Memory dismounting and mounting device and memory dismounting and mounting method

Abstract

The embodiment of the invention provides a memory disassembling and assembling device and a memory disassembling and assembling method, and relates to the technical field of server accessories. The memory dismounting and mounting device comprises a mounting seat, a first dismounting and mounting assembly and a second dismounting and mounting assembly, wherein the first dismounting and mounting assembly and the second dismounting and mounting assembly are movably arranged on the mounting seat; the first dismounting and mounting assembly abuts against the locking piece to be in an unlocking state, and the second dismounting and mounting assembly locks the memory so as to dismount the memory from the memory cooling device; the first dismounting assembly abuts against the locking piece to be in an unlocking state, the second dismounting assembly installs the memory into the memory cooling device and breaks away from the locked memory, the first dismounting assembly breaks away from the abutting locking piece, and the memory abuts against the locking piece to be in a locking state, so that the memory is installed into the memory cooling device. According to the memory dismounting device, the dismounting efficiency of the memory is improved, and the possibility that the memory and the heat conduction material are damaged is reduced.

Description

Technical Field

[0001] This application relates to the field of server accessory technology, and in particular to a memory disassembly and assembly device and a memory disassembly and assembly method. Background Technology

[0002] With the continuous optimization of heat dissipation efficiency and energy consumption control in data centers, liquid-cooled server technology has gradually become the mainstream solution for high-density computing scenarios. In liquid-cooled servers, memory, as one of the core computing components, experiences a significant increase in power consumption and heat generation, thus requiring efficient heat dissipation through liquid cooling technology.

[0003] In related technologies, the installation and removal of liquid-cooled server memory mainly rely on manual operation, using manual disassembly or general tools. When manually unlocking the Hippocampus lock, the operator needs to control multiple actions simultaneously, including pressing and rotating. Furthermore, using general tools requires the coordinated operation of both hands.

[0004] The above-mentioned process of disassembling and assembling memory is difficult to operate, making it hard to achieve precise insertion and removal in a confined space, and it is easy to damage the heat-conducting materials or the memory itself. Summary of the Invention

[0005] This application provides a memory disassembly and assembly device and a memory disassembly and assembly method to simplify the memory disassembly and assembly process, improve memory disassembly and assembly efficiency, achieve accurate insertion and removal, thereby reducing the possibility of damage to heat-conducting components or memory.

[0006] On one hand, this application provides a memory disassembly and assembly device for disassembling and assembling memory in a memory cooling device, wherein the memory is locked in the memory cooling device by a locking member.

[0007] The memory removal and installation device includes a mounting base, a first removal and installation component, and a second removal and installation component. The first removal and installation component is movably disposed on the mounting base and has a first locked state and a first dismounted state. When the first removal and installation component is in the first locked state, the first removal and installation component disengages from the locking member. When the first removal and installation component is in the first dismounted state, the first removal and installation component abuts against the locking member to make the locking member in the unlocked state.

[0008] The second disassembly and assembly component is movably disposed on the mounting base and has a second locking state and a second disassembly state; when the second disassembly and assembly component is in the second locking state, the second disassembly and assembly component is locked in memory; when the second disassembly and assembly component is in the second disassembly state, the second disassembly and assembly component is disengaged from the locked memory.

[0009] The first and second disassembly components work together to remove the memory from the memory cooling unit or install the memory into the memory cooling unit.

[0010] The first disassembly component is in the unlocked state when it abuts the locking member, while the second disassembly component locks the memory so that the memory can be removed from the memory cooling device.

[0011] The first disassembly and assembly component is in the unlocked state when it abuts the locking member. The second disassembly and assembly component installs the memory into the memory cooling device and disengages from locking the memory. The first disassembly and assembly component disengages from the locking member, and the memory abuts the locking member is in the locked state, so that the memory can be installed into the memory cooling device.

[0012] In the aforementioned memory disassembly and assembly device, the first disassembly and assembly component includes a first operating component and a first executing component. The first executing component has an abutting part, which is used to abut against a locking component.

[0013] The first operating member selectively abuts against the first actuator; when the first operating member abuts against the first actuator, the abutting part abuts against the locking member, so that the locking member is in an unlocked state; when the first operating member disengages from abutting against the first actuator, the abutting part disengages from abutting against the locking member.

[0014] In the aforementioned memory disassembly and assembly device, a first elastic element is provided between the first operating element and the mounting base, and the first operating element has a wedge-shaped operating surface and a snap-fit ​​surface that are interconnected.

[0015] The middle part of the first actuator is rotatably connected to the mounting base. The first end of the first actuator selectively abuts against the wedge-shaped operating surface, and the second end of the first actuator forms an abutment portion. A second elastic element is provided on the side of the first actuator near the second end and the mounting base.

[0016] The first elastic member has a tendency to push the first operating member toward the first end of the first actuator; the second elastic member has a tendency to push one side of the second end of the first actuator so that the first end of the first actuator disengages from the wedge-shaped operating surface.

[0017] The first end of the first actuator is subjected to force to move toward the wedge-shaped operating surface to abut against the wedge-shaped operating surface and compress the first elastic member through the first actuator; the first actuator rotates to compress the second elastic member, and the abutting part abuts against the locking member to make the locking member in the unlocked state; the first end of the first actuator is engaged with the engaging surface.

[0018] The first operating member is subjected to force to move away from the first actuator, so that the first end of the first actuator disengages from the locking surface, the abutting part disengages from the locking member under the elastic force of the second elastic member, the first end of the first actuator disengages from the wedge-shaped operating surface under the elastic force of the second elastic member, and the first operating member returns to the initial state under the elastic force of the first elastic member.

