Visual CCD appearance detection device and method for high-density pin connector

Abstract

The invention belongs to the technical field of product detection, and relates to a high-density pin connector visual CCD appearance detection device which is characterized by comprising a base, and a camera detection mechanism, a carrying mechanism, a defective product caching mechanism and a feeding mechanism which are mounted on the base. The device is composed of a feeding mechanism, a camera detection mechanism, a carrying mechanism, a discharging mechanism, a controller and the like, manual feeding is carried out, the feeding mechanism moves a material carrying mechanism to the position below the camera detection mechanism, and a camera shoots images of high-density pin connector products to be detected in a material tray; the detection software calculates the number, position and color of contact spring pieces and solder balls in the connector according to the acquired image, judges whether foreign matters exist on the base, finally judges whether the foreign matters are qualified and sends a result to the controller, and the controller controls the carrying mechanism to automatically carry unqualified products to the cache material carrying position. The device is combined with a detection method to realize automatic appearance detection, and has the advantages of strong connector product compatibility, high efficiency, high precision and low cost.

Description

Technical Field

[0001] This invention belongs to the field of product testing technology, and in particular relates to a visual CCD appearance inspection device and method for high-density pin connectors. Background Technology

[0002] Since most electronic components require soldering, it is necessary to inspect the quality of the soldered products. Usually, manual visual inspection of the connector is carried out using tools such as magnifying glasses, electronic magnifying glasses, and microscopes to determine whether there are any defects such as missing contacts, misaligned contacts, crushed contacts, warped contacts, bent contacts, deformed contacts, discolored contacts, and foreign objects, thereby preventing defective products from being shipped out.

[0003] Using magnification tools for manual visual inspection is limited by factors such as product structure and size, especially Figure 6 The large-size, thin-walled high-density pin connectors with more than 6000 pins shown are generally larger than 100mm*70mm. During the inspection process, the product needs to be moved continuously by the operator to achieve full field of view coverage. This results in the disadvantages of missed areas, visual fatigue, and long inspection time. Furthermore, the accuracy of the inspection results is easily affected by various factors such as human emotions and skills. Summary of the Invention

[0004] This application addresses the aforementioned technical problems by proposing a visual CCD appearance inspection device and method for high-density pin connectors. The specific technical solution is as follows: In a first aspect, the present invention provides a visual CCD appearance inspection device for high-density pin connectors, characterized in that it includes a base and a camera inspection mechanism, a conveying mechanism, a defective product buffer mechanism, and a feeding mechanism mounted on the base.

[0005] Furthermore, the camera detection mechanism includes a fixed frame, a Z-axis moving assembly, and a camera assembly. The fixed frame is fixed on the base, the Z-axis moving assembly is fixed on the fixed frame, and the camera assembly is mounted on the moving end of the Z-axis moving assembly.

[0006] Furthermore, the conveying mechanism includes a second fixed frame, a first dual-axis moving assembly, and a clamping assembly. The fixed frame is fixed on the base, the first dual-axis moving assembly is mounted on the second fixed frame, and the clamping assembly is connected to the moving end of the first dual-axis moving assembly.

[0007] Furthermore, the defective product buffer mechanism 4 includes a Y-axis moving component and a carrier, wherein the carrier is connected to the moving end of the Y-axis moving component via a mounting plate.

[0008] Furthermore, a photoelectric switch is installed on the carrier.

[0009] Further, the feeding mechanism comprises a fixed frame four, a double-shaft moving assembly two and a carrier two, the fixed frame four is fixed on the base, the double-shaft moving assembly two is installed on the fixed frame four, and the carrier two is connected to the moving end of the double-shaft moving assembly two.

[0010] Further, the base is provided with an operation table top and a mouse and keyboard placing mechanism arranged under the operation table top, and the fixed frame two is further fixed with a code scanning mechanism.

[0011] In the second aspect of the present application, a detection method of a high-density pin connector visual CCD appearance detection device is provided, and the detection method comprises the following steps: placing the product to be detected on the feeding mechanism; setting the product testing parameters, testing points, product carrying points and product unloading points in the upper computer, and writing the visual program at different photographing points of the product to be detected; performing automatic detection.

