An integrated circuit chip packaging device

Abstract

The utility model relates to a kind of integrated circuit chip packaging device, it is related to chip packaging technical field, including fixed platform, rotatory U-shaped frame is rotationally arranged above fixed platform, and the inner bottom of rotatory U-shaped frame is equipped with processing avoidance groove, and its four quarters are slidably equipped with positioning plate, the thickness of positioning plate is not greater than the thickness of substrate, and support platform is vertically lifted and arranged in the top of fixed platform, and the top structure of support platform is set along with the shape of processing avoidance groove, the inner bottom of rotatory U-shaped frame is slidably equipped with sliding L-shaped frame in the position of both sides of processing avoidance groove, and one end of one sliding L-shaped frame is fixedly equipped with fixed plate, and the inside of fixed plate is equipped with gap groove, sliding stop plate is equipped in gap groove, and a plurality of through grooves are penetrated and arranged in the top of stop plate, and the one end of through groove is arc structure and is laid with antiskid pad.The utility model solves the problem that existing integrated circuit chip packaging equipment is shielded processing area when double-sided packaging substrate clamping mode;Processing surface exchange procedure is complicated;The problem that first processing surface cannot be effectively supported.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to an integrated circuit chip packaging device. Background Technology

[0002] Integrated circuit chip packaging refers to the key process of electrically connecting, physically protecting, and heat-dissipating manufactured integrated circuit chips. It transforms the exposed chip into a stable and reliable independent device, ensuring its proper functioning in an electronic system. Packaging is mainly divided into two types: single-sided packaging and double-sided packaging. Single-sided packaging places the chip and leads on only one side of the substrate; double-sided packaging mounts the chip on both sides of the substrate, helping to reduce package size and improve system performance. The packaging process includes chip mounting, which precisely fixes the chip onto the substrate; wire bonding, which establishes electrical connections between the chip and external pins using fine metal wires; and dispensing, which uses sealant or underfill adhesive to encapsulate and protect the chip, enhance mechanical strength, and improve heat dissipation.

[0003] In existing packaging equipment, when performing single-sided packaging of integrated circuit chips, negative pressure adsorption is typically used to fix the substrate. This method fully exposes the upper surface of the substrate, providing unobstructed working space for processes such as mounting and bonding. However, when performing more complex double-sided packaging of integrated circuit chips, the surface of the substrate, which has already been processed, has bumps, solder balls, or encapsulated devices, making it uneven and unable to form an effective seal. Therefore, negative pressure adsorption is no longer suitable, and mechanical clamping must be used for edge fixation. However, this mechanical clamping and fixing method has many limitations: First, the clamping points need to occupy the effective space at the edge of the substrate. To avoid these clamping areas, the equipment often has a more complicated processing path planning, which affects the overall processing efficiency. Second, after the first side of the substrate is processed, the substrate needs to be removed from the fixture, flipped, and re-clamped and replaced, which is a cumbersome process and increases positioning errors. More importantly, the support problem is particularly prominent. When encapsulating the first processed side of the substrate, a flat support plate can be used to fully support the back side of the substrate (i.e., the unprocessed side), which can effectively prevent the substrate from deforming or breaking due to the downward pressure applied during the encapsulation process. However, when encapsulating the second processed side, its back side (i.e., the processed side that has been encapsulated) is already uneven and cannot obtain a flat and uniform effective support. This makes the substrate very prone to local deformation or even cracking when subjected to the downward pressure of the encapsulation process, which seriously affects the encapsulation yield and product reliability.

[0004] In conclusion, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide an integrated circuit chip packaging device. During the double-sided packaging process of integrated circuit chips, the device employs a clamping and fixing method that avoids the edge areas of the substrate processing surface, eliminating the need for detours or avoidance of clamping points in the processing path planning, thus ensuring smooth processing and overall efficiency. Once one side of the substrate is packaged, the device can automatically flip and interchange the processing surfaces without disassembling the substrate, greatly simplifying the process flow. When packaging the second processing surface, the device can adaptively adjust based on the undulating shape of the already packaged surface on the back of the substrate, providing uniform and fitting support, significantly reducing the risk of substrate deformation or cracking due to downward pressure, ultimately effectively improving packaging yield and product reliability.

