Multifunctional ground cleaning device in semiconductor field

Abstract

The invention discloses a multifunctional ground cleaning device in the semiconductor field. The multifunctional ground cleaning device comprises a ground cleaning device body. The floor cleaning device is internally provided with a control and filtering module, a movement module and a dust removal module. The control and filtration module is located above the movement module and comprises a filtration module, a control module and a fan module; the control module comprises a dust removal control sub-module and a motion control sub-module; the dust removal control sub-module is connected with a fan, a brush driving motor and a height control motor; the motion module comprises a driving module, a communication module and a sensing module; the driving module comprises a servo motor, a driving wheel and a power supply; the communication module is connected with an upper computer system; the sensing module integrates a laser radar and an inertial navigation sensor. According to the invention, the power burden of the fan under the same working condition is reduced; and meanwhile, the integration of the fan can effectively reduce the volume of the whole device and reduce the occupied area.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor production, in particular to a high-efficiency cleaning of dust generated on the ground in the process of a semiconductor workshop transportation system. BACKGROUND

[0002] A wafer is a silicon chip used for the production of silicon semiconductor integrated circuits. The wafer is used to produce chips for integrated circuits. In semiconductor production, an AGV small car transportation system is mainly responsible for accurately transporting semiconductor wafer boxes to designated positions, reducing human error, and having the advantages of flexibility and scalability. In the process of wafer production, ultra-fine dust is easily generated, which falls to the ground in the air; and in the process of AGV transportation, dust is generated by the friction between the wheels of the small car and the ground, which will make the ground dust fly up; at the same time, the repeated transportation of the AGV small car for a long time will make the floating dust gradually compacted into stubborn dust with strong adhesion, which will become suspended particles again at any time due to the vibration of the equipment and the walking of the staff; and the dust generated in the process of OHT overhead crane transportation system will also freely fall to the ground. Therefore, the amount of dust on the ground in the semiconductor workshop is large, and the nature of the dust is complex (the dust particle size is fine, and it is divided into flying dust and stubborn dust). The existence of dust will greatly reduce the yield rate in the process of wafer production.

[0003] In order to maintain the cleanliness of the semiconductor workshop and maintain the yield rate of wafer production, the ground needs to be cleaned regularly. In the existing semiconductor production process, manual cleaning is often used, which requires manual wiping, affecting the normal operation of other machines, and manual cleaning has instability and low automation.

[0004] The existing surface dust removal technology mainly includes contact type dust removal technology and non-contact type dust removal technology. The contact type dust removal technology mainly includes two ways of roll brush dust removal and sticky roller dust removal: roll brush dust removal is to use the brush on the brush body to move and clean the dust on the surface to be cleaned. When the force of the brush is greater than the adhesion of the dust, the dust will separate from the cleaning surface to complete the cleaning, which is usually used in combination with a negative pressure fan. The main advantages of this technology are simple structure, low cost, and strong cleaning ability for dust with high adhesion; the main disadvantage is poor cleaning ability for flying dust and ultra-fine dust. Sticky roller dust removal is to use the sticky material on the surface of the sticky roller to adhere the dust on the surface to be cleaned. When the adhesion of the dust is greater than the adhesion of the dust to the cleaning surface, the dust will separate from the cleaning surface to achieve the purpose of cleaning. The main advantages of this technology are simple structure and high cleaning tolerance (it has strong cleaning ability for both large particles and ultra-fine dust); the main disadvantage is that the sticky roller needs to be replaced frequently to maintain high cleaning ability, and its working mode can only clean the surface layer of the cleaning surface, and has limited cleaning ability for multi-layer dust.

[0005] The non-contact dust removal technology mainly includes three modes of negative pressure dust removal, blowing and sucking dust removal and pulse dust removal. The negative pressure dust removal mainly relies on the negative pressure generated by the fan to adsorb the dust on the surface to be cleaned, so that the cleaning purpose is achieved. The main advantage of this technology is simple structure and non-contact dust removal. The disadvantage is that the single negative pressure structure has limited cleaning capacity for dust with high adhesion. The blowing and sucking dust removal mainly includes positive pressure and negative pressure structures. The positive pressure is responsible for detaching and suspending the dust from the surface to be cleaned, and the negative pressure is responsible for collecting the raised dust, so that the cleaning purpose is achieved. The typical blowing and sucking dust removal technology is the air knife dust removal technology. The advantage of this technology is that the detachment capacity is further enhanced compared with the negative pressure dust removal technology. The disadvantage is that the two sets of fans of the positive pressure and the negative pressure increase the energy consumption and the volume, and the structure is more complex. The pulse dust removal mainly changes the positive pressure structure of the blowing and sucking dust removal technology, so that it can generate a pulse type oscillating airflow. This airflow further enhances the detachment capacity of the dust, and has a strong interference effect on the formation and stability of the boundary layer of the surface to be cleaned, which can detach finer dust. The disadvantage of this technology is that the structure is relatively complex, and the production and assembly cost is high. SUMMARY

[0006] In order to solve the problems existing in the prior art, the purpose of the present application is to provide a multifunctional floor cleaning device in the field of semiconductors. The multifunctional floor cleaning device is mainly suitable for semiconductor workshops and can clean the dust suspended and adhered on the ground.