[0019] In the aforementioned memory disassembly and assembly device, it is possible to have at least two first operating elements and at least two first executing elements; at least two first operating elements and at least two first executing elements are respectively disposed on opposite sides of the mounting base, and are disposed in a one-to-one correspondence; at least two first executing elements are respectively used to unlock the locking elements located on opposite sides of the memory.

[0020] In the aforementioned memory mounting and dismounting device, the mounting base has a mounting cavity and a first operating port and a second operating port communicating with the mounting cavity. The first operating member has a main body and an operating part. The main body is disposed in the mounting cavity, and a first elastic member is disposed between the main body and the inner wall of the mounting cavity.

[0021] The first operating port is located on the side of the mounting base facing the first actuator, and the main body selectively abuts against the first end of the first actuator through the first operating port.

[0022] The operating part passes through the second operating port and is located outside the mounting cavity. The edges of the operating part and the second operating port are matched to limit the position of the first operating member moving towards the first actuator.

[0023] In the aforementioned memory disassembly and assembly device, the second disassembly and assembly component can include a second operating element, an intermediate connecting element, and a second executing element.

[0024] A third elastic member is provided between the second operating member and the mounting base. The second operating member is rotatably connected to the first end of the intermediate connecting member. The middle part of the intermediate connecting member is rotatably connected to the mounting base. The second end of the intermediate connecting member is connected to the first end of the second actuator and a fourth elastic member is provided between it and the mounting base. The second end of the second actuator has a clamping part.

[0025] The third elastic member has a tendency to push the second operating member so that the intermediate connecting member and the second actuator are in an unlocked state through the second operating member; the fourth elastic member has a tendency to push the first end of the second actuator so that the second actuator is in an unlocked state.

[0026] The second operating member is subjected to force to compress the third elastic member, and through the intermediate connecting member, it drives the second actuator to compress the fourth elastic member, so that the second actuator is in a locked state.

[0027] The second operating member moves under the elastic force of the third elastic member, and the intermediate connecting member and the second actuator move under the elastic force of the fourth elastic member, so that the second actuator is in the unlocked state.

[0028] In the aforementioned memory mounting and dismounting device, it is possible to have at least two intermediate connectors and at least two second actuators; at least two intermediate connectors and at least two second actuators are respectively disposed on opposite sides of the mounting base, and are disposed in a one-to-one correspondence; at least two second actuators are respectively disposed on opposite sides of the memory.

[0029] In the aforementioned memory mounting and dismounting device, it is possible to have a mounting base including a mounting body, a second operating component having an operating body, and the extension direction of the mounting body being parallel to the extension direction of the operating body.

[0030] Along the extension direction of the mounting body, at least two first operating elements are disposed on opposite sides of the mounting body; along the extension direction of the operating body, at least two intermediate connecting elements and at least two second actuators are respectively disposed on opposite sides of the operating body.

[0031] In the aforementioned memory mounting and dismounting device, it is possible to have a second actuator with a clamping surface facing the memory; a first actuator located on the side of the second actuator away from the clamping surface; a limiting member provided between the first actuator and the second actuator along the direction from the first actuator to the second actuator, the limiting member being connected to the mounting base; the limiting member having a wedge-shaped protrusion facing the second actuator, and the side of the second actuator away from the clamping surface having a mating surface adapted to the shape of the wedge-shaped protrusion.

[0032] On the other hand, embodiments of this application provide a memory disassembly and assembly method, applied to the aforementioned memory disassembly and assembly apparatus, the memory disassembly and assembly method comprising:

[0033] The first disassembly / assembly component is controlled to be in the unlocked state against the locking member, and the second disassembly / assembly component is controlled to lock the memory so as to remove the memory from the memory cooling device.

[0034] The first disassembly and assembly component is controlled to be in the unlocked state when it abuts the locking member. The second disassembly and assembly component is controlled to install the memory into the memory cooling device and disengage from locking the memory. The first disassembly and assembly component is controlled to disengage from the locking member, and the memory abuts the locking member is in the locked state, so that the memory can be installed into the memory cooling device.

[0035] The memory disassembly and assembly device and method provided in this application embodiment, by setting a movable first disassembly and assembly component, including a first operating component and a first executing component, the first operating component is subjected to force to put the first executing component into an unlocked state, thereby unlocking the locking component, which can realize automatic unlocking of the locking component and reduce the operation degree of the unlocking operating component; by setting a movable second disassembly and assembly component, including a second operating component, an intermediate connecting component and a second executing component, the second operating component is subjected to force to put the second executing component into a locked state through the action of the intermediate connecting component, so that the clamping part of the second operating component locks the memory; when the second operating component is released from force, the second executing component is put into an unlocked state under the action of the third elastic component and the fourth elastic component, which is used to disassemble the memory and provides a stable clamping force to ensure that the memory does not detach during the disassembly and assembly process; by using the first disassembly and assembly component and the second disassembly and assembly component together, the memory can be accurately disassembled and assembled in a confined space, further reducing the operational complexity, thereby reducing the possibility of damage to the heat-conducting material or the memory. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0037] Figure 1 This is a schematic diagram of the memory disassembly and assembly device provided in the embodiments of this application;

[0038] Figure 2 An exploded view of the memory disassembly and assembly device provided in the embodiments of this application;

[0039] Figure 3 This is a schematic diagram of the structure of the memory cooling device provided in the embodiments of this application;

[0040] Figure 4 A schematic diagram of the first state of the first disassembly component of the memory disassembly and assembly device provided in an embodiment of this application;

[0041] Figure 5 A schematic diagram of the second state of the first disassembly component of the memory disassembly and assembly device provided in the embodiments of this application;

[0042] Figure 6 A schematic diagram of the third state of the first disassembly component of the memory disassembly and assembly device provided in the embodiments of this application;

