromagnetic fields, specifically a multi-physics coupling environment box that simultaneously generates and controls thermal, mechanical vibration, and electromagnetic fields; quantitative coupling relationship refers to the physical relationship between field parameters described by mathematical formulas; prefabricated solder shell refers to an electronic packaging test sample containing a solder layer prepared by standard processes.

[0026] Example 1 like Figure 1 As shown, this embodiment provides a solder layer aging test method, specifically taking the testing of a BGA-packaged SAC305 solder preform housing for an automotive engine control unit as an example. The method includes the following steps: S1. Place the pre-fabricated solder shell in the test area of ​​a multi-physics coupling environment.

[0027] Multiple, for example 10, SAC305 solder preformed shells that meet the quality standards are randomly selected from the same production batch as test samples to ensure consistency between samples. The sample selection criteria include: dimensional tolerance ±0.05mm, solder layer thickness uniformity deviation <5%, and surface oxide layer thickness <10nm.

[0028] Non-destructive testing of the samples was performed using a scanning ultrasonic microscope (C-SAM) with a working frequency of 30MHz and a scanning accuracy of 10μm. The initial morphology was confirmed to be free of initial defects (voids, cracks, etc.) inside the solder layer and recorded. The detection parameters were set as follows: pulse width 100ns, gain 40dB, and scanning step 5μm. Any abnormal areas found were marked and recorded.

[0029] The initial resistance of each sample was measured using a four-terminal micro-ohmmeter with a measurement current of 1A and an accuracy of 0.1μΩ. The measured value was recorded as the baseline data. During measurement, it was ensured that the probe made good contact with the pad, with a contact resistance of <0.5mΩ. Each sample was measured three times at different locations, and the average value was taken as the initial resistance value of that sample.

[0030] Cross-sectional analysis of three randomly selected samples was performed using a metallographic microscope to record the initial microstructure of the solder layer. Slow cutting technique was used when preparing metallographic samples, with a cutting speed of <0.1 mm / s, to avoid introducing mechanical stress. Etching was performed with a 5% nitric acid alcohol solution for 10-15 seconds to reveal grain boundaries and phase structure.

[0031] The sample is mounted on the sample stage of the multiphysics coupling environment chamber using a special non-magnetic clamp (e.g., a clamp made of 304 stainless steel). The specific non-magnetic clamp has a magnetic permeability of less than 1.01 to ensure that it will not interfere with the electromagnetic field. A digital torque wrench is used during installation to tighten the screws diagonally in two stages with a torque of 3 N·m to ensure uniform stress distribution.

[0032] Apply high-temperature thermal grease to the contact surface between the fixture and the sample. Select a grease with a thermal conductivity >3.5W / m·K and control the coating thickness to 50±10μm to ensure heat conduction efficiency.

[0033] After installation, a laser displacement sensor is used to detect the sample installation position to ensure that the deviation between the sample center and the test area center is less than 0.1mm; the three-coordinate measurement principle is used to measure in the X, Y and Z directions to ensure spatial positioning accuracy.

[0034] Among them, the thermal field is an asymmetric rapid thermal shock field profile based on the actual working condition data spectrum; the mechanical vibration field is a multi-axis random vibration field applied by a six-degree-of-freedom vibration table; and the electromagnetic field is a low-frequency alternating magnetic field with adjustable field strength and frequency driven by a pulse power supply.

[0035] S2. Configure the quantitative coupling relationship of aging test parameters.

[0036] In the central controller, the total number of aging test cycles is set to 500, the sampling frequency is 10Hz, and the data recording interval is one complete data record every 5 cycles.

[0037] The thermal field parameters are set as an asymmetric rapid thermal shock field profile, which refers to a thermal cycle field profile in which the heating rate is greater than the cooling rate. The specific cycle is as follows: nonlinearly heating from 25°C to 125°C within 60 seconds, maintaining 125°C for 180 seconds, then nonlinearly cooling to -40°C within 90 seconds, and finally maintaining -40°C for 120 seconds, to simulate the actual working environment of the automotive engine control unit from cold start to full load operation and then to shutdown.

