Wafer detection mechanism and wafer detection apparatus

Abstract

The application relates to the technical field of wafer detection, and provides a wafer detection mechanism and a wafer detection equipment. The wafer detection mechanism comprises a wafer carrier disc, a liquid collecting groove, a moving module and optical detection modules and liquid removing structures which are arranged at one side of the wafer carrier disc and are arranged at intervals. The optical detection module at least comprises a liquid film forming structure, the liquid film forming structure has a gap between the liquid film and a wafer to be detected, and the liquid film forming structure can form a liquid film covering at least part of an imaging field of view of the optical detection module in the gap. The liquid collecting groove is arranged at the bottom of the outer circumferential side of the wafer carrier disc. The moving module is used for controlling the wafer carrier disc to move in a horizontal plane relative to the optical detection modules and the liquid removing structures so that the two are alternatively corresponding to the wafer carrier disc. The wafer carrier disc and the optical detection modules are relatively moved under the action of the moving module, and the liquid film is driven to move along with the wafer carrier disc to detect the wafer to be detected. The wafer detection mechanism provided by the application can more efficiently detect wafers.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, and in particular to a wafer inspection mechanism and wafer inspection equipment. Background Technology

[0002] During wafer dicing, the wafer is typically supported on a tensioned blue film, resulting in a blue film adhering to the back of the diced wafer. Due to the high roughness of the blue film, it is impossible to completely detect dicing defects hidden beneath it on the wafer.

[0003] In related technologies, liquid is often added to the blue film to reduce its surface roughness. However, current detection methods still suffer from low efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide a wafer inspection mechanism that can perform wafer inspection more efficiently.

[0005] A wafer inspection mechanism includes a wafer carrier, an optical inspection module, a liquid removal structure, a liquid collection tank, and a moving module. The optical inspection module is disposed on one side of the wafer carrier and includes at least a liquid film forming structure. A gap exists between the liquid film forming structure and the blue film of the wafer under inspection, and a liquid film covering at least a portion of the imaging field of the optical inspection module is formed within the gap. The liquid removal structure is disposed on one side of the wafer carrier and spaced apart from the optical inspection module for removing liquid from the surface of the blue film after inspection. The liquid collection tank is disposed on the wafer carrier. The outer periphery of the bottom is used to receive the liquid removed by the liquid removal structure; the moving module is used to control the wafer carrier to move relative to the optical detection module and the liquid removal structure in the horizontal plane, so that one of the optical detection module and the liquid removal structure corresponds to the wafer carrier; wherein, the wafer carrier is located below the optical detection module, the wafer carrier and the optical detection module can move relative to each other under the action of the moving module, and the liquid film is driven to move during the relative movement of the optical detection module for the detection of the wafer to be tested.

[0006] Understandably, the wafer inspection mechanism provided in this application can integrate liquid film formation, inspection, and liquid removal functions. Combined with the moving module, it not only facilitates the rapid transfer of the wafer under test to the corresponding optical inspection module for optical inspection, but also allows for rapid transfer to the liquid removal structure for post-inspection liquid removal, maintaining the cleanliness of the blue film surface. Furthermore, during inspection, it can promote relative movement between the wafer under test and the optical inspection module to meet optical inspection requirements at different locations, significantly improving overall inspection efficiency. Simultaneously, this design ensures that the inspected wafer remains clean, facilitating direct input into the next processing step, reducing intermediate processing steps, and thus improving overall efficiency.

[0007] In some embodiments, the optical detection module further includes an illumination structure and an imaging structure; the illumination structure is used to emit infrared light toward the blue film side of the wafer under test; the imaging structure is located on the side of the liquid film forming structure opposite to the wafer carrier and is arranged on the same optical axis as the liquid film forming structure, and the imaging structure is used to collect imaging light from the wafer under test and pass through the blue film and the liquid film in sequence to image the wafer under test.

[0008] In some embodiments, the optical detection module further includes a first mounting base, an adjustment member, and a transition block. The transition block is adjustablely disposed on the first mounting base via the adjustment member. The transition block is connected to the liquid film forming structure, and the imaging structure is disposed on the first mounting base. The adjustment member is used to adjust the position of the transition block relative to the first mounting base to change the position of the liquid film forming structure relative to the imaging structure.

[0009] In some embodiments, the liquid film forming structure includes a base with a light-transmitting hole and a light-transmitting plate disposed within the light-transmitting hole, wherein the liquid film is formed between the light-transmitting plate and the blue film.

[0010] In some embodiments, the liquid film forming structure further includes a pressure plate connected to the base, the pressure plate having a limiting flange that is annularly arranged and protrudes from the side of the base facing the wafer carrier.

[0011] In some embodiments, the base body is provided with a liquid filling channel surrounding the outer periphery of the light-transmitting hole, and the liquid outlet of the liquid filling channel is located inside the limiting flange; and / or, a liquid return gap is provided between the outer wall of the pressure plate and the base body, and the base body is also provided with a liquid return channel, which communicates with the liquid return gap and is used to recover the liquid on the surface of the blue film.

[0012] In some embodiments, the optical detection module further includes a liquid supply and return structure, which is connected to the liquid addition channel and the liquid return channel, respectively. The liquid supply and return structure can replenish liquid to the gap to repair the liquid film during the relative movement of the liquid film forming structure and the wafer under test.

[0013] In some embodiments, the liquid removal structure includes at least an air knife for blowing liquid off the surface of the blue film after detection into the collection tank for recycling.

[0014] In some embodiments, the air knives are provided in multiples and arranged at intervals or adjacent to each other along the circumference of the wafer carrier, and the multiple air knives together enclose a liquid removal space.

[0015] In some embodiments, the moving module includes a first moving module and a second moving module connected to the first moving module. The second moving module is connected to the liquid collection tank. The first moving module is used to drive the liquid collection tank to move in a first direction in a horizontal plane via the second moving module. The second moving module is able to drive the liquid collection tank to move in a second direction in a horizontal plane. The liquid collection tank drives the wafer carrier to move synchronously. The first direction and the second direction are set at an angle.

[0016] In some embodiments, the wafer inspection mechanism further includes a dehumidification structure, wherein the dehumidification structure, the optical inspection module, and the liquid removal structure are arranged at intervals, and the moving module is capable of driving the wafer carrier to move below the dehumidification structure.

[0017] In some embodiments, the wafer inspection mechanism further includes an assembly stage and a support beam disposed on the assembly stage, the moving module is disposed on the assembly stage, the liquid collection tank is disposed on the moving module, and the optical inspection module and the liquid removal structure are both disposed on the support beam.

[0018] This application also provides a wafer inspection device, including a transport mechanism, a flipping mechanism, and the aforementioned wafer inspection mechanism. The flipping mechanism is used to flip the wafer to be inspected, and the transport mechanism is capable of flowing between the flipping mechanism and the wafer inspection mechanism to transport the flipped wafer to the wafer carrier of the wafer inspection mechanism. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a wafer inspection mechanism provided in an embodiment of this application;

[0021] Figure 2 This is a partial schematic diagram of the optical inspection module in the wafer inspection mechanism provided in the embodiments of this application;

[0022] Figure 3 for Figure 2 A partial cross-sectional view of the optical inspection module and the wafer provided;

[0023] Figure 4 for Figure 2 A simplified diagram of the first type of optical path for the provided optical detection module;

[0024] Figure 5 for Figure 2 A simplified diagram of the second type of detection optical path for the provided optical detection module;

[0025] Figure 6 A simplified optical path diagram provided for the detection by the optical detection module in an embodiment of this application;

[0026] Figure 7 This is a simplified optical path diagram for directly detecting the wafer under test via the blue film;

[0027] Figure 8 A simplified optical path diagram for detecting a wafer after a liquid film has been formed on the surface of the blue film;

[0028] Figure 9 for Figure 2 A partial schematic diagram of the provided optical detection module;

[0029] Figure 10 for Figure 2 A first partial cross-sectional view of the provided optical detection module;

[0030] Figure 11 for Figure 2 A second partial schematic diagram of the provided optical detection module;

[0031] Figure 12 for Figure 2 A partial cross-sectional view of the provided optical detection module at the liquid filling channel;

[0032] Figure 13 for Figure 2 A partial cross-sectional view of the provided optical detection module at the liquid return channel;

[0033] Figure 14 for Figure 2 A photograph of the provided optical detection module during liquid film compression.

[0034] Figure 15 for Figure 2 A cross-sectional view of the provided optical detection module along the radial direction of the light-transmitting aperture;

[0035] Figure 16 for Figure 2 A schematic diagram of the main body of the optical detection module provided;

[0036] Figure 17 for Figure 2 A schematic diagram showing the installation of the matching components in the provided optical inspection module;

[0037] Figure 18 for Figure 2 A simplified diagram of the base and the light-transmitting plate in the provided optical detection module;

[0038] Figure 19 for Figure 2 A second simplified diagram of the base and light-transmitting plate in the provided optical detection module;

[0039] Figure 20 for Figure 2 A third simplified diagram of the base and light-transmitting plate in the provided optical detection module;

[0040] Figure 21 for Figure 2 The fourth simplified diagram of the base and light-transmitting plate in the provided optical detection module;

[0041] Figure 22 for Figure 2 The fifth simplified diagram of the base and light-transmitting plate in the provided optical detection module;

[0042] Figure 23 for Figure 2 The sixth simplified diagram of the base and light-transmitting plate in the provided optical detection module;

[0043] Figure 24 This is a first schematic diagram of the liquid removal structure in the wafer inspection mechanism provided in the embodiments of this application;

[0044] Figure 25 for Figure 24 A magnified view of a section at point A in the middle;

[0045] Figure 26 This is a second schematic diagram of the liquid removal structure in the wafer inspection mechanism provided in the embodiments of this application;

[0046] Figure 27 This is a cross-sectional view of the liquid removal structure in the wafer inspection mechanism provided in the embodiments of this application;

[0047] Figure 28 for Figure 27 A magnified view of a section at point B in the middle;

[0048] Figure 29 This is a schematic diagram of a wafer inspection device provided in an embodiment of this application.

