Board card and network equipment

Abstract

The invention provides a board card and network equipment, and belongs to the technical field of communication. The board card comprises a first circuit board, a first light cage, a first radiator and a second radiator. The first optical cage is fixed on the first circuit board. The first light cage comprises a layer of first slots. Each first slot comprises a first window on the slot wall close to the first circuit board and a second window on the slot wall far away from the first circuit board. The first radiator is located on the side, close to the first circuit board, of the first light cage, and part of the first radiator extends into the first slots through the first windows. The second radiator comprises a cold plate and a plurality of elastic heat conduction assemblies. The cold plate is located on one side of the first light cage away from the first circuit board. One side of each elastic heat conduction assembly is connected with the cold plate, and the other side of each elastic heat conduction assembly extends into the corresponding first slot through the corresponding second window. Thus, the two sides of the optical module in the first slot are in contact with the first radiator and the second radiator respectively, the optical module dissipates heat from both sides, and the heat dissipation efficiency is high.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of communication technology, and in particular to a board card and a network device. BACKGROUND

[0002] An information and communications technology (ICT) device such as a switch is provided with a board card (or single board), which includes a circuit board and an optical cage provided on the circuit board. The optical cage has a slot for inserting an optical module and achieving electrical connection between the optical module and other electrical devices on the circuit board.

[0003] In order to dissipate heat from the optical module, a window is often opened in the top wall of the optical cage, and a heat sink is added to the top wall of the optical cage. Part of the heat sink extends into the interior of the optical cage through the window and is in contact with the optical module to absorb heat generated by the optical module.

[0004] Currently, as the power of the optical module becomes higher, the required heat dissipation efficiency of the optical module also becomes higher. SUMMARY

[0005] The present disclosure provides a board card and a network device. The first slot of the first optical cage of the board card is opened on both sides, and part of the structure of the first heat sink and the second heat sink extends into the interior of the first slot through the window on both sides of the first slot. In this way, the optical module in the first slot is in contact with the heat sink on both sides, the optical module dissipates heat on both sides, and the heat dissipation efficiency is higher. The technical solutions of the board card and the network device are described as follows.

[0006] In a first aspect, the present disclosure provides a board card. The board card includes a first circuit board, a first optical cage, a first heat sink, and a second heat sink. The first optical cage is fixed to the first circuit board. The first optical cage includes a plurality of first slots arranged in a layer. Each first slot includes a first window on the slot wall close to the first circuit board and a second window on the slot wall away from the first circuit board. The first heat sink is located on the side of the first optical cage close to the first circuit board, and part of the structure extends into the interior of the plurality of first slots through the plurality of first windows. The second heat sink includes a cold plate and a plurality of elastic heat-conducting components. The cold plate is located on the side of the first optical cage away from the first circuit board. One side of the plurality of elastic heat-conducting components is connected to the cold plate, and the other side extends into the interior of the plurality of first slots through the plurality of second windows. The elastic heat-conducting component can elastically stretch and contract relative to the plate surface of the cold plate.

[0007] In the first aspect, the first optical cage is one or more, and each first optical cage includes one or more first slots. For example, the first optical cage is a plurality, and each first optical cage includes two first slots or two first slots. Each first slot is used to accommodate an optical module.

[0008] The technical solution provided by the present disclosure is that the first window and the second window are respectively arranged on the two sides of the first slot, so that part of the structure of the first heat sink can extend into the interior of the first slot through the first window, and part of the structure of the second heat sink can extend into the interior of the first slot through the second window. In this way, the two sides of the optical module in the first slot are in contact with the heat sink, so that the optical module is double-sidedly cooled, that is, the heat of the optical module can be dissipated through the heat sink on the two sides. This improves the cooling efficiency of the optical module, and further reduces the failure rate of the optical module.

[0009] In addition, the second heat sink comprises a common cold plate and a plurality of elastic heat conduction components, and the plurality of elastic heat conduction components extend into the interiors of the plurality of first slots, so that in the process of inserting each optical module into each first slot, each optical module can compress the corresponding elastic heat conduction component, so that each optical module is smoothly inserted into the interior of the corresponding first slot, avoiding the interference between the optical module and the elastic heat conduction component, so that the optical module cannot be smoothly inserted. The above design enables the optical modules in the plurality of first slots to be cooled by a common cold plate, so that the cold plate can also function as a temperature equalizer for the plurality of optical modules, avoiding the temperature of individual optical modules from being too high.

[0010] In addition, after the optical module is inserted into the first slot, the elastic heat conduction component can be in close contact with the optical module under the elastic force of the elastic heat conduction component, so that the heat transfer efficiency between the optical module and the elastic heat conduction component is high, and the cooling efficiency of the optical module is improved.

[0011] In an implementation manner, the cold plate is a wind-cooled cold plate or a liquid-cooled cold plate. The wind-cooled cold plate is provided with fins, and the liquid-cooled cold plate is provided with a refrigerant.

[0012] In an implementation manner, the cold plate comprises a plurality of limiting grooves, and the plurality of limiting grooves correspond to the plurality of elastic heat conduction components one by one. The elastic heat conduction component comprises a floating plate and at least one elastic heat conduction piece. Part of the floating plate is limited in the limiting groove, and the other part is located outside the limiting groove and extends into the interior of the first slot through the second window. The elastic heat conduction piece is located between the floating plate and the bottom of the limiting groove, and abuts against the floating plate and the bottom of the limiting groove, respectively. The elastic heat conduction piece is in a compressed state. The floating plate is used to contact the optical module. The heat generated by the optical module is first transferred to the floating plate and then transferred to the cold plate through the elastic heat conduction piece.

[0013] The technical scheme provided by the present disclosure is that, in the process of inserting the optical module into the first slot, the optical module contacts the floating plate and drives the floating plate to retract relative to the plate surface of the cold plate, so that the optical module can be smoothly inserted into the inside of the first slot. After the optical module is inserted into the first slot, the elastic heat conduction member is in a compressed state, and the elastic heat conduction member applies an elastic force to the floating plate, so that the floating plate is in close contact with the optical module, and the heat transfer efficiency between the optical module and the floating plate is high.

[0014] In addition, by arranging the limiting groove on the cold plate, part of the structure of the elastic heat conduction assembly is embedded in the cold plate. Compared with the non-embedded contact scheme, the technical scheme provided by the present disclosure shortens the distance between the elastic heat conduction assembly and the refrigerant (such as the cooling liquid in the liquid cooling pipe) in the cold plate, reduces the thermal resistance, and improves the heat transfer efficiency between the elastic heat conduction assembly and the cold plate.

[0015] In an implementation manner, the elastic heat conduction member is a plurality of elastic heat conduction members, and the plurality of elastic heat conduction members are arranged along the extension direction of the first slot. The extension direction of the first slot is the insertion direction of the optical module.

[0016] In an implementation manner, the limiting groove includes a receiving portion and a notch portion along the depth direction. The inner diameter of the notch portion is smaller than the inner diameter of the receiving portion, and two step surfaces are formed between the notch portion and the receiving portion. The floating plate includes a main body portion and two limiting portions, and the two limiting portions are located on both sides of the main body portion. The two limiting portions are located in the receiving portion and respectively opposite to the two step surfaces. The main body portion penetrates through the notch portion and extends into the inside of the first slot.

[0017] When the optical module is pulled out of the first slot, the floating plate will extend relative to the plate surface of the cold plate under the action of the elastic force of the elastic heat conduction member. Since the two limiting portions are located in the receiving portion and respectively opposite to the two step surfaces, when the floating plate extends to the limit position, the two limiting portions abut against the two step surfaces, so that the floating plate cannot be separated from the limiting groove.

[0018] In an implementation manner, when the first slot does not have the optical module, the two limiting portions of the floating plate abut against the two step surfaces respectively, and the elastic heat conduction member is in a compressed state. Under the action of the elastic force of the elastic heat conduction member, the two limiting portions are tightly combined with the two step surfaces, so that the floating plate does not shake randomly. When the first slot has the optical module, the two limiting portions of the floating plate are separated from the two step surfaces respectively, the elastic heat conduction member is further compressed, the elastic force is enhanced, and the floating plate is more tightly combined with the optical module.

[0019] In an implementation manner, the side of the floating plate facing the groove bottom of the limiting groove includes a receiving groove, and the elastic heat conduction member abuts against the cavity bottom of the receiving groove.

[0020] The technical scheme provided by the present disclosure increases the distance between the floating plate and the groove bottom of the limiting groove by arranging the accommodating groove on the floating plate, thereby providing sufficient accommodation space for the elastic heat-conducting member.

[0021] In an implementation manner, the groove bottom of the limiting groove comprises a protrusion, the protrusion is opposite to the accommodating groove, and the outer diameter of the protrusion is smaller than the inner diameter of the accommodating groove. The elastic heat-conducting member abuts against one side of the protrusion facing the accommodating groove. The protrusion and the side wall of the limiting groove form a groove therebetween, and the groove is used for accommodating the limiting part of the elastic heat-conducting member, so as to provide sufficient movement space for the floating plate.

[0022] In an implementation manner, the protrusion is opposite to the liquid cooling pipe in the cold plate. In this way, the arrangement of the protrusion can avoid that the plate walls on both sides of the liquid cooling pipe are too thin.