[0012] Further, the method for setting the product testing points is as follows: controlling the feeding mechanism and the camera detection mechanism to move, so that the first photographing point corresponding to the feature area of the first product on the feeding mechanism is located at the center of the field of view of the camera detection mechanism and is in focus; storing the photographing points in the upper computer debugging interface , and the same applies to storing all photographing points of the ith product and product images, wherein i=1······m. The method for setting the product carrying points is as follows: controlling the feeding mechanism and the carrying mechanism to move, so that the center of the product on the feeding mechanism is located at the center of the clamping jaw of the carrying mechanism, and the clamping jaw can correctly clamp the product, and the carrying point is stored . The method for setting the product unloading points is as follows: controlling the carrying mechanism and the defective product buffer mechanism, so that the center of the clamping jaw is aligned with the center of the defective product buffer position, and the product can be correctly placed on the carrier of the defective product buffer mechanism, and the unloading point is stored .

[0013] The present application has the following beneficial effects: The application adopts a feeding mechanism, a camera detection mechanism, a carrying mechanism, a discharging mechanism, a controller and the like to constitute, manually feeds by hand, moves the loading mechanism to the camera detection mechanism below by the feeding mechanism, the camera shoots the image of the high-density pin connector product to be detected in the tray, the detection software calculates the number, position and color of the contact spring and the solder ball in the connector through the obtained image, judges whether there is foreign matter on the base, finally judges whether it is qualified, and sends the result to the controller, the controller controls the carrying mechanism to automatically carry the unqualified product to the buffer loading position, the device realizes automatic appearance detection in combination with the detection method, has the advantages of strong connector product compatibility, high efficiency, high precision and low cost, and can avoid the problems of missed detection, unstable detection result and low detection efficiency of manual detection. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 A structure schematic diagram of a high-density pin connector visual CCD appearance detection device is shown. Figure 2 A structure schematic diagram of a camera detection mechanism is shown. Figure 3 A structure schematic diagram of a carrying mechanism is shown. Figure 4 A structure schematic diagram of a defective product buffer mechanism is shown. Figure 5 A structure schematic diagram of a feeding mechanism is shown. Figure 6 A structure schematic diagram of a connector to be detected is shown. DETAILED DESCRIPTION

[0015] To make the purpose, technical scheme and advantages of the embodiments of the application clearer, the technical scheme of the application will be described clearly and completely in combination with embodiments.

[0016] As shown in Figure 1 A structure schematic diagram of a high-density pin connector visual CCD appearance detection device, the device includes a base 1, a camera detection mechanism 2, a carrying mechanism 3, a defective product buffer mechanism 4, a code scanning mechanism 5, a feeding mechanism 6, a mouse and keyboard placing mechanism 7 and an operation table 8, the camera detection mechanism 2, the carrying mechanism 3, the defective product buffer mechanism 4, the code scanning mechanism 5, the feeding mechanism 6, the mouse and keyboard placing mechanism 7 and the operation table 8 are all installed on the base 1, the carrying mechanism 3 reciprocally moves between the feeding mechanism 6 and the defective product buffer mechanism 4, and carries the defective product that does not pass the detection from the feeding mechanism 6 to the defective product buffer mechanism 4.

[0017] Figure 2As shown is a structural schematic view of the camera detection mechanism 2 for defect detection of the connector to be detected, the camera detection mechanism 2 comprising a fixed frame one, a Z-axis moving assembly one 206 and a camera assembly, the camera assembly being installed on the fixed frame one through the Z-axis moving assembly one 206, the fixed frame one being fixed with the base 1, and the Z-axis moving assembly one 206 being capable of moving the camera assembly on the Z-axis.

[0018] The fixed frame one is fixedly connected by four mounting plates 216, 201, 203 and 205, wherein the fixed frame one is fixed with the base 1 through the mounting plate 216, and the mounting plates 203 and 205 serve as reinforcing plates to form a support structure on both sides of the mounting plate 201, thereby improving the strength of the fixed frame one.

[0019] The Z-axis moving assembly one 206 comprises a motor, a lead screw and a moving block, the motor being fixedly connected with the fixed frame one, the rotating shaft of the motor being coaxially connected with the lead screw, and the moving block being threadedly connected with the lead screw and slidably connected with the mounting plate two 201 through a sliding rail, so that the moving block can be driven to move on the Z-axis when the motor drives the lead screw to rotate.

