Method for manufacturing display panel and display panel

Abstract

The application belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel. The preparation method comprises the following steps: providing a substrate substrate, the substrate substrate is provided with a plurality of pixel regions arranged in an array, an organic light-emitting unit is formed in each pixel region, and an encapsulation layer is arranged on the organic light-emitting unit; an optical adjustment layer is formed on the encapsulation layer, the optical adjustment layer is used for adjusting and controlling the polarization state of incident light; an optical structure unit is formed on the optical adjustment layer, the optical structure unit is arranged between adjacent pixel regions, and each optical structure unit comprises a plurality of optical structures arranged at intervals; a color filter layer is formed on the optical adjustment layer provided with the optical structure unit, the color filter layer comprises a plurality of color resistance blocks, one color resistance block corresponds to one pixel region, and the optical structure unit is located between adjacent color resistance blocks. The application can effectively improve the light-emitting efficiency of the display panel and increase the visual viewing angle.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a preparation method of a display panel and the display panel. BACKGROUND

[0002] With the development of organic light-emitting diode (OLED) display technology, in order to improve the light-emitting efficiency, a color filter on encapsulation (COE) structure is usually adopted to directly prepare a color filter (CF) on an encapsulation layer, so as to reduce the use of a polarizer.

[0003] In the existing COE structure, because the thin film encapsulation (TFE) layer is thick, the black matrix located thereon is easy to block the large-angle light-emitting of the OLED light-emitting layer, so that the viewing angle of the display panel is narrowed and the light-emitting efficiency is reduced. SUMMARY

[0004] The present application aims to provide a preparation method of a display panel and the display panel, which can effectively improve the light-emitting efficiency of the display panel and increase the visual viewing angle.

[0005] The first aspect of the present application provides a preparation method of a display panel, comprising the following steps: providing a substrate substrate, the substrate substrate has a plurality of pixel regions arranged in an array, an organic light-emitting unit is formed in each pixel region, and an encapsulation layer is covered on the organic light-emitting unit; forming an optical adjustment layer on the encapsulation layer, the optical adjustment layer is used to regulate the polarization state of incident light; forming an optical structure unit on the optical adjustment layer, the optical structure unit is arranged between adjacent pixel regions, and each optical structure unit comprises a plurality of spaced optical structures; forming a color filter layer on the optical adjustment layer with the optical structure unit, the color filter layer comprises a plurality of color resistance blocks, one color resistance block corresponds to one pixel region, and the optical structure unit is located between adjacent color resistance blocks.

[0006] In an exemplary embodiment of the present application, the step of forming an optical structure unit on the optical adjustment layer comprises: forming a patterned template layer, the pattern of the template layer is used to define the spaced arrangement of the plurality of optical structures in the optical structure unit; forming the optical structure unit composed of a functional material on the optical adjustment layer based on the patterned template layer; and removing the patterned template layer.

[0007] In an example embodiment of the present application, the step of forming the optical structure unit on the optical adjustment layer comprises: forming a functional material layer on the optical adjustment layer, and performing a patterning process on the functional material layer to form a first pattern; forming a mask layer on the optical adjustment layer, the mask layer covering the first pattern; performing a patterning process on the mask layer to form a second pattern having a plurality of spaced-apart openings, the openings exposing part of the first pattern; etching the exposed first pattern through the openings to form the optical structure unit; and removing the mask layer.

[0008] In an example embodiment of the present application, before the step of forming the functional material layer on the optical adjustment layer, the preparation method further comprises: forming a protective layer on the optical adjustment layer; and wherein the functional material layer is formed on the protective layer.

[0009] In an example embodiment of the present application, the step of forming the optical structure unit on the optical adjustment layer comprises: forming a protective layer on the optical adjustment layer, and performing a patterning process on the protective layer to form a sacrificial unit, the sacrificial unit having a plurality of spaced-apart protrusions; depositing a functional material in the sacrificial unit, the functional material covering the protrusions and the regions between adjacent protrusions; removing the sacrificial unit and simultaneously removing the functional material on the protrusions, and retaining the functional material in the regions between adjacent protrusions to form the optical structure unit.

