Optical module surface blackening and shading process

Abstract

The invention discloses an optical module surface blackening and shading process, and relates to the technical field of shading and coating of optical modules through nanoimprint .The optical module surface blackening and shading process comprises the steps that S1, the binding force between a prepared forming material and needed ink is low or no binding force exists, the forming material is adopted to prepare an ink coating jig, and the ink coating jig is used for coating the required ink; forming grooves are formed in the surface of the ink coating jig in an array mode, and the structures of the forming grooves are larger than those of optical modules to be processed; s2, the required amount of printing ink is added into all the forming grooves, the optical module to be treated is placed into the forming grooves, and after the printing ink is cured, the optical module with the blackened and shading surface is obtained; and S3, the optical module with the blackened and shading surface is taken out of the forming groove, the printing ink at the needed position of the surface of the optical module is cleaned, the light transmitting holes and the chip tin balls are exposed, and the finished optical module is obtained, so that interface separation between the printing ink and the forming groove can be guaranteed, smoothness and no damage in the demolding process are guaranteed, and the production yield and efficiency are improved.

Description

Technical Field

[0001] This invention relates to the field of nanoimprint coating for light-shielding optical modules, and in particular to a process for blackening and light-shielding the surface of optical modules. Background Technology

[0002] After the wafer-level lens and chip are bonded together, an optical module is formed. The shape of the optical module is generally T-shaped, requiring blackening treatment around its edges to block light. The thickness of the blackening material on each side must be ≤50μm, and the thickness of the blackening material at the corners and edges of the T-shaped structure must be uniform. Simultaneously, the light-transmitting surface of the T-shaped module and the solder ball surface of the chip must be free of black material contamination. However, due to the often small space and right-angled structure of the optical module, uneven distribution of the coating material is prone to occur during the blackening and light-blocking process. This unevenness can easily compromise the integrity of the light-blocking and seriously affect the optical performance of the optical module. Summary of the Invention

[0003] The purpose of this invention is to provide a blackening and light-shielding process for the surface of an optical module to solve the problems existing in the prior art. This process ensures the separation of the ink from the molding groove, guarantees the smoothness and non-destructive nature of the demolding process, and improves production yield and efficiency.

[0004] To achieve the above objectives, the present invention provides the following solution: The present invention provides a surface blackening and light-shielding process for an optical module, comprising: S1. Prepare the required molding material. The molding material has low or no bonding force with the required ink. The ink coating fixture is prepared using the molding material. The surface of the ink coating fixture is arrayed with molding grooves. The structure of the molding grooves is larger than the optical module to be processed. S2. Prepare the ink, add the required amount of ink to each of the molding grooves, place the optical module to be processed into the molding grooves, and squeeze the ink to cover the outer peripheral surface of the optical module to be processed. After the ink is cured, an optical module with a blackened and light-blocking surface is obtained. S3. Remove the blackened optical module from the molding groove, clean the ink at the required location on its surface using the necessary cleaning equipment, and expose the light-transmitting hole and chip solder ball to obtain the finished optical module.

[0005] Optionally, in step S1, the depth of the forming groove is consistent with the height of the optical module to be processed, and the width of the forming groove in both vertical directions is larger than the required size of the corresponding width of the optical module to be processed.

[0006] Optionally, in step S1, the required mold is first prepared, the mold including a base and a patterned protrusion arrayed on the base, the structure of the patterned protrusion matching the structure of the patterned groove; then the patterned material is formed on the mold, and after curing and demolding, the ink-coated fixture is obtained, the surface of the ink-coated fixture having a patterned groove arrayed corresponding to each of the patterned protrusions.

[0007] Optionally, in step S1, the molding material is placed above the array of molding protrusions and its imprint is filled onto the surface of the mold where the molding protrusions are located.

[0008] Optionally, before step S2, the amount of ink added to each of the molding grooves is experimentally verified to ensure that the ink around the optical module to be processed is uniform and without overflow after it is placed in the molding groove.

[0009] Optionally, in step S2, after the optical module to be processed is placed into the molding groove, there is an annular gap between the inner peripheral wall of the molding groove and the optical module to be processed, and the ink is squeezed into the annular gap and covers the outer peripheral wall of the optical module to be processed.

[0010] Optionally, in step S2, a bonding device is used to place the optical module to be processed into the center of the molding groove.

[0011] Optionally, in step S2, after placing the optical module to be processed into the molding groove, the ink-coated fixture is baked.

[0012] Optionally, in step S2, and before baking the ink-coated fixture, the baking parameters are experimentally verified to ensure that the ink covering the outer peripheral surface of the optical module to be processed is completely filled.

