Dynamic magnetic field regulation and control system and regulation and control method

Abstract

The invention relates to a dynamic magnetic field regulation and control system and a regulation and control method. The system comprises a signal acquisition module which is configured to acquire a process signal in a magnetron sputtering coating process; the signal analysis and decision module is configured to perform feature extraction and analysis on the process signal, select a magnetic field motion mode according to an analysis result and then send a corresponding mode instruction; the track planning and executing module is configured to generate and execute a magnetic field motion control instruction according to the mode instruction; and the magnetic field assembly performs magnetic field regulation and control based on the magnetic field motion control instruction so as to realize dynamic regulation and control of the magnetron sputtering coating process. According to the method, the utilization rate of the target material is remarkably increased to 70% or above from 40%-45% of an existing moving target technology, and the film thickness nonuniformity of the base material is stably controlled within + / -1% through the scattering effect of the high-frequency micro-motion mode on initial nonuniformity and the real-time online correction of the parameter self-adaptive mode on film thickness deviation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor magnetron sputtering, and relates to a dynamic magnetic field regulation system and a regulation method, in particular to a dynamic magnetic field regulation system and a regulation method based on a magnetron sputtering film coating process. BACKGROUND

[0002] In the field of semiconductor manufacturing, the target material utilization rate and film coating uniformity of the magnetron sputtering technology directly determine the product yield, production cost and application adaptability as a core process for preparing high-precision thin films (such as photomask chromium films, ITO transparent conductive films, etc.). In particular, in the manufacturing of high-end semiconductor devices, the requirements for film thickness uniformity and target material utilization rate are increasingly stringent. In the mainstream magnetron sputtering equipment on the current market, the local erosion of the target material leads to low utilization rate and poor film coating uniformity. Traditional magnetron sputtering equipment adopts a fixed magnetic field. During the sputtering process, the plasma is constrained by the fixed magnetic field and will concentrate on bombarding specific areas (usually annular areas with higher magnetic field strength) on the surface of the target material, resulting in the formation of annular grooves with different depths on the surface of the target material. This phenomenon of local concentrated erosion limits the effective utilization area of the target material to the periphery of the grooves, and a large amount of target material is wasted due to uneven erosion. Ultimately, the target material utilization rate is usually less than 35%. At the same time, the difference in sputtering rate in the annular groove area directly leads to uneven distribution of the film thickness on the substrate. To solve the problem of annular grooves caused by the fixed magnetic field, the industry has developed a magnetic body uniform speed reciprocating motion scheme. By driving the magnetic field assembly to move uniformly along the surface of the target material, uniform bombardment of the plasma on the target material is achieved. However, this scheme essentially belongs to "open-loop control", that is, the motion trajectory and speed of the magnetic field depend only on the preset time program, and cannot be dynamically adjusted according to the actual erosion state of the target material (such as local area erosion too fast or too slow). The improvement of target material utilization rate and substrate uniformity is limited. In addition, although the magnetic body uniform speed reciprocating motion scheme can avoid annular grooves, it cannot solve the problem of unevenness during movement caused by the edge effect of the magnetic field and the uneven distribution of the plasma density. After long-term operation, the target surface will still show a "wavy" uneven erosion. SUMMARY

[0003] The present application provides a dynamic magnetic field regulation system and a regulation method, specifically a dynamic magnetic field regulation system and a regulation method based on a magnetron sputtering film coating process. The purpose is to solve the problem of unevenness during movement caused by factors such as inherent characteristics of magnetic field distribution and unevenness of plasma, which limits the utilization rate of traditional uniform speed moving targets to a relatively low level (about 40%-45%) and makes it difficult to meet the requirements of high-end semiconductor processes for film thickness uniformity.

[0004] The first aspect of the present application provides a dynamic magnetic field regulation system, comprising: a signal acquisition module configured to acquire a process signal in a magnetron sputtering coating process to indirectly reflect a physical signal of a target erosion state and a coating uniformity; a signal analysis and decision module configured to perform feature extraction and analysis on the process signal, and select a corresponding mode instruction according to an analysis result after selecting a magnetic field motion mode, the multi-mode decision module being electrically connected with the signal acquisition module; a trajectory planning and execution module configured to generate and execute a magnetic field motion control instruction according to the mode instruction, the trajectory planning and execution module being electrically connected with the signal analysis and decision module; and a magnetic field assembly based on the magnetic field motion control instruction to perform magnetic field regulation to realize dynamic regulation of the magnetron sputtering coating process, the magnetic field assembly being an execution body of the magnetic field motion control instruction to dynamically regulate the sputtering process.

[0005] Further, the process signal includes preset process recipe parameters and a physical signal reflecting a dynamic state of the sputtering process, and the physical signal includes a plasma emission spectrum signal.

