Groove type semiconductor wafer cleaning machine

Abstract

The invention discloses a groove type semiconductor wafer cleaning machine, and relates to the technical field of semiconductor processing devices. The water purifier comprises a machine body, and a high-position water frame and a low-position water frame which are arranged in a stepped mode are constructed in the machine body; the immersion cleaning mechanism comprises two immersion tanks fixedly connected in the low-position water frame, bearing baskets are detachably installed in the immersion tanks through lifting parts, the bearing baskets are provided with wheel shifting parts used for driving wafers to rotate, a water outlet groove opening located in the upper side of the low-position water frame is fixedly formed in one side in the machine body, a liquid inlet pipe is installed on the machine body, and a water outlet groove opening located in the lower side of the low-position water frame is formed in the other side of the machine body. One end of the liquid inlet pipe is communicated with the water outlet groove opening, and the other end is communicated with the bottom of the soaking groove. The dial wheel part drives the wafer to rotate at a low speed in the soaking process, the wafer is assisted to rotate continuously in cooperation with directional spraying of the U-shaped spraying pipe, cleaning blind areas can be eliminated, the particle impurity removal rate is increased, and the cleanliness difference of the upper surface and the lower surface of the wafer is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing equipment technology, specifically to a tank-type semiconductor wafer cleaning machine. Background Technology

[0002] In the wafer fabrication process, wafers typically need to be cleaned first to remove impurities from the front side. Existing cleaning methods are divided into "single-wafer cleaning" and "tank cleaning." Single-wafer cleaning ensures cleaning quality, while tank cleaning ensures cleaning efficiency.

[0003] Most current mainstream tank cleaning machines use a basic "immersion + rinsing" process to clean wafers, but this method has many technical drawbacks in practical applications:

[0004] 1. Traditional immersion cleaning relies solely on natural liquid convection, which can easily create cleaning blind spots on the wafer surface and corners where they come into contact with the carrier basket. This results in a low removal rate of particulate impurities, poor cleaning uniformity, and substandard cleanliness.

[0005] 2. Wafers are mostly rigidly fixed in the carrier basket. Under the impact pressure of the cleaning fluid, the wafers are easily misaligned and bent from the grooves in the carrier basket, resulting in damage to the thin film layer on the wafer surface and poor safety.

[0006] Therefore, this invention proposes a tank-type semiconductor wafer cleaning machine. Summary of the Invention

[0007] The purpose of this application is to provide a tank-type semiconductor wafer cleaning machine in order to solve the problems in the background art.

[0008] To achieve the above objectives, this application specifically adopts the following technical solution:

[0009] A tank-type semiconductor wafer cleaning machine, comprising:

[0010] The body, wherein the body is constructed with a high-level water frame and a low-level water frame arranged in a stepped manner;

[0011] The immersion washing mechanism includes two immersion tanks fixedly connected to a low-level water frame. A carrying basket is detachably installed in the immersion tank via a lifting component. The carrying basket is equipped with a dial for driving the wafer to rotate. A water outlet located above the low-level water frame is fixedly installed on one side of the machine body. An inlet pipe is installed on the machine body. One end of the inlet pipe is connected to the water outlet and the other end is connected to the bottom of the immersion tank.

[0012] The rinsing assembly includes two cleaning tanks fixedly connected inside a high-level water frame. An ultrasonic vibrator is installed at the bottom of the cleaning tank. A water inlet pipe is installed on the other side of the machine body. Drain pipes are installed at the bottom of both the low-level and high-level water frames.

[0013] By driving the wafer to rotate at a low speed during the immersion process using the aforementioned dial component, cleaning blind spots can be eliminated, the removal rate of particulate impurities can be improved, and the difference in cleanliness between the upper and lower surfaces of the wafer can be reduced.