[0007] In order to achieve the above purpose, the technical scheme adopted by the present application is as follows: A multifunctional floor cleaning device in the field of semiconductors, comprising a floor cleaning device; the floor cleaning device is provided with a control and filtration module, a motion module and a dust removal module; The control and filtration module is located above the motion module, and the control and filtration module comprises a filtration module, a control module and a fan module; The control module comprises a dust removal control submodule and a motion control submodule, and the dust removal control submodule is connected with a fan, a brush driving motor and a height control motor; The motion module comprises a driving module, a communication module and a sensing module. The driving module comprises a servo motor, a driving wheel and a power supply. The communication module is connected with an upper computer system. The sensing module integrates a laser radar and an inertial navigation sensor; The dust removal module comprises an ultrasonic cleaning module, a rotary cleaning module and a brush cleaning module, and the ultrasonic cleaning module is provided with a dust removal head; The filtration module comprises a high-efficiency filter.

[0008] Ion bars are arranged on the two sides of the rotary cleaning module and the ultrasonic cleaning module, which are used to neutralize the ions with electric charge on the ground, so as to improve the cleaning efficiency; The filter module is usually applied as a combination or a single component, such as a primary filter + a medium filter + a high-efficiency filter, a primary filter + a high-efficiency filter, or a high-efficiency filter. These forms can be applied in the device, depending on the requirements of different scenes.

[0009] Further, in some embodiments, the dust removal head is internally provided with two spaced cavities, i.e., a positive pressure cavity and a negative pressure cavity. The positive pressure cavity is connected to the air inlet, and the bottom surface of the positive pressure cavity is provided with a blowing gap. The negative pressure cavity is connected to the air outlet, and the bottom of the negative pressure cavity is provided with an elongated air extraction gap. The positive pressure cavity is spaced apart from the top plate of the dust removal head frame, and the height ratio of the positive pressure cavity to the height of the dust removal head cavity is 2 / 3~3 / 4:1.

[0010] Further, in some embodiments, the bottom of the negative pressure cavity is provided with a pair of first air extraction gaps, second air extraction gaps, and third air extraction gaps. The distance C1 between the blowing gap at the bottom of the dust removal head and the first air extraction gap is between 15~25mm, the distance C2 between the first air extraction gap and the second air extraction gap is between 10~15mm, and the dust removal gap is provided with the third air extraction gap at both ends. The distance C3 between the end of the dust removal gap and the third air extraction gap is between 5~8mm.

[0011] Further, in some embodiments, the control module includes a height control motor, and the filter module is provided with a primary filter and a high-efficiency filter. The ratio of the air volume of the blowing gap to the air volume of the first air extraction gap is 1:1.5~2, the air volume of the first air extraction gap is equal to the air volume of the second air extraction gap, and the ratio of the air volume of the blowing gap to the air volume of the third air extraction gap is 1:1.5~2. The ratio of the pressure of the first air extraction gap, the second air extraction gap, and the third air extraction gap to the pressure of the blowing gap is 1:8~12.

[0012] Further, in some embodiments, the dust removal head is provided with a baffle on both sides. The ground cleaning device includes a frame, and the frame is provided with the dust removal head at the bottom. The dust removal head is provided with a height control motor on the top surface, the height control motor is arranged on the frame, and the height control motor is connected to the dust removal head.

[0013] Further, in some embodiments, the bottom of the positive pressure cavity is provided with a blowing gap through a multi-stage pulse channel. The multi-stage pulse channel includes a two-stage expanded airway cavity and a two-stage narrowed channel. The multi-stage pulse channel is sequentially provided with an air gap spacing varying air inlet spacing D1, a first narrowed airway spacing D2, a first-stage expanded cavity spacing D3 of the two-stage expanded airway cavity, a second narrowed airway spacing D4, a second-stage expanded cavity spacing D5 of the two-stage expanded airway cavity, and a dust removal spacing of the blowing gap from top to bottom (from inside to outside). The air gap spacing on the multi-stage pulse channel is: the air inlet spacing D1, the first-stage expansion cavity spacing D3 of the two-stage expansion airway cavity, and the second-stage expansion cavity spacing D5 of the two-stage expansion airway cavity are the same (D1=D3=D5); The first narrowed airway spacing D2, the second narrowed airway spacing D4, and the dust blowing spacing of the air blowing gap are the same (D2=D4=air blowing gap 38 spacing), and the ratio of the air inlet spacing D1 to the first narrowed airway spacing D2 is 1:1.5~2 (i.e., the ratio of spacing D1:D2=1:1.5~2).

