Liquid ejecting substrate, method of manufacturing same, and liquid ejecting head

Abstract

A liquid ejecting substrate includes a laminate formed of a support substrate, a first coupling member, a flexible member having a sheet shape, a second coupling member, and a channel substrate having a channel that guides a liquid to a nozzle, wherein the support substrate has a recessed portion at a position corresponding to at least a portion of the channel provided in the channel substrate, and the flexible member is provided between the channel and the recessed portion, and the first coupling member and the second coupling member are in partial contact with each other.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a liquid ejection substrate, a method of manufacturing a liquid ejection substrate, and a liquid ejection head. BACKGROUND

[0002] As one example of a liquid ejection head for ejecting liquid droplets, an inkjet head mounted on an inkjet recording apparatus is known. The inkjet head has a plurality of pressure chambers and nozzles, and is configured to eject ink droplets through the nozzles by causing a driving member to apply pressure to ink in the pressure chambers.

[0003] A change in internal pressure that occurs in conjunction with ejection of an ink droplet in one pressure chamber can propagate along a liquid channel to other pressure chambers. The so-called cross-talk that is thereby generated can cause ejection defects.

[0004] One example of a method of reducing the effects of cross-talk includes a method of using a damper to attenuate such a change in pressure. Japanese Patent No. 7196740 discloses a liquid ejection substrate in which a flexible member is provided within a liquid channel to serve as a damper. The flexible member disclosed in Japanese Patent No. 7196740 is held between substrates with a coupling member interposed therebetween. SUMMARY

[0005] However, in the configuration disclosed in Japanese Patent No. 7196740, when the adhesion between the flexible member and the coupling member is low, there is a risk of peeling of the substrates at the positions at which the flexible member is held between the substrates.

[0006] The present disclosure has been made in view of such a problem. The present disclosure provides a technique for suppressing peeling of substrates when a flexible member serving as a damper is provided in a liquid ejection substrate.

[0007] The present disclosure provides a liquid ejection substrate including a laminate composed of a support substrate, a first coupling member, a flexible member having a sheet-like shape, a second coupling member, and a channel substrate having a channel that guides a liquid to a nozzle, wherein

[0008] The support substrate has a recessed portion at a position corresponding to at least a portion of the channel of the channel substrate, and the flexible member is provided between the channel and the recessed portion, and

[0009] The first coupling member and the second coupling member are in partial contact with each other.

[0010] The present disclosure also provides a liquid ejection head including:

[0011] A liquid ejection substrate including a laminate composed of a support substrate, a first bonding member, a flexible member having a sheet shape, a second bonding member, and a channel substrate having a channel that guides a liquid to a nozzle, wherein the support substrate has a recessed portion at a position corresponding to at least a portion of the channel provided to the channel substrate, and the flexible member is provided between the channel and the recessed portion, and the first bonding member and the second bonding member are partially in contact with each other;

[0012] a housing configured to be able to store a liquid to be supplied to the channel; and

[0013] an electrical connector configured to transmit power and a control signal to the liquid ejection substrate.

[0014] The present disclosure also provides a method of manufacturing a liquid ejection substrate, the method including:

[0015] forming a through-hole in the support substrate, and forming a recessed portion at a position different from the through-hole;

[0016] placing the first bonding member on a surface of the support substrate on which the recessed portion is provided, but in a region in which the through-hole and the recessed portion are not provided;

[0017] placing the flexible member having a sheet shape on a top surface of the first bonding member;

[0018] forming an opening in the flexible member at a position corresponding to the through-hole of the support substrate; and

[0019] placing the second bonding member on a surface of the flexible member on an opposite side from a surface of the flexible member that is bonded to the support substrate via the first bonding member, and partially contacting the second bonding member with the first bonding member.

[0020] The features of the present disclosure will become apparent from the following description of embodiments with reference to the accompanying drawings. The following description of embodiments is described by way of example. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a schematic cross-sectional perspective view of a liquid ejection substrate according to one embodiment.

[0022] Figure 2 is an enlarged view for explaining how the flexible member is bonded.

[0023] Figure 3 is a schematic enlarged view of the vicinity of a segment serving as a damper.

[0024] Figure 4 is a schematic view showing how the bonding members are in contact with each other according to one embodiment.

[0025] Figures 5A-5C is a schematic diagram for explaining a manufacturing process of a liquid ejection substrate according to an embodiment.

[0026] Figures 6A-6C is a schematic diagram for explaining a manufacturing process of a liquid ejection substrate according to an embodiment.

[0027] Figure 7 is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment.

[0028] Figure 8A and Figure 8B is a schematic cross-sectional front view showing a liquid ejection substrate according to an embodiment.

[0029] Figure 9 is a schematic diagram showing a modification of a liquid ejection substrate.

[0030] Figure 10A and Figure 10B is a schematic diagram showing a modification of a liquid ejection substrate.

[0031] Figure 11A and Figure 11B is a schematic diagram showing a modification of a liquid ejection substrate.

[0032] Figures 12A-12C is a schematic cross-sectional front view of a liquid ejection substrate according to an embodiment.

[0033] Figure 13A and Figure 13B is a schematic diagram showing a liquid ejection substrate according to an embodiment.

[0034] Figure 14 is a schematic diagram for explaining a position at which a flexible member is to be provided.

[0035] Figure 15A and Figure 15B is a schematic diagram showing a modification of a liquid ejection substrate.

[0036] Figure 16 is a schematic diagram showing a configuration example of a liquid ejection device.

[0037] Figure 17 is a schematic diagram showing a configuration example of a liquid ejection head. DETAILED DESCRIPTION

[0038] Preferred embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The sizes, materials, shapes, and relative positions of the elements described in the embodiments are not intended to limit the scope of the present disclosure to what described, unless otherwise specified. The materials, shapes, and other characteristics of the components once explained in the following description remain unchanged throughout the entire description, unless otherwise specified. For configurations or processes not specifically shown or described, techniques well known or commonly used in the art can be used. Furthermore, the present disclosure is not limited only to these embodiments, and the combinations of the features described in the embodiments are not all necessarily essential to the solution provided by the present disclosure.

[0039] First Embodiment

[0040] Liquid ejecting apparatus

[0041] The liquid ejecting apparatus 600 according to the present embodiment includes a liquid ejecting head 710 that performs recording on a recording medium P by ejecting a liquid. The liquid ejecting head 710 includes a housing having a liquid reservoir capable of storing a liquid, a liquid ejecting substrate provided to a bottom surface of the housing, and an electrical connector via which power and control signals are sent to the liquid ejecting substrate.

