Pressure-sensitive material, preparation method of pressure-sensitive material and preparation method of pressure-sensitive film

Abstract

The invention discloses a pressure-sensitive material, a preparation method of the pressure-sensitive material and a preparation method of a pressure-sensitive film, and the preparation method of the pressure-sensitive material comprises the following steps: mixing dimethylformamide and polyimide to obtain resin, and mixing conductive ink, glass fibers and the resin to obtain the pressure-sensitive material. The resin is prepared from the following components in parts by mass: 25 to 55 parts of dimethylformamide and 55 to 85 parts of polyimide. The pressure-sensitive material comprises the following components in parts by mass: 100-200 parts of resin and 200-600 parts of conductive ink, and the mass of the glass fiber is 5-20% of the total mass of the conductive ink and the resin. The pressure-sensitive material is improved based on the dimethylformamide, the polyimide and the glass fibers, so that the linearity and the measuring range of the pressure-sensitive material are improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of sensing, and particularly relates to a pressure-sensitive material, a preparation method of the pressure-sensitive material, and a preparation method of a pressure-sensitive film BACKGROUND

[0002] In the fields of industrial automation, medical monitoring, intelligent wearing, etc., a pressure sensor as a core sensing element directly determines the performance of a terminal device in terms of detection accuracy and stability. The temperature drift characteristic, consistency, and pressure range adaptability of a pressure-sensitive film as a core sensitive unit of the pressure sensor are key indicators that affect the overall performance of the sensor. Existing pressure sensors have deficiencies in linearity and range, which seriously restrict the application accuracy and range of the pressure sensors in many fields.

[0003] Therefore, in view of the above technical problems, it is necessary to provide a pressure-sensitive material, a preparation method of the pressure-sensitive material, and a preparation method of a pressure-sensitive film. SUMMARY

[0004] The application aims to provide a pressure-sensitive material, a preparation method of the pressure-sensitive material, and a preparation method of a pressure-sensitive film, which can improve the linearity and range of the pressure-sensitive material.

[0005] To achieve the above-mentioned purpose, a technical solution provided by one specific embodiment of the application is as follows.

[0006] A preparation method of a pressure-sensitive material comprises the following steps.

[0007] Mixing dimethylformamide and polyimide to obtain a resin;

[0008] Mixing conductive ink, glass fiber, and the resin to obtain the pressure-sensitive material.

[0009] In one or more embodiments of the application, the resin comprises, in terms of mass fraction, 25-55 parts of dimethylformamide and 55-85 parts of polyimide.

[0010] In one or more embodiments of the application, the pressure-sensitive material comprises, in terms of mass fraction, 100-200 parts of the resin, 200-600 parts of conductive ink, and the mass of the glass fiber is 5%-20% of the total mass of the conductive ink and the resin.

[0011] In one or more embodiments of the application, mixing dimethylformamide and polyimide comprises the following steps.

[0012] The dimethylformamide is placed in a stirring tank, and the polyimide powder is added while stirring under the temperature condition of 25-35°C, the stirring time is 30-45 min, and the stirring speed of the stirring tank is 90-200 revolutions per minute.

[0013] The resin obtained after stirring is left to stand for 12-36 hours at room temperature of 25-35°C.

[0014] In one or more embodiments of the present application, the mixing of the conductive ink, the glass fiber and the resin comprises:

[0015] The conductive ink, the glass fiber and the resin are put into a stirring tank, and stirred for 30-45 minutes at a temperature of 25-35°C, and the stirring speed of the stirring tank is 90-200 revolutions per minute.

[0016] In one or more embodiments of the present application, the conductive ink is of the type E-Me Polymer CI-2015H; or,

[0017] The conductive ink comprises a conductive filler, a binder, a solvent and an auxiliary agent, the conductive filler comprises carbon powder and graphite, the binder comprises epoxy resin, phenolic resin and / or thermosetting acrylic resin, the solvent is an organic solvent, and the auxiliary agent comprises an antifoaming agent and / or a wetting dispersant.

[0018] In one or more embodiments of the present application, the conductive ink comprises the following raw material components in terms of mass fraction: amino resin 10-30 parts, phenolic resin 10-20 parts, graphite 10-30 parts, carbon powder 10-30 parts, ether solvent 20-40 parts, and ketone solvent 20-40 parts.