[0020] The camera assembly comprises a mounting plate three 210, a mounting plate four 207, a camera 208, a lens 209, a mounting plate five 211, a mounting plate six 202, a mounting plate seven 212, a mounting plate eight 213, a light source one 214 and a light source two 215, wherein the camera 208, the lens 209, the light source one 214 and the light source two 215 are sequentially arranged from top to bottom, the mounting plate three 210 is fixed with the moving block to drive the whole camera assembly to move, the mounting plate four 207 is fixed on the mounting plate three 210, the camera 208 is fixed on the mounting plate four 207, the mounting plate six 202 and the mounting plate seven 212 are cooperatively used to clamp and fix the lens 209 and then are fixed on the mounting plate three 210, the light source one 214 is fixed between the mounting plate seven 212 and the mounting plate eight 213, and the light source two 215 is fixed at the bottom of the mounting plate eight 213, and the camera 208, the lens 209, the light source one 214 and the light source two 215 are kept coaxial in the camera assembly.

[0021] Figure 3 As shown is a structural schematic view of the carrying mechanism 3, the carrying mechanism 3 comprising a fixed frame two, a double-shaft moving assembly one and a clamping assembly, the clamping assembly being connected with the double-shaft moving assembly one, and the double-shaft moving assembly one being installed on the fixed frame two, so that the clamping assembly can move in the Z-axis direction and the X-axis direction through the double-shaft moving assembly one.

[0022] The fixed frame two is fixedly connected by four mounting plates 301, 302, 303 and 305, wherein the fixed frame two is fixed with the base 1 through the mounting plate 301, and the mounting plates 302 and 305 serve as reinforcing plates to form a support structure on both sides of the mounting plate 303, thereby improving the strength of the fixed frame two.

[0023] The double-axial moving assembly comprises the X-axis moving assembly one 308 and the Z-axis moving assembly two 307. The X-axis moving assembly one 308 is installed on the mounting plate 303, and the Z-axis moving assembly two 307 is installed on the moving end of the X-axis moving assembly one 308 through the mounting plate 306.

[0024] The clamping assembly comprises the electric cylinder 311 and the clamping jaw 312. The electric cylinder 311 is fixedly connected with the moving end of the Z-axis moving assembly two 307 through the fixing frame three, and the clamping jaw 312 is installed on the two moving ends of the electric cylinder 311. The two clamping jaws 312 are driven to approach or move away from each other by the electric cylinder 311, so as to realize the grabbing and releasing of the product. The clamping jaw 312 adopts four-point contact, and the contact points are subjected to rubber coating treatment, so as to ensure that the contact part does not pinch the product and the holding is stable.

[0025] The fixing frame three is fixedly connected by four mounting plates 304, 309 and 310. The fixing frame three is fixed with the moving end of the Z-axis moving assembly two 307 through the mounting plate 304. The mounting plate 309 is used as a reinforcing plate to form a support structure on both sides of the mounting plate 304, so as to improve the strength of the fixing frame three.

[0026] In addition, the fixing frame two is fixed with the code scanning mechanism 5 through the mounting frame 501. The code scanning mechanism 5 is a code scanning gun used for scanning the product code to obtain the information of the product.

[0027] Figure 4 The structure of the defective product buffering mechanism 4 is shown. The defective product buffering mechanism 4 comprises the Y-axis moving assembly one 401 and the carriers one 406, 407 and 408. The Y-axis moving assembly one 401 is fixed on the base 1 through the mounting plate 409. The carriers one 406, 407 and 408 are fixedly connected with the moving end of the Y-axis moving assembly one 401 through the mounting plate 405. In addition, the photoelectric switches 402, 403 and 404 are arranged on the carriers one 406, 407 and 408 to detect whether the corresponding defective product buffering position exists.

[0028] Figure 5The structure of the feeding mechanism 6 is shown in the schematic view, the feeding mechanism 6 includes a fixed frame four, a double-shaft moving assembly two and a carrier two 605, the fixed frame four includes mounting plates 609, 607 and 610, wherein the mounting plate 609 is connected and fixed with the base 1, the double-shaft moving assembly two includes a Y-axis moving assembly two 603 and an X-axis moving assembly two 601, wherein the Y-axis moving assembly two 603 is fixed on the mounting plate 609, the X-axis moving assembly two 601 is fixed on the moving end of the Y-axis moving assembly two 603 through the mounting plate 606, meanwhile, the linear guide rails 608 are fixed on the mounting plates 607 and 610 and cooperate with the X-axis moving assembly two 601 to keep the stable movement of the X-axis moving assembly two 601, and the carrier two 605 is fixed on the moving end of the X-axis moving assembly two 601. The carrier two 605 is a precision machining part, and is designed to place test products according to the shape of the product, the inner side edge of the carrier two 605 is designed with an R5 large round corner to increase the guiding property of manual loading, and the position of product marking is designed to be hollowed out to avoid the carrier two 605, so as to facilitate reading of the product identification code.

