Mask plate surface type adjusting method and device
By combining the air pressure control module and the adjustment module, the mask surface shape can be effectively adjusted, solving the problem of mask surface flatness and improving photolithography efficiency.
Patent Information
- Application Number
- CN202511763465.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-27
- Publication Date
- 2026-01-16
AI Technical Summary
In existing technologies, the flatness of the mask surface decreases when the mask pattern area increases, making it difficult to guarantee image quality and resulting in low exposure efficiency.
The air pressure control module provides adsorption force to different adsorption areas of the mask template, and the adjustment module applies a pulling or pushing force perpendicular to the plane of the mask template to achieve preliminary and fine adjustment of the mask template surface.
This improves the efficiency and accuracy of mask shape adjustment, thereby enhancing lithography efficiency.
Smart Images
Figure CN121348670A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of photolithography, in particular to a mask plate surface adjustment method and device. BACKGROUND
[0002] In the photolithography process, the surface flatness of the mask plate has a significant impact on the photolithography effect. Currently, the area of the mask pattern region is small, and the exposure efficiency is low. However, when the mask plate pattern region is increased, the surface flatness is reduced, which makes it difficult to ensure the imaging quality. SUMMARY
[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a mask plate surface adjustment method and device.
[0004] In a first aspect, the present application provides a mask plate surface adjustment method, which comprises: providing a mask plate, and installing the mask plate on one side of a suction cup; the suction cup comprises at least two suction areas; the suction cup further comprises an adjustment area, the adjustment area is provided with a through hole, and the through hole is provided with an adjustment module; providing suction force to the at least two suction areas by a gas pressure control module, and adjusting the surface of the mask plate according to preset first target surface information; applying a pulling force or a pushing force perpendicular to the plane of the mask plate to the mask plate by the adjustment module according to preset second target surface information, so as to adjust the surface of the mask plate.
[0005] In a possible implementation, the step of providing suction force to the at least two suction areas by the gas pressure control module and adjusting the surface of the mask plate according to the preset first target surface information comprises: detecting the surface of the mask plate by a surface detection module to obtain first surface information; based on the first surface information, providing suction force to the at least two suction areas by the gas pressure control module, and adjusting the surface of the mask plate according to the preset first target surface information; The step of applying a pulling force or a pushing force perpendicular to the plane of the mask plate to the mask plate by the adjustment module according to the preset second target surface information, so as to adjust the surface of the mask plate, comprises: detecting the surface of the mask plate by a surface detection module to obtain second surface information; According to the second surface profile information, the adjusting module is used to apply a pulling force or a pushing force in a direction perpendicular to a plane where the mask plate is located to the mask plate, and the surface profile of the mask plate is adjusted according to the preset second target surface profile information.
[0006] In a possible implementation, the step of adjusting the surface profile of the mask plate according to the preset first target surface profile information by providing the adsorption force to the at least two adsorption areas respectively through the air pressure control module based on the first surface profile information includes: The first surface profile information is transmitted to an industrial computer, the air pressure control module is controlled to provide the adsorption force to the at least two adsorption areas respectively through the industrial computer, and the surface profile of the mask plate is adjusted according to the preset first target surface profile information. The step of adjusting the surface profile of the mask plate according to the preset second target surface profile information by applying the pulling force or the pushing force in the direction perpendicular to the plane where the mask plate is located to the mask plate through the adjusting module based on the second surface profile information includes: The second surface profile information is transmitted to an industrial computer, the adjusting module is controlled to apply the pulling force or the pushing force in the direction perpendicular to the plane where the mask plate is located to the mask plate through the industrial computer, and the surface profile of the mask plate is adjusted according to the preset second target surface profile information.
[0007] In a possible implementation, the step of providing the adsorption force to the at least two adsorption areas respectively through the air pressure control module includes: The preset adsorption force is provided to the at least two adsorption areas through at least two pressure control valves of the air pressure control module.
