Automatic laminating equipment for circuit board

Abstract

The invention discloses automatic film covering equipment for a circuit board, relates to the technical field of circuit board printing and film covering, and solves the problems that a protective film on the circuit board in a conveying and transferring state is easy to deviate and even fall off due to vibration and the like, and the protective effect of the protective film on a circuit on the circuit board is influenced. The automatic laminating equipment for the circuit board comprises an equipment base, the control panel is mounted at the edge of the top of the equipment base; the pre-storage bracket is mounted on one side of the top of the equipment base and is positioned on one side of the back surface of the control panel; the alignment pre-storage structure is mounted at the top of the equipment base and located on the side face of the pre-storage support; and the automatic film covering and flat pressing structure is mounted at the top of the equipment base and is positioned on the side surfaces of the pre-storage bracket and the alignment pre-storage structure. According to the circuit board laminating machine, the operations of adhesion of a protective film, mounting and positioning of the circuit board, transferring of the laminated circuit board, conveying and moving of the laminated circuit board, downward pressing of the laminated circuit board and dust removal can be automatically achieved, and the efficiency of laminating the circuit board is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board printing film coating, in particular to a circuit board automatic film coating device. BACKGROUND

[0002] The circuit board is a kind of highly reliable and excellent flexible printed board made of polyimide or polyester film as base material, which has the characteristics of high wiring density, light weight, thin thickness and good bending property.

[0003] The circuit board film (protective film) is mainly used for protecting the circuit board from environmental, physical and chemical damage, and improving its insulation and durability. When actually coating, the cut protective film is generally attached to the circuit board to protect the circuit board.

[0004] However, the film coating device has the following defects in actual use: 1. When the existing film coating device is used to coat the circuit board, the cut protective film that meets the size of the circuit board is attached to the circuit board. At this time, the vacuum chuck adsorption method is generally used to attach the cut protective film to the circuit board, and the subsequent hot melting method is used to make the two closely attached. However, when the protective film is attached to the surface of the circuit board, the protective film on the circuit board is easily offset or even dropped due to vibration during transportation and transfer, which affects the protective effect of the protective film on the circuit. 2. After the existing film coating device is used to coat the circuit board, the coated circuit board needs to be moved to the subsequent device (such as hot melting device) for subsequent processing. At this time, the conveying and unloading device is generally used to transfer the circuit board. However, when the circuit board is conveyed, some dust is easily adhered to the circuit board and the protective film of the protective circuit board, which affects the adhesion effect of the two after hot melting, and may cause corrosion or signal interference of the circuit, affecting the stability of the circuit board. SUMMARY

[0005] The purpose of the present application is to provide a circuit board automatic film coating device to solve the problems in the background art.

[0006] To achieve the above-mentioned purpose of the application, the technical scheme is as follows: The application provides a circuit board automatic film covering equipment, which comprises an equipment base, a control panel installed at the top edge of the equipment base, a pre-storage support installed at one side of the top of the equipment base and located at the back of the control panel, an alignment pre-storage structure installed at the top of the equipment base and located at the side of the pre-storage support, The automatic film covering and pressing structure comprises a film conveying and adsorbing assembly installed at the top of the equipment base and located at the back of the alignment pre-storage structure, a conveying and discharging assembly arranged at the side of the film conveying and adsorbing assembly and installed at the other side of the top of the equipment base, a film pressing-down assembly installed at the tail of the conveying and discharging assembly and at the top of the equipment base, a rolling rod installed at the bottom of the film pressing-down assembly and rotationally connected to the inside of the film pressing-down assembly, and a surface cleaning assembly connected to the outside of the reciprocating screw rod through a ball and movably connected to the outside of the rolling rod.

[0007] As a preferred scheme of the application, the alignment pre-storage structure comprises an upper support installed at the top of the equipment base, a linear lifting module installed at the top of the upper support, a concave support installed at the top center of the linear lifting module, horizontal air cylinders installed at the top of the left and right sides of the upper support, and a horizontal pushing plate connected to the output end of the horizontal air cylinders and slidably connected to the top of the linear lifting module.

[0008] As a preferred scheme of the application, an intermediate protrusion is installed at the side center of the horizontal pushing plate, the intermediate protrusion is slidably connected to the top of the linear lifting module, and the side of the intermediate protrusion abuts against the circuit board, The linear lifting module drives the circuit board placed at the top to move up and down.