[0014] The different sections of the two-stage expansion airway cavity (positive pressure generating cavity) are not limited to rectangular forms, and can be changed into diamond, semicircular, triangular, or variable curved surface forms, which can be used according to different working conditions.

[0015] Further, in some embodiments, a rotating cleaning module is provided with a rotating module inner cavity and a rotating module outer bin which are separated and independent, a rotating cleaning head is arranged in the rotating module inner cavity of the rotating cleaning module, a pair of downwardly protruding and extending nozzles are arranged on the bottom of the rotating cleaning head, and a pair of spaced side isolation plates are arranged outside the rotating cleaning head. The rotating module outer bin is provided with a rotating negative pressure port at the top and a negative pressure suction gap at the bottom, the negative pressure suction gap is arranged outside the bottom end of the rotating module inner cavity, and the rotating negative pressure port and the negative pressure suction gap are connected in penetration. The rotating module inner cavity is arranged in the rotating module outer bin, the rotating positive pressure port is connected with the rotating module inner cavity in penetration, and the rotating negative pressure port is connected with the rotating module outer bin in penetration.

[0016] Further, in some embodiments, a brush cleaning module is arranged in front of the dust removal head, and the brush cleaning module is arranged at the bottom of the frame. The brush cleaning module is provided with a brush (bristles), a brush cleaning brush plate arranged on the top of the brush, and a brush negative pressure port (brush dust removal suction port) arranged above the brush.

[0017] The brush includes, but is not limited to, a roller brush, a disc brush, a row brush, a strip brush, and a special-shaped brush, and the meaning of the brush cleaning is to clean the ground in the form of the brush.

[0018] Further, in some embodiments, a positive pressure fan is arranged above the air inlet of the dust removal head. The dust removal head is provided with a suction port connected with a negative pressure air pipe, the negative pressure air pipe is connected with a cyclone separator, the cyclone separator is provided with a high-efficiency filter, and the high-efficiency filter is provided with a negative pressure fan.

[0019] The application is directed to the strict clean requirements and special dust properties of a semiconductor workshop, and a multifunctional cleaning device based on an AMR (autonomous mobile robot) system is designed, which has path planning and automatic obstacle avoidance and other automatic functions; and the cleaning system has multiple cleaning modes and can clean according to different dust types and scenes; and solves the problems of instability, low automation and the like caused by traditional manual cleaning.

[0020] The application is directed to the different spaces and dust removal flexibility requirements of a semiconductor workshop, and two integrated schemes of a dust removal head are proposed: a positive and negative pressure integrated one-piece and a positive pressure integrated one-piece. The two schemes remove the pipeline transportation of the conventional scheme, reduce the degree of airflow energy loss, and reduce the fan power burden under the same working condition; at the same time, the integration of the fan can effectively reduce the volume of the overall device and reduce the floor area.

[0021] The application is directed to the cleaning requirements of ultra-fine dust in a semiconductor workshop, and a number of positive pressure structures of a dust removal head capable of generating ultrasonic pulse airflow are proposed. These structures can convert the direct positive pressure airflow into pulse airflow with ultrasonic frequency through fixed special geometric features; the airflow with this characteristic can effectively destroy the formation and stability of the airflow boundary layer of the surface to be cleaned, and the airflow energy can act more deeply on the surface to be cleaned, so that the dust with finer particle size is detached, thereby achieving the purpose of removing ultra-fine dust. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of the framework of the embodiment of the application; Figure 2 It is a side view schematic diagram of the embodiment of the application; Figure 3 It is a structural schematic diagram of the embodiment of the application; Figure 4 It is a three-dimensional schematic diagram of the dust removal head part of the embodiment of the application; Figure 5 It is a sectional view of the dust removal head part of the embodiment of the application; Figure 6 It is a schematic diagram of the air duct of the dust removal head bottom plate of the embodiment of the application; Figure 7 It is a schematic diagram of the airflow of the dust removal head bottom plate of the embodiment of the application; Figure 8 It is a structural schematic diagram of the brush cleaning module of the application; Figure 9 It is a schematic diagram of the positive pressure integrated one-piece of the embodiment of the application; Figure 10 It is a structural schematic diagram of the multi-stage pulse channel of the embodiment of the application; Figure 11 It is a schematic diagram of the positive and negative pressure integrated one-piece of the embodiment of the application; Figure 12 The sectional structure diagram of the rotating cleaning module of the present application; Figure 13 The structural schematic diagram of the rotating cleaning module of the present application. DETAILED DESCRIPTION

[0023] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described clearly and completely below in combination with specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0024] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "transverse", "transverse", "upper", "lower", "front", "rear", "inner", "outer" and the like are the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0025] Referring to the frame schematic diagram of Fig. 1, Figure 1 Based on the AMR (autonomous mobile robot) system, the present application provides a multifunctional floor cleaning device 11, which comprises a control and filtering module 13, a motion module 14 and a dust removal module 15.