[0043] Figure 7 A schematic diagram of the fourth state of the first disassembly component of the memory disassembly and assembly device provided in the embodiments of this application;

[0044] Figure 8 A schematic diagram of the first state of the second disassembly component of the memory disassembly and assembly device provided in an embodiment of this application;

[0045] Figure 9 This is a schematic diagram of the second state of the second disassembly component of the memory disassembly and assembly device provided in the embodiments of this application;

[0046] Figure 10 A flowchart of the memory disassembly method in the memory disassembly and assembly method provided in the embodiments of this application;

[0047] Figure 11 A schematic diagram illustrating the specific disassembly process in the memory disassembly and assembly method provided in this application embodiment;

[0048] Figure 12 This is a schematic diagram of the specific disassembly process in the memory disassembly and assembly method provided in the embodiments of this application;

[0049] Figure 13 This is a schematic diagram of the specific disassembly process in the memory disassembly and assembly method provided in the embodiments of this application;

[0050] Figure 14 This is a schematic diagram of the specific disassembly process in the memory disassembly and assembly method provided in the embodiments of this application;

[0051] Figure 15 This is a schematic diagram of the specific disassembly process in the memory disassembly and assembly method provided in the embodiments of this application;

[0052] Figure 16 This is a schematic diagram illustrating the specific disassembly process in the memory disassembly and assembly method provided in the embodiments of this application;

[0053] Figure 17 A flowchart of the memory installation method in the memory disassembly and assembly method provided in the embodiments of this application;

[0054] Figure 18 A schematic diagram illustrating the specific installation process in the memory disassembly and assembly method provided in this application embodiment;

[0055] Figure 19 This is a schematic diagram of the specific installation process in the memory disassembly and assembly method provided in the embodiments of this application;

[0056] Figure 20 This is a schematic diagram of the specific installation process in the memory disassembly and assembly method provided in the embodiments of this application;

[0057] Figure 21 This is a schematic diagram illustrating the specific installation process of the memory disassembly and assembly method provided in this application embodiment;

[0058] Figure 22 The diagram below illustrates the specific installation process of the memory disassembly and assembly method provided in this application embodiment.

[0059] Explanation of reference numerals in the attached figures:

[0060] 100. Mounting base; 110. Mounting cavity; 111. First operating port; 112. Second operating port; 120. Limiting element; 121. Wedge-shaped protrusion; 200. First disassembly / assembly assembly; 210. First operating element; 211. Main body; 212. Operating part; 213. Wedge-shaped operating surface; 214. Snap-fit ​​surface; 215. First elastic element; 220. First actuating element; 221. Abutting part; 222. Second elastic element; 300. Second disassembly / assembly assembly; 310. Second operating element; 311. Third elastic element; 320. Second actuating element; 321. Clamping part; 330. Intermediate connecting element; 331. Fourth elastic element; 400. Memory cooling device; 410. Memory; 420. Locking element; 430. Memory mounting slot; 440. Heat-conducting element.

[0061] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0062] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0063] In related technologies, the disassembly and assembly of liquid-cooled server memory relies on manual operation, using manual disassembly or general tools. When manually unlocking the Hippocampus lock, the operator needs to control multiple actions simultaneously, including pressing and rotating, which can easily lead to damage to the Hippocampus lock and make it difficult to control the precise force and angle of insertion and removal. Using general tools requires two-handed operation, which is difficult to operate, resulting in low disassembly and assembly efficiency, and can also easily damage the heat-conducting materials and memory.

[0064] In view of this, this application provides a memory disassembly and assembly device and a memory disassembly and assembly method, wherein the memory disassembly and assembly fixture includes a mounting base, a first disassembly and assembly component, and a second disassembly and assembly component. The first disassembly and assembly component is movably disposed on the mounting base, and the second disassembly and assembly component is movably disposed on the mounting base; the first disassembly and assembly component is in an unlocked state when it abuts against a locking member, and the second disassembly and assembly component locks the memory to remove the memory from the memory cooling device; the second disassembly and assembly component installs the memory into the memory cooling device and releases the locked memory, the first disassembly and assembly component releases the abutting locking member, and the memory abutting locking member is in a locked state to install the memory into the memory cooling device. By setting a movable first disassembly / assembly component, including a first operating element and a first actuating element, the first operating element, when subjected to force, causes the first actuating element to be in an unlocked state, thereby unlocking the locking element. This enables the locking element to unlock automatically, reducing the operational complexity of the unlocking operating element. By setting a movable second disassembly / assembly component, including a second operating element, an intermediate connecting element, and a second actuating element, the second operating element, when subjected to force, causes the second actuating element to be in a locked state through the action of the intermediate connecting element, locking the memory with its clamping part. When the force on the second operating element is released, the second actuating element is in an unlocked state under the action of the third and fourth elastic elements, providing a stable clamping force for disassembling the memory and ensuring that the memory does not detach during disassembly / assembly. Through the combined use of the first and second disassembly / assembly components, precise disassembly / assembly of the memory can be achieved in confined spaces, further reducing operational complexity and thus avoiding damage to the heat-conducting materials or the memory.

[0065] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0066] On the one hand, refer to Figures 1 to 3 As shown, this application embodiment provides a memory disassembly and assembly device for disassembling and assembling memory 410 in memory cooling device 400. Memory 410 is locked in memory cooling device 400 by locking member 420.

[0067] The memory removal and installation device includes a mounting base 100, a first removal and installation component 200, and a second removal and installation component 300. The first removal and installation component 200 is movably disposed on the mounting base 100 and has a first locked state and a first dismounted state. When the first removal and installation component 200 is in the first locked state, the first removal and installation component 200 disengages from the locking member 420. When the first removal and installation component 200 is in the first dismounted state, the first removal and installation component 200 abuts against the locking member 420, so that the locking member 420 is in the unlocked state.