[0006] To address the above problems, the present invention provides the following technical solution:

[0007] An integrated circuit chip packaging device includes a fixed stage, a rotating U-shaped frame rotatably mounted above the fixed stage, a processing clearance groove provided at the bottom of the rotating U-shaped frame, and positioning plates slidably mounted around its perimeter. The thickness of the positioning plates is no greater than the thickness of the substrate. A support stage is vertically raised and lowered at the top of the fixed stage, and the top structure of the support stage is conformally arranged to the processing clearance groove. Sliding L-shaped frames are slidably mounted at both sides of the processing clearance groove at the bottom of the rotating U-shaped frame. A fixed plate is fixedly mounted at one end of one of the sliding L-shaped frames. A gap groove is provided inside the fixed plate, and a stop plate is slidably mounted in the gap groove. A plurality of through grooves are provided through the top of the stop plate. One end of the through groove is an arc-shaped structure and covered with an anti-slip pad. A plurality of vertically slidable sliding rods are provided through the top of the fixed plate. The sliding rods are located in the through grooves, and a support column is provided at the bottom of the sliding rods. A plurality of receiving grooves are provided at the bottom of the fixed plate.

[0008] As an optimized solution, a top plate is provided above the fixed plate, and several pneumatic telescopic cylinders are fixedly provided at the end of one of the sliding L-shaped frames, with the telescopic ends of the pneumatic telescopic cylinders fixedly connected to the top plate.

[0009] As an optimized solution, another sliding L-shaped frame has a vertically sliding reset plate extending through its end. The sliding L-shaped frame has several lifting and telescopic cylinders fixedly installed at its end, and the telescopic ends of the lifting and telescopic cylinders are fixedly connected to the reset plate.

[0010] As an optimized solution, one end of the stop plate extends to the outside through the fixed plate and the sliding L-shaped frame, and a plurality of electrically controlled telescopic cylinders are fixedly provided at the end of the sliding L-shaped frame, and the telescopic ends of the electrically controlled telescopic cylinders are fixedly connected to the stop plate.

[0011] As an optimized solution, the rotating U-shaped frame is fixedly equipped with several drive telescopic cylinders on its inner wall, and the telescopic ends of the drive telescopic cylinders are fixedly connected to the sliding L-shaped frame.

[0012] As an optimized solution, the bottom of the rotating U-shaped frame is provided with clearance slots on both sides of the processing clearance slot. Several control telescopic cylinders are fixedly installed on the inner wall of the clearance slots and the side wall of the rotating U-shaped frame. The telescopic ends of the control telescopic cylinders are fixedly connected to the positioning plate.

[0013] As an optimized solution, the bottom of the sliding L-shaped frame is provided with a clearance groove to avoid the positioning plate.

[0014] As an optimized solution, a number of lifting telescopic cylinders are fixedly installed on the top of the fixed platform, and the telescopic ends of the lifting telescopic cylinders are fixedly connected to the support platform.

[0015] As an optimized solution, two support plates are fixedly provided on the top of the fixed platform, and the two ends of the rotating U-shaped frame are rotatably connected to the two support plates. A servo motor is fixedly provided at the end of one of the support plates, and the output shaft of the servo motor is fixedly connected to the rotating U-shaped frame.

[0016] As an optimized solution, the top of the fixing platform is provided with several mounting holes.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. During the encapsulation process, the support platform first moves upward to completely fill the processing clearance groove, placing the substrate on the support platform. Then, the positioning plates slide towards the substrate until all positioning plates contact the sidewalls of the substrate, thus completing the substrate positioning. At this point, the first processing surface of the substrate can be encapsulated. The support platform supports the back of the substrate. After the first processing surface is encapsulated, one of the sliding L-shaped brackets slides to a preset position, positioning the fixing plate above the substrate. Then, the stop plate slides inward, separating the anti-slip pad from the sliding rod, thus releasing the restriction on the sliding rod. At this point, the sliding rod is no longer constrained by the stop plate. The ejector plate then moves downward and pushes the sliding rod until the support column is completely disengaged from the receiving groove. Afterward, the sliding rod and support column are released under the influence of gravity. The slide naturally downwards until all support pillars contact the substrate or the device on the substrate. Then the stop plate resets and limits the sliding rod. At this time, the shape of all support pillars is consistent with the undulating shape of the first processing surface of the substrate. After the support platform resets and avoids the undulating shape, the rotating U-shaped frame rotates 180° so that the second processing surface of the substrate faces upwards and is exposed through the processing avoidance groove. All support pillars form an effective and stable support for the first processing surface of the substrate that fits the undulating shape. At this time, the second processing surface of the substrate can be packaged. In the double-sided packaging process of integrated circuit chips, the clamping and fixing method adopted by this device avoids the edge area of ​​the substrate processing surface, so that the processing path planning does not need to detour or avoid the clamping point, thereby ensuring the smoothness of the processing process and the overall efficiency.

