A semiconductor ingot rotation automatic positioning device

Abstract

The embodiment of the application provides a kind of based on semiconductor crystal ingot rotation automated positioning device, it is related to semiconductor crystal ingot processing equipment technical field, it includes frame, frame both sides are equipped with first linear guide and second linear guide, first linear guide and second linear guide are slidably provided with first platform, first platform is equipped with first driving part, first platform is rotatably provided with second platform, damping mechanism is equipped between second platform and first platform, first platform is also equipped with second driving part, second platform is equipped with fixed mechanism and bracket, bracket is set in second platform middle, fixed mechanism includes clamping assembly and locking assembly, first platform is equipped with laser displacement sensor and three first proximity switch near second platform rotation, second proximity switch is equipped in bracket middle.The application has the effect of improving positioning accuracy and reducing crystal ingot damage rate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor ingot processing equipment technology, and in particular to an automated positioning device based on semiconductor ingot rotation. Background Technology

[0002] In the processing of semiconductor ingots (such as single-crystal silicon ingots, sapphire ingots, etc.), precise positioning of the ingots is required to ensure the accuracy of subsequent cutting, grinding, and other processes. Existing ingot positioning devices mostly employ purely mechanical structures, achieving positioning through guide rail sliding, a rotating platform, and cylinder clamping. However, these devices have the following drawbacks: First, positioning accuracy depends on mechanical tolerances, making it difficult to achieve micron-level precision positioning; second, they lack a real-time detection and feedback mechanism, making it impossible to dynamically correct ingot offsets during rotation or sliding; and third, the ingot base is prone to damage due to rigid contact during clamping, and platform vibration can easily cause positioning drift.

[0003] To address the aforementioned issues, automated positioning devices for semiconductor ingots urgently need to solve the problems of low positioning accuracy and easy damage to ingots. Summary of the Invention

[0004] To address the issues of low positioning accuracy and easy damage to semiconductor ingots in existing semiconductor ingot positioning devices, this application provides an automated positioning device based on semiconductor ingot rotation.

[0005] The technical solution provided in this application for an automated positioning device based on semiconductor ingot rotation is as follows:

[0006] An automated positioning device for rotating semiconductor ingots includes a frame. A first linear guide rail and a second linear guide rail are arranged parallel to each other vertically on both sides of the frame. A first platform is slidably mounted on the first and second linear guide rails. A first driving component is provided on the first platform to drive the first platform to slide on the first and second linear guide rails. A second platform is rotatably mounted on the first platform. A second driving component is also provided on the first platform to drive the second platform to rotate. A shock-absorbing mechanism is provided between the second and first platforms. The second platform has a fixing mechanism for fixing an ingot base and a bracket for placing the ingot base. The bracket is located in the middle of the second platform. The fixing mechanism includes a clamping component and a locking component. A laser displacement sensor and three first proximity switches are provided on the first platform near the rotation point of the second platform. An L-shaped bracket is provided on the second platform to cooperate with the three first proximity switches for angle positioning. A second proximity switch is located in the middle of the bracket. A controller is also provided on the frame. The controller is electrically connected to the first proximity switch, the laser displacement sensor, the second proximity switch, the first driving component, and the second driving component.

[0007] Optionally, the clamping assembly includes a third linear guide rail and a fourth linear guide rail arranged parallel to each other at the bottom of the second platform. A first support portion and a second support portion are slidably disposed on the third linear guide rail and the fourth linear guide rail. The first support portion and the second support portion are respectively located on both sides of the bracket. A cavity is opened on the second platform to facilitate the sliding of the first support portion and the second support portion. The first support portion and the second support portion extend from the bottom of the second platform through the cavity to the top of the second platform. A first cylinder and a second cylinder are provided on the second platform. The first cylinder and the second cylinder are respectively located on one side of the first support portion and the second support portion. The first cylinder and the second cylinder are respectively fixedly connected to the first support portion and the second support portion.

[0008] Optionally, the locking assembly includes a third cylinder and a fourth cylinder disposed at the bottom of the second platform. The third cylinder and the fourth cylinder are arranged vertically upward. The first support and the second support are provided with square holes at the top of the second platform to facilitate the piston rods of the third cylinder and the fourth cylinder to rise and enter the corresponding square holes, thereby locking the first support and the second support.