[0068] The second disassembly and assembly component 300 is movably disposed on the mounting base 100 and has a second locking state and a second disassembly state. When the second disassembly and assembly component 300 is in the second locking state, the second disassembly and assembly component 300 locks the memory 410. When the second disassembly and assembly component 300 is in the second disassembly state, the second disassembly and assembly component 300 disengages from the lock memory 410.

[0069] The first disassembly assembly 200 and the second disassembly assembly 300 cooperate to remove the memory 410 from the memory cooling device 400 or to install the memory 410 into the memory cooling device 400.

[0070] The first disassembly / reassembly component 200 is in the unlocked state when it abuts against the locking component 420, and the second disassembly / reassembly component 300 locks the memory 410 so as to remove the memory 410 from the memory cooling device 400.

[0071] The first disassembly and assembly component 200 is in the unlocked state when it abuts against the locking member 420. The second disassembly and assembly component 300 installs the memory 410 into the memory cooling device 400 and disengages from locking the memory 410. The first disassembly and assembly component 200 disengages from abutting against the locking member 420, and the memory 410 abuts against the locking member 420 and is in the locked state, so that the memory 410 can be installed into the memory cooling device 400.

[0072] In the embodiments of this application, the memory removal and installation device is used to install memory 410 into the memory mounting slot 430 in the memory cooling device 400 and to remove memory 410 from the memory mounting slot 430. The mounting base 100 in the memory removal and installation device is used to install a first removal and installation component 200 and a second removal and installation component 300. When the first removal and installation component 200 is in a first unlocked state, it is used to open the locking member 420; when the second removal and installation component 300 is in a second locked state, it is used to clamp memory 410, so that the memory removal and installation tool can sequentially unlock the locking member 420 and clamp memory 410 for removal and installation.

[0073] For example, the mounting base 100 is used to install and remove components, providing a certain degree of support. Therefore, it can be made of anodized aluminum alloy to ensure its hardness and strength. In addition, the mounting base 100 can be understood as a handle, which comes into direct contact with the human hand. Therefore, it needs to provide a comfortable grip while isolating the conduction of static electricity from the human body. Additional anti-static rubber or silicone can be used to wrap the outside of the handle.

[0074] For example, the locking element 420 is a seahorse lock, disposed at both ends of the memory mounting slot 430 in the memory cooling device 400, for fixing the memory 410, and its shape is "L". When installing the memory 410, the bottom of the memory 410 contacts one end of the seahorse lock (seahorse dock latch), and the seahorse lock will reset under the action of its own structure, locking the memory 410. It can be understood that the reset here means that the seahorse lock is in the locked state. The locking element 420 can be made of metal to ensure its sturdiness and durability, or it can be made of plastic to have good insulation properties.

[0075] It should be noted that the initial state in the embodiments of this application refers to the state in which the components in the memory disassembly and assembly device are not subjected to any force.

[0076] As one feasible implementation, the first disassembly and assembly assembly 200 includes a first operating member 210 and a first actuating member 220. The first actuating member 220 has an abutting portion 221 for abutting against the locking member 420.

[0077] The first operating member 210 selectively abuts against the first actuating member 220; when the first operating member 210 abuts against the first actuating member 220, the abutting part 221 abuts against the locking member 420, so that the locking member 420 is in an unlocked state. It can be understood that when the first end of the first actuating member 220 is subjected to force, the first actuating member 220 contacts the first operating member 210. When it moves to below the first operating member 210, the other end of the first actuating member 220, specifically the abutting part 221, rotates relative to it to abut against the locking member 420, thereby opening the locking member 420.

[0078] When the first operating member 210 disengages from the first actuating member 220, the abutting part 221 disengages from the abutting locking member 420. It can be understood that when the first operating member 210 and the first actuating member 220 are not in contact, the first actuating member 220 is in the initial state.

[0079] For example, the first actuator 220 is used to unlock the locking member 420, and therefore comes into direct contact with the locking member 420. Therefore, its material not only needs to be hard, but also possesses insulation, wear resistance, and antistatic properties. Thus, antistatic synthetic stone, antistatic plastic, or anodized aluminum alloy can be used. The first operating member 210 can be made of antistatic engineering plastic. Antistatic properties prevent static electricity from the human body from being conducted through the first operating member 210 to the internal disassembly tool, ultimately damaging the memory 410. Furthermore, the surface can be smoothed to reduce friction with the inner wall of the mounting base 100, ensuring smooth sliding.

[0080] In one feasible implementation, a first elastic member 215 is provided between the first operating member 210 and the mounting base 100. The first operating member 210 has a wedge-shaped operating surface 213 and a locking surface 214 that are connected to each other. The wedge-shaped operating surface 213 can be understood as an inclined structure on the first operating member 210. When the first end of the first actuator 220 is subjected to force, the wedge-shaped operating surface 213 can decompose the force perpendicular to the first actuator 220. In this way, a smaller force can be used to move the first operating member 210, thereby locking the first actuator 220 at the locking surface 214.

[0081] The middle part of the first actuator 220 is rotatably connected to the mounting base 100. The first end of the first actuator 220 selectively abuts against the wedge-shaped operating surface 213, and the second end of the first actuator 220 forms an abutment portion 221. A second elastic member 222 is provided on the side of the first actuator 220 near the second end and the mounting base 100.

[0082] The first elastic member 215 has a tendency to push the first operating member 210 toward the first end of the first actuator 220; the second elastic member 222 has a tendency to push one side of the second end of the first actuator 220 so that the first end of the first actuator 220 disengages from the wedge-shaped operating surface 213.