[0009] As a preferred scheme of the application, the film conveying and adsorbing assembly comprises a side support installed at the top of the equipment base, a horizontal sliding rail system installed at the side of the side support, a horizontal sliding seat installed at the side of the horizontal sliding rail system, a sliding seat installed at the side of the horizontal sliding seat and slidably connected to the side support through a screw, a vertical sliding rail system installed at the side of the sliding seat, a vertical sliding seat installed at the side of the vertical sliding rail system, and a bending rack installed at the side of the vertical sliding seat through a screw, The horizontal sliding rail system is provided with two horizontal sliding seats, one horizontal sliding seat is installed at the side of each horizontal sliding rail system.

[0010] As a preferred scheme of the present application, the bottom of the bending rack is fixedly provided with a lower metal plate through screw mounting, a guide rod is slidably connected to the inner corner of the lower metal plate, a lower connecting plate is mounted at the bottom of the guide rod below the lower metal plate, a plurality of vacuum suction cups are mounted at the bottom edge of the lower connecting plate, Wherein, the outer side of the guide rod is provided with a buffer spring connected to the top of the lower metal plate, and the bottom of the vacuum suction cup is fixedly provided with a circuit board and a protective film.

[0011] As a preferred scheme of the present application, the conveying and discharging assembly comprises: an assembly support mounted on the other side of the top of the equipment base; side assembly frames mounted on both sides of the top of the assembly support; a linear drive source mounted on one side of the side assembly frame; a transmission belt movably arranged on the side of the side assembly frame and connected to the output end of the linear drive source through a synchronous wheel; a drive shaft rod movably extended to the inside of the side assembly frame and connected to the inside of the transmission belt through a synchronous wheel; a conveying gear movably arranged in the inside of the side assembly frame and mounted on the outside of the conveying gear; a conveying belt movably arranged in the inside of the side assembly frame and meshingly connected to the outside of the conveying gear, Wherein, the side assembly frame and the conveying belt are both provided with two, and the conveying gear is provided with four.

[0012] As a preferred scheme of the present application, the top of the conveying belt is provided with a horizontal discharging plate movably arranged on the top of the side assembly frame, longitudinal slide rail systems are mounted on both sides of the top of the horizontal discharging plate, longitudinal sliding seats are mounted on the top of the longitudinal slide rail systems, L-shaped sliding blocks movably arranged on the top of the horizontal discharging plate are mounted on the top of the longitudinal sliding seats through screw mounting, Wherein, extrusion cylinders are mounted on the side surface of the L-shaped sliding block, L-shaped extrusion blocks are connected to the output end of the extrusion cylinders, and circuit boards are extrusion-fixed on the side surface of the L-shaped extrusion blocks.

[0013] As a preferred scheme of the present application, the film under-pressing assembly comprises: an I-shaped base mounted on the top of the equipment base; a T-shaped plate mounted on the top of the I-shaped base through screw mounting; an under-pressing slide rail system mounted on the side surface of the T-shaped plate; under-pressing sliding seats mounted on the side surface of the under-pressing slide rail system; a guide seat mounted between the two under-pressing sliding seats; a rotary drive source mounted on one side of the top of the guide seat; a first gear connected to the output end of the rotary drive source; a second gear meshingly connected to the bottom of the first gear and movably arranged on the inside of the guide seat; a third gear meshingly connected to the bottom of the second gear and movably arranged on the inside of the guide seat; an electrostatic dust collection roller movably arranged on the inside bottom of the guide seat and connected to the third gear, Wherein, rolling rods rotatably connected to the inside of the guide seat are mounted on the side surface of the second gear, and the rolling rods are arranged above the electrostatic dust collection roller.