[0014] Furthermore, the soaking tank includes a support frame fixedly connected to the bottom of the low-level water frame. A rectangular frame with an open top is fixedly connected to the support frame. A suspension rod is constructed inside the rectangular frame, and a support mesh plate is detachably connected to the suspension rod. A positioning tube connected to the liquid inlet pipe is fixedly inserted through the bottom of the rectangular frame. The carrying basket is placed on the support mesh plate and connected to the positioning tube. By setting the support mesh plate inside the rectangular frame through the suspension rod, the carrying basket can be suspended in the air to ensure smooth flow of liquid at the bottom, thereby realizing the flow rinsing operation of the carrying basket and improving the cleaning effect.

[0015] Furthermore, the lifting component includes a waterproof frame fixedly connected within the low-level water frame. A cylinder push rod is fixedly connected within the waterproof frame, and a lifting vertical plate is fixedly connected to the movable end of the cylinder push rod. Three horizontal clamping rods arranged in a triangle are fixedly connected to the lifting vertical plate. The triangular structure can stably clamp the carrying basket, preventing swaying during lifting and increasing safety. During clamping operation, the horizontal clamping rods are first raised above the soaking tank by the cylinder push rod, and then the carrying basket is horizontally inserted between the three horizontal clamping rods. The operation is convenient and quick.

[0016] Furthermore, the carrying basket includes an arc-shaped basket frame with multiple receiving grooves arrayed within it. The arc-shaped basket frame is open at one end and closed at the other. An n-shaped tube is connected to the open end of the arc-shaped basket frame. One end of the bottom of the n-shaped tube is connected to a valve tube that is detachably connected to the positioning insertion tube. The other end of the n-shaped tube is connected to a U-shaped spray pipe arranged around the periphery of the arc-shaped basket frame. When the device is in use, the arc-shaped basket frame is inserted between three horizontal clamping rods and pushed until it is against the lifting vertical plate. At this time, the arc-shaped basket frame can be moved vertically by the cylinder push rod until it touches the support mesh plate in the soaking tank. At this time, the valve tube will be interlocked with the positioning insertion tube, and the arc-shaped basket frame will be in the center of the soaking tank to facilitate the flow of liquid and ensure the cleaning effect.

[0017] Furthermore, the dial component includes two mounting plates fixedly connected to the top of the arc-shaped basket frame. The two mounting plates are horizontally opposite each other and a shaft is rotatably mounted on them. Multiple dial wheels are fixedly sleeved on the shaft and are arranged vertically opposite to the receiving groove. A driving component for driving the shaft to rotate is installed inside the n-shaped tube. The driving component can drive the two shafts to rotate in the same direction, thereby causing the wafer to rotate in the receiving groove. Compared with traditional immersion rinsing, the wafer's own rotation can make the cleaning more uniform and comprehensive, avoid cleaning dead corners, and increase the cleaning effect.

[0018] Furthermore, the actuating wheel is made of silicone material, and the circumferential side of the actuating wheel is constructed with an annular groove for contacting the wafer. The annular groove is constructed with multiple elastic protrusions arranged in a circumferential array to contact the edge of the wafer, increase the rotational friction, and thus smoothly drive the wafer to rotate.

[0019] Furthermore, the driving component includes a circular frame constructed at the two corners of the n-shaped tube. A rotating shaft is rotatably mounted inside the circular frame, and a water wheel located inside the circular frame is fixedly sleeved on the rotating shaft. The rotating shaft is coaxially connected to the shaft rod. A diversion pipe is connected to the liquid inlet pipe through a control valve. The ends of the diversion pipe are respectively connected to two positioning tubes. When the device is in use, the arc-shaped basket is inserted between three horizontal clamping rods. The cylinder push rod can drive the arc-shaped basket into the support mesh plate in the soaking tank. At this time, the valve pipe will be sleeved with the positioning tube, and the arc-shaped basket will be in the center position of the soaking tank. At this time, the control valve will close the water outlet and open the diversion pipe, so that the liquid flows into the n-shaped tube and passes through the two circular frames in sequence. The water flow will drive the two water wheels to rotate in the same direction, thereby driving the wafer to rotate and saving energy.