[0083] Reference Figures 4 to 6 As shown, the first end of the first actuator 220 is subjected to force to move toward the wedge-shaped operating surface 213 to abut against the wedge-shaped operating surface 213, and the first elastic member 215 is compressed by the first operating member 210; the first actuator 220 rotates to compress the second elastic member 222, and the abutting part 221 abuts against the locking member 420 to make the locking member 420 in an unlocked state; the first end of the first actuator 220 is engaged with the engaging surface 214.

[0084] For example, the first elastic element 215 and the second elastic element 222 are springs. When the first end of the first actuator 220 is subjected to force and moves towards the wedge-shaped operating surface 213, the first operating element 210 compresses the first elastic element 215 and is in a compressed state. The first actuator 220 moves to the locking surface 214. At the same time, the other end of the first actuator 220 rotates relative to the first elastic element 215 and compresses the second elastic element 222. Due to the elastic force of the first elastic element 215, the first operating element 210 moves away from the first elastic element 215, causing the first actuator to be fixed to the locking surface 214. At this time, the abutting portion 221 of the first actuator 220 abuts against the locking member 420 and is in an unlocked state.

[0085] Reference Figure 7 As shown, the first operating member 210 is subjected to force to move away from the first actuator 220, so that the first end of the first actuator 220 disengages from the locking surface 214, the abutment portion 221 disengages from the locking member 420 under the elastic force of the second elastic member 222, the first end of the first actuator 220 disengages from the wedge-shaped operating surface 213 under the elastic force of the second elastic member 222, and the first operating member 210 returns to the initial state under the elastic force of the first elastic member 215.

[0086] Understandably, when the first operating member 210 is subjected to force, the first elastic member 215 is compressed, the first actuating member 220 disengages from the engaging surface 214, and under the elastic force of the second elastic member 222, the first actuating member 220 returns to its initial position. At this time, the second elastic member is in its initial state. Furthermore, under the elastic force of the first elastic member 215, the first operating member 210 is pushed back to its initial state, and the first elastic member also returns to its initial state.

[0087] As one feasible implementation, there are at least two first operating elements 210 and at least two first executing elements 220; at least two first operating elements 210 and at least two first executing elements 220 are respectively disposed on opposite sides of the mounting base 100 and are disposed in a one-to-one correspondence; at least two first executing elements 220 are respectively used to unlock the locking elements 420 located on opposite sides of the memory 410.

[0088] For example, there are two first operating members 210 and two first actuating members 220, which are respectively disposed on opposite sides of the mounting base 100. The symmetrical structure can evenly transmit the force to both sides when subjected to force, and can unlock the locking member 420 at the same time. This ensures that the force is evenly distributed on both sides during the unlocking process of the locking member 420, avoids damage to the locking member 420 caused by unlocking on one side first, and improves the unlocking efficiency.

[0089] As one feasible implementation method, refer to Figure 1 and Figure 2As shown, the mounting base 100 has a mounting cavity 110 and a first operating port 111 and a second operating port 112 communicating with the mounting cavity 110. The first operating member 210 has a main body 211 and an operating part 212. The main body 211 is disposed in the mounting cavity 110, and a first elastic member 215 is disposed between the main body 211 and the inner wall of the mounting cavity 110.

[0090] The first operating port 111 is located on the side of the mounting base 100 facing the first actuator 220, and the main body 211 selectively abuts against the first end of the first actuator 220 through the first operating port 111.

[0091] The operating part 212 passes through the second operating port 112 and is located outside the mounting cavity 110. The edges of the operating part 212 and the second operating port 112 are matched to limit the position of the first operating member 210 moving toward the first actuator 220.

[0092] In other embodiments, a magnetic locking mechanism can be provided in the mounting cavity 110, so that the first actuator 220 can be quickly locked and released without pressing by magnetic adsorption, further simplifying the operation process of the first actuator 220.

[0093] In one feasible implementation, the second disassembly / assembly assembly 300 includes a second operating element 310, an intermediate connecting element 330, and a second actuating element 320. The second operating element 310 is used to drive the second actuating element 320 to clamp the memory 410.

[0094] A third elastic member 311 is provided between the second operating member 310 and the mounting base 100. The second operating member 310 is rotatably connected to the first end of the intermediate connecting member 330. The middle part of the intermediate connecting member 330 is rotatably connected to the mounting base 100. The second end of the intermediate connecting member 330 is connected to the first end of the second actuating member 320, and a fourth elastic member 331 is provided between the intermediate connecting member 330 and the mounting base 100. The second end of the second actuating member 320 has a clamping part 321.

[0095] The third elastic member 311 has a tendency to push the second operating member 310 so that the intermediate connecting member 330 and the second actuator 320 are in an unlocked state through the second operating member 310; the fourth elastic member 331 has a tendency to push the first end of the second actuator 320 so that the second actuator 320 is in an unlocked state.

[0096] Reference Figure 8 and Figure 9 As shown, the second operating member 310 is subjected to force to compress the third elastic member 311, and drives the second actuator 320 through the intermediate connecting member 330 to compress the fourth elastic member 331, so that the second actuator 320 is in a locked state.

[0097] The second operating member 310 moves under the elastic force of the third elastic member 311, and the intermediate connecting member 330 and the second actuator 320 move under the elastic force of the fourth elastic member 331, so that the second actuator 320 is in the unlocked state.

[0098] Understandably, when the second operating member 310 is subjected to force, the third elastic member 311 is compressed. The second operating member 310 drives the intermediate connecting member 330 to rotate around the center, and the other end of the compressed fourth elastic member 331 is also compressed, so that the second actuator 320 is locked and used to clamp the memory 410.