[0006] Further, the preset process recipe parameters include a process type (standard process / super-uniform process), a target material type, a target film thickness, and a process time. The purpose of obtaining the parameters is to provide a process benchmark for the system to determine an initial working mode.

[0007] Further, the physical signal further includes a target temperature signal, a vacuum degree signal, and a substrate film thickness signal. The acquisition component of the target temperature signal is a thermocouple for real-time monitoring of the temperature of the target backplate. An abnormally high temperature may indicate a cooling system failure or an excessively high process power, and the system can alarm or adjust the cooling water flow to prevent target cracking or magnet demagnetization; the acquisition component of the vacuum degree signal is an ionization gauge for accurately measuring the working pressure of the sputtering chamber. The vacuum degree is a key parameter for maintaining a stable plasma and determining the sputtering rate, and its fluctuation will directly affect the coating quality. The system can determine the stability of the process environment accordingly; the acquisition component of the substrate film thickness signal is an optical film thickness monitor for real-time or periodic measurement of the thickness of the film deposited on the substrate. This signal is the most direct indicator for evaluating the coating uniformity and determining the process endpoint, and can provide the most accurate feedback basis for the parameter adaptive mode.

[0008] Further, the feature extraction and analysis include extracting a target element characteristic spectral line intensity from the plasma emission spectrum signal, calculating a real-time change gradient of the intensity, and analyzing a spatial distribution difference of the intensity.

[0009] Further, the signal acquisition module includes: a plurality of sensors configured to collect the physical signals. The physical signals collected by the sensors are transmitted to a signal analysis and decision module, pre-processed, and feature extracted and analyzed to provide data support for subsequent selection of a magnetic field motion mode, selection of the magnetic field motion mode, and issuance of a corresponding mode instruction, ultimately supporting closed-loop regulation and control of the entire system.

[0010] Further, the sensors include: a spectrum sensor configured to collect a plasma emission spectrum signal; an electric couple sensor configured to monitor a target temperature; and an ionization gauge sensor configured to measure a vacuum degree.

[0011] Further, the signal analysis and decision module includes: a multi-mode decision engine configured to select a magnetic field motion mode according to the results of feature extraction and analysis; when the analysis result is that the target erosion state is uniform and the process is stable, a global scanning mode is selected; when the analysis result is that there is an initial non-uniformity trend or the process recipe requires high uniformity (film thickness non-uniformity ≤ 1%), a high-frequency micro-motion mode is selected; and when the analysis result is that a region with a difference in target erosion rate is detected, a parameter adaptive mode is selected. The global scanning mode is suitable for conventional film coating processes, which is the most basic and energy-saving operation mode. When the process requirement is for ultra-uniform thin films, the high-frequency micro-motion mode is activated to disperse the initial non-uniformity through high-frequency vibration. When the uniformity exceeds the threshold, the parameter adaptive mode is activated. The parameter adaptive mode is a key algorithm structure for achieving maximum improvement in target utilization rate, which realizes the transition from passive consumption of "uniform scanning" to "on-demand compensation". The signal analysis and decision module is responsible for arbitration and switching between global scanning, high-frequency micro-motion, and parameter adaptive modes. It can call the most suitable mode to solve different process problems (such as the appearance of non-uniformity trends) according to different process goals (such as efficiency priority or uniformity priority), achieving the unity of universality and specificity.

[0012] Further, the judgment criteria for uniform target erosion state and stable process operation are that the spectrum intensity values of all monitoring points remain stable, and the standard deviation between them is less than 3% of the average intensity of the preset threshold (the uniformity of the spectrum intensity directly reflects the uniformity of the sputtering (erosion) rate of the target material. When the analysis result shows that the difference between the points is small, it indicates that the current uniform scanning erosion effect is good and no special intervention is needed).

[0013] Further, the judgment criteria for having an initial non-uniformity trend or requiring high uniformity in the process recipe are as follows: Case 1 (based on real-time signals): Feature extraction: analyze the short-term fluctuation of the spectral signal within one period of the magnetic field movement; Analysis result: the regular, periodical fluctuation of the spectral intensity (i.e. the "corrugation" evidence) is detected, which is synchronized with the scanning period of the magnetic field, and the fluctuation amplitude is greater than the stability threshold (3-5% of the average intensity), but does not exceed the global non-uniformity threshold; and Case two (based on the process recipe): When the target value of the "film thickness non-uniformity" in the loaded process recipe is extremely strict (e.g. ≤1%), the system will actively enable this mode at the beginning or initial stage of the process as a preventive measure. The high-frequency micro-motion mode aims to "prevent the problem from occurring", which breaks the periodic bombardment grooves that may be formed in the early stage of non-uniformity (case one) or in the strict process where non-uniformity is expected to occur (case two), and suppresses the formation of ring-shaped trench.

