Clamping tool for processing semiconductor device

Abstract

The invention relates to the technical field of clamping tools, in particular to a semiconductor device processing clamping tool which comprises a working table and a circular truncated cone, the circular truncated cone is arranged at the circle center of the working table, a wafer is placed on the circular truncated cone, the semiconductor device processing clamping tool further comprises a plurality of sliding plates, the sliding plates are annularly and synchronously arranged on the working table in a sliding mode, and the circular truncated cone is arranged on the working table. A bottom support and a clamping assembly are arranged at the inner end of the sliding plate, the bottom support and the upper surface of the circular truncated cone are coplanar, and the clamping assembly is arranged above the sliding plate in a sliding mode and comprises a fixing shaft arranged in a shaft frame; through cooperation of the clamping assembly and the negative pressure assembly, positioning consistency and low damage are both considered when wafers of different specifications are clamped, meanwhile, the supporting ring is arranged in the assembling groove in a flush falling-back and liftable mode, extra annular bearing and attachment can be provided when the supporting span is increased, interference with radial moving parts is avoided, and the clamping efficiency is improved. Therefore, the posture stability, adsorption stability and overall reliability of the sheet are improved, and pollution and maintenance burdens are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of clamping tooling, in particular to a semiconductor device processing clamping tooling. BACKGROUND

[0002] In the process of semiconductor manufacturing and testing, wafer workpieces often need to complete operations such as alignment, detection, temporary storage, light touch measurement and laser marking on a workbench. Existing clamping methods include vacuum adsorption chucks, mechanical edge clamping fixtures and their combination solutions.

[0003] A vacuum adsorption chuck relies on the formation of a certain sealing condition between the back surface of the workpiece and the adsorption surface. However, when the workpiece back surface has grinding lines, a large roughness, warping or attached micro-particles, air leakage channels are easily formed, resulting in slow establishment of negative pressure, insufficient adsorption force or fluctuation of the adsorption state. Although mechanical edge clamping can reduce large-area contact with the back surface, relative slippage may occur during clamping, the contact site may be too hard, or the edge may be stressed concentrated, which can easily cause edge scratches, edge collapse or micro-cracks. The thinner the sheet, the more brittle the material, and the more easily such defects can expand under subsequent handling, thermal cycling or assembly stress.

[0004] In addition, in order to adapt to workpieces of different diameters, existing fixtures often need to be replaced or the clamping points need to be adjusted repeatedly, which affects the changeover efficiency and positioning consistency. In the case of ultra-thin wafers or low-stiffness sheets, the clamping point moves outward or is not adequately supported, which can increase the suspended span between the center and the edge, causing deflection, vibration and attitude fluctuation, and thus affecting the alignment accuracy and measurement consistency. SUMMARY

[0005] The purpose of the present application is to solve the problem of poor positioning and clamping effect of wafers in the prior art, and to provide a semiconductor device processing clamping tooling.

[0006] To achieve the above purpose, the technical scheme adopted by the present application is as follows: a semiconductor device processing clamping tooling, comprising a workbench and a circular table, the circular table is arranged at the center of the workbench, the circular table is used to place a wafer, and further comprising:

[0007] A plurality of sliding plates are arranged in a ring shape and slide synchronously above the workbench. The inner end of the sliding plate is provided with a bottom support coplanar with the upper surface of the circular table.

[0008] A clamping assembly is slidably arranged above the sliding plate. The clamping assembly comprises a fixed shaft arranged in a shaft support. An end face chamfered upper wheel and a lower wheel are rotatably arranged on the fixed shaft. The upper wheel is connected to the shaft support by a spring.

[0009] A negative pressure assembly is arranged inside the workbench, which comprises a supporting ring and a second cylinder, the supporting ring is driven by the second cylinder to move up and down above the workbench at the outer ring of the circular table, the upper surface of the supporting ring is coplanar with the upper surface of the workbench and located in the reserved gap below the sliding plate when the supporting ring falls back, the supporting ring and the circular table above are respectively provided with a first air groove and a second air groove, and the first air groove and the second air groove are communicated with an external fan.