[0049] Reference numerals: 10, Wafer inspection mechanism; 20, Flipping mechanism; 30, Transport mechanism; 100, Optical inspection module; 110, Liquid film formation structure; 111, Base; 112, Light-transmitting plate; 113, Pressure plate; 120, Illumination module; 130, Imaging module; 131, Image acquisition unit; 132, Optical lens group; 140, Autofocus structure; 150, First assembly base; 151, Mounting base; 152, Guide structure; 160, Adjustment component; 170, Adapter block; 200, Liquid removal structure; 210 211. Air knife; 220. Rotating shaft; 221. Mounting bracket; 222. Connecting part; 222. Support part; 230. Locking element; 240. Second assembly base; 241. Substrate; 242. Support plate; 243. Assembly seat; 250. Adjustment component; 251. Limiting block; 252. Adjusting column; 253. Adjusting seat; 260. Elastic element; 270. Lifting cylinder; 300. Liquid collection tank; 400. Wafer carrier; 500. Moving module; 510. First moving module; 520. Second moving module; 600. Except Wet structure; 700, Assembly platform; 800, Support beam; 810, Beam section; 820, Support column; 900, Wafer to be tested; 910, Blue film; 1001, Gap; 1002, Liquid film; 1101, Light-transmitting hole; 1101a, First connecting region; 1101b, Second connecting region; 1102, Liquid filling channel; 1103, Liquid filling surface; 1104, Exhaust channel; 1105, Liquid return gap; 1106, Liquid return channel; 1111, Base body; 1111a, Assembly protrusion; 1111b, Surrounding 1112, retaining ring; 1121, first plate; 1122, second plate; 1131, limiting flange; 1141, liquid filling connector; 1142, liquid filling pipe; 1143, liquid return connector; 1144, liquid return pipe; 1321, objective lens; 1322, tube lens; 1322a, first half-reflecting mirror; 1323, second half-reflecting mirror; 1324, reflecting mirror; 2201, mounting hole; 11111, mounting ring groove; 11112, connecting groove; 11113, groove; 11121, mating protrusion. Detailed Implementation

[0050] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0051] It should be noted that when a component is referred to as being "fixed to" or "attached to" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0052] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0053] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0054] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0055] Please see Figures 2 to 6One embodiment of this application provides an infrared optical detection system, which is an optical detection module 100 described below. This module is installed on one side of the blue film 910 of a wafer 900 under test to perform infrared detection on the surface of the wafer 900 covered by the blue film 910. The infrared optical detection system includes an illumination module 120, a liquid film forming structure 110, an imaging module 130, and a control module (not shown in the figure). The illumination module 120 emits infrared light towards the blue film 910 side of the wafer 900 under test. The liquid film forming structure 110 has a light-transmitting hole 1101 and a liquid filling channel 1102 and a liquid return channel 1106 surrounding the light-transmitting hole 1101. A light-transmitting plate 112 that allows infrared light to pass through is installed inside the light-transmitting hole 1101. A gap 1001 exists between the liquid film forming structure 110 and the blue film 910. A liquid inlet channel 1102 and a liquid return channel 1106 are used to input and recover liquid into the gap 1001, respectively, to form a liquid film 1002 between the light-transmitting plate 112 and the blue film 910, covering at least a portion of the field of view of the imaging module 130. The imaging module 130 is located on the image side of the liquid film forming structure 110 and is coaxially arranged with the light-transmitting plate 112 and the liquid film 1002. It is used to collect imaging light from the wafer under test 900 that passes sequentially through the blue film 910, the liquid film 1002, and the light-transmitting plate 112 to image the wafer under test 900. A control module is used to control the relative movement of at least one of the liquid film forming structure 110 and the wafer under test 900 on a horizontal plane, and to drive the liquid film 1002 to move accordingly during the relative movement of the liquid film forming structure 110, thereby controlling the imaging module 130 to collect images of different areas of the wafer under test 900.

[0056] Among them, the optical axes of the light-transmitting plate 112, the liquid film 1002, and the imaging module 130 are all along the Z-axis direction, that is... Figure 2 The control module can control at least one of the liquid film forming structure 110 and the wafer 900 under test to move on the horizontal plane. For example, the control module can control only the liquid film forming structure 110 to move on the horizontal plane, or it can control only the wafer 900 under test to move on the horizontal plane, or it can control both the liquid film forming structure 110 and the wafer 900 under test to move on the horizontal plane. During movement, it can move along the X-axis direction on the horizontal plane, or only along the Y-axis direction, or along both the X-axis and Y-axis directions, or of course, it can move in other directions. Taking the X-axis direction as... Figure 2 The left-right direction can also be that the wafer under test 900 moves to the left along the X-axis, and the liquid film forming structure 110 moves to the right along the X-axis. It only needs to satisfy the defect detection requirements of different areas of the wafer under test 900; this is just an example.

[0057] Understandably, by injecting liquid through the liquid filling channel 1102 between the liquid film forming structure 110 and the blue film 910, liquid can be injected to form a liquid film 1002 under tension, thereby changing the light refraction path and facilitating the imaging module 130 to acquire a clearer image. During this process, since at least one of the liquid film forming structure 110 and the wafer 900 under test can move horizontally, the position of the liquid film 1002 relative to the wafer 900 under test can be adjusted. This effectively fixes the liquid film 1002 relative to the liquid film forming structure 110, maintaining the stability of the liquid film 1002 during detection and reducing the air content mixed into the liquid film 1002 during detection. This optimizes the light refraction path through the liquid film 1002, improving detection accuracy. Furthermore, this setup facilitates precise control of the liquid film 1002 within a small area, improving the overall detection accuracy of the wafer 900 under test through precise image detection within a small area.

[0058] Please see Figures 1 to 6 One embodiment of this application provides a wafer inspection mechanism 10, including a wafer carrier 400, an optical inspection module 100, a liquid removal structure 200, a liquid collection tank 300, and a moving module 500. Specifically, the optical inspection module 100 is disposed on one side of the wafer carrier 400 and includes at least a liquid film forming structure 110. A gap 1001 is formed between the liquid film forming structure 110 and the blue film 910 of the wafer 900 to be inspected, and a liquid film 1002 covering at least part of the imaging field of the optical inspection module 100 can be formed within the gap 1001. The liquid removal structure 200 is disposed on one side of the wafer carrier 400 and spaced apart from the optical inspection module 100, and is used to remove liquid from the surface of the blue film 910 after inspection. The liquid collection tank 300 is disposed at the bottom of the outer periphery of the wafer carrier 400, and is used to collect the liquid removed by the liquid removal structure 200. The moving module 500 controls the movement of the wafer carrier 400 relative to the optical inspection module 100 and the liquid removal structure 200 in a horizontal plane, so that one of the optical inspection module 100 and the liquid removal structure 200 corresponds to the wafer carrier 400. The wafer carrier 400 is located below the optical inspection module 100. The wafer carrier 400 and the optical inspection module 100 can move relative to each other under the action of the moving module 500, and during the relative movement of the optical inspection module 100, the liquid film 1002 moves accordingly to inspect the wafer 900 under test.

[0059] Taking a wafer carrier 400 positioned below the optical inspection module 100 and the liquid removal structure 200, and with the moving module 500 connected to the wafer carrier 400 as an example, the optical axis of the optical inspection module 100 and the liquid film 1002 is along the Z-axis, and the moving module 500 drives the wafer carrier 400 to move along the X-axis and Y-axis in the horizontal plane. The Z-axis direction is... Figure 1 The vertical direction and the X-axis direction are... Figure 1The left and right directions, and the Y-axis direction are... Figure 1 The front and back directions in the middle.

[0060] The wafer under test 900 is supported and fixed on the wafer carrier 400, and moved below the optical inspection module 100 by the moving module 500. The liquid film forming structure 110 in the optical inspection module 100 is positioned at a preset distance from the blue film 910 of the wafer under test 900, forming a gap 1001 between the liquid film forming structure 110 and the blue film 910. Liquid is then injected into this gap 1001 through the liquid film forming structure 110. Under its own tension, the liquid forms a liquid film 1002 within the gap 1001, covering at least a portion of the imaging field of view of the optical inspection module 100. The optical inspection module 100 can collect imaging light from the wafer under test 900 that passes sequentially through the blue film 910 and the liquid film 1002, thereby imaging the wafer under test 900. In this process, it is precisely because of the setting of the liquid film 1002 that the incident angle of light can be reduced when it is incident from air to the liquid film 1002. Since the refractive index of the liquid forming the liquid film 1002 is relatively small compared with that of the film layer (specifically, water can be selected), the angle of light deviating from the optical axis is small. Therefore, the degree of asymmetric reflection between the wafer reflection imaging light and the incident light is reduced, thereby improving the detection accuracy.

[0061] During the inspection process, the moving module 500 can drive the wafer carrier 400 to move relative to the optical inspection module 100 on a horizontal plane, which is equivalent to the optical inspection module 100 and the wafer carrier 400 moving relative to each other on a horizontal plane. Furthermore, during this movement, the liquid film 1002 can move with the liquid film forming structure 110, thereby ensuring that the liquid film 1002 is stably maintained between the liquid film forming structure 110 and the blue film 910. This guarantees that when the optical inspection module 100 acquires images of each area of ​​interest on the wafer 900 under test, both the incident light path and the imaging light path can pass through the liquid film 1002. Moreover, this setup effectively divides the surface of the wafer 900 under test into multiple smaller inspection areas, and the liquid film 1002 formed by the liquid film forming structure 110 can cover the current area of ​​interest on the wafer 900 under test and the field of view of the optical inspection module 100 in real time. By improving the inspection accuracy of each area of ​​interest on the wafer 900 under test, the overall inspection accuracy of the wafer is improved. Of course, it is precisely because the wafer carrier 400 and the optical inspection module 100 can move relative to each other under the action of the moving module 500 during the inspection process that the inspection position can be changed more promptly, thereby improving the inspection efficiency.