[0008] In a second aspect, the embodiments of the present application further provide a mask plate surface profile adjusting device, which uses the method in the first aspect, and the mask plate surface profile adjusting device includes: A suction cup, which includes at least two adsorption areas; An air pressure control module, which is used to provide the adsorption force to the at least two adsorption areas respectively to adsorb the mask plate and adjust the surface profile of the mask plate. The suction cup further includes an adjusting area, the adjusting area is provided with a through hole, the adjusting module is arranged in the through hole, and the adjusting module is used to apply the pulling force or the pushing force in the direction perpendicular to the plane where the mask plate is located to the mask plate to adjust the surface profile of the mask plate.
[0009] In a possible implementation, the mask plate surface type adjustment device further comprises a connecting piece, the connecting piece is arranged on the side of the adjustment module close to the mask plate, and the connecting piece is used to connect the adjustment module and the mask plate.
[0010] In a possible implementation, the mask plate surface type adjustment device further comprises a negative pressure providing module. The connecting piece is fixedly connected with the adjustment module, the connecting piece is connected with the negative pressure providing module, and the negative pressure providing module is used to provide negative pressure to the connecting piece to adsorb the mask plate.
[0011] In a possible implementation, the mask plate surface type adjustment device further comprises a surface type detection module, and the surface type detection module is used to detect the surface type of the mask plate.
[0012] In a possible implementation, the mask plate surface type adjustment device further comprises an industrial computer, the industrial computer is used to record the surface type detection result of the surface type detection module, and the industrial computer is used to control the air pressure control module or the adjustment module to adjust the surface type of the mask plate according to the surface type detection result of the surface type detection module.
[0013] In a possible implementation, the adsorption area comprises a gas hole, the air pressure control module comprises a plurality of pressure control valves, and at least two pressure control valves are used to provide adsorption force to at least two adsorption areas through the gas hole respectively.
[0014] Based on any one of the above aspects, the mask plate surface type adjustment method and device provided by the embodiments of the present application can adjust the adsorption force of different adsorption areas through the air pressure control module, can preliminarily adjust the surface type of the mask plate, and at the same time, can finely adjust the surface type of the mask plate through the adjustment module to exert a force in the vertical direction on the mask plate, so that effective adjustment of the surface type of the mask plate can be realized, and the efficiency and accuracy of the mask plate surface type adjustment can be improved, thereby facilitating improvement of the photolithography efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be called in the embodiments will be briefly introduced below, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for ordinary skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.
[0016] Figure 1 The flowchart of the mask plate surface type adjustment method provided by the present embodiment is shown in the figure. Figure 2Fig. 1 is a structural schematic diagram of a mask plate in the prior art; Figure 3 Fig. 2 is a structural schematic diagram of a mask plate provided in the embodiment; Figure 4 Fig. 3 is a surface type schematic diagram of a mask plate provided in the embodiment; Figure 5 Fig. 4 is a schematic diagram of a sub-step of step S200 provided in the embodiment; Figure 6 Fig. 5 is a schematic diagram of a sub-step of step S300 provided in the embodiment; Figure 7 Fig. 6 is a structural schematic diagram of a mask plate surface type adjustment device provided in the embodiment; Figure 8 Fig. 7 is a structural schematic diagram of a suction cup provided in the embodiment; Figure 9 Fig. 8 is a structural schematic diagram of a mask plate surface type adjustment device provided in the embodiment; Figure 10 Fig. 9 is a structural schematic diagram of a mask plate surface type adjustment device provided in the embodiment; Figure 11 Fig. 10 is a structural schematic diagram of a mask plate surface type adjustment device provided in the embodiment.
[0017] Fig. 1 is a structural schematic diagram of a mask plate in the prior art; DETAILED DESCRIPTION
[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0019] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present application.
[0020] It should be noted that similar reference numerals and letters refer to like items throughout the accompanying drawings, and once an item is defined in one drawing, it is not necessary to further define and explain it in subsequent drawings.