[0020] Furthermore, the valve tube includes a vertical tube fixedly penetrating one end of the n-shaped tube. The bottom of the vertical tube is constructed with a sleeve communicating with the positioning insertion tube. The middle part of the n-shaped tube is constructed with a water outlet mesh. An intervalve ring is constructed inside the n-shaped tube, located above the water outlet mesh. A hollow float is slidably sleeved on the vertical tube, located between the inner end of the n-shaped tube and the intervalve ring. When the hollow float moves upward and abuts against the intervalve ring, the water outlet mesh is blocked. When the water level is below the middle of the support basket, cleaning fluid is gradually injected into it through the water outlet mesh. When the water level is above the middle of the support basket, the wafer can be rotated by the drive component inside the n-shaped tube, and cleaning is sprayed towards the wafer through the U-shaped nozzle. This improves the cleaning effect and can also automatically control the switching of the cleaning mode to increase the cleaning effect.

[0021] Furthermore, the U-shaped nozzle includes a flow pipe fixedly connected to the periphery of the arc-shaped basket frame. Multiple water spray channels are fixedly connected to the flow pipe. The ends of the water spray channels are installed through the middle of the receiving groove. When spraying, it provides a certain assistance to the rotation of the wafer. When the water flows through, it can rinse the wafer surface and ensure that the cleaning solution evenly covers the wafer surface.

[0022] Furthermore, the cleaning tank includes a bracket fixedly connected to the bottom of the elevated water frame, a water passage frame fixedly connected to the bracket, a round hole at the bottom of the water passage frame, an ultrasonic vibrator connected to the bottom of the round hole, a mesh frame for supporting the load-bearing basket installed inside the water passage frame, an inclined spray pipe connected to the water inlet pipe fixedly connected to the top of the water passage frame, the bottom of the water passage frame being interconnected with the elevated water frame through the round hole, and the water inlet pipe being connected to the side of the elevated water frame, allowing for direct water injection into the entire elevated water frame, or switching the water supply to the inclined spray pipe via a solenoid valve to change the water inlet mode to showering, providing dual-mode cleaning and improving the cleaning effect.

[0023] The beneficial effects of this application are as follows:

[0024] 1. This application uses a dial to drive the wafer to rotate at a low speed during the immersion process. Combined with the directional spraying of the U-shaped nozzle to assist the continuous rotation of the wafer, it can eliminate cleaning blind spots, improve the removal rate of particulate impurities, and reduce the difference in cleanliness between the upper and lower surfaces of the wafer.

[0025] 2. The inner wall of the receiving groove of the bearing basket in this application is pasted with an anti-static silicone pad, and the actuating wheel is made of soft silicone material to resist the wafer, so as to avoid scratches, chipping, and edge breakage of the wafer. The flat water outlet of the U-shaped nozzle and the low-pressure spray design prevent damage to the thin film layer on the wafer surface. The triangular clamping structure of the lifting component ensures that the bearing basket is lifted and lowered smoothly without the risk of shaking or tilting, thus increasing the safety of the device. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of this application;

[0027] Figure 2 This is another perspective of the three-dimensional structure of this application;

[0028] Figure 3 This is a three-dimensional half-sectional view of the present application;

[0029] Figure 4 This is a three-dimensional structural diagram of the immersion washing mechanism of this application;

[0030] Figure 5 This application Figure 4 Half-section of the three-dimensional structure;

[0031] Figure 6 This application Figure 4 Partial sectional view of the three-dimensional structure;

[0032] Figure 7 This is a three-dimensional structural diagram of the load-bearing basket in this application;

[0033] Figure 8 This application Figure 7 Partial sectional view of the three-dimensional structure;

[0034] Figure 9 This is a three-dimensional structural diagram of the flushing assembly of this application;

[0035] Figure 10 This application Figure 9 Half-section of the three-dimensional structure.