[0014] Further, the judgment criteria for detecting the target material erosion rate difference area are: Feature extraction: continuously monitor and plot the distribution of the spectral intensity on the target material space; Analysis result: it is found that the spectral line intensity of a certain area or certain areas is continuously and significantly higher or lower than that of other areas, and the difference exceeds the preset threshold B (for example, the intensity of a certain area is continuously higher than the average value by more than 5%), which clearly indicates the "erosion rate difference area". At this time, simple uniform scanning or high-frequency vibration cannot correct this already formed and fixed non-uniformity. The system must perform "point compensation", and the parameter adaptive mode is activated. The system maps the "hot spot" (area of excessive erosion) or "cold spot" (area of insufficient erosion) located by the spectral analysis to the movement trajectory of the magnetic field, and performs nonlinear compensation movement by reducing the speed / increasing the residence time in the area (for the cold spot, to speed up the erosion) or skipping / accelerating through (for the hot spot, to slow down the erosion).

[0015] Further, the magnetic field movement mode includes a global scanning mode, a high-frequency micro-motion mode, and a parameter adaptive mode; the working mode of the global scanning mode is that the magnetic field assembly moves along the entire surface of the target material at a preset fixed speed (e.g. 5-20 mm / s) without local residence or speed adjustment, so that the magnetic field uniformly acts on the target material area; the working mode of the high-frequency micro-motion mode is that the magnetic field assembly superimposes high-frequency and small-amplitude vibration on the basis of the global scanning mode, and breaks the non-uniform distribution of ion bombardment on the target material surface through the vibration; the working mode of the parameter adaptive mode is that when the target material erosion rate difference area appears, the system locates the area of excessive erosion of the target material, and generates an instruction to reduce the moving speed of the magnetic field assembly or increase the residence time of the magnetic field assembly in the area, so as to increase the ion bombardment dose of the corresponding area Furthermore, the parameter adaptive mode executes a non-linear compensated motion trajectory. When activated, the system performs a series of operations of "positioning-calculation-generation" based on the spatial position information input from the perception layer, and outputs a variable speed motion command.

[0016] Furthermore, in the high-frequency micro-motion mode, the vibration is ±2-5mm and the frequency is 5-10Hz. Preferably, the vibration is ±3mm and the frequency is 8Hz.

[0017] Furthermore, the signal analysis and decision-making module also includes: A signal processing unit is configured to receive the process signal and perform preprocessing, feature extraction, and analysis on the process signal; and A preset parameter and model library is configured to provide a comparison benchmark for the multi-mode decision engine. The preset parameter and model library stores the data required for the operation of the dynamic magnetic field control system (including process thresholds for different coating scenarios (such as photomask, ITO coating) and default parameters for magnetic field motion modes).

[0018] Furthermore, the preprocessing includes filtering, noise reduction, and signal amplification.

[0019] Furthermore, the trajectory planning and execution module includes: A motion trajectory planner, configured to generate magnetic field motion trajectory parameters based on the selected pattern; A servo driver configured to convert the magnetic field motion trajectory parameters into servo motor control signals; and A position feedback unit is configured to monitor the position of the magnetic field component in real time and form a position closed-loop control.

[0020] Furthermore, the magnetic field component includes: Permanent magnets, configured to generate magnetic fields that control plasma, have their strength and distribution directly affecting the area and intensity of ion bombardment of the target material; and A motion drive mechanism is configured to drive the permanent magnet to move, wherein the permanent magnet adjusts its moving speed based on the magnetic field motion control command to achieve magnetic field regulation.

[0021] Furthermore, the motion drive mechanism includes a servo motor, a guide rail slider, and a transmission lead screw.

[0022] A second aspect of the present invention provides a dynamic magnetic field control method for a dynamic magnetic field control system, comprising the following steps: Acquire process signals during magnetron sputtering coating; The process signals are feature extracted and analyzed, and a corresponding mode command is issued after selecting the magnetic field motion mode based on the analysis results. generate and execute magnetic field motion control instructions according to the mode instructions, the magnetic field motion control instructions control the magnetic field assembly to perform magnetic field regulation to realize dynamic regulation of the magnetron sputtering film coating process; and The above steps are repeated to realize continuous optimization of the dynamic regulation of the magnetron sputtering film coating process.

[0023] Further, collecting process signals in the magnetron sputtering film coating process includes: acquiring preset process recipe parameters and physical signals reflecting the dynamic state of the sputtering process in real time, the physical signals indirectly reflect the target erosion state and film uniformity. This step introduces real-time sensing based on process physical signals as the data basis for subsequent decision-making, replacing the traditional "blind control" method which relies on preset time programs.

