Die cutting processing method of boron nitride

Abstract

The invention discloses a die cutting processing method of boron nitride, and belongs to a die cutting processing technology of electronic auxiliary materials. The die cutting processing method comprises the following steps: attaching an insulating film to the upper surface of boron nitride, and attaching a double faced adhesive tape to the lower surface of boron nitride; boron nitride containing an insulating film and a double-faced adhesive tape is subjected to shape die cutting forming, so that the insulating film and the double-faced adhesive tape form a closed edge wrapping structure, and the boron nitride is wrapped in the closed edge wrapping structure. The insulating film is additionally arranged on the upper surface of the boron nitride, so that the insulating film and the double-sided adhesive tape on the lower surface of the boron nitride form an edge covering effect, the boron nitride can be well wrapped inside, the toughness of the boron nitride is enhanced, the layering phenomenon is reduced, and the situation that powder falls off to pollute components is prevented. The problems that the boron nitride is easy to layer and powder falls off are solved, and the excellent characteristics of high thermal conductivity, high insulativity, high breakdown resistance, low dielectric coefficient, low dielectric loss and low density of the boron nitride are kept.

Description

Technical Field

[0001] This invention relates to the field of die-cutting processes for electronic accessories, and more particularly to a die-cutting method for boron nitride. Background Technology

[0002] Boron nitride is a thermally conductive material primarily composed of nitrogen and boron. It possesses high thermal conductivity, high insulation, high breakdown strength, as well as low dielectric constant, low dielectric loss, and low density. With the trend towards smarter and smaller electronic products, boron nitride is increasingly being used in electronic components for both thermal conductivity and insulation.

[0003] However, because boron nitride is made from powder calendering, it is relatively fragile and prone to delamination. During die-cutting and product use, delamination easily occurs, and powder flakes off at the cross-section when the edges are trimmed, potentially contaminating components. This limits the material's practical application and promotion, preventing it from meeting the quality requirements of real-world applications. Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a die-cutting method for boron nitride, which aims to solve the problems of delamination and powder shedding that occur in existing boron nitride materials during use.

[0005] The technical solution of the present invention is as follows: A method for die-cutting boron nitride, comprising the steps of: An insulating film is bonded to the upper surface of boron nitride, and double-sided adhesive is bonded to the lower surface of boron nitride. Boron nitride containing an insulating film and double-sided adhesive is die-cut into shape, so that the insulating film and the double-sided adhesive form a closed edge structure, and the boron nitride is wrapped in the closed edge structure.

[0006] Optionally, the step of bonding an insulating film to the upper surface of boron nitride and bonding double-sided adhesive to the lower surface of boron nitride specifically includes: A composite film is obtained by laminating a single-sided adhesive insulating film with a support film and then winding it up. Boron nitride is bonded onto a protective film, and then the shape is die-cut and waste is removed sequentially to obtain the first intermediate product. The composite film is bonded to the upper surface of the first intermediate product to obtain a second intermediate product, wherein the adhesive side of the insulating film in the composite film faces the boron nitride in the first intermediate product. Remove the protective film from the second intermediate product and re-apply double-sided tape to obtain the third intermediate product.

[0007] Optionally, the step of die-cutting the boron nitride containing the insulating film and double-sided adhesive into a closed edge structure, and encapsulating the boron nitride within the closed edge structure, specifically includes: The third intermediate product is die-cut using a die-cutting machine to form a closed edge structure, thereby encapsulating the boron nitride in the closed edge structure. Excess waste material outside the closed edge structure is removed using a waste removal machine to obtain the product.

[0008] Optionally, the die-cutting method includes the following steps: Step S1: After laminating the single-sided adhesive insulating film with the support film, roll it up to obtain a composite film; Step S2: Lay boron nitride onto the protective film, then use a die-cutting machine to die-cut the shape, and then use a waste removal machine to remove excess waste to obtain the first intermediate product; Step S3: The composite film is attached to the upper surface of the first intermediate product to obtain the second intermediate product, wherein the adhesive side of the insulating film in the composite film faces the boron nitride in the first intermediate product. Step S4: Remove the protective film from the second intermediate product, re-attach the double-sided tape, and obtain the third intermediate product; Step S5: Flip the third intermediate product over and use a die-cutting machine to die-cut the third intermediate product into shape, so that the composite film and double-sided adhesive in the third intermediate product form a closed edge structure, and the boron nitride is wrapped in the closed edge structure. Step S6: Use a waste removal machine to remove excess waste material outside the closed edge structure to obtain the product; Step S7: Transfer the product onto the carrier film; Step S8: Rewind the finished product.