[0023] In an implementation manner, the groove bottom of the limiting groove comprises at least one first matching groove, and one side of the floating plate facing the groove bottom of the limiting groove comprises at least one second matching groove. The first matching groove and the second matching groove are opposite to each other. Each elastic heat-conducting member is located between one first matching groove and one second matching groove, and respectively abuts against the groove walls of the first matching groove and the second matching groove.

[0024] The technical scheme provided by the present disclosure increases the contact area of the elastic heat-conducting member and the cold plate, and the contact area of the elastic heat-conducting member and the floating plate by arranging the elastic heat-conducting member to abut against the first matching groove of the groove bottom of the limiting groove and the second matching groove of the floating plate, thereby improving the heat transfer efficiency between the floating plate and the elastic heat-conducting member and between the elastic heat-conducting member and the cold plate. Meanwhile, the first matching groove and the second matching groove can also limit the elastic heat-conducting member.

[0025] In an implementation manner, the elastic heat-conducting member comprises an elastic member and a heat-conducting member. The heat-conducting member covers the elastic member, and the heat-conducting member abuts against the floating plate and the groove bottom of the limiting groove. The heat-conducting capacity of the heat-conducting member is greater than the heat-conducting capacity of the elastic member, and the elastic force of the elastic member is greater than the elastic force of the heat-conducting member.

[0026] The technical scheme provided by the present disclosure has the following advantages. On the one hand, the heat-conducting member covers the elastic member, so that the heat on the floating plate can be efficiently transferred to the cold plate through the heat-conducting member. On the other hand, the elastic member drives the heat-conducting member to tightly contact the floating plate and the groove bottom of the limiting groove, and also drives the floating plate to tightly contact the optical module, thereby improving the heat transfer efficiency between the optical module and the floating plate, between the floating plate and the heat-conducting member, and between the heat-conducting member and the cold plate.

[0027] In an implementation manner, the elastic member is an elastic spring sheet, and the extension direction of the elastic spring sheet intersects with the floating plate and the groove bottom of the limiting groove. In this way, the elastic spring sheet can apply an elastic force to the floating plate to make the floating plate extend outward from the limiting groove.

[0028] In an implementation manner, the heat-conducting member comprises a cylindrical structure, two end walls of the cylindrical structure are open, and the side walls of the cylindrical structure abut against the floating plate and the groove bottom of the limiting groove respectively. The elastic member is located inside the cylindrical structure and abuts against the side walls of the cylindrical structure. The cylindrical structure can be formed by winding a film structure around the elastic member. The film structure can be wound in one layer or multiple layers.

[0029] In an implementation manner, the material of the elastic member comprises beryllium copper alloy, tin phosphorus alloy, phosphor bronze, stainless steel or copper titanium alloy.

[0030] In an implementation manner, the material of the heat-conducting member comprises graphene, carbon-based heat-conducting pad, silicon-based heat-conducting pad or carbon fiber.

[0031] In an implementation manner, the first circuit board comprises a plurality of first openings, the plurality of first openings are in communication with the first windows of the plurality of first slots respectively. The first heat sink is located on the side of the first circuit board away from the first optical cage, and part of the structure of the first heat sink extends into the interior of the plurality of first slots through the plurality of first openings and the plurality of first windows.

[0032] The technical scheme provided by the present disclosure has the following advantages. On the one hand, by arranging the first heat sink on the side of the first circuit board away from the first optical cage, the interference of the first heat sink with the fixing of the first optical cage on the first circuit board is small, and the fixing of the first optical cage on the first circuit board is facilitated. On the other hand, by arranging the first openings on the first circuit board, part of the structure of the first heat sink can still extend into the interior of the first slots through the first openings and the first windows.

[0033] In an implementation manner, the first heat sink comprises a plurality of air-cooled heat sinks, and the plurality of air-cooled heat sinks correspond to the plurality of first slots one by one. The air-cooled heat sink comprises a base plate, fins and a boss, the fins and the boss are arranged on the two sides of the base plate, the fins are located outside the first slots, and the boss extends into the interior of the first slots through the first openings and the first windows. In this way, the air-cooled heat sink that is attached to the first circuit board is independent, rather than a heat sink comprising a common cold plate, which can avoid the interference between the common cold plate and the devices and structures on the circuit board, and simplify the manufacturing difficulty of the board card.

[0034] In an implementation manner, the shell wall of the first optical cage close to the first circuit board comprises a plurality of pins and a plurality of buckle connecting feet, wherein the pins and the buckle connecting feet are arranged on the two sides of each first window. The pins penetrate through the first circuit board and are fixedly connected with the first circuit board. The buckle connecting feet penetrate through the first circuit board, and part of the structure of the buckle connecting feet protrudes from the first circuit board. The air-cooled heat sink further comprises a plurality of buckles, each buckle is clamped with the buckle connecting feet on the two sides of the corresponding base plate to clamp the base plate between the buckle and the first circuit board.

[0035] The technical scheme provided by the present disclosure achieves the fixation of the air-cooled heat sink and the optical cage in the case that the optical cage and the air-cooled heat sink have the circuit board therebetween, by arranging the first optical cage to have the buckle connecting leg on the shell wall close to the first circuit board and arranging the buckle connecting leg to penetrate through the first circuit board.

[0036] In an implementation manner, the first heat sink includes a cold plate and a plurality of elastic heat-conducting components. One side of the plurality of elastic heat-conducting components of the first heat sink is connected with the cold plate of the first heat sink, and the other side thereof extends into the interior of the plurality of first slots through the plurality of first openings and the plurality of first windows. In this way, the two sides of the optical module in the first slot are both heat-dissipated through the cold plate, and when the cold plate is a liquid-cooled cold plate, the two sides of the optical module are both liquid-cooled heat-dissipated, and the heat-dissipation efficiency of the optical module is higher.

[0037] In an implementation manner, the board card further includes a second circuit board, a second optical cage and a third heat sink. The second circuit board is arranged opposite to the first circuit board. The first optical cage is fixed to the side of the first circuit board facing the second circuit board, and the second optical cage is fixed to the side of the second circuit board facing the first circuit board. The second optical cage includes a plurality of second slots arranged in one layer. Each second slot includes a third window on the slot wall close to the second circuit board and a fourth window on the slot wall away from the second circuit board. The second heat sink includes a plurality of elastic heat-conducting components, which are divided into two groups. One group of elastic heat-conducting components extends into the interior of the plurality of first slots through the plurality of second windows, and the other group of elastic heat-conducting components extends into the interior of the plurality of second slots through the plurality of fourth windows. The third heat sink is located on the side of the second optical cage close to the second circuit board, and part of the structure of the third heat sink extends into the interior of the plurality of second slots through the plurality of third windows.

[0038] In the implementation manner, the second optical cage is one or more, and each second optical cage includes one or more second slots. For example, the second optical cage is a plurality, and each second optical cage includes two second slots or four second slots. Each second slot is used for accommodating one optical module.

[0039] The technical scheme provided by the present disclosure achieves the fixation of the air-cooled heat sink and the optical cage in the case that the optical cage and the air-cooled heat sink have the circuit board therebetween, by arranging the first optical cage to have the buckle connecting leg on the shell wall close to the first circuit board and arranging the buckle connecting leg to penetrate through the first circuit board.

[0040] Further, by arranging the second heat sink to include a cold plate and two sets of elastic heat-conducting components, and arranging the two sets of elastic heat-conducting components to respectively extend into the interiors of the first slot and the second slot, the cold plate can be shared by the optical modules in the first slot and the second slot. In this way, on the one hand, the cold plate can play a role in temperature equalization for the optical modules in the first slot and the second slot, reducing the possibility of excessively high temperature of individual optical modules. On the other hand, the double-sided heat dissipation of the double-layer optical module only requires three layers of heat sinks, instead of four layers of heat sinks, reducing the number of heat sinks required by the board card and lowering the cost.

[0041] In an implementation manner, the second circuit board includes a plurality of second openings in one-to-one communication with the third openings of the plurality of second slots. The third heat sink is located on a side of the second circuit board away from the second optical cage. Part of the structure of the third heat sink extends into the interior of the second slot through the plurality of second openings and the plurality of third openings.

[0042] The technical solution provided by the present disclosure has the following advantages. On the one hand, by arranging the third heat sink on a side of the second circuit board away from the second optical cage, the third heat sink has less interference with the fixation of the second optical cage on the second circuit board, facilitating the fixation of the second optical cage on the second circuit board. On the other hand, by arranging the second openings on the second circuit board, part of the structure of the third heat sink can still extend into the interior of the second slot through the second openings and the third openings.

[0043] In an implementation manner, the first heat sink and the third heat sink each include a plurality of air-cooled heat sinks. The plurality of air-cooled heat sinks included in the first heat sink correspond to the plurality of first slots in one-to-one correspondence. The plurality of air-cooled heat sinks included in the third heat sink correspond to the plurality of second slots in one-to-one correspondence. In this way, the first circuit board and the second circuit board are attached to independent air-cooled heat sinks, instead of heat sinks including a common cold plate, which can avoid interference between the common cold plate and devices and structures on the circuit board, simplifying the manufacturing difficulty of the board card. In addition, one side of the optical modules in the first slot and the second slot is air-cooled, and the other side is liquid-cooled.