[0013] Optionally, in step S3, the cleaning equipment is a laser cleaning device.

[0014] The present invention achieves the following technical effects compared to the prior art: This invention discloses a surface blackening and light-shielding process for optical modules. It utilizes a specific molding material to prepare an ink-coating fixture with low or no adhesion to the desired ink. The ink is contained in molding grooves on the ink-coating fixture. After the optical module to be processed is placed into the molding groove, the ink is squeezed to cover the outer periphery of the optical module. After the ink cures, the interface between the ink and the molding groove is separated, ensuring a smooth and damage-free demolding process. This process yields high-quality blackened and light-shielding optical modules in a single step, preventing the ink layer from tearing and leaving some residue in the molding groove. It also avoids excessive peeling force during ink demolding, which could damage the optical structure of the optical module. Furthermore, it prevents damage to the ink-coating fixture during demolding, improving production yield and efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a top view of the overall structure of a mold in an example disclosed in this invention; Figure 2 This is a side view of the overall structure of a mold in an example disclosed in this invention; Figure 3 This is a schematic diagram of the overall structure of the optical module to be processed in an example disclosed in this invention; Figure 4 This is a process diagram of fabricating an ink-coating fixture in one example disclosed in this invention; Figure 5 This is a process diagram of fabricating an optical module with a blackened surface for light blocking, as disclosed in an example of the present invention. Figure 6 This is a process diagram of an optical module with a clean surface coated with black to block light, as disclosed in an example of the present invention; The components are: 1-base, 2-forming protrusion, 3-optical module to be processed, 4-mold, 5-forming material, 6-base, 7-ink coating fixture, 8-ink, 9-optical module with blackened surface for light blocking, and 10-optical module finished product. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] The purpose of this invention is to provide a blackening and light-shielding process for the surface of an optical module to solve the problems existing in the prior art. This process ensures the separation of the ink from the molding groove, guarantees the smoothness and non-destructive nature of the demolding process, and improves production yield and efficiency.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] like Figures 1 to 6 As shown, the present invention provides a blackening and light-shielding process for the surface of an optical module, comprising: S1. Prepare the required molding material 5. The bonding force between the molding material 5 and the required ink 8 is low or non-existent. The ink coating fixture 7 is prepared using this molding material 5. The surface of the ink coating fixture 7 is arrayed with molding grooves. The structure of the molding grooves is larger than that of the optical module 3 to be processed. S2. Prepare ink 8. Add the required amount of ink 8 to each molding groove. Place the optical module 3 to be processed into the molding groove and squeeze the ink 8 to cover the outer peripheral surface of the optical module 3 to be processed. After the ink 8 is cured, an optical module 9 with a blackened surface is obtained. S3. Remove the black-coated, light-blocking optical module 9 from the molding groove, and use the required cleaning equipment to clean the ink 8 at the required location on its surface, thus exposing the light-transmitting hole and the chip solder ball, to obtain the finished optical module 10.

[0021] This invention discloses a surface blackening and light-shielding process for an optical module. It involves using a specific molding material 5 to prepare an ink-coating fixture 7, which has low or no adhesion to the desired ink 8. The ink 8 is contained in a molding groove on the ink-coating fixture 7. After the optical module 3 to be processed is placed into the molding groove, the ink 8 is squeezed to cover the outer peripheral surface of the optical module 3. After the ink 8 cures, the interface between the ink 8 and the molding groove is separated, ensuring a smooth and damage-free demolding process. This process yields a high-quality surface blackening and light-shielding optical module 9 in one step, preventing the ink layer from tearing and leaving some residue in the molding groove. It also avoids excessive peeling force during ink 8 demolding, which could damage the optical structure of the optical module. Furthermore, it prevents damage to the ink-coating fixture 7 during demolding, thus improving production yield and efficiency.

[0022] In this embodiment, given the low bonding force between the molding material 5 and the required ink 8, the design of the molding groove employs a small draft angle combined with a precise mechanical demolding structure. The small draft angle reduces resistance during separation, and the mechanical demolding structure can be an ejector pin assembly or a pneumatic nozzle, etc., to apply precise mechanical force or air pressure during demolding to overcome the low bonding force between the molding material 5 and the required ink 8, ensuring that the demolding work is completed without damaging the ink layer and the optical module.

[0023] More preferably, there is no bonding force between the molding material 5 and the required ink 8. The ink layer and the molding groove are actually maintained by physical contact without any adhesion. The removal process is simpler and can more reliably guarantee the quality of the optical module 9 with the blackened surface.

[0024] Among them, the molding material 5 can be an elastic silicone material, such as polydimethylsiloxane (PDMS).