[0038] Establish the dynamic coupling relationship between vibration field parameters and thermal field parameters: a) Vibration frequency coupling relationship: f(Hz) = f_base + k1 × |T - T_ref| + k2 × |dT / dt|; Where f_base is the reference frequency (e.g., 100Hz), T_ref is the reference temperature (e.g., 25℃), and k1 and k2 are positive coupling coefficients calibrated through single-factor experiments. The calibration method is as follows: fix the temperature change rate, measure the effect of different k1 values ​​on the crack initiation rate, and select the k1 value that makes the crack initiation rate closest to the actual working condition (e.g., k1=0.5Hz / ℃); fix the absolute temperature value, measure the effect of different k2 values ​​on the dislocation density, and select the k2 value that makes the dislocation density closest to the actual working condition (e.g., k2=10Hz / (℃ / s)).

[0039] This relationship is based on dislocation dynamics theory. The rate of temperature change, dT / dt, reflects the rate of change of thermal stress in the material. When the thermal stress changes drastically, increasing the vibration frequency can more effectively excite dislocation motion and accelerate the accumulation of fatigue damage. The absolute temperature value, |T-T_ref|, reflects the degree of thermal softening of the material. At extreme temperatures, the material properties change, requiring adjustment of the vibration frequency to match the dynamic response characteristics of the material.

[0040] This relationship automatically increases the vibration frequency when the temperature changes drastically (higher |dT / dt|), simulating high-frequency microscopic excitation of the material under unsteady conditions. Under extreme temperature conditions, increasing the vibration frequency intensifies dislocation motion, accelerating the initiation and propagation of fatigue cracks. This achieves adaptive adjustment of the vibration frequency with temperature conditions, more realistically reflecting actual working conditions.

[0041] b) Vibration amplitude coupling relationship: A(Grms)=A_max×[1-α×(T / T_melt)^β]; Where A_max is the maximum amplitude (e.g., 1.5Grms), T_melt is the solder eutectic temperature (e.g., 217℃), and α and β are attenuation coefficients set based on the creep characteristics of the solder material, determined through material creep experiments: the creep rate of the solder is measured at different temperatures, and the β value is obtained by fitting (for SAC305 solder, α=0.6, β=2 can be taken).

[0042] This relationship is based on the temperature-dependent mechanical behavior of materials. At low temperatures, solder behaves as a brittle material, requiring a high vibration amplitude to effectively induce crack initiation. At high temperatures, the solder softens, and excessive vibration amplitude can lead to unrealistic large plastic deformation. Therefore, the vibration amplitude needs to decrease according to a power-law principle. The power exponent β reflects the sensitivity of the material's creep behavior to temperature.

[0043] The preset temperature threshold is set to 50℃. This threshold is determined based on the mechanical property transition point of SAC305 solder: below this temperature, the solder mainly exhibits elastic behavior; above this temperature, plastic deformation and creep effects are significantly enhanced.

[0044] Based on this relationship, when T < 50℃ (i.e., in the low-temperature range, such as -40℃), the vibration amplitude A of the mechanical vibration field is controlled to be maintained at the first vibration amplitude (i.e., close to the calculated value of A_max, approximately 1.47 Grms) to simulate the high-stress impact of the material in a brittle state. When T > 50℃ and approaches the test temperature range of the solder eutectic temperature (217℃) (e.g., rising to 125℃), the vibration amplitude A is controlled to decrease from the first vibration amplitude to the second vibration amplitude (approximately 1.2 Grms at 125℃) as the temperature increases, preventing unrealistic plastic deformation when the material softens. This nonlinear anti-correlation coupling relationship ensures the fidelity of the test and avoids overtesting problems. Establish the dynamic coupling relationship between electromagnetic field parameters and thermal field parameters: B(Gauss)=B_max×exp[-(E_a / K)×(1 / T-1 / T_ref)] Where B_max is the maximum electric field strength (e.g., 80 Gauss), E_a is the activation energy of the dominant diffusing atom (e.g., Sn) in the solder, which is determined by material diffusion experiments (e.g., 0.7 eV), and k is the Boltzmann constant (8.617e-5 eV / K).

[0045] This relationship, based on the Arrhenius equation, describes the exponential relationship between atomic diffusion rate and temperature. Electromigration is essentially caused by the directional diffusion of atoms under the combined influence of an electric field and temperature; therefore, the electromagnetic field strength needs to be matched to the atomic diffusion rate. At low temperatures, atomic diffusion is slow, and an excessively strong electromagnetic field will only generate Joule heating without aiding electromigration. At high temperatures, atomic diffusion accelerates, requiring a stronger electromagnetic field to maintain an effective driving force for electromigration.

