Pretreatment of substrates for hot dip plating

Abstract

A hot dip system includes a substrate path including one or more rollers configured to move a substrate along the substrate path between a first end and a second end, a pre-coating section, a pre-heating section, and a hot dip section, the pre-coating section is arranged relative to the substrate path and is configured to apply a first coating to the substrate, and the pre-heating section is arranged relative to the substrate path and is configured to heat the substrate and the first coating, the hot dip section is disposed relative to the substrate path and is configured to apply a second coating to the substrate.

Description

TECHNICAL FIELD

[0001] The information provided in this section is for the purpose of generally presenting the context of the disclosure. The work of the presently named inventors, to the extent the described is not common heritage, is not to be taken as prior art to the present disclosure, either explicitly or by implication.

[0002] The present disclosure relates generally to a hot dip coating system, and more specifically, to a system for pre-treating a substrate prior to entering a molten bath. BACKGROUND

[0003] Hot dip coating can involve applying a molten coating to a surface of a substrate in a continuous process. The substrate can pass through a bath of molten material as a continuous ribbon. In the molten bath, the substrate reacts with the molten material to bond the coating to the substrate. In some examples, the molten material adheres to the surface of the substrate, and in other examples, the molten material is connected to the substrate by embedding into at least a portion of the substrate.

[0004] Depending on the material of the substrate and the material of the molten bath, quality issues can arise during the hot dip coating process. For example, some substrate materials are good thermal conductors (e.g., copper), which can cause undesirable localized solidification of the molten material (e.g., lithium) on the surface of the substrate. The shortcomings of existing hot dip processes will be addressed by one or more principles of the present disclosure. SUMMARY

[0005] In one configuration, a hot dip coating system is provided that includes a substrate path including one or more rollers configured to move a substrate along the substrate path between a first end and a second end, a pre-coat section arranged relative to the substrate path and configured to apply a first coating to the substrate, a pre-heat section arranged relative to the substrate path and configured to heat the substrate and the first coating, and a hot dip coating section arranged relative to the substrate path and configured to apply a second coating to the substrate.

[0006] The hot dip coating system can include one or more of the following optional aspects. For example, the hot dip coating system can further include a masking section preceding the pre-coating section relative to the substrate path. The masking section can be configured to apply a mask to a portion of the substrate. The hot dip coating system can further include one or more quality assessment sections arranged relative to the substrate path. According to one aspect, the one or more quality assessment sections include a first quality section directly preceding the masking section and a second quality section arranged directly after the pre-coating section. According to another aspect, the hot dip coating system can further include a trimming section arranged relative to the substrate path and configured to remove the mask and trim off untreated portions of the substrate.

[0007] According to at least one aspect, the substrate includes copper, the first coating layer includes a zinc oxide material, and the second coating layer includes a lithium-based material.

[0008] According to another aspect, the pre-heating section includes one or more heaters arranged relative to a first surface of the substrate and relative to a second surface of the substrate. The one or more heaters can be configured to emit heat at a temperature between 180 °C and 250 °C. According to one example, a rate of heating of the substrate and the first coating layer can be adjusted based on a distance between the one or more heaters and the substrate and an angle of the one or more heaters relative to the substrate. According to another example, the one or more heaters can include an induction heater or a vertical cavity surface emitting laser (VCSEL) heater.

[0009] In another configuration, a method of manufacturing a current collector for a vehicle battery is provided. The method includes providing a substrate including a first surface, a second surface opposite the first surface, a first side, and a second side laterally spaced apart from the first side, applying a mask to the first surface and the second surface and a portion of the first side and the second side of the substrate, applying a first coating layer to the first surface and the second surface of the substrate, pre-heating the substrate and the first coating layer with one or more heaters arranged adjacent to the substrate, immersing the substrate in a molten bath of a second coating layer such that the second coating layer can adhere to the substrate, removing the mask, and trimming the substrate at the first side and the second side.

[0010] The method can include one or more of the following optional aspects. For example, providing the substrate can include providing a substrate including copper.

[0011] According to one aspect, the method of manufacturing the current collector further includes applying the first coating layer as a cold spray. The method of manufacturing the current collector can further include applying the first coating layer including a zinc oxide material.