[0014] As a preferred scheme of the present application, the surface cleaning assembly comprises: a lead screw slide connected outside the reciprocating lead screw through a ball; a cleaning roller mounted on the side of the lead screw slide, the cleaning roller being movably connected outside the rolling rod, Wherein, the outside of the rolling rod is provided with a plurality of cams, the cams being movably arranged inside the cleaning roller, and the cleaning roller having sufficient space inside for the movement of the cams. Compared with the prior art, the above one or more technical solutions have the following beneficial effects: 1. In the circuit board automatic film covering equipment, after the circuit board is covered with film, the protective film adhered to the circuit board can be automatically pressed and continuously rotated, so that the protective film adhered to the circuit board can be closely attached to the circuit board, reducing the probability of dislocation, deviation or even falling of the protective film when the circuit board is moved to subsequent processing equipment (hot melting equipment, etc.). At the same time, when the protective film on the circuit board is pressed and positioned, the electrostatic field generated on the pressed electrostatic dust roller can make the dust on the circuit board charged, realizing automatic adsorption and cleaning of the dust on the circuit board, and reducing the problem of subsequent circuit board processing quality caused by dust on the circuit board and the protective film. It should be noted that the present application can automatically realize the adhesion of the protective film, the installation and positioning of the circuit board, the transfer of the circuit board after film covering, the conveying and moving of the circuit board after film covering, and the pressing and dust removal of the circuit board after film covering, thereby improving the efficiency of film covering of the circuit board. 2. In the circuit board automatic film covering equipment, when the dust on the circuit board is adsorbed and the protective film on the circuit board is pressed and positioned, a plurality of annular electrostatic protrusions are arranged on the outer surface of the electrostatic dust roller. On the one hand, the uneven electrostatic dust roller can reduce the bubble and stripe defects of the protective film adhered to the circuit board, ensuring the flatness of the circuit board after film covering. On the other hand, the dust can move to the arc-shaped concave part, reducing the probability of dust sticking together when the dust on the circuit board is adsorbed, and reducing the probability of damaging the protective film when the electrostatic dust roller rotates to adhere to the protective film on the circuit board. 3. In the automatic film covering equipment for circuit board, when the static dust absorption roller is driven to rotate by the gear engagement transmission structure to press down and adhere the protective film on the circuit board, the gear engagement transmission structure can also drive the cleaning roller to move horizontally and reciprocally by the screw rod transmission mode to clean the dust on the static dust absorption roller after pressing down and dust absorption, so as to ensure that the surface of the static dust absorption roller is clean and reduce the probability of secondary pollution of the protective film on the circuit board. At the same time, the rolling rod driving the screw rod transmission structure to operate can also clean the dust adhered to the cleaning roller by driving the outer cam to rotate and operate, so as to protect the cleaning ability of the cleaning roller to the static dust absorption roller. 4. In the automatic film covering equipment for circuit board, when the circuit board after film covering is transported and unloaded, a plurality of L-shaped extrusion blocks moving horizontally and longitudinally can be used to install and position the circuit board and the protective film after adhesion is completed, so as to reduce the probability of misalignment and deviation of the circuit board when the circuit board is driven to move longitudinally for transportation and unloading. At the same time, by arranging the positioning sensor module (with the functions of pressure detection, infrared distance measurement and angle detection) at the bottom center of the placed circuit board, the circuit board for transportation and unloading can be accurately positioned, so as to realize the automatic film covering operation of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0015] The drawings constituting a part of the specification of the present application are used to provide a further understanding of the present application, and the illustrative embodiments of the present application and the description thereof are used to explain the present application, and do not constitute an improper limitation on the present application.

[0016] In addition, the terms "mounting", "arrangement", "provided with", "connected", "connected", "sleeved" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally configured; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0017] Figure 1 is a structural schematic diagram of the whole application; Figure 2 is a structural schematic diagram of the whole application from the side; Figure 3 is a structural schematic diagram of the whole application from the top; Figure 4 is a structural schematic diagram of the whole application from the front; Figure 5 is a structural schematic diagram of the alignment pre-storage structure of the present application; Figure 6 is a structural schematic diagram of the film covering, transporting and absorbing assembly of the present application; Figure 7 is the structure diagram of the connection between the sliding seat and the vacuum chuck of the present application; Figure 8 is the structure diagram of the conveying and unloading assembly of the present application; Figure 9 is the structure diagram of the connection between the horizontal unloading plate and the L-shaped extrusion block of the present application; Figure 10 is the structure diagram of the film under-pressing assembly of the present application; Figure 11 is the structure diagram of the film under-pressing assembly of the present application; Figure 10 is the structure diagram of the enlarged A area in the present application; Figure 12 is the structure diagram of the connection between the film under-pressing assembly and the surface cleaning assembly in the front view of the present application; Figure 13 is the structure diagram of the connection between the film under-pressing assembly and the surface cleaning assembly in the front view of the present application; Figure 14 is the structure diagram of the connection between the second gear and the surface cleaning assembly in the present application; In the figure: 10, equipment base; 20, control panel; 30, pre-storage support; 40, alignment pre-storage structure; 401, upper support; 402, linear lifting module; 403, concave support; 404, horizontal air cylinder; 405, horizontal pushing plate; 406, middle protruding block; 50, automatic film pressing structure; 501, film conveying and adsorbing assembly; 502, conveying and unloading assembly; 503, film under-pressing assembly; 504, rolling rod; 505, reciprocating screw rod; 506, surface cleaning assembly; 5011, side support; 5012, horizontal sliding rail system; 5013, horizontal sliding seat; 5014, sliding seat; 5015, vertical sliding rail system; 5016, vertical sliding seat; 5017, bending frame; 50171, lower metal plate; 50172, guide rod; 50173, lower connecting plate; 50174, vacuum chuck; 50175, buffer spring; 5021, assembly support; 5022, side assembly frame; 5023, linear driving source; 5024, transmission belt; 5025, driving shaft rod; 5026, conveying gear; 5027, conveying belt; 50271, horizontal unloading plate; 50272, longitudinal sliding rail system; 50273, longitudinal sliding seat; 50274, L-shaped sliding block; 50275, extrusion air cylinder; 50276, L-shaped extrusion block; 50277, positioning sensor module; 5031, T-shaped plate; 5032, T-shaped plate; 5033, downward sliding rail system; 5034, downward sliding seat; 5035, guide seat; 5036, rotary driving source; 5037, first gear; 5038, second gear; 5039, third gear; 50310, electrostatic dust roller; 5061, screw sliding seat; 5062, cleaning roller; 5063, cam; 60, electromagnetic module; 601, conductive module; 602, electrostatic protrusion. DETAILED DESCRIPTION