[0099] When the second operating member 310 is not subjected to force, the second actuator 320 returns to its initial state under the elastic force of the third elastic member 311, thereby driving the intermediate connecting member 330 connected to the second operating member 310 to rotate. At the same time, it returns to its initial state under the elastic force of the fourth elastic member 331. At this time, the second actuator 320 also returns to its initial state and is in the unlocked state. The third elastic member 311 and the fourth elastic member 331 also return to their initial states.

[0100] In other embodiments, miniature pressure sensors can be integrated on the first operating element 210 and the second operating element 310 to detect the applied force on the first operating element 210 and the second operating element 310 in real time, and can provide feedback to the operator through LED indicator lights or pressure gauges to ensure that the force applied to the memory 410 during the disassembly and assembly process meets the requirements.

[0101] In other embodiments, the clamping part 321 may be equipped with elastic buffers such as silicone pads, which can absorb the impact force received by the memory 410 during the installation and removal of the memory 410, reduce the rigid collision between the memory 410 and the clamping part 321 of the second actuator 320, and further prevent the memory 410 or the heat conduction part 440 from being damaged.

[0102] As one feasible implementation, there are at least two intermediate connectors 330 and at least two second actuators 320; at least two intermediate connectors 330 and at least two second actuators 320 are respectively disposed on opposite sides of the mounting base 100 and are disposed in a one-to-one correspondence; at least two second actuators 320 are respectively disposed on opposite sides of the memory 410.

[0103] For example, there are two intermediate connectors 330 and second actuators 320, which are respectively disposed on opposite sides of the mounting base 100 and inside the first actuators 220 on opposite sides of the mounting base 100, for clamping the memory 410 from both sides. This allows for the uniform application of clamping force from both sides, preventing wear on the memory mounting slot 430 due to force on one side, avoiding the memory 410 from falling off during clamping, and thus improving the efficiency of memory 410 installation and removal.

[0104] As one possible implementation, the mounting base 100 includes a mounting body, and the second operating member 310 has an operating body, with the extension direction of the mounting body parallel to the extension direction of the operating body.

[0105] Along the extension direction of the mounting body, at least two first operating elements 210 are disposed on opposite sides of the mounting body; along the extension direction of the operating body, at least two intermediate connecting elements 330 and at least two second actuators 320 are respectively disposed on opposite sides of the operating body.

[0106] In this embodiment, the operating body and the mounting body are parallel. This allows the force on the second operating member 310 to be simultaneously and equally converted into a clamping force of the second actuator 320 on the memory 410, preventing damage to the memory 410 caused by unilateral or uneven force application. The operating body and the mounting body are connected by at least two third elastic members 311. By providing the third elastic members 311, the second operating member 310 can return to its initial state under the action of the third elastic members 311 when the force on the operating body is removed.

[0107] In one feasible implementation, the second actuator 320 has a clamping surface facing the memory 410; the first actuator 220 is located on the side of the second actuator 320 away from the clamping surface; a limiting member 120 is provided between the first actuator 220 and the second actuator 320 along the direction from the first actuator 220 to the second actuator 320, and the limiting member 120 is connected to the mounting base 100; the limiting member 120 has a wedge-shaped protrusion 121 protruding towards the second actuator 320, and the side of the second actuator 320 away from the clamping surface has a mating surface that matches the shape of the wedge-shaped protrusion 121.

[0108] For example, the protruding wedge-shaped surface can be understood as an irregular slope, which causes the second actuator 320 to move downward along the irregular slope under the action of the second operating member 310. This allows the clamping part 321 of the second actuator 320 to accurately penetrate into the clamping groove of the memory 410, making the clamping of the memory 410 more stable and less prone to falling off. In addition, a limiting groove is provided on the side away from the clamping surface. The inner wall of the groove is inclined and adapted to the shape of the wedge-shaped protruding surface 121. The limiting groove works in conjunction with the wedge-shaped protrusion to prevent the second actuator 320 from disengaging from the wedge-shaped protruding surface 121.

[0109] In other embodiments, the limiting member 120 may use a gear transmission mechanism to control the movement of the second actuator 320 and the clamping of the memory 410 through gear meshing. The gear transmission mechanism can provide precise displacement control, further reducing lateral swaying during the installation and removal of the memory 410 and improving the contact stability of the heat-conducting component 440. Furthermore, by adjusting the angle of the wedge-shaped protrusion 121 or making the size of the memory installation and removal device adjustable, it can be adapted to accommodate the removal and removal of the memory 410 in various memory cooling devices 400, thereby improving versatility.

[0110] In summary, the memory disassembly and assembly device provided in this application can automatically unlock the locking component 420, reducing the operational complexity of the unlocking component; it can also provide a stable clamping force for the memory 410, ensuring that the memory 410 does not come off during disassembly; it enables the disassembly and assembly of the memory 410 in a confined space, further reducing the operational complexity, thereby avoiding damage to the heat-conducting component 440 or the memory 410.

[0111] On the other hand, this application provides a memory disassembly and assembly method, applied to the aforementioned memory disassembly and assembly apparatus, the memory disassembly and assembly method including a memory disassembly method and a memory installation method.

[0112] It is understood that since the memory disassembly and assembly method of this application uses the technical solution of the above-described memory disassembly and assembly device embodiment, it has at least the beneficial effects brought about by the technical solution of the above-described memory disassembly and assembly device embodiment, and will not be described in detail here.

[0113] Among them, reference Figure 10 As shown, the memory removal method includes:

[0114] S100: Controls the first disassembly / assembly component to be in the unlocked state when it abuts the locking element.

[0115] S200: Controls the second disassembly assembly to lock the memory so that the memory can be removed from the memory cooling device.

