Precise coating machine for producing adhesive film for laminating IC (integrated circuit) carrier plate

Abstract

The invention discloses a precise coating machine for producing an adhesive film for IC carrier plate pressing, and relates to the field of coating machine application, the precise coating machine comprises a control device, the inner side of the control device is rotatably connected with a rotating frame, the rotating frame is of a hexagonal structure, the rotating frame is connected with a first driving device, and the side face of the rotating frame is provided with a plurality of sets of vacuum coating plates; the multiple sets of vacuum coating plates are connected with a vacuum pump system, and a coating mechanism and a flattening mechanism are arranged above the rotating frame. According to the vacuum coating device, the hexagonal rotating frame is arranged to bear and install the multiple sets of vacuum coating plates, the vacuum coating plate right above is located at the coating station, the inclined feeding station and the inclined discharging station are arranged adjacent to the coating station, and due to the fact that the discharging station inclines downwards, a coated base material can fall down along with the situation after the vacuum coating plates are closed; and automatic discharging is achieved, then base material feeding, base material coating and base material discharging can be synchronously carried out on different stations of the rotating frame, and the coating production efficiency of the adhesive film is improved.

Description

Technical Field

[0001] This invention relates to the field of coating machine applications, specifically a precision coating machine for producing adhesive films for IC substrate lamination. Background Technology

[0002] IC substrate lamination film is a key material used in the manufacture of integrated circuit packaging substrates. It is mainly used to form a layered structure on the core board to achieve high-density circuit interconnection. It is the core material for manufacturing high-end processor (such as CPU and GPU) packaging substrates. It is bonded to the core board through vacuum lamination process to form fine wire patterns, supporting the transition connection between the nanoscale circuits inside the chip and the millimeter-level circuits on the external PCB board.

[0003] The adhesive film used for IC substrate lamination can be produced using a high-precision flatbed coating machine. A flatbed coating machine is a machine that precisely controls the transfer amount and distribution pattern of adhesive / coating on the surface of flexible / rigid substrates through a coating head with a specific structure, such as a doctor blade, micro-concave roller, or slit nozzle, to form a coating with uniform thickness and a smooth surface. Finally, the finished adhesive film is obtained after drying. For the application of flatbed coating machines, the substrate is usually laid flat on a vacuum adsorption plate by an operator. Using the principle of vacuum adsorption, the substrate is made to be flat and tightly adhered to the worktable. Then, the linear moving mold is activated to drive the slit mold to move, and the adhesive is sprayed evenly from the slit mold to form a uniform coating on the surface of the substrate. The coating can also be accelerated by using an infrared heating device.

[0004] When using a flatbed coating machine, the main steps include substrate feeding, coating, and substrate unloading. This means that the film production process must be carried out step by step from feeding to coating to unloading. If the relevant steps of film production can be carried out simultaneously, the efficiency of film coating can be improved. For some flexible substrates, when using a vacuum adsorption plate for adsorption, the operator usually needs to manually pre-lay the substrate before the vacuum adsorption plate can be activated to further adsorb and flatten the substrate. If the substrate has wrinkles from the beginning, even if the vacuum adsorption plate relies on adsorption, it will still cause unevenness of the substrate, thus affecting the coating work. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a precision coating machine for producing adhesive films for IC substrate lamination, so as to solve the technical problems mentioned in the background above.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a precision coating machine for producing adhesive film for IC substrate lamination, comprising a control device, wherein a rotating frame is rotatably connected to the inner side of the control device, the rotating frame having a hexagonal structure, a first driving device is connected to the rotating frame, and multiple sets of vacuum coating plates are mounted on the side of the rotating frame, the multiple sets of vacuum coating plates are connected to a vacuum pump system, and a coating mechanism and a flattening mechanism are provided above the rotating frame, the flattening mechanism including a connecting plate, a telescopic component connected to the top of the connecting plate, a mounting plate provided below the connecting plate, a guide rod provided to the top of the mounting plate, a first spring sleeved on the outside of the guide rod, the guide rod and the connecting plate being movably connected through each other, and two sets of mounting frames being rotatably connected to the bottom of the mounting plate via a torsion spring, the ends of the two sets of mounting frames being rotatably connected to a clamping wheel.