[0018] In order to make the personnel in the technical field better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person of ordinary skill in the art without making creative labor should belong to the protection scope of the present application. Embodiment one

[0019] Please refer to Figures 1-14 The automatic film covering equipment for circuit board comprises an equipment base 10, a control panel 20 installed at the top edge of the equipment base 10, a pre-storage support 30 installed at one side of the top of the equipment base 10 and located at the back of the control panel 20, an alignment pre-storage structure 40 installed at the top of the equipment base 10 and located at the side of the pre-storage support 30, and an automatic film covering flat pressing structure 50 installed at the top of the equipment base 10 and located at the side of the pre-storage support 30 and the alignment pre-storage structure 40. The automatic film covering flat pressing structure 50 comprises a film conveying and adsorbing assembly 501 installed at the top of the equipment base 10 and located at the back of the alignment pre-storage structure 40, a conveying and unloading assembly 502 arranged at the side of the film conveying and adsorbing assembly 501 and installed at the other side of the top of the equipment base 10, a film downward pressing assembly 503 installed at the outer side of the tail of the conveying and unloading assembly 502 and at the top of the equipment base 10, a rolling rod 504 installed at the bottom of the film downward pressing assembly 503 and rotationally connected in the film downward pressing assembly 503, and a surface cleaning assembly 506 connected with the rolling rod 504 through the ball bearing and movably connected with the rolling rod 504.

[0020] The working principle is as follows: when the circuit board is laminated for protection, the laminated circuit board is positioned on the top of the alignment pre-storage structure 40, the protective film for lamination is placed on the pre-storage support 30, and the protective film is automatically placed on the top of the circuit board in a manner of being adsorbed and fixed by the lamination conveying and adsorbing assembly 501, so that the lamination operation is realized (it should be noted that when the protective film is placed on the circuit board, the adhesive can be injected onto the circuit board by the glue injection equipment). Then, the circuit board after completing the lamination operation can be moved to the top of the conveying and unloading assembly 502 in a manner of being adsorbed and fixed by the lamination conveying and adsorbing assembly 501, and the conveying and unloading of the circuit board are realized by the conveying and unloading assembly 502. At this time, when the conveying and unloading assembly 502 conveys and unloads the circuit board, the protective film adhered to the circuit board can be positioned by the lamination pressing assembly 503, so that the protective film does not deviate, shake or even fall off during the conveying and moving of the circuit board, and the effect and quality of the subsequent processing of the laminated circuit board are ensured. At the same time, the operation of the lamination pressing assembly 503 can drive the rolling rod 504 and the reciprocating wire rod 505 to rotate, and the surface cleaning assembly 506 connected to the outer side of the reciprocating wire rod 505 is operated to clean the dust adsorbed on the lamination pressing assembly 503, so that the lamination pressing assembly 503 is always in a clean state when pressing the protective film and adsorbing the dust on the circuit board, and the circuit board is not easily polluted again (because of dust).

[0021] With reference to the specific description Figure 5 The alignment pre-storage structure 40 comprises: an upper support 401 mounted on the top of the equipment base 10; a straight line lifting module 402 mounted on the top of the upper support 401; a concave support 403 mounted at the top center of the straight line lifting module 402; a horizontal cylinder 404 mounted at the center of the top of the upper support 401 on the left and right sides; and a horizontal pushing plate 405 connected to the output end of the horizontal cylinder 404 and slidingly connected to the top of the straight line lifting module 402.

[0022] In the present application, an intermediate protrusion 406 is mounted at the side center of the horizontal pushing plate 405, the intermediate protrusion 406 is slidingly connected to the top of the straight line lifting module 402, and the side of the intermediate protrusion 406 abuts against the circuit board, wherein the straight line lifting module 402 drives the circuit board placed on the top to move up and down, In the present application, when the circuit board is laminated for protection, the circuit board is placed in the concave support 403, and the horizontal pushing plate 405 and the intermediate protrusion 406 connected to the output end of the horizontal cylinder 404 are driven to move horizontally by starting the operation of the horizontal cylinder 404, so that the circuit board mounted and positioned on the side of the intermediate protrusion 406 is pressed into the concave support 403, thereby improving the stability of the protective film during adhesion.