[0021] In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0022] In addition, the terms "horizontal", "vertical", "overhanging", and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0023] In the description of the present application, it should also be noted that unless otherwise explicitly specified and limited, the terms "provided", "mounted", "connected", "linked" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between the two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0024] It should be noted that the different features in the embodiments of the present application can be combined with each other without conflict.
[0025] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0026] Please refer to Figure 1 , Figure 1 An example of a flowchart of a mask plate surface type adjustment method provided by the present embodiment, the mask plate surface type adjustment method can include the following steps.
[0027] Step S100, providing a mask plate 100, installing the mask plate 100 on one side of a suction cup 200; the suction cup 200 includes at least two suction areas 210; the suction cup 200 further includes an adjustment area, the adjustment area is provided with a through hole 220, and the through hole 220 is provided with an adjustment module 400.
[0028] In the embodiment, the mask plate 100 can be arranged on one side of the suction cup 200, and the suction cup 200 can be used to adsorb and fix the mask plate 100 through the adsorption area 210. The mask plate 100 can include at least one mask pattern area 110, which is located at the center of the mask plate 100. The adjustment area of the suction cup 200 can be located at the center of the suction cup 200, and the orthographic projection of the adjustment area of the suction cup 200 on the mask plate 100 can completely cover the orthographic projection of the at least one mask pattern area 110 on the mask plate 100.
[0029] In the prior art, please refer to Figure 2 The number of mask pattern areas 110' of the mask plate 100' is usually only one, and the size is 26*33 mm. Compared with the prior art, when the mask plate 100 provided in the embodiment includes only one mask pattern area 110, the area of the mask pattern area 110 can be larger than that of the mask pattern area 110' of the mask plate 100' in the prior art. When the mask plate 100 provided in the embodiment includes a plurality of mask pattern areas 110, for example, please refer to Figure 3 When the mask plate 100 includes four mask pattern areas 110, the areas of the four mask pattern areas 110 can also be larger than that of the mask pattern area 110' of the mask plate 100' in the prior art. Therefore, the mask plate 100 provided in the embodiment has a large number of mask pattern areas 110 and a large area, and can realize large-area simultaneous exposure, thereby improving the photolithography efficiency.
[0030] It should be noted that when the mask plate 100 includes a plurality of mask pattern areas 110, the number of mask pattern areas 110 of the mask plate 100 is not limited to four, but can also be five, six, etc., which is not limited here.
[0031] In step S200, the gas pressure control module 300 is used to provide adsorption forces to the at least two adsorption areas 210 respectively, and the surface type of the mask plate 100 is adjusted according to the preset first target surface type information.
[0032] In the embodiment, the gas pressure control module 300 can be used to adjust the adsorption forces of different adsorption areas 210. By adjusting the adsorption forces of different adsorption areas 210, the deformation sizes of the mask plate 100 at different positions under the adsorption forces can be adjusted, so that the surface type of the mask plate 100 is preliminarily adjusted, and the surface type information of the mask plate 100 after the adjustment corresponds to the preset first target surface type information. The first target surface type information is the surface type information of the mask plate 100 after the preliminary adjustment. For example, when the surface fluctuation of the mask plate 100 after the adjustment is 100 nm (100 nm is the first target surface type information of the adjustment), the adsorption forces of different adsorption areas 210 can no longer be adjusted.
[0033] In step S300, according to the preset second target surface information, the adjustment module 400 applies a pulling or pushing force perpendicular to the plane where the mask 100 is located to the mask template 100 to adjust the surface of the mask template 100.
[0034] In this embodiment, the adjustment module 400 located within the through-hole 220 contacts the mask 100. The adjustment module 400 can apply a vertical force to the mask 100, further adjusting its surface profile so that the adjusted surface profile information corresponds to a preset second target surface profile. The second target surface profile information is the pre-set surface profile information of the mask 100 after fine adjustment. For example, when the surface profile undulation of the adjusted mask 100 is 10 nanometers (10 nanometers being the adjusted second target surface profile information), further adjustment of the mask 100's surface profile is unnecessary.