[0042] Configuration of liquid ejecting apparatus and liquid ejecting head

[0043] Reference Figure 15A , Figure 15B and Figure 16 A liquid ejecting apparatus 600 provided with the liquid ejecting head 710 according to the present disclosure will now be described. In the example described herein, the liquid ejecting apparatus 600 records an image by ejecting ink onto a recording medium P. Figure 15A and Figure 15B are schematic cross-sectional front views showing a schematic configuration of the liquid ejecting apparatus 600 (recording apparatus). Figure 16 is a perspective view of the liquid ejecting head 710 (recording head).

[0044] The liquid ejecting apparatus 600 includes a carriage 605 from which the liquid ejecting head 710 is detachable. The carriage 605 is mounted on a belt 606 that is tensioned between a drive pulley 603A and a driven pulley 603B, and is slidably provided along a guide shaft 602. The belt 606 is rotated by rotating the drive pulley 603A using a carriage motor 604 as a driving source, and the carriage 605 is reciprocated in the direction of arrow A. An encoder sensor 608 detects the position of the carriage 605 in the A direction by detecting a slit on a linear scale 607 extending in the A direction.

[0045] The first pair of conveyance rollers 609, 610 and the second pair of conveyance rollers 611, 612 are rotated by a conveyance motor to convey the recording medium P in the direction of arrow B. Hereinafter, the first pair of conveyance rollers and the second pair of conveyance rollers are also referred to as a conveyance roller set. The liquid ejection device 600, based on the detection result of the encoder sensor 608, while driving the carriage motor 604, ejects ink onto the recording medium P via the liquid ejection head 710 in accordance with the recording data. Thus, an image corresponding to one band is recorded on the recording medium P. Then, the conveyance roller set conveys the recording medium P in the direction of arrow B by a distance corresponding to one band. By alternately repeating the recording operation and the conveyance operation, a desired image is recorded on the recording medium P.

[0046] The liquid ejection device 600 is provided with a recovery unit 613 at one end in the A direction. The recovery unit 613 includes elements such as a cap member for protecting the liquid ejection head 710 and a pump for generating negative pressure inside the cap member by sucking ink from the cap member.

[0047] According to the present disclosure, four liquid ejection heads 710 are provided in the carriage 605, and cyan, magenta, yellow, and black inks are stored therein, respectively (only the liquid ejection head 710C corresponding to cyan is labeled with a reference numeral in the drawing). With these, full-color printing can be achieved. However, the scope of the present disclosure is not limited thereto, and the liquid ejection device 600 can also be a device for monochrome printing.

[0048] Figure 16 The illustrated liquid ejection head 710 includes a tank 704 in which ink is stored, and a recording head. The recording head further includes a wiring tape 702 via which recording data, electric power, and the like are supplied to the first liquid ejection substrate 100. The wiring tape 702 is provided with contacts 703, which are electrical connectors, for electrical connection with head-side contacts when the liquid ejection head 710 is mounted to the carriage 605. Note that the liquid ejection head 710 is not limited to a liquid ejection head in which the tank and the recording head are integrated, but can have a configuration including a separate tank and recording head.

[0049] Description of the first liquid ejection substrate 100

[0050] The first liquid ejection substrate 100 provided in the liquid ejection head 710 according to the present embodiment will now be explained. Figure 1 is a schematic cross-sectional perspective view of the first liquid ejection substrate 100. Figure 2 is a sectional view for explaining how the flexible member 101 is incorporated. Figure 2 is Figure 1FIG. 1 is a schematic view of the first liquid ejection substrate 100, but corresponds to a viewpoint on the +Y side. In each drawing of the present disclosure, the X direction corresponds to a width direction of the first liquid ejection substrate 100. The Y direction corresponds to a depth direction of the first liquid ejection substrate 100. The Z direction corresponds to a height direction of the first liquid ejection substrate 100. A surface of the first liquid ejection substrate 100 facing the +Z side will sometimes be referred to as a "top surface". A surface of the first liquid ejection substrate 100 facing the -Z side will sometimes be referred to as a "bottom surface". The X, Y, and Z directions are orthogonal to one another.

[0051] The liquid ejection substrate 100 according to the present embodiment is also referred to as a first liquid ejection substrate 100. The first liquid ejection substrate 100 includes a support substrate 102 that supports a bottom surface of a flexible member 101, and a passage substrate 103 that supports a top surface of the flexible member 101. Between a top surface of the support substrate 102 and a bottom surface of the flexible member 101, a first bonding member 104 is provided as a layer. Between a top surface of the flexible member 101 and a bottom surface of the passage substrate 103, a second bonding member 105 is provided as a layer. In this way, the flexible member 101 is held and fixed between the support substrate 102 and the passage substrate 103 via the first bonding member 104 and the second bonding member 105, respectively, arranged therebetween.

[0052] The passage substrate 103 includes a first substrate member 106 to a bottom surface of which the second bonding member 105 is attached. The first substrate member 106 has a housing space 107 recessed from a top surface toward a bottom surface. A diaphragm 108 is bonded to the top surface of the first substrate member 106 in a manner of covering the housing space 107. A piezoelectric element 109 is placed on a bottom surface of the diaphragm 108. The piezoelectric element 109 is placed within the housing space 107.

[0053] The passage substrate 103 further includes a second substrate member 110 bonded to a top surface of the diaphragm 108. A top surface of the second substrate member 110 has a nozzle 111 for ejecting a liquid in the form of a droplet. Examples of the support substrate 102, the first substrate member 106, and the second substrate member 110 include a silicon substrate. The support substrate 102 has a recessed portion 112 that is partially recessed from a top surface toward a bottom surface of the support substrate 102, and a bottom surface of the recessed portion 112 has an atmospheric connection port 119. At a position on the support substrate 102 different from the recessed portion 112, a third passage 115 is provided that penetrates through the support substrate 102, a portion of the bottom surface side of the flexible member 101, and the first substrate member 106.

[0054] The flexible member 101 has a first opening 116 via which the third passage 115 is open to the support substrate 102 and the first substrate member 106. An example of a method of forming the first opening 116 on the flexible member 101 is dry etching. The flexible member 101 contains a resin. Examples of the resin contained in the flexible member 101 include polyimide and polyamide.

[0055] The bottom surface of the flexible member 101 is bonded to the top surface of the support substrate 102 in a manner to cover the recessed portion 112. With this configuration, when an external force due to a change in pressure (described later), or the like is applied to the flexible member 101, the flexible member 101 is allowed to elastically deform toward the recessed portion 112. The elastically deformed flexible member 101 can then recover its original shape with its elastic restoring force.