[0062] After the test is completed, the moving module 500 can drive the wafer carrier 400 to move the wafer 900 under test to below the liquid removal structure 200. The liquid removal structure 200 removes the liquid from the surface of the blue film 910, and the removed liquid can be collected and gathered in the liquid collection tank 300 to prevent liquid from flowing to other structures and causing damage. Because the moving module 500 is used to drive the movement of the wafer carrier 400, only one moving module 500 needs to be set up, which not only simplifies the structure and facilitates control, but also saves waiting time and further improves the testing efficiency.

[0063] In other words, the wafer inspection mechanism 10 provided in this embodiment can achieve integrated functions of liquid film formation, inspection, and liquid removal. Combined with the moving module 500, it not only facilitates the rapid transfer of the wafer 900 to the target position (referring to the inspection position corresponding to the optical inspection module 100 and the liquid removal position corresponding to the liquid removal structure 200), but also facilitates the movement of the wafer 900 during the inspection process to meet optical inspection requirements at different positions, significantly improving overall inspection efficiency. Furthermore, this design ensures that the inspected wafer remains clean, allowing for direct processing into the next step, reducing intermediate processing steps, and thus improving overall efficiency.

[0064] Alternatively, the moving module 500 can be connected to the optical inspection module 100 and the liquid removal structure 200 to drive one of them to move relative to the wafer carrier 400, aligning them to perform inspection and liquid removal operations respectively. Alternatively, each of the optical inspection module 100 and the liquid removal structure 200 can have its own set of moving modules 500, using these two sets to control the optical inspection module 100 and the liquid removal structure 200 respectively. Or, each of the wafer carrier 400, the optical inspection module 100, and the liquid removal structure 200 can have a corresponding moving module 500. The key is to ensure that the wafer carrier 400 can move relative to the optical inspection module 100 and the liquid removal structure 200 in the horizontal plane; this is merely an example.

[0065] In some embodiments, the wafer inspection mechanism 10 further includes a control module (not shown in the figure), which controls the movement of the wafer carrier 400 relative to the optical inspection module 100 and the liquid removal structure 200 on the horizontal plane. That is, the optical inspection module 100 itself may have a control module, or the entire wafer inspection mechanism 10 may have a control module, as long as it can meet the command control requirements.

[0066] The control module can be a host computer. The moving module 500, optical detection module 100, and liquid removal structure 200 are connected to the host computer via signals, such as electrical or wireless signals, as long as signal transmission is possible. Sensors are installed at both the optical detection module 100 and the liquid removal structure 200 to detect the positioning of the wafer carrier 400. A sensor can also be installed on the wafer carrier 400 to detect the positioning of the wafer under test 900. The control module can issue corresponding control commands based on the sensor detection signals. For example, after the sensor on the wafer carrier 400 detects the positioning of the wafer under test 900, the control module controls the moving module 500 to move the wafer carrier 400 below the optical detection module 100. Once the sensor at the optical detection module 100 detects the positioning of the wafer under test 900, the control module controls the optical detection module 100 to perform the detection operation. After the test is completed, the control module controls the moving module 500 to drive the wafer carrier 400 to move below the liquid removal structure 200, and controls the liquid removal structure 200 to open according to the detection signal of the sensor at the liquid removal structure 200 to perform liquid removal. This is only an example.

[0067] Please see Figure 2 , Figure 3 , Figure 4 and Figure 6 In some embodiments, the optical detection module 100 further includes an illumination structure and an imaging structure. The illumination structure is the aforementioned illumination module 120, and the imaging structure is the aforementioned imaging module 130. The illumination module 120 is used to emit infrared light toward the blue film 910 side of the wafer 900 under test. The imaging module 130 is disposed on the side of the liquid film forming structure 110 opposite to the wafer carrier 400, which is equivalent to the imaging module being disposed on the image side of the liquid film forming structure 110, and is coaxially arranged with the liquid film forming structure 110 (that is, equivalent to the imaging module 130 being coaxially arranged with the liquid film 1002). The side of the liquid film forming structure 110 facing the wafer 900 under test serves as the object side of the liquid film forming structure 110. (Refer to...) Figures 4 to 6The imaging module 130 is used to acquire imaging light from the wafer under test 900, which passes sequentially through the blue film 910 and the liquid film 1002, to image the wafer under test 900. The imaging light is formed by infrared light emitted by the illumination module 120 incident on the wafer under test 900 and the blue film 910. Theoretically, it includes reflected light from the back of the wafer, scattered light from the surface of microcracks inside the wafer, or transmitted light that has been reflected or scattered and penetrated through the back of the wafer, etc. It may also include a small amount of light that is not beneficial to the detection requirements, such as reflected and scattered light from the blue film. The image ultimately acquired by the imaging module 130 is formed by its image sensor receiving all of the above light. Because infrared light has high penetrability, it can effectively penetrate the blue film 910, allowing the imaging module 130 to clearly capture images of the surface and interior of the wafer under test 900, thereby enabling the detection of internal defects (such as microcracks, microchips, etc.) in the wafer under test 900. The imaging module 130 is set on the same optical axis as the liquid film 1002, ensuring that the incident light can accurately pass through the liquid film 1002 and the blue film 910 and be projected onto the wafer 900 under test. The imaging light can also pass through the blue film 910 and the liquid film 1002 in sequence to reach the imaging module 130, thereby improving the clarity and accuracy of the imaging.

[0068] like Figure 2 and Figure 4 As shown, in some embodiments, the imaging module 130 includes an image acquisition unit 131 and an optical lens group 132. The optical lens group 132 includes an objective lens 1321 and a tube lens 1322. The tube lens 1322 is disposed between the objective lens 1321 and the image acquisition unit 131. The optical lens group 132 is used to collect imaging light and transmit the imaging light to the image acquisition unit 131 for imaging. Taking the Z-axis direction as an example, the aforementioned image sensor is disposed inside the image acquisition unit 131.

[0069] Image acquisition device 131 can be a camera. Objective lens 1321 includes multiple lenses spaced apart along the optical axis, such as at least two plano-convex lenses and at least one plano-concave lens, or combinations of plano-convex lenses, double-convex lenses, double-concave lenses, etc., for illustrative purposes only. Objective lens 1321 can provide high resolution for image acquisition device 131 to identify minute defects; and can provide primary magnification of the pattern on the surface of wafer 900 under test, facilitating image acquisition device 131 to capture a clearer image. Telescope lens 1322 includes at least a first semi-reflective mirror 1322a, which reflects infrared light emitted by illumination module 120 to objective lens 1321 and transmits imaging light to image acquisition device 131. Telescope lens 1322 also includes at least two lenses spaced apart along the Z-axis, such as at least two plano-convex lenses, with the planar sides of the two plano-convex lenses facing each other and the convex sides facing away from each other. For illustrative purposes only.

[0070] like Figure 5As shown, in some embodiments, the optical detection module 100 further includes an autofocus structure 140, and the optical lens group 132 further includes a second semi-reflective mirror 1323 corresponding to the autofocus structure 140. The autofocus structure 140 can automatically adjust the distance between the objective lens 1321 and the wafer 900 under test, so that the image on the image acquisition unit 131 achieves a clearer image. The second semi-reflective mirror 1323 can project the light beam emitted from the autofocus structure 140 onto the wafer 900 under test for focusing adjustment, and can also project the imaging light onto the image acquisition unit 131 for image acquisition. This type of embodiment can be applied to some occasions with high-precision detection requirements, using the autofocus structure 140 to achieve timely adjustment of the object distance to the object under test to achieve a clear imaging state.

[0071] In other embodiments, the optical lens group 132 includes a telecentric lens, specifically an object-side telecentric lens or a double telecentric lens. This type of embodiment can be applied to situations where high-speed inspection is required but accuracy can be appropriately reduced. By setting a telecentric lens to increase the depth of field on the object side, it can better cope with the undulations of the focusing surface and ensure that the wafer under test 900 is quickly and clearly imaged under a large depth-of-field lens.

[0072] like Figure 4 and Figure 5 As shown, in some embodiments, the optical lens assembly 132 further includes a reflector 1324, which is used to reflect the infrared light emitted by the illumination module 120 to the first half-reflector 1322a. In actual use, the optical lens assembly 132 is disposed inside the lens barrel.

[0073] Please see Figure 1 , Figure 2 , Figure 9 and Figure 10 In some embodiments, the optical detection module 100 further includes a first assembly base 150, an adjustment member 160, and a transition block 170. The transition block 170 is adjustablely disposed on the first assembly base 150 via the adjustment member 160. The transition block 170 is connected to the liquid film forming structure 110, and the imaging module 130 is disposed on the first assembly base 150. The adjustment member 160 is used to adjust the position of the transition block 170 relative to the first assembly base 150, thereby changing the position of the liquid film forming structure 110 relative to the imaging module 130.

[0074] In other words, the assembly position of the liquid film forming structure 110 can be finely adjusted by utilizing the cooperation between the adapter block 170 and the adjusting member 160. The first assembly base 150 can also install the optical detection module 100 to the target position, such as the support beam 800 described below. The imaging module 130 is connected to the first assembly base 150 via a lens barrel, which can be achieved using screws for easy assembly and disassembly. The adapter block 170 is L-shaped. The horizontal side of the L-shape is connected to the liquid film forming structure 110. For example, the liquid film forming structure 110 includes at least a base 111, and the adapter block 170 can be detachably connected to the base 111 via screws. Furthermore, the horizontal side of the adapter block 170 is connected to the upper surface of the base 111, and the lower surface of the base 111 is positioned close to the wafer 900 to be tested, in order to reduce liquid film formation interference; and the horizontal side can surround the outer periphery of the imaging module 130 to reduce assembly interference between the imaging module 130 and the liquid film forming structure 110. The vertical side of the L-shaped adapter block 170 is movably connected to the first assembly base 150. For example, a guide structure 152 is provided between the vertical side and the first assembly base 150 to guide the movement of the adapter block 170 relative to the first assembly base 150.