[0007] By adopting the above technical solution, a hexagonal rotating frame is used to support and install multiple sets of vacuum coating plates. The set of vacuum coating plates at the top is located at the coating station. The coating station is adjacent to an inclined loading station and a unloading station. Each set of vacuum coating plates has an extension plate on its side. Since the loading station is inclined upwards, the extension plate can prevent the substrate from falling. The operator quickly places the substrate at the loading station, and then the rotating frame rotates to bring the substrate into the coating station for coating. It then rotates again to bring the substrate into the unloading station. Since the unloading station is inclined downwards, the coated substrate can slide down smoothly after the vacuum coating plate is closed, realizing automatic unloading. Thus, substrate loading, substrate coating and substrate unloading can be carried out simultaneously at different stations of the rotating frame, improving the efficiency of the coating production of the adhesive film.

[0008] The present invention is further configured such that multiple sets of vacuum coating plates are evenly distributed on the side of the rotating frame, and the multiple sets of vacuum coating plates are connected to a vacuum pump system through a rotary joint and an electronic control valve.

[0009] Preferably, multiple sets of vacuum coating plates are installed on the side of the rotating frame. The set of vacuum coating plates directly above is the coating station, and the adjacent stations are the loading station and the unloading station. The rotating frame rotates 60° each time, allowing the substrate to move between the loading station, the coating station, and the unloading station. Thus, the loading, coating, and unloading of the substrate can be performed simultaneously, thereby improving the efficiency of film coating. The unloading station is equipped with an infrared heating device, which can shorten the solidification time of the adhesive. Multiple sets of electronic control valves control different vacuum coating plates respectively.

[0010] The present invention is further configured such that each of the multiple sets of vacuum coating plates is provided with an extension plate on its side. When the vacuum coating plate rotates and rises with the rotating frame, the extension plate is used to limit the substrate from falling.

[0011] Preferably, for the loading station, the rotating frame rotates 60° and rises, so the extension plate of the vacuum coating plate at the loading station can be used to limit the overlap of the base groove and prevent the base groove from falling off during the rotation of the rotating frame.

[0012] The present invention is further configured such that the coating mechanism includes a guide rail bracket mounted on the top of the control device, a movable frame movably mounted on the inner side of the guide rail bracket, the movable frame being connected to a second driving device, and a slit coating mold mounted on the bottom of the movable frame, the slit coating mold being connected to an adhesive injection system.

[0013] Preferably, a coating mechanism is provided for coating the substrate with adhesive. The guide rail support, the moving frame, and the second drive device together form a linear moving module for driving the slit coating mold to move back and forth. The linear moving module can also be a combination of guide rail and ball screw. The adhesive injection system is used to deliver the mixed coating adhesive to the slit coating mold through a hose. A precision height adjustment component is provided between the slit coating mold and the moving support to adjust the gap size between the slit coating mold and the vacuum coating plate, thereby controlling the coating thickness of the substrate.

[0014] The present invention is further configured such that multiple sets of guide rods are provided, and a first spring is sleeved on the outside of each set of guide rods. The multiple sets of guide rods are movably connected through the connecting plate, and the multiple sets of guide rods are evenly distributed.

[0015] Preferably, by setting multiple sets of guide rods, the movement between the connecting plate and the mounting plate is made more stable.

[0016] The present invention is further configured such that two sets of extrusion rods are movably mounted on the bottom of the mounting plate, and a second spring is sleeved on the outside of each set of extrusion rods.

[0017] Preferably, by setting a compression rod and a second spring, the compression rod can be used to push the two sets of mounting brackets, so that the two sets of mounting brackets can initially expand and separate.

[0018] The present invention is further configured such that the two sets of mounting brackets are symmetrically arranged, and each set of mounting brackets has an extension rod on its side. The two sets of extension rods are symmetrically arranged and are located directly below the compression rod.