[0009] Optionally, the piston rod heads of the third and fourth cylinders are provided with a first oblique surface, the first oblique surface facing the bracket, the square hole is smaller than the maximum diameter of the piston rods of the third and fourth cylinders, the square hole facing the first oblique surface is provided with a square hole oblique surface parallel to the first oblique surface, the lower part of the ingot base is provided with a second oblique surface, and the first support part and the second support part facing the bracket are both provided with support part oblique surfaces parallel to the second oblique surface.

[0010] Optionally, the first driving component includes a first motor, a rack on one side of the frame, and a gear at the output end of the first motor, the gear meshing with the rack.

[0011] Optionally, the second drive component includes a second motor, which is connected to the second platform.

[0012] Optionally, an elastic buffer layer is provided on the inclined surface of the support portion.

[0013] Optionally, the damping mechanism includes an annular damping pad and uniformly distributed damping springs. The annular damping pad is sleeved on the outside of the output shaft of the second drive member, and the damping springs are located at the edge of the bottom of the second platform.

[0014] In summary, this application includes at least one of the following beneficial technical effects:

[0015] The radial runout of the crystal ingot is detected by a laser displacement sensor, and the rotation angle of the second platform is accurately positioned by three first proximity switches. The shock absorption mechanism reduces vibration interference during platform rotation and sliding, further improving positioning accuracy. The controller dynamically adjusts the position of the first platform and the rotation angle of the second platform to achieve micron-level positioning. The beveled surface of the fixing mechanism and the design of the locking components prevent the crystal ingot base from shifting and disengaging during rotation. The elastic buffer layer improves clamping stability. Full closed-loop automatic control reduces manual intervention and improves positioning efficiency and consistency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of the first platform and the second platform of the present invention;

[0018] Figure 3 This is a schematic diagram of the second platform structure of the present invention;

[0019] Figure 4 This is a schematic diagram of the bottom structure of the second platform of the present invention;

[0020] Figure 5 This is a cross-sectional schematic diagram of the second platform of the present invention.

[0021] Explanation of reference numerals in the attached drawings: 1. Frame; 11. First linear guide rail; 12. Second linear guide rail; 2. First platform; 21. First motor; 22. Rack; 23. Gear; 24. Second motor; 3. Second platform; 31. Fixing mechanism; 32. Bracket; 331. Third linear guide rail; 332. Fourth linear guide rail; 341. First support part; 342. Second support part; 343. Cavity; 351. First cylinder; 352. Second cylinder; 353. Third cylinder; 354. Fourth cylinder; 355. Piston rod; 356. First beveled surface; 357. Square hole; 4. Ingot; 41. Ingot base; 411. Second beveled surface; 5. Laser displacement sensor; 61. First proximity switch; 62. Second proximity switch. Detailed Implementation

[0022] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” and “one or more” refer to one, two, or more than two. The term “and / or” is used to describe the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can indicate: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character “ / ” generally indicates that the preceding and following related objects are in an “or” relationship.

[0023] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0024] The following is in conjunction with the appendix Figure 1-5 The present invention will be described in further detail below.

[0025] This application discloses an automated positioning device based on semiconductor ingot rotation, referring to... Figure 1 and Figure 2The system includes a frame 1, with a first linear guide rail 11 and a second linear guide rail 12 arranged parallel to each other on both sides in the vertical direction. A first platform 2 is slidably mounted on the first linear guide rail 11 and the second linear guide rail 12. The first platform 2 is equipped with a first driving component that drives the first platform to slide on the first linear guide rail 11 and the second linear guide rail. The first driving component includes a first motor 21. A rack 22 is provided on one side of the frame 1. A gear 23 is provided at the output end of the first motor 21. The gear 23 meshes with the rack 22, and the first platform 2 slides vertically along the guide rails through gear and rack transmission. A second platform 3 is rotatably mounted on the first platform 2. The first platform 2 is also equipped with a second driving component that drives the second platform to rotate. The second driving component includes a second motor 24. The second motor 24 is connected to the second platform 3 and drives the second platform 3 to rotate around the central axis. The second platform 3 is equipped with a fixing device for fixing the ingot base 41. The system includes a positioning mechanism 31 and a bracket 32 ​​for placing the ingot base 41. The ingot base 41 is equipped with an ingot 4. A laser displacement sensor 5 and three first proximity switches 61 are installed on the first platform 2 near the rotation point of the second platform 3. The bottom of the second platform 3 is equipped with L-shaped supports evenly distributed around the circumference. When the second platform 3 rotates, the L-shaped supports trigger different first proximity switches 61 to achieve precise positioning of the rotation angle, such as 0°, 120°, and 240°. The laser displacement sensor 5 faces the side of the ingot 4 and is used to detect the radial runout of the ingot 4 in real time. A shock-absorbing mechanism is provided between the second platform 3 and the second driving component. The shock-absorbing mechanism includes an annular shock-absorbing pad and evenly distributed shock-absorbing springs. The annular shock-absorbing pad is sleeved on the outside of the output shaft of the second driving component, and the shock-absorbing springs are located at the edge of the bottom of the second platform. The shock-absorbing mechanism reduces vibration interference during the rotation and sliding of the second platform.

