High precision wafer alignment device

Abstract

The application relates to the technical field of temporary wafer bonding, in particular to a high-precision wafer alignment device which mainly solves the technical problem of low precision of a wafer alignment device. The device comprises a rack, a visual mechanism, an adsorption table plate, an XYZ three-axis platform, a rotating platform and an adjusting platform. The rack comprises a base and a gantry, the visual mechanism is installed above the crossbeam of the gantry, the adsorption table plate is fixed below the crossbeam of the gantry, the XYZ three-axis platform is installed on the base and located at the inner side of the gantry, the rotating platform is installed on the XYZ three-axis platform, and the adjusting platform comprises a bottom plate, a top plate and a leveling assembly. The bottom plate is fixed on the rotating platform, and the leveling assembly is connected between the bottom plate and the top plate and is circumferentially spaced apart and distributed with multiple sets. On one hand, the device can realize position calibration of a lower wafer and an upper wafer, and on the other hand, the device can avoid precision reduction caused by taking down, transferring and placing, and the two aspects can guarantee the precision when the upper and lower wafers are finally fixed, so that the process requirement is met.

Description

High-precision wafer alignment device Technical Field

[0001] This invention relates to the field of temporary wafer bonding technology, and more particularly to a high-precision wafer alignment device. Background Technology

[0002] Temporary wafer bonding refers to the technique of coating a temporary bonding adhesive layer on the surface of an upper wafer and / or a lower wafer, and then cross-linking the temporary bonding adhesive layer through processes such as UV curing and hot pressing, thereby achieving a tight bond between the upper and lower wafers to form a wafer pair. Temporary wafer bonding is generally completed by equipment such as a loading device, an alignment device, a bonding device, and a cooling station separation device. Among them, the alignment device is an important piece of equipment in the temporary wafer bonding process. When in use, it requires a chuck, which is attached to an alignment platform. A robotic arm picks up the upper and lower wafers, attaches the upper wafer to the upper adsorption platform, and attaches the lower wafer to the chuck. After visual alignment, the two wafers are brought into contact and separated at the edges by spacers to ensure that the air between the two wafers is expelled before bonding. Finally, the upper and lower wafers are pressed and fixed by a pre-pressure rod and transported to the next process with the chuck.

[0003] Existing alignment devices require the upper wafer to be removed separately after visual alignment and then placed on the lower wafer before being pressed and fixed. However, the process of removing the upper wafer from the upper adsorption platform causes a loss of precision. During the transfer process, the upper wafer is easily affected by external forces such as airflow disturbances, resulting in slight positional deviations. When the upper wafer is placed on the lower wafer, it will also be subject to slight impacts, resulting in slight positional deviations. These multiple factors lead to a significant decrease in the precision when the upper and lower wafers are finally fixed, making it difficult to meet process requirements.

[0004] Therefore, there is an urgent need for a high-precision wafer alignment device. Summary of the Invention

[0005] To overcome the technical shortcomings of existing wafer alignment devices, which have low precision, this invention provides a high-precision wafer alignment device.

[0006] The high-precision wafer alignment device provided by the present invention includes:

[0007] A frame, comprising a base and a gantry, the gantry being fixed to the base;

[0008] A vision mechanism is installed above the crossbeam of the gantry frame;

[0009] An adsorption platform is fixed below the crossbeam of the gantry frame. The lower surface of the adsorption platform is used for vacuum adsorption of wafers, and the adsorption platform is provided with a notch for visual alignment.

[0010] An XYZ three-axis platform is mounted on the base and located inside the gantry.

[0011] A rotating platform is mounted on the XYZ three-axis platform with the rotation axis arranged along the Z direction;

[0012] The adjustment platform includes a base plate, a top plate, and leveling components. The base plate is fixed on the rotating platform. Multiple sets of leveling components are connected between the base plate and the top plate and are distributed at intervals along the circumference. The top plate is used to absorb the chuck. The top plate is also provided with a negative pressure connection component for docking with the negative pressure channel of the chuck. The base plate is also provided with a first drive component for moving the chuck spacer and a second drive component for moving the chuck preload rod. The second drive component is arranged corresponding to the notch.

[0013] Optionally, the base includes a base frame, a marble slab, and shock-absorbing pads, with the marble slab fixed to the base frame via the shock-absorbing pads.