[0036] Reference numerals: 1. Body; 2. High-level water frame; 3. Low-level water frame; 4. Immersion mechanism; 401. Immersion tank; 4011. Support frame; 4012. Rectangular frame; 4013. Suspension rod; 4014. Support mesh plate; 4015. Positioning tube; 402. Water outlet; 403. Liquid inlet pipe; 4031. Control valve; 4032. Diverter pipe; 5. Lifting component; 501. Waterproof frame; 502. Cylinder push rod; 503. Lifting vertical plate; 504. Horizontal clamping rod; 6. Bearing basket; 601. Arc-shaped basket frame; 602. Receiving groove; 603. N-type pipe; 604. Valve pipe; 6041. Vertical pipe; 6042. Sleeve; 604 3. Water outlet mesh; 6044. Spacer ring; 6045. Hollow float; 605. U-shaped nozzle; 6051. Flow pipe; 6052. Spray trough pipe; 7. Dial wheel assembly; 701. Mounting plate; 702. Shaft; 703. Dial wheel; 7031. Ring groove; 7032. Elastic protrusion; 704. Drive component; 7041. Circular frame; 7042. Rotating shaft; 7043. Water wheel; 8. Flushing assembly; 801. Cleaning tank; 8011. Support; 8012. Water passage frame; 8013. Circular hole; 8014. Mesh frame; 8015. Inclined nozzle; 802. Ultrasonic vibrator; 803. Water inlet pipe; 804. Drain pipe. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0038] like Figures 1-9 As shown, one embodiment of this application discloses a tank-type semiconductor wafer cleaning machine, comprising:

[0039] The machine body 1 has a stepped high-level water frame 2 and a low-level water frame 3 inside. The machine body 1 is made of stainless steel and welded together. The interior is divided into high-level water frame 2 and low-level water frame 3 by a partition. The high-level water frame 2 is located near the opening of the machine body 1 and its upper surface is a sealing plate, while the low-level water frame 3 is located near the interior of the machine body 1 and its upper surface is a mesh plate. There is a height difference between the two.

[0040] The immersion cleaning mechanism 4 includes two immersion tanks 401 fixedly connected within the low-level water frame 3. The dual immersion tank 401 design improves cleaning efficiency per unit time. A carrying basket 6 is detachably installed within each immersion tank 401 via a lifting component 5. The lifting component 5 automatically raises and lowers the carrying basket 6, reducing the risk of accidental bumps and increasing safety. The carrying basket 6 is equipped with a dial 7 for driving wafer rotation, ensuring more uniform and comprehensive wafer cleaning. A water outlet 402 is fixedly installed on one side of the machine body 1, located above the low-level water frame 3. This water outlet 402 is situated inside the machine body 1, near the low-level water frame 3. The machine body 1 is equipped with an inlet pipe 403. One end of the inlet pipe 403 is connected to the outlet 402 and the other end is connected to the bottom of the soaking tank 401. When it is necessary to clean the wafer, the cleaning solution can be injected from above into the low water frame 3 through the inlet pipe 403 and the outlet 402 to rinse the carrier basket 6 in a large area, which can initially wash away some impurities. Then, the inlet pipe 403 is connected to the soaking tank 401 and the outlet 402 is closed, so that the cleaning solution flows from the inside of the soaking tank 401. The continuous flow is used to further clean and soak the wafer. With the rotation of the dial 7, the wafer can be cleaned evenly.

[0041] The rinsing assembly 8 includes two cleaning tanks 801 fixedly connected within the high-level water frame 2. The dual cleaning tanks 801 improve cleaning efficiency. An ultrasonic vibrator 802 is installed at the bottom of each cleaning tank 801. This ultrasonic vibrator 802 uses existing high-frequency ultrasonic vibration equipment, which can remove stubborn contaminants and residual metal ions from the wafer surface, thus improving the cleaning effect. A water inlet pipe 803 is installed on the other side of the body 1. Drain pipes 804 are installed at the bottom of both the low-level water frame 3 and the high-level water frame 2. The drain pipes 804 can automatically drain liquid through a solenoid valve and a PLC control system.