[0009] Optionally, the dimensions of the insulating film and the double-sided adhesive are both greater than or equal to 0.5 mm and less than or equal to 1.0 mm on each side compared to the dimensions of the boron nitride.

[0010] Optionally, the thickness of the insulating film is 0.001~0.005mm.

[0011] Optionally, the thickness of the double-sided adhesive is 0.005 mm.

[0012] Optionally, the protective film is a PET protective film, which is red in color and has an adhesion of 5~10gf / 25mm.

[0013] Optionally, the double-sided adhesive tape has a low-basis-weight release film with a thickness of 0.05 mm.

[0014] Optionally, the carrier film is a release film that can be separated from the double-sided adhesive. The release film has a thickness of 0.075 mm, a basis weight of 1~5 g / 25 mm, and a transparent color.

[0015] Beneficial Effects: This invention provides an innovative die-cutting method for boron nitride. Through specific steps and parameter control, such as surface bonding of an insulating film and the use of a double-edge wrapping process, this method effectively enhances the structural strength of boron nitride products and reduces delamination. Simultaneously, the edge wrapping design minimizes powder shedding during the cutting process, preventing component contamination and significantly improving the product's practical application performance and promotional value. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the product's cross-section.

[0017] Figure 2 This is a schematic diagram of the product's edge binding.

[0018] Figure 3 This is a schematic diagram of the product structure breakdown.

[0019] Figure 4 This is a schematic diagram of the winding process after the insulating film and the support film are laminated in step S1.

[0020] Figure 5 This is a schematic diagram of the process steps S2 to S8. Detailed Implementation

[0021] This invention provides a die-cutting method for boron nitride. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention is further described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0022] To address the issues of delamination and powder shedding in current boron nitride (BN) materials, this invention improves the existing die-cutting process by adding a single-sided adhesive insulating film, enhancing the structural toughness of BN and reducing its fragility. Simultaneously, a double-edge wrapping process effectively encapsulates the powder at the edges of the BN, preventing powder from shedding and contaminating components. This invention effectively solves the problems of delamination and powder shedding that contaminate components in BN products without compromising the original superior properties of BN (such as high thermal conductivity and high insulation).

[0023] Specifically, this invention provides a die-cutting method for boron nitride, comprising the following steps: An insulating film is bonded to the upper surface of boron nitride, and double-sided adhesive is bonded to the lower surface of boron nitride. Boron nitride containing an insulating film and double-sided adhesive is die-cut into a shape to form a closed-edge structure. The boron nitride is then encapsulated within this closed-edge structure. (See...) Figure 1 As shown.

[0024] In this embodiment, by adding an insulating film to the upper surface of boron nitride, forming an edge-wrapping effect with the double-sided adhesive on the lower surface of boron nitride, the boron nitride is effectively encapsulated, enhancing its toughness, reducing delamination, and preventing powder shedding and contamination of components. While solving the problems of easy delamination and powder shedding of boron nitride, it also retains the excellent high thermal conductivity, high insulation, high breakdown resistance, as well as the characteristics of low dielectric constant, low dielectric loss, and low density of boron nitride.

[0025] In one embodiment, the dimensions of the insulating film and the double-sided adhesive are each greater than or equal to 0.5 mm and less than or equal to 1.0 mm on each side compared to the dimensions of the boron nitride. For example, each side is greater than 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1.0 mm. In other words, the dimensions of the insulating film and the double-sided adhesive on each side, in both length and width directions, must be at least 0.5 mm larger than the boron nitride, but not exceeding 1.0 mm, to ensure a closed edge structure. If the dimensions on one side are too small, edge bursting will occur (i.e., the seal is not tight or complete); if the dimensions on one side are too large, it will affect the overall dimensions of the product and may even alter the original structural design of the product. Preferably, the dimensions of the insulating film and the double-sided adhesive are greater than the dimensions of the boron nitride by more than 0.8 mm on each side (e.g., ...). Figure 2 (As shown).