[0019] Preferably, an extension rod is provided to receive the compression rod, so that the compression rod descends and pushes the two sets of mounting brackets to initially expand and separate through the extension rod.

[0020] The invention is further configured such that a material feeding slide is provided on one side of the control device, and a movable plate is installed on the side of the material feeding slide by means of a torsion spring, the movable plate being located in the mating groove of the two sets of vacuum coating plates.

[0021] Preferably, by setting a movable plate mounted with a torsion spring, and the movable plate is located in the mating groove of the two sets of vacuum coating plates, the substrate sliding down from the vacuum coating plate at the unloading station can fall more effectively onto the movable plate and the unloading slide. During each rotation of the rotating frame, the vacuum coating plate at the unloading station will squeeze and impact the movable plate, causing it to flip over and then reset under the action of the torsion spring.

[0022] In summary, the present invention has the following main beneficial effects: 1. This invention uses a hexagonal rotating frame to support and install multiple sets of vacuum coating plates. One set of vacuum coating plates is located at the top of the frame and positioned at the coating station. Adjacent to the coating station are inclined loading and unloading stations. Each set of vacuum coating plates has an extension plate on its side. Since the loading station is inclined upwards, the extension plate can prevent the substrate from falling. The operator quickly places the substrate at the loading station, and then the rotating frame rotates to bring the substrate into the coating station for coating. It then rotates again to bring the substrate into the unloading station. Since the unloading station is inclined downwards, the coated substrate can slide down smoothly after the vacuum coating plate is closed, achieving automatic unloading. Thus, substrate loading, substrate coating, and substrate unloading can be carried out simultaneously at different stations of the rotating frame, improving the efficiency of the coating production of the adhesive film.

[0023] 2. This invention enables the initial flattening of a substrate by setting up a flattening mechanism. The flattening mechanism mainly includes two sets of clamping rollers mounted and fitted together using torsion springs. When the flattening mechanism descends under the pushing action of the telescopic component, initially, because the two sets of mounting brackets supporting the clamping rollers are at a vertical angle, the two sets of clamping rollers remain closed. The telescopic component only pushes the connecting plate down to compress the first spring. When the connecting plate continues to descend and press the pressing rod, the pressing rod presses the two sets of extension rods, allowing the two sets of mounting brackets to expand outward under force. As the flattening mechanism continues to descend and be subjected to force, the two sets of mounting brackets will further open, thereby using the rolling of the clamping rollers to initially flatten the substrate. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram showing the distribution of the feeding chute and movable plate of the present invention; Figure 3 This is a schematic diagram showing the distribution of the rotating frame, multiple sets of vacuum coating plates, and multiple sets of extension plates of the present invention. Figure 4 This is a schematic diagram of the coating mechanism structure of the present invention; Figure 5 This is a schematic diagram of the distribution of the slit coating mold of the present invention; Figure 6 This is a schematic diagram showing the interlocking distribution of the movable plate and the two sets of vacuum-coated plates of the present invention; Figure 7This is a schematic diagram of the flattening mechanism of the present invention; Figure 8 This is a schematic diagram of the expansion of the flattening mechanism of the present invention.

[0025] Explanation of reference numerals in the attached figures: 1. Control equipment; 2. Rotating frame; 3. Vacuum coating plate; 4. Extension plate; 5. Rotary joint; 6. Coating mechanism; 601. Guide rail bracket; 602. Moving frame; 603. Slit coating mold; 7. Flattening mechanism; 701. Connecting plate; 702. Mounting plate; 703. Guide rod; 704. First spring; 705. Mounting frame; 706. Pressure wheel; 707. Extension rod; 708. Extrusion rod; 709. Second spring; 8. Telescopic assembly; 9. Discharge slide; 10. Movable plate. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0027] The embodiments of the present invention will now be described.