[0023] Need to explain, straight lifting module 402 can be operated, drive line board to move up and down, convenient film conveying and adsorbing assembly 501 to the adsorption and transfer of line board.

[0024] With reference to Figure 6 and Figure 7 , film conveying and adsorbing assembly 501 includes: side support 5011 installed on the top of equipment base 10; Horizontal slide rail system 5012 installed on the side of side support 5011; Horizontal slide 5013 installed on the side of horizontal slide rail system 5012; The sliding seat 5014 is installed on the side of the horizontal slide 5013 and is in sliding connection with the side support 5011; Vertical slide rail system 5015 installed on the side of sliding seat 5014; Vertical slide 5016 installed on the side of vertical slide rail system 5015; The bending machine frame 5017 is installed on the side of the vertical slide 5016 by screw, wherein the horizontal slide rail system 5012 is provided with two, and one horizontal slide 5013 is installed on the side of each horizontal slide rail system 5012.

[0025] In the line board automatic film coating equipment of the application, when the protective film is adhered and the line board is transferred, the horizontal movement of the bending machine frame 5017 and the bottom part equipment fixed for adsorbing the protective film and the line board can be driven by starting the horizontal slide rail system 5012 to operate, realizing the adjustment and transfer operation of the position of the protective film and the line board. The bending machine frame 5017 and the bottom part equipment fixed for adsorbing the protective film and the line board can be driven by starting the vertical slide rail system 5015 to operate, realizing the adjustment and transfer operation of the position of the protective film and the line board.

[0026] With reference to Figure 6 and Figure 7 , the bottom of the bending machine frame 5017 is fixed by screw and is provided with lower metal plate 50171, the inside angle of lower metal plate 50171 is slidingly connected with guide rod 50172, the bottom of guide rod 50172 is provided with lower connecting plate 50173 below lower metal plate 50171, the bottom edge of lower connecting plate 50173 is provided with a plurality of vacuum suction cups 50174, wherein the outside of guide rod 50172 is provided with buffer spring 50175 connected to the top of lower metal plate 50171, and the bottom of vacuum suction cup 50174 is adsorbed and fixed with line board and protective film.

[0027] In the automatic film laminating equipment for circuit board of the present application, when the protective film is adhered and the circuit board is transferred, the design of the plurality of vacuum cups 50174 can vacuum adsorb the plurality of positions of the protective film and the circuit board, ensuring the stability of the protective film and the circuit board during subsequent conveying and transferring. The design of the buffer spring 50175 can also buffer the protective film and the circuit board in the adhered and transferred state, reducing the probability of collision during the adhesion of the protective film and the transfer and installation of the circuit board, and being safe.

[0028] With particular reference to Figure 8 and Figure 9 The conveying and discharging assembly 502 comprises: an assembly support 5021 mounted on the other side of the top of the equipment base 10; side assembly frames 5022 mounted on both sides of the top of the assembly support 5021; a linear drive source 5023 mounted on one side of the side assembly frame 5022; a transmission belt 5024 connected to the output end of the linear drive source 5023 through a synchronous wheel and movably arranged on the side of the side assembly frame 5022; a drive shaft 5025 connected to the inside of the transmission belt 5024 through a synchronous wheel and movably extended into the inside of the side assembly frame 5022; a conveying gear 5026 mounted on the outside of the drive shaft 5025 and movably arranged in the inside of the side assembly frame 5022; and a conveying belt 5027 movably arranged in the inside of the side assembly frame 5022 and meshingly connected to the outside of the conveying gear 5026, wherein the side assembly frame 5022 and the conveying belt 5027 are both provided with two, and the conveying gear 5026 is provided with four.

[0029] In the automatic film laminating equipment for circuit board of the present application, when the protective film is adhered and the circuit board is transferred, the design of the plurality of vacuum cups 50174 can vacuum adsorb the plurality of positions of the protective film and the circuit board, ensuring the stability of the protective film and the circuit board during subsequent conveying and transferring. The design of the buffer spring 50175 can also buffer the protective film and the circuit board in the adhered and transferred state, reducing the probability of collision during the adhesion of the protective film and the transfer and installation of the circuit board, and being safe.