[0024] Further, in the step of performing feature extraction and analysis on the process signals and selecting a magnetic field motion mode according to the analysis results to issue corresponding mode instructions, the feature extraction and analysis includes calculating the change gradient of the intensity of a specific element spectrum, and comparing the analysis results with preset threshold values and models, and the multi-mode decision engine automatically selects the optimal one from a plurality of pre-stored magnetic field motion modes according to the real-time analysis results. Further, in the step of generating and executing magnetic field motion control instructions according to the mode instructions, the magnetic field motion control instructions control the magnetic field assembly to perform magnetic field regulation, the magnetic field motion control instructions are servo motor motion control instructions, the servo motor motion control instructions are instructions generated by the system to automatically reduce the moving speed of the magnetic field assembly or increase the residence time in the area where the target material is eroded too fast, so as to realize "point and active compensation" of the erosion profile.

[0025] Further, in the preset threshold values and models, the preset threshold values include: a spectrum uniformity stability threshold value, which is set according to the statistical analysis results of a large amount of historical stable process data, and the preferred range is 1%~5% (which can be 3%), when the real-time spectrum uniformity is lower than this threshold value, it indicates that the target material is eroded uniformly, and the decision engine selects the global scanning mode; and a spectrum uniformity difference threshold value, which is set through experimental verification according to the process specifications to ensure the uniformity of the final film thickness, and the preferred range is 3%~8% (which can be 5%), when it is detected that the local area spectrum intensity deviation continuously exceeds this threshold value, it indicates that there is significant uneven erosion, and the decision engine selects the parameter adaptive mode.

[0026] Further, in the preset threshold values and models, the model includes: a state mapping model, which is a function relationship for mapping the intensity of the plasma emission spectrum to the target erosion rate established through previous experimental calibration, and provides a physical basis for subsequent decision-making; and A control decision model is used to calculate the compensation amount of the magnetic field assembly movement speed according to the erosion rate deviation output by the state mapping model in the parameter adaptive mode.

[0027] Further, after the magnetic field movement changes the sputtering process, return to step one and enter the next signal acquisition and decision cycle. Through this step, the entire process is constructed as a continuous closed-loop optimization system of "perception-decision-execution-re-perception", which can dynamically track and correct process drift, and ensure the continuous stability and optimization of the process effect.

[0028] The present application establishes an intelligent closed loop of perception-decision-execution, closely couples the dynamic regulation of the magnetic field with the real-time state of the sputtering process, actively intervenes and optimizes the erosion process of the target material and the growth process of the thin film, and the proposed dynamic magnetic field regulation method can be based on multi-mode automatic decision of real-time signals and nonlinear compensation movement in the parameter adaptive mode.

