A single crystal silicon wafer processing clamp

Abstract

The application discloses a single crystal silicon wafer processing clamp, and relates to the technical field of single crystal silicon processing, which comprises a mounting ring, a driving gear ring, a primary clamp assembly, a guide, a secondary clamp assembly and a driving unit. The mounting ring serves as a bearing base, the top of the mounting ring is provided with the driving gear ring, the inner ring is provided with the primary clamp assembly, the outer wall is fixedly connected with the guide, the guide is internally provided with the secondary clamp assembly, and the driving unit is internally provided with a built-in driving unit which is connected with the two-stage clamp through the mounting ring. For different thicknesses of silicon wafers, thin silicon wafers are clamped by the silicon wafer clamping plate through the driving motor one and the driving gear ring and the inclined push head; thick silicon wafers are clamped by the silicon wafer clamping arm after being centered by the driving motor two and the driving ring and the centering arm, and are clamped by the silicon wafer clamping arm. The clamp integrates the grading clamping and the precise guide structure, has the protection design, is high in adaptability, accurate in clamping, can avoid damage to the silicon wafer, is suitable for automatic processing, and improves the processing efficiency and the qualified rate.

Description

Technical Field

[0001] This invention relates to the field of monocrystalline silicon processing technology, specifically to a monocrystalline silicon wafer processing fixture. Background Technology

[0002] As a core substrate for industries such as semiconductors and photovoltaics, monocrystalline silicon wafers require precise positioning and stable clamping through fixtures during processing to ensure the processing accuracy of subsequent processes such as cutting, grinding, and coating.

[0003] Existing single-crystal silicon wafer processing fixtures are mainly divided into two categories: single mechanical clamping type and vacuum adsorption type. Mechanical clamping type mostly adopts a fixed clamping structure, which can only be adapted to silicon wafers of a specific thickness, with a narrow range of adaptability. Furthermore, improper control of clamping force can easily lead to chipping of silicon wafer edges and surface scratches. Although vacuum adsorption type can reduce mechanical damage, it has high requirements for the flatness of silicon wafers. When dealing with thicker silicon wafers, the adsorption stability is insufficient, and slippage is prone to occur. Moreover, it is difficult to achieve concentric centering and positioning.

[0004] Therefore, existing fixtures generally suffer from problems such as dispersed structure and uncoordinated drive. When switching to different specifications of silicon wafers, it is necessary to replace the fixture or adjust a large number of parameters, which is cumbersome and cannot meet the high-efficiency processing requirements of automated production lines.

[0005] Therefore, the present invention provides a single-crystal silicon wafer processing fixture to solve one or more of the above-mentioned problems. Summary of the Invention

[0006] (a) Technical problems to be solved

[0007] In view of the shortcomings of the prior art, the present invention provides a single crystal silicon wafer processing fixture to solve the problems mentioned in the background art.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, the present invention is implemented through the following technical solution, including an installation ring sleeve, a drive gear ring at the top of the installation ring sleeve, several sets of primary clamping assemblies installed around the inner ring of the drive gear ring, several sets of guide members fixed around the outer wall of the installation ring sleeve, and a secondary clamping assembly installed in each set of guide members. The secondary clamping assembly is driven by the drive unit installed in the installation ring sleeve to clamp the monocrystalline silicon wafer.

[0010] Preferably, a drive motor is installed inside the mounting ring, and the output shaft of the drive motor extends out of the top housing of the mounting ring and is fixedly sleeved with a drive gear. The drive gear meshes with the drive gear ring, and the inner wall of the drive gear ring extends toward the first-stage clamp assembly to form an inclined push head.

[0011] Preferably, the primary clamping assembly includes a primary clamping base, which is installed on the top of the mounting ring by several sets of bolts. The top of the primary clamping base is provided with a guide groove and two sets of clearance grooves, and the two sets of clearance grooves are symmetrically arranged on both sides of the guide groove. The bolts are installed in the clearance grooves.

[0012] Preferably, a limiting rod is fixedly disposed in a guide groove, a guide slider is movably sleeved on the outer wall of the limiting rod, and the guide slider is slidably connected to the inner wall of the guide groove. A reset spring is sleeved on the outer wall of the limiting rod, and both ends of the reset spring are fixedly connected to the inner wall of the guide groove and the guide slider, respectively.