[0026] In this embodiment, the insulating film on the upper surface of the boron nitride and the double-sided adhesive on the lower surface each have a dimension greater than 0.8 mm on each side compared to the boron nitride, forming a closed edge structure with a dimension greater than 0.8 mm on each side, thus encapsulating the boron nitride (e.g., Figure 1 and Figure 2 (As shown). In other words, the insulating film and double-sided adhesive must be 0.8 mm larger than boron nitride on each side in both length and width directions to ensure a closed-edge structure. This structure retains the excellent high thermal conductivity, high insulation, high breakdown resistance, low dielectric constant, low dielectric loss, and low density characteristics of boron nitride, while avoiding the problem of powder falling off the cross-section of the die-cutting edge during the die-cutting process and contaminating components.

[0027] In one embodiment, the thickness of the insulating film is 0.001~0.005mm, such as 0.001mm, 0.002mm, 0.003mm, 0.004mm, 0.005mm, etc. When the insulating film is within this thickness range, the impact on the properties of boron nitride itself is negligible. The insulating film is an organic insulating film. Preferably, the insulating film is a polyester insulating film (PET). Commonly used organic insulating films include polyester insulating film (PET), polypropylene (PP), polycarbonate (PC), and polyimide (PI). PC material is too rigid, and its thinnest thickness is currently only 0.05mm, so it is not used; PI film is too expensive, so it is also not used; PP film is not commonly used, so it is also not used. Furthermore, ultra-thin materials (thickness in the range of 0.001~0.005mm) for PI and PP have not yet been developed. Therefore, this embodiment preferably uses a PET film that is reasonably priced, meets the performance requirements, and has a thickness in the range of 0.001~0.005mm.

[0028] In one embodiment, the thickness of the double-sided adhesive is 0.005 mm.

[0029] The thickness of the double-sided tape can be selected according to the application requirements. However, for boron nitride-based double-sided tapes, two thicknesses are typically chosen: 0.005mm (the thinnest tape currently produced in the industry) and 0.01mm (a commonly used specification on the market). This is because if the double-sided tape is too thick, it will affect the properties of boron nitride itself. Therefore, in this embodiment, a double-sided tape with a thickness of 0.005mm is preferred. In one implementation, combined with Figure 3 As shown, the steps of bonding an insulating film to the upper surface of boron nitride and bonding double-sided adhesive to the lower surface of boron nitride specifically include: After laminating a single-sided adhesive insulating film with a support film, the film is rolled up (because the insulating film is thin and easily deformed, it needs to be laminated onto the support film first; the non-adhesive side of the insulating film is bonded to the adhesive side of the support film) to obtain a composite film. Boron nitride is bonded onto a low-viscosity protective film, and then the shape is die-cut and waste is removed to obtain the first intermediate product. The composite film is bonded to the upper surface of the first intermediate product to obtain a second intermediate product, wherein the adhesive side of the insulating film in the composite film faces the boron nitride in the first intermediate product. Remove the protective film from the second intermediate product and re-apply double-sided tape to obtain the third intermediate product.

[0030] In one embodiment, the step of die-cutting boron nitride containing an insulating film and double-sided adhesive to form a closed edge structure, and encapsulating the boron nitride within the closed edge structure specifically includes: The third intermediate product is die-cut using a die-cutting machine to form a closed edge structure, thereby encapsulating the boron nitride in the closed edge structure. Excess waste material outside the closed edge structure is removed using a waste removal machine to obtain the product.

[0031] In this embodiment, die-cutting is used to form a closed edge structure between the composite film and double-sided adhesive, which encapsulates boron nitride, effectively solving the problems of boron nitride material delamination and powder shedding.

[0032] In one embodiment, the low-viscosity protective film is a low-viscosity PET protective film (referring to a protective film with PET as the substrate and coated with low-viscosity adhesive).

