Test device

Abstract

The application discloses a test device. The test device comprises a substrate comprising opposite front and back surfaces; at least one test unit arranged on the front surface of the substrate, each test unit comprising two test pins and one or two connecting pads, each connecting pad being electrically connected to one test pin, the two test pins being arranged along a first direction, the extension direction of each test pin intersecting the first direction; in the extension direction of the test pins, the connecting pads are located on one side of the test pins; and the connecting pads electrically connected to the test pins are used to connect to one of the two electrodes of a capacitor to be tested.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, and in particular to a testing device. BACKGROUND

[0002] With the rapid development of electronic devices towards high performance and high reliability, chip capacitors (such as ceramic capacitors, silicon-based capacitors, etc.) as core passive components, the failure mode analysis and life prediction of chip capacitors in high stress environments (such as high temperature, high humidity, temperature cycling, long-term bias) become the key link to ensure the reliability of electronic devices. Reliability tests (such as endurance tests, steady-state damp heat tests, temperature shock tests, etc.) are the core means to evaluate the quality of chip capacitors, and the rationality of the testing device directly affects the accuracy and efficiency of the test results.

[0003] At present, the existing testing device still needs to be improved. SUMMARY

[0004] The purpose of the present application is to provide a testing device.

[0005] The present application discloses a testing device, comprising: a substrate comprising opposite front and back surfaces; at least one test unit provided on the front surface of the substrate, each test unit comprising two test fingers and one or two connection pads, each connection pad being electrically connected to one test finger, the two test fingers being arranged along a first direction, and the extension direction of each test finger intersecting the first direction; in the extension direction of the test fingers, the connection pad is located on one side of the test fingers; the connection pad electrically connected to the test finger is used to connect to one of the two electrodes of the capacitor to be tested.

[0006] In some optional embodiments, the two test fingers comprise a first test finger and a second test finger; the at least one test unit comprises a first test unit; in the first test unit, the number of connection pads is one, and the connection pad is electrically connected to the second test finger and is insulated from the first test finger, the capacitor to be tested is a wire-bonded capacitor, one of the two electrodes of the capacitor to be tested can be connected to the connection pad, and the other can be connected to the first test finger through a metal wire.

[0007] In some optional embodiments, in the first direction, the center of the connection pad is located between the center lines of the two test fingers.

[0008] In some optional embodiments, in the first direction, the connection pads are located between a first straight line and a second straight line, the first straight line coincides with a side of the first test pin finger away from the second test pin finger, and the second straight line coincides with a side of the second test pin finger away from the first test pin finger.

[0009] In some optional embodiments, in the first direction, the size of the connection pads is greater than the distance between the two test pin fingers.

[0010] In some optional embodiments, the at least one test unit includes a second test unit; in the second test unit, the number of the connection pads is two, and the two connection pads are electrically connected to the two test pin fingers one by one; the capacitor to be tested is a patch capacitor and includes two soldering terminals; and the two soldering terminals can be connected to the two connection pads one by one.

[0011] In some optional embodiments, in the second test unit, the center of each connection pad coincides with the center line of the corresponding test pin finger.

[0012] In some optional embodiments, in the second test unit, the two test pin fingers are symmetrically arranged, the two connection pads are symmetrically arranged, and the symmetry axis of the two test pin fingers coincides with the symmetry axis of the two connection pads.

[0013] In some optional embodiments, the test unit further includes a connection line, the connection line is arranged in the same layer as the connection pads, and each connection pad is electrically connected to one test pin finger through one connection line.

[0014] In some optional embodiments, the test device further includes a plurality of auxiliary pin fingers arranged on the back surface of the substrate and electrically connected to the test pin fingers one by one.

[0015] For the test device of the present application, each test unit includes two test pin fingers and a connection pad, the connection pad is electrically connected to one test pin finger, and the connection pad electrically connected to one test pin finger is used to connect one of the two electrodes of the capacitor to be tested. In the test process, the other electrode of the capacitor to be tested can be electrically connected to the other test pin finger, so that the capacitor to be tested can be tested through the two test pin fingers.

[0016] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present specification. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate embodiments consistent with the application, and together with the description, serve to explain the principles of the application.