[0013] Preferably, the bottom of the silicon wafer clamp is fixedly connected to the guide slider and slidably connected to the surface of the primary clamp base. The silicon wafer clamp extends towards the outer wall of the inner ring of the drive gear ring to form an arc-shaped protrusion. The arc-shaped protrusion abuts against the inclined push head. Two sets of vacuum suction cup bases are symmetrically fixed on the top of the silicon wafer clamp, and the top of the vacuum suction cup base is provided with several sets of adsorption holes.

[0014] Preferably, the drive unit includes a second drive motor, which is fixedly disposed at the bottom center of the inner wall of the mounting ring, and the drive ring is fixedly sleeved on the outer wall of the output shaft of the second drive motor. A first fixing plate is installed at the top center of the inner wall of the mounting ring through a first fixing rod, and a second clearance groove is provided at the connection between the mounting ring and the guide member.

[0015] Preferably, a limiting groove is provided on the guide member, one end of the limiting rod is fixedly connected to the inner wall of the limiting groove, the other end of the limiting rod extends into the mounting ring and is fixedly connected to the fixing plate, the guide slider is movably disposed in the limiting groove, and the guide slider is slidably sleeved on the outer wall of the limiting rod, one end of the first connecting rod is rotatably connected to the bottom of the guide slider, and the other end of the first connecting rod passes through the clearance groove and extends into the mounting ring and is rotatably connected to the drive ring.

[0016] Preferably, the secondary clamping assembly includes a support frame, which is connected to the guide slider two via a fixed rod two. The fixed rod two is symmetrically provided with a drive shaft one and a drive shaft two on both sides. The bottom of the drive shaft one and the drive shaft two are rotatably connected to the top of the guide slider two. The tops of the drive shaft one and the drive shaft two extend movably into the support frame, and the outer walls of the extended ends are respectively fixedly sleeved with drive gear three and drive gear two.

[0017] Preferably, the same centering arm is fixedly sleeved on the outer wall of each set of drive shafts, and a centering roller is movably installed at the end of the centering arm. The same silicon wafer arm is fixedly sleeved on the outer wall of each set of drive shafts, and two sets of clearance grooves are provided on the silicon wafer arm. An elastic pressure strip is provided in the clearance groove three near the end of the silicon wafer arm.

[0018] Preferably, the fixed end of the electric actuator is fixedly connected to the outer wall of the support frame, and the output end of the electric actuator is fixedly connected to the second fixed plate. The top of the second fixed plate is fixedly provided with a U-shaped drive component, and two sets of drive racks are symmetrically fixed at both ends of the U-shaped head of the U-shaped drive component. Each set of drive racks extends movably into the support frame and meshes with the second drive gear and the third drive gear.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] 1. Strong adaptability, covering multiple specifications of silicon wafers: Through the hierarchical design of "primary clamping assembly + secondary clamping assembly", it can be specifically adapted to thinner (such as monocrystalline silicon wafer 1 P1) and thicker (such as monocrystalline silicon wafer 2 P2) monocrystalline silicon wafers, solving the limitation of traditional clamps that can only clamp silicon wafers of a single thickness and expanding the applicability of the clamps.

[0021] 2. Integrated structure and high stability: The drive unit is built into the dry mounting ring 1, and the various clamping components are modularly arranged around the mounting ring 1. This reduces the external space occupation and ensures the precise movement trajectory of each component during clamping through the limiting effect of the guide 8 that bears the unified load of the mounting ring 1, thus avoiding clamping deviation caused by loose structure.

[0022] 3. Protect silicon wafers and reduce damage risk: The overall architecture provides the basis for the "anti-scratch and anti-displacement" design in subsequent embodiments 2 and 3. The reset spring 14 and cover structure of the primary clamping assembly, and the centering roller 34 and elastic pressure strip 32 of the secondary clamping assembly are all assembled based on the architecture of embodiment 1, which avoids problems such as scratches on the outer wall of the silicon wafer and edge cracks during clamping from the source.

[0023] 4. Easy to operate and adaptable to automated processing: The drive unit centrally controls two types of clamping components, which can switch between clamping silicon wafers of different thicknesses without changing the clamps. Combined with the loading and unloading process of the robotic arm, it can be quickly integrated into the automated processing production line to improve processing efficiency. At the same time, the modular design facilitates subsequent maintenance and component replacement, reducing the cost of use.