[0075] In some specific embodiments, a mounting base 151 protrudes from the side of the first assembly base 150 opposite to the imaging module 130. An adjusting member 160 is rotatably connected to the mounting base 151, and the end of the adjusting member 160 is threadedly connected to the adapter block 170. The guide structure 152 includes a guide rail and a slider. The guide rail is located on the first assembly base 150, and the slider is connected to the adapter block 170, with the slider slidably connected to the guide rail. During adjustment, the adjusting member 160 is rotated about its own axis, causing the adapter block 170 to reciprocate along the Z-axis under the action of the guide structure 152, thereby fine-tuning the distance between the upper surface of the liquid film forming structure 110 and the imaging module 130 along the Z-axis.

[0076] In other embodiments, the adjusting member 160 can also be used to adjust the pitch angle of the adapter block 170 relative to the first mounting base 150, thereby adjusting the pitch angle of the liquid film forming structure 110 relative to the imaging module 130. This is equivalent to adjusting the levelness of the liquid film forming structure 110 relative to the wafer 900 to be tested, ensuring that the optical axis of the liquid film forming structure 110 is coaxial with the optical axis of the imaging module 130. For example, the arc-shaped hole on the adapter block 170 can be used in conjunction with the adjusting member 160 to provide adjustment and guidance. This is only an example.

[0077] In actual assembly, the optical axis of the liquid film 1002 is assumed to be coaxial with the optical axis of the light-transmitting aperture 1101 of the liquid film forming structure 110. Therefore, maintaining the coaxial alignment of the imaging module 130 and the liquid film forming structure 110 satisfies the coaxial alignment requirement between the imaging module 130 and the liquid film 1002. Thus, at this time, only the position of the liquid film forming structure 110 relative to the imaging module 130 along the optical axis direction needs to be adjusted.

[0078] Please refer to details. Figure 3 , Figure 4 , Figure 11 , Figure 12 and Figure 13 Another embodiment of this application provides a liquid film forming structure 110, including a base 111 with a light-transmitting hole 1101 and a light-transmitting plate 112 disposed within the light-transmitting hole 1101, wherein a liquid film 1002 is formed between the light-transmitting plate 112 and the blue film 910. It is understood that the light-transmitting plate 112 can be made of glass and can transmit infrared light. By utilizing the light-transmitting plate 112, the morphology of the liquid film 1002 during the relative movement of the liquid film forming structure 110 and the wafer 900 under test can be effectively improved, reducing the impact on the liquid film 1002 and the imaging effect. For a detailed explanation of the principle, please refer to [reference needed]. Figures 6 to 8 ,in, Figures 6 to 8 In this context, θ0 is the incident angle of the incident light, θ1 is the angle of refraction of the incident light after refraction, θ2 is the incident angle of the incident light onto the wafer, and θ3 is the angle between the incident light and the reflected light.

[0079] Specifically, in Figure 7 In the solution without liquid film 1002 and without light-transmitting plate 112, the rough and uneven surface of blue film 910 and the varying angles of the blue film-air interface result in a large incident angle θ0 of the incident light on the surface of blue film 910. Furthermore, due to the different incident points of the incident beam at the blue film-air interface, multiple different incident angles may occur. Consequently, under the effect of light refraction, a large amount of imaging light (or reflected light) deviates significantly from the original incident direction, ultimately leading to blurred imaging of the wafer 900 under test. Similarly, in Figure 8 In the scheme shown with liquid film 1002 and no light-transmitting plate 112, although the problem of uneven surface of blue film 910 is alleviated, the unevenness of the liquid surface still causes some problems of image light deviation due to refraction, resulting in insufficient image clarity. Figure 6 In the scheme shown with liquid film 1002 and light-transmitting plate 112, since the light-transmitting plate-air interface is flat and the incident angle is basically the same, if the refractive index of the liquid is selected to be similar to that of the light-transmitting plate 112, the problem of light refraction or scattering can be effectively solved. The angle θ3 between the incident light and the reflected light is significantly reduced, so that the imaging light can be effectively collected by the imaging module 130, thereby achieving the purpose of clear imaging.

[0080] The base 111 is further provided with a liquid filling channel 1102 and a liquid return channel 1106 surrounding the outer periphery of the light-transmitting aperture 1101. The liquid filling channel 1102 and the liquid return channel 1106 are independent of each other and are used to input and recover liquid into the aforementioned gap 1001, respectively, so as to form a liquid film 1002 covering at least part of the field of view of the imaging module 130 between the light-transmitting plate 112 and the blue film 910. Specifically, one side wall of the base 111 along the axial direction of the light-transmitting aperture 1101 is defined as the liquid filling surface 1103. Specifically, the side wall of the base 111 away from the imaging module 130 along the axial direction of the light-transmitting aperture 1101 is defined as the liquid filling surface 1103. In other words, the side wall of the base 111 facing the wafer carrier 400 along the axial direction of the light-transmitting aperture 1101 is defined as the liquid filling surface 1103. The liquid filling channel 1102 is connected to the liquid filling surface 1103 and is used to deliver liquid to the surface of the blue film 910 on one side of the liquid filling surface 1103 so that the liquid fills the space between the light-transmitting plate 112 and the blue film 910 and forms a liquid film 1002.

[0081] In practical use, after the wafer under test 900 is positioned relative to the liquid film forming structure 110, liquid is slowly introduced into the gap 1001 between the liquid film forming structure 110 and the blue film 910 through the liquid addition channel 1102, and excess liquid is recovered through the liquid return channel 1106. By controlling the difference in the liquid addition and return rates, the volume of the formed liquid film 1002 remains stable. Due to the slow liquid flow rate and the close proximity of the liquid film forming structure 110 and the blue film 910, a liquid film 1002 will eventually form between the blue film 910 and the light-transmitting plate 112 due to liquid tension, which facilitates improved detection accuracy. Furthermore, if the liquid film 1002 breaks during the moving detection process, the liquid return channel 1106 can be used to absorb the liquid on the blue film 910, preventing liquid from spreading on the surface of the blue film 910. Additionally, during the moving detection process, liquid can be added to the gap 1001 through the liquid addition channel 1102 to stabilize the liquid film 1002. After the test is completed, the liquid is first recovered using the return channel 1106, and then the wafer carrier 400 is moved to the bottom of the liquid removal structure 200. The liquid removal structure 200 is used to remove the liquid from the surface of the blue film 910 to maintain the cleanliness of the wafer after the test.

[0082] Understandably, since the liquid filling channel 1102 is connected to the gap 1001, this means that the liquid column in the liquid filling channel 1102 (and the return channel 1106) is connected to the top of the liquid film 1002 at the gap 1001. Therefore, when the liquid film forming structure 110 and the blue film 910 move relative to each other on the horizontal plane, the liquid film forming structure 110 can drive the liquid film 1002 to move based on the intermolecular forces between the liquid column and the liquid film 1002, so that the liquid film 1002 does not completely stop on the blue film 910, because the intermolecular forces of the liquid are much greater than the interfacial forces between the liquid film 1002 and the blue film 910.

[0083] However, as the camera rapidly captures images (i.e., as the wafer 900 under test moves rapidly, the camera continuously captures images of different areas of the wafer 900 under test), the liquid film forming structure 110 also causes the liquid film 1002 to move rapidly relative to the blue film 910. This can easily lead to the problem that part of the liquid film 1002 remains on the blue film 910 due to inertia and cannot be carried away, thus causing it to break. Once the liquid film 1002 is broken and no longer intact, the incident light path and imaging light path that need to pass through the liquid film 1002 may no longer be intact, causing the imaging blur problem.

[0084] Please continue reading. Figure 3 , Figure 4 , Figure 11 , Figure 12 and Figure 13 To address the issue of the liquid film 1002 breaking during movement and affecting imaging, in some embodiments, the optical detection module 100 further includes a liquid supply and return structure (not shown in the figure). This structure is connected to the liquid addition channel 1102 and the liquid return channel 1106, respectively. The liquid supply and return structure can replenish liquid into the gap 1001 to repair the liquid film 1002 during the relative movement of the liquid film forming structure 110 and the wafer 900 under test. This ensures that during camera-flying imaging, every area of ​​interest of the wafer 900 under test covered by the camera's field of view is completely filled with the liquid film 1002, achieving clear imaging of the entire wafer. The liquid supply and return structure is electrically connected to the aforementioned control module and is used to control the liquid supply and return structure to input or recover liquid into the gap 1001.

[0085] Specifically, the aforementioned liquid filling channel 1102 is connected to a liquid filling pipe 1142, and the liquid return channel 1106 is connected to a liquid return pipe 1144. The liquid filling channel 1102 is connected to the liquid supply and return structure via the liquid filling pipe 1142, and the liquid return channel 1106 is connected to the liquid supply and return structure via the liquid return pipe 1144, thus satisfying the input and recovery of liquid at gap 1001. The liquid supply and return structure may include a storage tank and a pump. The liquid filling pipe 1142 and the liquid return pipe 1144 are respectively connected to the storage tank, and a filter may also be provided between the liquid return pipe 1144 and the storage tank to filter the recovered liquid. This is only an example; it is sufficient to satisfy the input and recovery of liquid.

[0086] The input liquid can be water. Alternatively, liquids or combinations such as glycerol or ethanol can be used, as long as the refractive index of the liquid is similar to that of the light-transmitting plate 112, or similar to that of both the light-transmitting plate 112 and the blue film 910.