[0029] The execution principle of the method of the present application is as follows: The signal analysis and decision module establishes the relationship between the indirect measurement of the target erosion state and the film uniformity, in the magnetron sputtering, the spectral line intensity of a specific element (such as a target atom) in the plasma emission spectrum is directly related to the sputtering rate (i.e. erosion rate) of the element, and the uniformity of the film thickness can also be obtained by statistical data of multiple measurement points, therefore, the spectrum and film thickness signal are the "real-time indicators" of the target erosion state and the film uniformity; the principle of the high-frequency micro-motion mode is to break the initial formation condition of periodic non-uniformity by high-frequency disturbance, at the beginning of sputtering, even if the magnetic field is moving, the ion bombardment will form a weak, periodic non-uniform distribution on the target surface, which is the "prototype" of the subsequent macroscopic annular groove, the high-frequency micro-motion mode of the application superimposes high-frequency and small-amplitude vibration on the macroscopic motion of the magnetic field, which is equivalent to continuously "stirring" and "dispersing" the sputtering groove being formed at the atomic scale, so that it cannot be deepened stably at a fixed position, this mode is suitable for ultra-thin film deposition, and can inhibit non-uniformity at the embryonic stage, and lay a foundation for growing extremely uniform thin films subsequently; the principle of the parameter adaptive mode is the principle of active compensation and closed-loop control, when the system identifies that the erosion rate of a certain area A on the target is higher than that of area B through signal analysis, it completes problem positioning, then, the system maps the spatial position of the problem area to the motion trajectory of the magnetic field, the depth of sputtering erosion is proportional to the ion bombardment energy (which can be simplified as a function of bombardment time and intensity) per unit area of the area, the core of the parameter adaptive mode is that when the magnetic field moves above the problem area A, the equivalent action time of the magnetic field in the area is increased by actively reducing the moving speed or temporarily stopping, which means that the target below the area receives more ion bombardment per unit time, and its erosion rate is actively accelerated; in addition, the method has continuous optimization, the principle of which is the negative feedback regulation principle, the whole system constitutes a typical negative feedback loop: execution control→observation effect→comparison with target→control correction→re-observation, the closed loop ensures that the system is not a static and one-time setting, but an intelligent system that can adapt to process drift (such as target consumption, power fluctuation) and environmental changes, and continuously approaches the optimal target, thereby ensuring the long-period stability and repeatability of the process effect; The present application has at least the following advantages: 1) the traditional uniform moving target treats all process states equally and cannot respond to dynamic changes, the system and method of the present application realize state-based decision making by analyzing signal characteristics (calculating the change gradient of spectral line intensity, the standard deviation of film thickness) in real time and comparing them with preset process models and thresholds; 2) in the traditional mode, due to physical edge effects and other problems, there are always areas with different target material erosion rates, the closed-loop compensation structure of the adaptive parameter mode of the present application increases the bombardment "dose" in the slow erosion area to actively speed up its consumption, so that the slow erosion area can match the fast erosion area, thereby actively homogenizing the entire target surface erosion profile and significantly improving the target material utilization rate from 40%-45% of the existing moving target technology to more than 70%; 3) the present application upgrades the open-loop mechanical movement to intelligent closed-loop control based on real-time sensing of physical signals, and through multi-mode cooperation and nonlinear active compensation, it precisely and targetedly intervenes in the sputtering physical process; 4) the dispersion effect of the high-frequency micro-motion mode on the initial unevenness and the real-time online correction of the film thickness deviation by the adaptive parameter mode can stably control the substrate film thickness unevenness within ±1%, which is especially suitable for high-end photomask applications that require extremely high uniformity; 5) the present application constructs a perception-decision-execution integrated closed-loop dynamic magnetic field regulation system, which fundamentally solves the defects of the traditional open-loop control method that cannot adapt to process dynamic changes, reduces the dependence on the experience of operators, improves the repeatability and yield of the process, and can automatically adapt to the natural drift of the equipment state to maintain long-term stability. BRIEF DESCRIPTION OF DRAWINGS

[0030] To further clarify the above and other advantages and features of the present application, embodiments of the present application will be presented with reference to the accompanying drawings. It can be understood that these drawings only depict typical embodiments of the present application and therefore should not be considered as limiting its scope. In the drawings, the same or corresponding components will be denoted by the same or similar reference signs for the sake of clarity.

[0031] Figure 1 A dynamic magnetic field regulation system schematic diagram in some embodiments of the present application is shown; Figure 2 A dynamic magnetic field regulation method schematic diagram in some embodiments of the present application is shown. DETAILED DESCRIPTION

[0032] It should be noted that the components in the various drawings can be shown exaggerated for illustration purposes and are not necessarily to scale.

[0033] In the present application, the embodiments are only intended to illustrate the scheme of the present application and should not be understood as limiting.

[0034] In the present application, the quantifier "one", "a" does not exclude the scenario of multiple elements, unless specifically indicated.

[0035] It should also be noted that in the embodiments of the present application, only a part of the components or assemblies may be shown for the sake of clarity and simplicity, but those skilled in the art can understand that the required components or assemblies can be added according to the specific scene under the teaching of the present application.

[0036] It should also be noted that in the scope of the present application, the words "same", "equal", "equal" and the like do not mean that the numerical values of the two are absolutely equal, but allow a certain reasonable error, that is, the words also cover "substantially the same", "substantially equal", "substantially equal".

[0037] It should also be noted that in the description of the present application, the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and is not meant to imply or suggest that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as implying or suggesting relative importance.

[0038] In addition, the embodiments of the present application describe the process steps in a specific order, however, this is only for the convenience of distinguishing between steps, and is not limited to the order of the steps, and in different embodiments of the present application, the order of the steps can be adjusted according to the adjustment of the process.

[0039] The following embodiments provide a dynamic magnetic field regulation system, Figure 1 A dynamic magnetic field regulation system is shown, comprising: The signal acquisition module is configured to acquire process signals in the magnetron sputtering film coating process to indirectly reflect physical signals of the target material erosion state and the film coating uniformity, the process signals include preset process recipe parameters and physical signals reflecting the dynamic state of the sputtering process, and the physical signals include plasma emission spectrum signals; The signal analysis and decision module is configured to extract and analyze the process signals, and select a magnetic field motion mode according to the analysis result and issue a corresponding mode instruction, the multi-mode decision module is electrically connected with the signal acquisition module; The trajectory planning and execution module is configured to generate and execute magnetic field motion control instructions according to the mode instructions, and the trajectory planning and execution module is electrically connected with the signal analysis and decision module; and The magnetic field assembly is controlled based on the magnetic field motion control instruction to realize dynamic regulation of the magnetron sputtering film coating process.

