Fabricated building structure health monitoring system and method

Abstract

The invention discloses a fabricated building structure health monitoring system and method, and relates to the technical field of building structure health monitoring, and the fabricated building structure health monitoring system and method uses an SMA spring assembly and a U-shaped buckle to connect an ardealite inner wall and a main body structure of a fabricated building, thereby greatly improving the shock resistance and safety of the fabricated building. Meanwhile, according to the hyperelasticity and the shape memory effect of the SMA spring, the heating temperature corresponding to SMA spring performance deviation recovery is analyzed, then a deformation deviation recovery curve and a fatigue deviation recovery curve of the SMA spring are obtained, in the mounting and using process of the assembly type structure, the deformation quantity and the cycle index of the SMA spring assembly are continuously monitored, and the deformation deviation recovery curve and the fatigue deviation recovery curve of the SMA spring assembly are obtained. According to the method, the performance deviation condition of the SMA spring assembly is obtained, so that the SMA spring assembly is heated to the corresponding temperature, the performance of the SMA spring assembly is repaired accordingly, the material performance degradation speed is effectively delayed, and the durability and reliability of the fabricated building structure are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of building structure health monitoring, in particular to a fabricated building structure health monitoring system and method. BACKGROUND

[0002] The fabricated building structure is assembled by prefabricated components through connecting nodes. In the construction or use process, the structure may be damaged or defective due to load changes, environmental factors and material aging, etc. The traditional fabricated building structure generally uses a steel keel structure, which has poor seismic resistance, low efficiency of disassembly and modification, and serious material waste.

[0003] The prior art, such as the fabricated building structure health monitoring system and method disclosed in the patent application with the publication number CN119880027A, performs first dynamic detection on all assembly connection areas inside the fabricated building, obtains first action dynamic data, determines the assembly connection stress distribution state information inside the fabricated building, comprehensively identifies the stress generated by the assembly connection of different structural members, identifies abnormal assembly connection areas based on the assembly connection stress distribution state information, detects and analyzes second action dynamic data of the abnormal assembly connection areas, obtains relative position change information between different structural members inside the abnormal assembly connection areas, accurately identifies the relative movement of the structural members, provides reliable basis for subsequent judgment of whether the structural members have loosening risk, and judges and warns the structure health of the fabricated building based on the existence state information of all structural members with loosening risk inside the fabricated building, timely and comprehensively investigates the structural members inside the fabricated building, and accurately monitors and timely warns the structure health of the fabricated building.

[0004] For the above-mentioned scheme, the following technical problems exist: 1. The current technology mainly analyzes the dynamic data of each connection area of the fabricated building, and then identifies the displacement of the components. The current technology does not consider that the traditional fabricated building structure has poor rigidity. When the load of each connection area changes, the position of the structure will frequently move, which is not conducive to the installation and use of the fabricated building structure.

[0005] 2. The current technology does not consider how to repair or disassemble and modify the structure when the structure of the fabricated building is displaced or deformed. The repair and disassembly and modification of the structure of the traditional fabricated building have large engineering quantity, and are prone to cause material waste and other problems. SUMMARY

[0006] The present application provides a fabricated building structure health monitoring system and method, which solves the problems in the background art.

[0007] To solve the above technical problems, the application adopts the following technical solutions: the application provides a prefabricated building structure health monitoring system in the first aspect, comprising: a building structure component module: used for connecting the phosphogypsum wall and the prefabricated building structure body through the SMA spring assembly and the U-shaped buckle.

[0008] A performance recovery test module is used for testing the performance offset of the SMA spring assembly, and the relationship between the performance offset of the SMA spring assembly and the heating temperature is analyzed.

[0009] A health monitoring module is used for monitoring the performance data of the SMA spring assembly installed in the phosphogypsum interior partition wall during use, analyzing the performance offset type of the SMA spring assembly, and repairing the performance of the SMA spring assembly.

[0010] A health monitoring feedback module is used for analyzing and feeding back the health monitoring and repair of the SMA spring assembly.

[0011] The application provides a prefabricated building structure health monitoring method in the second aspect, comprising: step one, connecting the phosphogypsum wall and the prefabricated building structure body through the SMA spring assembly and the U-shaped buckle.

[0012] Step two, testing the performance offset of the SMA spring assembly, and analyzing the relationship between the performance offset of the SMA spring assembly and the heating temperature.