[0042] like Figures 4-6 As shown, the specific structure of the soaking tank 401 of this application is disclosed. The soaking tank 401 includes a support frame 4011 fixedly connected to the bottom of the low-level water frame 3. A rectangular frame 4012 with an open top is fixedly connected to the support frame 4011. A suspension rod 4013 is constructed inside the rectangular frame 4012. A support mesh plate 4014 is detachably connected to the suspension rod 4013. A positioning tube 4015 connected to the liquid inlet pipe 403 is fixedly inserted through the bottom of the rectangular frame 4012. The carrying basket 6 is placed on the support mesh plate 4014 and connected to the positioning tube 4015. It should be noted that a polytetrafluoroethylene lining is attached to the inner wall of the rectangular frame 4012, which can improve its corrosion resistance and acid and alkali resistance. The support mesh plate 4014 is set inside the rectangular frame 4012 through the suspension rod 4013, which can suspend the carrying basket 6 and ensure the smooth flow of liquid at the bottom, thereby realizing the flow rinsing operation of the carrying basket 6 and improving the cleaning effect.

[0043] like Figure 5 As shown, the specific structure of the lifting component 5 of this application is disclosed. The lifting component 5 includes a waterproof frame 501 fixedly connected inside the low-position water frame 3 to prevent cleaning fluid from entering and to ensure the safety of internal components. A cylinder push rod 502 is fixedly connected inside the waterproof frame 501. A lifting vertical plate 503 is fixedly connected to the movable end of the cylinder push rod 502. Three horizontal clamping rods 504 arranged in a triangle are fixedly connected to the lifting vertical plate 503. It should be noted that the lifting vertical plate 503 is L-shaped, with one end connected to the top of the cylinder push rod 502 and the other end vertically inserted into the soaking tank 401. The three horizontal clamping rods 504 are set on the vertical surface of the lifting vertical plate 503. The triangular structure can stably clamp the carrying basket 6, avoid shaking during lifting, and increase safety. During the clamping operation, the horizontal clamping rods 504 are first raised above the soaking tank 401 by the cylinder push rod 502, and then the carrying basket 6 is horizontally inserted between the three horizontal clamping rods 504. The operation is convenient and quick.

[0044] like Figures 7-8 As shown, the specific structure of the bearing basket 6 of this application is disclosed. The bearing basket 6 includes an arc-shaped basket frame 601, which is integrally injection molded from polypropylene. The arc-shaped basket frame 601 has two support legs at the bottom for stable support, and the bottom structure is open. The overall shape is U-shaped, allowing liquid to flow smoothly through it. Multiple receiving grooves 602 are arrayed inside the arc-shaped basket frame 601. The receiving grooves 602 are arc-shaped and their inner walls are lined with anti-static silicone pads. The arc-shaped basket frame 601 is open at one end and closed at the other end. The closed end is connected to a handle for easy gripping and increased convenience. An n-shaped tube 603 is connected to the open end of the arc-shaped basket frame 601. One end of the bottom of the n-shaped tube 603 is connected to a valve tube 6 that is detachably connected to the positioning insertion tube 4015. 04. The other end of the n-shaped tube 603 is connected to a U-shaped spray pipe 605 arranged around the periphery of the arc-shaped basket 601. The valve tube 604 is used to connect to the positioning insertion tube 4015. The top of the positioning insertion tube 4015 is constructed with an inlet bevel for easy interlocking. It should be noted that when the device is in use, the arc-shaped basket 601 is inserted between the three horizontal clamping rods 504 and pushed to abut against the lifting vertical plate 503. At this time, the cylinder push rod 502 can drive the arc-shaped basket 601 to move vertically until it abuts against the support mesh plate 4014 in the soaking tank 401. At this time, the valve tube 604 will interlock with the positioning insertion tube 4015, and the arc-shaped basket 601 will be in the center of the soaking tank 401 to facilitate the flow of liquid and ensure the cleaning effect.

[0045] like Figures 7-8The specific structure of the dial component 7 of this application is disclosed. The dial component 7 includes two mounting plates 701 fixedly connected to the top of the arc-shaped basket frame 601. The two mounting plates 701 are horizontally opposite each other and a shaft 702 is rotatably mounted on them. A plurality of actuating wheels 703 are fixedly sleeved on the shaft 702 and are vertically opposite to the receiving groove 602. A driving component 704 for driving the shaft 702 to rotate is installed in the n-shaped tube 603. It should be noted that the actuating wheels 703 are used to abut the edge of the wafer. The two actuating wheels 703 can lift the wafer so that there is no gap between it and the receiving groove 602. To minimize contact and reduce friction during rotation, thus preventing wafer damage, a rotating rod can be installed at the bottom of the arc-shaped basket 601 to support the wafer. Combined with two actuating wheels 703, this allows the wafer to rotate smoothly. When the arc-shaped basket 601 is placed in the immersion tank 401, the valve pipe 604 connects to the positioning insertion pipe 4015. At this time, the driving component 704 can drive the two shafts 702 to rotate in the same direction, thereby causing the wafer to rotate within the receiving tank 602. Compared to traditional immersion rinsing, the wafer's own rotation allows for more even and comprehensive cleaning, avoiding cleaning dead zones and increasing the cleaning effect.