[0024] 5. Precise clamping ensures processing accuracy: Through the meshing transmission between the drive gear ring 2 and the first-level clamping assembly, and the linkage between the drive ring 21 and the second-level clamping assembly, multiple clamping components are ensured to move synchronously, achieving concentric clamping of the silicon wafer. This provides a precise positioning basis for subsequent cutting, grinding and other processing steps, improving the processing qualification rate of monocrystalline silicon wafers. Attached Figure Description

[0025] Figure 1 This is a top view of the structure of the present invention. Figure 1 ;

[0026] Figure 2 This is a schematic diagram of the structure of the primary clamping assembly of the present invention;

[0027] Figure 3 This is a top view of the structure of the present invention. Figure 2 ;

[0028] Figure 4 This is a schematic diagram of the drive unit structure of the present invention;

[0029] Figure 5 This is a schematic diagram of the secondary clamping assembly of the present invention. Figure 1 ;

[0030] Figure 6 This is a schematic diagram of the secondary clamping assembly of the present invention. Figure 2 ;

[0031] Figure 7 This is a schematic diagram illustrating the operating principle of the primary clamping assembly of the present invention;

[0032] Figure 8 This is a schematic diagram illustrating the working principle of the secondary clamping assembly of the present invention;

[0033] Figure 9 This is intended to illustrate the thickness grading of silicon wafers.

[0034] In the diagram: 1. Mounting ring; 2. Drive gear ring; 3. Inclined push head; 4. Drive gear one; 5. Drive motor one; 6. Primary clamp assembly; 7. Secondary clamp assembly; 8. Guide component; 9. Primary clamp base; 10. Guide groove one; 11. Clearance groove one; 12. Bolt; 13. Limiting rod one; 14. Return spring; 15. Guide slider one; 16. Silicon wafer clamp; 17. Arc-shaped protrusion; 18. Vacuum suction cup base; 19. Adsorption hole; 20. Drive motor two; 21. Drive ring; 22. Limiting rod two; 23. Limiting... 24. Guide slider II; 25. First connecting rod; 26. Clearance groove II; 27. Support frame; 28. Drive shaft I; 29. ​​Drive shaft II; 30. Silicon wafer retainer arm; 31. Clearance groove III; 32. Elastic pressure bar; 33. Centering retainer arm; 34. Centering roller; 35. U-shaped drive component; 36. Fixing plate II; 37. Drive rack; 38. Electric actuator; 39. Drive gear II; 40. Drive gear III; 41. Fixing plate I; 42. Fixing rod I; 43. Fixing rod II; P1. Monocrystalline silicon wafer I; P2. Monocrystalline silicon wafer II. Detailed Implementation

[0035] In this invention, the terms "first," "second," etc., are used for descriptive purposes only and do not specifically refer to any order or sequence, nor are they intended to limit the invention. They are merely used to distinguish protective components or operations described using the same technical terms, and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Furthermore, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0036] Example 1: Please refer to Figure 1 The present invention provides a technical means including an installation ring sleeve 1, a drive toothed ring 2 at the top of the installation ring sleeve 1, a number of primary clamping assemblies 6 installed around the inner ring of the drive toothed ring 2, and a number of guide members 8 fixed around the outer wall of the installation ring sleeve 1. Each guide member 8 is equipped with a secondary clamping assembly 7. The secondary clamping assembly 7 is driven by the drive unit installed in the installation ring sleeve 1 to clamp the monocrystalline silicon wafer.

[0037] The working principle of the above scheme is as follows: by constructing an integrated framework of "hierarchical clamping + unified drive", a structural foundation is provided for the precise clamping of monocrystalline silicon wafers of different thicknesses. Its core logic is: the mounting ring 1 serves as the overall load-bearing base, and the drive gear ring 2, the first-level clamping assembly 6, the guide 8, and the second-level clamping assembly 7 are modularly assembled. The drive unit (including core components such as drive motor 1 5 and drive motor 2 20) is built into the mounting ring 1 to achieve centralized power output and coordinated control.