[0019] In one or more embodiments of the present application, the preparation method further comprises: before the mixing of the conductive ink, the glass fiber and the resin, the conductive ink is taken out from an environment of 0-5°C, and after thawing for 30-45 minutes, the conductive ink is stirred for 15 minutes at room temperature.

[0020] Another aspect of the present application provides a pressure-sensitive material obtained by the preparation method of the pressure-sensitive material.

[0021] Still another aspect of the present application provides a preparation method of a pressure-sensitive film, comprising:

[0022] The pressure-sensitive material is obtained by the preparation method of the pressure-sensitive material.

[0023] The pressure-sensitive material obtained after stirring is transferred to a substrate to obtain a pressure-sensitive material layer.

[0024] The substrate with the pressure-sensitive material layer transferred thereon is subjected to high-temperature curing, and after curing, the substrate is left to stand at room temperature for a set time to obtain a pressure-sensitive film.

[0025] In one or more embodiments of the present application, the temperature range of the high-temperature curing is 80-200°C, and the curing time is 30-50 minutes.

[0026] In one or more embodiments of the present application, the substrate has a thickness of 0.05-0.125 mm.

[0027] In one or more embodiments of the present application, the substrate comprises a polyethylene terephthalate film or a polyimide film.

[0028] In one or more embodiments of the present application, transferring the stirred pressure-sensitive material to a substrate to obtain a pressure-sensitive material layer comprises:

[0029] The stirred pressure-sensitive material is uniformly coated on a screen printing plate of a preset mesh number, and is transferred to the substrate by screen printing.

[0030] Compared with the prior art, the pressure-sensitive material, the preparation method of the pressure-sensitive material and the preparation method of the pressure-sensitive film of the present application, by mixing dimethylformamide and polyimide to obtain a high-strength resin, and mixing conductive ink, glass fiber and resin to obtain a pressure-sensitive material, the linearity and range of the pressure-sensitive material are improved. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings described below are only some embodiments described in the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0032] Figure 1 Flow chart of the preparation method of the pressure-sensitive film in an embodiment of the present application;

[0033] Figure 2 Pressure-voltage relationship graph of the repeatability test in an embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the person skilled in the art better understand the technical solutions in the present disclosure, the technical solutions in the embodiments of the present disclosure will be described clearly and completely below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only some of the embodiments of the present disclosure, not all. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative labor should be within the scope of protection of the present disclosure.

[0035] The linearity of a thin-film pressure sensor refers to the deviation between the actual output signal (such as voltage or resistance change) and the ideal linear output (theoretically, the pressure-output is proportional to a straight line) within the full range of measurement. The better the linearity, the more reliable the subsequent data processing (without complex correction) and the measurement accuracy.

[0036] The linearity of a thin-film pressure sensor is significantly different from that of traditional rigid pressure sensors (such as strain gauge or piezoelectric) due to its structural characteristics (such as flexible substrate, thin sensitive layer, and contact force). For a resistive thin-film sensor, the pressure-sensitive layer material determines the basic linearity. The contact resistance change or the change in conductive path density after the pressure-sensitive layer is pressed. In the low pressure segment, nonlinearity may occur due to incomplete contact (slow output growth), in the medium and high pressure segment, it gradually tends to be linear, and in the high pressure segment, it may again be nonlinear due to saturated contact.

[0037] In addition, the existing thin-film pressure sensor has a small range.

[0038] To solve the above technical problems, the present disclosure provides a preparation method of a pressure-sensitive material, specifically comprising:

[0039] Mixing dimethylformamide and polyimide to obtain a resin;

[0040] Mixing conductive ink, glass fiber and resin to obtain a pressure-sensitive material.

[0041] The pressure-sensitive material used in existing pressure sensors is usually only conductive ink, which is composed of conductive fillers such as carbon nanotubes, graphene, and conductive carbon black, and elastic substrates such as silicone rubber and polyurethane. The electrical and mechanical properties of such composite materials are strongly dependent on temperature changes: on the one hand, the resistivity of the conductive filler changes significantly with temperature (such as carbon nanotubes, whose resistivity fluctuates by 15-25% in the range of -20℃ to 60℃), resulting in a significant shift in the output signal of the thin film under the same pressure; on the other hand, the glass transition temperature of the elastic substrate is low (most silicone rubber substrates have a glass transition temperature below -50℃), which is prone to hardening in low-temperature environments and reduces the deformation capacity under pressure, while in high-temperature environments, it is prone to creep, further exacerbating signal drift.