[0116] For example, the specific disassembly process is as follows: In the memory disassembly method, the first disassembly component 200 is controlled to abut against the locking member 420 in an unlocked state. Specifically, the first operating members 210 on both sides of the mounting body are subjected to a force toward the mounting body (e.g., Figure 11 This puts the first actuator 220 in its initial state, where it is not under any force and the abutment portion 221 of the first actuator 220 is tilted outward relative to the end near the first operating member 210. The memory installation / removal device is then placed into the corresponding memory mounting slot 430 (e.g., ...). Figure 12 ), applying a downward force to the memory mounting / removing device (such as Figure 13This causes the first actuator 220 to open the locking member 420, at which point the locking member 420 is in the unlocked state. Thus, under the action of the second actuator 320, the locking member 420 automatically unlocks without requiring additional unlocking steps. This avoids errors and damage to the locking member 420 caused by manual unlocking, and also improves the unlocking efficiency of the locking member 420.

[0117] The second disassembly / removal component 300 locks the memory 410, removing the memory 410 from the memory cooling device 400. Specifically, an upward force (e.g., applied to the second operating component 310) is involved. Figure 14 The second operating member 310 drives the intermediate connecting member 330 to rotate, thereby causing the clamping part 321 of the second actuator 320 to tilt inward, so that the clamping part 321 of the second actuator 320 hooks the hook grooves on both sides of the memory 410 (e.g., Figure 15 This ensures stable clamping of the memory 410 by the clamping part 321, preventing slippage or damage. A continuous force is applied to the second operating member 310, causing the entire memory removal and installation device to be subjected to upward force to remove the memory 410 perpendicular to the memory mounting slot 430, preventing damage to the memory 410 and the heat-conducting component 440. After removing the memory 410, the force on the second operating member 310 is released. The second operating member 310, the intermediate connecting member 330, and the second actuating member 320 are reset under the action of the fourth elastic member 331 and the third elastic member 311, and the memory 410 falls out (as shown). Figure 16 Finally, the memory 410 was removed from the memory mounting slot 430.

[0118] Reference Figure 17 As shown, the memory installation methods include:

[0119] S300: Controls the first disassembly / assembly component to be in the unlocked state when it abuts the locking element.

[0120] S400: Controls the second disassembly assembly to install the memory into the memory cooling device and release the locked memory.

[0121] S500: Controls the first disassembly component to disengage from the abutment locking member, and the memory abutment locking member is in a locked state, so as to install the memory into the memory cooling device.

[0122] For example, the steps of the memory installation method and the memory removal method are basically the opposite, and the specific process is as follows:

[0123] In the embodiments of this application, before the memory 410 is installed, when the locking member 420 is in the locked state, the specific process of controlling the first disassembly component 200 to abut against the locking member 420 in the unlocked state is the same as the process in the memory disassembly method, and will not be described in detail here. In other embodiments, before the memory 410 is installed, the locking member 420 is in the unlocked state, and the specific process is as follows: a downward force is applied to the first end of the first actuator 220 (e.g., Figure 18 This causes the first end of the first actuator 220 to engage with the engaging surface 214 of the first operating member 210, thus fixing the first actuator 220 in place. It can be understood that at this time, the first disassembly / assembly assembly 200 is in an open state.

[0124] The second disassembly / assembly assembly 300 controls the installation of memory 410 into memory cooling device 400 and disengages the locked memory 410. The specific process of the second actuator 320 clamping memory 410 in a locked and unlocked state is consistent with the process in the memory disassembly method (e.g., ...). Figure 19 (This will not be elaborated further here.) However, in the memory installation method, after the second actuator 320 clamps the memory 410, the memory 410 is placed into the memory installation slot 430 corresponding to the memory 410 (e.g., ...). Figure 20 This applies force to the memory mounting and dismounting device to press the memory 410 into place (e.g., Figure 21 At this point, locking component 420 automatically rotates and locks memory 410. Finally, remove the memory removal and installation device to complete the installation of memory 410 (e.g., Figure 22 ).

[0125] In summary, the disassembly and installation of memory 410 implements a distributed operation process. Through mechanical structural constraints, the operating components, execution components, and elastic components work together to ensure the reliability of each step of the operation.

[0126] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0127] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A memory disassembly device, characterized by, The application relates to a memory dismounting device for a memory (410) in a memory cooling device (400), wherein the memory (410) is locked and installed in the memory cooling device (400) through a locking piece (420); The memory dismounting device comprises: a mounting seat (100); a first dismounting assembly (200) movably arranged in the mounting seat (100) and having a first locking state and a first dismounting state; when the first dismounting assembly (200) is in the first locking state, the first dismounting assembly (200) is separated from abutting against the locking piece (420); when the first dismounting assembly (200) is in the first dismounting state, the first dismounting assembly (200) abuts against the locking piece (420), so that the locking piece (420) is in an unlocked state; a second dismounting assembly (300) movably arranged in the mounting seat (100) and having a second locking state and a second dismounting state; when the second dismounting assembly (300) is in the second locking state, the second dismounting assembly (300) locks the memory (410); when the second dismounting assembly (300) is in the second dismounting state, the second dismounting assembly (300) is separated from locking the memory (410); the first dismounting assembly (200) and the second dismounting assembly (300) cooperate to dismount the memory (410) from the memory cooling device (400) or install the memory (410) into the memory cooling device (400).

2. The memory disassembly device of claim 1, wherein, The first dismounting assembly (200) comprises a first operating piece (210) and a first executing piece (220), and the first executing piece (220) has an abutting portion (221) for abutting against the locking piece (420); the first operating piece (210) selectively abuts against the first executing piece (220); when the first operating piece (210) abuts against the first executing piece (220), the abutting portion (221) abuts against the locking piece (420), so that the locking piece (420) is in the unlocked state; when the first operating piece (210) is separated from abutting against the first executing piece (220), the abutting portion (221) is separated from abutting against the locking piece (420).