[0013] Step three, monitoring the performance data of the SMA spring assembly installed in the phosphogypsum interior partition wall during use, analyzing the performance offset type of the SMA spring assembly, and repairing the performance of the SMA spring assembly.

[0014] Step four, analyzing and feeding back the health monitoring and repair of the SMA spring assembly.

[0015] The application has the following beneficial effects: 1. The prefabricated building structure health monitoring system and method provided by the application connects the phosphogypsum interior wall and the main structure of the prefabricated building through the SMA spring assembly and the U-shaped buckle, greatly improves the seismic resistance and safety of the prefabricated building, analyzes the corresponding heating temperature for the performance offset recovery of the SMA spring according to the super-elasticity and shape memory effect of the SMA spring, obtains the deformation offset recovery curve and the fatigue offset recovery curve of the SMA spring, continuously monitors the deformation amount and the cycle number of the SMA spring assembly during the installation and use of the prefabricated structure, obtains the performance offset of the SMA spring assembly, heats the SMA spring assembly to the corresponding temperature, and repairs the performance of the SMA spring assembly. The application effectively delays the material performance degradation speed, improves the durability and reliability of the prefabricated building structure.

[0016] 2、The application introduces the SMA spring assembly into the prefabricated building structure, the super-elasticity and shape memory effect of the SMA material enable the prefabricated building structure to have strong deformation capacity, avoid the damage of the prefabricated building structure caused by severe vibration such as earthquake, and greatly improve the disassembly and modification efficiency when the prefabricated building structure is damaged, thereby ensuring the safety and stability of the prefabricated building structure.

[0017] 3、The application analyzes the deformation recovery offset and fatigue recovery offset of the SMA spring assembly, when the deformation of the SMA spring is too large or the cycle number is too large, heating the SMA spring assembly according to the set temperature cannot restore the original length of the SMA spring, at this time, a higher temperature is needed to restore the elastic performance and shape memory effect of the SMA, and the deformation recovery condition and cycle condition of the SMA spring assembly are monitored during the installation and use of the prefabricated building structure, the performance offset condition of the SMA spring assembly can be effectively analyzed, and the spring performance can be repaired in time, thereby effectively delaying the degradation speed of the material performance, improving the durability and reliability of the prefabricated building structure, and being beneficial to the long-term development of the prefabricated building industry. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 It is a schematic diagram of the system structure connection of the application.

[0020] Figure 2 It is a schematic diagram of the method implementation step flow of the application. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the application will be described clearly and completely in the following with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only some of the embodiments of the application, not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the application.

[0022] REFERENCE Figure 1As shown, the present application provides a prefabricated building structure health monitoring system in the first aspect, comprising the following modules: building structure component module: for connecting phosphogypsum wall and prefabricated building structure body through SMA spring assembly and U-shaped buckle.

[0023] It should be noted that SMA is shape memory alloy.

[0024] It should be noted that the SMA spring assembly and the U-shaped buckle are installed in the phosphogypsum interior partition wall of the prefabricated building structure, wherein the U-shaped buckle is detachable, the SMA can be reset by heating, and through the cooperation of the U-shaped buckle and the SMA, the seismic performance and the demolition efficiency of the prefabricated building are greatly enhanced.

[0025] In one specific example, the phosphogypsum wall and the prefabricated building body structure are connected through the SMA spring assembly and the U-shaped buckle, and the specific process is as follows: for the SMA spring assembly, the nickel-titanium alloy is wound into a cylindrical spring with a preset pitch, first determine the installation position of the SMA spring assembly at the top of the beam bottom and the phosphogypsum partition wall and preform the groove, then implant the expansion bolt sleeve in the groove and fix it with the positioning pin, and finally fasten the bolts at both ends of the SMA spring assembly with the expansion bolt sleeve on the beam bottom and the phosphogypsum partition wall, and remove the positioning pin.

[0026] It should be noted that the preset pitch is specifically set by the relevant staff according to the production requirements.

[0027] For the U-shaped buckle, galvanized cold-bent thin-walled steel is used as the U-shaped section of the U-shaped buckle, and epoxy resin glue is applied inside the buckle, first determine the installation position at the top of the beam bottom and the phosphogypsum partition wall and preform the groove, then embed the sleeve at the installation position of the phosphogypsum wall and fix it with the positioning bracket, drill a hole at the installation position of the beam bottom and implant an expansion bolt, then fix the L-shaped steel plate, align the two wing plates at the bottom of the U-shaped buckle with the embedded sleeve on the top surface of the block, use self-tapping screws to connect the sleeve through the U-shaped buckle screw hole, and at the same time, the top hook of the U-shaped buckle hooks the L-shaped steel plate at the bottom of the beam, finally use the bolt to fix the U-shaped buckle with the L-shaped steel plate, allowing the buckle to have a preset distance of movement in the horizontal direction.