[0010] In an example embodiment of the present application, the cross-sectional area of the protrusions gradually increases in the direction from the substrate to the optical adjustment layer.

[0011] In an example embodiment of the present application, the functional material is a conductive metal material.

[0012] The second aspect of the present application provides a display panel, comprising: a substrate; a plurality of organic light emitting units arranged in an array on the substrate; an encapsulation layer covering the organic light emitting units; an optical adjustment layer disposed on the encapsulation layer, the optical adjustment layer being configured to adjust the polarization state of incident light; a protective layer disposed on the optical adjustment layer; and an optical structure unit and a color filter layer disposed on the protective layer; wherein the color filter layer comprises a plurality of color resist blocks, one color resist block corresponding to one organic light emitting unit, the optical structure unit being located between adjacent color resist blocks, and the optical structure unit comprising a plurality of spaced-apart optical structures.

[0013] The third aspect of the present application provides a display panel, comprising: a substrate substrate; a plurality of organic light emitting units arranged in an array on the substrate substrate; an encapsulation layer covering the organic light emitting units; an optical adjustment layer disposed on the encapsulation layer, the optical adjustment layer being configured to regulate a polarization state of incident light; and an optical structure unit and a color filter layer disposed on the optical adjustment layer; wherein the color filter layer comprises a plurality of color resist blocks, one color resist block corresponding to one organic light emitting unit, the optical structure unit being located between adjacent color resist blocks, the optical structure unit being disposed on a side of the optical adjustment layer away from the substrate substrate and comprising a plurality of spaced optical structures.

[0014] In an exemplary embodiment of the present application, the cross-sectional area of the optical structure gradually decreases in the direction from the substrate substrate to the optical adjustment layer.

[0015] The display panel and the method for manufacturing the display panel of the present application have at least the following beneficial effects:

[0016] The present application sets the optical structure unit composed of a plurality of spaced optical structures between adjacent pixel regions, cooperates with the optical adjustment layer for regulating the polarization state, and makes the optical structure unit and the optical adjustment layer cooperate to make the incident ambient light be blocked after the polarization direction is rotated after reflection, thereby realizing the light shielding function while allowing the light emitted by the organic light emitting unit to pass through with low loss; this makes the pixel boundary region no longer completely shielded, thereby significantly reducing the shielding of the large-angle light emission, effectively improving the overall light emission efficiency of the display panel and increasing the visible viewing angle.

[0017] Other characteristics and advantages of the present application will become apparent from the following detailed description, or will be learned by practice of the present application.

[0018] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The drawings incorporated into the specification and forming a part thereof illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0020] Figure 1 A flowchart of a method for manufacturing a display panel provided by an embodiment of the present application is shown.

[0021] Figure 2A preparation method flowchart of the optical structure unit is shown.

[0022] Figure 3 A preparation method flowchart of the display panel is shown.

[0023] Figure 4 A structure flowchart of the display panel is shown.

[0024] Figure 5 A preparation method flowchart of the display panel is shown.

[0025] Figure 6 A structure flowchart of the display panel is shown.

[0026] Figure 7 A structure flowchart of the display panel is shown.

[0027] Figure 8 A structure flowchart of the display panel is shown.

[0028] Figure 9 A structure flowchart of the display panel is shown.

[0029] Figure 10 A structure flowchart of the display panel is shown.

[0030] BRIEF DESCRIPTION OF DRAWINGS

[0031] 10, display panel; 11, substrate; 12, organic light emitting unit; 13, encapsulation layer; 14, optical adjustment layer; 15, optical structure unit; 150, optical structure; 16, color resistance block; 17, driving backplane; 18, first pattern; 19, mask layer; 190, opening; 191, second pattern; 20, protection layer; 210, sacrifice unit; 211, protruding part; 212, groove. DETAILED DESCRIPTION

[0032] Example implementations are now described with reference to the following drawings. Example implementations can take form in various components and arrangements of components, and in various steps and arrangements of steps. The following description is in the context of a particular example implementation and should not be construed as limiting.