[0014] Optionally, the adsorption platform has two notches distributed at 180°, and the vision mechanism includes two sets of vision components. Each set of vision components includes a movable plate and a vision camera. The movable plate is installed above the crossbeam of the gantry and is driven to move along the line connecting the two notches. The vision camera is installed on the movable plate and is driven to rise and fall.

[0015] Optionally, the vision mechanism further includes edge cameras, with three sets of edge cameras. Two sets of edge cameras are respectively mounted on two movable plates and are collinear with the vision cameras of the two vision components. The remaining set of edge cameras is mounted on the crossbeam of the gantry and the adsorption platform has a detection port corresponding to the edge camera. Each set of edge cameras is driven to rise and fall.

[0016] Optionally, the adsorption platform is a microporous ceramic adsorption plate.

[0017] Optionally, the leveling component includes:

[0018] The mounting base is fixed to the base plate;

[0019] A sliding block, which is mounted on the fixed base and driven to move horizontally;

[0020] A lifting block is mounted on the fixed base and can be raised and lowered freely. The lifting block and the sliding block are slidably connected by a wedge structure so that the lifting block can be raised and lowered when the sliding block moves horizontally.

[0021] The connecting rod is fixedly connected to the lifting block at its bottom end and movably connected to the top plate at its top end.

[0022] Optionally, the bottom of the sliding block is connected to the fixed seat via a first cross roller guide, and the top of the sliding block is connected to the lifting block via a second cross roller guide. The second cross roller guide is arranged at an angle to form the wedge-shaped structure.

[0023] Optionally, the leveling assembly is provided in two sets distributed at 180°. The first set of leveling assemblies includes two sets of leveling assemblies, and the top end of the connecting rod of the first set of leveling assemblies is movably connected to the top plate through a ball-and-V-groove mating structure. The second set of leveling assemblies includes one set of leveling assemblies, and the top end of the connecting rod of the second set of leveling assemblies is movably connected to the top plate through a ball-and-socket structure.

[0024] Optionally, the top plate is further provided with lifting components. Multiple sets of lifting components are distributed circumferentially. Each lifting component includes a lifting drive and a pin. The lifting drive is installed below the top plate. The pin is connected to the output end of the lifting drive and can penetrate the top plate and the chuck under the drive of the lifting drive. The pins of the multiple sets of lifting components are used to engage the edge of the wafer to achieve initial positioning.

[0025] The technical solution provided by this invention has the following advantages compared with the prior art:

[0026] The high-precision wafer alignment device provided by this invention, on the one hand, identifies the markings of the upper and lower wafers through a vision mechanism, and performs fine-tuning of the chuck position through a leveling component, an XYZ three-axis platform, and a rotary platform, thereby achieving positional calibration between the lower and upper wafers and ensuring alignment accuracy. On the other hand, after visual alignment, the XYZ three-axis platform drives the lower wafer, chuck, and adjustment platform to rise as a whole, so that the lower wafer contacts the upper wafer. Then, a second drive component with a corresponding notch actuates the preload rod to complete the clamping and fixing of the upper and lower wafers. Throughout the process, the wafers do not need to detach from their original adsorption surface, avoiding the decrease in accuracy caused by removal, transfer, and placement. The combination of these two aspects ensures that the device guarantees the accuracy of the upper and lower wafers when they are finally fixed, thus meeting process requirements. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 shows a schematic diagram of the high-precision wafer alignment device in an embodiment of the present invention;

[0030] Figure 2 shows a schematic diagram of the vision mechanism in an embodiment of the present invention;

[0031] Figure 3 shows a schematic diagram of the adsorption platform in an embodiment of the present invention;

[0032] Figure 4 shows a schematic diagram of the adjustment platform in an embodiment of the present invention;

[0033] Figure 5 shows a schematic diagram of the structure of the first group of leveling components in an embodiment of the present invention;

[0034] Figure 6 shows a schematic diagram of the structure of the second set of leveling components in an embodiment of the present invention;

[0035] Figure 7 shows a schematic diagram of the structure of the top plate and auxiliary components in an embodiment of the present invention;

[0036] Figure 8 shows a structural schematic diagram of the base plate and auxiliary components in an embodiment of the present invention;

[0037] Figure 9 shows a schematic diagram of the structure of the chuck adapted to the high-precision wafer alignment device in an embodiment of the present invention.