[0028] It should be noted that the preset distance is set by the relevant staff, which is generally 5-10mm.

[0029] It should be noted that the U-shaped buckle is rigidly fixed through the embedded sleeve and the self-tapping screw, and combined with the elastic properties of the SMA spring assembly, the displacement of the phosphogypsum partition wall in an earthquake can be reset, improving the seismic performance of the prefabricated building.

[0030] The performance recovery test module is used for testing the performance offset of the SMA spring assembly, and analyzing the relationship between the performance offset of the SMA spring assembly and the heating temperature.

[0031] In one specific example, the performance offset of the SMA spring assembly includes a deformation recovery offset and a fatigue recovery offset.

[0032] In one specific example, the performance offset of the SMA spring assembly is tested as follows: S1, first, the SMA spring assemblies for testing are divided into two groups, one group is loaded to each target super-threshold deformation amount at a preset rate under room temperature conditions, and is kept for a period of time, then each target super-threshold deformation amount is recorded, after the recording is completed, heating is performed at a set spring recovery temperature, and after being kept for a period of time, the deformation recovery offset of each SMA spring assembly is recorded; the set spring recovery temperature is used as the starting temperature, and the temperature is increased at a preset temperature gradient, according to which each SMA spring assembly that has a deformation recovery offset is heated at each temperature, and after the heating is completed, natural cooling to room temperature is performed, and the post-recovery deformation offset of each SMA spring assembly is recorded.

[0033] It should be noted that the SMA spring assemblies for testing are completely the same as the SMA spring assemblies installed in the assembled building structure.

[0034] It should be noted that the preset rate and the preset temperature gradient and the like are set by the relevant staff themselves, and are not specifically limited here.

[0035] For example, the deformation threshold of each SMA spring assembly is 10 cm, the length of the spring itself is 5 cm, the preset recovery temperature is 80℃, the preset rate is 0.01 mm / min, and the preset temperature gradient is 5℃, and the target super-threshold deformation amounts are set to be 11 cm, 12 cm, 13 cm and 14 cm, etc., the deformation recovery offset of each SMA spring assembly is tested to be 2 cm, 1.5 cm, 1 cm and -0.3 cm, each SMA spring assembly that has a deformation recovery offset is heated at 80℃, 85℃, 90℃, 95℃, 100℃ and 105℃, respectively, and the post-recovery deformation offset data of each SMA spring assembly is obtained, and the example is only for illustrative purposes, and the actual test data is much more than the example data.

[0036] S2, another group is loaded to the deformation variable within any target threshold at room temperature according to a preset rate, and after a period of time, the deformation variable within each target threshold is recorded. After the recording is completed, heating is performed according to a set spring recovery temperature, and a period of time is maintained. Each SMA spring assembly is tested according to each preset loading time, and the deformation recovery offset of each SMA spring assembly after each loading time is recorded. The set spring recovery temperature is taken as the starting temperature, and the temperature is raised according to a preset temperature gradient. Accordingly, each SMA spring assembly that has a deformation recovery offset is heated at each temperature, and is naturally cooled to room temperature after heating is completed. The fatigue offset of each SMA spring assembly after recovery is recorded.

[0037] It should be noted that each preset rate, each preset loading time, and the preset temperature gradient are set by relevant staff, and are not specifically limited here.

[0038] For example, the deformation threshold of each SMA spring assembly is 10 cm, the length of the spring itself is 5 cm, the preset recovery temperature is 80°C, the preset rate is 0.01 mm / min, each preset loading time is 10 times, 12 times, 14 times, and 18 times, the preset temperature gradient is 5°C, and the deformation recovery offset of each SMA spring assembly obtained by testing at each preset loading time is 0.2 cm, 1 cm, 1.4 cm, and 3 cm, respectively. Each SMA spring assembly that has a deformation recovery offset is heated at 80°C, 85°C, 90°C, 95°C, 100°C, and 105°C, respectively, to obtain the fatigue offset data of each SMA spring assembly after recovery. The example is only illustrative, and the actual test data is much more than the example data.