[0026] The control and filtering module 13 is located above the motion module 14 and is divided into the following three modules: a filtering module 21, a control module 22 and a fan module 23.

[0027] The filtering module 21 is usually applied as a combination or a single component, such as a primary filter + a medium filter + a high-efficiency filter, a primary filter + a high-efficiency filter, or a high-efficiency filter. Some of the descriptions below also reflect that these forms will be applied in the device, depending on the requirements of different working conditions.

[0028] The filtration module 21 is equipped with two filters: a pre-filter 31 and a high-efficiency filter 32. The pre-filter 31 can capture larger dust particles (millimeters or larger), while the high-efficiency filter 32 is responsible for capturing smaller dust particles (micrometers or submicrometers). This staged filtration design can improve the overall filtration efficiency and accuracy, and significantly extend the service life of the high-efficiency filter 32. The control module 22 includes two sub-modules: a dust removal control sub-module and a motion control sub-module. The dust removal control sub-module connects the fan 33, the brush drive motor 34, and the height control motor 35. The dust removal control sub-module can control the start and stop of the fan 33, the brush drive motor 34, and the height control motor 35 of the dust removal head 36. The motion control sub-module includes the motion and steering drive of the floor cleaning device 11 (AMR autonomous mobile robot) and various sensors. The main function of the motion control sub-module is to drive the floor cleaning device 11 (AMR) to move and turn, and at the same time realize path planning and automatic obstacle avoidance functions through various sensors.

[0029] The motion module 14 mainly includes a drive module 24, a communication module 25, and a perception module 26 for the ground cleaning device 11 (AMR autonomous mobile robot). The drive module 24 mainly includes servo motors, drive wheels, and power supply, and is responsible for the motion function of the ground cleaning device 11. The communication module 25 is mainly responsible for communicating with the host computer system and converting path planning and automatic obstacle avoidance functions into physical motion signals. The perception module 26 integrates multiple sensor types such as lidar and inertial navigation sensors, and can transmit its own motion and surrounding environment data to the host computer, which then issues instructions to the communication module 25 to realize path planning and automatic obstacle avoidance functions.

[0030] Furthermore, in one embodiment, the dust removal module 15 includes a brush cleaning module 27, an ultrasonic cleaning module 28, and a rotary cleaning module 29; the control module 22 includes a height control motor 35, which is mainly responsible for controlling the height of the ultrasonic cleaning module 28 (dust removal head 36) from the surface to be cleaned. The floor cleaning device 11 employs two modes to remove dust: one mode uses the ultrasonic cleaning module 28 (dust removal head 36) for ultrafine dust with low adhesion, and the other mode uses the brush cleaning module 27 and the ultrasonic cleaning module 28 (ultrasonic cleaning dust removal head 36) for deep cleaning of highly adhesive dust, thereby cleaning the dust on the semiconductor workshop floor.

[0031] The rotating cleaning module 29 and the ultrasonic cleaning module 28 are equipped with ion bars on both sides to neutralize charged ions on the ground, thereby improving cleaning efficiency.

[0032] See appendix Figure 12 Appendix Figure 13 As shown, attached Figure 12Appendix Figure 13 The diagram illustrates the structure of the rotary cleaning module 29. The rotary cleaning module 29 contains a separate (independent) rotary module inner cavity 68 and a rotary module outer chamber 69. A rotary cleaning head 61 is located within the rotary module inner cavity 68. The bottom of the rotary cleaning head 61 has paired nozzles 65 extending downwards on both sides. Spacing side partitions 66 are located on both sides of the rotary cleaning head 61. The paired nozzles 65 at the bottom of the rotary cleaning head 61 are spaced apart below the side partitions 66. A high-pressure airflow is provided to the rotary positive pressure port 64 by a rotary pneumatic device 63 (rotary positive pressure air source) to facilitate the rotary cleaning process. The cleaning head 61 rotates at high speed, using the rotational impact force of the airflow to lift up ultrafine particles onto the product surface. The rotating module outer chamber 69 of the rotating cleaning module 29 has a rotating negative pressure port 62 at the top and a negative pressure suction slit 67 at the bottom. The negative pressure suction slit 67 is located on the outer side of the bottom end of the rotating module inner cavity 68. The rotating negative pressure port 62 and the negative pressure suction slit 67 are connected. The rotating negative pressure port 62 at the bottom of the rotating module outer chamber 69 draws in dust through the negative pressure generated by the fan 33, and then the dust and air are separated by the filter module 21. The purified air is then discharged. The rotating module inner cavity 68 of the rotating cleaning module 29 is set in the rotating module outer chamber 69. The rotating module inner cavity 68 and the rotating module outer chamber 69 are separated and independent and do not communicate with each other. The rotating positive pressure port 64 is connected to the rotating module inner cavity 68 of the rotating cleaning module 29, and the rotating negative pressure port 62 is connected to the rotating module outer chamber 69 of the rotating cleaning module 29. The rotating negative pressure port 62 (top of the outer chamber) is connected to the negative pressure suction seam 67 (bottom of the outer chamber) through the rotating module outer chamber 69. The rotating cleaning positive pressure air duct is as follows: rotating air pressure device 63 → rotating positive pressure port 64 → rotating module inner cavity 68 → rotating cleaning head 61 → nozzle 65.