[0035] Based on the above design, in the mask surface shape adjustment method provided in this embodiment, the air pressure control module 300 adjusts the adsorption force of different adsorption regions 210, which can initially adjust the surface shape of the mask 100. At the same time, the adjustment module 400 applies a vertical force to the mask 100, which can finely adjust the surface shape of the mask 100. In this way, the surface shape of the mask 100 can be effectively adjusted, and the efficiency and accuracy of the surface shape adjustment of the mask 100 can be improved, which is conducive to improving the lithography efficiency.
[0036] Please refer to Figure 4 , Figure 4 Example: A schematic diagram of the surface shape adjustment of the mask template 100 provided in this application shows that after the deformation of the mask template 100 caused by the adsorption force at different positions is adjusted by the air pressure control module 300 and the surface shape of the mask template 100 is adjusted by the adjustment module 400, the surface shape undulation of the mask template 100 is significantly reduced.
[0037] In one possible implementation, please refer to Figure 5 Step S200 may include the following sub-steps.
[0038] Step S210: The mask template 100 is subjected to surface shape detection by the surface shape detection module to obtain the first surface shape information.
[0039] In this embodiment, the face shape of the mask 100 can be directly detected by the face shape detection module to obtain the first face shape information of the mask 100 before the face shape adjustment.
[0040] Step S220, based on the first face type information, the gas pressure control module 300 provides adsorption force to at least two adsorption areas 210 respectively, and adjusts the face type of the mask plate 100 according to the first target face type information.
[0041] In this embodiment, the gas pressure control module 300 can provide different adsorption forces to at least two adsorption areas 210 respectively according to the first face type information obtained in step S210, adjust the face type of the mask plate 100, and after the face type adjustment, the face type detection module detects the face type again, and judges whether the face type information of the mask plate 100 after adjustment corresponds to the first target face type information, if the face type information of the mask plate 100 after adjustment corresponds to the first target face type information, the face type of the mask plate 100 does not need to be adjusted by the gas pressure control module 300 again; if the face type information of the mask plate 100 after adjustment does not correspond to the first target face type information, the face type of the mask plate 100 is adjusted by the gas pressure control module 300 again until the face type information of the mask plate 100 after adjustment corresponds to the first target face type information.
[0042] Please refer to Figure 6 , step S300 can include the following sub-steps.
[0043] Step S310, the face type of the mask plate 100 is detected by the face type detection module to obtain the second face type information.
[0044] In this embodiment, after the face type of the mask plate 100 is preliminarily adjusted, the face type of the mask plate 100 is detected by the face type detection module to obtain the second face type information of the mask plate 100.
[0045] Step S320, based on the second face type information, the adjustment module 400 applies a pulling force or a pushing force perpendicular to the plane on which the mask plate 100 is located to the mask plate 100, and adjusts the face type of the mask plate 100 according to the second target face type information.
[0046] In the embodiment, the adjustment module 400 can exert a vertical pulling force or pushing force on the mask plate 100 according to the second surface profile information obtained in step S310 to adjust the surface profile of the mask plate 100, and after the adjustment, the surface profile detection module detects again and judges whether the surface profile information of the mask plate 100 after the adjustment corresponds to the preset second target surface profile information. If the surface profile information of the mask plate 100 after the adjustment corresponds to the preset second target surface profile information, the surface profile of the mask plate 100 does not need to be adjusted by the adjustment module 400 again. If the surface profile information of the mask plate 100 after the adjustment does not correspond to the preset second target surface profile information, the surface profile of the mask plate 100 is adjusted by the adjustment module 400 again until the surface profile information of the mask plate 100 after the adjustment corresponds to the preset second target surface profile information.