[0044] In an implementation manner, the first heat sink and the third heat sink each include a cold plate and a plurality of elastic heat-conducting components. One side of the plurality of elastic heat-conducting components of the first heat sink is connected to the cold plate of the first heat sink, and the other side extends into the interior of the plurality of first slots through the plurality of second openings. One side of the plurality of elastic heat-conducting components of the third heat sink is connected to the cold plate of the third heat sink, and the other side extends into the interior of the plurality of second slots through the plurality of fourth openings. In this way, both sides of the optical modules in the first slot and the second slot are cooled by the cold plate, and when the cold plate is a liquid-cooled cold plate, both sides of the optical modules are liquid-cooled, and the heat dissipation efficiency of the optical modules is higher.

[0045] In a second aspect, the present disclosure provides a network device. The network device comprises at least one board card as any one of the first aspect.

[0046] The board card can also be referred to as a single board. The network device can also be referred to as an information and communications technology (ICT) device. The network device can be a switch, a router, a server, etc.

[0047] In a third aspect, the present disclosure provides a heat sink. The heat sink comprises a cold plate and a plurality of elastic heat-conducting components. One side of the plurality of elastic heat-conducting components is connected to the cold plate. The elastic heat-conducting components can elastically stretch and contract relative to the plate surface of the cold plate.

[0048] In an implementation manner, the cold plate comprises a plurality of limiting grooves, and the plurality of limiting grooves correspond to the plurality of elastic heat-conducting components one by one. The elastic heat-conducting component comprises a floating plate and at least one elastic heat-conducting piece. A part of the floating plate is limited in the limiting groove, and another part is located outside the limiting groove. The elastic heat-conducting piece is located between the floating plate and the groove bottom of the limiting groove, and respectively abuts against the floating plate and the groove bottom of the limiting groove.

[0049] The related content about the elastic heat-conducting component and the cold plate can be referred to the related content in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0050] Figure 1 is a schematic diagram of a board card provided by an embodiment of the present disclosure;

[0051] Figure 2 is a schematic diagram of a board card provided by an embodiment of the present disclosure;

[0052] Figure 3 is an exploded view of a board card provided by an embodiment of the present disclosure;

[0053] Figure 4 is a front view of a board card provided by an embodiment of the present disclosure;

[0054] Figure 5 is a partial cross-sectional view of a board card provided by an embodiment of the present disclosure;

[0055] Figure 6 is a partial cross-sectional view of a board card provided by an embodiment of the present disclosure;

[0056] Figure 7 is a schematic diagram of a liquid cooling heat sink provided by an embodiment of the present disclosure;

[0057] Figure 8 is a schematic diagram of a cold plate, a liquid cooling pipe and an elastic heat-conducting component provided by an embodiment of the present disclosure;

[0058] Figure 9 is an exploded view of a liquid cooling radiator provided by an embodiment of the present disclosure;

[0059] Figure 10 is a sectional view of a liquid cooling radiator provided by an embodiment of the present disclosure;

[0060] Figure 11 is a sectional view of a liquid cooling radiator provided by an embodiment of the present disclosure;

[0061] Figure 12 is a sectional view of a cold plate, a floating plate and a liquid cooling pipe provided by an embodiment of the present disclosure;

[0062] Figure 13 is a schematic view of an elastic heat-conducting member provided by an embodiment of the present disclosure;

[0063] Figure 14 is a schematic view of another elastic heat-conducting member provided by an embodiment of the present disclosure;

[0064] Figure 15 is a schematic view of a light cage provided by an embodiment of the present disclosure;

[0065] Figure 16 is a schematic view of a mounting manner of a light cage on a circuit board provided by an embodiment of the present disclosure;

[0066] Figure 17 is a schematic view of a mounting manner of a light cage on a circuit board provided by an embodiment of the present disclosure;

[0067] Figure 18 is a schematic view of a board card provided by an embodiment of the present disclosure;

[0068] Figure 19 is a schematic view of a board card provided by an embodiment of the present disclosure;

[0069] Figure 20 is an exploded view of a board card provided by an embodiment of the present disclosure;

[0070] Figure 21 is a front view of a board card provided by an embodiment of the present disclosure;

[0071] Figure 22 is a partial sectional view of a board card provided by an embodiment of the present disclosure;

[0072] Figure 23 is a partial sectional view of a board card provided by an embodiment of the present disclosure;

[0073] Figure 24 is a sectional view of a liquid cooling radiator provided by an embodiment of the present disclosure;

[0074] Figure 25 is a schematic view of a board card provided by an embodiment of the present disclosure;

[0075] Figure 26 is a front view of a board card provided by an embodiment of the present disclosure;

[0076] Figure 27 is a front view of a board card provided by an embodiment of the present disclosure;

[0077] Figure 28 is a front view of a board card provided by an embodiment of the present disclosure.

[0078] Legend

[0079] 1, first circuit board, 11, first opening;

[0080] 2, first optical cage, 21, first slot, 22, first window, 23, second window, 24, pin, 25, buckle connecting leg;

[0081] 3, first heat sink;

[0082] 4, second heat sink;

[0083] 5, second circuit board, 51, second opening;

[0084] 6, second optical cage, 61, second slot, 62, third window, 63, fourth window;

[0085] 7, third heat sink;

[0086] 100, heat sink, 110, cold plate, 111, limiting groove, 1110, step surface, 1111, accommodating part, 1112, notch part, 1113, protrusion, 1114, first matching groove, 1115, groove, 120, elastic heat conduction assembly, 121, floating plate, 1211, main body part, 1212, limiting part, 1213, accommodating groove, 1214, second matching groove, 1215, first inclined surface, 122, elastic heat conduction piece, 1221, elastic piece, 1222, heat conduction piece, 130, liquid cooling pipe;

[0087] 200, air-cooled heat sink, 210, base plate, 220, fin, 230, boss, 231, second inclined surface, 240, buckle. DETAILED DESCRIPTION

[0088] An information and communications technology (ICT) device (such as a switch) is provided with a board card, which includes a circuit board and an optical cage provided on the circuit board. The optical cage has a slot, and a connector is provided in the slot and electrically connected to an electrical device (such as a chip) on the circuit board. The slot is used for inserting an optical module so that the optical module is mated with the connector, and then the board card can communicate with other devices through the optical module. The ICT device can also be referred to as a network device, and the board card can also be referred to as a single board.

[0089] When the optical module is working, a large amount of heat will be emitted, and the higher the temperature of the optical module, the higher the failure rate of the optical module. Therefore, in order to reduce the failure rate of the optical module, the temperature of the optical module needs to be reduced.

[0090] In order to dissipate heat from the optical module, the related art opens a window in the top wall of the optical cage and adds a heat sink to the top wall of the optical cage. Part of the heat sink extends into the interior of the slot of the optical cage through the window and is in contact with the optical module to absorb the heat generated by the optical module. However, as the power of the optical module becomes higher and higher, the heat dissipation capacity required by the optical module also becomes higher and higher, and the heat dissipation method in the related art cannot meet the heat dissipation requirements of the high-power optical module.

[0091] In view of the above technical problems, the embodiments of the present disclosure provide a new type of board card. As shown in Figures 1-4 the board card includes a first circuit board 1, a first optical cage 2, a first heat sink 3, and a second heat sink 4. The first optical cage 2 is fixed to the first circuit board 1. The first optical cage 2 includes a plurality of first slots 21 arranged in a layer. As shown in Figure 3 each first slot 21 includes a first window 22 near the slot wall of the first circuit board 1 and a second window 23 away from the slot wall of the first circuit board 1. As shown in Figures 4-6 the first heat sink 3 is located on the side of the first optical cage 2 close to the first circuit board 1, and part of the structure (such as a boss 230) extends into the interior of the plurality of first slots 21 through the plurality of first windows 22. As shown in Figures 4-7 the second heat sink 4 includes a cold plate 110 and a plurality of elastic heat-conducting components 120. The cold plate 110 is located on the side of the first optical cage 2 away from the first circuit board 1, one side of the plurality of elastic heat-conducting components 120 is connected to the cold plate 110, and the other side extends into the interior of the plurality of first slots 21 through the plurality of second windows 23. The elastic heat-conducting components 120 can elastically stretch and contract relative to the plate surface of the cold plate 110.

[0092] The first circuit board 1 can be a printed circuit board (PCB). The first optical cage 2 is one or more, and each first optical cage 2 includes one or more first slots 21. For example, as shown in Figures 1-4 each first optical cage 2 includes two first slots 21. For another example, as shown in Figure 15 each first optical cage 2 includes four first slots 21. Each first slot 21 is used to accommodate an optical module. The inside of the first slot 21 is provided with a connector, which is electrically connected to the electrical device on the first circuit board 1. When the optical module is inserted into the first slot 21, the optical module is docked with the connector, and then the board card can communicate with other devices through the optical module.