[0046] like Figure 8 As shown, the specific structure of the actuating wheel 703 of this application is disclosed. The actuating wheel 703 is made of silicone. The circumferential side of the actuating wheel 703 has an annular groove 7031 for contacting the wafer. The annular groove 7031 has a plurality of elastic protrusions 7032 arranged in an array along the circumference. The elastic protrusions 7032 are also made of silicone and are used to contact the edge of the wafer to increase the rotational friction, thereby smoothly driving the wafer to rotate.

[0047] like Figures 7-8 The specific structure of the driving component 704 of this application is disclosed. The driving component 704 includes a circular frame 7041 constructed at the two corners of the n-shaped tube 603. A rotating shaft 7042 is rotatably mounted inside the circular frame 7041. A water wheel 7043 located inside the circular frame 7041 is fixedly sleeved on the rotating shaft 7042. The rotating shaft 7042 is coaxially connected to the shaft 702. A diversion pipe 4032 is connected to the inlet pipe 403 through a control valve 4031. The ends of the diversion pipe 4032 are respectively connected to two positioning insertion tubes 4015. When the device is in use, the arc-shaped basket 601 is inserted. Between the three horizontal clamping rods 504, the cylinder push rod 502 can drive the arc-shaped basket 601 into the support mesh plate 4014 in the soaking tank 401. At this time, the valve pipe 604 will be connected to the positioning insertion pipe 4015, and the arc-shaped basket 601 will be in the center of the soaking tank 401. At this time, the control valve 4031 will close the water outlet 402 and open the diversion pipe 4032, so that the liquid flows into the n-shaped pipe 603 and passes through the two circular frames 7041 in sequence. The water flow will drive the two water wheels 7043 to rotate in the same direction, thereby causing the wafer to rotate.

[0048] like Figure 8 The specific structure of the valve pipe 604 of this application is disclosed. The valve pipe 604 includes a vertical pipe 6041 fixedly penetrating one end of an n-shaped pipe 603. The bottom of the vertical pipe 6041 is constructed with a sleeve 6042 communicating with the positioning insertion tube 4015. The middle part of the n-shaped pipe 603 is constructed with a water outlet mesh 6043. A spacer ring 6044 is constructed inside the n-shaped pipe 603, located above the water outlet mesh 6043. A hollow float 6045 is slidably sleeved on the vertical pipe 6041, located between the inner end of the n-shaped pipe 603 and the spacer ring 6044. When the hollow float 6045 moves upward and abuts the spacer ring 6044, the water outlet mesh 6043 is blocked. The vertical pipe 6041 is mainly used to allow liquid to pass directly through the vertical pipe 6041 inside the n-shaped pipe 603. 041 flows into the upper side of the hollow float 6045 and then out through the water outlet mesh 6043. When the external water level is higher than the height of the vertical pipe 6041, the hollow float 6045 will gradually rise until it completely blocks the water outlet mesh 6043. At this time, the water flow can only enter the n-shaped pipe 603 through the spacer ring 6044. Based on this principle, when the water level is below the middle of the support basket 6, the cleaning fluid can be gradually injected into it through the water outlet mesh 6043. When the water level is higher than the middle of the support basket 6, the wafer can be rotated by the drive component 704 in the n-shaped pipe 603. At the same time, the cleaning fluid is sprayed towards the wafer through the U-shaped nozzle 605, which improves the cleaning effect and can also automatically control the switching of the cleaning mode to increase the cleaning effect.