[0012] According to another aspect, pre-heating the substrate and the first coating layer further includes clamping the substrate between the one or more heaters.

[0013] According to at least one example, preheating the substrate and the first coating further comprises arranging one or more heaters relative to the first surface or the second surface of the substrate.

[0014] According to another example, preheating the substrate and the first coating further comprises arranging one or more heaters relative to the first side or the second side of the substrate.

[0015] According to at least one aspect, the method of manufacturing a current collector further comprises providing a second coating comprising a lithium material.

[0016] According to another aspect, the method of manufacturing a current collector further comprises evaluating a quality of the substrate and the first coating.

[0017] According to at least one example, trimming the substrate at the first side and the second side further comprises providing a laser for removing untreated portions of the substrate. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings described herein are for illustrative purposes only of selected configurations and are not intended to limit the scope of the present disclosure.

[0019] Figure 1 is a schematic view of a hot dip coating system according to the principles of the present disclosure;

[0020] Figure 2 is a substrate with a mask on a portion of the substrate Figure 1 is a cross-sectional view of the substrate of

[0021] Figure 3 is a close-up view of a pre-coating section of the hot dip coating system of Figure 1

[0022] Figure 4 is a cross-sectional view of the substrate of Figure 1

[0023] Figure 5 is a top view of the substrate of Figure 4

[0024] Figure 6 is a close-up view of a pre-heating section of the hot dip coating system of Figure 1

[0025] Figure 7 is a close-up cross-sectional view of the substrate comprising one or more partially solidified second coatings

[0026] Figure 8 is a close-up cross-sectional view of the substrate comprising a uniformly distributed second coating; and

[0027] Figure 9 ​​​​is a flowchart of a method of manufacturing a current collector for a battery for a vehicle in accordance with the principles of the present disclosure.

[0028] In all of the drawings, like reference numerals refer to like parts throughout the several views. DETAILED DESCRIPTION

[0029] Example configurations will now be described more fully with reference to the accompanying drawings. Example configurations are provided by way of example to convey the principles of the present disclosure to those skilled in the art. Specific structural and functional details disclosed herein are not to be interpreted as limiting but are to be understood as being exemplary. Like numbers refer to like elements throughout the description.

[0030] The terminology used herein is for the purpose of describing particular example configurations only and is not intended to be limiting. As used herein, the singular articles "a," "an," and "the" can be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having," are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order

[0031] When an element or layer is referred to as being "on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it can be directly on, engaged, connected, attached, or coupled to the other element or layer, or one or more intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0032] The terms “first,” “second,” “third,” etc. can be used herein to describe various elements, components, regions, layers and / or sections. The elements, components, regions, layers and / or sections should not be limited by the terms. These terms can be used only to distinguish one element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, the terms such as “first,” “second,” and other numerical terms do not imply a sequence or an order. Thus, a first element, component, region, layer or section discussed below can be termed a second element, component, region, layer or section without departing from the teachings of the example configurations.

[0033] In this application, including the following claims, the term “module” can be replaced by the term “circuit.” The term “module” can refer to, be part of, or include: an Application Specific Integrated Circuit (ASIC); a digital, analog, or mixed analog / digital discrete circuit; a digital, analog, or mixed analog / digital integrated circuit; a combination of combinational logic circuits; a field programmable gate array (FPGA); a processor (shared, dedicated, or group) that executes code; a memory (shared, dedicated, or group) that stores code executed by a processor; other suitable hardware components that provide the described functionality; or a combination of some or all of the above, such as in a system-on-chip.

[0034] The term “code,” as used in this application, including the following claims, can include software, firmware, and / or microcode, and can refer to program, routines, functions, classes, and / or objects. The term “shared processor” includes a single processor that executes some or all code from multiple modules. The term “group processor” includes a processor that executes some or all code from one or more modules in combination with an additional processor. The term “shared memory” encompasses a single memory that stores some or all code from multiple modules. The term “group memory” includes a memory that stores some or all code from one or more modules in combination with an additional memory. The term “memory” can be a subset of the term “computer-readable medium.” The term “computer-readable medium” does not include transitory propagating signals and thus can be considered tangible and non-transitory. Non-limiting examples of non-transitory computer-readable media include tangible computer-readable media including non-volatile memory, magnetic storage, and optical storage.