[0093] The technical scheme provided by the embodiments of the present disclosure is that the first window 22 and the second window 23 are respectively arranged on the two sides of the first slot 21, so that part of the structure of the first heat sink 3 can extend into the inside of the first slot 21 through the first window 22, and part of the structure of the second heat sink 4 can extend into the inside of the first slot 21 through the second window 23. In this way, after the optical module is inserted into the first slot 21, the two sides of the optical module are in contact with the first heat sink 3 and the second heat sink 4 respectively, so that the optical module is double-sided heat dissipation, the heat dissipation efficiency of the optical module is higher, and the failure rate is lower.

[0094] In addition, by arranging the second heat sink 4 to include a common cold plate 110 and a plurality of elastic heat conduction components 120, and arranging the plurality of elastic heat conduction components 120 to extend into the inside of the plurality of first slots 21, in the process of inserting each optical module into each first slot 21, the optical module can press the corresponding elastic heat conduction component 120, so that the elastic heat conduction component 120 is retracted relative to the plate surface of the cold plate 110, and then the optical module can be smoothly inserted into the inside of the corresponding first slot 21. It can be understood that the design of the plurality of elastic heat conduction components 120 allows the plurality of optical modules to share one cold plate 110 for heat dissipation, and the optical modules cannot be inserted into the inside of the first slot 21 due to interference with the elastic heat conduction component 120. In addition, the cold plate 110 can uniform the temperature of the optical modules in the plurality of first slots 21, avoiding the temperature of individual optical modules being too high.

[0095] In addition, after the optical module is inserted into the first slot 21, the elastic heat conduction component 120 can be in close contact with the optical module under the elastic force of the elastic heat conduction component 120, so that the heat transfer efficiency between the optical module and the elastic heat conduction component 120 is higher, thereby improving the heat dissipation efficiency of the optical module and reducing the failure rate of the optical module.

[0096] The type of the cold plate 110 is not limited in the embodiments of the present disclosure. In some examples, as shown in Figure 7 andFigure 8 As shown, the cold plate 110 is a liquid-cooled cold plate. Inside the cold plate 110 flows a coolant, which circulates to continuously take away the heat transferred to the cold plate 110. In some examples, as shown in FIG. 1B, the cold plate 110 includes a liquid-cooled tube 130, which has a cooling liquid (i.e., the coolant) flowing therein. The heat transferred to the cold plate 110 via the elastic heat-conductive assembly 120 is continuously taken away by the cooling liquid in the liquid-cooled tube 130. Figure 8 As shown, the inside of the cold plate 110 includes a liquid-cooled tube 130, which has a cooling liquid (i.e., the coolant) flowing therein. The heat transferred to the cold plate 110 via the elastic heat-conductive assembly 120 is continuously taken away by the cooling liquid in the liquid-cooled tube 130. In some examples, as shown in FIG. 1B, the cold plate 110 includes a liquid-cooled tube 130, which has a cooling liquid (i.e., the coolant) flowing therein. The heat transferred to the cold plate 110 via the elastic heat-conductive assembly 120 is continuously taken away by the cooling liquid in the liquid-cooled tube 130. Figure 8 As shown, in the projection view along the direction perpendicular to the plate surface of the cold plate 110, the elastic heat-conductive assembly 120 partially overlaps with the liquid-cooled tube 130. In this way, the heat of the elastic heat-conductive assembly 120 is transferred to the cooling liquid in the liquid-cooled tube 130.

[0097] In other examples, the cold plate 110 is an air-cooled cold plate, which is provided with fins for air cooling. In this case, the cold plate 110 is not shown in the figures.

[0098] Next, the implementation of the elastic heat-conductive assembly 120 is described by way of example.

[0099] In some examples, as shown in FIG. 1B, the cold plate 110 includes a plurality of limiting grooves 111 (only one is shown in the figure), which correspond to the plurality of elastic heat-conductive assemblies 120. The elastic heat-conductive assembly 120 includes a floating plate 121 and at least one elastic heat-conductive piece 122. A part of the floating plate 121 is limited in the limiting groove 111, and another part is located outside the limiting groove 111 and extends into the inside of the first slot 21 through the second window 23. The elastic heat-conductive piece 122 is located between the floating plate 121 and the bottom of the limiting groove 111, and abuts against the floating plate 121 and the bottom of the limiting groove 111, respectively. Figures 9-11 As shown, the cold plate 110 includes a plurality of limiting grooves 111 (only one is shown in the figure), which correspond to the plurality of elastic heat-conductive assemblies 120. The elastic heat-conductive assembly 120 includes a floating plate 121 and at least one elastic heat-conductive piece 122. A part of the floating plate 121 is limited in the limiting groove 111, and another part is located outside the limiting groove 111 and extends into the inside of the first slot 21 through the second window 23. The elastic heat-conductive piece 122 is located between the floating plate 121 and the bottom of the limiting groove 111, and abuts against the floating plate 121 and the bottom of the limiting groove 111, respectively.

[0100] The floating plate 121 is used to contact the optical module. The heat generated by the optical module is first transferred to the floating plate 121, and then transferred to the cold plate 110 via the elastic heat-conductive piece 122. The elastic heat-conductive piece 122 is used to drive the floating plate 121 to move to the outside of the limiting groove 111, so that the floating plate 121 can elastically stretch and contract relative to the plate surface of the cold plate 110.

[0101] In the process that the optical module is inserted into the first slot 21, the optical module contacts the floating plate 121 and drives the floating plate 121 to retract relative to the plate surface of the cold plate 110, so that the optical module can be smoothly inserted into the inside of the first slot 21. After the optical module is inserted into the first slot 21, the elastic heat-conducting member 122 is compressed, the elastic heat-conducting member 122 applies an elastic force to the floating plate 121, so that the floating plate 121 is in close contact with the optical module, and the heat transfer efficiency between the optical module and the floating plate 121 is high.

[0102] In addition, by arranging the limiting groove 111 on the cold plate 110, part of the structure of the elastic heat-conducting assembly 120 is embedded in the cold plate 110, compared with the contact scheme without embedding, the technical scheme provided by the embodiment of the present disclosure shortens the distance between the elastic heat-conducting assembly 120 and the refrigerant (such as the cooling liquid in the liquid cooling pipe 130), reduces the thermal resistance, and improves the heat transfer efficiency between the elastic heat-conducting assembly 120 and the cold plate 110.

[0103] In some examples, as shown in Figure 6 The face of the floating plate 121 towards the slot opening of the first slot 21 is a first inclined surface 1215, which is used to contact the optical module to enable the optical module to smoothly drive the floating plate 121 to retract.

[0104] In some examples, as shown in Figure 11 The limiting groove 111 includes an accommodating portion 1111 and a slot opening portion 1112 along the depth direction, the inner diameter of the slot opening portion 1112 is smaller than that of the accommodating portion 1111, and two step surfaces 1110 are formed between the slot opening portion 1112 and the accommodating portion 1111. As shown in Figure 9 and Figure 11 The floating plate 121 includes a main body portion 1211 and two limiting portions 1212, and the two limiting portions 1212 are located on both sides of the main body portion 1211. As shown in Figure 11 The two limiting portions 1212 are located in the accommodating portion 1111 and respectively opposite to the two step surfaces 1110. The main body portion 1211 penetrates through the slot opening portion 1112 and extends into the inside of the first slot 21.

[0105] When the optical module is pulled out of the first slot 21, the floating plate 121 extends relative to the plate surface of the cold plate 110 under the elastic force of the elastic heat-conducting member 122. Since the two limiting portions 1212 are located in the accommodating portion 1111 and respectively opposite to the two step surfaces 1110, when the floating plate 121 extends to the limit position, the two limiting portions 1212 abut against the two step surfaces 1110, so that the floating plate 121 cannot be separated from the limiting groove 111.

[0106] In some examples, when there is no optical module in the first slot 21, the two limiting portions 1212 of the floating plate 121 abut against the two step faces 1110 respectively, and the elastic heat-conducting member 122 is in a compressed state. In this way, under the elastic force of the elastic heat-conducting member 122, the two limiting portions 1212 are tightly attached to the two step faces 1110, so that the floating plate 121 cannot shake at will. When there is an optical module in the first slot 21, the two limiting portions 1212 of the floating plate 121 are separated from the two step faces 1110 respectively, the elastic heat-conducting member 122 is further compressed, and the elastic force of the elastic heat-conducting member 122 is enhanced, so that the floating plate 121 can be more tightly attached to the optical module.

[0107] The present embodiment does not limit the implementation of the notch portion 1112. In some examples, the second heat sink 4 further includes a blocking member, which is fixedly connected with the cold plate 110 and partially extends into the limiting groove 111. The portion of the blocking member above the groove bottom of the limiting groove 111 has the step face 1110. The blocking member can be a baffle or a screw.

[0108] In some examples, as shown in Figures 10-12 the side of the floating plate 121 facing the groove bottom of the limiting groove 111 includes a receiving groove 1213, and the elastic heat-conducting member 122 abuts against the cavity bottom of the receiving groove 1213. By providing the receiving groove 1213 on the floating plate 121, the spacing between the floating plate 121 and the groove bottom of the limiting groove 111 is increased, and sufficient space is provided for the elastic heat-conducting member 122. In this way, the volume of the elastic heat-conducting member 122 can be larger, which facilitates the manufacture of the elastic heat-conducting member 122.