[0047] In a possible implementation, when the surface profile of the mask plate 100 is adjusted according to the preset first target surface profile information by the gas pressure control module 300 providing the adsorption force to the at least two adsorption areas 210 respectively based on the first surface profile information, the first surface profile information can be transmitted to the industrial computer 700, and the industrial computer 700 controls the gas pressure control module 300 to provide the adsorption force to the at least two adsorption areas 210 respectively to adjust the surface profile of the mask plate 100 according to the preset first target surface profile information.
[0048] In the embodiment, the surface profile detection module can transmit the first surface profile information obtained in step S210 to the industrial computer 700, and the industrial computer 700 controls the gas pressure control module 300 to provide different adsorption forces to the at least two adsorption areas 210 respectively to adjust the deformation size of the mask plate 100 at different positions when the mask plate 100 is subjected to the adsorption force, so as to preliminarily adjust the surface profile of the mask plate 100 according to the preset first target surface profile information.
[0049] In the embodiment, the surface profile detection module can transmit the second surface profile information obtained in step S310 to the industrial computer 700, and the industrial computer 700 controls the adjustment module 400 to exert a vertical pulling force or pushing force on the mask plate 100, so as to preliminarily adjust the surface profile of the mask plate 100.
[0050] In the embodiment, the surface profile detection module can transmit the second surface profile information obtained in step S310 to the industrial computer 700, and the industrial computer 700 controls the adjustment module 400 to exert a vertical pulling force or pushing force on the mask plate 100, so as to preliminarily adjust the surface profile of the mask plate 100.
[0051] In one possible implementation, when the pressure control module 300 provides adsorption force to at least two adsorption regions 210 respectively, a specified adsorption force can be provided to at least two adsorption regions 210 respectively through at least two pressure control valves 310 of the pressure control module 300.
[0052] In this embodiment, each adsorption region 210 can correspond to a pressure control valve 310. Each pressure control valve 310 can provide different adsorption forces to the corresponding adsorption region 210, ensuring that the mask 100 can deform under the action of different adsorption forces to achieve the preset surface shape requirements.
[0053] This application also provides a mask template surface shape adjustment device. Please refer to... Figure 7 The mask template surface adjustment device may include a suction cup 200, a pneumatic control module 300, and an adjustment module 400.
[0054] Please refer to Figure 8 The suction cup 200 may include at least two independent or separate adsorption areas 210. Different adsorption areas 210 have different adsorption forces. The suction cup 200 can adsorb and fix the mask template 100 by the adsorption forces of different adsorption areas 210.
[0055] Specifically, at least two adsorption regions 210 can be arranged in a ring, and the areas of different adsorption regions 210 can be different.
[0056] It should be noted that the number and shape of the adsorption regions 210 can be adjusted according to the actual situation, and no specific limitation is made here.
[0057] Please refer to this again. Figure 7 The air pressure control module 300 can be used to provide different adsorption forces to at least two adsorption regions 210 to adsorb the mask template 100 and to make preliminary adjustments to the surface shape of the mask template 100 until the surface shape information of the mask template 100 reaches the preset first target surface shape information.
[0058] Additionally, please refer to [the website / platform] again. Figure 8 The suction cup 200 may also include an adjustment area, the adjustment area being provided with a through hole 220, and an adjustment module 400 being provided within the through hole 220. The adjustment module 400 may be used to apply a pulling or pushing force perpendicular to the plane of the mask 100 to adjust the surface shape of the mask 100.
[0059] In the embodiment, the adjusting area can be located at the center of the chuck 200, the adsorbing area 210 is arranged around the adjusting area, the orthographic projection of the adjusting area on the mask plate 100 can completely cover the orthographic projection of the mask pattern area 110 of the mask plate 100 on the mask plate 100, and the area of the orthographic projection of the adjusting area on the mask plate 100 can be greater than the area of the orthographic projection of the mask pattern area 110 of the mask plate 100 on the mask plate 100. The adjusting module 400 is arranged in the through hole 220 of the chuck 200 and located at the edge position of the through hole 220. When the chuck 200 adsorbs the mask plate 100, the adjusting module 400 can not be in contact with the mask pattern area 110 of the mask plate 100.