[0025] Furthermore, this invention specifically addresses the surface blackening and light-shielding of T-shaped optical modules. When placing the optical module 3 to be processed into the molding groove, the end face with the light-transmitting hole faces the bottom of the groove. During the process of covering the optical module with ink 8, because the end face with the light-transmitting hole is in contact with the bottom of the groove, less ink 8 is applied to that end face, facilitating subsequent cleaning. Also, the end face of the T-shaped optical module with the chip solder ball faces away from the bottom of the groove. Preferably, the amount of ink 8 added to the molding groove needs to be precisely controlled so that it does not cover the end face with the chip solder ball during the process of covering the optical module, thus reducing the cleaning work required for that side.

[0026] To ensure that the ink 8 can fully cover the outer peripheral surface of the optical module 3 to be processed, based on a specific implementation, the cross-section of the optical module 3 to be processed is rectangular, and the cross-sectional shape of the forming groove matches it. Therefore, in step S1, the depth of the forming groove is consistent with the height of the optical module 3 to be processed, and the width of the forming groove along both vertical directions is larger than the corresponding width of the optical module 3 to be processed by the required size, so as to reserve the required gap between the inner peripheral wall of the forming groove and the optical module 3 to be processed, and to ensure that the ink 8 can cover the outer peripheral wall of the optical module 3 to be processed.

[0027] To ensure uniform ink coverage, the distances from the corresponding positions on both sides of the optical module 3 to be processed from the inner wall of the molding groove are the same; that is, the molding groove extends beyond the corresponding width of the optical module 3 in both vertical directions. To further ensure uniform ink coverage, the width of the molding groove in both vertical directions is the same size larger than the corresponding width of the optical module 3. In another specific implementation, the cross-section of the optical module 3 to be processed is circular, and the cross-sectional shape of the forming groove matches it. Therefore, in step S1, the depth of the forming groove is consistent with the height of the optical module 3 to be processed, and the inner diameter of the forming groove is larger than the outer diameter of the optical module 3 to be processed by the required size.

[0028] In the two specific embodiments described above, the width of the forming groove along both vertical directions is 100 micrometers larger than the corresponding width of the optical module 3 to be processed, and 50 micrometers on each side; or the inner diameter of the forming groove is 50 micrometers larger than the outer diameter of the optical module 3 to be processed; both can ensure that the thickness of the formed ink 8 is 50 micrometers.

[0029] Regarding the preparation of mold 4, based on a specific implementation method, in step S1, the required mold 4 is first prepared. Preferably, the mold 4 is processed using ultra-precision machining equipment. The mold 4 includes a base 1 and molding protrusions 2 arrayed on the base 1. The structure of the molding protrusions 2 matches the structure of the molding grooves. Then, the molding material 5 is molded onto the mold 4, and after curing and demolding, an ink-coated fixture 7 is obtained. The surface of the ink-coated fixture 7 is arrayed with molding grooves corresponding to each molding protrusion 2.

[0030] Based on this embodiment, in some cases, in step S1, the molding material 5 can be melted and molded onto the surface of the mold 4 with the molding protrusions 2 by casting, and then cured. In other cases, in step S1, the molding material 5 is placed above the array of molding protrusions 2 and imprinted onto the surface of the mold 4 with the molding protrusions 2. Preferably, a nanoimprinting device is used, which uses its substrate 6 to press against the molding protrusions 2 after contacting the molding material 5, so that the molding material 5 fills the entire surface of the mold 4 with the molding protrusions 2. In order to ensure the structural strength of the ink coating fixture 7, the molding material 5 is cured at room temperature for 24 hours after being imprinted by the imprinting device.

[0031] Regarding the preparation of mold 4, based on another specific implementation method, the molding material 5 can be formed into the required shape first, and then the array of molding grooves can be processed by machining.

[0032] Furthermore, to improve the accuracy of the amount of ink 8 added, based on a specific implementation method, before step S2, the amount of ink 8 added to each molding groove is experimentally verified (DOE verification) to ensure that after the optical module 3 to be processed is placed in the molding groove, the ink 8 around it is uniform and there is no overflow.

[0033] To ensure that the outer peripheral wall of the optical module 3 to be processed is covered with a uniform ink layer, in this embodiment, after the optical module 3 to be processed is placed into the molding groove in step S2, there is an annular gap between the inner peripheral wall of the molding groove and the optical module 3 to be processed, and the ink 8 is squeezed into the annular gap and covers the outer peripheral wall of the optical module 3 to be processed.