[0039] In a specific example, the analysis obtains the relationship between the performance offset of the SMA spring assembly and the heating temperature, and the specific process is as follows: the deformation offset of each SMA spring assembly after recovery is taken as the vertical coordinate, and the corresponding heating temperature is taken as the horizontal coordinate. The deformation offset data of each SMA spring assembly after recovery and the corresponding heating temperature data obtained by testing are nonlinearly fitted to construct a deformation offset recovery curve of the SMA spring assembly.

[0040] The fatigue offset of each SMA spring assembly after recovery is taken as the vertical coordinate, and the corresponding heating temperature is taken as the horizontal coordinate. The fatigue offset data of each SMA spring assembly after recovery and the corresponding heating temperature data obtained by testing are nonlinearly fitted to construct a fatigue offset recovery curve of the SMA spring assembly.

[0041] It should be noted that the nonlinear fitting is a prior art, and thus will not be described again.

[0042] Health monitoring module: for monitoring the performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, and analyzing the performance deviation type of the SMA spring assembly, so as to perform performance repair on the SMA spring assembly.

[0043] In a specific example, the performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall is monitored as follows: before the SMA spring assembly is installed, the magnetostrictive displacement sensor shell is fixed coaxially with the SMA spring assembly, the probe end is connected to the end face of the SMA spring assembly, and the other end is connected to the signal line in the junction box for monitoring the deformation data of the SMA paralyzed assembly. At the same time, the fiber Bragg grating strain gauge is pasted on the surface of the SMA spring assembly, and the fiber bus is connected to the modulator for monitoring the cycle number of the SMA spring assembly. The PI film-based flexible resistance sheet is wound on the surface of the SMA spring assembly, and the PI film-based flexible resistance sheet lead is connected to the DC power supply for heating the SMA spring assembly.

[0044] It should be noted that the displacement, cycle number and temperature of the SMA spring assembly are displayed in real time through the cloud management platform, and an alarm is given when the displacement, cycle number and temperature exceed the threshold value.

[0045] In a specific example, the performance deviation type of the SMA spring assembly is analyzed as follows: when the deformation deviation value of the SMA spring assembly is compared with the set deformation deviation threshold value, if the absolute value of the deformation deviation value of the SMA spring assembly is less than or equal to the set deformation deviation threshold value, deformation recovery is not needed, and if the absolute value of the deformation deviation value of the SMA spring assembly is greater than the set deformation deviation threshold value of the SMA spring assembly, deformation recovery is needed.

[0046] The cycle number of the SMA spring assembly is compared with the set cycle number threshold value, if the cycle number of the SMA spring assembly is less than or equal to the set cycle number threshold value, fatigue repair is not needed, and if the cycle number of the SMA spring assembly is greater than the set cycle number threshold value, fatigue repair is needed.

[0047] It should be noted that the deformation deviation threshold value and the cycle number threshold value are obtained by referring to the production instruction document of the SMA spring assembly.

[0048] In a specific example, the performance of the SMA spring assembly is repaired, and the specific process is as follows: obtaining the deformation offset of the SMA spring assembly that needs to be repaired, matching the deformation offset with the deformation offset recovery curve of the SMA spring assembly, and comparing the minimum deformation offset after recovery obtained by matching with the set deformation offset threshold value, when the minimum deformation offset after recovery is less than or equal to the set deformation offset threshold value, using the external DC power supply to heat the SMA spring assembly to the heating temperature corresponding to the minimum deformation offset after recovery, when the minimum deformation offset after recovery is greater than the set deformation offset threshold value, then the SMA spring assembly needs to be replaced.

[0049] Similarly, the number of cycles of the SMA spring assembly that needs to be repaired is obtained, the number of cycles is matched with the fatigue offset recovery curve of the SMA spring assembly, and the minimum deformation offset after recovery obtained by matching is compared with the set deformation offset threshold value, when the minimum deformation offset after recovery is less than or equal to the set deformation offset threshold value, using the external DC power supply to heat the SMA spring assembly to the heating temperature corresponding to the minimum deformation offset after recovery, when the minimum deformation offset after recovery is greater than the set deformation offset threshold value, then the SMA spring assembly needs to be replaced.

[0050] Health monitoring feedback module: for analyzing and feeding back the health monitoring and repair of the SMA spring assembly.