[0060] It should be noted that the shape and cross-sectional area of the through hole 220 can be adjusted according to actual conditions, which is not limited here.
[0061] In a possible implementation, please refer to Figure 9 The mask plate surface type adjusting device can further include a connecting piece 600 arranged on the side of the adjusting module 400 close to the mask plate 100. The connecting piece 600 can be used to connect the adjusting module 400 and the mask plate 100, so as to facilitate the fine adjustment of the surface type of the mask plate 100 by the adjusting module 400. The connecting piece 600 can be made of a flexible material.
[0062] In the embodiment, the adjusting module 400 can include a plurality of fine adjustment units, each of which can be connected to the mask plate 100 through a connecting piece 600. Each fine adjustment unit can independently apply a vertical pulling force or pushing force to the mask plate 100, so as to realize the precise regulation and control of the local surface type of the mask plate 100.
[0063] In some examples, the fine adjustment unit can be a motor or a driver. When the fine adjustment unit is a motor, a vertical pulling force or pushing force can be applied to the mask plate 100 by adjusting the extension state of the extension rod of the motor. When the fine adjustment unit is a driver, the local surface type of the mask plate 100 can be adjusted by controlling the motion state of the driver in the vertical direction.
[0064] In a possible implementation, please refer to Figure 9 The mask plate surface type adjusting device can further include a negative pressure providing module 500. The connecting piece 600 is fixedly connected to the adjusting module 400, and the center of the connecting piece 600 is provided with an opening. The connecting piece 600 can be connected to the negative pressure providing module 500, and the negative pressure providing module 500 can be used to provide negative pressure to the connecting piece 600 to adsorb the mask plate 100.
[0065] In the embodiment, please refer to Figure 10The negative pressure providing module 500 can be connected with the air pressure control module 300, and the negative pressure providing module 500 can be used to provide negative pressure to the air pressure control module 300. The air pressure control module 300 can be connected with the adsorption area 210 through an air pipe, and the air pressure control module 300 can adjust the size of the negative pressure, so as to adjust the deformation size of the mask plate 100 at different positions when the mask plate 100 is subjected to the adsorption force.
[0066] In addition, please refer again to Figure 9 The opening of the connecting piece 600 can also be connected with the air pressure control module 300 through an air pipe, and the air pressure control module 300 can be connected with the negative pressure providing module 500 through an air pipe. The negative pressure providing module 500 is used to provide negative pressure to the connecting piece 600, and the air pressure control module 300 is used to adjust the size of the negative pressure of the connecting piece 600.
[0067] In some examples, the negative pressure providing module 500 can be a gas pump.
[0068] In a possible implementation, the mask plate surface shape adjusting device can further include a surface shape detection module, and the surface shape detection module can be used to detect the surface shape of the mask plate 100.
[0069] In some examples, the surface shape detection module can include a surface shape interferometer or a picometer interferometer.
[0070] In a possible implementation, the mask plate surface shape adjusting device can further include an industrial computer 700, and the industrial computer 700 can be used to record the surface shape detection result of the surface shape detection module, and control the air pressure control module 300 or the adjusting module 400 to adjust the air pressure of different adsorption areas 210 according to the surface shape detection result of the surface shape detection module, so as to adjust the surface shape of the mask plate 100.
[0071] In the embodiment, the surface shape detection module can be connected with the industrial computer 700 through a control line, and the industrial computer 700 can be connected with the air pressure control module 300 and the adjusting module 400 through the control line. The surface shape detection module can transmit the detected surface shape information of the mask plate 100 to the industrial computer 700, and the industrial computer 700 can control the air pressure control module 300 or the adjusting module 400 to adjust the surface shape of the mask plate 100 according to the surface shape information.