[0087] Please see Figure 4 , Figure 11 , Figure 12 and Figure 13In some embodiments, the liquid film forming structure 110 further includes a pressure plate 113 connected to the base 111. The pressure plate 113 has a limiting flange 1131, which is annularly arranged and protrudes from the side of the base 111 facing the wafer carrier 400. It is understood that the pressure plate 113 can press liquid onto the surface of the blue film 910 to form a liquid film 1002 for optical detection. Here, pressing refers to squeezing the liquid between the light-transmitting plate 112 and the blue film 910 of the wafer 900 under test, and can constrain and limit the spread or diffusion of the liquid, thereby making the liquid film 1002 flatly confined within the lateral dimension of the pressure plate 113. Generally, the lateral dimension of the liquid film forming structure 110 matches the imaging module 130; specifically, the lateral dimension of the light-transmitting plate 112 matches the imaging field of view of the imaging module 130, that is, it matches the FOV (Field of View) range of the imaging module 130. The lateral dimension of the pressure plate 113 is slightly larger than that of the light-transmitting plate 112, so that the liquid film 1002 covers the imaging field of view corresponding to the light-transmitting plate 112, and the lateral dimension of the base 111 is generally slightly larger than that of the pressure plate 113. Figure 14 The image shown is of a liquid film that is stably pressed within the area of ​​the pressure plate 113.

[0088] The aforementioned lateral dimension refers to the cross-sectional dimension.

[0089] In other words, by using the limiting flange 1131, not only is the edge of the liquid film 1002 limited, but the distance between the liquid film forming structure 110 at the edge of the liquid film 1002 and the wafer 900 under test can also be reduced, thereby improving the stability of the liquid film 1002. Especially during the inspection process, when the wafer carrier 400 moves the wafer 900 under test relative to the liquid film forming structure 110 under the action of the moving module 500, the limiting flange 1131 can stably limit the liquid film 1002 at the gap 1001, eliminating the need to re-form the liquid film 1002 for inspection at different positions of the wafer 900 under test, thereby improving inspection efficiency.

[0090] like Figure 3 , Figure 4 , Figure 12 and Figure 13 As shown, in some specific embodiments, the side wall of the base 111 facing away from the imaging module 130 along the light-transmitting hole 1101 is defined as a liquid filling surface 1103. The liquid filling channel 1102 extends through the liquid filling surface 1103, and the aforementioned limiting flange 1131 protrudes from the liquid filling surface 1103 and surrounds the outer periphery of the liquid filling surface 1103. That is, the liquid outlet of the liquid filling channel 1102 is located inside the limiting flange 1131, thereby ensuring that the input liquid can fully fill the gap 1001 to form a stable liquid film 1002.

[0091] Furthermore, the limiting flange 1131 gradually expands along the direction of the base 111 toward the wafer carrier 400. Specifically, taking the cross-section of the base 111 as circular as an example, the cross-section of the liquid film 1002 is also basically circular. From the direction of the base 111 toward the wafer carrier 400, the radial dimension of the limiting flange 1131 gradually increases, making the side of the limiting flange 1131 facing the liquid film 1002 be inclined. This arrangement is equivalent to providing a smooth transition surface, which better guides the liquid to diffuse smoothly and continuously throughout the gap 1001, not only reducing the tendency of liquid to recede or accumulate at the edge, but also reducing the amount of air entrained in the liquid, reducing bubbles, and ensuring that the liquid film 1002 can cover the edge defined by the limiting flange 1131 as uniformly and stably as possible.

[0092] In other embodiments, the sidewall of the limiting flange 1131 facing the liquid film 1002 is provided as an arc surface that is concave outward along the radial direction of the seat 111. The arc surface can fit more closely to the edge of the liquid film 1002 and further alleviate the generation of bubbles.

[0093] In some specific embodiments, the limiting flange 1131 is arranged in a closed ring along the circumference of the seat 111. Alternatively, the limiting flange 1131 may also be a plurality of arc-shaped arrangements spaced apart along the circumference of the seat 111, with a small gap 1001 between any two adjacent arcs and a smooth, gradual transition at the gap 1001 to reduce the risk of reduced stability of the liquid film 1002 due to sharp corners.

[0094] Please see Figure 4 , Figure 12 and Figure 13 In some embodiments, a return gap 1105 is provided between the outer wall of the pressure plate 113 and the seat 111. The return channel 1106 communicates with the return gap 1105 and is used to recover the liquid on the surface of the blue film 910. That is, the return gap 1105 is located on the outside of the pressure plate 113 to ensure that the return operation and the liquid addition operation do not interfere with each other. When return is required, the supply and return structure can be controlled to form a negative pressure at the return gap 1105, drawing out the liquid overflowing from the outside of the pressure plate 113 beyond its lateral dimension, thereby stably pressing the liquid film 1002 within the pressure plate 113.

[0095] Furthermore, the return gap 1105 is arranged in a ring around the outer periphery of the liquid filling surface 1103. This arrangement ensures a sufficient return range so that a uniform and continuous negative pressure can be generated around the seat 111, ensuring that the return operation can uniformly and efficiently cover the liquid on the surface of the blue film 910 and reduce liquid residue.

[0096] like Figure 3 , Figure 4 , Figure 11 , Figure 12 and Figure 13 As shown, in some specific embodiments, multiple liquid addition channels 1102 and liquid return channels 1106 are provided, and they are staggered and spaced apart along the circumference of the seat 111. Each liquid return channel 1106 is connected to the liquid return gap 1105. It can be understood that by using multiple liquid addition channels 1102, the uniformity of liquid addition can be ensured, which is conducive to the uniform diffusion of liquid to the gap 1001 and the formation of a stable liquid film 1002 under the pressing action of the pressure plate 113; and it is precisely because the liquid return gap 1105 is arranged in a ring shape that the uniformity of liquid return is ensured. At the same time, the staggered spacing of the liquid addition channels 1102 and liquid return channels 1106 further maintains the uniform distribution of the liquid addition channels 1102, and improves the uniformity and stability of the liquid film 1002.

[0097] Please see Figure 11 , Figure 12 , Figure 13 , Figure 15 , Figure 16 and Figure 17 In some embodiments, the seat body 111 includes a seat body 1111 and an assembly fitting 1112. The seat body 1111 is provided with an assembly ring groove 11111, and an assembly protrusion 1111a is provided at the bottom of the assembly ring groove 11111. A liquid filling channel 1102 is provided in the seat body 1111 and passes through the assembly protrusion 1111a, and a liquid return channel 1106 is provided in the seat body 1111 and communicates with the assembly ring groove 11111. The assembly fitting 1112 is provided in the assembly protrusion 1111a, and a pressure plate 113 is provided in the assembly fitting 1112 and cooperates with the outer ring wall of the assembly ring groove 11111 to form a liquid return gap 1105. This arrangement ensures that the liquid filling channel 1102 and the liquid return channel 1106 do not interfere with each other and are independent of each other.

[0098] Specifically, the aforementioned light-transmitting hole 1101 is located in the middle of the base body 1111 and extends through the base body 1111. The assembly ring groove 11111 is recessed from the liquid filling surface 1103 along the Z-axis towards the side away from the wafer carrier 400. The assembly ring groove 11111 divides the side of the base body 1111 facing the wafer carrier 400 into a retaining ring 1111b forming the outer ring groove wall and an assembly protrusion 1111a forming the inner ring groove wall. The assembly sleeve 1112 can be fitted onto the assembly protrusion 1111a, the pressure plate 113 is fitted onto the assembly sleeve 1112, and the liquid return gap 1105 is located between the outer wall of the pressure plate 113 and the retaining ring 1111b. A limiting structure (not shown in the figure) is provided between the pressure plate 113 and the assembly 1112. The limiting structure includes a limiting groove and a limiting protrusion. One of the limiting protrusion and the limiting groove is located on the inner sidewall of the pressure plate 113, and the other is located on the outer sidewall of the assembly 1112. For example, the outer sidewall of the assembly 1112 may have a limiting protrusion protruding radially outward along the light-transmitting hole 1101, and the inner sidewall of the pressure plate 113 may have a limiting groove recessed radially outward along the light-transmitting hole 1101. The limiting protrusion is inserted into the limiting groove to satisfy the assembly limiting of the pressure plate 113 and the assembly 1112. The pressure plate 113 may be made of rubber or silicone material, etc.

[0099] In some specific embodiments, the liquid filling channel 1102 is L-shaped, including a transverse section extending radially along the light-transmitting hole 1101 and a vertical section extending axially along the light-transmitting hole 1101, with the transverse section communicating with the vertical section. A portion of the mounting protrusion 1111a facing the sidewall of the wafer carrier 400 forms the liquid filling surface 1103, and the vertical section extends through to the sidewall of the mounting protrusion 1111a facing the wafer carrier 400.

[0100] Furthermore, the return channel 1106 extends radially along the light-transmitting hole 1101. The bottom of the assembly ring groove 11111 is also recessed with a plurality of connecting grooves 11112 arranged at intervals along its circumference, each connecting groove 11112 being recessed along the axial direction of the light-transmitting hole 1101. Each connecting groove 11112 corresponds to a liquid-filling channel 1102, and each liquid-filling channel 1102 is connected to the assembly ring groove 11111 through its corresponding connecting groove 11112.

[0101] Furthermore, a liquid filling connector 1141 is provided at the liquid filling channel 1102, and the liquid filling connector 1141 is connected to the liquid filling pipe 1142. Similarly, a liquid return connector 1143 is provided at the liquid return channel 1106, and the liquid return connector 1143 is connected to the liquid return pipe 1144. The outer wall of the seat body 1111, which is used to connect the liquid filling connector 1141 and the liquid return connector 1143, is flat, which facilitates contact with the plane of each connector and improves the reliability of the connection. At the same time, the seat body 1111, which is used to connect each connector, protrudes radially outward relative to the retaining ring 1111b that is formed into the assembly annular groove 11111, so as to reduce the assembly interference between the connector connection and the limiting flange 1131, maintain the stability of the limiting flange 1131, and make it less susceptible to deformation by external forces.

[0102] like Figure 11 , Figure 13 , Figure 16 and Figure 17 As shown, in some embodiments, the assembly protrusion 1111a is radially recessed inward along the assembly annular groove 11111 with multiple grooves 11113. These grooves 11113 are spaced apart circumferentially along the assembly protrusion 1111a. Each groove 11113 has a corresponding return channel 1106 on its outer periphery, and a corresponding filling channel 1102 is provided between any two adjacent grooves 11113. In other words, the assembly protrusion 1111a can be divided into multiple spaced regions using multiple grooves 11113. Each region has a corresponding filling channel 1102, and each groove 11113 corresponds to a return channel 1106, further ensuring the independence and uniform distribution of the return channel 1106 and the filling channel 1102.