[0030] With particular reference to Figure 8 and Figure 9The top of the conveying belt 5027 is provided with a horizontal discharging plate 50271 movably arranged on the top of the side assembling frame 5022, the top of the horizontal discharging plate 50271 is provided with a longitudinal sliding rail system 50272 on both sides, the top of the longitudinal sliding rail system 50272 is provided with a longitudinal sliding seat 50273, the top of the longitudinal sliding seat 50273 is provided with an L-shaped sliding block 50274 movably arranged on the top of the horizontal discharging plate 50271, wherein the side surface of the L-shaped sliding block 50274 is provided with an extrusion air cylinder 50275, the output end of the extrusion air cylinder 50275 is connected with an L-shaped extrusion block 50276, and the side surface of the L-shaped extrusion block 50276 is extrusion-fixed with a circuit board.

[0031] It should be noted that the positioning sensor module 50277 is arranged at the middle position of the horizontal discharging plate 50271, and the positioning sensor module 50277 has the functions of pressure detection, infrared distance measurement and angle detection.

[0032] In the circuit board automatic laminating equipment, when the circuit board is placed on the top of the horizontal discharging plate 50271, the position and angle of the circuit board can be determined through the design of the positioning sensor module 50277. Then, through the determined position and angle, the longitudinal sliding rail system 50272 is started to work to drive the L-shaped extrusion block 50276 to move longitudinally. The extrusion air cylinder 50275 is started to work to drive the L-shaped extrusion block 50276 to move horizontally, so as to accurately position and extrude the circuit board and the protective film thereof.

[0033] Specifically refer to Figure 10 , Figure 11 , Figure 12 and Figure 13 , the laminating and pressing assembly 503 comprises a I-shaped base 5031 arranged on the top of the equipment base 10, a T-shaped plate 5032 arranged on the top of the I-shaped base 5031 through screwing, a pressing sliding rail system 5033 arranged on the side surface of the T-shaped plate 5032, a pressing sliding seat 5034 arranged on the side surface of the pressing sliding rail system 5033, a guide seat 5035 arranged between the two pressing sliding seats 5034, a rotary driving source 5036 arranged on one side of the top of the guide seat 5035, a first gear 5037 connected with the output end of the rotary driving source 5036, a second gear 5038 meshingly connected with the bottom of the first gear 5037 and movably arranged on the inner side of the guide seat 5035, a third gear 5039 meshingly connected with the bottom of the second gear 5038 and movably arranged on the inner side of the guide seat 5035, and an electrostatic dust collection roller 50310 connected with the third gear 5039 and movably arranged on the inner bottom of the guide seat 5035, wherein the side surface of the second gear 5038 is provided with a rolling rod 504 rotatably connected with the inner side of the guide seat 5035, and the rolling rod 504 is arranged above the electrostatic dust collection roller 50310.

[0034] When the protective film adhered to the circuit board is pressed down, the pressing slide rail system 5033 is started to operate, the pressing slide seat 5034 arranged on the side of the pressing slide rail system 5033 is driven to move up and down, and the guide seat 5035 and the electrostatic dust collection roller 50310 arranged on the side of the pressing slide seat 5034 are driven to move up and down, so that the position of the electrostatic dust collection roller 50310 is adjusted and the electrostatic dust collection roller 50310 is attached to the top of the circuit board and the protective film.

[0035] The rotating drive source 5036 is started to operate, the first gear 5037 connected to the output end of the rotating drive source 5036 is driven to rotate, and the second gear 5038 engaged and connected to the bottom of the first gear 5037 is driven to rotate. When the second gear 5038 rotates, the third gear 5039 engaged and connected to the bottom of the second gear 5038 rotates, the electrostatic dust collection roller 50310 connected to the side of the third gear 5039 rotates, and the horizontal movement of the circuit board is matched to realize the pressing positioning operation of the protective film on the top of the circuit board.

[0036] It should be noted that when the second gear 5038 rotates, the rolling rod 504 connected to the side of the second gear 5038 rotates, and the reciprocating screw rod 505 connected to the side of the rolling rod 504 rotates.

[0037] Specifically refer to Figure 14 The surface cleaning assembly 506 includes a screw rod slide seat 5061 connected to the outside of the reciprocating screw rod 505 through a ball, and a cleaning roller 5062 mounted on the side of the screw rod slide seat 5061. The cleaning roller 5062 is movably connected to the outside of the rolling rod 504, wherein a plurality of cams 5063 are mounted on the outside of the rolling rod 504, the cams 5063 are movably arranged in the inside of the cleaning roller 5062, and the inside of the cleaning roller 5062 has enough space for the movement of the cams 5063.

[0038] In the automatic film covering equipment for the circuit board, when the reciprocating screw rod 505 rotates, the screw rod slide seat 5061 connected to the outside of the reciprocating screw rod 505 through a ball moves horizontally (reciprocates), the cleaning roller 5062 mounted on the side of the screw rod slide seat 5061 is driven to move horizontally and reciprocally on the outside of the rolling rod 504, and the dust on the electrostatic dust collection roller 50310 arranged on the bottom is cleaned.