[0038] In the picture:

[0039] 1. Frame; 11. Base; 111. Base frame; 112. Marble slab; 113. Shock-absorbing pad; 12. Gantry frame; 2. Vision mechanism; 21. Moving plate; 22. Vision camera; 23. Edge-extending camera; 3. Adsorption platform; 31. Notch; 32. Detection port; 4. XYZ three-axis platform; 5. Rotary platform; 6. Adjustment platform; 61. Base plate; 62. Top plate; 63. Leveling assembly; 631. Fixing base; 63 2. Sliding block; 633. Lifting block; 634. Connecting rod; 635. First crossed roller guide rail; 636. Second crossed roller guide rail; 64. Negative pressure connecting assembly; 65. First drive assembly; 651. Telescopic cylinder; 652. Lever; 66. Second drive assembly; 661. Lifting and rotating combination drive pair; 662. Claw; 67. Lifting assembly; 671. Lifting drive component; 672. Ejector pin; 68. Support plate;

[0040] 100. Inner disc body; 200. Outer ring frame; 300. Partition assembly; 400. Pre-compression assembly. Detailed Implementation

[0041] To better understand the above-mentioned objectives, features, and advantages of the present invention, the solutions of the present invention will be further described below. It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other.

[0042] In this description, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. It should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0043] Many specific details are set forth in the following description in order to provide a full understanding of the invention, but the invention may also be practiced in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of the invention, and not all embodiments.

[0044] The specific embodiments of the present invention will now be described in detail with reference to Figures 1 to 9.

[0045] This embodiment provides a high-precision wafer alignment device, including a frame 1, a vision mechanism 2, an adsorption stage 3, an XYZ three-axis platform 4, a rotary platform 5, and an adjustment platform 6.

[0046] The frame 1 includes a base 11 and a gantry 12, with the gantry 12 fixed to the base 11.

[0047] Specifically, in this embodiment, the base 11 includes a base frame 111, a marble slab 112, and a shock-absorbing pad 113. The marble slab 112 is fixed to the base frame 111 by the shock-absorbing pad 113. The marble slab 112 has good flatness, and the shock-absorbing pad 113 can improve the buffering capacity of the device. In other embodiments, the base 11 may also adopt a box-shaped structure, etc.

[0048] The vision mechanism 2 is installed above the crossbeam of the gantry 12, and the adsorption platform 3 is fixed below the crossbeam of the gantry 12. The lower surface of the adsorption platform 3 is used for vacuum adsorption of the wafer, and the adsorption platform 3 is provided with a notch 31 for visual alignment.

[0049] Specifically, in this embodiment, the adsorption stage 3 has two notches 31 distributed at 180°. The vision mechanism 2 includes two sets of vision components. Each vision component includes a movable plate 21 and a vision camera 22. The movable plate 21 is mounted above the crossbeam of the gantry 12 and is driven to move along the line connecting the two notches 31. The vision camera 22 is mounted on the movable plate 21 and is driven to rise and fall. The movable plate 21 and the vision camera 22 can be driven by linear power components such as a linear slide. By sliding the movable plate 21, the vision camera 22 can be moved to different positions to adapt to wafers with different marking positions. The cooperation of the two sets of vision components can improve the accuracy of vision alignment. In other embodiments, one or three sets of vision components may also be provided.

[0050] Furthermore, the vision mechanism 2 also includes edge cameras 23. Three sets of edge cameras 23 are provided, with two sets mounted on two movable plates 21 and collinear with the vision cameras 22 of the two vision components. The remaining set of edge cameras 23 is mounted on the crossbeam of the gantry 12, and the adsorption platform 3 has a detection port 32 corresponding to the edge camera 23. Each set of edge cameras 23 is driven to move up and down. The edge cameras 23 can be driven by linear motion components such as linear slides. The position of the remaining set of edge cameras 23 is not limited, but it is preferably installed in the middle of the vision cameras 22 of the two vision components. The three sets of edge cameras 23 can detect the edges of the wafer, and in conjunction with the vision cameras 22, the detection accuracy can be improved.

[0051] It should be noted that the adsorption platform 3 in Figure 3 has two notches 31 and two detection ports 32. A vision component is installed at each of the two notches 31, and only one detection port 32 is equipped with an edge camera 23.