[0018] Figure 1 is a schematic diagram of a test device of the present application.

[0019] Figure 2 is a schematic diagram of the AA profile of Figure 1

[0020] Figure 3 is a schematic diagram of the BB profile of Figure 1

[0021] Figure 4 is a schematic diagram of the structure shown in Figure 3

[0022] Figure 5 is a schematic diagram of the CC profile of Figure 1

[0023] Figure 6 is a schematic diagram of the first test unit connected to the capacitor to be tested in the present application.

[0024] Figure 7 is another schematic diagram of a test device of the present application.

[0025] Figure 8 is a schematic diagram of the second test unit connected to the capacitor to be tested in the present application.

[0026] Figure 9 is yet another schematic diagram of a test device of the present application.

[0027] Reference signs: 1, substrate; 2, connection pad; 3, connection line; 4, test gold finger; 401, first test gold finger; 402, second test gold finger; 5, capacitor to be tested; 6, metal wire; 7, test unit; 701, first test unit; 702, second test unit; 8, auxiliary gold finger; 9, via hole; 10, solder resist layer; X, first direction; L, center line. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments (or “modes of implementation”) of the present application will be described clearly and completely herein with reference to the accompanying drawings. The following description refers to the accompanying drawings, in which the same numbers in different drawings represent the same or similar elements, unless otherwise indicated.

[0029] ​​​​If the application embodiments involve terms of direction indication or position relationship (for example, up, down, left, right, front, back, inner, outer, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative position relationship, motion condition, etc. between components in a certain specific posture (as shown in the drawings); if the specific posture changes, the direction indication or position relationship will also change accordingly. In addition, the terms "first", "second", etc. in the application embodiments are only used for convenience of description, and cannot be understood as indicating or implying relative importance.

[0030] The application embodiment discloses a test device for testing the reliability of a to-be-tested capacitor. Figure 1 and Figure 7 As shown in the drawings, the test device can include: a substrate 1 including opposite front and back surfaces; at least one test unit 7 arranged on the front surface of the substrate 1, each test unit 7 including two test pins 4 and one or two connection pads 2, each connection pad 2 being electrically connected to one test pin 4, the two test pins 4 being arranged along a first direction X, and the extension direction of each test pin 4 intersecting the first direction X; in the extension direction of the test pin 4, the connection pad 2 is located on one side of the test pin 4; and the connection pad 2 electrically connected to the test pin 4 is used to be connected to one of the two electrodes of the to-be-tested capacitor 5 (see Figure 6 and Figure 8 ).

[0031] For the test device of the application embodiment, each test unit 7 includes two test pins 4 and a connection pad 2, the connection pad 2 being electrically connected to one test pin 4, and the connection pad 2 electrically connected to one test pin 4 being used to be connected to one of the two electrodes of the to-be-tested capacitor 5, and in the test process, the other electrode of the to-be-tested capacitor 5 can be electrically connected to the other test pin 4, so that the to-be-tested capacitor 5 can be tested by the two test pins 4.

[0032] The parts of the test device of the application embodiment will be described in detail as follows:

[0033] The substrate 1 is the basic bearing component of the test device, and the front surface thereof is used to arrange the test units 7, and the back surface thereof can be used to arrange auxiliary pins 8. The substrate 1 can be made of insulating and high-temperature-resistant materials, such as ceramic or glass fiber epoxy resin, to adapt to the high-stress test environment. The substrate 1 is usually designed as a rectangular flat plate. The size of the substrate 1 is designed according to the test capacity, for example, 5-40 test units 7 can be carried. The substrate 1 needs to have good insulation and thermal stability. The thermal expansion coefficient of the substrate 1 matches the test pin 4 to avoid structural deformation caused by temperature change.

[0034] The test unit 7 is arranged on the front surface of the substrate 1. The number of the test unit 7 can be one, two, three, four or more. For example, when the number of the test unit 7 is more than one, the plurality of test units 7 can be arranged uniformly along the first direction X (e.g., the length direction of the substrate 1). In this case, the test unit 7 can be arranged at the edge region of the substrate 1. The adjacent test units 7 are arranged at intervals in the first direction X to avoid mutual interference. Each test unit 7 independently realizes the electrical connection of the to-be-tested capacitor 5, and the test units 7 are electrically isolated from each other.