[0109] In some examples, as shown in Figures 10-12 the groove bottom of the limiting groove 111 includes a protrusion 1113 opposite to the receiving groove 1213, and the outer diameter of the protrusion 1113 is smaller than the inner diameter of the receiving groove 1213. At least one elastic heat-conducting member 122 abuts against the side of the protrusion 1113 facing the receiving groove 1213. The protrusion 1113 and the side wall of the limiting groove 111 form a groove 1115 therebetween, and the groove 1115 is opposite to the two limiting portions 1212 of the floating plate 121 to provide sufficient space for the limiting portions 1212.

[0110] In some examples, as shown in Figures 10-12 the protrusion 1113 is opposite to the space where the coolant is located (such as the liquid cooling pipe 130). In this way, the setting of the protrusion 1113 can avoid the thickness of the plate body on both sides of the coolant being too small. In some examples, the protrusion 1113 is formed after the groove 1115 is formed in the groove bottom of the limiting groove 111.

[0111] To improve the heat transfer efficiency between the elastic heat-conducting member 122 and the floating plate 121, in some examples, as shown in Figure 12 and Figure 11 , the groove bottom of the limiting groove 111 comprises at least one first matching groove 1114, and each elastic heat-conducting member 122 is in contact with the groove wall of the first matching groove 1114. In this way, the contact area between the elastic heat-conducting member 122 and the cold plate 110 is increased, thereby improving the heat transfer efficiency between the elastic heat-conducting member 122 and the cold plate 110. As shown in Figure 12 and Figure 13 , the shape of the first matching groove 1114 matches the shape of the part of the elastic heat-conducting member 122 that is in contact with the first matching groove 1114. For example, the cross section of the first matching groove 1114 is arc-shaped, and the cross section of the part of the elastic heat-conducting member 122 that is in contact with the first matching groove 1114 is also arc-shaped (as shown in Figure 13 . In addition, the first matching groove 1114 can also play a certain limiting role on the elastic heat-conducting member 122.

[0112] In some examples, as shown in Figure 12 and Figure 11 , the side of the floating plate 121 facing the groove bottom of the limiting groove 111 comprises at least one second matching groove 1214, and each elastic heat-conducting member 122 is in contact with the groove wall of the second matching groove 1214. In this way, the contact area between the elastic heat-conducting member 122 and the floating plate 121 is increased, thereby improving the heat transfer efficiency between the floating plate 121 and the elastic heat-conducting member 122. As shown in Figure 12 and Figure 13 , the shape of the second matching groove 1214 matches the shape of the part of the elastic heat-conducting member 122 that is in contact with the second matching groove 1214. For example, the cross section of the second matching groove 1214 is arc-shaped, and the cross section of the part of the elastic heat-conducting member 122 that is in contact with the second matching groove 1214 is also arc-shaped (as shown in Figure 13 . In addition, the second matching groove 1214 can also play a certain limiting role on the elastic heat-conducting member 122.

[0113] Among them, the above-mentioned first matching groove 1114 and second matching groove 1214 can exist simultaneously or alternatively. In some examples, as shown in Figure 12 , the first matching groove 1114 and the second matching groove 1214 exist simultaneously and are opposite to each other. As shown in Figure 11 , each elastic heat-conducting member 122 is located between one first matching groove 1114 and one second matching groove 1214, and is in contact with the groove wall of the first matching groove 1114 and the second matching groove 1214, respectively.

[0114] In some examples, as shown in Figure 12As shown, the first matching groove 1114 is located on the protrusion 1113 of the groove bottom of the limiting groove 111. The second matching groove 1214 is located on the cavity bottom of the accommodating groove 1213 of the floating plate 121.

[0115] In other examples, the groove bottom of the limiting groove 111 is not provided with the first matching groove 1114, and the floating plate 121 is not provided with the second matching groove 1214. That is, the groove bottom of the limiting groove 111 is a plane, and the surface of the floating plate 121 facing the groove bottom of the limiting groove 111 is a plane. In this way, the manufacturing difficulty of the cold plate 110 and the floating plate 121 can be simplified. For this case, as shown in Figure 14 As shown, the elastic heat-conducting member 122 is used for the surfaces of the floating plate 121 and the groove bottom of the limiting groove 111 that are in contact are both planes, so as to ensure a large enough contact area.

[0116] In some examples, as shown in Figures 9-11 As shown, the elastic heat-conducting member 122 is a plurality of. In this way, on the one hand, the plurality of elastic heat-conducting members 122 provide greater elastic force, so that the floating plate 121 can be in more closely contact with the optical module. On the other hand, the heat on the floating plate 121 can be more efficiently transmitted to the cold plate 110 through the plurality of elastic heat-conducting members 122.

[0117] In some examples, as shown in Figure 6 As shown, the plurality of elastic heat-conducting members 122 are arranged in sequence along the insertion direction of the optical module. Wherein, the insertion direction of the optical module is shown as the direction of the arrow in Figure 6 .

[0118] In some examples, as shown in Figure 13 and Figure 14 As shown, the elastic heat-conducting member 122 includes an elastic member 1221 and a heat-conducting member 1222, the heat-conducting member 1222 covers the elastic member 1221, and the heat-conducting member 1222 abuts against the floating plate 121 and the groove bottom of the limiting groove 111, respectively.

[0119] Wherein, since the heat-conducting member 1222 covers the elastic member 1221, and the heat-conducting member 1222 abuts against the floating plate 121 and the groove bottom of the limiting groove 111, respectively, the heat on the floating plate 121 can be efficiently transmitted to the groove bottom of the limiting groove 111 (that is, the cold plate 110) through the heat-conducting member 1222. On the other hand, the elastic member 1221 drives the heat-conducting member 1222 to be in close contact with the floating plate 121 and the groove bottom of the limiting groove 111, so as to also improve the transmission efficiency of the heat on the floating plate 121 to the cold plate 110.

[0120] In some examples, as shown in Figure 13 and Figure 14 As shown, the elastic member 1221 is an elastic spring sheet, and the extension direction of the elastic spring sheet intersects the floating plate 121 and the groove bottom of the limiting groove 111.

[0121] In some examples, as shown in Figure 13 the cross section of the elastic spring piece is S-shaped or Z-shaped. In other examples, as shown in Figure 14 the cross section of the elastic spring piece is π-shaped.

[0122] In other examples, the elastic piece 1221 is a compression spring.

[0123] In some examples, as shown in Figure 13 and Figure 14 the heat-conducting piece 1222 includes a cylindrical structure. Two end walls of the cylindrical structure are open, and the side wall of the cylindrical structure abuts against the floating plate 121 and the groove bottom of the limiting groove 111 respectively. The elastic piece 1221 is located inside the cylindrical structure and abuts against the side wall of the cylindrical structure. Among them, in some examples, the cylindrical structure is formed by winding a film structure, and the film structure can be wound by one or more layers. For example, as shown in Figure 13 and Figure 14 the film structure is two layers.

[0124] In other examples, the heat-conducting piece 1222 is a coating and is coated on the elastic piece 1221.

[0125] In some examples, the material of the elastic piece 1221 includes beryllium copper alloy, tin phosphorus alloy, phosphor bronze or copper titanium alloy. On the one hand, the elastic piece 1221 made of the above-mentioned materials has good elastic properties, so that the elastic heat-conducting piece 122 has good elastic properties. On the other hand, the elastic piece 1221 made of the above-mentioned materials also has good heat-conducting properties, which is conducive to the heat on the floating plate 121 being transferred to the cold plate 110 through the elastic heat-conducting piece 122.

[0126] In other examples, the material of the elastic piece 1221 can also be stainless steel, rubber, spring steel, spring copper or spring aluminum, etc.

[0127] In some examples, the material of the heat-conducting piece 1222 is thermal interface material (TIM), for example, including graphene, carbon-based heat-conducting pad, silicon-based heat-conducting pad or carbon fiber. Among them, the heat-conducting properties of the above-mentioned materials are good, which is conducive to the heat on the floating plate 121 being transferred to the cold plate 110 through the elastic heat-conducting piece 122.

[0128] Next, the setting position of the first heat sink 3 is exemplarily described.

[0129] In some examples, as shown in Figures 1-6As shown, the first heat sink 3 is located on the side of the first circuit board 1 facing away from the first optical cage 2. The first circuit board 1 comprises a plurality of first openings 11, and the plurality of first openings 11 are respectively in communication with the first windows 22 of the plurality of first slots 21. Part of the structure of the first heat sink 3 extends into the interior of the plurality of first slots 21 through the plurality of first openings 11 and the plurality of first windows 22.

[0130] In this way, on the one hand, since the first heat sink 3 is located on the side of the first circuit board 1 facing away from the first optical cage 2, the first heat sink 3 has less interference with the fixation of the first optical cage 2 on the first circuit board 1, which is conducive to the fixation of the first optical cage 2 on the first circuit board 1. On the other hand, by providing that the first circuit board 1 comprises a plurality of first openings 11, part of the structure of the first heat sink 3 can still extend into the interior of the first slots 21 through the first openings 11 and the first windows 22.