[0052] Specifically, in this embodiment, the adsorption platform 3 is a microporous ceramic adsorption plate, which has advantages such as high flatness and high cleanliness. In other embodiments, the adsorption platform 3 may also be a metal suction cup, etc.

[0053] The XYZ three-axis platform 4 is mounted on the base 11 and located inside the gantry 12.

[0054] It is easy to understand that the XYZ three-axis platform 4 is a mature structure in this field, so it will not be elaborated here.

[0055] The rotating platform 5 is mounted on the XYZ three-axis platform 4 and the rotation axis is arranged along the Z direction.

[0056] Specifically, the structure of the rotating platform 5 is not limited. For example, the rotating platform 5 in this embodiment is an air-floating rotating structure, which has low friction and high precision.

[0057] The adjustment platform 6 includes a base plate 61, a top plate 62, and a leveling assembly 63. The base plate 61 is fixed on the rotating platform 5. The leveling assembly 63 is connected between the base plate 61 and the top plate 62 and is distributed in multiple sets at intervals along the circumference. The top plate 62 is used to absorb the chuck. The top plate 62 is also provided with a negative pressure connection assembly 64 for docking with the negative pressure channel of the chuck. The base plate 61 is also provided with a first drive assembly 65 for moving the chuck partition and a second drive assembly 66 for moving the chuck preload rod. The second drive assembly 66 is arranged corresponding to the notch 31.

[0058] Specifically, the leveling component 63 in this embodiment includes a fixed base 631, a sliding block 632, a lifting block 633, and a connecting rod 634. The fixed base 631 is fixed to the base plate 61. The sliding block 632 is mounted on the fixed base 631 and is driven to move horizontally. The lifting block 633 is mounted on the fixed base 631 and can move freely up and down. The lifting block 633 and the sliding block 632 are slidably connected by a wedge structure so that the lifting block 633 moves up and down when the sliding block 632 moves horizontally. The bottom end of the connecting rod 634 is fixedly connected to the lifting block 633, and the top end is movably connected to the top plate 62. The sliding block 632 can be driven by a linear slide or other linear power component. The lifting block 633 can move freely up and down through a guide rail pair, a column sleeve pair, or other commonly used guide pairs. During operation, the horizontal movement of the sliding block 632 is converted into the lifting of the lifting block 633 through the wedge structure, thereby adjusting the height of the top plate 62.

[0059] More specifically, the bottom of the sliding block 632 is connected to the fixed seat 631 via a first crossed roller guide 635, and the top of the sliding block 632 is connected to the lifting block 633 via a second crossed roller guide 636. The second crossed roller guide 636 is arranged at an angle to form a wedge-shaped structure. The crossed roller guide has the advantages of low friction and high precision. In other embodiments, a guide rail pair can also be used to connect the sliding block 632 to the fixed seat 631, or a wedge-shaped structure can be formed by the cooperation of an inclined guide groove and a sliding rod.

[0060] Specifically, in this embodiment, the leveling components 63 are provided in two sets distributed at 180°. The first set of leveling components 63 includes two sets of leveling components 63, and the top end of the connecting rod 634 of the first set of leveling components 63 is movably connected to the top plate 62 through a ball-and-V-groove fitting structure. The second set of leveling components 63 includes one set of leveling components 63, and the top end of the connecting rod 634 of the second set of leveling components 63 is movably connected to the top plate 62 through a ball-and-joint structure. Since the top plate 62 will not only shift vertically but also horizontally during the leveling process, this embodiment sets the leveling components 63 in two sets arranged opposite to each other: one set adopts a ball-and-V-groove fitting structure, which can simultaneously compensate for vertical and horizontal shifts; the other set adopts a ball-and-joint structure to ensure that the position of the top plate 62 does not shift significantly, and can also compensate for the angle changes of the top plate 62 during the leveling process.

[0061] Specifically, the structure of the negative pressure connection component 64 is not limited. For example, in this embodiment, the negative pressure connection component 64 adopts an elastic structure so that it can abut against the negative pressure channel of the chuck with a certain elastic force, thereby ensuring a sealed connection.

[0062] The first drive assembly 65 and the second drive assembly 66 need to be designed according to the configured chuck structure, which should be easy for those skilled in the art to design.