[0026] Reference Figure 3 and Figure 4The bracket 32 ​​is positioned in the middle of the second platform 3, and a second proximity switch 62 is embedded in the center of its top to detect whether the ingot base 41 is in place. The fixing mechanism 31 includes a third linear guide rail 331 and a fourth linear guide rail 332 arranged parallel to each other at the bottom of the second platform 3. A first support part 341 and a second support part 342 are slidably arranged on the third linear guide rail 331 and the fourth linear guide rail 332. The first support part 341 and the second support part 342 are located on both sides of the bracket 32. A cavity 343 is opened on the second platform 3 to facilitate the sliding of the first support part 341 and the second support part 342. The first support part 341 and the second support part 342 extend from the bottom of the second platform 3 through the cavity 343 to the top of the second platform 3. A first cylinder 351 and a second cylinder 351 are provided on the second platform 3. Cylinder 352, first cylinder 351 and second cylinder 352 are respectively located on one side of first support part 341 and second support part 342. First cylinder 351 and second cylinder 352 are respectively fixedly connected to first support part 341 and second support part 342, and are used to push first support part 341 and second support part 342 closer to and away from the middle bracket 32 ​​respectively. Third cylinder 353 and fourth cylinder 354 are also provided at the bottom of the second platform. Third cylinder 353 and fourth cylinder 354 are arranged vertically upward. The first support part 341 and second support part 342 are provided with square holes 357 at the top of the second platform 3, so that the piston rods of third cylinder 353 and fourth cylinder 354 can rise and enter the corresponding square holes 357 to lock the first support part 341 and second support part 342.

[0027] Reference Figure 5 The piston rods 355 of the third cylinder 353 and the fourth cylinder 354 both have a first oblique surface 356 at their heads. The first oblique surface 356 faces the bracket 32. The square hole 357 is smaller than the maximum diameter of the piston rods 355 of the third cylinder 353 and the fourth cylinder 354. The square hole 357 facing the first oblique surface 356 has a square hole bevel parallel to the first oblique surface 356. When the ingot base 41 is clamped, the piston rod 355 rises, and the first oblique surface 356 fits tightly with the square hole bevel, realizing the first... The locking of the first support part 341 and the second support part 342, the lower part of the crystal ingot base 41 is provided with a second oblique surface 411, and the first support part 341 and the second support part 342 are both provided with support part oblique surfaces parallel to the second oblique surface 411 on the side facing the bracket 32, which further improves the clamping stability and prevents the crystal ingot base 41 from deviating and dislodging when rotating. The support part oblique surface is provided with an elastic buffer layer, which can be silicone. The elastic buffer layer can avoid damage caused by rigid contact between the metal support part and the crystal ingot base 41.

[0028] The device also includes a controller, which is electrically connected to a first proximity switch 61, a laser displacement sensor 5, a second proximity switch 62, a first motor 21, and a second motor 24. During operation, the ingot base 41 is placed on the bracket 32. After the first proximity switch 8 detects the signal, it feeds back to the controller. The controller starts the first cylinder 351 and the second cylinder 352 to push the first support part 341 and the second support part 342 to clamp the ingot base 41. Then the third cylinder 353 and the fourth cylinder 354 are activated to lock the first support part 341 and the second support part 342. The laser displacement sensor 5 detects the radial runout of the ingot 4, the second proximity switch 62 positions the rotation angle of the second platform 3, and the controller adjusts the first motor 21 and the second motor 24 according to the detection data to achieve precise positioning of the ingot 4.

[0029] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. Any equivalent modifications or variations made by those skilled in the art based on the content disclosed in the present invention should be included within the scope of protection set forth in the claims.