[0028] Please see Figures 1-8 A precision coating machine for producing adhesive film for IC substrate lamination includes a control device 1. A rotating frame 2, hexagonal in structure, is rotatably connected to the inner side of the control device 1. The rotating frame 2 is connected to a first driving device, such as a servo motor and gear transmission assembly. Multiple sets of vacuum coating plates 3 are mounted on the side of the rotating frame 2. The surface of each vacuum coating plate 3 has a uniformly distributed set of negative pressure holes for negative pressure adsorption of the substrate. The multiple sets of vacuum coating plates 3 are connected to a vacuum pump system. A coating mechanism 6 and a flattening mechanism 7 are arranged above the rotating frame 2. The coating mechanism 6 is used to uniformly coat the adhesive onto the surface of the substrate, and the flattening mechanism 7 is used for preliminary coating of the substrate. The flattening mechanism 7 is designed to make the substrate more flat, so that it can be further laid flat on the surface of the vacuum coating plate 3 by negative pressure adsorption. The flattening mechanism 7 includes a connecting plate 701, and a telescopic component 8, such as an electric telescopic rod, is connected to the top of the connecting plate 701. A mounting plate 702 is provided below the connecting plate 701, and a guide rod 703 is provided at the top of the mounting plate 702. A first spring 704 is sleeved on the outside of the guide rod 703. The guide rod 703 and the connecting plate 701 are movably connected through each other. Two sets of mounting brackets 705 are rotatably connected to the bottom of the mounting plate 702 by a torsion spring. The ends of the two sets of mounting brackets 705 are rotatably connected to a pressure wheel 706.

[0029] Please refer to the above embodiments for further details. Figure 1 and Figure 3Multiple sets of vacuum coating plates 3 are evenly distributed on the side of the rotating frame 2. The multiple sets of vacuum coating plates 3 are connected to a vacuum pump system through a rotary joint 5 and an electronic control valve. By installing multiple sets of vacuum coating plates 3 on the side of the rotating frame 2, the set of vacuum coating plates 3 directly above is the coating station. The loading station and unloading station are adjacent to the coating station. The rotating frame 2 rotates 60° each time, so that the substrate moves between the loading station, the coating station and the unloading station. Thus, the loading, coating and unloading of the substrate can be carried out simultaneously, thereby improving the efficiency of film coating. The unloading station is equipped with an infrared heating device, which can shorten the solidification time of the adhesive. Multiple sets of electronic control valves control different vacuum coating plates 3 respectively.

[0030] Please refer to the above embodiments for further details. Figure 3 Each of the multiple sets of vacuum coating plates 3 has an extension plate 4 on its side. When the vacuum coating plate 3 rotates and rises with the rotating frame 2, the extension plate 4 is used to limit the substrate from falling. For the loading station, the rotating frame 2 rotates 60° and rises. Therefore, the extension plate 4 of the vacuum coating plate 3 at the loading station can be used to limit the overlapping of the substrate and prevent the substrate from falling during the rotation of the rotating frame 2.

[0031] Please refer to the above embodiments for further details. Figure 4 and Figure 5 The coating mechanism 6 includes a guide rail bracket 601 mounted on the top of the control device 1. A movable frame 602 is movably mounted on the inner side of the guide rail bracket 601. The movable frame 602 is connected to a second drive device, and a slot coating mold 603 is mounted on the bottom of the movable frame 602. The slot coating mold 603 is connected to an adhesive injection system. The coating mechanism 6 is used to coat the substrate with adhesive. The guide rail bracket 601, the movable frame 602, and the second drive device together form a linear movement module, which is used to drive the slot coating mold 603 to move back and forth. The linear movement module can also be a combination of guide rail and ball screw. The adhesive injection system is used to deliver the mixed coating adhesive to the slot coating mold 603 through a hose. A precision height adjustment component is set between the slot coating mold 603 and the movable frame 602 to adjust the gap size between the slot coating mold 603 and the vacuum coating plate 3, thereby controlling the coating thickness of the substrate.