[0035] As shown in Figure 1 and Figure 2 , each test unit 7 includes two test gold fingers 4. The test gold finger 4 is made of conductive and wear-resistant material to reduce contact resistance and improve service life. The test gold finger 4 is in the shape of a long strip, and the extension direction of the test gold finger 4 is perpendicular to the first direction X. In this case, one end of each test gold finger 4 can extend out of the substrate 1. In the extension direction of the test gold finger 4, the size of the test gold finger 4 can be greater than the size of the connection pad 2. The two test gold fingers 4 are arranged along the first direction X, and the two test gold fingers 4 are arranged at intervals. In this case, when the number of the test unit 7 is more than one, the plurality of test gold fingers 4 included in the plurality of test units 7 are arranged along the first direction X. For the two test gold fingers 4 of each test unit 7, one test gold finger 4 is electrically connected to one electrode of the to-be-tested capacitor 5, and the other test gold finger 4 is electrically connected to the other electrode of the to-be-tested capacitor 5 to transmit the test signal.

[0036] As shown in Figure 1 and Figure 5 , the connection pad 2 is arranged on one side of the extension direction of the test gold finger 4 and is arranged at intervals with the test gold finger 4. The connection pad 2 is made of the same material as the test gold finger 4. The thickness of the connection pad 2 is consistent with that of the test gold finger 4. In this case, the connection pad 2 can be arranged in the same layer as the test gold finger 4. The connection pad 2 can be circular, rectangular or of other shapes. The connection pad 2 needs to have good solderability and oxidation resistance. The connection pad 2 serves as an intermediate connection between the to-be-tested capacitor 5 and the test gold finger 4, realizes the electrical connection between the electrode of the to-be-tested capacitor 5 and the test circuit, and facilitates the reliability test.

[0037] In an embodiment, as shown in Figure 1 , Figure 2 and Figure 6As shown, the plurality of test units 7 described above includes at least one first test unit 701. Each first test unit 701 can include one connection pad 2. Taking two test fingers 4 in each first test unit 701 as an example, the connection pad 2 in each first test unit 701 is electrically connected to the second test finger 402 through the connection wire 3 and is insulated from the first test finger 401. Taking a wire-bonded capacitor as an example, one of the two electrodes of the wire-bonded capacitor can be connected to the connection pad 2 through conductive glue, and the other electrode can be bonded to the first test finger 401 through the metal wire 6, thereby realizing the electrical connection between the wire-bonded capacitor and the two test fingers. The plurality of test units 7 described above can all be first test units 701, or some test units 7 are first test units 701. When the number of first test units 701 is more than one, the plurality of first test units 701 are distributed along the first direction X at intervals. Such an arrangement makes the layout of the test units 7 more compact, can meet the needs of simultaneous testing of multiple capacitors, and improves the test efficiency.

[0038] For the first test unit 701 described above, in the first direction X, the center of the connection pad 2 is located between the center lines L of the two test fingers 4. The center of the connection pad 2 is located at the geometric center of the connection pad 2. The center line L of the test finger 4 is perpendicular to the first direction X, and the center line L is an infinitely extendable straight line, and the center line L passes through the center of each test finger 4. In addition, in the first direction X, the center of the connection pad 2 can be located between the first straight line (the side of the first test finger 401 away from the second test finger 402) and the second straight line (the side of the second test finger 402 away from the first test finger 401). Such an arrangement improves the stability of the connection. The first straight line coincides with the side of the first test finger 401 away from the second test finger 402, and the second straight line coincides with the side of the second test finger 402 away from the first test finger 401.