[0010] Specifically, a plurality of sliding grooves are arranged in a ring shape above the workbench, and the sliding plate is arranged in the sliding groove through a sliding block below the sliding plate.

[0011] Preferably, the sliding grooves extend along the radial direction and are distributed in the circumferential direction, so that the sliding plate obtains a clear radial guide track, and the cooperation of the sliding block and the sliding groove can reduce the deflection of the sliding plate during movement and improve the position consistency of the plurality of sliding plates.

[0012] Specifically, a back plate is arranged above the sliding plate, the back plate is provided with a sliding frame through a first cylinder, the sliding frame is rotatably provided with a connecting frame at both ends, and the connecting frame is rotatably connected with the end faces of adjacent two shaft frames at both ends.

[0013] Preferably, the back plate provides an installation reference for the clamping assembly, so that the clamping movement and the supporting structure are arranged in layers, the sliding frame drives the whole movement of the connecting frame under the driving of the first cylinder, the rotating connection of the connecting frame and the shaft frame can reduce the transmission of assembly errors, and a plurality of shaft frames can form a continuous clamping unit in the circumferential direction, thereby improving the uniformity of edge contact.

[0014] Specifically, the chamfered ends of the upper wheel and the lower wheel arranged opposite to each other are chamfered, and the upper wheel and the lower wheel are arranged opposite to each other at one end for limiting the edge of the wafer.

[0015] Preferably, the chamfered end faces of the upper wheel and the lower wheel match the chamfered area of the wafer edge, so as to reduce the contact stress concentration, and the wafer edge is located in the clamping gap between the upper wheel and the lower wheel, thereby forming a geometric constraint in the up-down direction.

[0016] Specifically, an assembly groove is arranged above the workbench, the supporting ring is located in the assembly groove, a telescopic shaft is arranged in the workbench, a plurality of telescopic shafts and second cylinders are arranged inside the workbench below the assembly groove, and the telescopic shafts and the second cylinders are arranged in a spaced manner.

[0017] Preferably, the assembly groove is used for accommodating the supporting ring, so that the supporting ring can be flush with the surface of the workbench when it falls back and keep the appearance neat, and a plurality of telescopic shafts support the supporting ring in the circumferential direction, which is conducive to the parallelism control of the supporting ring during lifting.

[0018] Specifically, the supporting ring is provided in multiple groups, and the multiple groups of supporting rings are arranged in a concentric ring structure.

[0019] Preferably, multiple sets of concentric supporting rings are adapted to different diameters or different supporting area requirements, each supporting ring can be arranged in different assembly slots or partitioned positions in the same assembly slot, and the number and spacing of the supporting ring sets can be selected according to the sheet stiffness and the allowable contact area;

[0020] Specifically, the workbench is internally provided with an annular pipe in communication with the air inlet end of an external fan, a first branch pipe and a second branch pipe are respectively arranged in communication on the annular pipe, the first branch pipe is arranged in the telescopic shaft, and the second branch pipe is arranged in the circular table.

[0021] Preferably, the annular pipe serves as a circumferential main pipe, the gas supply and extraction path is more evenly distributed in the circumferential direction, the first branch pipe is arranged in the telescopic shaft, the pipeline communication can be maintained during the lifting of the supporting ring, and the interference of the exposed hose is avoided.

[0022] The supporting ring is internally provided with a hollow structure, the first branch pipe is in communication with the first gas groove through the inside of the supporting ring, the upper end of the second branch pipe is in communication with the second gas groove, and sealing lips are respectively arranged on the inner walls of the first gas groove and the second gas groove.

[0023] Preferably, the hollow structure of the supporting ring can serve as a gas distribution cavity, the first gas groove can obtain a more uniform gas extraction channel, the sealing lips are arranged on the edges of the gas groove openings, a continuous sealing boundary can be formed, and the length of the gas leakage path is reduced, and the first gas groove and the second gas groove can respectively correspond to the supporting ring area and the central circular table area to form a partitioned adsorption surface.