[0038] When clamping and processing monocrystalline silicon wafers is required, the actual thickness of the wafer can be used as a reference. Figure 9 (Based on the thickness standard shown), select to activate either the primary clamping assembly 6 or the secondary clamping assembly 7. For thinner monocrystalline silicon wafers, the drive motor 5 in the drive unit drives the gear ring 2, which in turn drives the primary clamping assembly 6 to complete the clamping. For thicker monocrystalline silicon wafers, the drive motor 20 in the drive unit drives the drive ring 21, which, in conjunction with the guiding and limiting function of the guide component 8, drives the secondary clamping assembly 7 to complete the integrated centering and clamping operation. In the entire architecture, the drive gear ring 2 provides circumferential driving power for the primary clamping assembly 6, and the guide component 8 provides radial movement guidance for the secondary clamping assembly 7. This ensures that the two types of clamping assemblies work independently under the control of the drive unit without interfering with each other, achieving adaptable clamping for monocrystalline silicon wafers of different specifications.

[0039] The beneficial effects of the above scheme are as follows:

[0040] 1. Strong adaptability, covering multiple specifications of silicon wafers: Through the hierarchical design of "primary clamping assembly + secondary clamping assembly", it can be specifically adapted to thinner (such as monocrystalline silicon wafer 1 P1) and thicker (such as monocrystalline silicon wafer 2 P2) monocrystalline silicon wafers, solving the limitation of traditional clamps that can only clamp silicon wafers of a single thickness and expanding the applicability of the clamps.

[0041] 2. Integrated structure and high stability: The drive unit is built into the dry mounting ring 1, and the various clamping components are modularly arranged around the mounting ring 1. This reduces the external space occupation and ensures the precise movement trajectory of each component during clamping through the limiting effect of the guide 8 that bears the unified load of the mounting ring 1, thus avoiding clamping deviation caused by loose structure.

[0042] 3. Protect silicon wafers and reduce damage risk: The overall architecture provides the basis for the "anti-scratch and anti-displacement" design in subsequent embodiments 2 and 3. The reset spring 14 and cover structure of the primary clamping assembly, and the centering roller 34 and elastic pressure strip 32 of the secondary clamping assembly are all assembled based on the architecture of embodiment 1, which avoids problems such as scratches on the outer wall of the silicon wafer and edge cracks during clamping from the source.

[0043] 4. Easy to operate and adaptable to automated processing: The drive unit centrally controls two types of clamping components, which can switch between clamping silicon wafers of different thicknesses without changing the clamps. Combined with the loading and unloading process of the robotic arm, it can be quickly integrated into the automated processing production line to improve processing efficiency. At the same time, the modular design facilitates subsequent maintenance and component replacement, reducing the cost of use.

[0044] 5. Precise clamping ensures processing accuracy: Through the meshing transmission between the drive gear ring 2 and the first-level clamping assembly, and the linkage between the drive ring 21 and the second-level clamping assembly, multiple clamping components are ensured to move synchronously, achieving concentric clamping of the silicon wafer. This provides a precise positioning basis for subsequent cutting, grinding and other processing steps, improving the processing qualification rate of monocrystalline silicon wafers.

[0045] Example 2: Based on Example 1, please refer to... Figure 1 , Figure 2 , Figure 3 , Figure 7 as well as Figure 9 The primary clamping assembly 6 includes a primary clamping base 9, which is installed on the top of the mounting ring 1 by several sets of bolts 12. The top of the primary clamping base 9 is provided with a guide groove 10 and two sets of clearance grooves 11, and the two sets of clearance grooves 11 are symmetrically arranged on both sides of the guide groove 10. The bolts 12 are installed in the clearance grooves 11.

[0046] Furthermore, the limiting rod 13 is fixedly installed inside the guide groove 10, the guide slider 15 is movably sleeved on the outer wall of the limiting rod 13, and the guide slider 15 is slidably connected to the inner wall of the guide groove 10. The reset spring 14 is sleeved on the outer wall of the limiting rod 13, and both ends of the reset spring 14 are fixedly connected to the inner wall of the guide groove 10 and the guide slider 15, respectively.