[0033] Furthermore, in one embodiment, the ultrafine dust cleaning employs ultrasonic cleaning principles. The dust removal head 36 has two internal chambers: a positive pressure chamber 37, connected to an air inlet 45, with a blowing slit 38 on its bottom surface; and a negative pressure chamber 39, connected to an air intake 46, which in turn connects to a negative pressure duct 57. The bottom of the negative pressure chamber 39 has six slender exhaust slits (a symmetrical set of first exhaust slit 41, second exhaust slit 42, and third exhaust slit 43). The positive pressure chamber 37 is spaced apart from the top plate of the dust removal head 36 frame, with the height of the positive pressure chamber 37 to the height of the dust removal head 36 chambers in a ratio of 2 / 3 to 3 / 4:1. A smaller cavity height ratio shortens the path of the positive pressure airflow, reduces energy loss, and concentrates the output ultrasonic airflow energy, thus increasing the desorption capacity for dust. At the same time, further reducing the height ratio will increase the manufacturing cost and installation difficulty of the positive pressure cavity.

[0034] Furthermore, in one embodiment, see Appendix Figure 7 As shown, the distance between the blowing gap 38 and the first exhaust gap 41 at the bottom of the dust removal head 36 is designed as follows: the distance C1 between the two gaps, the blowing gap 38 and the first exhaust gap 41, is between 15 and 25 mm. This design is beneficial for the ultrasonic airflow generated by the positive pressure chamber 37 to effectively act on the cleaning surface and prevent the negative pressure generated by the negative pressure chamber from affecting the airflow. The distance C2 between the first exhaust gap 41 and the second exhaust gap 42 is between 10 and 15 mm (which increases the cleaning area while preventing the airflow of the two exhaust gaps from interfering with each other). A third exhaust gap 43 is provided at both ends of the blowing gap 38, and the distance C3 between the end of the blowing gap 38 and the third exhaust gap 43 is between 5 and 8 mm. The design of the first exhaust slit 41 and the third exhaust slit 43 helps to prevent dust from escaping to areas other than the dust removal head 36 after the ultrasonic airflow generated by the positive pressure chamber 37 desorbs the dust on the cleaning surface; the design of the second exhaust slit 42, in addition to eliminating the possibility of dust escape, also has the function of pre-cleaning the surface to be cleaned, thus improving the degree of cleaning.

[0035] Airflow ratio: The ratio of airflow from the blowing gap 38 to the airflow from the first exhaust gap 41 is 1:1.5~2; the airflow from the first exhaust gap 41 is equal to the airflow from the second exhaust gap 42; and the ratio of airflow from the blowing gap 38 to the airflow from the third exhaust gap 43 is 1:1.5~2. This airflow ratio ensures that the air generated in the positive pressure chamber 37 is drawn away by the negative pressure, preventing desorbed dust from escaping outside the dust collector head 36 area at any given time.

[0036] Pressure relationship: The pressure ratio between the blowing gap 38 and the exhaust gaps (first exhaust gap 41, second exhaust gap 42, and third exhaust gap 43) is 8~12:1. This pressure relationship is beneficial for the desorption of dust from the surface to be cleaned by the positive pressure chamber 37 (positive pressure module), while ensuring the collection of desorbed dust by the negative pressure chamber 39 (negative pressure module).

[0037] The dust removal head 36 is further equipped with baffles 44 on both sides to more effectively remove all dust particles and avoid the risk of dust escaping. The floor cleaning device 11 includes a frame 51, with a dust removal head 36 at the bottom of the frame 51 and a height control motor 35 on the dust removal head 36. The height control motor 35 is mounted on the frame 51. The height of the dust removal head 36 is adjusted from the surface to be cleaned by the drive of the height control motor 35, thereby adapting to various working conditions and adjusting the distance between the dust removal head 36 and the surface of the object being cleaned.

[0038] Furthermore, in one embodiment, see Appendix Figure 11As shown in the schematic diagram of the multi-stage pulse channel 47, the bottom of the positive pressure chamber 37 is provided with a blowing gap 38 that passes through the multi-stage pulse channel 47. The multi-stage pulse channel 47 includes a double-stage expansion airway cavity 59 and a two-stage narrowing surface channel. The multi-stage pulse channel 47 is provided with the following structures in sequence from top to bottom (from inside to outside): air inlet gap D1 with varying air gap spacing, first narrowing airway gap D2, first stage expansion cavity gap D3 of the double-stage expansion airway cavity 59, second narrowing airway gap D4, second stage expansion cavity gap D5 of the double-stage expansion airway cavity 59, and dust blowing gap 38; the width of the blowing gap 38 is the dust blowing gap.