[0033] In the present application, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0034] In the present application, unless otherwise explicitly specified and limited, the terms "assembly", "connection" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, it can be internal communication of two elements or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] In addition, the described features, structures or characteristics can be combined in any suitable way in one or more embodiments. In the following description, many specific details are provided to give a sufficient understanding of the embodiments of the present application. However, those skilled in the art will realize that the technical solutions of the present application can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be used. In other cases, well-known methods, devices, implementations or operations are not shown or described in detail to avoid obscuring the aspects of the present application.

[0036] Referring to Figure 1 As shown, the present application provides a preparation method of a display panel 10, which optimizes the optical structure of the pixel boundary area to improve the display performance of the display panel 10. It specifically includes the following steps:

[0037] Step S100, providing a substrate 11, the substrate 11 has a plurality of pixel regions arranged in an array, an organic light emitting unit 12 is formed in each pixel region, and an encapsulation layer 13 is covered on the organic light emitting unit 12.

[0038] Step S200, forming an optical adjustment layer 14 on the encapsulation layer 13, the optical adjustment layer 14 is used to regulate the polarization state of incident light.

[0039] Step S300, forming an optical structure unit 15 on the optical adjustment layer 14, the optical structure unit 15 is arranged between adjacent pixel regions, and each optical structure unit 15 includes a plurality of spaced optical structure bodies 150.

[0040] Step S400, forming a color filter layer on the optical adjustment layer 14 with the optical structure units 15, the color filter layer including a plurality of color resist blocks 16, one color resist block 16 corresponding to one pixel region, the optical structure units 15 being located between adjacent color resist blocks 16.

[0041] In step S100, the substrate 11 can be a rigid substrate (such as glass) or a flexible substrate (such as polyimide PI). A driving backplane 17 is formed on the substrate 11, the driving backplane 17 being formed by mature semiconductor thin film preparation processes (such as deposition, photolithography, etching, etc.) to form a thin film transistor (TFT) array (not shown in the figure) including a gate, a source, a drain, and an active layer, the thin film transistors being arranged in a matrix to define a plurality of pixel regions.

[0042] Subsequently, in each pixel region, an organic light emitting unit 12 is prepared by a process such as vacuum evaporation. Each organic light emitting unit 12 is generally a laminated structure including, from bottom to top, an anode (for example, composed of indium tin oxide ITO / silver Ag / ITO), a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a cathode (for example, magnesium silver alloy Mg:Ag). The anode is electrically connected to the source or the drain of the corresponding thin film transistor through a via hole to achieve independent driving. In order to separate adjacent pixels, a pixel definition layer (PDL) is also provided between the pixels.

[0043] Finally, a thin film encapsulation layer 13 covering all the organic light emitting units 12 is formed on the entire display area and non-display area. The encapsulation layer 13 is generally a multi-layer structure, for example, composed of a first inorganic encapsulation layer 13 (such as SiNx), an organic encapsulation layer 13 (such as resin), and a second inorganic encapsulation layer 13 (such as SiNx) stacked in sequence, and the main function is to block the intrusion of external water and oxygen to protect the sensitive organic light emitting material.

[0044] In step S200, an optical adjustment layer 14 is formed on the surface of the encapsulation layer 13 by a coating, curing or attaching process.

[0045] In some embodiments, the optical adjustment layer 14 is a quarter wave plate (QWP). The quarter wave plate is a kind of phase retardation plate, which can convert incident linearly polarized light into circularly polarized light, or convert circularly polarized light into linearly polarized light. Its material can be polycarbonate (PC), cyclo olefin polymer (COP) and other high molecular thin films with birefringence characteristics, and the thickness is precisely designed to achieve 90-degree phase delay for light in a specific wavelength range (such as the visible light band). The main function of this layer is to change the polarization state of the light passing through it, providing key optical conditions for subsequent cooperation with the optical structure units 15 to suppress ambient light reflection.