[0024] Specifically, multiple sliding plates are driven by a linkage mechanism, the linkage mechanism comprises a rotating ring, a gear and a motor, the rotating ring is rotationally arranged below the circular table, a gear ring is arranged below the inner ring of the rotating ring, the motor and the gear are arranged inside the workbench, the side wall of the gear is in meshing connection with the gear ring, the gear is in linkage connection with the output end of the motor, and the outer side of the rotating ring is in linkage connection with the sliding block through an arc-shaped piece.

[0025] Preferably, the motor is driven to rotate the gear, and then drive the gear ring and the rotating ring to rotate, and then drive the arc-shaped piece to move.

[0026] Specifically, a second hinge block is arranged below the sliding block, a plurality of first hinge blocks are arranged on the outer side of the rotating ring, the arc-shaped piece is in the form of an arc structure and is hingedly connected to the second hinge block and the first hinge block at both ends.

[0027] Preferably, the first hinge block and the second hinge block provide a rotating connection point, so that the arc-shaped piece is allowed to swing in an angle during movement to adapt to the linear motion track of the sliding block, and the arc-shaped piece adopts an arc structure so that multiple connecting rods can be arranged in the circumferential space without interfering with each other.

[0028] Compared with the prior art, the present application has the following beneficial effects:

[0029] The present application is supported by the coplanar support of the circular table and the multi-sliding plate bottom support, and the linkage mechanism drives the radial adjustment of the multiple sliding plates in a ring shape, so that the clamping point remains circumferentially symmetrical and positioning consistent with the change of the wafer diameter, avoiding the low efficiency and poor repeated positioning caused by the frequent replacement of jigs or repeated adjustment in the prior art when switching different specifications of workpieces. Meanwhile, the upper wheel and lower wheel type clamping assembly is arranged in the circumferential direction to form stable geometric constraints on the edge of the wafer, and the small differences in thickness and edge chamfer can be absorbed by the spring pre-tightening, thereby reducing the risk of edge scratching, edge collapse and stress concentration caused by uncontrollable clamping force or poor contact form, thereby improving the reliability and yield of wafer clamping.

[0030] The present application sets up air grooves on the circular table and the support ring respectively, and forms a partitioned air extraction channel through the annular pipe and the branch pipe, and sets up a sealing lip at the air groove opening, so that the back surface of the wafer can still form a relatively stable sealing boundary and air extraction adhesion condition even in the case of roughness, grinding lines or local air leakage channels, thereby reducing the problems of slow negative pressure establishment and adsorption force fluctuation caused by the sensitivity of the traditional vacuum chuck to the back surface state. The support ring is hollow inside and communicates with the branch pipe, which is conducive to the uniform distribution of air extraction in the circumferential direction, reduces the attitude disturbance caused by local adsorption unevenness, and improves the attitude stability and repeat accuracy in the alignment, detection and light load processing processes.

[0031] The support ring of the present application is arranged in the assembly groove and has a liftable structure, which is flush with the surface of the workbench and located below the sliding plate when falling back, and when the wafer diameter is large or the support span is increased, an additional annular support can be formed by lifting the support ring, thereby shortening the suspended span and suppressing deflection and vibration. This way takes into account the compact structure and convenient maintenance, reduces the pollution accumulation and cleaning difficulty caused by the exposure of the support structure, and improves the system reliability and long-term stability. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is a perspective view of the present application.

[0033] Figure 2 It is a perspective view of the present application.

[0034] Figure 3 It is a cross-sectional view of the workbench of the present application.

[0035] Figure 4 It is a bottom view of the sliding plate and negative pressure assembly of the present application.

[0036] Figure 5 It is a position diagram of the circular table and negative pressure assembly of the present application.

[0037] Figure 6 It is a structure diagram of the rotating ring of the present application.

[0038] Figure 7 It is a structure diagram of the clamping assembly of the present application.

[0039] Figure 8 Figure is a schematic diagram of the shaft structure of the present application.