[0039] The two-stage expansion airway cavity 59 (positive pressure generating cavity) is not limited to a rectangular shape in different cross sections. It can also be rhomboid, semi-circular, triangular, or curved. All of these shapes are variations of the rectangular shape and can be adopted according to different working conditions.

[0040] The air gap spacing on the multi-stage pulse channel 47 is the same as that of the air inlet spacing D1, the first-stage expansion cavity spacing D3 of the dual-stage expansion airway cavity 59, and the second-stage expansion cavity spacing D5 of the dual-stage expansion airway cavity 59 (D1=D3=D5). The distances of the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the dust blowing distance of the blowing gap 38 are the same (D2=D4=the distance of the blowing gap 38). The ratio of spacing D1:D2 is 1:1.5~2 (D1:D2=1:1.5~2). The airflow passes through D1→D2→D3→D4→D5→blowing gap 38, and undergoes airway fluctuation changes from wide airway D1→narrow airway D2→wide airway D3→narrow airway D4→wide airway D5→narrow airway 38. When the airflow enters the wide airway from the narrow airway, the airflow on both sides of the airway develops into a free shear flow, forming a large vortex at the wide airway. The main airflow continues to flow downward and merges with the airflow in the wide airway at the opening and continues to move downward, resulting in a high-frequency, high-speed pulsed airflow. The airflow pulse frequency reaches the ultrasonic frequency, and the air outlet of the blowing gap 38 performs impact dust blowing and sweeping.

[0041] When encountering stubborn dust caused by repeated rolling, the device will activate a second cleaning mode: First, the brush cleaning module 27 is used to sweep the surface to be cleaned. This stage will separate the stubborn dust from the surface to be cleaned. Most of the dust will enter the brush negative pressure port 53 (brush dust removal port) along with the brush 48 (brush bristles) and be collected. At the same time, the brush cleaning plate 52 is also configured inside to remove the dust adhering to the brush 48 and prevent the adsorbed dust from falling back onto the cleaning surface. Then, a small amount of dust remaining on the surface will be removed by the rotating cleaning device. Finally, the ultrafine particles will be cleaned by the ultrasonic cleaning module. The multi-stage dust removal mode will completely remove the particles.

[0042] The brush 48 includes, but is not limited to, forms of brushes such as roller brushes, disc brushes, row brushes, strip brushes, and irregularly shaped brushes. The meaning of brush 48 cleaning is to clean the floor using a brush.

[0043] To address the space and dust removal requirements of different semiconductor workshops, this application innovatively proposes two integrated solutions for the dust removal head 36: a positive pressure integrated solution and a positive and negative pressure integrated solution.

[0044] The integrated positive pressure design integrates the positive pressure fan 54 into the upper part of the ultrasonic dust removal head 36, while the negative pressure fan 55 remains in the overall frame 51. Because the airflow transmission distance between the positive pressure fan 54 and the dust removal head 36 is significantly shortened (eliminating the need for a flexible hose connection), this design effectively reduces energy loss from the positive pressure fan 54 to the outlet of the dust removal head 36.

[0045] See appendix Figure 9 As shown, attached Figure 9 It is a positive pressure integrated solution, which helps control overall costs. In addition, the solution integrates the negative pressure fan 55 with the dust collection chamber, and the dust collection head 36 is equipped with a pressure sensor 56, which is suitable for production environments with high dust generation and helps reduce the frequency of cleaning and maintenance.

[0046] See appendix Figure 10 As shown, attached Figure 10 This is a schematic diagram of an integrated positive and negative pressure system. This integrated system further integrates both the positive pressure fan 54 and the negative pressure fan 55 onto the ultrasonic dust collector head 36, eliminating the conventional two-stage filtration structure. Instead, it uses a combination of a cyclone separator 58 and a high-efficiency filter 32 to collect dust: the cyclone separator 58 first separates and captures large-diameter particles, and then the high-efficiency filter 32 intercepts ultrafine dust to prevent escape. As mentioned earlier, removing the flexible hose significantly reduces pressure loss within the pipeline. For semiconductor workshops with limited space and low dust generation, integrating the positive and negative pressure fans 54 and 55 onto the dust collector head 36 helps to further reduce the overall equipment size and improve space utilization.

[0047] The two integration schemes in this application significantly reduce the overall system size and footprint by integrating the positive pressure fan 54 (or together with the negative pressure fan 55) onto the dust collector head 36, thereby better meeting the space-efficient utilization requirements of semiconductor workshops. Simultaneously, due to reduced airflow energy loss, the required fan power is correspondingly lower to achieve the same outlet airflow conditions at the dust collector head 36. This not only improves the flexibility of fan selection but also creates conditions for selecting more compact fan models.