[0039] It should be noted that the outside of the cleaning roller 5062 is provided with a dust adhesion layer, the inside of the dust adhesion layer is provided with a rubber layer, and the inside of the rubber layer is provided with the rolling rod 504.

[0040] Further, when the rolling rod 504 rotates, the cam 5063 installed outside the rolling rod 504 rotates, and the cleaning roller 5062 is continuously pressed and rebounded at different positions, facilitating the adhesion and installation of the circuit board (the first two steps) and cleaning the dust adhered to the cleaning roller 5062. Embodiment two

[0041] With reference to the drawings Figure 13 The middle position of the electrostatic dust collection roller 50310 is inwardly recessed, and the recessed part is sleeved with an electromagnetic module 60. The electromagnetic module 60 is arranged outside the shaft rod of the electrostatic dust collection roller 50310. The power transmission end of the electromagnetic module 60 is electrically connected with a plurality of conductive modules 601 extending into the electrostatic dust collection roller 50310. The outer part of the electrostatic dust collection roller 50310 is provided with a plurality of electrostatic protrusions 602. The conductive modules 601 adsorb the dust on the circuit board through the electrostatic protrusions 602.

[0042] In the automatic film covering equipment for circuit board, when the dust adhered to the circuit board and the protective film is cleaned, the electromagnetic module 60 operates to generate an electrostatic magnetic field through the conductive modules 601 and the electrostatic protrusions 602, and change the ionization state of the dust in the air through the electrostatic magnetic field, so that the dust is charged and then adsorbed through electrostatic adsorption to adsorb the dust on the circuit board and the protective film. The outer surface of the electrostatic dust collection roller 50310 formed by the electrostatic protrusions 602 is more uneven, which can improve the adhesion effect of the protective film and form an arc-shaped electrostatic adsorption area, avoiding the problem that the dust is accumulated in blocks on the circular surface and not easily damaging the protective film during dust adsorption.

[0043] The basic principles, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

[0044] The terms "center", "longitudinal", "transverse", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only a simplified description for the convenience of describing the present application, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the scope of protection of the present application.

[0045] Therefore, any modification, equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical scope disclosed by the present application should be covered within the protection scope of the present application.

Claims

1. An automatic film laminating apparatus for a circuit board, characterized by comprising: The device base (10); the control panel (20) is installed at the top edge of the device base (10); the pre-storage support (30) is installed at the top of the device base (10) and located at the back of the control panel (20); the alignment pre-storage structure (40) is installed at the top of the device base (10) and located at the side of the pre-storage support (30); the automatic film laminating structure (50) is installed at the top of the device base (10) and located at the side of the pre-storage support (30) and the alignment pre-storage structure (40), The automatic film laminating structure (50) comprises: a film conveying and adsorbing assembly (501) installed at the top of the device base (10) and located at the back of the alignment pre-storage structure (40); The conveying and unloading assembly (502) is arranged at the side of the film conveying and adsorbing assembly (501) and installed at the other side of the top of the device base (10); the film pressing-down assembly (503) is installed at the outside of the tail of the conveying and unloading assembly (502) and at the top of the device base (10); the rolling rod (504) is installed at the bottom of the film pressing-down assembly (503); the reciprocating screw rod (505) is installed at the bottom of the rolling rod (504) and rotationally connected in the film pressing-down assembly (503); the surface cleaning assembly (506) is connected outside the reciprocating screw rod (505) through the ball and movably connected outside the rolling rod (504). The alignment pre-storage structure (40) comprises: an upper support (401) installed at the top of the device base (10); a linear lifting module (402) installed at the top of the upper support (401); a concave support (403) installed at the top center of the linear lifting module (402); a horizontal cylinder (404) installed at the top center of the left and right sides of the upper support (401); a horizontal pushing plate (405) connected with the output end of the horizontal cylinder (404) and slidably connected at the top of the linear lifting module (402).

2. The automatic film laminating apparatus for a circuit board according to claim 1, characterized by: The side center of the horizontal pushing plate (405) is provided with an intermediate protrusion (406) which is slidably connected at the top of the linear lifting module (402), and the side of the intermediate protrusion (406) abuts against the circuit board.