[0032] Please refer to the above embodiments for further details. Figure 7 Multiple sets of guide rods 703 are provided, and each set of guide rods 703 is fitted with a first spring 704. The multiple sets of guide rods 703 are movably connected through the connecting plate 701, and the multiple sets of guide rods 703 are evenly distributed. By providing multiple sets of guide rods 703, the movement between the connecting plate 701 and the mounting plate 702 is more stable.

[0033] Please refer to the above embodiments for further details. Figure 7 Two sets of compression rods 708 are movably installed at the bottom of the mounting plate 702, and a second spring 709 is sleeved on the outside of each set of compression rods 708. By setting the compression rods 708 and the second spring 709, the compression rods 708 can push the two sets of mounting brackets 705, so that the two sets of mounting brackets 705 can initially expand and separate.

[0034] Please refer to the above embodiments for further details. Figure 7 Two sets of mounting brackets 705 are symmetrically arranged, and each set of mounting brackets 705 has an extension rod 707 on its side. The two sets of extension rods 707 are symmetrically arranged and located directly below the extrusion rod 708. The extension rods 707 are used to support the extrusion rod 708, so that the extrusion rod 708 descends and pushes the two sets of mounting brackets 705 to initially expand and separate through the extension rods 707.

[0035] Please refer to the above embodiments for further details. Figure 6 The control device 1 has a feeding slide 9 on one side, and a movable plate 10 is installed on the side of the feeding slide 9 by means of a torsion spring. The movable plate 10 is located in the docking groove of the two sets of vacuum coating plates 3. The movable plate 10 is installed by means of a torsion spring and is located in the docking groove of the two sets of vacuum coating plates 3. That is to say, the substrate that slides from the vacuum coating plate 3 at the feeding station can fall onto the movable plate 10 and the feeding slide 9 more effectively. During each rotation of the rotating frame 2, the vacuum coating plate 3 at the feeding station will squeeze and impact the movable plate 10, causing it to flip over and then reset under the action of the torsion spring.

[0036] In practical operation, the present invention is as follows: First, the workers place the unprocessed substrates one by one onto the side of the vacuum coating plate 3 at the loading station. Since the vacuum coating plate 3 at the loading station is tilted and rotated upward, the extension plate 4 on the side of the vacuum coating plate 3 at the loading station can prevent the substrates from falling. Then, the first drive device connected to the rotating frame 2 drives the rotating frame 2 to rotate 60°, so that the substrates at the loading station rotate into the coating station.

[0037] Next, the telescopic assembly 8 pushes the flattening mechanism 7 to descend as a whole. When the two sets of clamping rollers 706 are in contact with the substrate of the coating station, they cannot continue to descend due to the restriction of the vacuum coating plate 3 of the coating station. Consequently, the telescopic assembly 8 pushes the connecting plate 701 to continue to descend and compress the first spring 704. The connecting plate 701 continues to descend until it touches and presses the two sets of pressing rods 708, pushing the two sets of pressing rods 708 to descend and compress the second spring 709. The descent of the two sets of pressing rods 708 will press the mounting bracket 7. The extension rod 707 on the inner side of 05 causes the inner side of the two sets of mounting brackets 705 to be subjected to force, thereby driving the two sets of mounting brackets 705 to expand outward. During the expansion process, the torsion spring of the mounting bracket 705 is stretched, and the pressure rollers 706 at the ends of the two sets of mounting brackets 705 roll on the surface of the substrate to initially flatten it. When the two sets of pressure rollers 706 expand to the maximum, the vacuum pump system is controlled by the control valve to start the vacuum coating plate 3 of the coating station. Using the principle of negative pressure adsorption, the substrate of the coating station is tightly attached to the top of the vacuum coating plate 3.