[0047] Furthermore, the bottom of the silicon wafer clamp 16 is fixedly connected to the guide slider 15 and slidably connected to the surface of the primary clamp base 9. The silicon wafer clamp 16 extends towards the outer wall of the inner ring of the drive gear ring 2 to form an arc-shaped protrusion 17. The arc-shaped protrusion 17 abuts against the inclined push head 3. Two sets of vacuum suction cup bases 18 are symmetrically fixed on the top of the silicon wafer clamp 16, and the top of the vacuum suction cup base 18 is provided with several sets of adsorption holes 19.

[0048] Furthermore, the drive motor 5 is installed inside the mounting ring 1, and the output shaft of the drive motor 5 extends out of the top housing of the mounting ring 1 and is fixedly sleeved with the drive gear 4. The drive gear 4 meshes with the drive gear ring 2, and the inner ring wall of the drive gear ring 2 extends toward the first-stage clamp assembly 6 to form the inclined push head 3.

[0049] Preferably, both the guide groove 10 and the clearance groove 11 are provided with a cover at the top.

[0050] The working principle and beneficial effects of the above scheme are as follows: Due to the inconsistent thickness of monocrystalline silicon wafers, such as Figure 7 The image shows the application of thinner single-crystal silicon wafers (thickness standard reference). Figure 9 When clamping (as shown), the thinner monocrystalline silicon wafer P1 needs to be placed directly onto the annular surface formed by the tops of several sets of primary clamping bases 9 using a robotic arm. At this time, simply start the drive motor 5 to drive the drive gear 4 to rotate. The drive gear 4 drives the drive gear ring 2 to rotate. Since the inclined push head 3 set on the inner wall of the drive gear ring 2 will squeeze the arc-shaped protrusion 17, it will push the silicon wafer clamping plate 16 to move on the surface of the primary clamping base 9. At this time, the cooperation between the guide slider 15 and the limiting rod 13 plays a guiding and limiting role, preventing the silicon wafer clamping plate 16 from shifting and damaging the outer wall of the monocrystalline silicon wafer P1. Until the several sets of silicon wafer clamping plates 16 move to just abut against the outer wall of the monocrystalline silicon wafer P1, the monocrystalline silicon wafer P1 is clamped. Then, turn off the drive motor 5, and the monocrystalline silicon wafer can be operated on for the next step.

[0051] The top of both the guide groove 10 and the clearance groove 11 is equipped with a cover, and the cover is kept horizontal with the surface of the first-stage clamp base 9 after installation to avoid scratching the monocrystalline silicon wafer and to prevent the internal components from being exposed. When it is necessary to release the monocrystalline silicon wafer P1, simply start the drive motor 5 to drive the drive gear 4 to reverse, and the inclined push head 3 will no longer squeeze the arc protrusion 17. Then, under the action of the reset spring 14, the silicon wafer clamp 16 will be reset.

[0052] Example 3: Based on any one of Examples 1-2, please refer to... Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 as well as Figure 9 The drive unit includes a second drive motor 20, which is fixedly located at the bottom center of the inner wall of the mounting ring 1, and the drive ring 21 is fixedly sleeved on the outer wall of the output shaft of the second drive motor 20. The first fixing plate 41 is installed at the top center of the inner wall of the mounting ring 1 through the first fixing rod 42. The mounting ring 1 and the guide member 8 are provided with a relief groove 26.

[0053] Furthermore, a limiting groove 23 is provided on the guide member 8, one end of the limiting rod 22 is fixedly connected to the inner wall of the limiting groove 23, and the other end of the limiting rod 22 extends into the mounting ring 1 and is fixedly connected to the fixing plate 41. The guide slider 24 is movably disposed in the limiting groove 23, and the guide slider 24 is slidably sleeved on the outer wall of the limiting rod 22. One end of the first connecting rod 25 is rotatably connected to the bottom of the guide slider 24, and the other end of the first connecting rod 25 passes through the clearance groove 26 and extends into the mounting ring 1 to be rotatably connected to the drive ring 21.

[0054] Furthermore, the secondary clamping assembly 7 includes a support frame 27, which is connected to the guide slider 24 via a fixing rod 23. A drive shaft 1 28 and a drive shaft 29 are symmetrically arranged on both sides of the fixing rod 23. The bottoms of drive shaft 1 28 and drive shaft 29 are rotatably connected to the top of the guide slider 24. The tops of drive shaft 1 28 and drive shaft 29 extend movably into the support frame 27, and drive gear 30 and drive gear 2 39 are respectively fixedly sleeved on the outer walls of their extended ends. Furthermore, the outer walls of each set of drive shaft 1 28 are fixedly sleeved with the same centering arm 33, and a centering roller 34 is movably installed at the end of the centering arm 33. The outer walls of each set of drive shaft 2 29 are fixedly sleeved with the same silicon wafer arm 30, and two sets of clearance grooves 31 are provided on the silicon wafer arm 30. An elastic pressure strip 32 is provided in the clearance groove 31 near the end of the silicon wafer arm 30.