[0042] The present disclosure obtains a high-strength resin based on dimethylformamide and polyimide, which improves the hardness of the conductive ink and further improves the linearity of the pressure-sensitive material.

[0043] Further, in an embodiment, the resin comprises, by mass fraction: dimethylformamide 25-55 parts, polyimide 55-85 parts.

[0044] In an embodiment, the pressure sensitive material comprises, by mass fraction: 100-200 parts of resin, 200-600 parts of conductive ink, and glass fiber with a mass of 5-20% of the total mass of the conductive ink and the resin.

[0045] The present disclosure improves the range of the pressure sensitive material by adding glass fiber into the pressure sensitive material.

[0046] In an embodiment, the dimethyl formamide and the polyimide are mixed, comprising:

[0047] The dimethyl formamide is placed in a stirring tank, and the polyimide powder is added while stirring at a temperature of 25-35℃, and the stirring time is 30-45 min, and the stirring speed of the stirring tank is 90-200 rpm.

[0048] The resin obtained after stirring is left to stand for 12-36 h at room temperature of 25-35℃.

[0049] In an embodiment, the conductive ink, the glass fiber and the resin are mixed, comprising:

[0050] The conductive ink, the glass fiber and the resin are placed in a stirring tank, and stirred at a temperature of 25-35℃ for 30-45 min, and the stirring speed of the stirring tank is 90-200 rpm.

[0051] In an embodiment, the conductive ink is of the type of Yimei Polymer CI-2015H; or,

[0052] In an embodiment, the conductive ink comprises conductive filler, binder, solvent and auxiliary agent, the conductive filler comprises carbon powder and graphite, the binder comprises epoxy resin, phenolic resin and thermosetting acrylic resin, the solvent is organic solvent, and the auxiliary agent comprises defoaming agent and wet dispersing agent.

[0053] In an embodiment, the conductive ink comprises, by mass fraction: 10-30 parts of amino resin, 10-20 parts of phenolic resin, 10-30 parts of graphite, 10-30 parts of carbon powder, 20-40 parts of ether solvent and 20-40 parts of ketone solvent.

[0054] The preparation method in an embodiment further comprises: before mixing the conductive ink, the glass fiber and the resin, the conductive ink is taken out from an environment of 0-5℃, thawed for 30-45 min and then stirred for 15 min at room temperature.

[0055] The present disclosure provides a pressure sensitive material obtained by the above preparation method, which is suitable for a resistive flexible pressure sensor. It can be understood that the resistance change mechanism of the resistive flexible pressure sensor mainly comprises quantum tunneling or change of interface contact resistance.

[0056] For example, quantum tunneling: when the conductive filler (i.e. carbon powder) content of the conductive ink is low and not in direct contact, electrons need to pass between the filler particles by tunneling effect, at which time the initial resistance is extremely high. When pressed, the particle spacing is further reduced, and the probability of electron tunneling penetration is greatly improved, resulting in a sharp drop in resistance. This mechanism has higher sensitivity and is suitable for small pressure detection. When the particle concentration in the conductive polymer composite material is lower than the percolation threshold, the resistance of the composite material decreases with the increase of the applied stress. The disadvantage of the tunneling effect is that the repeatability of the measurement is low, and since the matrix is usually composed of an elastomer, the test accuracy is poor when repeated measurements are made due to the inherent viscoelasticity of the elastomer.

[0057] The present disclosure improves the elastic modulus and breaking strength of the pressure-sensitive material by adding self-configured high-strength resin (including dimethylformamide and polyimide) in the conductive ink, thereby improving the maximum tolerable deformation of the pressure-sensitive film, and further improving the sensor range.

[0058] Further, the present disclosure also provides a preparation method of a pressure-sensitive film, comprising:

[0059] The pressure-sensitive material obtained by the preparation method of the pressure-sensitive material provided by the present disclosure;

[0060] The agitated pressure-sensitive material is transferred to a substrate to obtain a pressure-sensitive material layer;

[0061] The substrate with the transferred pressure-sensitive material layer is subjected to high-temperature curing, and is placed at room temperature for a set time after curing to obtain a pressure-sensitive film.

[0062] In an embodiment, the temperature range of high-temperature curing is 80-200°C, and the curing time is 30-50 min.

[0063] In an embodiment, the thickness of the substrate is 0.05-0.125 mm. The substrate includes a polyethylene terephthalate film or a polyimide film.