[0049] like Figures 7-8 As shown, the specific structure of the U-shaped nozzle 605 of this application is disclosed. The U-shaped nozzle 605 includes a flow pipe 6051 fixedly connected to the periphery of the arc-shaped basket 601. Multiple water spray channels 6052 are fixedly connected to the flow pipe 6051. The ends of the water spray channels 6052 are installed through the middle of the receiving groove 602. It should be noted that the number of water spray channels 6052 is the same as the number of receiving grooves 602. Its water outlet is vertical strip-shaped, and its width is the same as the width of the receiving groove 602. The water outlet direction is at an upward angle to the wafer surface, which provides a certain assistance for the wafer rotation. When passing through, it can rinse the wafer surface and ensure that the cleaning fluid evenly covers the wafer surface.

[0050] like Figures 9-10As shown, the specific structure of the cleaning tank 801 of this application is disclosed. The cleaning tank 801 includes a support 8011 fixedly connected to the bottom of the high-level water frame 2. A water passage frame 8012 is fixedly connected to the support 8011. The bottom of the water passage frame 8012 has a circular hole 8013. An ultrasonic vibrator 802 is connected to the bottom of the circular hole 8013. A mesh frame 8014 for supporting the bearing basket 6 is installed inside the water passage frame 8012. An inclined spray pipe 8015 connected to the water inlet pipe 803 is fixedly connected to the top of the water passage frame 8012. The support 8011 of the cleaning tank 801 can suspend the water passage frame 8012 to realize the flow of water at the bottom. In operation, an ultrasonic vibrator 802 is installed in the round hole 8013 at the bottom of the water frame 8012, which can perform high-frequency agitation on the water inside the water frame 8012. There are two inclined spray pipes 8015 at the top of the water frame 8012, which are located on both sides and are inclined towards the mesh frame 8014 to spray water. It should be noted that the bottom of the water frame 8012 is connected to the high-level water frame 2 through the round hole 8013, and the water inlet pipe 803 is connected to the side of the high-level water frame 2. It can directly fill the entire high-level water frame 2 with water, or the water supply can be switched to the inclined spray pipes 8015 by the solenoid valve, so that the water inlet mode is changed to rinsing. The dual-mode cleaning can improve the cleaning effect.

[0051] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A tank-type semiconductor wafer cleaning machine, characterized in that, include: The body (1) has a stepped high-level water frame (2) and a low-level water frame (3) inside. The immersion washing mechanism (4) includes two immersion tanks (401) fixedly connected in the low-level water frame (3). A carrying basket (6) is detachably installed in the immersion tank (401) via a lifting component (5). A dial component (7) for driving the wafer to rotate is provided on the carrying basket (6). A water outlet (402) located on the upper side of the low-level water frame (3) is fixedly installed on one side of the machine body (1). An inlet pipe (403) is installed on the machine body (1). One end of the inlet pipe (403) is connected to the water outlet (402) and the other end is connected to the bottom of the immersion tank (401). The rinsing assembly (8) includes two cleaning tanks (801) fixedly connected in the high-level water frame (2). An ultrasonic vibrator (802) is installed at the bottom of the cleaning tank (801). A water inlet pipe (803) is installed on the other side of the body (1). Drain pipes (804) are installed at the bottom of both the low-level water frame (3) and the high-level water frame (2).

2. The tank-type semiconductor wafer cleaning machine according to claim 1, characterized in that, The soaking tank (401) includes a support frame (4011) fixedly connected to the bottom of the low-level water frame (3). A rectangular frame (4012) with an open top is fixedly connected to the support frame (4011). A suspension rod (4013) is constructed inside the rectangular frame (4012). A support mesh plate (4014) is detachably connected to the suspension rod (4013). A positioning tube (4015) connected to the liquid inlet pipe (403) is fixedly inserted through the bottom of the rectangular frame (4012). The carrying basket (6) is placed on the support mesh plate (4014) and connected to the positioning tube (4015).