[0063] For example, the chuck structure configured in the high-precision wafer alignment device of this embodiment is shown in Figure 9. The chuck includes an inner disk body 100 and an outer ring frame 200. The chuck is provided with a spacer assembly 300 and a pre-pressing assembly 400. The spacers of the spacer assembly 300 have a working state above the inner disk body 100 and a clearance state away from the inner disk body 100 by being pulled. The pre-pressing rod of the pre-pressing assembly 400 has a pre-pressing state above the inner disk body 100 and a storage state placed in the outer ring frame 200 by being raised, lowered and rotated.

[0064] Therefore, the first drive assembly 65 in this embodiment is designed as a combination of a telescopic cylinder 651 and a lever 652. The telescopic cylinder 651 is arranged horizontally, and the lever 652 is driven to move horizontally by the telescopic cylinder 651, and the lever 652 pulls the partition. The second drive assembly 66 is designed as a combination of a lifting and rotating combined drive pair 661 and a chuck 662. The lifting and rotating combined drive pair 661 drives the chuck 662 to lift and rotate, and the chuck 662 drives the pre-compression assembly 400 to lift and rotate.

[0065] It should be noted that multiple support plates 68 are provided between the base plate 61 and the top plate 62. A clearance is provided between the support plates 68 and the top plate 62 to compensate for any positional shift of the top plate 62 during leveling. The support plates 68 are mainly used to support the top plate 62 and its associated structures when not in operation.

[0066] Furthermore, the top plate 62 is also equipped with lifting components 67, with multiple sets of lifting components 67 distributed circumferentially. Each lifting component 67 includes a lifting drive 671 and ejector pins 672. The lifting drive 671 is installed below the top plate 62, and the ejector pins 672 are connected to the output end of the lifting drive 671 and, driven by the lifting drive 671, can penetrate the top plate 62 and the chuck. The ejector pins 672 of the multiple lifting components 67 are used to engage the edge of the lower wafer for initial positioning. The lifting components 67 can be made using linear power components such as cylinders. After the robotic arm picks up the lower wafer, it is first placed between multiple ejector pins 672, so that the edge of the wafer is simultaneously engaged within multiple ejector pins 672, thus achieving initial positioning. Subsequently, the lifting drive 671 drives the ejector pins 672 and the lower wafer to descend as a whole until the lower wafer falls onto the chuck. This improves the positional accuracy of the lower wafer and avoids large errors.

[0067] The working principle of the high-precision wafer alignment device in this embodiment is as follows:

[0068] 1) The robotic arm transfers the chuck to the top plate 62, and the chuck is fixed to the top plate 62 by negative pressure adsorption;

[0069] 2) The robotic arm transfers the upper wafer to the adsorption platform 3, and the upper wafer is fixed to the lower surface of the adsorption platform 3 by negative pressure adsorption;

[0070] 3) The lifting drive 671 drives the ejector pin 672 to extend, and the robot transfers the lower wafer to the ejector pin 672. The edge of the lower wafer is engaged with the inside of multiple ejector pins 672.

[0071] 4) The lifting drive 671 drives the ejector pin 672 to retract, and the lower wafer falls onto the chuck and is fixed by negative pressure adsorption;

[0072] 5) Vision unit 2 detects the markings on the upper and lower wafers and obtains the position difference signal;

[0073] 6) The leveling component 63, the XYZ three-axis platform 4, and the rotary platform 5 work together according to the position difference signal to make micro-adjustments to the lower wafer until the lower wafer and the upper wafer are aligned.

[0074] 7) The first drive component 65 drives the partition to move, causing the partition to switch to the working state;

[0075] 8) The XYZ three-axis platform 4 drives the rotary platform 5, the adjustment platform 6, the chuck, and the lower wafer to move upward as a whole until the lower wafer contacts the upper wafer;

[0076] 9) The second drive component 66 drives the preload rod to move, causing the preload rod to switch to the preload state;

[0077] 10) When the negative pressure of the adsorption platform 3 fails, the XYZ three-axis platform 4 descends, the negative pressure of the top plate 62 fails, and the robot arm transfers the chuck, upper wafer and lower wafer as a whole to the next process.

[0078] The above are merely specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Although detailed descriptions have been provided with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments, and they should all be covered within the protection scope of the claims.