[0131] In some examples, as shown in Figure 15 and Figure 16 , the shell wall of the first optical cage 2 facing the first circuit board 1 comprises a plurality of pins 24, and the plurality of pins 24 penetrate through the first circuit board 1 and are fixedly connected with the first circuit board 1. For example, after the pin 24 penetrates through the first circuit board 1, it is bent on the side of the first circuit board 1 facing away from the first optical cage 2, so that the pin 24 cannot be pulled out of the first circuit board 1.

[0132] In some examples, as shown in Figure 15 and Figure 16 , the two sides of each first slot 21 are provided with pins 24. In this way, the fixation of the first optical cage 2 on the first circuit board 1 is more stable.

[0133] In some examples, as shown in Figures 1-4 , the first heat sink 3 comprises a plurality of air-cooled heat sinks 200, and the plurality of air-cooled heat sinks 200 correspond one-to-one to the plurality of first slots 21. As shown in Figures 4-6 , the air-cooled heat sink 200 comprises a base plate 210, fins 220 and bosses 230, and the fins 220 and the bosses 230 are arranged on the two sides of the base plate 210. The fins 220 are located outside the first slot 21, and the bosses 230 extend into the interior of the first slot 21 through the first opening 11 and the first window 22. Among them, the optical module inserted into the interior of the first slot 21 is in contact with the boss 230, and the heat generated by the optical module is first transmitted to the boss 230 and then transmitted to the fins 220 through the base plate 210. The fins 220 are generally arranged on the flow path of the wind blown by the fan, and the heat on the fins 220 is carried away by the wind.

[0134] The technical scheme provided by the embodiments of the present disclosure is that the first heat sink 3 includes a plurality of air-cooled heat sinks 200, so that the bottom surface of the optical module inserted into the first slot 21 is air-cooled and the top surface is liquid-cooled (in the case of a liquid-cooled cold plate 110). The bottom surface of the optical module is the surface opposite to the first circuit board 1, and the top surface of the optical module is opposite to the bottom surface.

[0135] In order to prevent the optical module from being unable to be inserted into the first slot 21 due to interference with the boss 230 during insertion into the first slot 21, in some examples, the air-cooled heat sink 200 is mounted on the first optical cage 2 or the first circuit board 1 by a buckle or a spring screw, so that the air-cooled heat sink 200 can be extended and retracted in the first window 22. In this way, during the insertion of the optical module into the first slot 21, the optical module will press the boss 230, so that the boss 230 moves outward of the first slot 21, and then the optical module can be smoothly inserted into the first slot 21. After the optical module is inserted into the first slot 21, the boss 230 will be in close contact with the optical module under the action of the buckle and the spring screw, so that the heat transfer efficiency between the optical module and the boss 230 is high, which is beneficial to improve the heat dissipation efficiency of the optical module.

[0136] In some examples, as shown in Figure 6 The face of the boss 230 towards the slot of the first slot 21 is a second inclined surface 231, which is used to contact the optical module during insertion to enable the optical module to press the boss 230 smoothly.

[0137] In some examples, in order to reduce the influence of the pin 24 on the fixation of the air-cooled heat sink 200 on the first circuit board 1, as shown in Figure 17 The pin 24 is arranged on both sides of the substrate 210 of the air-cooled heat sink 200, so that the substrate 210 can be well attached to the first circuit board 1 without contacting the pin 24.

[0138] In some examples, as shown in Figures 15-17 The shell wall of the first optical cage 2 close to the first circuit board 1 further includes a plurality of buckle connecting feet 25. The plurality of buckle connecting feet 25 penetrate the first circuit board 1, and part of the structure of the buckle connecting feet 25 protrudes from the first circuit board 1. As shown in Figure 17 The air-cooled heat sink 200 further includes a plurality of buckles 240, each of which is clamped with the buckle connecting feet 25 on both sides of the corresponding substrate 210 to clamp the substrate 210 between the buckle 240 and the first circuit board 1. In this way, the air-cooled heat sink 200 is fixed on the first optical cage 2 in the case that the first optical cage 2 and the air-cooled heat sink 200 have the first circuit board 1 therebetween.

[0139] In some examples, as shown in Figure 15 and Figure 16As shown, the two sides of each first slot 21 are provided with a buckle connecting leg 25.

[0140] In some examples, as shown in Figure 15 and Figure 16 The end of the buckle connecting leg 25 includes a hook structure for buckling with the buckle.

[0141] In addition to the technical solution that the first heat sink 3 includes a plurality of air-cooled heat sinks 200, in other examples, as shown in Figure 18 The first heat sink 3 includes a cold plate 110 and a plurality of elastic heat-conducting components 120, one side of the plurality of elastic heat-conducting components 120 of the first heat sink 3 is connected with the cold plate 110 of the first heat sink 3, and the other side extends into the inside of the plurality of first slots 21 through the plurality of first openings 11 and the plurality of first windows 22. In this way, the two sides of the optical module inserted into the first slot 21 are both liquid-cooled (for the case of the cold plate 110 being a liquid-cooled cold plate), and the heat dissipation efficiency of the optical module is higher.

[0142] In some examples, in order to avoid interference between the cold plate 110 of the first heat sink 3 and the pin 24, a gap is provided between the cold plate 110 and the first circuit board 1 to accommodate the pin 24. In addition, it can be understood that, since the first circuit board 1 is arranged between the cold plate 110 of the first heat sink 3 and the first optical cage 2, and no circuit board is arranged between the cold plate 110 of the second heat sink 4 and the first optical cage 2, the length of the elastic heat-conducting component 120 of the first heat sink 3 extending relative to the cold plate 110 is greater than the length of the elastic heat-conducting component 120 of the second heat sink 4 extending relative to the cold plate 110.

[0143] In addition to the technical solution that the first heat sink 3 is arranged on the side of the first circuit board 1 away from the first optical cage 2, and the first circuit board 1 includes a plurality of first openings 11, in some examples, the first heat sink 3 (in the case of the first heat sink 3 including a cold plate 110) is arranged between the first circuit board 1 and the first optical cage 2, and the pin 24 of the first optical cage 2 penetrates through the cold plate 110 before being fixedly connected with the first circuit board 1. In other examples, a common opening is arranged on the first circuit board 1, and the plurality of air-cooled heat sinks 200 of the first heat sink 3 penetrate through the common opening and are fixed on the first optical cage 2.

[0144] In some examples, as shown in Figures 19-23 and Figure 25 The board card further includes a second circuit board 5, a second optical cage 6, and a third heat sink 7. The second circuit board 5 is arranged opposite to the first circuit board 1, the first optical cage 2 is fixed on the side of the first circuit board 1 facing the second circuit board 5, and the second optical cage 6 is fixed on the side of the second circuit board 5 facing the first circuit board 1. As shown in Figure 20As shown, the second optical cage 6 includes a plurality of second slots 61 arranged in a layer. Each second slot 61 includes a third window 62 on the slot wall close to the second circuit board 5, and a fourth window 63 on the slot wall away from the second circuit board 5. As shown Figures 19-23 As shown, the second heat sink 4 is located between the first optical cage 2 and the second optical cage 6, and includes a cold plate 110 and two groups of elastic heat-conducting components 120 arranged on both sides of the cold plate 110. One group of elastic heat-conducting components 120 extends into the interior of the first slot 21 through the plurality of second windows 23, and the other group of elastic heat-conducting components 120 extends into the interior of the second slot 61 through the plurality of fourth windows 63. Figures 19-23 As shown, the third heat sink 7 is located on the side of the second circuit board 5 away from the second optical cage 6, and part of the structure of the third heat sink 7 extends into the interior of the second slot 61 through the plurality of third windows 62.

[0145] The second circuit board 5 can be the same type of circuit board as the first circuit board 1. The second optical cage 6 can be the same type of optical cage as the first optical cage 2. The related features and fixing methods of the second optical cage 6 can refer to the related content of the first optical cage 2, which will not be described here. The third heat sink 7 can be the same type of heat sink as the first heat sink 3.

[0146] The technical scheme provided by the embodiments of the present disclosure makes the two sides of the optical module inserted into the first slot 21 contact the first heat sink 3 and the second heat sink 4 respectively, and the two sides of the optical module inserted into the second slot 61 contact the second heat sink 4 and the third heat sink 7 respectively, so that the optical modules in the first slot 21 and the second slot 61 are both double-sided heat dissipation, and the heat dissipation efficiency of the optical module is higher.

[0147] Furthermore, by arranging the second heat sink 4 to include the cold plate 110 and the two groups of elastic heat-conducting components 120, and arranging the two groups of elastic heat-conducting components 120 to extend into the interiors of the first slot 21 and the second slot 61 respectively, the cold plate 110 can be shared by the optical modules in the first slot 21 and the second slot 61. In this way, on the one hand, the cold plate 110 can uniform the temperature of the optical modules in the first slot 21 and the second slot 61, avoiding the temperature of individual optical modules being too high. On the other hand, the double-sided heat dissipation of the double-layer optical module only needs three layers of heat sinks, instead of four layers of heat sinks, reducing the number of heat sinks required by the board card and reducing the cost.