[0046] The preset first temperature range threshold is set to -40℃ to 0℃, which corresponds to low-temperature conditions where material diffusion is strongly suppressed; the preset second temperature range threshold is set to 80℃ to 125℃, which corresponds to high-temperature / high-temperature impact conditions where atomic migration is active.

[0047] According to this exponential relationship, when T is within the first temperature range threshold, the field strength B of the control electromagnetic field automatically decreases (calculated according to this exponential relationship, it decreases to about 4.2 Gauss at -40℃); when T is within the second temperature range threshold, the field strength B of the control electromagnetic field automatically increases (calculated according to this exponential relationship, it increases to about 78.5 Gauss at 125℃).

[0048] Simultaneously, the phase difference ΔΦ_v between the peak vibration intensity of the mechanical vibration field and the peak temperature of the thermal field is controlled to be 60°. This phase difference is determined by finite element thermal simulation based on the material's thermal inertia parameters. Specifically, a three-dimensional model of the solder layer is established, the material's specific heat capacity, thermal conductivity, and density parameters are input, the temperature field transfer function is calculated, and the phase delay is determined. This means that when the sample reaches its highest temperature, the mechanical vibration does not reach its peak value, but rather the maximum mechanical impact occurs after the sample remains in a high-temperature state for a period of time. This application introduces a stress reloading cycle after thermoplastic deformation through time-sequence misalignment, which greatly intensifies the interaction between creep and fatigue, and can more realistically simulate working conditions such as the bumps after a car engine starts.

[0049] In real-world operating conditions, mechanical loads often lag behind temperature changes because the thermal inertia of the structure causes a phase difference between the temperature field and the stress field. This embodiment introduces a controllable phase difference to accurately reproduce this asynchronous temporal phenomenon, making the test conditions closer to real-world operating conditions.

[0050] S3. Perform parametric coupling to simultaneously apply thermal, mechanical vibration and electromagnetic fields to the preformed solder shell and perform closed-loop control to conduct accelerated aging tests on the preformed solder shell.

[0051] During the test, the central controller starts the multiphysics coupling environment chamber, first performing system self-tests and sensor calibrations. The self-test includes: thermal management unit power output calibration, vibration table frequency response testing, and electromagnetic field uniformity detection. Calibration lasts approximately 5 minutes to ensure each system reaches optimal operating condition.

[0052] Thermal, mechanical vibration, and electromagnetic fields are applied simultaneously. The state parameters of each physical field (thermal, mechanical vibration, and electromagnetic fields) are monitored in real time using K-type thermocouples, triaxial accelerometers, and Hall sensors. These parameters include the current temperature (T), rate of temperature change (|dT / dt|), vibration frequency (f), vibration amplitude (A), and magnetic field strength (B).

[0053] The central controller reads sensor data every 100ms, substitutes it into a preset quantitative coupling relationship for real-time calculation, and generates dynamic commands to dynamically adjust the output parameters of each field. The control algorithm adopts incremental PID control with a proportional coefficient Kp=0.8, integral time Ti=2s, and derivative time Td=0.1s, ensuring fast and stable system response.

[0054] The adjusted parameters form a closed-loop control through sensor feedback, ensuring that the physical fields maintain a precise dynamic coupling relationship throughout the test.

[0055] The test program is initiated, and the central controller begins executing the accelerated aging test. The specific control flow is as follows: The thermal management unit, the six-degree-of-freedom vibration table, and the electromagnetic coil array are started synchronously.

[0056] K-type thermocouples, triaxial accelerometers, and Hall sensors placed near the sample monitor in real time the current state parameters such as temperature (T), rate of temperature change (dT / dt), vibration frequency (f), vibration amplitude (A), and magnetic field strength (B).

[0057] The central controller reads sensor data every 100 milliseconds and substitutes it into the preset quantitative coupling relationship in step S2 above for real-time calculation.