[0064] In an embodiment, the agitated pressure-sensitive material is transferred to a substrate to obtain a pressure-sensitive material layer, comprising: uniformly coating the agitated pressure-sensitive material on a screen printing plate of a preset mesh number using a doctor blade, and transferring it to the substrate by screen printing.

[0065] The present disclosure is further described below in conjunction with specific embodiments.

[0066] Example 1:

[0067] In conjunction with Figure 1 the present embodiment provides a preparation method of a pressure-sensitive film, specifically comprising:

[0068] S1, mixing dimethylformamide and polyimide to obtain a resin.

[0069] Specifically, in this embodiment, dimethylformamide is first put into the stirring tank, and polyimide powder is added while stirring at a temperature of 25-35°C. The stirring time is 30 min, and the stirring speed of the stirring tank is 90-200 rpm.

[0070] The resin obtained after stirring is left to stand for 24 h at room temperature of 25°C.

[0071] Further, in this embodiment, the resin includes, in terms of mass parts, dimethylformamide 25 parts and polyimide 55 parts.

[0072] It should be noted that the resin obtained in this embodiment is a high-strength resin.

[0073] S2, the conductive ink, the resin, and glass fibers with a mass of 11% of the total mass of the conductive ink and the resin are mixed to obtain a pressure-sensitive material.

[0074] Specifically, 400 g of conductive ink, 55 g of glass fibers, and 100 g of resin are put into a stirring tank, stirred for 30 min at a temperature of 25°C, and the stirring speed of the stirring tank is 90-200 rpm.

[0075] It can be understood that the conductive ink in this embodiment needs to be stored in a low-temperature environment (0-5°C), so before step S2 is performed, the conductive ink needs to be taken out of the low-temperature environment (0-5°C), thawed for 30 min, and then stirred at room temperature for 15 min.

[0076] Further, the model of the conductive ink in this embodiment is E-Me Polymer CI-2015H.

[0077] The conductive ink includes conductive fillers (including carbon powder and graphite), binders (such as synthetic resins such as epoxy resin, phenolic resin, thermosetting acrylic resin, etc.), solvents (such as organic solvents such as toluene, isopropyl alcohol, acetone, etc.), and auxiliaries (such as defoaming agents, wetting dispersants).

[0078] It can be understood that the conductive ink is well known in the prior art, and therefore will not be described in detail here. Any known or unknown conductive ink can be used without limitation.

[0079] For example, in an alternative embodiment, the conductive ink includes, in terms of mass parts, the following raw material components: amino resin 10-30 parts, phenolic resin 10-20 parts, graphite 10-30 parts, carbon powder 10-30 parts, ether solvent 20-40 parts, and ketone solvent 20-40 parts.

[0080] S3, the pressure-sensitive material after stirring is transferred to a substrate to obtain a pressure-sensitive material layer.

[0081] Specifically, in this embodiment, the stirred pressure-sensitive material is evenly coated onto a 300-mesh screen printing plate using a scraper, and then transferred onto a 0.125mm thick polyethylene terephthalate (PET) film using screen printing.

[0082] S4, the substrate with the pressure-sensitive material layer transferred is cured at high temperature, and then placed at room temperature for a set time after curing to obtain a pressure-sensitive film.

[0083] Table 1

[0084]

[0085] Combination Figure 2 As shown in Table 1, this embodiment performs repeatability tests on the pressure-sensitive film prepared from the pressure-sensitive material obtained in the above steps. Three tests were conducted at pressures of 0.2, 0.5, 1, 2, 3, 4, 5, and 6 MPa respectively, and the change in voltage (adc) was calculated using the measured voltage values. The change in voltage characterizes the repeatability of the pressure-sensitive film (the smaller the deviation, the better the repeatability). The data in Table 1 and... Figure 2 As can be seen from the overlap of the curves shown, the repeatability of the pressure-sensitive film in this embodiment is within 10%, especially in the large pressure range (greater than 4MPa), the repeatability of the pressure-sensitive film is excellent.

[0086] Furthermore, experiments show that the pressure-sensitive film obtained based on the pressure-sensitive material obtained in this embodiment has the following characteristics: maximum range of 7~10MPa, linearity of 0.9651, and maximum temperature drift of 13.26%.