[0029] The mouse and keyboard placing mechanism 7 is arranged on the operation table top 8, and the mouse and keyboard placing mechanism 7 is mainly used for storing mouse and keyboard.

[0030] Based on the above-mentioned high-density pin connector visual CCD appearance automatic measurement device, a detection method is also provided, which includes the following steps: The product to be tested is placed on the carrier two 605; The camera detection mechanism 2, the defective product buffer mechanism 4, the carrying mechanism 3 and the feeding mechanism 6 are reset to zero; The test parameters and test points of the product to be tested are set in the upper computer, and the visual program under different photographing points of the product to be tested is written; Automatic detection is performed.

[0031] The product test parameters are set as follows: Different products have different characteristic sizes and imaging parameters, in order to be compatible with the test, the characteristic length and width of the product are inputted, and the number of photographing points of the product is calculated. Before the test, the number of products in the carrier two 605, the characteristic length and width of the product to be tested and the imaging parameters are filled in the product maintenance interface of the upper computer.

[0032] The product test points are set as follows: The X-axis moving assembly two 601 is manually controlled to move the carrier two 605, the Y-axis moving assembly two 603 and the Z-axis moving assembly one 206 are manually controlled to move the camera 208, so that the first photographing point corresponding to the characteristic area in the first product on the carrier two 605 is located at the center of the field of view of the camera 208 and is in focus, and the photographing point is stored in the upper computer debugging interface, and the photographing points of the i-th product are stored in the same way. ​And product image, wherein i=1 ··· m.

[0033] Setting product carrying point: Manual control X-axis moving assembly two 601 moves carrier two 605, manual control X-axis moving assembly one 308, so that the center of the product on carrier two 605 is just located at the center of the clamping jaw 312, and the clamping jaw 312 can correctly clamp the product, and the carrying point is stored 。

[0034] Setting product unloading point: Manual control Z-axis moving assembly two 307 and X-axis moving assembly one 308, and manual control Y-axis moving assembly one 401, so that the center of the clamping jaw 312 is aligned with the center of the defective buffer position, and the product can be correctly placed on carrier one 406, and the unloading point is stored 。

[0035] Self-checking: Before each test, the device needs to be self-checked to determine whether the test accuracy of the device meets the design requirements and whether the material throwing function is normal, and the specific process is as follows: Make the point inspection product correctly placed in carrier two 605, manually select the product calibration program, press the start button, move carrier two 605 and camera 208 according to the set photographing point, camera 208 sequentially shoots part of the image of the product and calculates the appearance abnormal position in the product, the program automatically compares the abnormal position with the actual value of the point inspection product, and the actual value is consistent, which is determined to be qualified, and the carrying mechanism 3 does not act, otherwise it is unqualified, the material throwing mechanism 3 acts and puts the product into the defective product buffer mechanism 4.

[0036] Automatic testing: Only when the point inspection is normal can the test be carried out, otherwise the test cannot be carried out, and the specific process is as follows: Make the measured product correctly placed in carrier two 605, select the product test program, press the start button, move carrier two 605 and camera 208 according to the set photographing point, camera 208 sequentially shoots part of the image of the product and calculates the appearance abnormal position in the product and marks it, and the carrying mechanism 3 does not act, otherwise it is unqualified, the material throwing mechanism 3 acts and puts the product into the defective product buffer mechanism 4.

[0037] In combination with the above description, the detection method comprises the following steps: Step (1), refer to or calculate the size of the measured area of the high-density pin connector long*wide=W*L; Step (2), refer to or calculate the detection range of the photographing system long*wide=C*K; Step (3), calculate the ratio a of the length of the measured area of the high-density pin connector and the length of the photographing system, and the ratio b of the width of the measured area of the high-density pin connector and the width of the photographing system, and then determine the number of product detection photographing points as P=a*b; Step (4), manually control the X-axis moving assembly two 601 to move the carrier two 605, manually control the Y-axis moving assembly two 603 and the Z-axis moving assembly one 206 to move the camera 208, so that the corresponding feature area of the first photographing point in the first product on the carrier two 605 is located at the center of the field of view of the camera 208 and is in focus, and save the photographing point position on the host computer debugging interface. Similarly, save all photographing points and product images of the ith product, where i=1···m. Step (5), manually control the X-axis moving assembly two 601 to move the carrier two 605, and manually control the X-axis moving assembly one 308, so that the center of the product on the carrier two 605 is located at the center of the gripper 312, and the gripper 312 can correctly clamp the product, and save the carrying point position . Step (6), manually control the Z-axis moving assembly two 307 and the X-axis moving assembly one 308, and manually control the Y-axis moving assembly one 401, so that the center of the gripper 312 is aligned with the center of the defective buffer position, and the product can be correctly placed on the carrier one 406, and save the unloading point position . Step (7), according to the product images at different photographing points obtained in step (4), write corresponding image processing algorithms, calculate the appearance abnormal positions in different photographing points, and mark them on the map. Step (8), according to the appearance abnormal positions at different photographing points obtained in step (7), summarize the complete product abnormal positions and mark them, and count the abnormal distribution, which is used for further analysis of the positions of abnormal occurrence and possible process reasons, and for product production process improvement.