[0040] In the figure: 1, workbench; 2, wafer; 3, round table; 411, sliding plate; 412, sliding block; 413, sliding groove; 421, bottom support; 431, sliding frame; 432, connecting frame; 433, shaft frame; 434, fixed shaft; 435, upper wheel; 436, lower wheel; 437, spring; 44, first air cylinder; 45, back plate; 511, ring support; 512, telescopic shaft; 513, second air cylinder; 514, assembly groove; 521, annular pipe; 522, first branch pipe; 523, second branch pipe; 524, first air groove; 525, second air groove; 526, sealing lip; 611, rotating ring; 612, gear; 613, tooth ring; 614, motor; 621, first hinged block; 622, second hinged block; 623, arc-shaped piece. DETAILED DESCRIPTION

[0041] The following description is provided to enable those skilled in the art to practice the present application. The preferred embodiments described herein are only examples of the present application and various modifications can be made by those skilled in the art.

[0042] As Figures 1 to 8 shown in a semiconductor device processing clamping tool, comprising a workbench 1 and a round table 3, the round table 3 is arranged at the center of the workbench 1, and the round table 3 is used to place a wafer 2, further comprising:

[0043] A sliding plate 411 is arranged above the workbench 1, and the sliding plate 411 is annular and synchronously slides, and the inner end of the sliding plate 411 is arranged with a bottom support 421 which is coplanar with the upper surface of the round table 3;

[0044] A clamping assembly is arranged above the sliding plate 411, and the clamping assembly comprises a fixed shaft 434 arranged in a shaft frame 433, an upper wheel 435 and a lower wheel 436 with chamfered end faces are arranged on the fixed shaft 434, and the upper wheel 435 is connected with the shaft frame 433 through a spring 437 arranged above the upper wheel 435;

[0045] A negative pressure assembly is arranged inside the workbench 1, and the negative pressure assembly comprises a ring support 511 and a second air cylinder 513, the ring support 511 is driven by the second air cylinder 513 to move up and down above the workbench 1 at the outer ring of the round table 3, when the ring support 511 falls back, the upper surface is coplanar with the upper surface of the workbench 1 and located in the reserved gap below the sliding plate 411, the ring support 511 and the round table 3 are respectively provided with a first air groove 524 and a second air groove 525 arranged above them, and the first air groove 524 and the second air groove 525 are communicated with an external air blower;

[0046] The circular table 3 is arranged at the center of the workbench 1, so that the center area of the wafer 2 is first supported as a reference, and the plurality of sliding plates 411 are arranged in a ring shape, and the bottom support is coplanar with the upper surface of the circular table 3, so that the edge area of the wafer is synchronously supported, and the unstable posture caused by the high center and low edge or the local suspension is avoided;

[0047] The clamping assembly adopts the upper wheel 435 and the lower wheel 436 to form an edge clamping gap, the upper wheel is elastically deflected through the spring 437, and the clamping assembly can automatically compensate when there is a slight difference in the thickness or the chamfer size of the wafer, so as to reduce the risk of scratching and edge collapse caused by hard clamping;

[0048] In addition, the supporting ring 511 in the negative pressure assembly can be lifted and lowered and fall in line, and is below the sliding plate 411 and leaves a gap, so that the radial movement of the sliding plate 411 is not interfered by the supporting ring;

[0049] Meanwhile, the first air groove 524 and the second air groove 525 are in communication with the external fan, so as to form a local negative pressure fit on the back of the wafer and improve the clamping stability;

[0050] A plurality of sliding grooves 413 are arranged in a ring shape above the workbench 1, and the sliding plate 411 is slidably arranged in the sliding groove 413 through the sliding block 412;

[0051] The sliding grooves 413 are arranged in a ring shape along the circumference of the workbench, and the extension direction of each sliding groove 413 is radial, so that the sliding plate 411 can stably move in the radial direction;

[0052] In addition, the sliding plate 411 is provided with a back plate 45, the back plate 45 is provided with a sliding frame 431 through a first air cylinder 44, the sliding frame 431 is rotatably provided with a connecting frame 432 at both ends, and the connecting frame 432 is rotatably connected with the end faces of adjacent two shaft frames 433;

[0053] The back plate 45 is arranged above the sliding plate 411, and can be used as a mounting base and a movement guide reference of the clamping assembly, so that the stress of the clamping assembly and the supporting stress of the sliding plate are layered and arranged, the mutual interference is reduced, and the first air cylinder 44 and the sliding frame 431 constitute a linear driving unit;