[0058] Based on the calculation results, the controller generates control commands to dynamically adjust the output of the vibration table and electromagnetic power supply. For example, when the system detects that the temperature is rising at a rate of 20℃ / s, it will immediately increase the vibration frequency according to the vibration frequency relationship. When the temperature reaches a peak of 125℃, the controller will maintain a high-intensity electromagnetic field and wait for the duration corresponding to a 60° phase difference before commanding the vibration table to output the maximum allowable amplitude calculated at that temperature. The adjusted field parameters will be immediately monitored again by the sensor array and fed back to the monitoring step as new state parameters, forming a closed-loop control loop to ensure that the three physical fields maintain precise dynamic coupling according to the preset quantitative model throughout the aging process.

[0059] S4. After the accelerated aging test is completed, the performance of the prefabricated solder shell is monitored to obtain the aging test results.

[0060] After 500 cycles, the test automatically stops and the ambient temperature is slowly lowered according to a preset cooling program, with the cooling rate controlled within 3℃ / min to avoid additional damage caused by thermal shock. Once the temperature has dropped to room temperature, the sample is carefully removed using a special tool to avoid introducing mechanical damage.

[0061] The aged samples were subjected to aging tests, and the resistance change curves of the samples during the tests were recorded. A high-precision impedance analyzer was used to measure the frequency characteristics and analyze the dielectric properties and interface state changes.

[0062] Non-destructive testing of the samples was performed again using scanning ultrasonic microscopy (C-SAM). Eight out of ten samples showed microcracks at the solder layer-substrate interface, significantly higher than the two samples found using traditional testing methods. Electrical performance testing showed an average increase in resistance of 15%, far exceeding the 5% increase observed in traditional testing. Scanning electron microscopy and energy dispersive spectroscopy analysis revealed electromigration-induced voids within the solder joints, with cracks propagating along the intermetallic compound layer at the interface, exhibiting typical multi-field coupled failure characteristics, significantly different from the single thermal fatigue crack morphology observed in traditional testing.

[0063] The solder layer aging test method proposed in this embodiment shows significant progress in many aspects compared with the prior art. These beneficial effects do not stem from simple stress superposition, but are directly attributed to the synergistic effect of various innovative features in the technical solution, specifically reflected in the following aspects: Traditional methods suffer from distorted failure modes due to their inability to describe inter-field interactions. This invention, however, introduces a linear relationship between vibration frequency and temperature change rate (f=f_base+k1×|T-T_ref|+k2×|dT / dt|), automatically enhancing high-frequency micro-excitation during rapid temperature changes. This more effectively stimulates dislocation motion under unsteady material conditions, accelerating the accurate initiation of fatigue cracks. Simultaneously, the nonlinear inverse relationship between vibration amplitude and temperature (A=A_max×[1-α×(T / T_melt)^β]) effectively prevents unrealistic plastic deformation caused by excessive mechanical stress during high-temperature softening, ensuring the physical fidelity of aging.

[0064] This embodiment introduces the exponential relationship based on the Arrhenius equation (B=B_max×exp[-(E_a / k)×(1 / T-1 / T_ref)]) into electromagnetic field control to precisely match the physical law of atomic diffusion rate changing with temperature. At high temperatures, the field strength automatically increases exponentially, synergizing with the rapidly increasing atomic mobility to achieve a targeted acceleration of the electromigration effect; while at low temperatures, the field strength automatically decreases, avoiding unnecessary energy consumption. This mechanism-driven precise acceleration enables this application to produce aging effects equivalent to 3-5 times that of traditional methods within the same test cycle, shortening the traditional test cycle of over 1000 hours to less than 300 hours.

[0065] This embodiment parameterizes the coupling relationship into a specific mathematical model, enabling highly flexible and consistent test conditions. For different application scenarios (such as automotive electronics and consumer electronics), the test profile can be quickly customized simply by adjusting the coupling coefficients (k1, k2, α, β, etc.). The parameterization method provided in this embodiment ensures accurate reproduction of test conditions and eliminates deviations caused by human operation.

[0066] This embodiment introduces the concept of a controlled phase difference (ΔΦ_v = 60°) to create a controllable delay between the peak mechanical vibration and the peak thermal temperature, simulating the real-world scenario where mechanical impact lags behind temperature changes. By employing a time-sequenced design, a stress reloading cycle following thermoplastic deformation is introduced, effectively intensifying the creep-fatigue interaction and successfully reproducing the synergistic failure mechanism that cannot be generated by a single stress test. Through this time-sequence coupling, interface crack propagation behavior and damage accumulation that more closely resemble actual working conditions can be observed in a laboratory environment.