[0056] The first substrate member 106 is provided with a plurality of first passages 113 that communicate with the first opening 116, and a second passage 114 that communicates with each of the first passages 113. The first substrate member 106 also has a plurality of accommodation spaces 107 arranged in the Y direction, and each of the accommodation spaces has a diaphragm 108 as a top surface. Each of the accommodation spaces 107 accommodates a plurality of piezoelectric elements 109 provided on a bottom surface of the diaphragm 108.

[0057] The diaphragm 108 has a diaphragm opening 117 that connects the second passage 114 to the first substrate member 106 and the second substrate member 110. The second substrate member 110 also has a plurality of pressure chambers 118 with the diaphragm 108 as a bottom surface. In the second substrate member 110, a plurality of nozzles 111 that communicate with a plurality of corresponding pressure chambers 118 are arranged in the Y direction.

[0058] With this configuration, when liquid is to be ejected from the first liquid ejection substrate 100, the liquid is supplied to the first passages 113 through the third passage 115 and the first opening 116. The liquid supplied to the first passages 113 will then be supplied to the pressure chambers 118 through the second passage 114 and the diaphragm opening 117.

[0059] The piezoelectric elements 109 change the internal volume of the pressure chambers 118 by deforming the diaphragm 108 in response to an electrical signal received from a controller in a main unit of the liquid ejection device 600. As a result, the pressure in the pressure chambers 118 changes, and the liquid in the pressure chambers 118 is pressurized so that droplets (e.g., ink droplets) are ejected from the nozzles 111 in the +Z direction. Liquid that is not ejected through the nozzles 111 is recovered.

[0060] When the pressure changes, the flexible member 101 providing one wall of the first channel 113 elastically deforms toward the recessed portion 112, thus attenuating the pressure change. In other words, the entire first channel 113 acts as a damper. Because this configuration can mitigate pressure changes in the nozzle other than the nozzle performing the injection operation, the effects of crosstalk can be suppressed.

[0061] like Figure 2 As shown, the first liquid jetting substrate 100 includes a support substrate 102, a first substrate member 106, and a second substrate member 110, which are laminated together by corresponding bonding members therebetween. The support substrate 102 is provided with a third channel 115, which is a liquid supply channel. The first substrate member 106 included in the channel substrate 103 is provided with a first channel 113 capable of storing liquid supplied via the third channel 115. The second substrate member 110 is provided with a plurality of pressure chambers 118 communicating with the first channel 113. The second substrate member 110 included in the channel substrate 103 is provided with a plurality of nozzles 111, which are correspondingly arranged with respect to the corresponding pressure chambers 118, and each nozzle is capable of jetting liquid stored in the corresponding pressure chamber 118. A sheet-like flexible member 101 stretched across the hollow space defined by the support substrate 102 and the first substrate member 106 (i.e., the space formed by the recessed portion 112 and the first channel 113) forms part of the wall of the first channel 113.

[0062] Figure 3 yes Figure 2 The diagram shows a schematic enlarged view of the vicinity of the segment used as a damper. For convenience, the flexible member 101 is divided into: a first segment 201, which is bonded to the support substrate 102 and the first substrate member 106; a second segment 202, which forms part of the first channel 113; and a third segment 203, which is bonded to the support substrate 102. In these segments, the top and bottom surfaces of the first segment 201 of the flexible member 101 are bonded to the substrate by a bonding member therebetween. Therefore, if the adhesive force between the flexible member 101 and the bonding member is weak, the flexible member 101 may peel off from the bonding member due to elastic deformation of the flexible member 101. When the flexible member 101 peels off from the bonding member, not only will the function of the flexible member 101 as a damper deteriorate, but the substrates will also peel off from each other. In view of this situation, a unique bonding method is used in the first segment 201 in this embodiment.

[0063] Configuration of attaching a connecting member to an elastic member and another connecting member

[0064] Figure 4 This is a schematic diagram showing how the bonding members in this embodiment come into contact with each other, and is also a schematic diagram showing the first liquid jetting substrate 100.

[0065] As Figure 4 shown, in a configuration in which the support substrate 102 and the passage substrate 103 are bonded to each other, the flexible member 101 includes a first opening 116, thereby allowing the third passage 115 and the first passage 113 to communicate with each other.

[0066] The flexible member 101 also has a first section 201 that is supported in a manner of being held between the support substrate 102 and the first substrate member 106. The flexible member 101 also has a second section 202 that encloses the recessed portion 112, is neither supported by the support substrate 102 nor by the first substrate member 106, and is elastically deformable toward the recessed portion 112 when subjected to an external force. The second section 202 functions as a damper section for attenuating pressure variation upon ejection of liquid. The flexible member 101 also has a third section 203 whose bottom surface is supported by the support substrate 102 and whose top surface is not supported.

[0067] In the first section 201 in the present embodiment, the first bonding member 104 that has been applied to the top surface of the support substrate 102 is attached to the bottom surface of the flexible member 101. In contrast, on the top surface of the flexible member 101, the second bonding member 105 that has been applied to the bottom surface of the first substrate member 106 is continuously attached to the outer peripheral side surface of the flexible member 101 and to a portion of the outer peripheral surface of the first bonding member 104, on the outer side of the first section 201 in the -X direction.

[0068] With this configuration, the bonding members are allowed to contact each other. Therefore, even if the flexible member 101 in the first section 201 is peeled off from the bonding members, peeling of the substrates can be suppressed due to the bonding members being bonded to each other. Furthermore, since the flexible member 101 is bonded to the second bonding member 105 with a larger area, the bonding strength can be improved compared to a conventional counterpart. Therefore, in the case of the liquid ejection substrate 100 according to the present disclosure, even when the adhesion between the flexible member 101 and the bonding members is low and there is a risk of peeling of the substrates, the substrates can be firmly fixed to each other.

[0069] Bonding member

[0070] The first bonding member 104 and the second bonding member 105 will now be explained. When it is not necessary to distinguish the first bonding member 104 and the second bonding member 105, these bonding members will simply be referred to as “bonding members”. Furthermore, when it is not necessary to distinguish the support substrate 102, the first substrate member 106, and the second substrate member 110 from each other, they will simply be referred to as “substrates”.

[0071] As the bonding member, an organic material or an inorganic material can be used. Depending on the material used for the substrate, the substrate can have a problem of degradation at high temperature. Therefore, an organic material that can bond at a lower temperature is preferable because it can increase the degree of freedom of the material used for the substrate. As the organic bonding member, an adhesive material can be used. However, a material that can bond in a cured state is preferable because it is easier to increase the bonding strength. A thermoplastic material is preferable because it is a member that is softened and becomes adhesive by heating and then cured by lowering the temperature, and thus can be easily handled. A material that is cured by a chemical reaction after bonding is preferable because it is easier to increase the bonding strength. A heat-curable material is preferable because the curing reaction is easy to control.