Claims

1. An automated positioning device based on the rotation of semiconductor ingots, comprising a frame (1), wherein a first linear guide rail (11) and a second linear guide rail (12) are arranged parallel to each other in the vertical direction on both sides of the frame (1), a first platform (2) is slidably arranged on the first linear guide rail (11) and the second linear guide rail (12), a first driving member is provided on the first platform (2) to drive the first platform (2) to slide on the first linear guide rail (11) and the second linear guide rail (12), a second platform (3) is rotatably arranged on the first platform (2), and a second driving member is also provided on the first platform (2) to drive the second platform (3) to rotate, characterized in that: A shock-absorbing mechanism is provided between the second platform (3) and the second driving component. The shock-absorbing mechanism includes an annular shock-absorbing pad and uniformly distributed shock-absorbing springs. The annular shock-absorbing pad is sleeved on the outside of the output shaft of the second driving component. The shock-absorbing springs are located at the edge of the bottom of the second platform (3). The second platform (3) is provided with a fixing mechanism (31) for fixing the ingot base (41) and a bracket (32) for placing the ingot base (41). The bracket (32) is located in the middle of the second platform (3). The fixing mechanism (31) includes a clamping component and a locking component. The clamping component includes components that are slidably disposed on the second platform (3). 3) The second platform (3) is provided with a first support part (341) and a second support part (342). The second platform (3) is also provided with a first cylinder (351) and a second cylinder (352) that drive the first support part (341) and the second support part (342) respectively. The locking assembly includes a third cylinder (353) and a fourth cylinder (354) provided at the bottom of the second platform (3). The third cylinder (353) and the fourth cylinder (354) are arranged vertically upward. The piston rod (355) of the third cylinder (353) and the fourth cylinder (354) are both provided with a first oblique surface (356) at the head. The first support part (341) and the second support part (342) are provided with a first support part (341) and a second support part (342). 1) The second support part (342) is provided with a square hole (357) at the top of the second platform (3) so that the piston rod (355) of the third cylinder (353) and the fourth cylinder (354) can rise and enter the corresponding square hole (357) to lock the first support part (341) and the second support part (342). The bottom part of the crystal ingot base (41) is provided with a second oblique surface (411). The first support part (341) and the second support part (342) are both provided with a support part oblique surface parallel to the second oblique surface (411) on the side facing the bracket (32). The support part oblique surface is provided with an elastic buffer layer. The first platform (2) A laser displacement sensor (5) and three first proximity switches (61) are provided near the rotation of the second platform (3). An L-shaped bracket that cooperates with the three first proximity switches (61) is provided on the second platform (3) for angular positioning. A second proximity switch (62) is provided in the middle of the bracket (32). A controller is also provided on the frame (1). The controller is electrically connected to the first proximity switch (61), the laser displacement sensor (5), the second proximity switch (62), the first drive and the second drive respectively. The laser displacement sensor (5) is used to detect the radial runout of the ingot in real time and feed it back to the controller to adjust the drive.

2. The automated positioning device based on semiconductor ingot rotation according to claim 1, characterized in that: The clamping assembly also includes a third linear guide rail (331) and a fourth linear guide rail (332) arranged parallel to the bottom of the second platform (3). The first support part (341) and the second support part (342) are slidably arranged on the third linear guide rail (331) and the fourth linear guide rail (332). The first support part (341) and the second support part (342) are respectively located on both sides of the bracket (32). The second platform (3) has a cavity (343) to facilitate the sliding of the first support part (341) and the second support part (342). The first support part (341) and the second support part (342) extend from the bottom of the second platform (3) through the cavity (343) to the top of the second platform (3).

3. The automated positioning device based on semiconductor ingot rotation according to claim 2, characterized in that: The first beveled surface (356) faces the bracket (32). The square hole (357) is smaller than the maximum diameter of the piston rod (355) of the third cylinder (353) and the fourth cylinder (354). The square hole (357) facing the first beveled surface (356) has a beveled surface parallel to the first beveled surface (356). The bottom part of the ingot base (41) has a second beveled surface (411). The first support part (341) and the second support part (342) facing the bracket (32) both have a support part beveled surface parallel to the second beveled surface (411).

4. The automated positioning device based on semiconductor ingot rotation according to claim 1, characterized in that: The first driving component includes a first motor (21), a rack (22) is provided on one side of the frame (1), and a gear (23) is provided at the output end of the first motor (21), and the gear (23) meshes with the rack (22).

5. The automated positioning device based on semiconductor ingot rotation according to claim 1, characterized in that: The second drive unit includes a second motor (24), which is connected to the second platform (3).

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