[0051] In a specific example, the health monitoring and repair of the SMA spring assembly are analyzed and fed back, and the specific process is as follows: using the SMA spring assembly and the U-shaped buckle to connect the phosphogypsum wall and the main body of the fabricated building structure, and the fabricated building structure is recorded as the target fabricated building, and then the service life of a plurality of target fabricated buildings is monitored, so as to calculate the average service life of the target fabricated building, and the average service life of the target fabricated building is compared with the average service life of the historical fabricated building structure, and the comparison result is fed back to the relevant staff.

[0052] It should be noted that the average service life of the target fabricated building is compared with the average service life of the historical fabricated building structure, and the service life of the target fabricated building is improved by nearly 50% compared with the traditional fabricated building.

[0053] Referring to Figure 2 The present application provides a fabricated building structure health monitoring method in a second aspect, comprising the following steps: step one, connecting the phosphogypsum wall and the main body of the fabricated building structure through the SMA spring assembly and the U-shaped buckle.

[0054] Step two, performance offset test of the SMA spring assembly, and then analyzing the relationship between the performance offset of the SMA spring assembly and the heating temperature.

[0055] Step three, monitoring the performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing the performance deviation type of the SMA spring assembly, and repairing the performance of the SMA spring assembly.

[0056] Step four, analyzing and feeding back the health monitoring and repair of the SMA spring assembly.

[0057] The application provides a prefabricated building structure health monitoring system and method, which uses SMA spring assemblies and U-shaped buckle connections to connect the phosphogypsum inner wall and the main structure of the prefabricated building, greatly improves the seismic resistance and safety of the prefabricated building, analyzes the corresponding heating temperature for restoring the performance deviation of the SMA spring according to the super-elasticity and shape memory effect of the SMA spring, obtains the shape deformation deviation recovery curve and the fatigue deviation recovery curve of the SMA spring, continuously monitors the deformation amount and cycle number of the SMA spring assembly during the installation and use of the prefabricated structure, obtains the performance deviation of the SMA spring assembly, heats the SMA spring assembly to the corresponding temperature, and repairs the performance of the SMA spring assembly accordingly. The application effectively delays the material performance degradation speed, improves the durability and reliability of the prefabricated building structure.

[0058] The above is only an example and description of the concept of the application, and those skilled in the art can make various modifications, supplements or substitutions of similar ways to the described specific embodiments without departing from the concept of the application or exceeding the scope defined by the application.

Claims

1. A prefabricated building structure health monitoring system, characterized by, The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly.

2. The prefabricated building structure health monitoring system according to claim 1, wherein, The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly.

3. The prefabricated building structure health monitoring system according to claim 2, wherein, The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly.

4. The prefabricated building structure health monitoring system according to claim 3, wherein, The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, and a health monitoring feedback module for analyzing and feeding back health monitoring and repair conditions of the SMA spring assembly. The application relates to a building structure component module for connecting a phosphogypsum wall and a fabricated building structure body through an SMA spring assembly and a U-shaped buckle, a performance recovery test module for testing performance offset of the SMA spring assembly, a health monitoring module for monitoring performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall during use, analyzing performance offset types of the SMA spring assembly, and performing performance repair on the SMA spring assembly, S2, another group is loaded into the arbitrary target threshold variable at room temperature according to the preset rate, and the target threshold variable is recorded after a period of time. After the recording is completed, heating is carried out according to the set spring recovery temperature, and a period of time is maintained. The SMA spring assembly is tested according to each preset loading time, and the deformation recovery offset of the SMA spring assembly after each loading time is recorded. The set spring recovery temperature is taken as the starting temperature, the temperature is raised according to the preset temperature gradient, and the SMA spring assembly with deformation recovery offset is heated at each temperature. After heating is completed, it is naturally cooled to room temperature, and the recovery fatigue offset of the SMA spring assembly after cooling is recorded.

5. The prefabricated building structure health monitoring system according to claim 4, wherein, The analysis obtains the relationship between the performance offset of the SMA spring assembly and the heating temperature, and the specific process is as follows: The recovery deformation offset of each SMA spring assembly is taken as the ordinate, and the corresponding heating temperature is taken as the abscissa. The recovery deformation offset data of each SMA spring assembly obtained by testing and the corresponding heating temperature data are nonlinearly fitted to construct the deformation offset recovery curve of the SMA spring assembly. The recovery fatigue offset of each SMA spring assembly is taken as the ordinate, and the corresponding heating temperature is taken as the abscissa. The recovery fatigue offset data of each SMA spring assembly obtained by testing and the corresponding heating temperature data are nonlinearly fitted to construct the fatigue offset recovery curve of the SMA spring assembly.