[0072] As the material of the bonding member, for example, an epoxy resin, an acrylic, a polyurethane, a silicone resin, a benzocyclobutene, a polyimide, a polyamide, a polyamide-imide, a cyanoacrylate, a phenol, a melamine, a styrene, a cyclized rubber, or a mixture thereof can be used. Among these materials, a resin containing an epoxy resin, a silicone resin, a benzocyclobutene, or a polyimide as a main component is preferable because these resins have excellent chemical resistance.

[0073] The type of the epoxy resin is not limited to a particular type. For example, a bisphenol epoxy resin, an epoxy phenol resin, an epoxy polyol, an alicyclic epoxy resin, a glycidyl epoxy resin, a polyurethane-modified epoxy resin, a chelate-modified epoxy resin, a rubber-modified epoxy resin, or a mixture thereof can be used.

[0074] The type of the silicone resin is not limited to a particular type. For example, a condensation-cured silicone resin or an addition-type silicone resin can be used. Among these, an addition-type silicone resin that has a small curing shrinkage is preferable. For example, an epoxy-modified silicone resin, an acrylic-modified silicone resin, a methyl silicone resin, a phenyl silicone resin, a methylphenyl silicone resin, an alkyd-modified silicone resin, a polyester-modified silicone resin, or a mixture thereof can be used.

[0075] The type of the polyimide is not limited to a particular type. A thermoplastic polyimide in the form of a film can be used. A polyamide acid can also be used as a precursor. A precursor that is cured after bonding is preferably used because this property makes it easier to increase the bonding strength.

[0076] The bonding member can contain a filler as an additive. For example, a fibrous filler is preferable. This is because a fibrous filler is relatively effective in suppressing defects such as breakage of the bonding member. As examples of the fibrous filler, a carbon fiber, a metal fiber, a glass fiber, or a cellulose fiber can be used.

[0077] For the purpose of improving chemical resistance or enhancing the binding force with respect to the binding member, the substrate can include a functional layer. The functional layer can be provided on a portion of the substrate. The functional layer can be provided on the entire surface of the substrate. A coupling agent can be placed between the support substrate 102 and the flexible member 101 and between the first substrate member 106 and the flexible member 101. By selecting a coupling agent suitable for the material of the substrate, the material of the functional layer, and the material of the binding member, a covalent bond can be formed, and thus the effect of enhancing the binding force can be achieved. Of course, a coupling agent can also be placed between the flexible member 101 and the first substrate member 106.

[0078] Furthermore, the binding member used in the liquid ejection substrate according to the present disclosure can be made of the same material, but the adhesion force applied between the second binding member 105 and the first binding member 104 is preferably higher than the adhesion force applied between the second binding member 105 and the flexible member 101. Thereby, by bringing the second binding member 105 into contact with the first binding member 104 in the first section 201, the binding strength can be improved. Furthermore, in the configuration in which the adhesion force applied between the second binding member 105 and the first binding member 104 is preferably higher than the adhesion force applied between the second binding member 105 and the flexible member 101, the binding members can be made of different materials. In this way, the first binding member 104 and the second binding member 105 can be functionally separated. For example, by forming the first binding member 104 using an elastic material so as to absorb the vibration of the flexible member 101 and by forming the second binding member 105 using a material that applies a high adhesion force, the peeling caused by vibration can be suppressed while improving the reliability.

[0079] Method of manufacturing a liquid ejection substrate

[0080] Figures 5A-5C and Figures 6A-6C is a schematic diagram for explaining an example of the manufacturing process of the first liquid ejection substrate 100 according to the present embodiment.

[0081] Figure 5A is a schematic diagram illustrating the first step. In the support substrate 102, the recessed portion 112 and the third passage 115 have been formed. At this point in time, the third passage 115 is a through-hole 404 that penetrates the support substrate 102. As Figure 5AAs shown, in the first step, an uncured first bonding member 104 is applied to the support substrate 102, specifically to the surface where the recessed portion 112 is provided, but in the area without the recessed portion 112 and the through-hole 404. The technique used to apply the uncured first bonding member 104 is a technique typically used for resin components. To apply the first bonding member 104 to the entire surface of the support substrate 102, methods such as spin coating or spraying can be used. To apply the first bonding member 104 to a portion of the support substrate 102, for example, the first bonding member 104 can be applied by screen printing or transferring a dry film of the bonding member using a dispenser.

[0082] like Figure 5B As shown, a flexible member 101 without an opening corresponding to the first opening 116 is laid. This will be described later. Figure 6A At a certain point in time, an opening 406 will be formed in this part to become the first opening 116. As an example of a technique for forming the opening 406, dry etching using a mask material (not shown) can be used. When a photosensitive resin is used for the flexible member 101, a patterning technique by exposure can be used.

[0083] Figure 5B This is a schematic diagram illustrating the second step. (For example...) Figure 5B As shown, in the second step, the sheet-like flexible member 101 is placed on the first bonding member 104, and the support substrate 102 and the flexible member 101 are bonded to the first bonding member 104. During the bonding process of the support substrate 102 and the flexible member 101, an appropriate temperature, pressure, or time is selected based on the structure or thickness of the support substrate 102 or the material of the first bonding member 104. Since the first bonding member 104 may be affected by atmospheric oxygen, etc., it is preferable to bond the support substrate 102 and the flexible member 101 under negative pressure.

[0084] Figure 5C This is a schematic diagram illustrating the third step. (For example...) Figure 5C As shown, in the third step, the first bonding member 104 is cured. In the fourth step, the first bonding member 104 is cured by using a chemical reaction, thereby achieving an effect of enhanced bonding strength. The appropriate temperature, time, atmosphere, etc., for curing the first bonding member 104 can depend on the material of the first bonding member 104. As an example of a technique for regulating the flow of the first bonding member 104, there is a technique for rapidly heating the first support substrate 102 by irradiating it with electromagnetic waves or the like. As another example, there is a technique for curing the first bonding member 104 by irradiating it through the first support substrate 102 with electromagnetic waves or the like.

[0085] Figure 6A is a schematic view showing the fourth step. As shown in Figure 6A the fourth step, an opening 406 is formed in the flexible member 101. As an example of a technique for forming the opening 406, a technique of forming an opening by dry etching using a mask material (not shown) can be used. When a photosensitive resin is used for the flexible member 101, a technique of patterning by exposure can be used.