3. The apparatus according to claim 2, wherein: The linear lifting module (402) drives the circuit board placed at the top to move up and down. The film conveying and adsorbing assembly (501) comprises: a side support (5011) installed at the top of the device base (10); a horizontal sliding rail system (5012) installed at the side of the side support (5011); a horizontal sliding seat (5013) installed at the side of the horizontal sliding rail system (5012); a sliding seat (5014) installed at the side of the horizontal sliding seat (5013) and slidably connected with the side support (5011) through screws; a vertical sliding rail system (5015) installed at the side of the sliding seat (5014); a vertical sliding seat (5016) installed at the side of the vertical sliding rail system (5015); a bending rack (5017) installed at the side of the vertical sliding seat (5016) through screws, 4. The apparatus according to claim 1, wherein: ​ Two horizontal slide rail systems (5012) are arranged, and one horizontal slide (5013) is arranged on the side of each horizontal slide rail system (5012).

5. The apparatus according to claim 4, wherein: The bottom of the bending rack (5017) is fixedly connected with a lower metal plate (50171) through screws, a guide rod (50172) is slidably connected to the inner corner of the lower metal plate (50171), the bottom of the guide rod (50172) is connected with a lower connecting plate (50173) below the lower metal plate (50171), and a plurality of vacuum suction cups (50174) are arranged on the bottom edge of the lower connecting plate (50173). The outer side of the guide rod (50172) is provided with a buffer spring (50175) connected to the top of the lower metal plate (50171), and the bottom of the vacuum suction cup (50174) is connected with a circuit board and a protective film.

6. The apparatus according to claim 1, wherein: The conveying and discharging assembly (502) comprises an assembly support (5021) arranged on the other side of the top of the equipment base (10), side assembly frames (5022) arranged on both sides of the top of the assembly support (5021), a linear drive source (5023) arranged on one side of the side assembly frame (5022), a transmission belt (5024) connected with the output end of the linear drive source (5023) through a synchronous wheel and movably arranged on the side of the side assembly frame (5022), a drive shaft (5025) connected with the inner side of the transmission belt (5024) through a synchronous wheel and movably extended into the side assembly frame (5022), a conveying gear (5026) movably arranged on the outer side of the drive shaft (5025) and in the side assembly frame (5022), and a conveying belt (5027) movably arranged in the side assembly frame (5022) and engaged with the outer side of the conveying gear (5026). The side assembly frame (5022) and the conveying belt (5027) are provided with two, and the conveying gear (5026) is provided with four.

7. The apparatus according to claim 6, wherein: The top of the conveying belt (5027) is provided with a horizontal discharging plate (50271) movably arranged on the top of the side assembly frame (5022), the top of the horizontal discharging plate (50271) is provided with a longitudinal slide rail system (50272) arranged on both sides, the top of the longitudinal slide rail system (50272) is provided with a longitudinal slide (50273), and the top of the longitudinal slide (50273) is provided with an L-shaped sliding block (50274) movably arranged on the top of the horizontal discharging plate (50271) through screws. The side of the L-shaped sliding block (50274) is provided with an extrusion cylinder (50275), the output end of the extrusion cylinder (50275) is connected with an L-shaped extrusion block (50276), and the side of the L-shaped extrusion block (50276) is extruded and fixed with a circuit board.

8. The apparatus according to claim 7, wherein: The under-film pressing assembly (503) comprises: an I-shaped base (5031) mounted on the top of the equipment base (10); a T-shaped plate (5032) mounted on the top of the I-shaped base (5031) by screws; a pressing slide rail system (5033) mounted on the side of the T-shaped plate (5032); a pressing slide (5034) mounted on the side of the pressing slide rail system (5033); a guide seat (5035) mounted between the two pressing slides (5034); a rotary driving source (5036) mounted on one side of the top of the guide seat (5035); a first gear (5037) connected with the output end of the rotary driving source (5036); a second gear (5038) meshingly connected at the bottom of the first gear (5037) and movably arranged inside the guide seat (5035); a third gear (5039) meshingly connected at the bottom of the second gear (5038) and movably arranged inside the guide seat (5035); and an electrostatic dust collection roller (50310) connected with the third gear (5039) and movably arranged at the bottom inside the guide seat (5035). The side surface of the second gear (5038) is provided with a rolling rod (504) rotatably connected inside the guide seat (5035), and the rolling rod (504) is arranged above the electrostatic dust collection roller (50310).

9. The apparatus according to claim 8, wherein: The surface cleaning assembly (506) comprises: a lead screw slide (5061) connected outside the reciprocating lead screw (505) by balls; a cleaning roller (5062) mounted on the side of the lead screw slide (5061), the cleaning roller (5062) being movably connected outside the rolling rod (504), The outside of the rolling rod (504) is provided with a plurality of cams (5063), the cams (5063) being movably arranged inside the cleaning roller (5062), and the cleaning roller (5062) has sufficient space for the movement of the cams (5063).

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