[0035] The apparatuses and methods described in this application can be implemented partially or fully by one or more computer programs executed by one or more processors. The computer programs include processor-executable instructions stored on at least one non-transitory computer-readable medium. The computer programs can also include and / or rely on stored data.

[0036] A software application (i.e., a software resource) can refer to computer software that causes a computing device to perform a task. In some examples, a software application can be referred to as an “application,” an “app,” or a “program.” Example applications include, without limitation, system diagnostic applications, system management applications, system maintenance applications, word processing applications, spreadsheet applications, messaging applications, media streaming applications, social networking applications, and gaming applications.

[0037] A non-transitory memory can be a physical device that is used to temporarily or permanently store a program (e.g., a sequence of instructions) or data (e.g., program state information) for use by a computing device. A non-transitory memory can be a volatile and / or non-volatile addressable semiconductor memory. Examples of non-volatile memory include, without limitation, flash memory and read-only memory (ROM) / programmable read-only memory (PROM) / erasable programmable read-only memory (EPROM) / electrically erasable programmable read-only memory (EEPROM) (e.g., commonly used for firmware such as a boot program). Examples of volatile memory include, without limitation, random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), phase change memory (PCM), and disks or tapes.

[0038] These computer programs (also known as programs, software, software applications or code) include machine instructions for a programmable processor, and can be implemented in a high-level procedural and / or object-oriented programming language, and / or in assembly / machine language. As used herein, the terms “machine-readable medium” and “computer-readable medium” refer to any computer program product, non-transitory computer readable medium, apparatus and / or device (e.g., magnetic discs, optical disks, memory, Programmable Logic Devices (PLDs)) used to provide machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term “machine-readable signal” refers to any signal used to provide machine instructions and / or data to a programmable processor.

[0039] Various implementations of the systems and techniques described herein can be realized in digital electronic and / or optical circuitry, integrated circuitry, specially designed ASICs (application specific integrated circuits), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include implementation in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.

[0040] The processes and logic flows described in this specification can be performed by one or more programmable processors executing one or more computer programs to perform functions by operating on input data and generating output. The processes and logic flows can also be performed by special purpose logic circuitry, e.g., an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit). Processors suitable for the execution of a computer program include, by way of example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer. Generally, a processor will receive instructions and data from a read-only memory or a random access memory or both. The essential elements of a computer are a processor for performing instructions and one or more memory devices for storing instructions and data. Generally, a computer will also include, or be operatively coupled to receive data from or transfer data to, or both, one or more mass storage devices for storing data, e.g., magnetic, magneto-optical disks, or optical disks. However, a computer need not have such devices. Computer readable media suitable for storing computer program instructions and data include all forms of non-volatile memory, media and memory devices, including by way of example semiconductor memory devices, e.g., EPROM, EEPROM, and flash memory devices; magnetic disks, e.g., internal hard disks or removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks. The processor and the memory can be supplemented by, or incorporated in, special purpose logic circuitry.

[0041] To provide for interaction with a user, one or more aspects of the disclosure can be implemented on a computer having a display device, e.g., a CRT (cathode ray tube), LCD (liquid crystal display), or touch screen, for displaying information to the user and optionally a keyboard and a pointing device, e.g., a mouse or a trackball, by which the user can provide input to the computer. Other kinds of devices can be used to provide for interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback, e.g., visual feedback, auditory feedback, or tactile feedback; and input from the user can be received in any form, including acoustic, speech, or tactile input. In addition, a computer can interact with a user by sending documents to and receiving documents from a device used by the user; for example, by sending web pages to a web browser on a user’s client device in response to requests received from the web browser.

[0042] Due to the electrical conductivity, structural stability, and ease of manufacture of copper-based current collectors, copper-based current collectors can be added to energy storage systems, such as lithium-ion batteries, sodium-ion or sodium-metal batteries, or supercapacitors. Coating a copper-based current collector with one or more materials, such as lithium, can improve the performance of lithium-ion batteries. However, obtaining a smooth and / or uniform layer of lithium on a copper-based current collector can be challenging because copper is an excellent thermal conductor. Typically, when entering a molten bath of lithium, localized solidification of lithium will occur on the copper-based current collector. This is undesirable, and thus further improvements are needed.