[0067] This embodiment achieves real-time monitoring and dynamic adjustment of multi-physics parameters through rapid data acquisition and processing with a period of 100ms. This closed-loop control ensures that the three major forces (thermal, vibration, and electromagnetic) maintain a precise dynamic coupling relationship according to the preset quantitative model throughout the entire test, effectively suppressing test deviations caused by equipment response delays or environmental fluctuations, and providing key technical support for obtaining reliable and repeatable test results.

[0068] Example 2 like Figure 2 As shown, this embodiment provides a solder layer aging test system for implementing the solder layer aging test method as described in Embodiment 1. The solder layer aging test system includes a sample mounting module 1, an environmental application module 2, and an aging test module 3.

[0069] The sample mounting module 1 includes a non-magnetic fixture and a sample stage for placing a pre-fabricated solder shell in a test area within a multi-physics coupling environment. The environmental application module includes a multi-physics coupling environment chamber, which integrates a thermal management unit, a six-degree-of-freedom vibration table, and an electromagnetic coil array. It is used to simultaneously apply thermal, mechanical vibration, and electromagnetic fields to the prefabricated solder shell to perform accelerated aging tests on the prefabricated solder shell.

[0070] The aging test module includes a sensor array and a post-analysis device, which is used to monitor the performance of the prefabricated solder shell after the accelerated aging test is completed, and obtain the aging test results.

[0071] The environmental application module has a built-in dynamic control unit that can store and execute the quantitative coupling relationship described in Example 1, and dynamically adjust the mechanical vibration field and / or electromagnetic field output according to the real-time monitored thermal field parameters.

[0072] Example 3 This embodiment provides a solder layer aging test device, integrating the system described in Embodiment 2. The device includes a multiphysics coupling environment chamber and a central controller.

[0073] The central controller uses an industrial computer and comes pre-installed with control software. The software code contains the solution logic for the mathematical relationship described in Example 1.

[0074] The sensor array communicates with the controller via a data acquisition card. After the operator inputs the test parameters through the software interface, the equipment can automatically complete the entire test.

[0075] Example 4 This embodiment provides a computer-readable storage medium storing a computer program. When the program is executed by a processor, it performs the following operations: receiving test parameters and coupling equations input by the user; controlling the multiphysics coupling environment box to start and synchronously apply each physical field; cyclically executing closed-loop control of parameter monitoring, coupling equation calculation, and field parameter adjustment during the test; and automatically terminating the test and saving the data after the set conditions are met.

[0076] Those skilled in the art will understand that the modules or steps described above in this application can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby allowing them to be stored in a storage device for execution by a computing device, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0077] Note that the above description is merely a preferred embodiment and the technical principles employed in this application. Those skilled in the art will understand that this application is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of this application. Therefore, although this application has been described in detail through the above embodiments, this application is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of this application, and the scope of this application is determined by the scope of the appended claims.

[0078] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A solder layer aging test method characterized by, The method comprises the following steps: placing a prefabricated solder shell in a test area in a multi-physical field coupling environment; synchronously applying a thermal field, a mechanical vibration field and an electromagnetic field to the prefabricated solder shell to perform accelerated aging test on the prefabricated solder shell; monitoring the performance of the prefabricated solder shell after the accelerated aging test is completed to obtain an aging test result; wherein, during the accelerated aging test, based on a preset quantitative coupling relationship, the field parameters of the mechanical vibration field and / or the electromagnetic field are dynamically adjusted according to the state parameters of the thermal field.

2. The solder layer aging test method according to claim 1, characterized by, The quantitative coupling relationship includes at least one of the following relationships: the vibration frequency of the mechanical vibration field is positively correlated with the absolute value and the rate of change of the temperature of the thermal field; the vibration amplitude of the mechanical vibration field is negatively correlated with the temperature of the thermal field; the field strength of the electromagnetic field is positively correlated with the temperature of the thermal field.