[0055] Furthermore, the fixed end of the electric actuator 38 is fixedly connected to the outer wall of the support frame 27, and the output end of the electric actuator 38 is fixedly connected to the second fixed plate 36. The top of the second fixed plate 36 is fixedly provided with a U-shaped drive component 35, and two sets of drive racks 37 are symmetrically fixed at both ends of the U-shaped head of the U-shaped drive component 35. Each set of drive racks 37 extends movably into the support frame 27 and meshes with the second drive gear 39 and the third drive gear 40.

[0056] Preferably, a vacuum generator is installed inside the vacuum suction cup base 18 for use with the suction hole 19.

[0057] Preferably, the drive ring 21 has a bottom plate and an opening at the top.

[0058] The working principle and beneficial effects of the above scheme are as follows: Due to the inconsistent thickness of monocrystalline silicon wafers, such as Figure 8 The image shows the thickness of a single-crystal silicon wafer (thickness standard reference). Figure 9 When clamping (as shown), the thicker monocrystalline silicon wafer 2P2 needs to be placed directly onto the top of several sets of vacuum suction cup bases 18 using a robotic arm. The vacuum generator inside is then activated to suction the monocrystalline silicon wafer 2P2 through the suction holes 19, preventing it from falling. Subsequently, the drive motor 20 is activated, causing the drive ring 21 to rotate. As the drive ring 21 rotates, it pulls the first connecting rod 25 connected to it, causing it to deflect within the clearance groove 26. This causes the guide slider 24 to move along the limiting rod 22 towards the drive ring 21. This continues until the guide slider 24, with its top centering arm 33, contacts the outer wall of the monocrystalline silicon wafer 2P2. At this point, the suction holes 19 no longer suction the monocrystalline silicon wafer 2P2, and the multiple sets of centering rollers 34 can push the monocrystalline silicon wafer 2P2 without damage until its center coincides with the center of the mounting ring 1. Then, the drive motor 20 is turned off. Simultaneously, the electric actuator 38 is activated. The electric actuator 38 drives the U-shaped drive component 35 to move through the fixed plate 2 36, thereby enabling the drive rack 37 to drive the drive gear 2 39 and the drive gear 3 40 to rotate synchronously in opposite directions. At this time, the drive gear 3 40 drives the centering arm 33 to move away from the outer wall of the monocrystalline silicon wafer 2 P2 through the drive shaft 1 28, while the drive gear 2 39 drives the silicon wafer arm 30 to move closer to the outer wall of the monocrystalline silicon wafer 2 P2 through the drive shaft 2 29. The setting of the clearance groove 3 31 can provide clearance space for the reverse rotation of the centering arm 33, avoiding interference between the silicon wafer arm 30 and the centering arm 33 during the movement. Until the multiple sets of silicon wafer arms 30 clamp the monocrystalline silicon wafer 2 P2, the elastic pressure strip 32 plays an auxiliary fixing role. In the above way, the monocrystalline silicon wafer 1 P1 is clamped, and the next operation of the monocrystalline silicon wafer can be carried out.