[0103] Specifically, the fitting 1112 has an inner wall fitted onto the fitting protrusion 1111a. Multiple mating protrusions 11121 protrude radially inward from the inner wall along the fitting annular groove 11111. These mating protrusions 11121 are spaced apart circumferentially along the fitting 1112. Each mating protrusion 11121 is inserted into and confined within a groove 11113. The fitting 1112 and the seat body 1111 together define the liquid filling surface 1103. In other words, by utilizing the engagement of the groove 11113 and the mating protrusions 11121, the connection area between the fitting 1112 and the seat body 1111 is increased, thereby improving connection reliability. Furthermore, this arrangement also enhances the sealing performance at the connection point. The mounting kit 1112 is pressed against the bottom of the mounting ring groove 11111 on the side wall away from the wafer carrier 400, and the base body 1111 can be connected to the mating protrusion 11121 by screws to achieve fastening between the mounting kit 1112 and the base body 1111.

[0104] like Figure 11 , Figure 13 , Figure 16 and Figure 17As shown, in some specific embodiments, the mounting protrusion 1111a has four grooves 11113, which divide the mounting protrusion 1111a into four spaced-apart areas. Each area is provided with a liquid filling channel 1102, and the outer periphery of each groove 11113 is provided with a liquid return channel 1106. Thus, the seat body 111 has four liquid filling channels 1102 and four liquid return channels 1106. The grooves 11113 are provided for insertion and engagement with the mating protrusions 11121 of the mounting set 1112. After the mounting set 1112 is assembled relative to the seat body 1111, it can cover the radially inward portion of each connecting groove 11112.

[0105] Alternatively, the base 111 is provided with an assembly ring groove 11111, and a portion of the pressure plate 113 is accommodated within the assembly ring groove 11111 and fixed to the base 111. A return fluid gap 1105 is provided between the outer ring wall of the assembly ring groove 11111 and the outer side wall of the pressure plate 113; and the bottom of the assembly ring groove 11111 is recessed with a connecting groove 11112 that connects the assembly ring groove 11111 and the return fluid channel 1106.

[0106] Furthermore, the aforementioned connecting groove 11112 is arranged to gradually expand outward along the radial direction of the assembly ring groove 11111, which facilitates guiding the liquid to flow as fully as possible toward the return channel 1106, thereby reducing the flow resistance to the return channel 1106. The cross-section of the connecting groove 11112 along the Z-axis is larger than the cross-section of the return channel 1106 along the Z-axis, which helps to increase the flow rate.

[0107] Please see Figure 3 , Figure 4 , Figure 11 , Figure 12 , Figure 13 , Figure 18 and Figure 19 In some embodiments, the light-transmitting plate 112 is flush with the liquid-filling surface 1103. That is, the side wall of the light-transmitting plate 112 facing the wafer carrier 400 is flush with the side wall of the base 111 facing the wafer carrier 400. This arrangement helps to press and form a uniform liquid film 1002, and the surface of the light-transmitting plate 112 can also be fully wetted by the liquid, reducing the generation of bubbles and the impact of bubbles on imaging quality.

[0108] like Figure 12 and Figure 13 As shown, in some specific embodiments, the light-transmitting aperture 1101 is configured as a stepped aperture, including a large-diameter section and a small-diameter section connected to one end of the large-diameter section, the large-diameter section being located on the side facing the wafer carrier 400. The light-transmitting plate 112 is accommodated in the large-diameter section.

[0109] like Figure 18As shown, alternatively, the thickness of the light-transmitting plate 112 along the Z-axis is the same as the length of the light-transmitting hole 1101 along the Z-axis. The light-transmitting plate 112 is cylindrical in shape to fit the light-transmitting hole 1101. Each liquid filling channel 1102 and each liquid return channel 1106 are arranged around the outer periphery of the light-transmitting hole 1101, and each liquid filling channel 1102 is not interconnected at the base 111.

[0110] like Figure 19 As shown, in another alternative embodiment, the light-transmitting plate 112 includes a first plate 1121 and a second plate 1122, which are arranged axially spaced within the light-transmitting hole 1101. The first plate 1121 is flush with the liquid-filling surface 1103. Specifically, the first plate 1121 is disposed towards the side closest to the wafer carrier 400, and the second plate 1122 is disposed towards the side closest to the imaging module 130. The side wall of the first plate 1121 facing the wafer carrier 400 is flush with the liquid-filling surface 1103 to maintain sufficient wetting of the first plate 1121 by the liquid. At the same time, the side wall of the second plate 1122 away from the first plate 1121 is flush with the side wall of the base 111 away from the wafer carrier 400 to maintain that the assembly position between the second plate 1122 and the imaging module 130 can be adapted to the base 111.

[0111] The area between the first plate 1121 and the second plate 1122, defined by the light-transmitting aperture 1101, is a first connecting region 1101a. Multiple liquid-filling channels 1102 are arranged at circumferential intervals along the channel, with at least two channels connecting to the first connecting region 1101a. This arrangement ensures that liquid is also present between the first plate 1121 and the second plate 1122, thereby forming an optical path of glass layer-liquid layer-glass layer-liquid layer arranged along the optical axis (i.e., the Z-axis direction).

[0112] In other embodiments, the liquid filling channel 1102 may not be connected to the first connecting region 1101a between the two plates (i.e., the aforementioned first plate 1121 and second plate 1122). In this case, the first connecting region 1101a can be in a vacuum state to reduce the impact on the optical path caused by the addition of air medium.

[0113] Please see Figures 20 to 23In some embodiments, the light-transmitting plate 112 is located on the side of the liquid filling channel 1102 away from the liquid filling surface. The base 111 is also provided with an exhaust channel 1104, which connects to the area located at the bottom of the light-transmitting plate 112 within the light-transmitting hole 1101. At this time, the liquid added to the gap 1001 through each liquid filling channel 1102 can flow to the light-transmitting hole 1101 and fill the area located at the bottom of the light-transmitting plate 112 within the light-transmitting hole 1101. Therefore, by using the exhaust channel 1104, the gas in the light-transmitting hole 1101 can be fully discharged to reduce air bubbles in the liquid film 1002, so that the bottom of the light-transmitting plate 112 is fully wetted by the liquid column in the second connecting area 1101b connected to the liquid film 1002, thereby improving the imaging quality.

[0114] like Figure 20 As shown, the exhaust channel 1104 can extend radially along the light-transmitting hole 1101 to exhaust air from the outer wall of the base 111, reducing the impact of air on the imaging module 130. Of course, as... Figure 17 As shown, the exhaust passage 1104 can also be L-shaped, including a horizontal section and a vertical section, so that exhaust is emitted from the upper surface of the seat 111. This is only an example.

[0115] Please continue reading. Figures 20 to 23 In some embodiments, the area at the bottom of the light-transmitting plate 112 within the light-transmitting hole 1101 (i.e., the area of ​​the light-transmitting plate 112 facing the liquid-filling surface within the light-transmitting hole 1101) is defined as a second connecting region 1101b, and either the return channel 1106 or the filling channel 1102 can be selectively connected to the second connecting region 1101b. For example, when the filling channel 1102 is connected to the second connecting region 1101b, the liquid input through the filling channel 1102 can flow directly to the second connecting region 1101b, and during the flow, it will squeeze the air at the second connecting region 1101b out of the exhaust channel 1104. Alternatively, the return channel 1106 can be connected to the second connecting region 1101b, thereby directly drawing liquid from the middle of the gap 1001 and discharging it along the return channel 1106.

[0116] When the return liquid channel 1106 is connected to the second connecting area 1101b, a return liquid gap 1105 is not required between the pressure plate 113 and the base 111; liquid recovery is achieved solely through the cooperation of the second connecting area 1101b and the return liquid channel 1106. Alternatively, a return liquid gap 1105 can be provided between the outer wall of the pressure plate 113 and the base 111. In this case, the return liquid channel 1106 includes a first horizontal section and a second horizontal section, which are spaced apart along the axial direction of the light-transmitting hole 1101 on the base 111. The first horizontal section connects the return liquid channel 1106 and the second connecting area 1101b, and the second horizontal section connects the second connecting area 1101b and the return liquid connector 1143. This is merely an example; the key is to ensure that return liquid and liquid addition do not interfere with each other.

[0117] In the above Figures 20 to 23 In the illustrated embodiment, compared to Figure 10 , Figure 18 and Figure 19 In the embodiment, since a central liquid column is added and filled in the second connected region 1101b, when the liquid film forming structure 110 and the blue film 910 move relative to each other on the horizontal plane, the liquid film 1002 can be better driven to move based on the intermolecular forces between the central liquid column and the surrounding liquid column and the liquid film 1002.

[0118] Please see Figure 1 , Figure 24 , Figure 26 and Figure 27 In some embodiments, the liquid removal structure 200 includes at least an air knife 210, which is used to blow the liquid on the surface of the blue film 910 after detection to the collection tank 300 for recovery. That is, the air knife 210 generates a high-speed airflow to sweep the residual liquid on the blue film 910 into the collection tank 300. In this process, the liquid removal structure 200 does not need to directly contact the wafer, avoiding secondary damage to the wafer due to static electricity; moreover, the air knife 210 makes the liquid flow trajectory controllable, specifically along the blowing direction of the air knife 210, reducing the risk of secondary contamination caused by splashing due to uncontrollable trajectory. During the blowing process, the wafer carrier 400 can also move horizontally along the X-axis and Y-axis directions under the action of the moving module 500, which is more conducive to thoroughly removing residual liquid from the surface of the blue film 910 under the action of the airflow of the air knife 210, improving the water removal efficiency.