[0054] The sliding frame 431 is displaced under the driving and drives the connecting frame 432 to move, the connecting frame 432 and the adjacent shaft frame 433 are rotatably connected, a plurality of shaft frames 433 form a clamping unit that can be adjusted in shape, and a plurality of shaft frames 433 are well adapted to the edges of wafers 2 with different diameters;

[0055] The upper wheel 435 and the lower wheel 436 are arranged at one end of the opposite edges in a chamfered manner, and the upper wheel 435 and the lower wheel 436 are arranged at one end of the opposite edges for limiting the edge of the wafer 2;

[0056] The upper wheel and the lower wheel opposite end face are provided with chamfer or arc transition, which can form more conformal contact with the edge chamfer area of the wafer, so as to change the linear angular contact into relatively flat surface contact or arc surface contact, reduce stress concentration, and the wafer edge is located in the clamping gap formed between the upper wheel and the lower wheel, and the edge is spatially constrained by gap size control;

[0057] The gap can be designed according to the wafer thickness and chamfer size, and can be matched with the upper wheel spring to realize certain tolerance absorption;

[0058] In addition, an assembly groove 514 is formed above the workbench 1, the supporting ring 511 is located in the assembly groove 514, the workbench 1 is provided with telescopic shafts 512, the telescopic shafts 512 and the second cylinders 513 are provided with multiple and located inside the workbench 1 below the assembly groove 514, and the telescopic shafts 512 and the second cylinders 513 are arranged in a spaced manner;

[0059] The assembly groove 514 is used for accommodating the supporting ring 511, so that the supporting ring 511 can be hidden in the internal space of the workbench 1 in the falling state and flush with the upper surface of the workbench, so as to not affect the movement path and supporting plane of the sliding plate 411, and the telescopic shafts and the second cylinders arranged below the supporting ring serve as lifting driving mechanisms and can lift the supporting ring to a position close to the back surface of the wafer when needed, forming an additional annular supporting and adsorbing area;

[0060] The circumferential distribution of the multiple telescopic shafts 512 can improve the parallelism and stress uniformity during the lifting of the supporting ring 511, so as to avoid the inclination of the supporting ring 511 caused by single-point lifting, thereby reducing the risk of local hard lifting of the back surface of the wafer;

[0061] In addition, the supporting ring 511 is provided with multiple groups, and the multiple groups of the supporting ring 511 are arranged in a concentric ring structure.

[0062] The multiple groups of concentric supporting rings 511 are arranged, so that the tooling can cover a wider range of wafer diameters or support radius requirements, and the supporting rings with different radii can be located at different radial positions. When clamping wafers with different diameters or when the position change of the sliding plate 411 causes the center and edge support span to increase, one or more groups of supporting rings are selectively lifted to expand the wafer back surface support from a single ring to multiple concentric rings, thereby shortening the maximum suspended span and improving the overall rigidity;

[0063] In addition, the multiple groups of supporting rings 511 can also form a partitioned adsorption surface, which is convenient for maintaining the stable adhesion of some areas when the back surface is rough or there are local air leakage channels;

[0064] Furthermore, the workbench 1 is internally provided with an annular pipe 521 which is in communication with the air inlet end of an external fan, and the annular pipe 521 is respectively provided with a first branch pipe 522 and a second branch pipe 523 in communication, the first branch pipe 522 is arranged in the telescopic shaft 512, and the second branch pipe 523 is located in the circular table 3;

[0065] The annular pipe 521 is arranged in the circumferential direction inside the workbench and can be used as a main pipeline for negative pressure or air extraction, the first branch pipe 522 and the second branch pipe 523 are respectively branched from the annular pipe 521 and constitute branch connections for the air grooves of the supporting ring and the circular table, the first branch pipe 522 is arranged in the telescopic shaft 512, so that the supporting ring 511 still maintains continuous air path communication during lifting, and the risk of winding, bending or pollution caused by exposed flexible pipes is avoided, and the structure generally requires that the telescopic shaft is hollow or provided with an axial through hole, so that the gas passage is synchronously telescoped with the lifting mechanism;