[0086] Figure 6B is a schematic view showing the fifth step. As shown in Figure 6B the fifth step, the first substrate member 106 having the second bonding member 105 applied to the bottom surface along the inner periphery is bonded to the flexible member 101. By applying the second bonding member 105 to the bottom surface of the first substrate member 106, the second bonding member 105 can be inhibited from spreading onto the flexible member 101 that is stretched across the recessed portion 112. Thereby, the spread second bonding member 105 can be prevented from inhibiting elastic deformation of the flexible member 101. In the fifth step, an appropriate temperature, pressure, time, and the like are selected in a manner suitable for the structure or thickness of the first substrate member 106 or the material of the second bonding member 105. Since the second bonding member 105 can be affected by oxygen and the like in the atmosphere, bonding is preferably performed under a negative pressure. During the bonding process, the uncured second bonding member 105 is pressed and spreads out from the first segment 201. Further, as shown on the left side, Figure 6B a portion of the uncured second bonding member 105 flows and comes into contact with the first bonding member 104 due to the low viscosity of the uncured second bonding member 105.

[0087] Figure 6C is a schematic view showing the sixth step. As shown in Figure 6C the sixth step, the second bonding member 105 is cured. In the sixth step, the second bonding member 105 is cured by using a chemical reaction, and thus an effect of enhancing the bonding force can be achieved. In order to cure the second bonding member 105, an appropriate temperature, time, atmosphere, and the like can be selected based on the material of the second bonding member 105. As an example of a technique for adjusting the flow of the second bonding member 105, there is a technique of rapidly heating the first substrate member 106 by irradiating the first substrate member 106 with an electromagnetic wave or the like. As another example, there is a technique for curing the second bonding member 105 by irradiating the second bonding member 105 with an electromagnetic wave or the like through the first substrate member 106.

[0088] The method for providing the flexible member 101 is not limited to the above-described example. Another possible technique includes preparing another support substrate 102 on which the flexible member 101 is formed in advance, bonding the another support substrate 102 to the support substrate 102 via a bonding member, and then removing the another support substrate 102.

[0089] Examples

[0090] Now, an example of the manufacturing method shown in Figures 5A-5C and Figures 6A-6C will be described. The following description will be made with reference to Figures 5A-5C and Figures 6A-6C , but the following description is only for illustrating an example of the technical preference. In particular, the technical scope of the present disclosure is not limited by the following example.

[0091] As shown in Figure 5A , a silicon substrate of 625 μm was prepared as the support substrate 102. The positive photoresist on both sides of the silicon substrate was exposed and developed. Then, the substrate was dry-etched to form a recessed portion 112 having a depth of 300 μm and a width of 300 μm and a first channel 113 having a width of 200 μm. Then, the uncured first bonding member 104 was formed as a dry film having a thickness of 2 μm and transferred onto the support substrate 102. In this example, a thermosetting resin was applied as the first bonding member 104.

[0092] Then, as shown in Figure 5B , the support substrate 102 and the flexible member 101 were bonded to each other via the uncured first bonding member 104. As an example, a polyimide film having a thickness of 3 μm was used as the flexible member 101. The flexible member 101 was formed by a lamination method while applying pressure. The lamination temperature was set to a temperature at which the uncured first bonding member 104 would not cure.

[0093] Then, as shown in Figure 5C , the uncured first bonding member 104 was cured. In this example, the first bonding member 104 was subjected to heat treatment at 250°C using a nitrogen atmosphere furnace.

[0094] Then, as shown in Figure 6A , a mask pattern (not shown) was formed on the flexible member 101, and using a publicly known reactive dry etching method, an opening 406 was formed using a mixed gas of CF4 gas (tetrafluoromethane gas) and oxygen.

[0095] Then, as shown in Figure 6B , the first substrate member 106 on which the uncured second bonding member 105 was applied was bonded to the flexible member 101. As an example, a silicone substrate was used as the first substrate member 106. In the above-described manner, as shown in Figure 4As shown, a first substrate member 106 and a second substrate member 110 are formed. At this time, a second bonding member 105 with a thickness of 40 μm is formed by dispensing thermosetting epoxy resin, which is a material whose adhesive force to the first bonding member 104 is higher than its adhesive force to the flexible member 101. Due to the bonding between the first substrate member 106 and the flexible member 101, in the first segment 201, the uncured second bonding member 105 diffuses out from the top surface of the flexible member 101 along the -X direction and from the first segment 201, continuously attaching to the outer peripheral surface of the flexible member 101 in the -X direction, a portion of the outer peripheral surface of the first bonding member 104 in the -X direction, and also attaching to the top surface of the flexible member 101.

[0096] Then, as Figure 6C As shown, the second bonding member 105 is cured. In this example, a nitrogen atmosphere furnace is used to subject the second bonding member 105 to heat treatment at 160°C.

[0097] Using a liquid jetting head 710 provided with a first liquid jetting substrate 100 manufactured as described above, a jetting operation is performed within a predetermined time period. During this predetermined time period, the jetting operation proceeds stably. After the jetting operation is completed, no peeling is observed in the support substrate 102, flexible member 101, and first substrate member 106 of the first liquid jetting substrate 100.

[0098] Overview

[0099] As described above, for the first liquid jet substrate 100 according to this embodiment, in the first region 201 where the flexible member 101 is held between substrates, a second bonding member 105, which has a greater adhesion force to the first bonding member 104 than to the flexible member 101, is continuously attached to the top surface of the flexible member 101, the outer peripheral surface of the flexible member 101 in the -X direction, and a portion of the outer peripheral surface of the first bonding member 104 in the -X direction. With this configuration, the bonding members can be allowed to contact each other. Therefore, even if the bonding member peels off from the flexible member 101 in the first segment 201, substrate peeling can be suppressed because the bonding members are bonded to each other. Furthermore, since the flexible member 101 and the second bonding member 105 are bonded over a larger area, the bonding strength can be improved compared to conventional corresponding portions. Therefore, in the case of the liquid jet substrate 100 according to this disclosure, even when the adhesion between the flexible member 101 and the bonding member is low and there is a risk of substrate peeling, the substrates can be firmly fixed to each other.

[0100] Second Embodiment

[0101] A second embodiment of the present disclosure will now be described with reference to the accompanying drawings. In the following description, configurations that are the same as or corresponding to the first embodiment will be referred to using the same reference numerals or names and their descriptions will be omitted as appropriate, while attention will be paid to the description of differences. The difference between this embodiment and the first embodiment is that, in the first segment 201, the top surface of the second connecting member 105 contacts the top surface of the first connecting member 104.