[0119] Therefore, the liquid removal structure 200 provided in this embodiment can more effectively remove liquid from the surface of the blue film 910 without having to consider the water volume and replace it regularly, and can remove liquid without direct contact with the blue film 910, significantly reducing pollution caused by liquid splashing or dripping.

[0120] In some embodiments, multiple air knives 210 are arranged at intervals or adjacent to each other along the circumference of the wafer carrier 400, and the multiple air knives 210 together enclose a liquid removal space. That is, by using multiple air knives 210, the water removal efficiency and effect are further improved, thereby improving the overall processing efficiency of the wafer inspection mechanism 10. At the same time, because multiple air knives 210 together enclose a liquid removal space, they can cooperate with each other to form an air curtain adapted to the shape of the liquid removal space, further reducing the impact of liquid splashing.

[0121] In some specific embodiments, the air blades 210 are provided with four air blades that together form a ring-shaped liquid removal space. The wafer carrier 400 is located below the liquid removal structure 200. The wafer carrier 400 and the liquid removal structure 200 can move relative to each other under the action of the moving module 500. During the relative movement of the liquid removal structure 200, the liquid in the liquid removal space is moved to the liquid collection tank 300. That is, the four air blades 210 form a quadrilateral air curtain, which can blow away and confine the liquid in the air curtain. Then, the horizontal movement of the wafer carrier 400 relative to the liquid removal structure 200 causes the air curtain to move relative to the wafer carrier 400, thereby blowing the liquid in the air curtain into the liquid collection tank 300.

[0122] Alternatively, there may be only one air knife 210. The air outlet of the air knife 210 is located on the side away from the optical detection module 100, which reduces the interference of the purging operation on the optical detection module 100. During the purging process, the wafer carrier 400 can also drive the wafer to move relative to the air knife 210, so as to thoroughly and effectively clean the liquid.

[0123] Please see Figures 24 to 27 In some embodiments, the liquid removal structure 200 further includes a mounting bracket 220 and a locking member 230. The air knife 210 is rotatably connected to the mounting bracket 220 via a rotating shaft 211, and the locking member 230 is used to lock the air knife 210 to the mounting bracket 220. This arrangement facilitates adjustment of the assembly angle of the air knife 210, thereby adjusting the air outlet angle of the air knife 210. The air knife 210 has a blowing channel, the axis of which is the blowing direction M of the air knife 210, and the blowing direction forms an acute angle β with the wafer carrier 400. The locking member 230 can lock the air knife 210 to the mounting bracket 220 after the air knife 210 is adjusted to its position, ensuring the assembly stability of the air knife 210 during the blowing process.

[0124] Please continue reading. Figures 24 to 27In some embodiments, the mounting bracket 220 is provided with a mounting hole 2201 for the locking member 230 to pass through. The mounting hole 2201 is arc-shaped along the axis of the rotating shaft 211, and the locking member 230 can move within the mounting hole 2201 in the arc length direction of the mounting hole 2201. That is, by utilizing the cooperation between the mounting hole 2201 and the locking member 230, the angle adjustment of the air knife 210 can be guided, reducing the offset of the air knife 210 during the adjustment process. Specifically, the air knife 210 is connected to rotating shafts 211 on both sides along its own length direction, and is rotatably connected to the mounting bracket 220 through the corresponding rotating shafts 211. When the locking member 230 is unlocked, it can cause the air knife 210 to rotate around the axis of the rotating shaft 211 to meet the air outlet angle adjustment; and during the adjustment process, the hole wall of the mounting hole 2201 cooperates with the locking member 230 to guide the rotation of the air knife 210. After the adjustment is in place, the locking member 230 is locked so that the air knife 210 cannot rotate.

[0125] The locking element 230 can be a screw, a bolt and nut, or a washer to reduce wear. The rotating shaft 211 can be a pin or a pin.

[0126] Furthermore, each air knife 210 is provided with a mounting bracket 220 and a locking element 230 to meet the air outlet angle adjustment of each air knife 210.

[0127] See Figure 24 , Figure 27 and Figure 28 In some embodiments, the liquid removal structure 200 further includes a second mounting base 240 and an adjustment component 250. A mounting bracket 220 is slidably connected to the second mounting base 240, and the adjustment component 250 is connected to both the second mounting base 240 and the mounting bracket 220, and is used to adjust the vertical mounting position of the mounting bracket 220 relative to the mounting base. Specifically, the mounting bracket 220 can be slidably connected to the second mounting base 240 via a combination of a guide rail and a slider. The length direction of the guide rail is along the Z-axis, thus facilitating the adjustment of the mounting position of the mounting bracket 220 along the Z-axis, ensuring that the airflow from the air knife 210 can stably sweep the surface of the blue film 910. For example, moving the mounting bracket 220 downwards along the Z-axis can bring the air knife 210 closer to the wafer carrier 400; conversely, moving the mounting bracket 220 upwards along the Z-axis can move the air knife 210 away from the wafer carrier 400.

[0128] The guide rail is located on the second assembly base 240, and the slider is located on the mounting bracket 220. The slider is slidably connected to the guide rail to guide the movement of the mounting bracket 220. The second assembly base 240 can install the liquid removal structure 200 at the target position.

[0129] In some embodiments, the adjustment assembly 250 includes a limiting block 251, an adjustment column 252, and an adjustment seat 253. The limiting block 251 is disposed on the mounting bracket 220. The adjustment column 252 passes through and is connected to the second mounting base 240. The adjustment column 252 is connected to the limiting block 251 and is rotatable about its own axis to drive the limiting block 251 to move vertically. The adjustment seat 253 is connected to one end of the adjustment column 252 away from the limiting block 251 and is used to lock the adjustment column 252 to the second mounting base 240.

[0130] Specifically, the second mounting base 240 includes a base plate 241 and a support plate 242 connected to the base plate 241, with the support plate 242 set at an angle to the base plate 241. For example, the base plate 241 is set vertically, and the support plate 242 is set horizontally, with both set perpendicularly. The aforementioned mounting bracket 220 is slidably connected to the base plate 241, and both the adjusting column 252 and the adjusting seat 253 are connected to the support plate 242. The adjusting column 252 can be a screw and is threadedly connected to the limiting block 251. The adjusting seat 253 is a nut. When adjustment is required, the adjusting seat 253 is loosened, and then the adjusting column 252 is rotated. At this time, since the limiting block 251 is located on the mounting bracket 220, and the mounting bracket 220 is slidably connected to the second mounting base 240, it can limit the rotation of the limiting block 251 around the axis of the adjusting column 252, keeping the limiting block 251 moving along the axial direction of the adjusting column 252 under the action of the adjusting column 252. Once adjusted, lock the adjusting seat 253 onto the second assembly base 240. This is just an example.

[0131] The adjusting column 252 can be a component with a threaded section, as long as it can meet the requirement of fine-tuning the position of the limiting block 251 along the Z-axis.

[0132] like Figure 24 and Figure 26 As shown, in some embodiments, the liquid removal structure 200 further includes a lifting cylinder 270. The lifting cylinder is located on the assembly base and connected to the mounting frame 220, and is used to drive the mounting frame 220 to move the air knife 210 along the Z-axis direction to adjust the distance between the air knife 210 and the wafer carrier 400. The lifting cylinder 270 can be replaced by other linear modules that can achieve linear motion, such as electric push rods, as long as they can meet the linear drive requirements along the Z-axis direction. This is only an example for illustration.

[0133] Furthermore, the liquid removal structure 200 also includes an elastic element 260, which connects the assembly base and the mounting bracket 220. Understandably, by utilizing the elastic element 260 to strengthen the assembly of the mounting bracket 220 relative to the assembly base, it is possible to ensure that the mounting bracket 220 and the air knife 210 are suspended in the event of a failure of the lifting cylinder 270, reducing the risk of the air knife 210 falling directly. The elastic element 260 can be a component with elasticity, such as a spring. When the lifting cylinder 270 drives the mounting bracket 220 to move, the elastic element 260 can also adaptively deform elastically.

[0134] In practical use, the second mounting base 240 also includes a mounting seat 243 connected to the substrate 241, and the mounting seat 243 extends horizontally. The mounting bracket 220 includes a connecting portion 221 and a support portion 222 connected to the connecting portion 221. The support portion 222 is connected to the air knife 210, and the connecting portion 221 is slidably connected to the substrate 241. One end of the elastic member 260 is connected to the mounting seat 243, and the other end is connected to the connecting portion 221 of the mounting bracket 220.

[0135] like Figures 1 to 3 As shown, in some embodiments, the wafer carrier 400 is located in the middle of the liquid collection tank 300 and is connected to the liquid collection tank 300 to form an integral structure. The moving module 500 is connected to the liquid collection tank 300, thereby driving the wafer carrier 400 to move on a horizontal plane through the liquid collection tank 300. The bottom of the liquid collection tank 300 is provided with a drain hole, which is connected to a drain pipe to drain the liquid collected in the liquid collection tank 300. Alternatively, the liquid collection tank 300 may have a supporting protrusion in the middle, and the wafer carrier 400 may be fixed to the supporting protrusion. The only requirement is that it satisfies the overall configuration of the liquid collection tank 300 and the wafer carrier 400.

[0136] The bottom of the liquid collection tank 300 is inclined downward from the middle to the edge, which helps to guide the water flow to the edge and discharge it from the drain hole at the edge.

[0137] like Figure 1 As shown, in some embodiments, the moving module 500 includes a first moving module 510 and a second moving module 520 connected to the first moving module 510. The second moving module 520 is connected to the liquid collection tank 300. The first moving module 510 is used to drive the liquid collection tank 300 to move in a first direction in the horizontal plane via the second moving module 520. The second moving module 520 can drive the liquid collection tank 300 to move in a second direction in the horizontal plane, and the liquid collection tank 300 drives the wafer carrier disk 400 to move synchronously. The first and second directions are set at an angle. For example, the first direction is the X-axis direction, and the second direction is the Y-axis direction. The optical detection module 100 and the liquid removal structure 200 can be arranged at intervals along the X-axis direction.