[0066] The supporting ring 511 is internally hollow, the first branch pipe 522 is in communication with the first air groove 524 through the inside of the supporting ring 511, the upper end of the second branch pipe 523 is in communication with the second air groove 525, and the inner wall edges of the first air groove 524 and the second air groove 525 are respectively provided with sealing lips 526;

[0067] The hollow structure in the supporting ring 511 can be used as a gas buffer cavity or a distribution cavity, the first branch pipe 522 enters the hollow cavity and then communicates with the first air groove on the upper surface of the supporting ring 511 through the cavity, so that the air extraction is more uniform in the circumferential direction, and local uneven adsorption caused by single-point air extraction is reduced;

[0068] The sealing lips 526 are arranged at the edges of the grooves of the first air groove 524 and the second air groove 525, can form a more stable sealing boundary when the back surface of the wafer is in contact with the air groove, reduce air leakage caused by the rough back surface, grinding lines or micro-particles, and the sealing lips 526 can be annular flanges, lip-shaped rings or elastic sealing structures, the height and compression amount of which can be designed to be small-range elastic deformation, so as to balance the sealing effect and avoid too large pressure marks on the back surface of the wafer;

[0069] As an embodiment,

[0070] A plurality of sliding plates 411 are driven by a linkage mechanism;

[0071] The linkage mechanism comprises a rotating ring 611, a gear 612 and a motor 614, the rotating ring 611 is rotationally arranged below the circular table 3, a gear ring 613 is arranged below the inner ring of the rotating ring 611, the motor 614 and the gear 612 are arranged inside the workbench 1, the sidewall of the gear 612 is in meshing connection with the gear ring 613, the gear 612 is in linkage connection with the output end of the motor 614, and the outer side of the rotating ring 611 is in linkage connection with the sliding block 412 through an arc-shaped piece 623;

[0072] The motor 614 drives the gear 612 to rotate, and then drives the gear ring 613 and the rotating ring 611 to rotate, and then drives the arc-shaped member 623 to move.

[0073] The rotating ring 611 is provided with a plurality of first hinged blocks 621 on the outer side, and the arc-shaped member 623 is in an arc-shaped structure and is hinged to the second hinged block 622 and the first hinged block 621 at both ends.

[0074] The first hinged block 621 is arranged on the outer side of the rotating ring 611 and is distributed in a circumferential direction, forming a plurality of equal-angle hinged points, and the second hinged block 622 is arranged below the sliding block 412, so that the arc-shaped member 623 is stably connected at both ends. The arc-shaped member 623 adopts an arc-shaped connecting rod structure and can transmit a pulling and pushing action in a hinged manner when the rotating ring rotates. Since both ends of the arc-shaped member are hinged, the arc-shaped member allows a certain angle to swing in the working process, so as to adapt to the linear motion track of the sliding block 412 in the radial sliding groove, and improve the motion smoothness and the service life of the mechanism.