[0033] Protective films come in many types. Based on the substrate, common types include PP, PET, and PE protective films. Because PP and PE protective films are too soft and lack good support, PET protective films are chosen due to their harder texture and excellent support. Based on the adhesive, commonly used adhesives include acrylic and silicone adhesives. Given the higher price and unit cost of silicone adhesives, acrylic adhesive is preferred in this embodiment. Based on color, common colors include red, transparent, and blue. Since red and blue are easy to observe with the naked eye and facilitate foolproof operation, red is preferred for the protective film in this embodiment. Based on adhesion, there are ultra-light adhesion (≤5gf / 25mm), low basis weight adhesion (5-20gf / 25mm), medium adhesion (30-50gf / 25mm), high adhesion (80-100gf / 25mm), and ultra-high adhesion (>100gf / 25mm). Too low an adhesion will prevent the adhesion of other materials, while too high an adhesion will result in excessively tight bonding and difficulty in separation. In this embodiment, considering both product size and ease of processing, a viscosity of 5-10 gf / 25 mm is selected. In one embodiment, the double-sided adhesive tape has a low-basis-weight release film with a thickness of 0.05 mm.

[0034] The low-basis-weight release film serves two purposes: firstly, it effectively protects the double-sided adhesive during processing, preventing contamination or damage before use and ensuring its adhesive properties; secondly, it facilitates easy separation from the double-sided adhesive during subsequent removal, without hindering the adhesive or the entire processing, thus improving processing efficiency and product quality.

[0035] In one specific implementation, combined with Figures 4-5 As shown, the die-cutting method for boron nitride includes the following steps: Step S1: After laminating the single-sided adhesive insulating film with the support film, roll it up to obtain a composite film; Step S2: Lay boron nitride onto a low-viscosity protective film, then use a die-cutting machine to die-cut the shape, and then use a waste removal machine to remove excess waste to obtain the first intermediate product. Step S3: The composite film is attached to the upper surface of the first intermediate product to obtain the second intermediate product, wherein the adhesive side of the insulating film in the composite film faces the boron nitride in the first intermediate product. Step S4: Remove the protective film from the second intermediate product, re-attach the double-sided tape, and obtain the third intermediate product; Step S5: Flip the third intermediate product over and use a die-cutting machine to die-cut the third intermediate product into shape, so that the composite film and double-sided adhesive in the third intermediate product form a closed edge structure, and the boron nitride is wrapped in the closed edge structure. Step S6: Use a waste removal machine to remove excess waste material outside the closed edge structure to obtain the product; Step S7: Transfer the product onto the carrier film; Step S8: Rewind the finished product.

[0036] In one embodiment, the carrier film is a release film that can be separated from the double-sided adhesive. The release film has a thickness of 0.075 mm, a basis weight of 1~5 g / 25 mm, and is transparent.

[0037] Since the bottom of the product is double-sided adhesive, a release film that can separate from the double-sided adhesive is selected as the carrier film. Release films come in various thicknesses, generally between 0.025mm and 0.12mm, such as 0.025mm, 0.05mm, 0.075mm, 0.1mm, and 0.12mm; the basis weight ranges from 1g to infinity g / 25mm. Common colors include transparent, red, and blue. This embodiment considers factors such as product size, the strength of the double-sided adhesive, and ease of use, selecting a 0.075mm thick release film (too thin and it's inconvenient to handle, and the texture is soft; too thick and it's not commonly used and not readily available, and the unit price is also high), with a basis weight of 1~5g / 25mm (too high a basis weight would make the product difficult to remove from the carrier film), and a transparent color. This allows inspectors to visually check for product defects. Other details regarding this embodiment are described above and will not be repeated here.

[0038] This embodiment adds a very thin insulating film with a thickness of 0.001~0.005mm to the upper surface of boron nitride. The outer dimensions of the insulating film on the upper surface of boron nitride and the double-sided adhesive on the lower surface are both greater than or equal to 0.8mm on each side compared to the outer dimensions of boron nitride, forming a closed edge structure with a single side ≥0.8mm, thus encapsulating the boron nitride. This structure retains the excellent high thermal conductivity, high insulation, high breakdown resistance, as well as the low dielectric constant, low dielectric loss, and low density characteristics of boron nitride itself, while avoiding the problem of powder falling off from the cross-section of the die-cutting edge of boron nitride during die-cutting and contaminating components.