[0102] Figure 7 This is a schematic front cross-sectional view of the second liquid jetting substrate 300 according to this embodiment. Figure 7 As shown, the end of the flexible member 101 in the first segment 201 is located at a position offset to one side of the recessed portion 112 along the +X direction. Therefore, in the first segment 201, the second connecting member 105 is continuously attached to the top surface of the flexible member 101, the side surface of the flexible member 101 in the -X direction, and the top surface of the first connecting member 104.

[0103] and Figure 4 Compared to the first embodiment shown, this configuration increases the contact area between the second connecting member 105 and the first connecting member 104. In other words, in the case of the second liquid jetting substrate 300 according to this embodiment, the substrates can be securely fixed to each other at the position where the flexible member 101 is held therebetween.

[0104] Third Embodiment

[0105] A third embodiment of this disclosure will now be described with reference to the accompanying drawings. In the following description, configurations identical or corresponding to those in the first and second embodiments will be referred to using the same reference numerals or names and their descriptions will be omitted where appropriate, while attention will be paid to the description of differences. This embodiment differs from the first embodiment in that the flexible member 101 does not have a second opening 501 in the first segment 201.

[0106] Figure 8A and Figure 8B This is a schematic cross-sectional front view showing the third liquid jetting substrate 500 according to this embodiment. Figure 8A As shown, the first segment 201 according to this embodiment is provided with one or more annular second openings 501. An example of a method for forming the second opening 501 on the flexible member 101 is dry etching. The location of the second opening 501 is not limited, as long as it is located within the first segment 201. In the first segment 201, the first bonding member 104 flows onto the inner peripheral surface of the second opening 501. With this configuration, the second opening 501 is allowed to accommodate additional first bonding members 104.

[0107] Figure 8B It is along Figure 8A A cross-sectional view taken by line Vb-Vb in the diagram. (Example)Figure 8B As shown, the flexible member 101 has a first opening 116 and a second opening 501 as openings. In a configuration where the first substrate members 106 of the supporting substrate 102 and the second channel substrate 103 are joined together, the first opening 116 allows the third channel 115 and the first channel 113 to communicate with each other.

[0108] In the first segment 201 according to this embodiment, the first bonding member 104 applied to the top surface of the support substrate 102 flows to the inner peripheral surface of each second opening 501 provided on the surface bonded to the support substrate 102. Therefore, the second bonding member 105 is continuously attached to the top surface of the flexible member 101 and the top surface of the first bonding member 104.

[0109] and Figure 4 Compared to the first embodiment shown, this configuration increases the contact area between the first connecting member 104 and the second connecting member 105. In the case of the third liquid jetting substrate 500 according to this embodiment, the substrates can be firmly fixed to each other at the position where the flexible member 101 is held therebetween.

[0110] First modification of the third embodiment

[0111] Figure 9 This is a schematic diagram showing the third liquid jetting substrate 500 according to the modification. (See attached diagram.) Figure 9 As shown, the modified flexible member 101 has a second opening 501 continuously disposed along the inner side of the first segment 201. That is, the modified second opening 501 is disposed along the first segment 201 to connect with the supporting substrate 102 (see [reference]). Figure 1 The opening extends from the combined surface.

[0112] With this configuration, the second connecting member 105 is connected to the first connecting member 104 at a ratio of Figure 8A The example in the text shows a larger area combination. Therefore, in the case of the liquid jet substrate in this modification, the substrates can be fixed to each other even more firmly at the position where the flexible member 101 holds them between the substrates.

[0113] Second modification of the third embodiment

[0114] Figure 10A and Figure 10B This is a schematic diagram showing the third liquid jetting substrate 500 according to the modification. (See attached diagram.) Figure 10A and Figure 10B As shown, the end of the flexible member 101 in the first segment 201 is located offset to one side towards the recessed portion 112 along the +X direction. The modified flexible member 101 also has one or more annular second openings 501 on the inner side of the first segment 201 along the +X direction.

[0115] With this configuration, while ensuring the area of ​​the flexible member 101 and the connecting member connected to each other through the annular opening, the connecting member and the first connecting member 104 are connected at a ratio... Figure 8A The example in the text shows a larger area combination. Therefore, in the case of the liquid jet substrate 100 according to this modification, the substrates can be fixed to each other even more firmly at the position where the flexible member 101 holds them between the substrates.

[0116] Third modification of the third embodiment

[0117] Figure 11A and Figure 11B This is a schematic diagram showing the third liquid jetting substrate 500 according to the modification. (See attached diagram.) Figure 11A As shown, the first segment 201 according to this embodiment is provided with one or more annular second openings 501. The position of the second opening 501 is not limited, as long as it is located in the first segment 201. In the first segment 201, the diffused portion of the first connecting member 104 that has passed through the second opening 501 extends on the top surface of the flexible member 101.

[0118] Figure 11B It is along Figure 11A A cross-sectional view taken by line Vb-Vb in the diagram. (Example) Figure 11B As shown, in the first segment 201 according to this embodiment, the first bonding member 104 applied to the top surface of the support substrate 102 passes through the second opening 501 provided on the surface bonded to the support substrate 102 and extends on the top surface of the flexible member 101.

[0119] Therefore, in the first segment 201, the first connecting member 104 is attached to the bottom surface of the flexible member 101, the inner peripheral surface of the second opening 501, and the top surface of the flexible member 101. That is, since the first connecting member 104, which has flowed into the second opening 501, extends on the top surface of the flexible member 101, the first connecting member 104 acts as an anchor to secure the flexible member 101. In this example, multiple second openings 501 are provided in the first segment 201 to enhance the anchoring effect of the first connecting member 104.

[0120] This configuration ensures a relatively large bonding area between the support substrate 102 and the flexible member 101. Therefore, compared to a conventional counterpart, the bonding strength between the support substrate 102 and the flexible member 101 in the first segment 201 can be improved. Furthermore, since the bonding area between the first bonding member 104 and the second bonding member 105 is increased, the substrates can be securely fixed to each other at the position where the flexible member 101 is held between the substrates.

[0121] Fourth embodiment

[0122] A fourth embodiment of this disclosure will now be described with reference to the accompanying drawings. In the following description, configurations identical or corresponding to those described above will be referred to using the same reference numerals or names, and their descriptions will be omitted where appropriate, while attention will be paid to descriptions of differences. This embodiment is intended to securely fasten substrates to each other without requiring any processing of the substrate.