[0075] Working principle: in the initial standby state, a plurality of sliding plates 411 are installed in the corresponding sliding grooves 413 above the workbench 1 through the sliding blocks 412, each sliding groove 413 extends radially, and a plurality of sliding grooves 413 are distributed in a ring shape to ensure that a plurality of sliding plates 411 can move radially, at this time each sliding plate 411 is in an open position, leaving enough space to place the wafer 2, by setting a bottom support 421 in the inner end of each sliding plate 411, the upper surface of the bottom support 421 is coplanar with the upper surface of the circular table 3, forming a coplanar support system of a circular table and a circumferential bottom support, providing a unified reference height for the stable placement of the subsequent wafer, then the wafer 2 is placed stably above the circular table 3, the retaining ring 511 is located in the assembly groove 514 above the workbench, and the retaining ring is in the falling position in standby, the upper surface thereof is coplanar with the upper surface of the workbench and located in the reserved gap below the sliding plate 411, which means that when the sliding plate 411 moves radially, the height below the sliding plate 411 after the retaining ring falls back will not mechanically interfere, ensuring smooth movement of the sliding mechanism and avoiding jamming or collision caused by additional support structures, the linkage mechanism is driven to move the plurality of sliding plates towards the wafer, specifically, the motor 614 is installed inside the workbench, the motor output end is connected with the gear 612, the motor 614 drives the gear to rotate, and the gear 612 is meshed with the gear ring 613 to make the rotating ring 611 rotate by a controlled angle, a plurality of first hinge blocks 621 are arranged on the outer side of the rotating ring, a second hinge block 622 is arranged below the sliding block 412, the arc-shaped piece 623 is in an arc-shaped link structure, and the two ends are respectively hinged with the first hinge block 621 and the second hinge block 622, when the rotating ring rotates, each first hinge block rotates with the rotating ring, drives the arc-shaped piece to push and pull, and then drags the second hinge block and the corresponding sliding block 412 to move radially along the sliding groove 413, achieving the effect of synchronous movement, so that a plurality of sliding plates 411 symmetrically approach or move away from the center of the circular table, realizing the centering clamping basis of the wafer 2, as the sliding plates 411 are radially retracted, the supporting points of the bottom support 421 are formed near the edge of the wafer to form uniform support, and the wafer gradually returns to the center area near the circular table 3 under multi-point constraint, completing the mechanical preparation of concentric positioning, the clamping assembly 43 is arranged above the sliding plate, in standby, the upper wheel is in contact with the end surface of the lower wheel under the pushing action of the spring, the first cylinder 44 is driven to push the shaft frame 433 to approach the edge of the wafer 2, wherein the upper surface of the lower wheel 436 is always flush with the lower surface of the wafer 2, when the upper wheel 435 is in contact with the edge of the wafer 2, due to the chamfering of the upper wheel 435, the edge of the wafer 2 can push the upper wheel 435 upwards, the spring is slightly squeezed, until the edge of the wafer 2 is in contact with the fixed shaft 434, at this time the wafer 2 is stably located between the upper wheel 435 and the lower wheel 436, and the spring is used to achieve soft pre-tightening, reducing edge damage, and when the 44 pushing 431 advances, due to the rotary connection of the connecting frame 432, the shaft frame 433 and the sliding frame 431, a plurality of shaft frames 433 are more easily in contact with the edge of the wafer 2, adapting to wafers 2 of different sizes,After the wafer 2 is clamped in place by the clamping assembly, the second air cylinder is driven to extend, lifting the support ring 511 away from the sliding plate 411 so that the upper surface of the support ring 511 is flush with the upper surface of the circular table 3. The support ring 511 achieves the effect of stably supporting the overhanging part of the wafer 2, and the wafer forms a stable reference attitude after being placed, and does not spontaneously warp or locally overhang due to the height difference between the center and the periphery. The external fan is then driven to open, forming a negative pressure adsorption effect between the first air groove 524, the second air groove 525 and different positions below the wafer, and the sealing lip 526 is further arranged to ensure the stability of the wafer and achieve good anti-skid effect. In addition, when the support ring is not needed, the second air cylinder 513 is in a retracted state, and the telescopic shaft 512 drives the support ring 511 to fall into the assembly groove 514, so that the upper surface of the support ring is flush with the upper surface of the workbench and is in the gap below the sliding plate. At this time, the sliding plate can cross the radial projection area where the support ring is located without collision during radial sliding. The plurality of support rings 511 are arranged in a concentric ring structure, so that one or more support rings can be selected according to the diameter of the wafer and the support requirement, and the support ring belt is expanded from the inside to the outside, so as to segmentally shorten the overhanging span that may exist on the back of the wafer, and improve the overall rigidity and attitude stability.