[0019] 2. After one side of the substrate is packaged, the device can automatically flip and change the processing side without disassembling the substrate, which greatly simplifies the process flow.

[0020] 3. When encapsulating the second processing surface, the device can adaptively adjust according to the undulating shape of the first processing surface of the substrate, thereby providing uniform and fitting effective support, significantly reducing the risk of substrate deformation or cracking caused by downward pressure, and ultimately effectively improving the encapsulation yield and product reliability.

[0021] 4. After the substrate is encapsulated on both sides, the positioning plate is reset to release the restriction on the substrate, and then the encapsulated substrate is taken out. The stop plate slides inward to release the restriction on the sliding rod. The support column and the sliding rod then slide downward under the action of gravity. Subsequently, another sliding L-shaped frame slides to the preset position, the reset plate slides downward and pushes all the support columns back into the receiving groove. Then the stop plate is reset and limits the sliding rod. The ejection plate and the reset plate effectively realize the disengagement and reset of the support column, which significantly improves the overall practicality of the device. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the top of the rotating U-shaped frame of the present invention;

[0025] Figure 3 This is a schematic diagram of the bottom structure of the rotating U-shaped frame of the present invention;

[0026] Figure 4 This is a schematic diagram of the internal structure of the rotating U-shaped frame of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of the end of the sliding L-shaped frame of the present invention;

[0028] Figure 6 This is a side sectional view of the fixing plate of the present invention;

[0029] Figure 7 This is a schematic diagram of the stop plate of the present invention;

[0030] Figure 8 This is a schematic diagram of the internal structure of the fixing plate of the present invention.

[0031] In the diagram: 1-Fixed platform; 2-Support plate; 3-Rotating U-shaped frame; 4-Base plate; 5-Servo motor; 6-Mounting hole; 7-Lifting telescopic cylinder; 8-Machining clearance groove; 9-Positioning plate; 10-Clearing groove; 11-Control telescopic cylinder; 12-Support platform; 13-Lifting telescopic cylinder; 14-Drive telescopic cylinder; 15-Sliding L-shaped frame; 16-Reset plate; 17-Ejection plate; 18-Pneumatic telescopic cylinder; 19-Electrically controlled telescopic cylinder; 20-Fixed plate; 21-Sliding rod; 22-Gap groove; 23-Stop plate; 24-Support column; 25-Accommodation groove; 26-Clearing groove; 27-Anti-slip pad; 28-Through groove. Detailed Implementation

[0032] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0033] like Figures 1 to 8As shown, an integrated circuit chip packaging device includes a fixed platform 1, a rotating U-shaped frame 3 rotatably mounted on top of the fixed platform 1, a processing clearance groove 8 at the bottom of the rotating U-shaped frame 3, and positioning plates 9 slidably mounted around its perimeter. The thickness of the positioning plates 9 is no greater than the thickness of the substrate 4. A support platform 12 is vertically raised and lowered at the top of the fixed platform 1. The top structure of the support platform 12 is conformally arranged to the processing clearance groove 8. Sliding L-shaped frames 15 are slidably mounted on both sides of the processing clearance groove 8 at the bottom of the rotating U-shaped frame 3. A fixed plate 20 is fixedly mounted at one end of one of the sliding L-shaped frames 15. A gap groove 22 is provided inside the fixed plate 20. A stop plate 23 is slidably mounted inside the gap groove 22. A plurality of through grooves 28 are provided through the top of the stop plate 23. One end of the through groove 28 is an arc-shaped structure and is covered with an anti-slip pad 27. A plurality of vertically slidable sliding rods 21 are provided through the top of the fixed plate 20. The sliding rods 21 are located inside the through grooves 28. A support column 24 is provided at the bottom of the sliding rods 21. A plurality of receiving grooves 25 are provided at the bottom of the fixed plate 20.

[0034] A top plate 17 is provided above the fixed plate 20. Several pneumatic telescopic cylinders 18 are fixedly provided at the end of one of the sliding L-shaped frames 15. The telescopic ends of the pneumatic telescopic cylinders 18 are fixedly connected to the top plate 17.