[0040] The signal acquisition module comprises: A plurality of sensors configured to acquire physical signals. The physical signals acquired by the sensors are transmitted to the signal analysis and decision module, pre-processed and feature extracted and analyzed to provide data support for subsequent selection of the magnetic field motion mode, select the magnetic field motion mode and issue the corresponding mode instruction, and finally support the closed-loop regulation of the entire system. The sensors include: a spectral sensor configured to acquire plasma emission spectrum signals; an electrical couple sensor configured to monitor the target temperature; and an ionization gauge sensor configured to measure the vacuum degree; The signal analysis and decision module comprises: A multi-mode decision engine configured to select a magnetic field motion mode according to the feature extraction and analysis results; when the analysis result is that the target erosion state is uniform and the process is running stably, a global scanning mode is selected; when the analysis result is that there is an initial non-uniformity trend or the process recipe requires high uniformity (film thickness non-uniformity ≤ 1%), a high-frequency micro-motion mode is selected; when the analysis result is that a target erosion rate difference area is detected, a parameter adaptive mode is selected; the magnetic field motion mode includes the global scanning mode, the high-frequency micro-motion mode and the parameter adaptive mode; the working mode of the global scanning mode is that the magnetic field assembly moves along the overall surface of the target material at a preset fixed speed (such as 5-20 mm / s) without local stopping or speed adjustment, so that the magnetic field uniformly acts on the target material area; the working mode of the high-frequency micro-motion mode is that the magnetic field assembly superimposes high-frequency and micro-amplitude vibration (vibration is ±2-5 mm, frequency is 5-10 Hz) on the basis of the global scanning mode, so as to break the non-uniform distribution of ion bombardment on the target material surface through vibration; the working mode of the parameter adaptive mode is that when a target erosion rate difference area appears, the system locates the area where the target material erodes too fast and generates an instruction to reduce the moving speed of the magnetic field assembly or increase the residence time of the magnetic field assembly in the area, so as to increase the ion bombardment dose of the corresponding area. The parameter adaptive mode executes a nonlinear compensation motion trajectory. When activated, the system will perform a series of operations of "positioning-computing-generating" according to the spatial position information input by the perception layer, and output a variable speed motion instruction. A signal processing unit configured to receive the process signal, pre-process (filtering, noise reduction and signal amplification) and feature extract and analyze the process signal; and The preset parameter and model library is configured to provide a comparison benchmark for the multi-mode decision engine. The preset parameter and model library stores data required for the operation of the dynamic magnetic field regulation system, including process thresholds of different film coating scenarios (such as photomask, ITO film coating), and default parameters of magnetic field motion modes.

[0041] The trajectory planning and execution module includes: a motion trajectory planner configured to generate magnetic field motion trajectory parameters according to the selected mode; a servo driver configured to convert the magnetic field motion trajectory parameters into servo motor control signals; and a position feedback unit configured to monitor the magnetic field component position in real time and form a position closed-loop control.

[0042] The magnetic field component includes: a permanent magnet configured to generate a magnetic field for regulating plasma, the strength and distribution of the magnetic field directly affecting the area and intensity of ion bombardment on the target material; and a motion driving mechanism configured to drive the permanent magnet to move, the permanent magnet adjusting the moving speed based on the magnetic field motion control instruction to achieve magnetic field regulation. The motion driving mechanism includes a servo motor, a guide rail slider, and a transmission screw.

[0043] The following embodiments provide a dynamic magnetic field regulation method of a dynamic magnetic field regulation system, Figure 2 The dynamic magnetic field regulation method is shown in the schematic diagram, including the following steps: Collecting process signals during the magnetron sputtering film coating process: real-time acquisition of preset process recipe parameters and physical signals reflecting the dynamic state of the sputtering process, the physical signals indirectly reflecting the target material erosion state and film coating uniformity. This step introduces real-time sensing based on process physical signals as the data basis for subsequent decision-making, replacing the traditional "blind control" method relying on preset time programs; Feature extraction and analysis are performed on the process signals, and a corresponding mode instruction is issued after selecting the magnetic field motion mode according to the analysis results; wherein the feature extraction and analysis include calculating the change gradient of the intensity of a specific element spectrum, and comparing the analysis results with the preset threshold and model. The multi-mode decision engine automatically selects the optimal one from multiple pre-stored magnetic field motion modes according to the real-time analysis results; Generate and execute the magnetic field motion control instruction according to the mode instruction. The magnetic field motion control instruction controls the magnetic field component to perform magnetic field regulation, so as to achieve dynamic regulation of the magnetron sputtering film coating process. The magnetic field motion control instruction is a servo motor motion control instruction. The servo motor motion control instruction is an instruction generated by the system to automatically reduce the moving speed of the magnetic field component or increase the dwell time in the area where the target material erodes too fast, so as to achieve "point and active compensation" of the erosion profile, and The above steps are repeated to achieve continuous optimization of dynamic regulation of the magnetron sputtering process: after the sputtering process is changed by the magnetic field movement, return to step one and enter the next signal collection and decision-making cycle. Through this step, the entire process is constructed as a continuous closed-loop optimization system of "perception-decision-making-execution-re-perception", which can dynamically track and correct process drift, ensuring the continuous stability and optimization of process effect.