[0123] Figures 12A-12C This is a schematic front cross-sectional view of the fourth liquid jetting substrate 1000 according to this embodiment. Figure 12A This is an enlarged view of the first segment 201 of the fourth liquid jet substrate 1000 according to this embodiment.

[0124] like Figure 12A As shown, in the first segment 201 according to this embodiment, the second bonding member 105 is continuously attached to the top surface of the flexible member 101 and the inner peripheral surface of the second opening 501. The first bonding member 104 is applied to the top surface of the support substrate 102. However, the first bonding member 104 is applied to the portion of the first bonding member 104 that is not attached to the inner peripheral surface of the second opening 501.

[0125] With this configuration, the second bonding member 105 on the top surface of the flexible member 101 extends to the first bonding member 104 located below the bottom surface of the flexible member 101 (along the -Z direction). Therefore, in the first segment 201, the area where the second bonding member 105 and the first bonding member 104 are bonded to each other can be increased. That is, where the flexible member 101 is held between the substrates, the substrates can be firmly fixed to each other.

[0126] Furthermore, since the second opening 501 can accommodate an additional second connecting member 105, the amount of the second connecting member 105 diffusing into the second segment 202 can be adjusted. This configuration also prevents the second connecting member 105 from attaching to the second segment 202 and suppresses the function of the second segment 202 as a damper.

[0127] First modification of the fourth embodiment

[0128] Figure 12B This is a schematic diagram showing the fourth liquid jetting substrate 1000 according to the modification. (See attached diagram.) Figure 12B As shown, in the first segment 201 according to this modification, the second bonding member 105 is continuously attached from the top surface of the flexible member 101 to the top surface of the support substrate 102 through the second opening 501. In this modification, the portion through which the second bonding member 105 passes is not provided with a layer of the first bonding member 104.

[0129] With this configuration, the area where the flexible member 101 is held between the substrates can be increased, thereby firmly fixing the substrates to each other.

[0130] Second modification of the fourth embodiment

[0131] Figure 12C This is a schematic diagram showing the fourth liquid jetting substrate 1000 according to the modification. (See attached diagram.) Figure 12C As shown, in the first segment 201 of this modification, the second connecting member 105 is continuously attached to the top surface of the flexible member 101, the inner peripheral surface of the second opening 501, and the supporting substrate 102. In this modification, the portion through which the second connecting member 105 passes is not provided with a layer of the first connecting member 104.

[0132] With this configuration, the second connecting member 105 can fix the flexible member 101 like an anchor. Therefore, in the case of the fourth liquid jetting substrate 1000 according to this modification, it is possible to... Figure 12A and Figure 12B The example better prevents the peeling of the flexible component 101.

[0133] Fifth embodiment

[0134] A fifth embodiment of this disclosure will now be described with reference to the accompanying drawings. In the following description, configurations identical or corresponding to those described above will be referred to using the same reference numerals or names, and their descriptions will be omitted where appropriate, while attention will be paid to descriptions of differences. This embodiment aims to securely fasten substrates to each other while suppressing diffusion through substrate processing.

[0135] Figure 13A and Figure 13B This is a schematic front cross-sectional view of the fifth liquid jetting substrate 1100 according to this embodiment. Figure 13A This is a schematic enlarged view of the first segment 201 according to this embodiment. For example... Figure 13A As shown, the support substrate 102 in this embodiment has a first groove 1101, and the first connecting member 104 is attached to the first groove. Multiple first grooves 1101 can be provided.

[0136] With this configuration, the diffusion of the first bonding member 104 into the second segment 202 can be suppressed when the first bonding member 104 is applied. That is, the substrates can be firmly fixed to each other while preventing the diffusion of the first bonding member 104 from hindering the function of the damper.

[0137] Modifications to the fifth embodiment

[0138] Figure 13B This is a diagram showing the fifth liquid jetting substrate 1100 according to this modification. (See diagram)Figure 13B As shown, the flexible member 101 in this modification is provided with a second opening 501. The support substrate 102 in this modification has a second groove 1102, to which the second connecting member 105 is attached. Multiple second grooves 1102 may be provided.

[0139] With this configuration, in the first segment 201 according to the modification, by applying the second connecting member 105 to the top surface of the flexible member 101, the second connecting member 105 on the top surface of the flexible member 101 extends into the second groove 1102. With this configuration, the second connecting member 105 can fix the flexible member 101 like an anchor. Therefore, in the case of the fifth liquid jet substrate 1100 according to the present modification, the substrates can be firmly fixed to each other while preventing the diffusion of the second connecting member 105 from hindering the function of the damper.

[0140] As described above, according to embodiments of the present disclosure, the substrates can be securely fixed to each other at the location where the flexible member 101 is held between the substrates.

[0141] Other embodiments

[0142] As described above, the first to fifth embodiments show a configuration in which the flexible member 101 is disposed on a first surface 401, which corresponds to Figure 14 The bottom surface of the channel substrate 103 in the -Z direction. However, the surfaces on which the flexible member 101 and the support substrate 102 are disposed are not limited to the first surface 401. For example, as according to Figure 15A A schematic front cross-sectional view of the sixth liquid jetting substrate 2100 of this embodiment shows that the flexible member 101 and the support substrate 102 can be disposed on the second surface 402, which corresponds to Figure 14 The top surface of the channel substrate 103 shown in the +Z direction.

[0143] In addition, such as Figure 15B A schematic front cross-sectional view of the seventh liquid jetting substrate 3100 in this embodiment is shown, wherein the flexible member 101 and the support substrate 102 can be disposed with respect to... Figure 14 The diaphragm of the channel substrate 103 shown is located on the third surface 403 of the same layer. In this case, the top surface of the channel substrate 103 has a damping segment provided with a flexible member 101, and a driving segment provided with a receiving space 107 and a diaphragm 108.

[0144] The above embodiments can be combined appropriately.

[0145] In the above embodiments, the support substrate 102, the first substrate member 106, and the second substrate member 110 are provided as independent components, but these components do not necessarily have to be independent components. For example, the support substrate 102, the first substrate member 106, and the second substrate member 110 may be contained in a single substrate.

[0146] In the above embodiments, dry etching has been mentioned as an example of a method for forming the first opening 116 and the second opening 501 in the flexible member 101. Another possible example includes patterning the first opening 116 and the second opening 501 by exposure when the flexible member 101 contains a photosensitive resin.

[0147] exist Figure 6B In the fifth step, the first substrate member 106 with the second bonding member 105 applied to its bottom surface is bonded to the flexible member 101. In another example of the fifth step, the first substrate member 106 without the second bonding member 105 applied to its bottom surface can be bonded to the top surface of the flexible member 101 with the second bonding member 105 applied.