[0072] Specifically, please refer again to Figure 10 During the preliminary adjustment stage of the surface shape of the mask plate 100, the industrial computer 700 can control the air pressure control module 300 to adjust the adsorption force of different adsorption areas 210 according to the surface shape information of the mask plate 100 measured by the surface shape detection module, so as to adjust the deformation size of the mask plate 100 at different positions when the mask plate 100 is subjected to the adsorption force.
[0073] Please refer to Figure 11The industrial computer 700 can be connected with each fine adjustment unit of the adjustment module 400 through a control line. In the fine adjustment stage of the surface type of the mask plate 100, the industrial computer 700 can control the direction and size of the force applied to the mask plate 100 by each fine adjustment unit of the adjustment module 400 according to the surface type information of the mask plate 100 measured by the surface type detection module, so as to adjust the surface type of the mask plate 100.
[0074] In a possible implementation, referring back to Figure 10 Each adsorption area 210 can include at least one air hole 211, and the air hole 211 of each adsorption area 210 can be connected with the air pressure control module 300 through an air pipe. The air pressure control module 300 can include at least two pressure control valves 310, and the number of the pressure control valves 310 can be equal to the number of the adsorption areas 210. The at least two pressure control valves 310 can be used to provide different adsorption forces to the at least two adsorption areas 210 through the air holes 211, respectively.
[0075] In some examples, when each adsorption area 210 includes two air holes 211, the two air holes 211 of each adsorption area 210 are connected with the same pressure control valve 310, so as to ensure that the adsorption forces of the area are the same and uniformly distributed, and meanwhile, the change speed of the adsorption force is accelerated.
[0076] It should be noted that the number of the air holes 211 of each adsorption area 210 can be adjusted according to actual needs, which is not specifically limited here.
[0077] In summary, the embodiment provides a mask plate surface type adjustment method and device. The air pressure control module is used to adjust the adsorption forces of different adsorption areas, so as to preliminarily adjust the surface type of the mask plate. Meanwhile, the adjustment module is used to apply a force in the vertical direction to the mask plate, so as to finely adjust the surface type of the mask plate. In this way, the effective adjustment of the surface type of the mask plate can be realized, and the efficiency and accuracy of the mask plate surface type adjustment can be improved, so as to facilitate the improvement of the photolithography efficiency.
[0078] It is to be noted that, as used in this specification and the appended claims, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component" can include a combination of two or more components, and the term "an element" can include comparable reference to a plurality of elements. Also, as used in this specification and the appended claims, the term "or" as used in the context of "A / B" or "A / B / C" means any of the possibilities A, B, or C, i.e. "A or B" or "A or C" or "B or C." Further, the term "comprising" as used in this specification and the appended claims, is inclusive or open and does not exclude additional, non-relevant elements or limit it to the specific elements
[0079] The preferred embodiments of the present application have been described above with the intent to enable those skilled in the art to make and use it. Various modifications to these embodiments will occur to those skilled in the art and are intended to be encompassed by the appended claims. The modifications are not limited to only those elements of a claim recited in the specification and the elements are not limited to only those which can be explicitly described. Therefore, it is manifestly intended that the present application be limited only by the following claims and equivalents thereof.
Claims
1. A mask plate surface shape adjustment method characterized by comprising: The method comprises: Providing a mask plate, and mounting the mask plate on one side of a chuck; the chuck comprises at least two adsorption areas; the chuck further comprises an adjustment area, and the adjustment area is provided with a through hole, and the through hole is provided with an adjustment module; Providing adsorption force to the at least two adsorption areas by a gas pressure control module, and adjusting the surface type of the mask plate according to preset first target surface type information; Applying pulling force or pushing force to the mask plate in a direction perpendicular to the plane where the mask plate is located by the adjustment module according to preset second target surface type information, so as to adjust the surface type of the mask plate.