[0138] Both the first moving module 510 and the second moving module 520 can be linear modules. The structure of linear modules is a mature existing technology, so it will not be described in detail here.

[0139] like Figure 1 As shown, in some embodiments, the wafer inspection mechanism 10 further includes a dehumidification structure 600. The dehumidification structure 600, the optical inspection module 100, and the liquid removal structure 200 are arranged at intervals, and the moving module 500 can drive the wafer carrier 400 to move below the dehumidification structure 600. For example, the dehumidification structure 600, the optical inspection module 100, and the liquid removal structure 200 are arranged at intervals along the X-axis. The optical inspection module 100 can be disposed between the dehumidification structure 600 and the liquid removal structure 200. The dehumidification structure 600 can be used to dry moisture in the air.

[0140] like Figure 1 , Figure 3 , Figure 4 , Figure 12 and Figure 13 As shown, in actual use, the wafer inspection unit 10 is located in a sealed space, which can be filled with dry gas to maintain the dryness of the air. Since liquid needs to be added during the inspection process to form a liquid film 1002, although the liquid can be absorbed by the return channel 1106 after inspection, and the liquid on the surface of the blue film 910 can be removed in conjunction with the liquid removal structure 200, the moisture content in the air still increases. Therefore, the dehumidification structure 600 can further remove moisture and dry the air, maintaining the dryness of the air within the sealed space.

[0141] like Figure 1 As shown, in some embodiments, the wafer inspection mechanism 10 further includes an assembly stage 700 and a support beam 800 disposed on the assembly stage 700. A moving module 500 is disposed on the assembly stage 700, a liquid collection tank 300 is disposed on the moving module 500, and the optical inspection module 100 and the liquid removal structure 200 are both disposed on the support beam 800. Specifically, the support beam 800 includes a beam portion 810 and support columns 820 connected to both ends of the beam portion 810 in the length direction (i.e., the X-axis direction). Both support columns 820 are fixed to the assembly stage 700 to mount the beam portion 810 above the assembly stage 700. The aforementioned optical inspection module 100, liquid removal structure 200, and dehumidification structure 600 can all be installed on the same side of the beam portion 810 along the Y-axis direction, or they can be on different sides.

[0142] Furthermore, both the optical inspection module 100 and the liquid removal structure 200 are slidably connected to the crossbeam 810 and are each equipped with a lifting cylinder for reciprocating movement along the Z-axis, facilitating adjustment of the distance between them and the wafer carrier 400. This is merely an example.

[0143] Among them, the 800 supporting beam can be directly adopted as a gantry frame.

[0144] Please see Figure 1 and Figure 29 This application also provides a wafer inspection device, including a transport mechanism 30, a flipping mechanism 20 and the aforementioned wafer inspection mechanism 10. The flipping mechanism 20 is used to flip the wafer 900 to be inspected. The transport mechanism 30 can move between the flipping mechanism 20 and the wafer inspection mechanism 10 to transport the flipped wafer 900 to the wafer carrier 400 of the wafer inspection mechanism 10.

[0145] Understandably, the diced wafer is transported to the flipping mechanism 20, positioned by the flipping mechanism 20, and flipped 180 degrees so that the back side of the wafer 900 to be tested is facing upwards. Then, the transport mechanism 30 picks up the wafer 900 to be tested and transports it to the wafer carrier 400, where it is positioned. Next, the moving module 500 drives the wafer carrier 400 to move sequentially below the optical inspection module 100 and below the liquid removal structure 200, satisfying optical inspection and liquid removal, and then dehumidifying using the dehumidification structure 600 after liquid removal. After completing the above operations, the transport mechanism 30 can again pick up the wafer on the wafer carrier 400 and transport it to the flipping mechanism 20, where it is flipped 180 degrees so that the front side of the wafer is facing upwards. It is then transported to the unloading station, where the wafer 900 to be tested can be transported to the flipping mechanism 20 for the above operations.

[0146] The wafer carrier 400 can fix the wafer by adsorption, and the transport mechanism 30 can also fix the wafer by adsorption. The wafer inspection equipment also includes an inspection machine, and all the above-mentioned mechanisms are integrated into the inspection machine to form an integrated device.

[0147] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0148] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A wafer inspection mechanism, characterized in that, include: Wafer carrier (400); An optical detection module (100) is disposed on one side of the wafer carrier (400) and includes at least a liquid film forming structure (110). The liquid film forming structure (110) has a gap (1001) between it and the blue film (910) of the wafer to be tested (900), and is capable of forming a liquid film (1002) covering at least part of the imaging field of the optical detection module (100) within the gap (1001). A liquid removal structure (200) is disposed on one side of the wafer carrier disk (400) and spaced apart from the optical detection module (100) for removing liquid from the surface of the blue film (910) after detection; A liquid collection tank (300) is located at the bottom of the outer periphery of the wafer carrier (400) and is used to collect the liquid removed by the liquid removal structure (200); A moving module (500) is used to control the wafer carrier (400) to move relative to the optical detection module (100) and the liquid removal structure (200) in a horizontal plane, so that one of the optical detection module (100) and the liquid removal structure (200) corresponds to the wafer carrier (400); The wafer carrier (400) is located below the optical detection module (100). The wafer carrier (400) and the optical detection module (100) can move relative to each other under the action of the moving module (500). During the relative movement of the optical detection module (100), the liquid film (1002) moves to detect the wafer (900) to be tested. The liquid film forming structure (110) includes a base (111) with a light-transmitting hole (1101) and a light-transmitting plate (112) disposed within the light-transmitting hole (1101). The liquid film (1002) is formed between the light-transmitting plate (112) and the blue film (910). The liquid film forming structure (110) also includes a pressure plate (113), which is connected to the base (111). The pressure plate (113) has... A limiting flange (1131) is arranged in a ring and protrudes from the side of the base (111) facing the wafer carrier (400). The base (111) is provided with a liquid filling channel (1102) surrounding the outer periphery of the light-transmitting hole (1101). The base (111) is also provided with a liquid return channel (1106). The liquid outlet of the liquid filling channel (1102) is located inside the limiting flange (1131).

2. The wafer inspection mechanism (10) according to claim 1, characterized in that, The optical detection module (100) also includes: An illumination structure for emitting infrared light toward the blue film (910) side of the wafer (900) under test; An imaging structure is disposed on the side of the liquid film forming structure (110) away from the wafer carrier disk (400) and is arranged on the same optical axis as the liquid film forming structure (110). The imaging structure is used to collect imaging light from the wafer under test (900) and pass through the blue film (910) and the liquid film (1002) in sequence to image the wafer under test (900).

3. The wafer inspection mechanism (10) according to claim 2, characterized in that, The optical detection module (100) further includes a first assembly base (150), an adjustment member (160), and a transition block (170). The transition block (170) is adjustablely disposed on the first assembly base (150) through the adjustment member (160). The transition block (170) is connected to the liquid film forming structure (110). The imaging structure is disposed on the first assembly base (150). The adjusting member (160) is used to adjust the position of the adapter block (170) relative to the first assembly base (150) to change the position of the liquid film forming structure (110) relative to the imaging structure.

4. The wafer inspection mechanism according to claim 1, characterized in that, A return liquid gap (1105) is provided between the outer wall of the pressure plate (113) and the seat (111). The return liquid channel (1106) is connected to the return liquid gap (1105) and is used to recover the liquid on the surface of the blue film (910).

5. The wafer inspection mechanism according to claim 4, characterized in that, The optical detection module (100) also includes a liquid supply and return structure, which is connected to the liquid addition channel (1102) and the liquid return channel (1106) respectively. The liquid supply and return structure can replenish liquid to the gap (1001) to repair the liquid film (1002) during the relative movement of the liquid film forming structure (110) and the wafer under test (900).

6. The wafer inspection mechanism (10) according to claim 1, characterized in that, The liquid removal structure includes at least an air knife (210), which is used to blow the liquid on the surface of the blue film (910) after detection to the collection tank (300) for recovery.

7. The wafer inspection mechanism according to claim 6, characterized in that, The air knife (210) is provided in multiple ways and is arranged at intervals or adjacent to each other along the circumference of the wafer carrier (400). The multiple air knives (210) together form a liquid removal space.

8. The wafer inspection mechanism (10) according to claim 1, characterized in that, The moving module (500) includes a first moving module (510) and a second moving module (520) connected to the first moving module (510). The second moving module (520) is connected to the liquid collection tank (300). The first moving module (510) is used to drive the liquid collection tank (300) to move in a first direction in a horizontal plane through the second moving module (520). The second moving module (520) can drive the liquid collection tank (300) to move in a second direction in a horizontal plane. The liquid collection tank (300) drives the wafer carrier disk (400) to move synchronously. The first direction and the second direction are set at an angle.

9. The wafer inspection mechanism (10) according to claim 1, characterized in that, The wafer inspection mechanism (10) further includes a dehumidification structure (600), the dehumidification structure (600), the optical inspection module (100) and the liquid removal structure (200) are arranged at intervals, and the moving module (500) can drive the wafer carrier (400) to move below the dehumidification structure (600).

10. The wafer inspection mechanism (10) according to claim 1, characterized in that, The wafer inspection mechanism (10) further includes an assembly stage (700) and a support beam (800) disposed on the assembly stage (700). The moving module (500) is disposed on the assembly stage (700), the liquid collection tank (300) is disposed on the moving module (500), and the optical inspection module (100) and the liquid removal structure (200) are both disposed on the support beam (800).

11. A wafer inspection device, characterized in that, The device includes a transport mechanism (30), a flipping mechanism (20), and a wafer inspection mechanism (10) according to any one of claims 1 to 10. The flipping mechanism (20) is used to flip the wafer to be tested (900). The transport mechanism (30) is capable of flowing between the flipping mechanism (20) and the wafer inspection mechanism (10) to transport the flipped wafer to be tested (900) to the wafer carrier (400) of the wafer inspection mechanism (10).

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