[0034] In step S2, a bonding device is used to place the optical module 3 to be processed into the center of the molding groove to ensure the uniformity of the annular interval, thereby ensuring the uniformity of the ink layer. Preferably, a bonding device, such as the AD280 bonding device, can be used to align the optical module 3 to be processed with the center of the molding groove.

[0035] Specifically, in step S2, after placing the optical module 3 to be processed into the molding groove, the ink coating fixture 7 is baked. Preferably, in step S2, before baking the ink coating fixture 7, the baking parameters are experimentally verified (DOE verification) to ensure that the ink 8 covering the outer peripheral surface of the optical module 3 to be processed is completely filled and free of air bubbles or pores.

[0036] Based on a specific implementation, in step S3, the cleaning equipment uses a laser cleaning device to clean the ink 8 on the surface of the optical module 9, which has been blackened and shielded from light, so that the light-transmitting holes and chip solder balls are exposed. Preferably, the surface of the optical module 9, which has been blackened and shielded from light, has no ink 8 residue on the surface of the light-transmitting holes and chip solder balls, so as to meet the product requirements.

[0037] It should be noted that in the example where the depth of the molding groove matches the height of the optical module 3 to be processed, and the amount of ink 8 added to each molding groove is experimentally verified to ensure that the ink 8 does not overflow, then when the end face of the optical module with the light-transmitting hole faces the bottom of the molding groove, and the end face of the optical module 3 with the chip solder ball faces away from the bottom of the molding groove, since the ink 8 does not overflow, the end face of the optical module 3 with the chip solder ball will not be covered with an ink layer, and therefore no cleaning is required. Only the end face of the optical module with the light-transmitting hole needs to be processed.

[0038] Any adaptive changes made according to actual needs are within the scope of protection of this invention.

[0039] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0040] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A process for blackening the surface of an optical module, characterized in that, include: S1. Prepare the required molding material. The molding material has low or no bonding force with the required ink. The ink coating fixture is prepared using the molding material. The surface of the ink coating fixture is arrayed with molding grooves. The structure of the molding grooves is larger than the optical module to be processed. S2. Prepare the ink, add the required amount of ink to each of the molding grooves, place the optical module to be processed into the molding grooves, and squeeze the ink to cover the outer peripheral surface of the optical module to be processed. After the ink is cured, an optical module with a blackened and light-blocking surface is obtained. S3. Remove the blackened optical module from the molding groove, clean the ink at the required location on its surface using the necessary cleaning equipment, and expose the light-transmitting hole and chip solder ball to obtain the finished optical module.

2. The optical module surface blackening and light-shielding process according to claim 1, characterized in that, In step S1, the depth of the forming groove is consistent with the height of the optical module to be processed, and the width of the forming groove along both vertical directions is larger than the required size of the corresponding width of the optical module to be processed.

3. The optical module surface blackening and light-shielding process according to claim 1, characterized in that, In step S1, the required mold is first prepared. The mold includes a base and a patterned protrusion arrayed on the base. The structure of the patterned protrusion matches the structure of the patterned groove. The patterned material is then formed on the mold, and after curing and demolding, the ink-coated fixture is obtained. The surface of the ink-coated fixture is arrayed with patterned grooves that correspond one-to-one with each of the patterned protrusions.

4. The optical module surface blackening and light-shielding process according to claim 3, characterized in that, In step S1, the molding material is placed above the array of molding protrusions and imprinted onto the surface of the mold where the molding protrusions are located.

5. The optical module surface blackening and light-shielding process according to claim 1, characterized in that, Before step S2, the amount of ink added to each of the molding grooves is experimentally verified to ensure that the ink around the optical module to be processed is uniform and without overflow after it is placed in the molding groove.

6. The optical module surface blackening and light-shielding process according to claim 1, characterized in that, In step S2, after the optical module to be processed is placed into the molding groove, there is an annular gap between the inner peripheral wall of the molding groove and the optical module to be processed, and the ink is squeezed into the annular gap and covers the outer peripheral wall of the optical module to be processed.

7. The optical module surface blackening and light-shielding process according to claim 6, characterized in that, In step S2, the optical module to be processed is placed at the center of the molding groove using a bonding device.

8. The optical module surface blackening and light-shielding process according to claim 1, characterized in that, In step S2, after the optical module to be processed is placed into the molding groove, the ink coating fixture is baked.

9. The optical module surface blackening and light-shielding process according to claim 8, characterized in that, In step S2, before baking the ink-coated fixture, the baking parameters are experimentally verified to ensure that the ink covering the outer peripheral surface of the optical module to be processed is completely filled.

10. The optical module surface blackening and light-shielding process according to claim 1, characterized in that, In step S3, the cleaning equipment is a laser cleaning device.

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