[0043] Reference Figure 1 A schematic view of a hot dip plating system 100 is provided. A substrate track or path 102, including one or more rollers 104, extends between a first end 106 and a second end 108. One or more pre-treatment sections, regions, and / or stations are arranged relative to the substrate path 102. As will be discussed below, the one or more pre-treatment portions can be configured to evaluate, treat, and / or modify a substrate 110 prior to entering a material molten bath. The rollers 104 can be arranged to control the position (i.e., horizontal, vertical, angled, etc.) and movement of the substrate 110 between the first end 106 and the second end 108.

[0044] The substrate 110 can include a continuous roll of material (e.g., foil, wire, etc.) or a single component (e.g., a billet). In the present example, the substrate 110 can be stored as a roll of copper foil (not shown) and can be arranged relative to the substrate path 102 such that the substrate 110 can be continuously fed between the first end 106 and the second end 108. Additional rolls of material can be coupled together (e.g., by brazing, welding, or other means) such that the substrate 110 can be processed without interruption. The substrate 110 includes a first or upper surface 112, a second or lower surface 114 opposite the first surface 112, a first side 116, and a second side 118 laterally spaced apart from the first side 116, as shown in Figure 2 The substrate 110 includes a thickness 120 between the first surface 112 and the second surface 114 and a width 122 between the first side 116 and the second side 118.

[0045] Although not shown in Figure 1 , the hot dip plating system 100 can include portions for cleaning and / or preparing the substrate 110 for processing. In other words, for example, the substrate 110 can be treated with a cleaning agent or another preparation that removes oil, dirt, and / or debris present on the substrate 110. Again referring to Figure 1The hot dip coating system 100 can also include one or more quality assessment sections for assessing physical and / or chemical properties of the substrate 110. For example, a first quality assessment section 200 is disposed relative to the substrate path 102 and can be configured to determine a flatness and / or thickness of the substrate 110. In the present example, the flatness and / or thickness is assessed using a laser profilometry system 202.

[0046] With continued reference to Figure 1 The hot dip coating system 100 includes a masking section 300 disposed directly after the first quality assessment section 200 relative to the substrate path 102. The masking section 300 can be configured to cover or mask a portion of the substrate 110. In other words, a portion of the first surface 112, the second surface 114, the first side 116, and the second side 118 of the substrate 110 can be covered with a mask 302, as shown in Figure 2 According to one aspect, the mask 302 is of a removable material that can be mechanically removed or removed by a user at some point downstream of the masking section 300. The mask 302 is configured to temporarily protect the portion of the substrate 110 from being coated with one or more materials as the substrate 110 travels toward the second end 108. Thus, when the mask 302 is removed, the substrate 110 includes an untreated portion 304 on the first surface 112, the second surface 114, the first side 116, and the second side 118. According to another aspect, the mask 302 is made of a flexible material that can easily follow the movement of the substrate 110 as the substrate 110 travels along the rollers 104 toward the second end 108 of the substrate path 102.

[0047] With continued reference to Figure 1 The hot dip coating system 100 includes a pre-coat section 400 disposed directly after the masking section 300 relative to the substrate path 102. The pre-coat section 400 can be configured to apply (e.g., spray, atomize, etc.) a first coating or material 402 onto the first surface 112 and / or the second surface 114 of the substrate 110, as shown in Figure 4 and Figure 5 The pre-coat section 400 can include one or more first or upper sprayers 404 disposed adjacent to the first surface 112 and one or more second or lower sprayers 406 disposed adjacent to the second surface 114, as shown in Figure 3 In the present example, the substrate 110 can be moved horizontally (see Figure 3the first coating 402 to the first surface 112 and / or the second surface 114, while the substrate 110 is being moved vertically upward or pulled vertically upward. For example, a different orientation of the substrate 110 can be desired so that the first coating 402 is applied evenly on the substrate 110. According to one aspect, the first coating 402 can be made of a zinc oxide material. According to another aspect, the first coating 402 can be applied as a cold spray onto the substrate 110. The first coating 402 can be desired to improve adhesion of another material, such as lithium, to the substrate 110, as will be discussed in greater detail below.