[0059] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A single-crystal silicon wafer processing fixture, characterized in that, The device includes a mounting ring (1), a drive toothed ring (2) on the top of the mounting ring (1), several sets of primary clamping assemblies (6) are installed around the inner ring of the drive toothed ring (2), and several sets of guide members (8) are fixed around the outer wall of the mounting ring (1). Each set of guide members (8) is equipped with a secondary clamping assembly (7). The secondary clamping assembly (7) is driven by the drive unit installed in the mounting ring (1) to clamp the single crystal silicon wafer. The drive unit includes a second drive motor (20), which is fixedly located at the bottom center of the inner wall of the mounting ring (1), and the drive ring (21) is fixedly sleeved on the outer wall of the output shaft of the second drive motor (20). The first fixing plate (41) is installed at the top center of the inner wall of the mounting ring (1) through the first fixing rod (42). The second clearance groove (26) is provided at the connection between the mounting ring (1) and the guide (8). A limiting groove (23) is provided on the guide (8). One end of the limiting rod (22) is fixedly connected to the inner wall of the limiting groove (23). The other end of the limiting rod (22) extends into the mounting ring (1) and is fixedly connected to the fixing plate (41). The guide slider (24) is movably disposed in the limiting groove (23) and slides on the outer wall of the limiting rod (22). One end of the first connecting rod (25) is rotatably connected to the bottom of the guide slider (24). The other end of the first connecting rod (25) passes through the clearance groove (26) and extends into the mounting ring (1) to be rotatably connected to the drive ring (21). The secondary clamp assembly (7) includes a support frame (27), which is connected to the guide slider (24) via a fixed rod (43). The fixed rod (43) is symmetrically provided with a drive shaft (28) and a drive shaft (29) on both sides. The bottom of the drive shaft (28) and the drive shaft (29) are rotatably connected to the top of the guide slider (24). The tops of the drive shaft (28) and the drive shaft (29) extend into the support frame (27), and the outer walls of the extended ends are respectively fixedly sleeved with a drive gear (40) and a drive gear (39). Each set of drive shaft one (28) has the same centering arm (33) fixedly sleeved on its outer wall, and the centering arm (33) has a centering roller (34) movably installed at its end. Each set of drive shaft two (29) has the same silicon wafer arm (30) fixedly sleeved on its outer wall, and the silicon wafer arm (30) has two sets of clearance grooves three (31) opened on its surface. The clearance groove three (31) near the end of the silicon wafer arm (30) is provided with an elastic pressure strip (32). The fixed end of the electric actuator (38) is fixedly connected to the outer wall of the support frame (27), and the output end of the electric actuator (38) is fixedly connected to the second fixed plate (36). The top of the second fixed plate (36) is fixedly provided with a U-shaped drive component (35), and two sets of drive racks (37) are symmetrically fixed at both ends of the U-shaped head of the U-shaped drive component (35). Each set of drive racks (37) extends movably into the support frame (27) and meshes with the second drive gear (39) and the third drive gear (40).

2. The single-crystal silicon wafer processing fixture according to claim 1, characterized in that, The drive motor (5) is installed inside the mounting ring (1), and the output shaft of the drive motor (5) extends out of the top housing of the mounting ring (1) and is fixedly fitted with the drive gear (4). The drive gear (4) meshes with the drive gear ring (2), and the inner wall of the drive gear ring (2) extends toward the first-stage clamp assembly (6) to form an inclined push head (3).

3. A single-crystal silicon wafer processing fixture according to claim 2, characterized in that, The primary clamp assembly (6) includes a primary clamp base (9), which is installed on the top of the mounting ring (1) by several sets of bolts (12). The primary clamp base (9) has a guide groove (10) and two sets of clearance grooves (11) on its top, and the two sets of clearance grooves (11) are symmetrically arranged on both sides of the guide groove (10). The bolts (12) are installed in the clearance grooves (11).

4. A single-crystal silicon wafer processing fixture according to claim 3, characterized in that, The limiting rod (13) is fixedly installed in the guide groove (10). The guide slider (15) is movably sleeved on the outer wall of the limiting rod (13), and the guide slider (15) is slidably connected to the inner wall of the guide groove (10). The reset spring (14) is sleeved on the outer wall of the limiting rod (13), and the two ends of the reset spring (14) are fixedly connected to the inner wall of the guide groove (10) and the guide slider (15) respectively.

5. A single-crystal silicon wafer processing fixture according to claim 4, characterized in that, The bottom of the silicon wafer clamp (16) is fixedly connected to the guide slider (15) and slidably connected to the surface of the first-stage clamp base (9). The silicon wafer clamp (16) extends towards the outer wall of the inner ring of the drive gear ring (2) to form an arc-shaped protrusion (17). The arc-shaped protrusion (17) abuts against the inclined push head (3). Two sets of vacuum suction cup bases (18) are symmetrically fixed on the top of the silicon wafer clamp (16), and several sets of suction holes (19) are provided on the top of the vacuum suction cup bases (18).

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