[0039] In another embodiment, as Figure 7 and Figure 8As shown, at least one test unit 7 comprises a second test unit 702; in the second test unit 702, the number of connection pads 2 is two, and the two connection pads 2 are electrically connected to the two test fingers 4 one by one. Among them, each connection pad 2 can be electrically connected to the corresponding test finger 4 through the connecting line 3. Taking the patch capacitor as an example, the patch capacitor can include two soldering ends, which can be connected to the two connection pads 2 one by one to realize the electrical connection between the patch capacitor and the two fingers. The above-mentioned plurality of test units 7 can be the second test unit 702, or part of the test units 7 are the second test unit 702. Among them, when the number of the second test unit 702 is multiple, the plurality of second test units 702 are distributed along the first direction X, so that the layout of the test unit 7 is more compact, which can meet the demand of simultaneous testing of multiple capacitors and improve the test efficiency.

[0040] As shown in Figure 1 , Figure 3 and Figure 4 , the above-mentioned connecting line 3 can be arranged in the same layer as the connection pad 2 to connect the test finger 4 and the connection pad 2. The connecting line 3 is made of the same material as the test finger 4. The connecting line 3 can be arranged in the same layer as the above-mentioned connection pad 2. In addition, the test device of the present application can also include a solder mask layer 10 covering the connecting line 3. The solder mask layer 10 is green oil.

[0041] As shown in Figure 9 , the number of the above-mentioned test unit 7 can be multiple, part of the test units 7 are the first test unit 701, and another part of the test units 7 are the second test unit 702. Such arrangement makes the test device of the present application applicable to both wire capacitors and patch capacitors, improving the versatility.

[0042] During the test process, the test finger 4 of the test device is connected to the interface of the test equipment, and the test equipment applies a test signal (such as a direct current voltage, a temperature cycle) to the to-be-tested capacitor 5 through the test finger 4 and the connection pad 2, and collects the parameters (such as the capacitance value, the loss tangent) of the to-be-tested capacitor 5, so as to evaluate its reliability.

[0043] In addition, as shown in Figure 2 , the test device of the present application can also include an auxiliary finger 8. The number of the auxiliary finger 8 can be multiple. The auxiliary finger 8 is arranged on the back of the substrate 1, and the plurality of auxiliary fingers 8 are arranged along the first direction X and connected to the test finger 4 on the front surface one by one (for example, through the via 9 in the substrate 1 to realize electrical connection). The auxiliary finger 8 is made of the same material as the test finger 4. The auxiliary finger 8 is in a strip shape.

[0044] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of the present application is not limited to the precise structure described in the above embodiments and shown in the accompanying drawings; any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the scope of protection of the present application.

Claims

1. A testing device, characterized in that, include: The substrate includes a front side and a back side, which are opposite to each other. At least one test unit is disposed on the front side of the substrate. Each test unit includes two test gold fingers and one or two connection pads. Each connection pad is electrically connected to one of the test gold fingers. The two test gold fingers are arranged along a first direction, and the extension direction of each test gold finger intersects with the first direction. In the extending direction of the test gold finger, the connecting pad is located on one side of the test gold finger; the connecting pad, which is electrically connected to the test gold finger, is used to connect to one of the two electrodes of the capacitor under test; The two test gold fingers include a first test gold finger and a second test gold finger; the at least one test unit includes a first test unit; in the first test unit, the number of the connecting pads is one, and the connecting pads are electrically connected to the second test gold finger and insulated from the first test gold finger; the capacitor to be tested is a wire bonding capacitor, one of the two electrodes of the capacitor to be tested can be connected to the connecting pads, and the other can be connected to the first test gold finger through a metal wire; In the first direction, the size of the connecting pad is greater than the distance between the two test gold fingers.

2. The testing apparatus according to claim 1, characterized in that, In the first direction, the center of the connecting pad is located between the center lines of the two test gold fingers.

3. The testing apparatus according to claim 2, characterized in that, In the first direction, the connection pad is located between a first straight line and a second straight line, the first straight line coinciding with the side of the first test gold finger away from the second test gold finger, and the second straight line coinciding with the side of the second test gold finger away from the first test gold finger.

4. The testing apparatus according to claim 1, characterized in that, The test unit also includes a connecting line, which is disposed on the same layer as the connecting pad, and the connecting pad is electrically connected to one of the test gold fingers through the connecting line.

5. The testing apparatus according to claim 1, characterized in that, The testing apparatus also includes: Multiple auxiliary gold fingers are disposed on the back side of the substrate and are electrically connected to the test gold fingers one by one.

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