[0087] Comparative Example 1:

[0088] The difference between this comparative example and Example 1 is that:

[0089] Place 400g of conductive ink and 100g of resin into a mixing tank and stir for 30 minutes at 25℃. The stirring speed of the tank is 90~200 rpm.

[0090] Experiments show that the pressure-sensitive film obtained based on the pressure-sensitive material in this comparative example has the following characteristics: maximum pressure range of 4 MPa, linearity of 0.8557, and maximum temperature drift of 18.51%.

[0091] Comparative Example 2:

[0092] The difference between this comparative example and Example 1 is that 300g of conductive ink and 100g of resin were placed in a mixing tank, and the mass of glass fiber was 2% of the total mass of conductive ink and resin.

[0093] Through experiments, it is known that the pressure-sensitive film obtained based on the pressure-sensitive material of the comparative example has a maximum range of 2 MPa and a linearity of 0.8909.

[0094] The linearity of the pressure-sensitive film (usually referred to as the linear correlation coefficient R 2 ) is used to quantify the degree of fit between the actual output signal and the ideal linear relationship. The closer the value is to 1, the more stable the proportional relationship between pressure change and output signal (such as voltage, resistance) is, and there is no significant non-linear deviation. The pressure-sensitive film of Example 1 is significantly better than Comparative Example 1 and Comparative Example 2 in terms of linearity key performance indicators. The linearity deviation of the comparative examples is large, and only semi-quantitative measurement can be achieved.

[0095] Further, compared with Comparative Example 1, the temperature drift of Example 1 is reduced by 28.4%, indicating that the anti-interference ability of Example 1 to temperature change is stronger, and the measurement consistency at different temperature environments is better.

[0096] Example 2

[0097] The embodiment provides a preparation method of a pressure-sensitive film, specifically comprising:

[0098] S1, mixing dimethylformamide and polyimide to obtain a resin.

[0099] Specifically, in this embodiment, dimethylformamide is first placed in a stirring tank, and polyimide powder is added while stirring under the temperature condition of 25-35°C. The stirring time is 30 min, and the stirring speed of the stirring tank is 90-200 rpm.

[0100] Under the temperature condition of room temperature 25°C, the resin obtained after stirring is placed for 24 h.

[0101] Further, in this embodiment, the resin includes, in terms of mass fraction: dimethylformamide 30 parts, and polyimide 70 parts.

[0102] It should be noted that the resin obtained in this embodiment is a high-strength resin.

[0103] S2, mixing conductive ink, resin, and glass fibers with a mass of 15% of the total mass of the conductive ink and the resin to obtain a pressure-sensitive material.

[0104] Specifically, 600 g of conductive ink, 55 g of glass fiber, and 200 g of resin are placed in a stirring tank and stirred for 30 min under the temperature condition of 25°C. The stirring speed of the stirring tank is 90-200 rpm.

[0105] It can be understood that the conductive ink in the embodiment needs to be stored in a low-temperature environment (0-5°C), so before step S2 is performed, the conductive ink needs to be taken out from the low-temperature environment (0-5°C), thawed for 30 min, and then stirred at room temperature for 15 min.

[0106] Further, the model of the conductive ink in the embodiment is Yimei polymer CI-2015H.

[0107] The conductive ink includes a conductive filler (including carbon powder and graphite), a binder (for example, a synthetic resin such as an epoxy resin, a phenolic resin, a thermosetting acrylic resin, etc.), a solvent (for example, an organic solvent such as toluene, isopropyl alcohol, acetone, etc.), and an auxiliary agent (for example, an antifoaming agent, a wet dispersing agent).

[0108] It can be understood that the conductive ink is well known in the prior art, so it will not be described in detail here, and any known or unknown conductive ink can be used here without limitation.

[0109] S3, transferring the stirred pressure-sensitive material to the substrate by screen printing to obtain a pressure-sensitive material layer.

[0110] Specifically, the stirred pressure-sensitive material is uniformly coated on a 300-mesh screen printing plate using a doctor blade in the embodiment, and is transferred to a 0.1-mm-thick polyimide film by screen printing.

[0111] S4, high-temperature curing the substrate on which the pressure-sensitive material layer is transferred, and placing it at room temperature for a set time after curing to obtain a pressure-sensitive film.

[0112] The present application improves the linearity and range of the pressure-sensitive material by improving the pressure-sensitive material based on dimethylformamide, polyimide, and glass fibers.