[0038] Subsequently, the telescopic component 8 drives the flattening mechanism 7 to rise and reset. Then, the moving frame 602 moves under the drive of the second drive device, which drives the slit coating mold 603 to move laterally. The adhesive injection system injects adhesive into the slit coating mold 603, and the slit coating mold 603 evenly coats the adhesive onto the surface of the substrate. After the substrate is coated, the rotating frame 2 continues to rotate 60°, bringing the substrate from the coating station into the unloading station. That is to say, during the continuous rotation of the rotating frame 2, the slit coating mold 603 moves back and forth to coat the substrate. After the substrate is coated at the unloading station, the infrared heating device is activated to accelerate the solidification of the adhesive. Then, the vacuum pump system is controlled by the control valve to close the vacuum coating plate 3 at the unloading station. The substrate loses its adsorption force and slides down through the movable plate 10 to the top of the unloading slide 9.

[0039] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A precision coater for producing adhesive films for IC carrier lamination, comprising a control device (1), characterized in that: The inner side of the control equipment (1) is rotationally connected with a rotating frame (2), the rotating frame (2) is a hexagonal structure, the rotating frame (2) is connected with a first driving device, and a plurality of vacuum coating plates (3) are installed on the side of the rotating frame (2), the plurality of vacuum coating plates (3) are connected with a vacuum pump system, and a coating mechanism (6) and a flattening mechanism (7) are arranged above the rotating frame (2), the flattening mechanism (7) comprises a connecting plate (701), the top of the connecting plate (701) is connected with an extension assembly (8), the lower side of the connecting plate (701) is provided with a mounting plate (702), the top of the mounting plate (702) is provided with a guide rod (703), the outer side of the guide rod (703) is sleeved with a first spring (704), the guide rod (703) and the connecting plate (701) are movably penetrated, the bottom of the mounting plate (702) is rotationally connected with two groups of mounting frames (705) through the setting of torsion springs, and the ends of the two groups of mounting frames (705) are rotationally connected with pressing wheels (706).

2. The precision coater for producing adhesive films for IC carrier board press bonding according to claim 1, wherein: A plurality of vacuum coating plates (3) are evenly distributed on the side of the rotating frame (2), and the plurality of vacuum coating plates (3) are connected with the vacuum pump system through the setting of rotary joints (5) and electronic control valves.

3. The precision coater for producing adhesive films for IC carrier board press bonding according to claim 2, wherein: The side of the plurality of vacuum coating plates (3) is provided with an extension plate (4), when the vacuum coating plate (3) rises with the rotating frame (2), the extension plate (4) is used for limiting the falling of the substrate.

4. The precision coater for producing adhesive films for IC carrier board press bonding according to claim 3, wherein: The coating mechanism (6) comprises a guide rail support (601) mounted on the top of the control equipment (1), a moving frame (602) movably mounted on the inner side of the guide rail support (601), a second driving device connected with the moving frame (602), and a slit coating die (603) mounted on the bottom of the moving frame (602), the slit coating die (603) is connected with a glue liquid filling system.

5. The precision coater for producing adhesive films for IC carrier press bonding according to claim 4, wherein: A plurality of guide rods (703) are provided, and the outer sides of the plurality of guide rods (703) are sleeved with first springs (704), the plurality of guide rods (703) are movably penetrated with the connecting plate (701), and the plurality of guide rods (703) are evenly distributed.

6. The precision coater for producing adhesive films for IC carrier press bonding according to claim 5, wherein: The bottom of the mounting plate (702) movably mounts two groups of extrusion rods (708), and the outer sides of the two groups of extrusion rods (708) are sleeved with second springs (709).

7. The precision coater for producing adhesive films for IC carrier board press bonding according to claim 6, wherein: The two groups of mounting frames (705) are symmetrically arranged, and the side of the two groups of mounting frames (705) is provided with an extension rod (707), the two groups of extension rods (707) are symmetrically arranged, and the two groups of extension rods (707) are located directly below the extrusion rods (708).

8. The precision coater for producing adhesive films for IC carrier press bonding according to claim 7, wherein: One side of the control equipment (1) is provided with a discharging chute (9), and the side of the discharging chute (9) is provided with a movable plate (10) through the setting of a torsion spring, and the movable plate (10) is located in the butt joint groove of the two groups of vacuum coating plates (3).

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