[0148] In some examples, as shown Figure 24 As shown, the two plate surfaces of the cold plate 110 are each provided with a limiting groove 111, and part of the structure of the two groups of elastic heat-conducting components 120 is respectively limited in the limiting grooves 111 of the two plate surfaces of the cold plate 110. The limiting manner of the elastic heat-conducting component 120 in the limiting groove 111 can refer to the description of the limiting manner of the elastic heat-conducting component 120 in the limiting groove 111 in the first optical cage 2. Figure 24The foregoing related content is not repeated here.

[0149] In some examples, as shown in FIG. 1, the first heat sink 3 is located on the side of the first circuit board 2 away from the first optical cage 1. The first circuit board 2 includes a plurality of first openings 21, and the plurality of first openings 21 and the plurality of first slots 21 one-to-one communication. The part of the structure of the first heat sink 3 extends into the interior of the plurality of first slots 21 through the plurality of first openings 21 and the plurality of first windows 22. In this way, on the one hand, by setting the first heat sink 3 on the side of the first circuit board 2 away from the first optical cage 1, the first heat sink 3 is less likely to interfere with the fixation of the first optical cage 1 on the first circuit board 2, which is conducive to the fixation of the first optical cage 1 on the first circuit board 2. On the other hand, by setting the first circuit board 2 to include a plurality of first openings 21, the part of the structure of the first heat sink 3 can still extend into the interior of the plurality of first slots 21 through the plurality of first openings 21 and the plurality of first windows 22. Figure 24

[0150] Next, the setting position of the third heat sink 7 is exemplarily described.

[0151] In some examples, as shown in FIG. 1, the first heat sink 3 is located on the side of the first circuit board 2 away from the first optical cage 1. The first circuit board 2 includes a plurality of first openings 21, and the plurality of first openings 21 and the plurality of first slots 21 one-to-one communication. The part of the structure of the first heat sink 3 extends into the interior of the plurality of first slots 21 through the plurality of first openings 21 and the plurality of first windows 22. In this way, on the one hand, by setting the first heat sink 3 on the side of the first circuit board 2 away from the first optical cage 1, the first heat sink 3 is less likely to interfere with the fixation of the first optical cage 1 on the first circuit board 2, which is conducive to the fixation of the first optical cage 1 on the first circuit board 2. On the other hand, by setting the first circuit board 2 to include a plurality of first openings 21, the part of the structure of the first heat sink 3 can still extend into the interior of the plurality of first slots 21 through the plurality of first openings 21 and the plurality of first windows 22. Figure 20 In some examples, as shown in FIG. 1, the first heat sink 3 is located on the side of the first circuit board 2 away from the first optical cage 1. The first circuit board 2 includes a plurality of first openings 21, and the plurality of first openings 21 and the plurality of first slots 21 one-to-one communication. The part of the structure of the first heat sink 3 extends into the interior of the plurality of first slots 21 through the plurality of first openings 21 and the plurality of first windows 22. In this way, on the one hand, by setting the first heat sink 3 on the side of the first circuit board 2 away from the first optical cage 1, the first heat sink 3 is less likely to interfere with the fixation of the first optical cage 1 on the first circuit board 2, which is conducive to the fixation of the first optical cage 1 on the first circuit board 2. On the other hand, by setting the first circuit board 2 to include a plurality of first openings 21, the part of the structure of the first heat sink 3 can still extend into the interior of the plurality of first slots 21 through the plurality of first openings 21 and the plurality of first windows 22.

[0152] Figures 19-21 In some examples, as shown in FIG. 1, the first heat sink 3 and the third heat sink 7 each include a plurality of air-cooled heat sinks 200. The plurality of air-cooled heat sinks 200 included in the first heat sink 3 correspond to the plurality of first slots 21 one-to-one, and the plurality of air-cooled heat sinks 200 included in the third heat sink 7 correspond to the plurality of second slots 61 one-to-one. In this way, the bottom surface of the optical module inserted into the first slot 21 and the second slot 61 is air-cooled heat dissipation, and the top surface is liquid-cooled heat dissipation (in the case of the liquid-cooled cold plate 110).

[0153] In some examples, as shown in FIG. 1, the first heat sink 3 and the third heat sink 7 each include a cold plate 110 and a plurality of elastic heat-conducting components 120. One side of the plurality of elastic heat-conducting components 120 of the first heat sink 3 is connected to the cold plate 110 of the first heat sink 3, and the other side extends into the interior of the plurality of first slots 21 through the plurality of second windows 23. One side of the plurality of elastic heat-conducting components 120 of the third heat sink 7 is connected to the cold plate 110 of the third heat sink 7, and the other side extends into the interior of the plurality of second slots 61 through the plurality of fourth windows 24. In this way, both surfaces of the optical module inserted into the first slot 21 and the second slot 61 are liquid-cooled heat dissipation (in the case of the liquid-cooled cold plate 110), and the heat dissipation efficiency of the optical module is higher. Figure 25 Figure 26 In some examples, as shown in FIG. 1, the first heat sink 3 and the third heat sink 7 each include a cold plate 110 and a plurality of elastic heat-conducting components 120. One side of the plurality of elastic heat-conducting components 120 of the first heat sink 3 is connected to the cold plate 110 of the first heat sink 3, and the other side extends into the interior of the plurality of first slots 21 through the plurality of second windows 23. One side of the plurality of elastic heat-conducting components 120 of the third heat sink 7 is connected to the cold plate 110 of the third heat sink 7, and the other side extends into the interior of the plurality of second slots 61 through the plurality of fourth windows 24. In this way, both surfaces of the optical module inserted into the first slot 21 and the second slot 61 are liquid-cooled heat dissipation (in the case of the liquid-cooled cold plate 110), and the heat dissipation efficiency of the optical module is higher.

[0154] ​​​Besides the technical solution of placing the third heat sink 7 on the side of the second circuit board 5 facing away from the second optical cage 6 and setting the second circuit board 5 to include multiple second openings 51, in some examples, the third heat sink 7 (in the case where the third heat sink 7 includes a cold plate 110) is located between the second circuit board 5 and the second optical cage 6, and the pins 24 of the second optical cage 6 pass through the cold plate 110 before being fixedly connected to the second circuit board 5. In other examples, a common opening is provided on the second circuit board 5, through which multiple air-cooled heat sinks 200 of the third heat sink 7 pass and are fixed to the second optical cage 6.

[0155] In the case where the first radiator 3, the second radiator 4, and the third radiator 7 are all radiator 100, except... Figure 26 In addition to the arrangement shown, in other examples, such as Figure 27 As shown, the first heat sink 3 is located between the first circuit board 1 and the second circuit board 5. The first heat sink 3 includes a cold plate 110 and two sets of elastic heat-conducting components 120. One set of elastic heat-conducting components 120 extends into the interior of the first slot 21 through the first opening 11 and the first window 22. The other set of elastic heat-conducting components 120 extends into the interior of the second slot 61 through the second opening 51 and the third window 62. The second heat sink 4 includes a cold plate 110 and multiple elastic heat-conducting components 120, which extend into the interior of the first slot 21 through multiple second windows 23. The third heat sink 7 includes a cold plate 110 and multiple elastic heat-conducting components 120, which extend into the interior of the second slot 61 through multiple fourth windows 63.

[0156] In some examples, such as Figure 28 As shown, the board also includes multiple layers of optical cage and heatsink 100. Among them, in Figure 28 In the board shown, Figure 26 The board unit shown and Figure 27 The board units shown are used alternately. Figure 28 The part enclosed by the solid line is Figure 26 The board unit shown, Figure 28 The part enclosed in the dashed box is Figure 27 The board unit shown.

[0157] This disclosure also provides a network device. The network device includes one or more of the aforementioned boards. The network device may also be referred to as an ICT device. The network device includes switches, routers, and servers, etc.

[0158] This disclosure also provides a heat sink 100. For example... Figures 7-11As shown, the heat sink 100 includes a cold plate 110 and multiple flexible heat-conducting components 120. The multiple flexible heat-conducting components 120 are connected to the cold plate 110 and are capable of elastic expansion and contraction relative to the surface of the cold plate 110. The heat sink 100 can also be referred to as a liquid-cooled heat sink or a liquid-cooled plate. The heat sink 100 can be used in circuit boards for cooling optical modules, and can also be used in other fields.

[0159] In some examples, such as Figures 9-11 As shown, the cold plate 110 includes multiple limiting grooves 111, each corresponding to a multiple elastic heat-conducting components 120. Each elastic heat-conducting component 120 includes a floating plate 121 and an elastic heat-conducting element 122. A portion of the floating plate 121 is confined within the limiting groove 111, while another portion is located outside the limiting groove 111. The elastic heat-conducting element 122 is located between the bottom of the floating plate 121 and the limiting groove 111, and abuts against both the bottom of the floating plate 121 and the bottom of the limiting groove 111.

[0160] For details regarding the cold plate 110 and the flexible thermal conductive component 120, please refer to the aforementioned related content, which will not be repeated here.