3. The memory disassembly device of claim 2, wherein, a first elastic piece (215) is arranged between the first operating piece (210) and the mounting seat (100), and the first operating piece (210) has a wedge-shaped operating surface (213) and a clamping surface (214) connected to each other; the first executing piece (220) is rotationally connected to the mounting seat (100), a first end of the first executing piece (220) selectively abuts against the wedge-shaped operating surface (213), and a second end of the first executing piece (220) forms the abutting portion (221); a second elastic piece (222) is arranged between a side of the first executing piece (220) close to the second end and the mounting seat (100). When the locking piece (420) is in the unlocking state, the first executing piece (220) abuts against the wedge-shaped operation surface (213) and the clamping surface (214), the second elastic piece (222) is in the compressed state, and the abutting portion (221) abuts against the locking piece (420); When the locking piece (420) is in the locking state, the first executing piece (220) is separated from abutting against the wedge-shaped operation surface (213) and the clamping surface (214), the second elastic piece (222) returns to the initial state, and the abutting portion (221) is separated from abutting against the locking piece (420).

4. The memory disassembly device of claim 3, wherein, The first operation piece (210) and the first executing piece (220) are both at least two; the at least two first operation pieces (210) and the at least two first executing pieces (220) are arranged on opposite sides of the mounting seat (100) in one-to-one correspondence. The at least two first executing pieces (220) are respectively used for unlocking the locking pieces (420) located on opposite sides of the memory (410).

5. The memory disassembly device of claim 3, wherein, The mounting seat (100) has a mounting cavity (110), a first operation opening (111) and a second operation opening (112) which are in communication with the mounting cavity (110), and the first operation piece (210) has a main body portion (211) and an operation portion (212); the main body portion (211) is arranged in the mounting cavity (110), and the first elastic piece (215) is arranged between the main body portion (211) and a cavity inner wall of the mounting cavity (110); The first operation opening (111) is located on a side of the mounting seat (100) facing the first executing piece (220), and the main body portion (211) selectively abuts against a first end of the first executing piece (220) through the first operation opening (111); The operation portion (212) penetrates through the second operation opening (112) and is located outside the mounting cavity (110), and the operation portion (212) and an opening edge of the second operation opening (112) are limited in position cooperation, so as to limit the position of the first operation piece (210) moving towards the first executing piece (220).

6. The memory disassembly device according to any one of claims 2-5, wherein, The second dismounting assembly (300) comprises a second operation piece (310), an intermediate connecting piece (330) and a second executing piece (320); The second operation piece (310) is arranged between the mounting seat (100) and the third elastic piece (311), the second operation piece (310) is rotationally connected to a first end of the intermediate connecting piece (330), the intermediate connecting piece (330) is rotationally connected to the mounting seat (100), a second end of the intermediate connecting piece (330) is connected to a first end of the second executing piece (320), and the second end of the second executing piece (320) is arranged between the mounting seat (100) and the fourth elastic piece (331); and the second end of the second executing piece (320) has a clamping portion (321). The second operating member (310) is forced to compress the third elastic member (311) and drive the second executing member (320) through the intermediate connecting member (330) to compress the fourth elastic member (331) so that the second executing member (320) is in a locked state; The second operating member (310) is moved under the elastic force of the third elastic member (311), and the intermediate connecting member (330) and the second executing member (320) are moved under the elastic force of the fourth elastic member (331) so that the second executing member (320) is in an unlocked state.

7. The memory disassembly device of claim 6, wherein, The intermediate connecting member (330) and the second executing member (320) are both at least two; at least two intermediate connecting members (330) and at least two second executing members (320) are arranged on opposite sides of the mounting seat (100) one by one. At least two second executing members (320) are arranged on opposite sides of the memory (410) respectively.

8. The memory disassembly device of claim 6, wherein, The mounting seat (100) comprises a mounting body, and the second operating member (310) has an operating body, and the extension direction of the mounting body is parallel to the extension direction of the operating body; Along the extension direction of the mounting body, at least two first operating members (210) are arranged on opposite sides of the mounting body; along the extension direction of the operating body, at least two intermediate connecting members (330) and at least two second executing members (320) are arranged on opposite sides of the operating body respectively.

9. The memory disassembly device of claim 6, wherein, The second executing member (320) has a clamping surface for facing the memory (410); the first executing member (220) is located on the side of the second executing member (320) away from the clamping surface; Along the direction from the first executing member (220) to the second executing member (320), a limiting member (120) is arranged between the first executing member (220) and the second executing member (320), and the limiting member (120) is connected to the mounting seat (100); The limiting member (120) has a wedge-shaped protruding surface (121) protruding towards the second executing member (320), and the side of the second executing member (320) away from the clamping surface has a matching surface adapted to the shape of the wedge-shaped protruding surface (121).

10. A memory disassembling method applied to the memory disassembling device of any one of claims 1-9, characterized in that, The memory disassembly method comprises: Controlling the first disassembly assembly (200) to abut against the locking member (420) to be in an unlocked state, and controlling the second disassembly assembly (300) to lock the memory (410) to disassemble the memory (410) from the memory cooling device (400); The first disassembling component (200) is controlled to abut against the locking part (420) in an unlocked state, the second disassembling component (300) is controlled to install the memory (410) into the memory cooling device (400) and to release the locking of the memory (410), and the first disassembling component (200) is controlled to release the abutment against the locking part (420), and the memory (410) abuts against the locking part (420) in a locked state, so as to install the memory (410) into the memory cooling device (400).

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