Claims

1. A high-precision wafer alignment device, characterized in that, include: A frame (1) includes a base (11) and a gantry (12), the gantry (12) being fixed to the base (11); a vision mechanism (2) mounted above the crossbeam of the gantry (12); an adsorption platform (3) fixed below the crossbeam of the gantry (12), the lower surface of the adsorption platform (3) being used for vacuum adsorption of wafers, and the adsorption platform (3) having a notch (31) for visual alignment; an XYZ three-axis platform (4) mounted on the base (11) and located inside the gantry (12); and a rotating platform (5) mounted on the XYZ three-axis platform (4) with its rotation axis arranged along the Z direction. The adjustment platform (6) includes a base plate (61), a top plate (62), and a leveling assembly (63). The base plate (61) is fixed on the rotating platform (5). The leveling assembly (63) is connected between the base plate (61) and the top plate (62) and is distributed in multiple sets at intervals along the circumference. The top plate (62) is used to adsorb the chuck. The top plate (62) is also provided with a negative pressure connection assembly (64) for docking with the negative pressure channel of the chuck. The base plate (61) is also provided with a first drive assembly (65) for moving the chuck partition and a second drive assembly (66) for moving the chuck preload rod. The second drive assembly (66) is arranged corresponding to the notch (31).

2. The high-precision wafer alignment device according to claim 1, characterized in that, The base (11) includes a base frame (111), a marble slab (112), and a shock-absorbing pad (113), wherein the marble slab (112) is fixed to the base frame (111) by the shock-absorbing pad (113).

3. The high-precision wafer alignment device according to claim 1, characterized in that, The adsorption platform (3) has two notches (31) distributed at 180°. The vision mechanism (2) includes two sets of vision components. Each set of vision components includes a moving plate (21) and a vision camera (22). The moving plate (21) is installed above the crossbeam of the gantry frame (12) and is driven to move along the line connecting the two notches (31). The vision camera (22) is installed on the moving plate (21) and is driven to rise and fall.

4. The high-precision wafer alignment device according to claim 3, characterized in that, The vision mechanism (2) also includes an edge camera (23), which has three sets. Two of the edge cameras (23) are installed on two moving plates (21) and are collinear with the vision cameras (22) of the two vision components. The remaining edge camera (23) is installed on the crossbeam of the gantry (12) and the adsorption platform (3) has a detection port (32) for the edge camera (23). Each edge camera (23) is driven to rise and fall.

5. The high-precision wafer alignment device according to claim 1, characterized in that, The adsorption platform (3) is a microporous ceramic adsorption plate.

6. The high-precision wafer alignment device according to claim 1, characterized in that, The leveling assembly (63) includes: a fixed base (631) fixed on the base plate (61); a sliding block (632) mounted on the fixed base (631) and driven to move horizontally; a lifting block (633) mounted on the fixed base (631) and capable of free lifting and lowering, wherein the lifting block (633) and the sliding block (632) are slidably connected by a wedge structure to drive the lifting block (633) to lift and lower when the sliding block (632) moves horizontally; and a connecting rod (634) whose bottom end is fixedly connected to the lifting block (633) and whose top end is movably connected to the top plate (62).

7. The high-precision wafer alignment device according to claim 6, characterized in that, The bottom of the sliding block (632) is connected to the fixed seat (631) via the first cross roller guide (635), and the top of the sliding block (632) is connected to the lifting block (633) via the second cross roller guide (636). The second cross roller guide (636) is arranged at an angle to form the wedge structure.

8. The high-precision wafer alignment apparatus according to claim 6 or 7, characterized in that, The leveling assembly (63) is provided with two sets distributed at 180°. The first set of leveling assemblies (63) includes two sets of leveling assemblies (63), and the top end of the connecting rod (634) of the first set of leveling assemblies (63) is movably connected to the top plate (62) through a ball and V-groove fitting structure. The second set of leveling assemblies (63) includes one set of leveling assemblies (63), and the top end of the connecting rod (634) of the second set of leveling assemblies (63) is movably connected to the top plate (62) through a ball joint structure.

9. The high-precision wafer alignment device according to claim 1, characterized in that, The top plate (62) is also provided with lifting components (67), and multiple sets of lifting components (67) are distributed circumferentially. Each lifting component (67) includes a lifting drive (671) and a pin (672). The lifting drive (671) is installed below the top plate (62), and the pin (672) is connected to the output end of the lifting drive (671) and can penetrate the top plate (62) and the chuck under the drive of the lifting drive (671). The pins (672) of the multiple sets of lifting components (67) are used to engage the edge of the wafer to achieve initial positioning.

Images