[0046] Referring to Figure 2As shown in FIG. 3, the step of forming the optical structure units 15 on the optical adjustment layer 14 includes:

[0047] In step S310, a patterned template layer is formed, and the pattern of the template layer is used to define the spaced arrangement of the optical structures 150 in the optical structure units 15.

[0048] In step S320, the optical structure units 15 composed of the functional material are formed on the optical adjustment layer 14 based on the patterned template layer.

[0049] In step S330, the patterned template layer is removed.

[0050] Referring to Figure 3 and Figure 4 As shown in FIG. 3, in some embodiments, the step of forming the optical structure units 15 on the optical adjustment layer 14 can include:

[0051] In step S310a, a functional material layer is formed on the optical adjustment layer 14, and the functional material layer is subjected to a first patterning process to form a first pattern 18.

[0052] In step S320a, a mask layer 19 is formed on the optical adjustment layer 14, and the mask layer 19 covers the first pattern 18.

[0053] In step S330a, the mask layer 19 is subjected to a second patterning process to form a second pattern 191 having spaced arrangement openings 190, and the openings 190 expose part of the first pattern 18.

[0054] In step S340a, the exposed first pattern 18 is etched through the openings 190 to form the optical structure units 15.

[0055] In step S350a, the mask layer 19 is removed.

[0056] That is, the mask layer 19 is used as a template layer, and the optical structure units 15 are prepared through the mask layer 19.

[0057] In step S310a, before forming the functional material layer on the optical adjustment layer 14, a transparent protective layer 20 with a thickness of approximately 1 μm is coated on the optical adjustment layer 14. The material can be PI, PMMA, epoxy resin, silicon nitride (SiNx), or silicon oxide (SiOx), etc., to protect the underlying optical adjustment layer 14 in subsequent processes. Then, a functional material layer is formed on the protective layer 20 by physical vapor deposition (PVD). The functional material layer can be a conductive metal, such as chromium (Cr), aluminum (Al), copper (Cu), or other low-reflectivity metals, with a thickness of 1 nm-1000 nm, optionally 150 nm-300 nm. Next, the functional material layer is patterned for the first time through a first photolithography and etching process to form a first pattern 18 covering the preset pixel boundary area.

[0058] In step S320a, a layer of photoresist or PMMA is coated on the substrate on which the first pattern 18 is formed to form a mask layer 19. Then, the mask layer 19 is patterned using micro / nano fabrication techniques such as nanoimprint lithography or laser interference lithography. This patterning forms a periodic lattice structure pattern, i.e., a series of spaced openings 190 are generated on the mask layer 19, which expose portions of the underlying first pattern 18. The linewidth of the lattice (width of the opening 190) is 1 nm-500 nm (e.g., 50 nm), and the line spacing (period) is 1 nm-500 nm (e.g., 50 nm-100 nm). This patterned mask layer 19 serves as a temporary template layer defining the position of the final optical structure 150.

[0059] In step S330a, using the mask layer 19 as an etching barrier layer, the portion of the first pattern 18 exposed through the opening 190 is subjected to dry or wet etching until it is completely removed. To ensure complete etching, 1%-50% over-etching can be performed to complete the etching of the metal, but without etching through the protective layer 20, so as not to damage the optical adjustment layer 14. After etching, the portion of the first pattern 18 protected by the mask layer 19 is retained, forming an optical structural unit 15 composed of multiple spaced metal lines that is complementary to the pattern of the template opening 190, wherein each metal line is an optical structure 150.

[0060] In step S340a, the mask layer 19 is removed using a stripping solution or a plasma ashing process.

[0061] See Figure 5 and Figure 6 As shown, in some other embodiments, the step of forming the optical structural unit 15 on the optical adjustment layer 14 includes:

[0062] Step S310b, a protection layer 20 is formed on the optical adjustment layer 14, and the protection layer 20 is patterned to form a sacrificial unit 210, which has a plurality of protruding portions 211 arranged at intervals.