[0161] The terminology used in the embodiments of this disclosure is for illustrative purposes only and is not intended to limit the scope of this disclosure. Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The above descriptions are merely optional embodiments of this disclosure and are not intended to limit the disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A board card, characterized by, The board card comprises a first circuit board (1), a first optical cage (2), a first heat sink (3) and a second heat sink (4); The first optical cage (2) is fixed to the first circuit board (1), and the first optical cage (2) comprises a plurality of first slots (21) arranged in a layer, each first slot (21) comprises a first window (22) on the slot wall close to the first circuit board (1) and a second window (23) on the slot wall away from the first circuit board (1); The first heat sink (3) is located on the side of the first optical cage (2) close to the first circuit board (1), and part of the structure extends into the interior of the plurality of first slots (21) through the plurality of first windows (22); The second heat sink (4) comprises a cold plate (110) and a plurality of elastic heat conduction components (120), the cold plate (110) is located on the side of the first optical cage (2) away from the first circuit board (1), one side of the plurality of elastic heat conduction components (120) is connected with the cold plate (110), and the other side extends into the interior of the plurality of first slots (21) through the plurality of second windows (23), wherein the elastic heat conduction component (120) can elastically stretch and contract relative to the plate surface of the cold plate (110).

2. The board card according to claim 1, characterized in that, The cold plate (110) comprises a plurality of limiting grooves (111) corresponding to the plurality of elastic heat conduction components (120), and the elastic heat conduction component (120) comprises a floating plate (121) and at least one elastic heat conduction piece (122); Part of the floating plate (121) is limited in the limiting groove (111), and the other part is located outside the limiting groove (111) and extends into the interior of the first slot (21) through the second window (23); The at least one elastic heat conduction piece (122) is located between the floating plate (121) and the groove bottom of the limiting groove (111) and abuts against the floating plate (121) and the groove bottom of the limiting groove (111) respectively.

3. The board card of claim 2, wherein, The limiting groove (111) comprises a containing part (1111) and a groove mouth part (1112) along the depth direction, the inner diameter of the groove mouth part (1112) is smaller than that of the containing part (1111), and two step faces (1110) are formed between the groove mouth part (1112) and the containing part (1111); The floating plate (121) comprises a main body part (1211) and two limiting parts (1212), and the two limiting parts (1212) are located on both sides of the main body part (1211); The two limiting parts (1212) are located in the containing part (1111) and respectively opposite to the two step faces (1110), and the main body part (1211) penetrates through the groove mouth part (1112) and extends into the interior of the first slot (21) through the second window (23).

4. The board card according to claim 2 or 3, characterized in that, The floating plate (121) comprises a containing groove (1213) on one side of the groove bottom of the limiting groove (111), and the at least one elastic heat-conducting piece (122) abuts against the cavity bottom of the containing groove (1213).

5. The board card of claim 4, wherein, The groove bottom of the limiting groove (111) comprises a protrusion (1113) opposite to the containing cavity (1213), and the outer diameter of the protrusion (1113) is smaller than the inner diameter of the containing cavity (1213). The at least one elastic heat-conducting piece (122) abuts against the protrusion (1113).

6. The board card according to any one of claims 2 to 5, characterized in that, The groove bottom of the limiting groove (111) comprises at least one first matching groove (1114), and one side of the floating plate (121) towards the groove bottom of the limiting groove (111) comprises at least one second matching groove (1214), and the first matching groove (1114) and the second matching groove (1214) are opposite to each other one by one. Each of the elastic heat-conducting pieces (122) is located between one first matching groove (1114) and one second matching groove (1214), and abuts against the groove wall of the first matching groove (1114) and the second matching groove (1214) respectively.

7. The board card according to any one of claims 2 to 6, characterized in that The elastic heat-conducting piece (122) comprises an elastic piece (1221) and a heat-conducting piece (1222). The heat-conducting piece (1222) covers the elastic piece (1221), and abuts against the groove bottom of the floating plate (121) and the limiting groove (111) respectively.

8. The board card of claim 7, wherein, The elastic piece (1221) is an elastic spring sheet, and the extension direction of the elastic spring sheet intersects with the floating plate (121) and the groove bottom of the limiting groove (111).

9. The board card according to claim 7 or 8, characterized in that, The heat-conducting piece (1222) comprises a cylindrical structure, two end walls of the cylindrical structure are open, and the side wall of the cylindrical structure abuts against the groove bottom of the floating plate (121) and the limiting groove (111) respectively. The elastic piece (1221) is located inside the cylindrical structure and abuts against the side wall of the cylindrical structure.

10. The board card according to any of claims 7-9, characterized in that, The material of the elastic piece (1221) comprises beryllium copper alloy, tin phosphorus alloy, phosphor bronze, stainless steel or copper titanium alloy.

11. The board card according to any of claims 7-10, characterized in that, The material of the heat-conducting piece (1222) comprises graphene, carbon-based heat-conducting pad, silicon-based heat-conducting pad or carbon fiber.

12. The board card according to any one of claims 1 to 11, characterized in that, The first circuit board (1) comprises a plurality of first openings (11), and the plurality of first openings (11) are in communication with the first windows (22) of the plurality of first insertion grooves (21) respectively. The first heat sink (3) is located on the side of the first circuit board (1) away from the first optical cage (2), and part of the structure extends into the interior of the plurality of first insertion grooves (21) through the plurality of first openings (11) and the plurality of first windows (22).

13. The board card of claim 12, wherein, The first heat sink (3) comprises a plurality of air-cooled heat sinks (200), and the plurality of air-cooled heat sinks (200) correspond to the plurality of first insertion grooves (21) one by one. The air-cooled radiator (200) comprises a base plate (210), fins (220) and bosses (230), the fins (220) and the bosses (230) are arranged on both sides of the base plate (210), the fins (220) are located outside the first slot (21), and the bosses (230) extend into the inside of the first slot (21) through the first opening (11) and the first window (22).

14. The board card of claim 13, wherein, The first optical cage (2) comprises a plurality of pins (24) and a plurality of buckle connecting pins (25) near the shell wall of the first circuit board (1), wherein the pins (24) and the buckle connecting pins (25) are arranged on both sides of each first window (22); The plurality of pins (24) penetrate the first circuit board (1) and are fixedly connected with the first circuit board (1), and the plurality of buckle connecting pins (25) penetrate the first circuit board (1), and part of the structure of the buckle connecting pin (25) protrudes from the first circuit board (1); The air-cooled radiator (200) further comprises a plurality of buckles (240), each buckle (240) is clamped with the buckle connecting pin (25) on both sides of the corresponding base plate (210) to clamp the base plate (210) between the buckle (240) and the first circuit board (1).

15. The board card of claim 12, wherein, The first radiator (3) comprises a cold plate (110) and a plurality of elastic heat-conducting components (120), one side of the plurality of elastic heat-conducting components (120) of the first radiator (3) is connected with the cold plate (110) of the first radiator (3), and the other side extends into the inside of the plurality of first slots (21) through the plurality of first openings (11) and the plurality of first windows (22).

16. The board card according to any of claims 1-15, characterized by The board card further comprises a second circuit board (5), a second optical cage (6) and a third radiator (7); The second circuit board (5) is arranged opposite to the first circuit board (1), the first optical cage (2) is fixed to one side of the first circuit board (1) facing the second circuit board (5), and the second optical cage (6) is fixed to one side of the second circuit board (5) facing the first circuit board (1); The second optical cage (6) comprises a plurality of second slots (61), the plurality of second slots (61) are arranged in one layer, each second slot (61) comprises a third window (62) near the slot wall of the second circuit board (5) and a fourth window (63) away from the slot wall of the second circuit board (5); The plurality of elastic heat-conducting components (120) of the second radiator (4) are divided into two groups, one group of elastic heat-conducting components (120) extends into the inside of the plurality of first slots (21) through the plurality of second windows (23), and the other group of elastic heat-conducting components (120) extends into the inside of the plurality of second slots (61) through the plurality of fourth windows (63). The third heat sink (7) is located on the side of the second optical cage (6) close to the second circuit board (5), and part of the structure of the third heat sink (7) extends into the second slot (61) through the third window (62).

17. The board card of claim 16, wherein, The second circuit board (5) includes a plurality of second openings (51), which are in one-to-one communication with the third window (62) of the second slot (61). The third heat sink (7) is located on the side of the second circuit board (5) away from the second optical cage (6), and part of the structure of the third heat sink (7) extends into the second slot (61) through the second opening (51) and the third window (62).

18. The board card according to claim 16 or 17, characterized in that The first heat sink (3) and the third heat sink (7) each include a plurality of air-cooled heat sinks (200), and the first heat sink (3) includes a plurality of air-cooled heat sinks (200) corresponding to the first slot (21), and the third heat sink (7) includes a plurality of air-cooled heat sinks (200) corresponding to the second slot (61).

19. The board card according to claim 16 or 17, characterized in that, The first heat sink (3) and the third heat sink (7) each include a cold plate (110) and a plurality of elastic heat-conducting components (120). One side of the plurality of elastic heat-conducting components (120) of the first heat sink (3) is connected to the cold plate (110) of the first heat sink (3), and the other side extends into the first slot (21) through the second window (23). One side of the plurality of elastic heat-conducting components (120) of the third heat sink (7) is connected to the cold plate (110) of the third heat sink (7), and the other side extends into the second slot (61) through the fourth window (24).

20. A network device, comprising: The network device includes the board card of any one of claims 1-19.

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