[0048] Referring again to Figure 1 , the hot dip coating system 100 can include a second quality assessment section 500 for assessing physical properties of the substrate 110. The second quality assessment section 500 can be arranged directly after the pre-coat section 400 with respect to the substrate path 102 and can be configured to assess an oxide thickness and / or an oxide type on the substrate 110. In the present example, an x-ray fluorescence spectroscopy (XRF) source 502 and an XRF detector 504 can be used to determine the oxide thickness and / or the oxide type of the substrate 110.

[0049] The hot dip coating system 100 also includes a pre-heating section 600 arranged after the pre-coat section 400 and, in the present example, directly after the second quality assessment section 500 with respect to the substrate path 102. Referring to Figure 6 , the pre-heating section 600 is configured to emit heat toward the substrate 110 to increase a temperature of the substrate 110 and / or the first coating 402. As Figure 1 and Figure 6As shown, the pre-heat section 600 can include one or more heaters 602 arranged adjacent to the substrate path 102. According to one aspect, the one or more heaters 602 can be induction heaters or vertical cavity surface emitting laser (VCSEL) heaters. According to another aspect, the one or more heaters 602 can include a temperature of about 180°C to 250°C, and each heater 602 can be held at approximately the same temperature or at different temperatures. Generally, there are several possible arrangements of the one or more heaters 602 within the pre-heat section 600. For example, the one or more heaters 602 can be arranged relative to the first surface 112 and / or the second surface 114 or relative to the first side 116 and / or the second side 118. In at least one example, the one or more heaters 602 can be arranged in a top-down configuration, where the substrate 110 travels vertically downward through the arrangement of one or more heaters 602. In another example, the substrate 110 can be sandwiched between two or more of the one or more heaters 602. Additionally or alternatively, a heated roller (not shown) can be configured to contact the substrate 110 and / or the first coating 402 and increase its temperature as the substrate 110 passes through the heated roller. According to another aspect, the one or more heaters 602 can be arranged at different distances from the substrate 110 or at different angles relative to the substrate 110. Arranging the one or more heaters 602 at different distances and / or at different angles relative to the substrate 110 can be desirable to maintain a heating rate of the substrate 110 and / or the first coating 402. It can be desirable to pre-heat the substrate 110 and / or the first coating 402 to reduce a dwell time of the substrate 110 in the hot-dip section 700 of the hot-dip system 100.

[0050] Referring again to Figure 1 , the hot-dip section 700 is arranged directly after the pre-heat section 600 relative to the substrate path 102. The hot-dip section 700 is configured to coat the substrate 110 with a second coating or material 702. In the present example, the hot-dip section 700 includes a furnace 704 that maintains a molten bath of the second coating 702. According to one aspect, the second coating 702 is made primarily of lithium.

[0051] To date, reference has been made to Figure 7 When a copper substrate is not pre-treated, local solidification of lithium typically occurs on the surface of the copper substrate when the copper substrate is placed into the molten bath of lithium. If the substrate is held in the molten bath for an extended duration (i.e., increased dwell time), the local solidification of lithium eventually re-melts. However, this typically results in dissolution of the underlying copper substrate, which affects the integrity of the substrate and can result in, for example, peeling or tearing of the substrate.

[0052] Referring to Figure 8The pre-treatment sections described above are desirable because they reduce the residence time of the substrate 110 in the molten bath and also ensure that localized solidification of the second coating 702 (e.g., lithium) does not occur on the surface of the substrate 110. In other words, the pre-coating section 400 and the pre-heating section 600 are desirable to maintain the integrity of the underlying substrate 110 and to ensure that the second coating 702 adheres uniformly to the substrate 110. Additionally, as a result of the pre-treatment sections, the second coating 702 can bond, fuse, or at least partially embed into the substrate 110 to create a secure connection between the second coating 702 and the substrate 110. After coating the substrate 110 with the second coating 702 and when the substrate 110 is removed from the hot dip section 700, an interlocking portion 124 is formed between the second coating 702 and the substrate 110.