[0035] Another sliding L-shaped frame 15 has a vertically sliding reset plate 16 through its end. Several lifting and telescopic cylinders 13 are fixedly installed at the end of the sliding L-shaped frame 15, and the telescopic ends of the lifting and telescopic cylinders 13 are fixedly connected to the reset plate 16.

[0036] One end of the stop plate 23 extends to the outside through the fixed plate 20 and the sliding L-shaped frame 15. Several electrically controlled telescopic cylinders 19 are fixedly provided at the end of the sliding L-shaped frame 15. The telescopic ends of the electrically controlled telescopic cylinders 19 are fixedly connected to the stop plate 23.

[0037] Several drive telescopic cylinders 14 are fixedly installed on the inner walls of the rotating U-shaped frame 3, and the telescopic ends of the drive telescopic cylinders 14 are fixedly connected to the sliding L-shaped frame 15.

[0038] The bottom of the rotating U-shaped frame 3 is provided with clearance grooves 10 on both sides of the processing clearance groove 8. Several control telescopic cylinders 11 are fixedly provided on the inner wall of the clearance groove 10 and the side wall of the rotating U-shaped frame 3. The telescopic end of the control telescopic cylinder 11 is fixedly connected to the positioning plate 9.

[0039] The bottom of the sliding L-shaped frame 15 is provided with a clearance groove 26 to avoid the positioning plate 9.

[0040] Several lifting telescopic cylinders 7 are fixedly installed on the top of the fixed platform 1, and the telescopic ends of the lifting telescopic cylinders 7 are fixedly connected to the support platform 12.

[0041] Two support plates 2 are fixedly installed on the top of the fixed platform 1. The two ends of the rotating U-shaped frame 3 are rotatably connected to the two support plates 2. A servo motor 5 is fixedly installed at the end of one of the support plates 2. The output shaft of the servo motor 5 is fixedly connected to the rotating U-shaped frame 3.

[0042] The top of the fixed platform 1 has several mounting holes 6.

[0043] Soft pads such as silicone pads can be installed at the bottom of the support column 24 to prevent damage to the components on the substrate 4.

[0044] The working principle of this device is as follows:

[0045] During the encapsulation process, the support platform 12 first moves upward to completely fill the processing clearance groove 8, placing the substrate 4 on the support platform 12. Then, the positioning plates 9 slide towards the substrate 4 until all positioning plates 9 are in contact with the sidewalls of the substrate 4, thus completing the positioning of the substrate 4. At this point, the first processing surface of the substrate 4 can be encapsulated. The support platform 12 supports the back of the substrate 4. After the first processing surface is encapsulated, one of the sliding L-shaped brackets 15 slides to a preset position, positioning the fixing plate 20 above the substrate 4. Then, the stop plate 23 slides inward, separating the anti-slip pad 27 from the sliding rod 21, thus releasing the restriction on the sliding rod 21. At this point, the sliding rod 21 is no longer constrained by the stop plate 23. The ejector plate 17 then moves downward and pushes the sliding rod 21 until the support column 24 completely disengages from the receiving groove 25. Afterward, the sliding rod 21 and... Under the influence of gravity, the support columns 24 slide down naturally until all the support columns 24 contact the substrate 4 or the devices on the substrate 4. Then, the stop plate 23 resets and limits the sliding rod 21. At this time, the shape of all the support columns 24 is consistent with the undulating shape of the first processing surface of the substrate 4. After the support platform 12 resets and avoids the undulating shape, the rotating U-shaped frame 3 rotates 180° so that the second processing surface of the substrate 4 faces upward and is exposed through the processing avoidance groove 8. All the support columns 24 form an effective and stable support for the first processing surface of the substrate 4 that fits the undulating shape. At this time, the second processing surface of the substrate 4 can be packaged. In the double-sided packaging process of integrated circuit chips, the clamping and fixing method adopted by this device avoids the edge area of ​​the processing surface of the substrate 4, so that the processing path planning does not need to detour or avoid the clamping point, thereby ensuring the smoothness of the processing process and the overall efficiency.

[0046] After one side of the substrate 4 is encapsulated, the device can automatically flip and change the processing side without disassembling the substrate 4, which greatly simplifies the process flow.

[0047] When encapsulating the second processing surface, the device can adaptively adjust according to the undulating shape of the first processing surface of the substrate 4, thereby providing uniform and fitting effective support, significantly reducing the risk of substrate 4 deformation or cracking caused by downward pressure, and ultimately effectively improving the encapsulation yield and product reliability.