[0044] In the following examples, the sputtering power is 1-2 kW; the working pressure is 0.07-0.5 Pa; and the argon flow rate is 30-60 sccm.

[0045] Example 1 The following examples provide high-frequency micro-motion mode applied to chromium plating of photomask: Application scenario: 50nm thick chromium film is plated on a 6-inch quartz for semiconductor photomask manufacturing, requiring film thickness uniformity (σ / mean) ≤1%.

[0046] Optimal use state: Activation mode: the system automatically activates the high-frequency micro-motion mode according to the photomask process recipe (if the film thickness uniformity is ≤1%, the high-frequency micro-motion mode is automatically activated at the beginning of the process or in the initial stage).

[0047] Running parameters: the magnet performs ±3mm, 8Hz micro-high-frequency vibration in the central area, while the overall scanning is performed at a speed of 5mm / s; Principle of action: high-frequency vibration effectively disperses atomic clusters in the initial stage of film formation, suppressing the formation trend of initial annular grooves; Achievement effect: the final film thickness uniformity reaches 0.8%, far exceeding the level that can be achieved by traditional moving targets (usually ≥3%), and the estimated target material utilization rate can reach 65%.

[0048] Example 2 The following examples provide parameter adaptive mode applied to large-area ITO plating: Application scenario: long-time continuous plating of ITO transparent conductive film on a G8.5 (2200mm×2500mm) glass substrate.

[0049] Optimal use state: Initial stage (0-4 hours): the system uses global scanning mode, and the magnet moves at a constant speed of 20mm / s, with a stable target material utilization rate of 45%; Mid-stage (after 4 hours): the plasma spectrometer detects that the In element spectrum intensity in the corresponding area on the right side of the target continuously weakens by 5%, indicating that the erosion in this area is accelerated, and the system automatically switches to parameter adaptive mode; Compensation action: when the magnet moves to the right within the ±100 mm range, the speed is automatically reduced to 15 mm / s, which is equivalent to increasing the bombardment dose by 33% in this area; Effect achieved: throughout the target material life cycle (8 hours), the film thickness uniformity of the glass substrate is maintained within ±1.5%, and the actual measured comprehensive target utilization rate reaches 76%.

[0050] Example 3 The following provides an example of multi-mode synergy applied to research-grade ultra-thin films: Application scenario: prepare a 5nm thick platinum ultra-thin film on a 4-inch sapphire substrate for cutting-edge catalysis research, requiring a film thickness fluctuation of <±0.1 nm.

[0051] Optimal use state: Phase one (0-2nm): use high-frequency micro-motion mode (±2mm, 10Hz) to ensure extreme uniformity in the nucleation stage and lay a uniform foundation; Phase two (2-5nm): switch to global scanning mode, but at the same time, the parameter adaptive algorithm continuously monitors in the background. Once any slight deviation trend is found through spectral signals (such as slightly higher spectral line intensity in the central area), inject a small speed compensation instruction in the local area.

[0052] Effect achieved: the final film thickness uniformity (standard deviation) reaches 0.4% (corresponding to ~±0.02 nm fluctuation), achieving atomic-scale deposition control and meeting research needs.

[0053] Example 4 The following provides an example of closed-loop maintenance mode applied to mass production stability control: Application scenario: maintain the long-term stability of the sputtering process for several months in a 24 / 7 (7 days 24 hours) continuous production semiconductor production line.

[0054] Optimal use state: The system is always in standby state in parameter adaptive mode. As the target material is consumed from a new target to an old target, its erosion profile and plasma characteristics will slowly drift; The system automatically and gradually fine-tunes the gain parameters of its compensation algorithm (such as the α coefficient in the figure) by continuously monitoring film thickness uniformity data.

[0055] Effect achieved: without manual intervention by engineers to adjust the process formula, the film thickness uniformity of each batch of products can always meet the process specification of ±2%, significantly improving product yield and overall efficiency of the production line.