[0048] The AMR (Autonomous Mobile Robot) floor cleaning device 11 disclosed in this application is suitable for dust collection in semiconductor workshops. The device features dust removal path planning and automatic obstacle avoidance; it also incorporates two cleaning modes, one for ultrafine dust and the other for stubborn dust with strong adhesion, maintaining the cleanliness requirements of semiconductor workshops and ensuring high yield rates in wafer production. Compared to traditional single dust removal modes, it is highly targeted, has a high dust removal rate, and meets the cleanliness requirements of semiconductor workshops.

[0049] Furthermore, this application innovatively proposes two integrated dust collector head 36 solutions to address the differences in spatial layout and dust removal requirements across various semiconductor workshops: positive pressure integration and positive / negative pressure integration. These two solutions integrate the fan inside or near the dust collector head 36, eliminating the need for flexible hose connections in traditional designs, thereby significantly shortening the airflow path and reducing pressure loss. The volume and footprint of the floor cleaning device 11 are also significantly optimized: the positive pressure integration solution reduces volume by approximately 30%, and the positive / negative pressure integration solution reduces volume by approximately 50%.

[0050] In this application, the arrangement of the brush cleaning module 27, ultrasonic cleaning module 28, and rotary cleaning module 29 is shown as only one arrangement. In actual applications, different arrangements and the number of dust removal methods will be adjusted according to different working conditions. Following the order from the front to the rear of the AMR (Autonomous Mobile Robot) ground cleaning device 11, possible arrangements include: 1. Brush cleaning module 27 + Rotary cleaning module 29 + Ultrasonic cleaning module 28 (with accessories) Figure 2 Arrangement method); 2. Ultrasonic cleaning module 28 + brush cleaning module 27 + rotary cleaning module 29; 3. Rotary cleaning module 29 + ultrasonic cleaning module 28; 4. Ultrasonic cleaning module 28 + rotary cleaning module 29; 5. Ultrasonic cleaning module 28; 6. Ultrasonic cleaning module 28 + brush cleaning module 27 + rotary cleaning module 29 + ultrasonic cleaning module 28; 7. Ultrasonic cleaning module 28 + brush cleaning module 27 + rotary cleaning module 29 + brush cleaning module 27 + ultrasonic cleaning module 28.

[0051] Meanwhile, the layout of the base plate may also be adjusted depending on the dust removal method, such as changing the dust removal device from horizontal to vertical placement (see attached). Figure 2 (The middle part is placed horizontally).

[0052] That is, the three dust removal methods, the number of each method applied, and the layout of each method on the base plate will change according to the working conditions and will be applied flexibly.

[0053] To address the problem of desorption and collection of ultrafine dust in semiconductor workshops, this application designs several ultrasonic positive pressure dust removal head structures 36. The ultrasonic positive pressure structure can transform positive pressure DC airflow into pulsed airflow with ultrasonic frequency. The airflow with high-frequency oscillation properties can effectively destroy the airflow boundary layer, thereby removing micron- and submicron-sized dust and meeting the cleanliness requirements of semiconductor workshops.

[0054] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this application should be determined by the appended claims.

Claims

1. A multifunctional floor cleaning device for the semiconductor industry, comprising: A floor cleaning device (11); characterized in that the floor cleaning device (11) is provided with: a control and filtration module (13), a motion module (14) and a dust removal module (15). The control and filtration module (13) is located above the motion module (14). The control and filtration module (13) includes a filtration module (21), a control module (22), and a fan module (23). The control module (22) includes a dust removal control submodule and a motion control submodule. The dust removal control submodule is connected to the fan (33), the brush drive motor (34), and the height control motor (35). The motion module (14) includes a drive module (24), a communication module (25), and a sensing module (26). The drive module (24) includes a servo motor, drive wheels, and power supply. The communication module (25) is connected to the host computer system. The sensing module (26) integrates a lidar and an inertial navigation sensor. The dust removal module (15) includes an ultrasonic cleaning module (28), a rotary cleaning module (29), and a brush cleaning module (27). The ultrasonic cleaning module (28) is equipped with a dust removal head (36). The filtration module (21) includes a high-efficiency filter (32).

2. The multifunctional floor cleaning device for the semiconductor field according to claim 1, characterized in that, The dust removal head (36) has two spaced cavities: a positive pressure cavity (37) and a negative pressure cavity (39). The positive pressure cavity (37) is connected to the air inlet (45), and there is a blower slit (38) on the bottom surface of the positive pressure cavity (37). The negative pressure cavity (39) is connected to the air inlet (46), and there is a narrow exhaust slit at the bottom of the negative pressure cavity (39). There is a gap between the positive pressure cavity (37) and the top plate of the dust removal head (36) frame. The ratio of the height of the positive pressure cavity (37) to the height of the dust removal head (36) cavity is 2 / 3 to 3 / 4:

1.