[0038] The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them.

Claims

1. A high-density pin connector visual CCD appearance inspection method, characterized by, The method adopts a detection device, which comprises a base and a camera detection mechanism, a carrying mechanism, a defective product buffer mechanism and a feeding mechanism installed on the base; The method comprises the following steps: Placing the product to be tested on the feeding mechanism; Setting the product testing parameters, testing points, product carrying points and product unloading points in the upper computer, and writing the visual program of the product at different photographing points; Executing automatic detection.

2. The high-density pin connector visual CCD appearance inspection method of claim 1, wherein, The method for setting the product testing points is as follows: Controlling the feeding mechanism and the camera detection mechanism to move, so that the first photographing point corresponding to the characteristic area of the first product on the feeding mechanism is located at the center of the field of view of the camera detection mechanism and is in focus; In the host computer debugging interface, save the photographing point By analogy, save all the photographing points of the ith product And product images, where i = 1 ··· m; The method for setting the product carrying points is as follows: Controlling the moving of the feeding mechanism and the carrying mechanism, so that the center of the product on the feeding mechanism is located at the center of the clamping jaw of the carrying mechanism, and the clamping jaw can correctly clamp the product, and the storage carrying point is determined ; The method for setting the product unloading points is as follows: The control carrying mechanism and the defective product buffer mechanism are controlled to align the center of the clamping jaw with the center of the defective product buffer position, so that the product can be correctly placed on the carrier of the defective product buffer mechanism, and the loading and unloading points are stored .

3. A high-density pin connector visual CCD appearance inspection apparatus, characterized by, The detection device is applied to the high-density pin connector visual CCD appearance detection method of claim 1 or 2, and comprises a base and a camera detection mechanism, a carrying mechanism, a defective product buffer mechanism and a feeding mechanism installed on the base.

4. The high-density pin connector visual CCD appearance inspection apparatus according to claim 3, wherein The camera detection mechanism comprises a fixed frame one, a Z-axis moving assembly one and a camera assembly, the fixed frame one is fixed on the base, the Z-axis moving assembly one is fixed on the fixed frame one, and the camera assembly is installed on the moving end of the Z-axis moving assembly.

5. The high-density pin connector visual CCD appearance inspection apparatus according to claim 3, wherein The carrying mechanism comprises a fixed frame two, a double-shaft moving assembly one and a clamping assembly, the fixed frame is fixed on the base, the double-shaft moving assembly one is installed on the fixed frame two, and the clamping assembly is connected to the moving end of the double-shaft moving assembly one.

6. The high-density pin connector visual CCD appearance inspection apparatus according to claim 3, wherein The defective product buffer mechanism 4 comprises a Y-axis moving assembly one and a carrier one, and the carrier one is connected to the moving end of the Y-axis moving assembly one through a mounting plate.

7. The high-density pin connector visual CCD appearance inspection apparatus according to claim 6, wherein An optical switch is arranged on the carrier one.

8. The high-density pin connector visual CCD appearance inspection apparatus according to claim 3, wherein The feeding mechanism comprises a fixed frame four, a double-shaft moving assembly two and a carrier two, the fixed frame four is fixed on the base, the double-shaft moving assembly two is installed on the fixed frame four, and the carrier two is connected to the moving end of the double-shaft moving assembly two.

9. The high-density pin connector visual CCD appearance inspection apparatus according to claim 3, wherein An operating table surface is arranged on the base, and a mouse and keyboard placing mechanism is arranged under the operating table surface, and a code scanning mechanism is further fixed on the fixed frame two.

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