6. The prefabricated building structure health monitoring system according to claim 5, wherein, The performance data of the SMA spring assembly installed in the phosphogypsum inner partition wall is monitored, and the specific process is as follows: Before the SMA spring assembly is installed, the magnetostrictive displacement sensor shell is coaxially fixed with the SMA spring assembly, the probe end is connected to the end face of the SMA spring assembly, the other end is led out to the junction box, and the deformation data of the SMA spring assembly is monitored. At the same time, the fiber Bragg grating strain gauge is pasted on the surface of the SMA spring assembly, the fiber bus is connected to the adjusting instrument, the cycle number of the SMA spring assembly is monitored, and the PI film-based flexible resistance sheet is wound on the surface of the SMA spring assembly. The PI film-based flexible resistance sheet lead is connected to the direct current power supply for heating the SMA spring assembly.

7. The prefabricated building structure health monitoring system according to claim 6, wherein, The performance offset type of the SMA spring assembly is analyzed, and the specific process is as follows: When the deformation offset value of the SMA spring assembly is monitored and compared with the set deformation offset threshold value, if the absolute value of the deformation offset value of the SMA spring assembly is less than or equal to the set deformation offset threshold value, deformation recovery is not needed, and if the absolute value of the deformation offset value of the SMA spring assembly is greater than the set deformation offset threshold value of the SMA spring assembly, deformation recovery is needed. The cycle number of the SMA spring assembly is compared with the set cycle number threshold value, if the cycle number of the SMA spring assembly is less than or equal to the set cycle number threshold value, fatigue repair is not needed, and if the cycle number of the SMA spring assembly is greater than the set cycle number threshold value, fatigue repair is needed.

8. The fabricated building structural health monitoring system according to claim 7, wherein, The performance of the SMA spring assembly is repaired, and the specific process is as follows: The deformation offset of the SMA spring assembly that needs to be repaired is obtained, the deformation offset is matched with the deformation offset recovery curve of the SMA spring assembly, and the minimum deformation offset after recovery obtained by matching is compared with the set deformation offset threshold value. When the minimum deformation offset after recovery is less than or equal to the set deformation offset threshold value, the SMA spring assembly is heated to the heating temperature corresponding to the minimum deformation offset after recovery by using the external DC power supply. When the minimum deformation offset after recovery is greater than the set deformation offset threshold value, the SMA spring assembly needs to be replaced. Similarly, the cycle number of the SMA spring assembly that needs to be repaired is obtained, the cycle number is matched with the fatigue offset recovery curve of the SMA spring assembly, and the minimum deformation offset after recovery obtained by matching is compared with the set deformation offset threshold value. When the minimum deformation offset after recovery is less than or equal to the set deformation offset threshold value, the SMA spring assembly is heated to the heating temperature corresponding to the minimum deformation offset after recovery by using the external DC power supply. When the minimum deformation offset after recovery is greater than the set deformation offset threshold value, the SMA spring assembly needs to be replaced.

9. The fabricated building structural health monitoring system of claim 8, wherein, The health monitoring and repair of the SMA spring assembly are analyzed and fed back, and the specific process is as follows: The assembled building structure connected by the SMA spring assembly and the U-shaped buckle connecting the phosphogypsum wall and the main body of the assembled building structure is recorded as the target assembled building, and the service life of a plurality of target assembled buildings is monitored to calculate the average service life of the target assembled building. The average service life of the target assembled building is compared with the average service life of the historical assembled building structure, and the comparison result is fed back to the relevant staff.

10. A method for monitoring the health of a fabricated building structure, using the fabricated building structure health monitoring system of any one of claims 1-9, wherein, It includes: Step one, connect the phosphogypsum wall and the main body of the assembled building structure by the SMA spring assembly and the U-shaped buckle; Step two, test the performance offset of the SMA spring assembly, and then analyze the relationship between the performance offset of the SMA spring assembly and the heating temperature; Step three, monitor the performance data of the SMA spring assembly installed in the phosphogypsum interior partition wall during use, and then analyze the performance offset type of the SMA spring assembly to repair the performance of the SMA spring assembly; Step four, analyze and feed back the health monitoring and repair of the SMA spring assembly.

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