3. The solder layer aging test method according to claim 2, characterized by, When the quantitative coupling relationship is that the vibration amplitude of the mechanical vibration field is negatively correlated with the temperature of the thermal field, the dynamic adjustment of the field parameters of the mechanical vibration field and / or the electromagnetic field according to the state parameters of the thermal field based on the preset quantitative coupling relationship comprises: obtaining the temperature of the thermal field and comparing the temperature with a preset temperature threshold value; when the temperature of the thermal field is lower than the preset temperature threshold value, controlling the vibration amplitude of the mechanical vibration field to maintain at a first vibration amplitude value; when the temperature of the thermal field is higher than the preset temperature threshold value and approaches the eutectic temperature of the prefabricated solder shell, controlling the vibration amplitude of the mechanical vibration field to decrease from the first vibration amplitude value to a second vibration amplitude value according to a power law as the temperature increases; wherein, the first vibration amplitude value is greater than the second vibration amplitude value.

4. The solder layer aging test method according to claim 2, characterized by, When the quantitative coupling relationship is that the field strength of the electromagnetic field is positively correlated with the temperature of the thermal field, the dynamic adjustment of the field parameters of the mechanical vibration field and / or the electromagnetic field according to the state parameters of the thermal field comprises: obtaining the temperature of the thermal field and comparing the temperature of the thermal field with a preset first temperature range threshold value and a preset second temperature range threshold value; when the temperature of the thermal field is in the preset first temperature range threshold value, controlling the field strength of the electromagnetic field to automatically weaken; when the temperature of the thermal field is in the preset second temperature range threshold value, controlling the field strength of the electromagnetic field to automatically strengthen.

5. The solder layer aging test method according to claim 1, characterized by, The method further comprises: during the accelerated aging test, controlling the vibration intensity peak value of the mechanical vibration field to be delayed by a preset phase difference relative to the temperature peak value of the thermal field in time; wherein, the phase difference is determined based on the thermal inertia parameter of the solder layer.

6. The solder layer aging test method according to claim 5, characterized by, The quantitative coupling relationship is realized through the following closed-loop control steps: a) real-time monitoring of the state parameters of the thermal field, the mechanical vibration field and the electromagnetic field; b) real-time solving of the quantitative coupling relationship and generation of control instructions according to the monitored state parameters; c) dynamically adjusting the field parameters of the mechanical vibration field and the electromagnetic field according to the control instructions, and feeding back the adjusted field parameters as new state parameters to step a) to form a closed-loop control loop.

7. The solder layer aging test method according to claim 1, characterized by, The thermal field is an asymmetric rapid thermal shock field profile based on actual working condition data spectrum; And / or, the mechanical vibration field is a multi-axis random vibration field applied by a six-degree-of-freedom vibration table. And / or, the electromagnetic field is a low-frequency alternating magnetic field with adjustable field strength and frequency driven by a pulse power supply.

8. A solder layer aging test system for implementing the solder layer aging test method according to any one of claims 1 to 7, characterized by, The method comprises the steps of: a sample mounting module for placing a prefabricated solder shell in a test area in a multi-physical field coupling environment; an environment applying module for synchronously applying a thermal field, a mechanical vibration field and an electromagnetic field to the prefabricated solder shell to perform an accelerated aging test on the prefabricated solder shell; an aging test module for monitoring the performance of the prefabricated solder shell after the accelerated aging test is completed to obtain an aging test result; The environment applying module comprises a dynamic control unit configured to dynamically adjust the field parameters of at least one of the mechanical vibration field and / or the electromagnetic field based on a preset quantitative coupling relationship and according to the state parameters of the thermal field.

9. A solder layer aging test apparatus characterized by comprising: The method comprises the steps of: a multi-physical field coupling environment box comprising a thermal management unit, a multi-axis vibration table and an electromagnetic coil array, configured to accommodate a prefabricated solder shell and synchronously apply a thermal field, a mechanical vibration field and an electromagnetic field to the prefabricated solder shell; a sensor array arranged in the multi-physical field coupling environment box, configured to monitor the state parameters and environmental parameters of the multi-physical field coupling environment box; a central controller in communication connection with the multi-physical field coupling environment box and the sensor array, wherein the central controller is configured to perform the solder layer aging test method according to any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, the computer program comprising instructions that, when executed by a computer, cause the computer to perform the method of any one of claims 1 to 9. The computer program is executed by a processor to implement the solder layer aging test method according to any one of claims 1 to 7.

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