[0048] After the substrate 4 is encapsulated on both sides, the positioning plate 9 resets to release the restriction on the substrate 4, and then the encapsulated substrate 4 is taken out. The stop plate 23 slides inward to release the restriction on the sliding rod 21. The support column 24 and the sliding rod 21 then slide downward under the action of gravity. Subsequently, another sliding L-shaped frame 15 slides to the preset position, and the reset plate 16 slides downward and pushes all the support columns 24 back into the receiving groove 25. Then the stop plate 23 resets and limits the sliding rod 21. The ejection plate 17 and the reset plate 16 effectively realize the disengagement and reset of the support column 24, which significantly improves the overall practicality of the device.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. An integrated circuit chip packaging device, characterized in that: The system includes a fixed platform (1), a rotating U-shaped frame (3) rotatably mounted above the fixed platform (1), a processing clearance groove (8) at the bottom of the rotating U-shaped frame (3), and positioning plates (9) slidably mounted around it. The thickness of the positioning plates (9) is not greater than the thickness of the base plate (4). A support platform (12) is vertically raised and lowered at the top of the fixed platform (1). The top structure of the support platform (12) is conforming to the shape of the processing clearance groove (8). Sliding L-shaped frames (15) are slidably mounted on both sides of the bottom of the rotating U-shaped frame (3) at the processing clearance groove (8). One end of the sliding L-shaped frame (15) is... A fixing plate (20) is fixedly provided in the part. A gap groove (22) is provided inside the fixing plate (20). A stop plate (23) is slidably provided in the gap groove (22). A number of through grooves (28) are provided through the top of the stop plate (23). One end of the through groove (28) is an arc structure and is covered with an anti-slip pad (27). A number of vertically sliding rods (21) are provided through the top of the fixing plate (20). The sliding rods (21) are located in the through grooves (28). A support column (24) is provided at the bottom of the sliding rods (21). A number of receiving grooves (25) are provided at the bottom of the fixing plate (20). A top plate (17) is provided above the fixed plate (20), and a plurality of pneumatic telescopic cylinders (18) are fixedly provided at the end of one of the sliding L-shaped frames (15), and the telescopic end of the pneumatic telescopic cylinder (18) is fixedly connected to the top plate (17). Another sliding L-shaped frame (15) has a vertically sliding reset plate (16) through its end. The end of the sliding L-shaped frame (15) is fixedly provided with a plurality of lifting telescopic cylinders (13), and the telescopic ends of the lifting telescopic cylinders (13) are fixedly connected to the reset plate (16). One end of the stop plate (23) extends to the outside through the fixed plate (20) and the sliding L-shaped frame (15). Several electrically controlled telescopic cylinders (19) are fixedly provided at the end of the sliding L-shaped frame (15). The telescopic end of the electrically controlled telescopic cylinder (19) is fixedly connected to the stop plate (23). The bottom of the rotating U-shaped frame (3) is provided with a clearance groove (10) on both sides of the processing clearance groove (8). The inner wall of the clearance groove (10) and the side wall of the rotating U-shaped frame (3) are both fixedly provided with a number of control telescopic cylinders (11). The telescopic end of the control telescopic cylinder (11) is fixedly connected to the positioning plate (9).

2. The integrated circuit chip packaging device according to claim 1, characterized in that: The rotating U-shaped frame (3) is fixedly provided with several drive telescopic cylinders (14) on its inner wall, and the telescopic end of the drive telescopic cylinder (14) is fixedly connected to the sliding L-shaped frame (15).

3. The integrated circuit chip packaging device according to claim 1, characterized in that: The bottom of the sliding L-shaped frame (15) is provided with a clearance groove (26) to avoid the positioning plate (9).

4. The integrated circuit chip packaging device according to claim 1, characterized in that: The top of the fixed platform (1) is fixedly provided with several lifting telescopic cylinders (7), and the telescopic ends of the lifting telescopic cylinders (7) are fixedly connected to the support platform (12).

5. The integrated circuit chip packaging device according to claim 1, characterized in that: The top of the fixed platform (1) is fixedly provided with two support plates (2), and the two ends of the rotating U-shaped frame (3) are rotatably connected to the two support plates (2). One of the support plates (2) is fixedly provided with a servo motor (5) at one end, and the output shaft of the servo motor (5) is fixedly connected to the rotating U-shaped frame (3).

6. The integrated circuit chip packaging apparatus according to claim 1, characterized in that: The top of the fixed platform (1) is provided with several mounting holes (6).

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