3. The tank-type semiconductor wafer cleaning machine according to claim 1, characterized in that, The lifting component (5) includes a waterproof frame (501) fixedly connected to the low-level water frame (3), a cylinder push rod (502) fixedly connected inside the waterproof frame (501), a lifting vertical plate (503) fixedly connected to the movable end of the cylinder push rod (502), and three horizontal clamping rods (504) arranged in a triangle fixedly connected on the lifting vertical plate (503).

4. A tank-type semiconductor wafer cleaning machine according to claim 1, characterized in that, The carrying basket (6) includes an arc-shaped basket frame (601), and multiple receiving grooves (602) are arrayed inside the arc-shaped basket frame (601). The arc-shaped basket frame (601) is open at one end and closed at the other end. An n-shaped tube (603) is connected to the open end of the arc-shaped basket frame (601). A valve pipe (604) is detachably connected to a positioning insertion tube (4015) at one end of the bottom of the n-shaped tube (603). A U-shaped nozzle (605) is connected to the other end of the n-shaped tube (603) around the arc-shaped basket frame (601).

5. A tank-type semiconductor wafer cleaning machine according to claim 4, characterized in that, The dial component (7) includes two mounting plates (701) fixedly connected to the top of the arc-shaped basket frame (601). The two mounting plates (701) are horizontally opposite each other and a shaft (702) is rotatably installed on them. Multiple dial wheels (703) are fixedly sleeved on the shaft (702) and are vertically opposite to the receiving groove (602). A driving component (704) for driving the shaft (702) to rotate is installed inside the n-shaped tube (603).

6. A tank-type semiconductor wafer cleaning machine according to claim 5, characterized in that, The actuating wheel (703) is made of silicone. The actuating wheel (703) has an annular groove (7031) on its circumferential side for contacting the wafer. The annular groove (7031) has multiple elastic protrusions (7032) arranged in a circumferential array.

7. A tank-type semiconductor wafer cleaning machine according to claim 5, characterized in that, The drive unit (704) includes a circular frame (7041) constructed at the two corners of the n-shaped tube (603). A rotating shaft (7042) is rotatably installed inside the circular frame (7041). A water wheel (7043) located inside the circular frame (7041) is fixedly sleeved on the rotating shaft (7042). The rotating shaft (7042) is coaxially connected to the shaft (702). A diversion pipe (4032) is connected to the inlet pipe (403) through a control valve (4031). The ends of the diversion pipe (4032) are respectively connected to two positioning tubes (4015).

8. A tank-type semiconductor wafer cleaning machine according to claim 4, characterized in that, The valve pipe (604) includes a vertical pipe (6041) that is fixedly inserted through one end of an n-shaped pipe (603). The bottom of the vertical pipe (6041) is constructed with a sleeve (6042) that communicates with the positioning insertion tube (4015). The middle part of the n-shaped pipe (603) is constructed with a water outlet mesh (6043). The n-shaped pipe (603) is constructed with a spacer ring (6044) located above the water outlet mesh (6043). A hollow float (6045) is slidably sleeved on the vertical pipe (6041) between the inner end of the n-shaped pipe (603) and the spacer ring (6044). When the hollow float (6045) moves upward and abuts against the spacer ring (6044), the water outlet mesh (6043) is blocked.

9. A tank-type semiconductor wafer cleaning machine according to claim 4, characterized in that, The U-shaped nozzle (605) includes a flow pipe (6051) fixedly connected to the periphery of the arc-shaped basket frame (601). Multiple water spraying channel pipes (6052) are fixedly connected to the flow pipe (6051). The ends of the water spraying channel pipes (6052) are installed through the middle of the receiving groove (602).

10. A tank-type semiconductor wafer cleaning machine according to claim 1, characterized in that, The cleaning tank (801) includes a bracket (8011) fixedly connected to the bottom of the high-level water frame (2), a water passage frame (8012) fixedly connected to the bracket (8011), a round hole (8013) constructed at the bottom of the water passage frame (8012), an ultrasonic vibrator (802) connected to the bottom of the round hole (8013), a mesh frame (8014) for supporting the bearing basket (6) installed inside the water passage frame (8012), and an inclined spray pipe (8015) connected to the water inlet pipe (803) fixedly connected to the top of the water passage frame (8012).

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