[0053] Referring again to Figure 1 , the finishing section 800 can be disposed directly after the hot dip section 700 with respect to the substrate path 102. The finishing section 800 can be configured to remove the mask 302 from the substrate 110 and expose the untreated portion 304 of the substrate 110. Additionally, the finishing section 800 can include a laser or finishing mechanism 802 to cut, finish, and / or remove the untreated portion 304. The mask 302 can be particularly desirable such that the laser 802 only needs to cut through one material (i.e., copper) instead of multiple materials (i.e., lithium and copper).

[0054] Referring to Figure 9 , a method 900 of manufacturing a current collector for a vehicle battery is provided. At 910, a substrate 110 is provided that includes a first surface 112, a second surface 114 opposite the first surface 112, a first side 116, and a second side 118 laterally spaced apart from the first side 116.

[0055] At 920, a mask 302 is applied to a portion of the first surface 112 and the second surface 114 and the first side 116 and the second side 118 of the substrate 110.

[0056] At 930, a first coating 402 is applied to the first surface 112 and the second surface 114 of the substrate 110.

[0057] At 940, the substrate 110 and / or the first coating 402 are preheated with one or more heaters 602 disposed adjacent to the substrate 110.

[0058] At 950, the substrate 110 is submerged in a molten bath of a second coating 702 such that the second coating 702 can cover and / or adhere to the substrate 110.

[0059] At 960, the mask 302 is removed from the substrate 110 to expose the untreated portion 304 of the substrate 110.

[0060] At 970, the substrate 110 can be trimmed at the first side 116 and the second side 118 with the laser 802 to remove the unprocessed portion 304 of the substrate 110.

[0061] A number of implementations have been described. Nevertheless, it will be understood that various modifications can be made without departing from the spirit and scope of the disclosure. Therefore, other implementations are within the scope of the following claims. The foregoing description is provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure to the precise form described, and various modifications and variations are possible in light of the disclosure. The implementations were chosen and described in order to provide the best illustration of the principles of the disclosure and the practical application, and to enable others skilled in the art to best utilize the disclosure. The best mode implemented by the inventors has been provided and further modifications that are obvious to those of ordinary skill in the art are intended to be within the scope of the claims.

Claims

1. A hot-dip plating system, comprising: A substrate path, comprising one or more rollers configured to move a substrate between a first end and a second end along the substrate path; A pre-coated section, the pre-coated section being arranged relative to the substrate path and configured to apply a first coating to the substrate; A preheating section, the preheating section being arranged relative to the substrate path and configured to heat the substrate and the first coating; as well as A hot-dip plating section, which is arranged relative to the substrate path and configured to apply a second coating to the substrate.

2. The hot-dip coating system of claim 1, further comprising a masking section prior to the pre-coating section relative to the substrate path, the masking section being configured to apply a mask to a portion of the substrate.

3. The hot-dip plating system of claim 2 further includes one or more quality assessment sections arranged relative to the substrate path.

4. The hot-dip plating system according to claim 3, wherein, The one or more quality assessment sections include a first quality portion directly before the masking section and a second quality portion directly after the pre-coated section.

5. The hot-dip plating system of claim 3 further includes a trimming section arranged relative to the substrate path and configured to remove the mask and trim away untreated portions of the substrate.

6. The hot-dip plating system of claim 1, wherein the substrate comprises copper, the first coating comprises a zinc oxide material, and the second coating comprises a lithium-based material.

7. The hot-dip plating system according to claim 1, wherein, The preheating section includes one or more heaters arranged relative to a first surface of the substrate and a second surface of the substrate.

8. The hot-dip galvanizing system of claim 7, wherein the one or more heaters are configured to emit heat at a temperature between 180°C and 250°C.

9. The hot-dip plating system according to claim 7, wherein, The heating rate of the substrate and the first coating can be adjusted based on the distance between the one or more heaters and the substrate, as well as the angle of the one or more heaters relative to the substrate.

10. The hot-dip plating system according to claim 7, wherein, The one or more heaters include induction heaters or vertical cavity surface emitting laser (VCSEL) heaters.

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