2. The reticle face type adjustment method of claim 1, wherein, The step of providing adsorption force to the at least two adsorption areas by the gas pressure control module and adjusting the surface type of the mask plate according to preset first target surface type information comprises: Detecting the surface type of the mask plate by a surface type detection module to obtain first surface type information; Based on the first surface type information, providing adsorption force to the at least two adsorption areas by the gas pressure control module, and adjusting the surface type of the mask plate according to preset first target surface type information; The step of applying pulling force or pushing force to the mask plate in a direction perpendicular to the plane where the mask plate is located by the adjustment module according to preset second target surface type information, so as to adjust the surface type of the mask plate comprises: Detecting the surface type of the mask plate by a surface type detection module to obtain second surface type information; Based on the second surface type information, applying pulling force or pushing force to the mask plate in a direction perpendicular to the plane where the mask plate is located by the adjustment module, and adjusting the surface type of the mask plate according to preset second target surface type information.
3. The reticle face type adjustment method according to claim 2, wherein The step of providing adsorption force to the at least two adsorption areas by the gas pressure control module and adjusting the surface type of the mask plate according to preset first target surface type information based on the first surface type information comprises: Transmitting the first surface type information to an industrial computer, and controlling the gas pressure control module to provide adsorption force to the at least two adsorption areas by the industrial computer, and adjusting the surface type of the mask plate according to preset first target surface type information; The step of applying pulling force or pushing force to the mask plate in a direction perpendicular to the plane where the mask plate is located by the adjustment module according to preset second target surface type information based on the second surface type information comprises: Transmitting the second surface type information to an industrial computer, and controlling the adjustment module to apply pulling force or pushing force to the mask plate in a direction perpendicular to the plane where the mask plate is located by the industrial computer, and adjusting the surface type of the mask plate according to preset second target surface type information.
4. The reticle face type adjustment method of claim 1, wherein The step of providing adsorption force to the at least two adsorption areas by the gas pressure control module comprises: Providing preset adsorption force to the at least two adsorption areas by at least two pressure control valves of the gas pressure control module.
5. A mask plate surface profile adjustment apparatus characterized by comprising: The mask plate surface type adjustment device uses the mask plate surface type adjustment method according to any one of claims 1-4. A chuck, comprising at least two adsorption areas; An air pressure control module, configured to provide adsorption force to the at least two adsorption areas respectively, so as to adsorb a mask plate and adjust a surface type of the mask plate; The chuck further comprises an adjusting area, which is provided with a through hole, and an adjusting module is arranged in the through hole, the adjusting module is configured to apply pulling force or pushing force to the mask plate in a direction perpendicular to a plane on which the mask plate is arranged, so as to adjust the surface type of the mask plate.
6. The reticle face type adjustment apparatus according to claim 5, wherein The mask plate surface type adjusting device further comprises a connecting piece, which is arranged on a side of the adjusting module close to the mask plate, and is configured to connect the adjusting module and the mask plate.
7. The reticle facet adjustment apparatus of claim 6, wherein, The mask plate surface type adjusting device further comprises a negative pressure providing module. The connecting piece is fixedly connected with the adjusting module, and is connected with the negative pressure providing module, and the negative pressure providing module is configured to provide negative pressure to the connecting piece so as to adsorb the mask plate.
8. The reticle facet adjustment apparatus of claim 5, wherein, The mask plate surface type adjusting device further comprises a surface type detection module, which is configured to detect the surface type of the mask plate.
9. The reticle facet adjustment apparatus of claim 8, wherein, The mask plate surface type adjusting device further comprises an industrial computer, which is configured to record a surface type detection result of the surface type detection module, and control the air pressure control module or the adjusting module to adjust the air pressure of different adsorption areas according to the surface type detection result of the surface type detection module, so as to adjust the surface type of the mask plate.
10. The reticle facet adjustment apparatus of claim 5, wherein, The adsorption area comprises an air hole, and the air pressure control module comprises at least two pressure control valves, which are configured to provide adsorption force to the at least two adsorption areas respectively through the air hole.