[0063] Step S320b, a functional material is deposited in the sacrificial unit 210, which covers the protruding portions 211 and the regions between the adjacent protruding portions 211.

[0064] Step S330b, the sacrificial unit 210 is removed, and at the same time, the functional material on the protruding portions 211 is removed, and the functional material in the regions between the adjacent protruding portions 211 is reserved to form the optical structure unit 15.

[0065] In step S310b, on the optical adjustment layer 14, a layer of organic material that can be removed by a specific solvent is coated as the protection layer 20, for example, a photoresist or a negative photoresist whose main component is PMMA. Then, the protection layer 20 is patterned by nanoimprint or photolithography process to directly form the sacrificial unit 210. The sacrificial unit 210 includes a plurality of protruding portions 211 arranged at intervals, and the grooves 212 between the protruding portions 211 expose the underlying optical adjustment layer 14.

[0066] As shown in FIG. 3B, the side wall of the protruding portion 211 is designed to have an inclination angle, that is, the cross-sectional area of the protruding portion 211 gradually increases in the direction from the substrate 11 to the optical adjustment layer 14, forming an inverted trapezoidal structure. Figure 7 The design has two purposes. First, when the functional material is deposited, the cantilever structure with the top narrow and the bottom wide can form a physical shadow area below the top edge of the protruding portion 211, so that the functional material layer deposited on the side wall of the protruding portion 211 and the bottom region of the groove 212 is discontinuous or easy to break, thereby effectively reducing the adhesion between the functional material covering the top of the protruding portion 211 and the functional material filling in the groove 212 during the subsequent stripping, and ensuring clean and complete stripping.

[0067] It should be noted that the protection layer 20 after the patterning process is a high-precision temporary template layer that defines the final pattern.

[0068] It can be understood that when the negative photoresist is selected, the unexposed area is dissolved after exposure and development, and the exposed area is retained due to crosslinking reaction. This chemical property makes it easier to form a pattern structure with an inclined side wall or even an inverted trapezoidal structure.

[0069] In step S320b, a functional material (e.g. the conductive metal described above) is deposited on the protective layer 20 and the optical adjustment layer 14 by physical vapor deposition or the like. The functional material covers the top of the protrusion 211 of the sacrificial unit 210 and fills into the trench 212 of the sacrificial unit 210 at the same time.

[0070] In step S330b, the sacrificial unit 210 (the template layer) is dissolved and removed using a special stripping solution. In the process of dissolving the sacrificial unit 210, the functional material (metal) covering the top of the protrusion 211 of the sacrificial unit 210 is lifted away due to the loss of support; while the functional material (metal) filling into the trench 212 and directly contacting the optical adjustment layer 14 is retained. In this way, the optical structure unit 15 is directly formed, and the optical structure 150 (metal line) of the optical structure unit 15 is located at the original position of the trench 212.

[0071] When the protrusion 211 is an inverted trapezoidal structure, the cross-sectional shape of the optical structure 150 formed finally gradually decreases in the direction from the substrate 11 towards the optical adjustment layer 14.

[0072] Compared with the method of forming and patterning a mask layer 19 additionally after forming the functional material layer and performing the first patterning to obtain the first pattern 18, and then defining the optical structure unit 15 by etching process, the present embodiment directly patterns the protective layer 20 to form the sacrificial unit 210, and then removes the sacrificial unit 210 and the material thereon to form the optical structure unit 15 by stripping process after depositing the functional material, thereby omitting the steps of preparing and patterning the separate mask layer 19 and the etching step, simplifying the process flow and helping to realize a thinner display panel 10 structure.