[0076] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A semiconductor device processing clamping fixture, comprising a worktable (1) and a frustum (3), wherein the frustum (3) is disposed at the center of the worktable (1), and a wafer (2) is placed on top of the frustum (3), characterized in that, Also includes: A sliding plate (411) is provided, and multiple sliding plates (411) are arranged in a ring and synchronously sliding above the worktable (1). The inner end of the sliding plate (411) is provided with a base (421) that is coplanar with the upper surface of the frustum (3). A clamping assembly is slidably disposed above a sliding plate (411). The clamping assembly includes a fixed shaft (434) disposed within a shaft frame (433). An upper wheel (435) and a lower wheel (436) with chamfered end faces are rotatably disposed on the fixed shaft (434). The upper wheel (435) is assembled and connected to the shaft frame (433) via a spring (437). The negative pressure assembly is located inside the workbench (1). The negative pressure assembly includes a support ring (511) and a second cylinder (513). The support ring (511) is driven to move up and down above the workbench (1) at the outer ring of the truncated cone (3) by the second cylinder (513). When the support ring (511) falls back, its upper surface is coplanar with the upper surface of the workbench (1) and is located in the reserved gap below the sliding plate (411). The support ring (511) and the truncated cone (3) are respectively provided with a first air groove (524) and a second air groove (525). The first air groove (524) and the second air groove (525) are connected to the external fan.

2. The semiconductor device processing clamping fixture according to claim 1, characterized in that: The workbench (1) has multiple grooves (413) arranged in a ring above it, and the sliding plate (411) is slidably disposed in the grooves (413) below by a slider (412).

3. The semiconductor device processing clamping fixture according to claim 2, characterized in that: A back plate (45) is provided above the sliding plate (411). The back plate (45) is provided with a sliding frame (431) via a first cylinder (44). A connecting frame (432) is rotatably provided at both ends of the sliding frame (431). The two ends of the connecting frame (432) are rotatably connected to the end faces of two adjacent shaft frames (433).

4. The semiconductor device processing clamping fixture according to claim 3, characterized in that: The edges of the upper wheel (435) and the lower wheel (436) are chamfered at one end, and the edges of the upper wheel (435) and the lower wheel (436) are used to limit the edge of the wafer (2).

5. The semiconductor device processing clamping fixture according to claim 4, characterized in that: An assembly slot (514) is provided above the workbench (1). The support ring (511) is located in the assembly slot (514). A telescopic shaft (512) is provided inside the workbench (1). Multiple telescopic shafts (512) and second cylinders (513) are provided inside the workbench (1) below the assembly slot (514). The telescopic shafts (512) and second cylinders (513) are arranged at intervals.

6. The semiconductor device processing clamping fixture according to claim 5, characterized in that: The support ring (511) is provided in multiple sets, and the multiple sets of support rings (511) are arranged in a concentric ring structure.

7. A semiconductor device processing clamping fixture according to claim 6, characterized in that: The workbench (1) is provided with an annular pipe (521) inside. The annular pipe (521) is connected to the air inlet of the external fan. The annular pipe (521) is connected with a first branch pipe (522) and a second branch pipe (523). The first branch pipe (522) is inserted inside the telescopic shaft (512), and the second branch pipe (523) is located inside the frustum (3).

8. A semiconductor device processing clamping fixture according to claim 7, characterized in that: The ring (511) has a hollow structure inside. The upper part of the first branch pipe (522) is connected to the first air groove (524) through the inside of the ring (511). The upper end of the second branch pipe (523) is connected to the second air groove (525). The inner wall edges of the first air groove (524) and the second air groove (525) are respectively provided with sealing lips (526).

9. A semiconductor device processing clamping fixture according to claim 8, characterized in that: Multiple sliding plates (411) are driven by a linkage mechanism, which includes a rotating ring (611), a gear (612) and a motor (614). The rotating ring (611) is rotatably disposed below the frustum (3). A toothed ring (613) is provided below the inner ring of the rotating ring (611). The motor (614) and the gear (612) are both disposed inside the worktable (1). The side wall of the gear (612) meshes with the toothed ring (613). The gear (612) is linked with the output end of the motor (614). The outer side of the rotating ring (611) is linked with the slider (412) through an arc-shaped part (623).

10. A semiconductor device processing clamping fixture according to claim 9, characterized in that: The slider (412) is provided with a second hinge block (622) below it, and the outer side of the rotating ring (611) is provided with a plurality of first hinge blocks (621). The arc-shaped component (623) has an arc-shaped structure and its two ends are respectively hinged to the second hinge block (622) and the first hinge block (621).

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