[0113] It is apparent to those skilled in the art that the present disclosure is not limited to the details of the above-described exemplary embodiments, and the present disclosure can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present disclosure. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the present disclosure being defined by the appended claims rather than the above description, and it is intended to include all changes falling within the meaning and range of equivalents of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

[0114] Furthermore, it should be understood that although the specification is described in terms of embodiments, not every embodiment includes every feature or implementation described herein. The specification can include implicit combinations of explicitly mentioned features and / or implicit combinations of implicitly mentioned features. Such combinations are also expressly included within the scope of the specification and an embodiment.

Claims

1. A method for producing a pressure sensitive material, characterized by, include: Dimethylformamide and polyimide are mixed to obtain a resin; The conductive ink, glass fiber, and resin are mixed to obtain a pressure-sensitive material.

2. The method of claim 1, wherein the pressure sensitive material is prepared by the steps of: The resin, by weight, comprises: 25-55 parts dimethylformamide and 55-85 parts polyimide.

3. The method for preparing the pressure-sensitive material according to claim 1, characterized in that, The pressure-sensitive material comprises, by weight, 100-200 parts of resin, 200-600 parts of conductive ink, and the glass fiber comprises 5%-20% of the total weight of the conductive ink and resin.

4. The method of claim 1, wherein the pressure sensitive material is prepared by the steps of: The mixture of dimethylformamide and polyimide includes: Dimethylformamide is placed in a mixing tank, and polyimide powder is added while stirring at a temperature of 25~35℃ for 30~45 minutes. The stirring speed of the mixing tank is 90~200 rpm. The resin obtained after stirring was allowed to stand for 12 to 36 hours at a room temperature of 25 to 35°C.

5. The method of claim 1, wherein the pressure sensitive material is prepared by the steps of: Mixing conductive ink, glass fiber, and the resin includes: The conductive ink, glass fiber, and resin are placed in a mixing tank and stirred for 30 to 45 minutes at a temperature of 25 to 35°C. The stirring speed of the tank is 90 to 200 rpm.

6. The method of claim 1, wherein the pressure sensitive material is prepared by the steps of: The conductive ink is model number Yimei Polymer CI-2015H; or, The conductive ink includes conductive fillers, binders, solvents, and additives. The conductive fillers include toner and graphite. The binders include epoxy resin, phenolic resin, and / or thermosetting acrylic resin. The solvent is an organic solvent. The additives include defoamers and / or wetting and dispersing agents.

7. The method of claim 1, wherein the pressure sensitive material is prepared by a process comprising: The conductive ink comprises, by weight, the following raw material components: 10-30 parts amino resin, 10-20 parts phenolic resin, 10-30 parts graphite, 10-30 parts carbon powder, 20-40 parts ether solvent, and 20-40 parts ketone solvent.

8. The method of claim 1, wherein the pressure sensitive material is prepared by the steps of: The preparation method further includes: before mixing the conductive ink, glass fiber and the resin, taking the conductive ink out of the 0~5℃ environment, thawing it for 30~45 minutes and then stirring it at room temperature for 15 minutes.

9. A pressure sensitive material, characterized by It is obtained by the preparation method of the pressure-sensitive material according to any one of claims 1 to 8.

10. A method of making a pressure sensitive film, characterized by, include: A pressure-sensitive material is provided, wherein the pressure-sensitive material is obtained by the preparation method of the pressure-sensitive material according to any one of claims 1 to 8; The stirred pressure-sensitive material is transferred onto a substrate to obtain a pressure-sensitive material layer; The substrate with the pressure-sensitive material layer transferred on it is cured at high temperature, and then placed at room temperature for a set time after curing to obtain a pressure-sensitive film.

11. The method of claim 10, wherein the pressure sensitive film is prepared by the steps of: The high-temperature curing temperature range is 80~200℃, and the curing time is 30~50min.

12. The method of claim 10, wherein the pressure sensitive film is prepared by the steps of: The thickness of the substrate is 0.05~0.125mm.

13. The method of claim 10, wherein the pressure sensitive film is prepared by the steps of: The substrate includes a polyethylene terephthalate film or a polyimide film.

14. The method of claim 10, wherein the pressure sensitive film is prepared by the steps of: The stirred pressure-sensitive material is transferred onto a substrate to obtain a pressure-sensitive material layer, including: The mixed pressure-sensitive material is evenly coated onto a screen printing plate with a preset mesh size using a squeegee, and then transferred to the substrate using screen printing.

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