[0073] In step S400, after the preparation of the optical structure unit 15 is completed, a conventional color film preparation process such as spin coating, exposure, development, and baking is adopted to form a color filter layer on the optical adjustment layer 14. The layer includes red (R), green (G), and blue (B) color resist blocks 16. The position of each color resist block 16 is aligned with and covers a pixel area (i.e. an organic light emitting unit 12) on the substrate 11. The color filter layer is used to modulate the spectrum of the light emitted by the corresponding pixel's organic light emitting unit 12, so as to improve the color purity and display color gamut.

[0074] The optical structure unit 15 prepared in the present application is located between the adjacent color resist blocks 16. The optical structure unit 15 allows part of the display light to pass through while effectively suppressing the reflection of ambient light, thereby significantly improving the light extraction efficiency of the pixel boundary area and improving the viewing angle characteristics of the display panel 10.

[0075] Through the above two methods, two display panels 10 with different microstructures can be prepared.

[0076] Referring to Figure 8 In some embodiments, the display panel 10 is prepared by an etching process. The structure of the display panel 10 from bottom to top includes a substrate 11, an organic light-emitting unit 12, an encapsulation layer 13, an optical adjustment layer 14, a protective layer 20, and an optical structure unit 15 and a color filter layer disposed on the protective layer 20. The optical structure unit 15 includes a plurality of optical structures 150 made of conductive metal material and arranged at intervals.

[0077] In other embodiments, referring to Figure 9 and Figure 10 The display panel 10 is prepared by a stripping process. The structure of the display panel 10 from bottom to top includes a substrate 11, an organic light-emitting unit 12, an encapsulation layer 13, an optical adjustment layer 14, and an optical structure unit 15 and a color filter layer disposed on the optical adjustment layer 14. Since the sacrificial unit 210 is completely removed, there is no additional protective layer 20. The optical structure unit 15 also includes a plurality of optical structures 150 made of conductive metal material and arranged at intervals, and the optical structures 150 have the shape feature that the cross-sectional area gradually decreases upward.

[0078] Referring to Figure 8 The display panel 10 works with the optical structure unit 15 and the optical adjustment layer 14. The optical principle is that the ambient light (natural light) incident on the optical structure unit 15 is converted into linearly polarized light in a single direction (for example, horizontally linearly polarized light). After the linearly polarized light passes through the optical adjustment layer 14, it becomes right circularly polarized light. After the circularly polarized light is reflected by the metal electrode (such as an anode) inside the panel, the rotation direction is reversed (i.e., it becomes left circularly polarized light). After the reflected circularly polarized light passes through the optical adjustment layer 14 again, it becomes linearly polarized light perpendicular to the initial direction (for example, vertically linearly polarized light). Due to the characteristics of the optical structure unit 15, the vertically linearly polarized light cannot pass through and is reflected or absorbed, thereby effectively suppressing ambient light reflection and achieving a dark state effect similar to a black matrix.

[0079] For the light (unpolarized light) emitted by the light-emitting layer of the organic light-emitting unit 12 itself, when it passes through this area, about half of the light (the component consistent with the direction of the grating transmission axis) can pass through, only losing the other half of the energy. Compared with the complete shielding of the black matrix (BM) in the related art (such as Figure 8 the exit light of the display panel 10 of the present application), the overall light efficiency of the display panel 10 is significantly improved. At the same time, since the physical shielding area of the optical structure is much smaller than the wide black matrix, less light is shielded when viewed from a large angle, thereby effectively improving the viewing angle characteristics of the display panel 10.

[0080] In summary, the application, by virtue of the innovative design of the material and structure, greatly improves the active light emitting efficiency of the display panel 10 while effectively managing the reflection of ambient light, and achieves excellent display effects with high contrast and high brightness.

[0081] In the description of the specification, the description referring to the terms "some embodiments", "exemplarily", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are contained in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples, without contradiction.

[0082] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application. Any changes or modifications made in accordance with the claims and specification of the present application shall be within the scope of the present application.