[0039] In summary, the present invention provides a die-cutting method for boron nitride. This method adds an insulating film to the upper surface of the boron nitride, creating an edge-wrapping effect with the double-sided adhesive on the lower surface of the boron nitride. This effectively encapsulates the boron nitride, enhancing its toughness. While solving the problems of easy delamination and powder shedding of boron nitride, it also retains the excellent high thermal conductivity, high insulation, high breakdown resistance, as well as the low dielectric constant, low dielectric loss, and low density characteristics of boron nitride. It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A method for die-cutting boron nitride, characterized in that, Including the following steps: An insulating film is bonded to the upper surface of boron nitride, and double-sided adhesive is bonded to the lower surface of boron nitride. Boron nitride containing an insulating film and double-sided adhesive is die-cut into shape, so that the insulating film and the double-sided adhesive form a closed edge structure, and the boron nitride is wrapped in the closed edge structure.

2. The die-cutting method for boron nitride according to claim 1, characterized in that, The steps of bonding an insulating film to the upper surface of boron nitride and bonding double-sided adhesive to the lower surface of boron nitride specifically include: A composite film is obtained by laminating a single-sided adhesive insulating film with a support film and then winding it up. Boron nitride is bonded onto a protective film, and then the shape is die-cut and waste is removed sequentially to obtain the first intermediate product. The composite film is bonded to the upper surface of the first intermediate product to obtain a second intermediate product, wherein the adhesive side of the insulating film in the composite film faces the boron nitride in the first intermediate product. Remove the protective film from the second intermediate product and re-apply double-sided tape to obtain the third intermediate product.

3. The die-cutting method for boron nitride according to claim 2, characterized in that, The step of die-cutting boron nitride containing an insulating film and double-sided adhesive into a closed edge structure, and encapsulating the boron nitride within the closed edge structure, specifically includes: The third intermediate product is die-cut using a die-cutting machine to form a closed edge structure, thereby encapsulating the boron nitride in the closed edge structure. Excess waste material outside the closed edge structure is removed using a waste removal machine to obtain the product.

4. The die-cutting method for boron nitride according to claim 1, characterized in that, The die-cutting process includes the following steps: Step S1: After laminating the single-sided adhesive insulating film with the support film, roll it up to obtain a composite film; Step S2: Lay boron nitride onto the protective film, then use a die-cutting machine to die-cut the shape, and then use a waste removal machine to remove excess waste to obtain the first intermediate product; Step S3: The composite film is attached to the upper surface of the first intermediate product to obtain the second intermediate product, wherein the adhesive side of the insulating film in the composite film faces the boron nitride in the first intermediate product. Step S4: Remove the protective film from the second intermediate product, re-attach the double-sided tape, and obtain the third intermediate product; Step S5: Flip the third intermediate product over and use a die-cutting machine to die-cut the third intermediate product into shape, so that the composite film and double-sided adhesive in the third intermediate product form a closed edge structure, and the boron nitride is wrapped in the closed edge structure. Step S6: Use a waste removal machine to remove excess waste material outside the closed edge structure to obtain the product; Step S7: Transfer the product onto the carrier film; Step S8: Rewind the finished product.

5. The die-cutting method for boron nitride according to claim 1, 2, or 4, characterized in that, The dimensions of the insulating film and the double-sided adhesive are greater than or equal to 0.5 mm and less than or equal to 1.0 mm on each side compared to the dimensions of the boron nitride.

6. The die-cutting method for boron nitride according to claim 1, 2, or 4, characterized in that, The thickness of the insulating film is 0.001~0.005mm.

7. The die-cutting method for boron nitride according to claim 1, 2, or 4, characterized in that, The thickness of the double-sided adhesive is 0.005 mm.

8. The die-cutting method for boron nitride according to claim 2 or 4, characterized in that, The protective film is a PET protective film, which is red in color and has an adhesion of 5~10gf / 25mm.

9. The die-cutting method for boron nitride according to claim 1, characterized in that, The double-sided adhesive tape has a low-grammage release film with a thickness of 0.05 mm.

10. The die-cutting method for boron nitride according to claim 4, characterized in that, The carrier film is a release film that can be separated from the double-sided adhesive. The release film has a thickness of 0.075 mm, a basis weight of 1~5 g / 25 mm, and a transparent color.

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