[0148] In the above embodiments, a piezoelectric system using a piezoelectric element has been described as an example of a drive unit for applying pressure to ink in a pressure chamber. Other examples of drive units for applying pressure to ink in a pressure chamber include methods using electrostatic force and methods using heating elements.

[0149] According to this disclosure, a technique can be provided for suppressing substrate peeling when a flexible member serving as a damper is provided in a liquid jet substrate.

[0150] While this disclosure has been described with reference to embodiments, it should be understood that this disclosure is not limited to the disclosed embodiments. The scope of the following claims shall be given the broadest interpretation in order to cover all such modifications and equivalent structures and functions.

Claims

1. A liquid jetting substrate, the liquid jetting substrate comprising a laminate consisting of a support substrate, a first bonding member, a flexible member having a sheet-like shape, a second bonding member, and a channel substrate having channels for guiding liquid to a nozzle, wherein... The support substrate has a recessed portion at a position corresponding to at least a portion of the channel disposed on the channel substrate, and the flexible member is disposed between the channel and the recessed portion. The first connecting member and the second connecting member are in partial contact with each other.

2. The liquid jetting substrate according to claim 1, wherein, The adhesive force between the second bonding member and the first bonding member is higher than the adhesive force between the second bonding member and the flexible member.

3. The liquid jetting substrate according to claim 1 or 2, wherein, The second bonding member disposed on the top surface of the flexible member is in continuous contact with the end of the flexible member and the end of the first bonding member on the outer peripheral side surface of the liquid jet substrate.

4. The liquid jetting substrate according to claim 1 or 2, wherein, The direction in which the first bonding member, the flexible member, and the second bonding member are laminated is established as a first direction, and the direction orthogonal to the first direction is established as a second direction, wherein at least a portion of the end of the flexible member in the second direction is located between the outer peripheral surface of the liquid jet substrate and the end of the recessed portion.

5. The liquid jetting substrate according to claim 1 or 2, wherein... The flexible member has an opening in the segment that engages with the second connecting member, and At least one of the first connecting member and the second connecting member is disposed within the opening such that the first connecting member and the second connecting member are in contact with each other within the opening.

6. The liquid jetting substrate according to claim 5, wherein, A plurality of openings are provided along the bonding surface between the flexible member and the supporting substrate.

7. The liquid jetting substrate according to claim 5, wherein, The opening extends along the bonding surface between the flexible member and the support substrate.

8. The liquid jetting substrate according to claim 5, wherein A plurality of openings are provided along the bonding surface that bonds with the support substrate, and The direction in which the first bonding member, the flexible member, and the second bonding member are laminated is established as a first direction, and the direction orthogonal to the first direction is established as a second direction, wherein at least a portion of the end of the flexible member in the second direction is located between the outer peripheral surface of the liquid jet substrate and the end of the recessed portion.

9. The liquid jetting substrate according to claim 5, wherein, The first connecting member is in continuous contact with the bottom and top surfaces of the flexible member and the inner peripheral surface of the opening.

10. The liquid jetting substrate according to claim 1 or 2, wherein The flexible member has an opening in the segment that engages with the second connecting member, and The first connecting member has a groove in a segment corresponding to the opening, and the second connecting member is arranged in the groove of the first connecting member.

11. The liquid jetting substrate according to claim 1 or 2, wherein, The support substrate has a groove in the segment that engages with the first connecting member, and the first connecting member is arranged in the groove of the first connecting member.

12. The liquid jetting substrate according to claim 1 or 2, wherein The flexible member has an opening in the segment that engages with the second connecting member. The first connecting member has a groove extending to the supporting substrate in the area corresponding to the opening, and The second connecting member contacts the supporting substrate through the opening of the flexible member and the groove of the first connecting member.

13. The liquid jetting substrate according to claim 1 or 2, wherein, The first connecting member and the second connecting member are made of the same material.

14. The liquid jetting substrate according to claim 1 or 2, wherein, The first bonding member is a member with greater flexibility than the second bonding member, and the second bonding member is a member with greater adhesive strength to the flexible member than to the first bonding member.

15. The liquid jetting substrate according to claim 1 or 2, wherein, The channel substrate includes a plurality of nozzles, a plurality of pressure chambers corresponding to the plurality of nozzles, a second channel configured to guide the liquid through the channel to the plurality of pressure chambers, and a plurality of drive units disposed in the plurality of pressure chambers and configured to eject ink by applying pressure to the liquid.

16. The liquid jetting substrate according to claim 1 or 2, wherein, The liquid jetting substrate comprises a laminate consisting of the support substrate, the first bonding member, the flexible member, the second bonding member, and the channel substrate, laminated in the order listed herein.

17. The liquid jetting substrate according to claim 1 or 2, wherein The liquid jetting substrate comprises a laminated member consisting of the channel substrate, the second bonding member, the flexible member, the first bonding member, and the support substrate, laminated in the order listed herein, and The nozzle is disposed on the top surface of the channel substrate in a segment where the second connecting member is not arranged.

18. The liquid jetting substrate according to claim 1 or 2, wherein In the liquid jetting substrate, the channel substrate includes: A damper segment, the damper segment comprising a laminate composed of the first connecting member, the flexible member and the second connecting member; and a drive segment, the drive segment being provided with a drive unit configured to eject the liquid by applying pressure to the liquid, and The support substrate is laminated on the top surfaces of the damper segment and the drive segment.

19. A liquid injection head, comprising: A liquid jetting substrate comprising a laminate consisting of a support substrate, a first bonding member, a flexible member having a sheet-like shape, a second bonding member, and a channel substrate having a channel for guiding liquid to a nozzle, wherein the support substrate has a recessed portion at a position corresponding to at least a portion of the channel disposed on the channel substrate, and the flexible member is disposed between the channel and the recessed portion, and the first bonding member and the second bonding member are in partial contact with each other; A housing configured to store liquid to be supplied to the channel; and An electrical connector configured to send power and control signals to the liquid jetting substrate.

20. A method for manufacturing a liquid jet substrate, the method comprising: A through hole is formed in the support substrate, and a recessed portion is formed at a position different from the through hole; The first connecting member is placed on the surface of the support substrate where the recessed portion is provided, but in the area where the through hole and the recessed portion are not provided; A flexible component with a sheet-like shape is placed on the top surface of the first connecting component; An opening is formed in the flexible member at a position corresponding to the through hole in the support substrate; as well as The second bonding member is placed on the surface of the flexible member opposite to the surface of the support substrate via the first bonding member, and the second bonding member is brought into partial contact with the first bonding member.

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