Claims

1. A method for manufacturing a display panel, characterized by, The method comprises the following steps: providing a substrate, the substrate having a plurality of pixel regions arranged in an array, each of the pixel regions having an organic light emitting unit formed thereon, the organic light emitting unit being covered by an encapsulation layer; forming an optical adjustment layer on the encapsulation layer, the optical adjustment layer being configured to adjust a polarization state of incident light; forming an optical structure unit on the optical adjustment layer, the optical structure unit being arranged between adjacent pixel regions, and each of the optical structure units comprising a plurality of optical structures arranged in an interval; forming a color filter layer on the optical adjustment layer having the optical structure unit formed thereon, the color filter layer comprising a plurality of color resist blocks, one of the color resist blocks corresponding to one of the pixel regions, the optical structure unit being arranged between adjacent color resist blocks.

2. The production method according to claim 1, characterized by, The step of forming the optical structure unit on the optical adjustment layer comprises: forming a patterned template layer, the pattern of the template layer being configured to define an interval arrangement of the optical structures in the optical structure unit; forming the optical structure unit on the optical adjustment layer by using the patterned template layer as a reference, the optical structure unit being formed by a functional material; removing the patterned template layer.

3. The production method according to claim 2, characterized by, The step of forming the optical structure unit on the optical adjustment layer comprises: forming a functional material layer on the optical adjustment layer, and performing a patterning process on the functional material layer to form a first pattern; forming a mask layer on the optical adjustment layer, the mask layer covering the first pattern; performing a patterning process on the mask layer to form a second pattern having openings arranged in an interval, the openings exposing part of the first pattern; performing etching on the exposed first pattern through the openings to form the optical structure unit; removing the mask layer.

4. The production method according to claim 3, characterized by, Before the step of forming the functional material layer on the optical adjustment layer, the method further comprises: forming a protection layer on the optical adjustment layer; wherein the functional material layer is formed on the protection layer.

5. The preparation method according to claim 2, characterized in that, The step of forming the optical structure unit on the optical adjustment layer comprises: forming a protection layer on the optical adjustment layer, and performing a patterning process on the protection layer to form a sacrificial unit, the sacrificial unit having a plurality of protruding portions arranged in an interval; depositing a functional material in the sacrificial unit, the functional material covering the protruding portions and regions between adjacent protruding portions; removing the sacrificial unit and the functional material on the protruding portions at the same time, and retaining the functional material in the regions between adjacent protruding portions to form the optical structure unit.

6. The production method according to claim 5, characterized by, In a direction from the substrate to the optical adjustment layer, a cross-sectional area of the protruding portion gradually increases.

7. The production method according to claim 3 or 5, characterized by, The functional material is a conductive metal material.

8. A display panel, characterized by, The method comprises: a substrate; a plurality of organic light emitting units arranged in an array on the substrate; an encapsulation layer covering the organic light emitting units; an optical adjustment layer arranged on the encapsulation layer, the optical adjustment layer being configured to adjust a polarization state of incident light; a protection layer arranged on the optical adjustment layer; and an optical structure unit and a color filter layer arranged on the protection layer. The color filter layer includes a plurality of color resist blocks, one color resist block corresponding to one organic light emitting unit, and the optical structure unit is located between adjacent color resist blocks and includes a plurality of spaced optical structures.

9. A display panel, characterized by, The display panel includes: a substrate substrate; a plurality of organic light emitting units arranged in an array on the substrate substrate; an encapsulation layer covering the organic light emitting units; an optical adjustment layer disposed on the encapsulation layer, the optical adjustment layer being used to regulate the polarization state of incident light; and an optical structure unit and a color filter layer disposed on the optical adjustment layer; The color filter layer includes a plurality of color resist blocks, one color resist block corresponding to one organic light emitting unit, and the optical structure unit is located between adjacent color resist blocks, the optical structure unit is disposed on the side of the optical adjustment layer away from the substrate substrate, and includes a plurality of spaced optical structures.

10. The display panel of claim 9, wherein, In the direction from the substrate substrate to the optical adjustment layer, the cross-sectional area of the optical structure gradually decreases.

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