3. A multifunctional floor cleaning device for the semiconductor field according to claim 2, characterized in that, The bottom of the negative pressure cavity (39) is provided with a first exhaust slit (41), a second exhaust slit (42), and a third exhaust slit (43). The distance C1 between the air blowing gap (38) and the first exhaust gap (41) at the bottom of the dust removal head (36) is between 15 and 25 mm, and the distance C2 between the first exhaust gap (41) and the second exhaust gap (42) is between 10 and 15 mm; a third exhaust gap (43) is provided at both ends of the dust blowing gap (38), and the distance C3 between the end of the dust blowing gap (38) and the third exhaust gap (43) is between 5 and 8 mm.

4. A multifunctional floor cleaning device for the semiconductor field according to claim 1, characterized in that, The control module (22) includes a height control motor (35), and the filter module (21) is provided with a pre-filter (31) and a high-efficiency filter (32). The air volume ratio of the blower gap (38) to the air volume of the first exhaust gap (41) is 1:1.5~2, the air volume of the first exhaust gap (41) is equal to the air volume of the second exhaust gap (42), and the air volume ratio of the blower gap (38) to the air volume of the third exhaust gap (43) is 1:1.5~2. The pressure ratio between the first exhaust slit (41), the second exhaust slit (42), the third exhaust slit (43) and the blowing slit (38) is 1:8~12.

5. A multifunctional floor cleaning device for the semiconductor field according to claim 1, characterized in that, The dust removal head (36) is provided with baffles (44) on both sides; the ground cleaning device (11) includes a frame (51), the bottom of the frame (51) is provided with a dust removal head (36), the dust removal head (36) is provided with a height control motor (35) on the top of the dust removal head (36), the height control motor (35) is set on the frame (51), and the height control motor (35) is connected to the dust removal head (36).

6. A multifunctional floor cleaning device for the semiconductor field according to claim 2, characterized in that, The bottom of the positive pressure chamber (37) is provided with a blowing gap (38) that is traversed by a multi-stage pulse channel (47). The multi-stage pulse channel (47) includes a double-stage expansion airway cavity (59) and a two-stage narrowing surface channel. The multi-stage pulse channel (47) is provided with an air inlet gap D1 with varying air gap spacing, a first narrowing airway gap D2, a first-stage expansion cavity gap D3 of the double-stage expansion airway cavity (59), a second narrowing airway gap D4, a second-stage expansion cavity gap D5 of the double-stage expansion airway cavity (59), and a dust blowing gap (38) from top to bottom. The air gap spacing on the multi-stage pulse channel (47) is the same as that of the air inlet spacing D1, the first stage expansion cavity spacing D3 of the dual-stage expansion airway cavity (59), and the second stage expansion cavity spacing D5 of the dual-stage expansion airway cavity (59). The dust blowing distances of the first narrowing airway spacing D2, the second narrowing airway spacing D4, and the air blowing gap (38) are the same, and the ratio of the air inlet spacing D1 to the first narrowing airway spacing D2 is 1:1.5~2.

7. A multifunctional floor cleaning device for the semiconductor field according to claim 1, characterized in that, The rotating cleaning module (29) is provided with a separate rotating module inner cavity (68) and a rotating module outer compartment (69). The rotating module inner cavity (68) of the rotating cleaning module (29) is provided with a rotating cleaning head (61). The bottom sides of the rotating cleaning head (61) are provided with a pair of nozzles (65) that protrude downwards. The rotating cleaning head (61) is provided with spaced side isolation plates (66) on both sides. The pair of nozzles (65) at the bottom of the rotating cleaning head (61) are located at the lower part of the side isolation plates (66). The rotating module (29) has a rotating negative pressure port (62) at the top of the rotating module outer chamber (69) and a negative pressure suction seam (67) at the bottom of the rotating module outer chamber (69). The negative pressure suction seam (67) is located on the outer side of the bottom end of the rotating module inner cavity (68), and the rotating negative pressure port (62) and the negative pressure suction seam (67) are connected in a through manner. The inner cavity (68) of the rotating module is located in the outer chamber (69) of the rotating module. The positive pressure port (64) of the rotating module is connected to the inner cavity (68) of the rotating module, and the negative pressure port (62) of the rotating module is connected to the outer chamber (69) of the rotating module.

8. A multifunctional floor cleaning device for the semiconductor field according to claim 1, characterized in that, The dust removal head (36) is provided with a brush cleaning module (27) in front of it, and the brush cleaning module (27) is located at the bottom of the frame (51); The brush cleaning module (27) is equipped with a brush (48), a brush cleaning plate (52) with resistance is provided on the brush (48), and a brush negative pressure port (53) is provided above the brush (48).

9. A multifunctional floor cleaning device for the semiconductor field according to claim 1, characterized in that, A positive pressure fan (54) is provided on the air inlet (45) of the dust removal head (36); The negative pressure chamber (39) of the dust removal head (36) is provided with an air inlet (46), the air inlet (46) is connected to the negative pressure air pipe (57), the negative pressure air pipe (57) is connected to the cyclone separator (58), the cyclone separator (58) is provided with a high-efficiency filter (32), and the high-efficiency filter (32) is provided with a negative pressure fan (55).

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