[0056] While several embodiments of the application have been described, it is contemplated that those skilled in the art will, in light of the teachings herein, recognize various modifications and changes that can be made without departing from the scope of the present application. It is therefore intended that the scope of the application not be limited to the exact recitations of the claims that follow, but rather that they be interpreted as broadly as is allowed under the prior art.

Claims

1. A dynamic magnetic field regulation system, characterized in that, The method comprises the following steps: a signal acquisition module configured to acquire process signals in a magnetron sputtering process; a signal analysis and decision module configured to extract and analyze features of the process signals and select a magnetic field motion mode according to the analysis results and issue a corresponding mode instruction, the multi-mode decision module being electrically connected to the signal acquisition module; a trajectory planning and execution module configured to generate and execute a magnetic field motion control instruction according to the mode instruction, the trajectory planning and execution module being electrically connected to the signal analysis and decision module; and a magnetic field assembly configured to regulate the magnetic field based on the magnetic field motion control instruction to achieve dynamic regulation of the magnetron sputtering process. The process signals include preset process recipe parameters and physical signals reflecting the dynamic state of the sputtering process, and the physical signals include plasma emission spectrum signals.

2. The dynamic magnetic field regulation system of claim 1, wherein, The signal acquisition module comprises:

3. The dynamic magnetic field regulation system of claim 1, wherein, a plurality of sensors configured to acquire the physical signals. The signal analysis and decision module comprises:

4. The dynamic magnetic field regulation system of claim 1, wherein, a multi-mode decision engine configured to select a magnetic field motion mode according to the feature extraction and analysis results; when the analysis results show that the target material erosion state is uniform and the process is stable, a global scanning mode is selected; when the analysis results show that there is an initial non-uniformity trend or the process recipe requires high uniformity, a high-frequency micro-motion mode is selected; when the analysis results show that a target material erosion rate difference area is detected, a parameter adaptive mode is selected. The magnetic field motion modes include a global scanning mode, a high-frequency micro-motion mode, and a parameter adaptive mode; the global scanning mode works in the following way: the magnetic field assembly moves along the entire surface of the target material at a preset fixed speed without local stopping or speed adjustment, so that the magnetic field uniformly acts on the target material area; the high-frequency micro-motion mode works in the following way: the magnetic field assembly superimposes high-frequency and micro-amplitude vibrations on the basis of the global scanning mode, which breaks the non-uniform distribution of ion bombardment on the target material surface through the vibrations; the parameter adaptive mode works in the following way: when a target material erosion rate difference area appears, the system locates the area where the target material erodes too fast and generates an instruction to reduce the moving speed of the magnetic field assembly or increase the residence time of the magnetic field assembly in that area, so as to increase the ion bombardment dose in the corresponding area.

5. The dynamic magnetic field regulation system of claim 1, wherein, In the high-frequency micro-motion mode, the vibrations are ±2-5 mm with a frequency of 5-10 Hz.

6. The dynamic magnetic field regulation system of claim 5, wherein, The signal analysis and decision module further comprises:

7. The dynamic magnetic field regulation system of claim 1, wherein, a signal processing unit configured to receive the process signals and perform preprocessing, feature extraction, and analysis on the process signals; and a preset parameter and model library configured to provide a comparison benchmark for the multi-mode decision engine. The trajectory planning and execution module comprises:

8. The dynamic magnetic field regulation system of claim 1, wherein, a motion trajectory planner configured to generate magnetic field motion trajectory parameters according to the selected mode; a servo driver configured to convert the magnetic field motion trajectory parameters into servo motor control signals; and a position feedback unit configured to monitor the position of the magnetic field assembly in real time and form a position closed-loop control. The magnetic field assembly comprises:

9. The dynamic magnetic field regulation system of claim 1, wherein, a permanent magnet configured to generate a magnetic field for regulating the plasma; and ​ A motion driving mechanism configured to drive the permanent magnet to move, the permanent magnet adjusting a moving speed based on the magnetic field motion control instruction to achieve magnetic field regulation.

10. A method of dynamic magnetic field regulation based on the dynamic magnetic field regulation system according to any one of claims 1 to 9, characterized in that, The method comprises the following steps: Collecting process signals during the magnetron sputtering coating process; Performing feature extraction and analysis on the process signals, and selecting a magnetic field motion mode according to the analysis results and then issuing a corresponding mode instruction; Generating and executing a magnetic field motion control instruction according to the mode instruction, the magnetic field motion control instruction controlling the magnetic field assembly to perform magnetic field regulation to achieve dynamic regulation of the magnetron sputtering coating process; And Repeating the above steps to continuously optimize the dynamic regulation of the magnetron sputtering coating process.

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